JP2010040943A - Device and method for cleaning substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To carefully rinse off foreign matter adhering to an edge of a wafer without complicating a device nor increasing the size thereof. <P>SOLUTION: A drive mechanism of cleaning brushes 7 and 9 includes push pins 5, a push ring 6, a rotating arm 8 and the like, and shared. When the push ring 6 is lowered and located at the lowest point, a balance weight 10 abuts on an inclined surface 16 of a casing 2, and thereby the rotation of the rotating arm 8 is suppressed. When the push ring 6 is lifted, the balance weight 10 is separated from the inclined surface 16 of the casing 2. Then, the rotating arm 8 is rotated clockwise on the paper surface by gravity applied to the balance weight 10. As a result, the cleaning brush 7 contacts a peripheral part on the undersurface of a wafer W, and the cleaning brush 9 contacts an end face part of the wafer W. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate such as a silicon wafer or a glass substrate.

  In a semiconductor manufacturing process in which a semiconductor device is manufactured by forming a circuit pattern on a wafer, particles such as particles and photoresist remaining on the wafer (hereinafter abbreviated as “foreign matter”) may cause a decrease in yield. It becomes a cause. Therefore, in the semiconductor manufacturing process, a wafer cleaning process is performed as necessary. With the miniaturization of design rules and the introduction of immersion exposure technology, the importance of this cleaning process is increasing.

In addition, during the semiconductor manufacturing process, the foreign matter adhering to the edge affects the circuit pattern formation accuracy or contaminates the processing solution. Further, the adhered foreign matter may be turned into particles, which may adversely affect subsequent processes. For this reason, it is necessary to wash out not only the wafer surface on which the circuit pattern is formed but also the edge portion of the wafer, that is, the foreign matter and particles adhering to the peripheral portion and end surface portion of the front and back surfaces of the wafer. Has been proposed (see, for example, Patent Document 1).
JP 2008-84934 A

  In this type of cleaning apparatus, a plurality of cleaning brushes for cleaning each part are provided in order to carefully wash off foreign substances adhering to the peripheral edge and end surface of the curved wafer. In such a case, since a drive mechanism for driving the cleaning brush is also required for each brush, the apparatus configuration is complicated, and the apparatus tends to increase in size.

  The present invention has been made in view of the above circumstances, and provides a substrate cleaning apparatus and a substrate cleaning method capable of carefully washing out foreign substances adhering to the edge of a wafer without complicating and increasing the size of the apparatus. For the purpose.

In order to achieve the above object, a substrate cleaning apparatus according to a first aspect of the present invention includes:
A rotation drive unit that holds a substantially circular substrate and rotates the substrate around a vertical axis;
An elevating member disposed below the substrate;
A lifting device for lifting and lowering the lifting member;
A first cleaning brush attached to the elevating member so as to face the peripheral edge of the lower surface of the substrate;
A second cleaning brush attached to the elevating member so as to come into contact with an end surface portion of the substrate when the elevating member is raised;
Is provided.

  For example, the second cleaning brush is attached so as to face the end surface portion, and the second cleaning brush is rotatable on the elevating member so as to be able to approach and separate from the end surface portion of the substrate. A rotating arm attached to the rotating arm, a rotating moment applying portion for applying a rotating moment to the rotating arm so that one end portion of the rotating arm approaches the end surface portion, and the other end of the rotating arm when the lifting member is lowered. A fixing member that separates from the other end when the elevating member is raised and abuts against the other end, and that gives a rotational moment to the rotating arm in a direction in which one end of the rotating arm is separated from the end surface portion; You may arrange.

  For example, the fixing member has an inclined surface that contacts the other end of the rotating arm, the rotating arm is further inclined than a normal line of the inclined surface, and the fixing member is By abutting against the other end, a rotational moment in a direction in which one end of the rotating arm is separated from the end face is applied to the rotating arm.

  The fixing member may be a casing that houses the lifting device.

  The rotational moment applying unit may include a balance weight attached to the rotating arm.

  The rotational moment applying unit may further include an elastic member that is bridged between the elevating member and the rotating arm.

  The elevating device may include an actuator for elevating the elevating member and an adjusting unit for adjusting a force for elevating the elevating member.

  The sensor further includes a sensor that detects a pressing force applied to the peripheral edge when the first cleaning brush contacts the peripheral edge, and the adjustment unit adjusts the pressing force based on a detection signal of the sensor. It is good to do.

  A motor for rotating the first cleaning brush may be further provided.

  An arm disposed above the substrate; a third cleaning brush attached to the arm so as to oppose a peripheral portion of an upper surface of the substrate; and the arm being driven to drive the third cleaning brush. It is good also as providing the arm drive device which raises / lowers.

  The substrate cleaning method according to the second aspect of the present invention provides a driving force to the first and second cleaning brushes by rotating the substrate and moving a predetermined driving member in the first direction, The first cleaning brush is brought into contact with a peripheral portion of one surface of the substrate, the second cleaning brush is brought into contact with an end surface portion of the substrate, and the first cleaning brush and the second cleaning brush are brought into contact with the substrate. In this state, the substrate is cleaned, and the predetermined driving member is moved in the second direction to apply a driving force to the first and second cleaning brushes so as to be separated from the substrate. The rotation of the substrate is stopped.

  According to the substrate cleaning apparatus of the present invention, it is possible to carefully wash out foreign substances and the like attached to the edge of the wafer without complicating and increasing the size of the apparatus.

  Hereinafter, the best mode for carrying out the present invention will be described in detail with reference to the drawings.

<First Embodiment>
First, a first embodiment of the present invention will be described.
FIG. 1 shows a configuration of a substrate cleaning apparatus 100 according to the present embodiment.

  The substrate cleaning apparatus 100 is used, for example, for cleaning the wafer W as a circular substrate, particularly for cleaning the edge of the wafer W. The substrate cleaning apparatus 100 is a single wafer type wet cleaning apparatus, and is a spin cleaning apparatus that performs cleaning while rotating the wafer W.

  As shown in FIG. 1, the substrate cleaning apparatus 100 includes a base 1, a casing 2, a spin chuck 3, a motor 4A, an elevating device 4B, three push pins 5, a push ring 6, and a cleaning brush. 7, a rotating arm 8, a cleaning brush 9, a balance weight 10, three nozzles 12, a cup 13, and an upper brush mechanism 14. In the present embodiment, the casing 2 corresponds to a fixing member, the spin chuck 3 and the motor 4A correspond to a rotation drive unit, and the push ring 6 corresponds to an elevating member. The cleaning brush 7 corresponds to the first cleaning brush, and the cleaning brush 9 corresponds to the second cleaning brush.

  The base 1 is placed on the floor surface of a clean room through, for example, a vibration isolation mechanism. The casing 2 is installed on the base 1 and its position is fixed. The casing 2 houses a motor 4A for rotating the spin chuck 3 and a lifting device 4B for lifting and lowering the spin chuck 3. The upper part of the casing 2 is formed in a substantially truncated cone shape.

  The spin chuck 3 protrudes from the topmost portion of the casing 2 in the + Z direction. The spin chuck 3 holds the wafer W to be cleaned by vacuum suction on a table at its upper end. As a result, the wafer W is held horizontally. The spin chuck 3 is connected to a motor 4A and rotates around a vertical axis O parallel to the Z axis according to the rotation of the motor 4A. Due to the rotation of the spin chuck 3, the wafer W rotates about the Z axis.

  A motor (spindle motor) 4A drives the spin chuck 3 to rotate.

The lifting device 4B includes, for example, an actuator such as a cylinder that operates by air pressure or hydraulic pressure. The lifting device 4B supports the three push pins 5 and moves them up and down.
The three push pins 5 protrude from the casing 2 in the + Z direction. The third push pin 5 is provided on the opposite side (−X side) of the spin chuck 3 and is not shown. When viewed from the + Z side, the three push pins 5 are arranged at intervals of 120 degrees on the circumference centering on the spin chuck 3. The three push pins 5 move up and down while maintaining the same height at the same time.

  The push ring 6 is attached to the upper ends of the three push pins 5. The push ring 6 is composed of an annular flat plate, and is disposed below the wafer W held by the spin chuck 3 so as to be substantially parallel to the wafer W. The push ring 6 is supported by the three push pins 5 and moves up and down while maintaining a horizontal posture.

  A cleaning brush 7 is attached to the upper surface of the push ring 6. The cleaning brush 7 is installed so as to face the peripheral edge of the lower surface of the wafer W. When the push ring 6 is raised, the cleaning brush 7 comes into contact with the peripheral edge of the lower surface of the wafer W. Here, the peripheral portion is an outer peripheral surface of about several cm from the end surface portion of the wafer W. During cleaning, the cleaning brush 7 contacts the peripheral edge of the lower surface of the wafer W. The pressing force of the cleaning brush 7 generated by the contact is uniquely determined by the height of the cleaning brush 7 and the elasticity of the cleaning brush 7. Determined.

  A rotating arm 8 is attached via a rotating shaft 15 to the end of the push ring 6 on the side opposite to the attachment position of the cleaning brush 7. The rotating arm 8 can be rotated around the X axis by the rotating shaft 15. The rotating shaft 15 is attached to a substantially central portion of the rotating arm 8. When the rotary arm 8 rotates about the rotary shaft 15, one end (the end on the + Z side) can approach and separate from the end surface portion of the wafer W. A cleaning brush 9 is attached to one end, and a balance weight 10 (weight) is attached to the other end. The cleaning brush 9 is attached to face the end surface portion of the wafer W. Further, the balance weight 10 tends to drop according to the gravity, and gives a rotating moment clockwise to the rotating arm 8. When the rotary arm 8 is rotated by this rotational moment, one end of the rotary arm 8 to which the cleaning brush 9 is attached approaches the end surface portion of the wafer W. As shown in FIG. Abuts against the end face.

  More specifically, as shown in FIG. 2A, in the initial state where the push ring 6 is located at the lowest point (home position), the balance weight 10 contacts the inclined surface 16 of the casing 2. Therefore, the rotation of the rotary arm 8 is suppressed by the inclined surface 16.

  When the push ring 6 is raised, initially, the balance weight 10 slides on the inclined surface 16 of the casing 6, and the rotary arm 8 gradually rises. Subsequently, when the balance weight 10 is separated from the inclined surface 16, the rotary arm 8 is rotated clockwise by the gravity applied to the balance weight 10, and the cleaning brush 9 is moved to the wafer as shown in FIG. Abuts against the end face of W.

  When the push ring 6 is lowered again, the balance weight 10 again comes into contact with the inclined surface of the casing 2, and the reaction force received from the inclined surface 16 generates a counterclockwise rotational moment on the rotary arm 8, so that the balance weight 10 is The rotary arm 8 rotates counterclockwise while sliding on the inclined surface 16. As the rotary arm 8 rotates counterclockwise on the paper surface, the cleaning brush 9 moves away from the end surface of the wafer W and retracts. When the push ring 6 reaches the lowest point, the substrate cleaning apparatus 100 returns to the initial state shown in FIG.

  As described above, the casing 2 has the inclined surface 16 that comes into contact with and separates from the other end of the rotary arm 8, that is, the balance weight 10, when the push ring 6 moves up and down. When the inclined surface 16 comes into contact with the balance weight 10, a rotation moment opposite to the rotation moment generated by the balance weight 10 is applied to the rotary arm 8 due to the reaction force of the force received from the balance weight 10. In order to make the rotational moment generated by the contact with the inclined surface 16 opposite to the rotational moment due to the balance weight 10, the rotating arm 8 is always inclined further than the normal of the inclined surface 16. Is desirable.

The nozzle 12 shown in FIG. 1 is connected to a cleaning liquid supply device 31 (not shown) (see FIG. 3), and sprays the cleaning liquid toward the wafer W at an appropriate speed. The cleaning liquid is, for example, pure water (De-Ionized Water: DIW).
The injection port of the upper nozzle 12 faces the substantially central portion of the rotating wafer W. The cleaning liquid ejected from the ejection port spreads over the entire upper surface of the wafer W due to the centrifugal force of the rotation of the wafer W and falls downward from the outer periphery of the wafer W.
The injection ports of the two lower nozzles 12 face the outer peripheral direction of the lower surface of the wafer W. The cleaning liquid sprayed from these spray ports falls after being sprayed onto the lower surface of the wafer W including the portion where the cleaning brush 7 and the wafer W are in contact with each other. With the cleaning liquid continuously sprayed, a sufficient water film is formed in the vicinity of the cleaning brushes 7, 9, and 22, and the formation of scratches due to brush cleaning is prevented.

  The cup 13 prevents the cleaning liquid sprayed from the nozzle 12 from leaking outside. The cleaning liquid dropped from the wafer W and collected by the cup 13 is discharged from a lower drain port (drain) 131. The cup 13 can be moved up and down by driving a cup driving device 33 (not shown) in FIG. When the wafer W is loaded or unloaded, the cup 13 is lowered so as not to interfere with the load arm. During cleaning, the cleaning liquid is prevented from splashing as shown in FIG. Has risen to position.

  The upper brush mechanism 14 includes an upper arm 21 and a cleaning brush 22 as a third cleaning brush. The upper arm 21 is driven by an upper arm drive device 32 (see FIG. 3) (not shown in FIG. 1), and is movable in the Y-axis direction and the Z-axis direction. The cleaning brush 22 is attached to the lower end of the upper arm 21. As a result, the cleaning brush 22 can be opposed to the peripheral edge portion of the upper surface of the wafer W, and is in contact with the peripheral edge portion of the upper surface of the wafer W as shown in FIG.

  In FIG. 1, the cleaning is performed such that the cleaning brush 7 and the cleaning brush 22 sandwich the wafer W therebetween. In this way, the pressing force received from the cleaning brush 7 and the pressing force received from the cleaning brush 22 are opposite forces that have substantially the same point of action, so that the wafer W is deformed by these pressing forces. Can be prevented.

  FIG. 3 shows the configuration of the control system of the substrate cleaning apparatus 100 according to the present embodiment. As shown in FIG. 3, the control system is configured with a main controller 50 as the center.

  The main controller 50 includes a motor 4A, an elevating device 4B, a cleaning liquid supply device 31, an upper arm driving device 32, a cup driving device 33, a load arm driving device 34, a spin chuck driving device 35, and a vacuum. A suction mechanism 36 is connected. These operate under the control of the main controller 50. The lifting device 4B lifts and lowers the push ring 6 as described above. The cleaning liquid supply device 31 supplies the cleaning liquid to the three nozzles 12. The upper arm drive device 32 drives the upper brush mechanism 14 in the Y axis direction and the Z axis direction. The cup driving device 33 moves the cup 13 up and down. The load arm driving device 34 drives a load arm (not shown) that loads and unloads the wafer W with respect to the spin chuck 3. The spin chuck driving device 35 is a motor 4A that rotates the spin chuck 3 and a driver thereof. The vacuum suction mechanism 36 is a vacuum pump or the like for performing vacuum suction of the wafer W by the spin chuck 3.

  The main control device 50 includes a microcomputer including a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. A control program is stored in the ROM, and a work area and the like necessary for the control operation are formed in the RAM. In the main controller 50, the CPU executes the control program read from the ROM, and reads and writes data to and from the RAM as necessary, thereby performing overall control of the entire substrate cleaning apparatus 100.

  Next, the operation of the substrate cleaning apparatus 100 according to this embodiment will be described.

  At the initial stage when the cleaning process is started, the substrate cleaning apparatus 100 is in a state as shown in FIG. In this state, the wafer W is not held on the spin chuck 3, the push ring 6 is positioned at the lowest point, and the cleaning brush 9 is facing upward. Further, the upper brush mechanism 14 is retracted to the rightmost position (position further to the right of the cup 13), and the cup 13 is retracted to the lowermost position.

  In response to the cleaning process start instruction, main controller 50 starts the cleaning process shown in FIG. 4 and loads wafer W onto spin chuck 3 (step S01). More specifically, the main controller 50 drives the load arm drive unit 34 to hold the wafer W to be cleaned on the load arm (not shown), and transports it to above the spin chuck 3 to load the wafer W. Transfer from the arm to the spin chuck 3. The main controller 50 drives the vacuum suction mechanism 36 almost simultaneously with the transfer of the wafer W to the spin chuck 3 to cause the wafer W to be vacuum-sucked by the spin chuck 3. As a result, the wafer W is vacuum-sucked and held by the spin chuck 3 as shown in FIG.

Next, the main controller 50 drives the motor 4A via the spin chuck drive device 35 to rotate the spin chuck 3 at a predetermined rotational speed (step S03). Thereby, the rotation of the wafer W is started as shown in FIG.
Subsequently, main controller 50 drives cup driving device 33 to raise cup 13 as shown in FIG. 7 (step S05).

  Next, main controller 50 instructs cleaning liquid supply apparatus 31 to inject cleaning liquid (step S07). As a result, as shown in FIG. 7, the cleaning liquid is supplied from the cleaning liquid supply device 31 to the nozzle 12, and the ejection of the cleaning liquid from the nozzle 12 is started.

  Next, main controller 50 raises push pin 5 and push ring 6 via lifting device 4B (step S09). As a result, the cleaning brush 7 rises and the rotary arm 8 rotates, so that the cleaning brush 7 comes into contact with the peripheral end portion of the lower surface of the rotating wafer W as shown in FIG. The cleaning brush 9 comes into contact. Thereby, the scrub cleaning of the peripheral edge portion of the lower surface of the wafer W and the end face portion is substantially started.

  The main controller 50 drives the upper brush mechanism 14 in the direction indicated by the arrow YA via the upper arm driving device 32 as shown in FIG. 9 (in order not to interfere with the cup 13). By detouring, the cleaning brush 22 is brought into contact with the peripheral edge of the upper surface of the wafer W (step S11). Thereby, scrub cleaning of the peripheral portion of the upper surface of the wafer W is substantially started.

  Main controller 50 continues to clean wafer W (step S13). More specifically, main controller 50 continues the state shown in FIG. 9 for a predetermined time. As a result, foreign matter adhering to the peripheral and end surface portions of the lower and upper surfaces of the wafer W is washed away together with the cleaning liquid, and the foreign matter adhering to the upper and lower peripheral portions of the wafer W is scraped off by the cleaning brushes 7 and 22. The foreign matter adhering to the end surface portion of the wafer W is scraped off by the cleaning brush 9 and is discharged from the drain of the cup 13 together with the cleaning liquid.

  When the cleaning for a certain period of time is completed, the main controller 50 retracts the upper brush mechanism 14 in the + Y direction in the direction opposite to the arrow in FIG. 9 via the upper arm driving device 32 (step S15). And push ring 6 grade | etc., Is lowered | hung via the raising / lowering apparatus 4B. As a result, the cleaning brushes 7 and 9 are separated from the wafer W. At this point, the substrate cleaning apparatus 100 returns to the state shown in FIG. This state is continued for a while, and finish cleaning is performed only by spraying the cleaning liquid.

  Subsequently, the main controller 50 stops the supply of the cleaning liquid by the cleaning liquid supply apparatus 31 (step S17). At this point, the substrate cleaning apparatus 100 returns to the state shown in FIG.

  Further, main controller 50 performs a drying process on wafer W (step S19). More specifically, the main controller 50 controls the motor 4 </ b> A via the spin chuck drive device 35 to increase the rotation speed of the spin chuck 3. As a result, the cleaning liquid moisture remaining on the wafer W is shaken off from the wafer W by the centrifugal force generated by the rotation of the wafer W.

  Next, the main controller 50 lowers the cup 13 via the cup driving device 33 (step S21). Further, the motor 4A is controlled to stop the rotation of the spin chuck 3 via the spin chuck driving device 35 (step S23), and the wafer W is unloaded (step S25). More specifically, the main control device 50 releases the vacuum suction by the spin chuck 3 via the vacuum suction mechanism 36 and drives the load arm driving device 34 to move the wafer W from the spin chuck 3 to the load arm. Deliver. The load arm holds the wafer W and transports the wafer W to the outside. At this point, the substrate cleaning apparatus 100 returns to the initial state shown in FIG.

  As described above, according to the present embodiment, the cleaning brush 7 used for cleaning the peripheral portion on the lower surface side of the wafer W and the cleaning brush 9 used for cleaning the end surface portion of the wafer W are driven. The mechanism is standardized, and the cleaning brushes 7 and 9 can be brought into contact with and separated from the wafer W only by moving the push ring 6 up and down. For this reason, the configuration of the apparatus does not become unnecessarily complicated, and the apparatus does not need to be enlarged, and the control thereof is easy.

<Second Embodiment>
In the first embodiment, the pressing force of the cleaning brushes 7 and 9 against the wafer W is constant, but these may be adjusted.
Therefore, a second embodiment of the present invention in which the pressing force of the cleaning brushes 7 and 9 can be adjusted will be described.
As shown in FIG. 10, the substrate cleaning apparatus 101 according to the present embodiment applies a pressing force to the wafer W by the cleaning brushes 7, 9, and 22 in addition to the configuration of the substrate cleaning apparatus 100 according to the first embodiment. A mechanism for adjusting and a mechanism for monitoring the pressing force are further provided. In the present embodiment, the same parts as those in the substrate processing apparatus 100 according to the first embodiment are denoted by the same reference numerals.

  As shown in FIG. 10, the substrate cleaning apparatus 101 according to the present embodiment is provided with an elevating device 4B 'instead of the elevating device 4B. The elevating device 4B 'includes an actuator 41, a connecting member 42, a base plate 43, a cylinder 44, a linear guide 45, a base plate 46, and an elevating drive unit 47 as an adjustment unit.

  The actuator 41 is installed on the inner bottom surface of the casing 2. As the actuator 41, for example, a pneumatic cylinder or a hydraulic cylinder is used.

  The connecting member 42 is an L-shaped member fixed to the upper end portion of the cylinder 41. When the cylinder 41 is driven, the vertical position of the connecting member 42 changes. A base plate 43 is attached to the connecting member 42. The base plate 43 supports the base plate 46 via the cylinder 44 and the linear guide 45. The base plate 46 supports the three push pins 5. When the connecting member 42 moves up and down, the base plate 43, the cylinder 44, the linear guide 45, and the base plate 46 move up and down, and as a result, the push pin 5 moves up and down.

  A lift drive unit 47 is connected to the cylinder 44. The lift drive unit 47 adjusts the air pressure (or hydraulic pressure) of the cylinder 44 and adjusts the force applied from the base plate 43 to the base plate 46. As a result of this adjustment, the pressing force transmitted from the cleaning brush 7 to the wafer W can be adjusted. Although the linear guide 45 supports the base plate 46, the posture of the base plate 46 is maintained parallel to the base plate 43, that is, horizontally even when the pressure of the cylinder 44 is adjusted. Yes.

  Thus, in this embodiment, the pressing force transmitted from the cleaning brush 7 to the wafer W can be adjusted. In this way, the pressing force applied to the wafer W from the cleaning brush 7 is maintained at a value suitable for rubbing cleaning, and it is possible to carefully wash off foreign matter adhering to the peripheral edge of the lower surface of the wafer W.

  In the present embodiment, a push spring 25 is bridged between the push ring 6 and the rotating shaft 15. When the pressing spring 25 presses the rotating arm 8, a rotating moment is generated that rotates the rotating arm 8 clockwise in the drawing. In other words, the push spring 25, together with the balance weight 10, imparts a rotating moment in the clockwise direction to the rotating arm 8. Therefore, by adding the pressing spring 25, the force with which the cleaning brush 9 presses the wafer W can be further increased.

  Furthermore, in the substrate cleaning apparatus 101 according to the present embodiment, three weight sensors 51, 52, and 53 are provided. The weight sensor 51 detects the pressing force (more precisely, the reaction force) applied to the peripheral edge when the cleaning brush 7 comes into contact with the lower peripheral edge of the wafer W. The weight sensor 52 detects the pressing force (more precisely, the reaction force) applied to the end surface portion of the cleaning brush 9 when it contacts the end surface portion of the wafer W. The weight sensor 53 detects the pressing force (more precisely, the reaction force) applied to the peripheral edge when the cleaning brush 22 contacts the upper peripheral edge of the wafer W.

  The detection signals of the weight sensors 51, 52, 53 are sent to the display unit 60 as an output unit. On the display unit 60, the signal levels of the detection signals of the weight sensors 51, 52, 53 are displayed. Therefore, the operator can confirm whether or not the pressing force applied to the wafer W is within an appropriate range by looking at the display content of the display unit 60.

  The cleaning operation of the substrate cleaning apparatus 101 according to the present embodiment is the same as the cleaning operation of the substrate cleaning apparatus 100 according to the first embodiment.

  As described above, in the substrate processing apparatus 101 according to the present embodiment, a mechanism for adjusting the pressing force applied to the wafer W from the cleaning brushes 7, 9, 22 and the like, and a mechanism for detecting the pressing force. Is provided. By these mechanisms, the pressing force applied to the wafer W by the cleaning brushes 7, 9, 22 and the like can be adjusted. Accordingly, the cleaning effect can be further enhanced.

  In the present embodiment, the detection signals of the weight sensors 51, 52, 53 are displayed on the display unit 60. However, the detection signals of the weight sensors 51, 52, 53 are stored as log data in a storage device as an output unit. The log data may be stored so that the log data can be confirmed after the process is completed.

<Third Embodiment>
In the second embodiment, the detection values of the three weight sensors 51, 52, 53 can be displayed on the display unit 60, or can be used for controlling the pressing force.
Hereinafter, a third embodiment in which the pressing force of the cleaning brushes 7 and 9 is controlled using the detected value of the gravity center will be described.
As shown in FIG. 11, the substrate cleaning apparatus 102 according to this embodiment controls the pressing force of the cleaning brush 7 on the wafer W in addition to the configuration of the substrate cleaning apparatus 101 according to the second embodiment. And a mechanism for performing the operation.

  As shown in FIG. 11, the substrate cleaning apparatus 102 according to the present embodiment is that the detection signal of the weight sensor 51 is output not only to the display unit 60 but also to the lifting drive unit 47. This is different from the substrate cleaning apparatus 102 according to the embodiment.

  Based on the detection signal from the weight sensor 51, the lifting drive unit 47 is configured so that the pressing force of the cleaning brush 7 on the wafer W exceeds the appropriate range so that the pressing force is reduced. The pressure of the cylinder 44 is adjusted so that the pressing force becomes larger when the pressing force of the cleaning brush 7 on the wafer W is lower than an appropriate value.

  By doing so, the pressing force applied from the cleaning brush 7 to the wafer W by the feedback control is maintained at an appropriate value during the cleaning, so that the cleaning effect can be further enhanced.

  The cleaning operation of the substrate cleaning apparatus 102 is the same as the cleaning operation of the substrate cleaning apparatus 101 according to the second embodiment.

  In the present embodiment, the pressing force of the cleaning brush 22 on the wafer W may be controlled by finely adjusting the position of the upper arm 21 in the Z-axis direction based on the detection signal of the weight sensor 53. In this way, the upper and lower surfaces of the wafer W are sandwiched between the cleaning brush 7 and the cleaning brush 22 and the weight sensors 51 and 53 are provided so as to control the pressing force of the both to be equal. Can be canceled. As a result, it is possible to minimize stress applied to the wafer W during cleaning, suppress deformation of the wafer W, and prevent breakage.

<Fourth Embodiment>
In the above embodiment, the cleaning brushes 7 and 22 are stopped. However, in order to enhance the cleaning effect, they can be rotated.
Hereinafter, a fourth embodiment including a mechanism for rotating the cleaning brushes 7 and 22 will be described.

The substrate cleaning apparatus 103 according to this embodiment is different from the substrate cleaning apparatus 100 according to the first embodiment in that motors 61 and 62 are provided.
The motor 61 is attached to the push ring 6 immediately below the cleaning brush 7 and rotates the cleaning brush 7 about the Z axis. The motor 62 is provided in the upper arm 21 and rotates the cleaning brush 22 around the Z axis. Main controller 50 makes wafers W come into contact with motors 61 and 62 while cleaning brushes 7 and 22 are rotated at a constant rotational speed.

  If the cleaning brushes 7 and 22 are rotated, the cleaning effect of the wafer W can be further enhanced in combination with the rotation of the wafer W, and the degree of wear of the cleaning brushes 7 and 22 can be reduced. Life can be extended.

Further, not only the peripheral edge of the upper surface of the wafer W may be cleaned with the cleaning brush 22 but also the entire upper surface of the wafer W may be cleaned while moving the cleaning brush 22.
For example, as shown by arrows YB in FIG. 13 in steps S09 and S11 in FIG. 4, the upper brush mechanism 14 is moved down to a position exceeding the center of the wafer W, and then passes through the center of the wafer W. Then, the upper brush mechanism 14 is raised again, moved to a position beyond the center of the wafer W, then lowered, and then moved to the end through the center of the wafer W. Then, the process of washing is repeated.

  As a result, the foreign matter adhering to the entire upper surface of the wafer W is scrubbed by the cleaning brush 22 and further carried to the edge of the wafer W by the cleaning brush 22 and flows down from the wafer W together with the cleaning liquid. In this way, scrub cleaning of the entire upper surface of the wafer W becomes possible.

<Summary>
As described above in detail, according to each of the above-described embodiments, the drive mechanisms of the cleaning brushes 7 and 9 are made common, thereby preventing the apparatus from becoming complicated and large. This commonization is realized by a combination of the push ring 6 that moves up and down and the rotary arm 8.

  When the push ring 6 rises, the rotary arm 8 rotates. As a result, the cleaning brush 7 contacts the peripheral edge of the lower surface of the wafer W, and the cleaning brush 9 contacts the end surface of the wafer W. When the push ring 6 is lowered, the rotating arm 8 rotates in the reverse direction. Accordingly, the cleaning brushes 7 and 9 are retracted from the wafer W.

  Such a cooperative operation of the push ring 6 and the rotary arm 8 is realized by the action of the inclined surface 16 of the casing 2, the balance weight 10, and the like. The rotating arm 8 is always given a clockwise rotating moment by the balance weight 10 or the like. However, when the balance weight 10 comes into contact with the inclined surface 16, the reaction force received from the inclined surface 16 gives a rotational moment in the opposite direction to the rotating arm 8, and the rotating arm 8 rotates in the opposite direction or rotates. Is suppressed. That is, in this way, when the push ring 6 is raised, the rotating arm 8 is rotated clockwise on the paper surface, and when the push ring 6 is lowered, a driving mechanism is realized in which the rotating arm 8 is rotated counterclockwise on the paper surface. According to this drive mechanism, the interlocking of the cleaning brushes 7 and 9 is realized, and simultaneous scrub cleaning of the sliding edge portion and the end surface portion of the lower surface of the wafer W becomes possible. If simultaneous scrub cleaning of the sliding edge portion and end surface portion of the lower surface of the wafer W can be realized, the cleaning time of the wafer W can be shortened accordingly.

  The angle of the inclined surface 16 of the casing 2 and the angle of inclination of the rotary arm 8 can be arbitrarily set as long as the above-described operation can be realized. However, the rotary arm 8 is more than the normal line of the inclined surface 16. It must be inclined. Otherwise, when the push ring 6 is lowered, the inclined surface 16 cannot give a rotational moment counterclockwise to the rotary arm 8.

  The inclined surface 16 may be a curved surface instead of a flat surface. In short, any surface that can give a rotational moment counterclockwise to the rotation arm 8 may be used. Further, the balance weight 10 may be rotatable around the X axis so that the inclined surface 16 can be easily slid.

  Thus, in each said embodiment, although the member which suppresses rotation of the rotation arm 8 was made into the casing 2, this invention is not restricted to this, The other member which suppresses rotation of the rotation arm 8 is provided. It may be. However, if the rotation of the rotary arm 8 is suppressed on the slope of the casing 2 as in the above embodiments, the number of members can be reduced, which is advantageous for simplification and miniaturization of the apparatus. .

  Further, in each of the above embodiments, the cleaning brush 7 for cleaning the peripheral portion of the lower surface of the wafer W and the cleaning brush 22 for cleaning the peripheral portion of the upper surface of the wafer W are provided, and the peripheral portions of both surfaces are simultaneously cleaned. I was able to. Thereby, the cleaning time of the wafer W can be shortened. In each of the above embodiments, the push ring 6 is lifted in step S09 and the upper brush mechanism 14 is moved in step S11 separately. However, these may be performed simultaneously.

  Further, in each of the embodiments described above, it is the balance weight 10 and further the pressing spring 25 that gives the rotating moment to the rotating arm 8, but the pressing spring 25 alone causes the rotating moment to be applied to the rotating arm 8. May be given. Further, the spring is not limited to a coil spring, and may be a tension spring or a leaf spring. Furthermore, any elastic member such as a guard can be used as long as the rotating arm 8 can be appropriately biased. Further, it may be energized by the attractive force / repulsive force of the magnet.

  As the cleaning brushes 7, 9, and 22, various types such as a sponge-like one and a brush-like one can be used. For example, a brush made of polyvinyl alcohol or polypropylene can be employed. The kind of brush should just be selected appropriately according to a use. For example, for the cleaning brush 7 for cleaning the peripheral edge of the lower surface of the wafer W, a brush combining a polyvinyl alcohol brush and a polypropylene brush may be used in order to remove a wide variety of particles. Good.

It is a figure which shows the structure of the board | substrate cleaning apparatus which concerns on the 1st Embodiment of this invention. FIG. 2A is a diagram illustrating a state when the push ring is positioned at the lowest point, and FIG. 2B is a diagram illustrating a state when the push ring is raised. It is a figure which shows the structure of the control system of the board | substrate cleaning apparatus of FIG. It is a flowchart of the cleaning process of the board | substrate cleaning apparatus of FIG. It is FIG. (1) which shows cleaning operation | movement of a board | substrate cleaning apparatus. It is FIG. (2) which shows cleaning operation | movement of a board | substrate cleaning apparatus. It is FIG. (3) which shows cleaning operation | movement of a board | substrate cleaning apparatus. It is FIG. (4) which shows cleaning operation | movement of a board | substrate cleaning apparatus. It is FIG. (5) which shows cleaning operation | movement of a board | substrate cleaning apparatus. It is a figure which shows the structure of the substrate cleaning apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows the structure of the board | substrate cleaning apparatus which concerns on the 3rd Embodiment of this invention. It is a figure which shows the structure of the board | substrate cleaning apparatus which concerns on the 4th Embodiment of this invention. It is a figure which shows the modification of operation | movement of an upper brush mechanism.

Explanation of symbols

1 Base 2 Casing 3 Spin chuck 4A Motor (spindle motor)
4B Lifting device 5 Push pin 6 Push ring 7 Cleaning brush 8 Rotating arm 9 Cleaning brush 10 Balance weight 12 Nozzle 13 Cup 14 Upper brush mechanism 15 Rotating shaft 16 Inclined surface 21 Upper arm 22 Cleaning brush 25 Push spring 31 Cleaning liquid supply device 32 Upper part Arm drive device 33 Cup drive device 34 Load arm drive device 35 Spin chuck drive device 36 Vacuum suction mechanism 41 Actuator 42 Connecting member 43 Base plate 44 Cylinder 45 Linear guide 46 Base plate 47 Elevating drive unit 50 Main controller 51, 52, 53 Weight sensor 60 Display unit 61, 62 Motor 71 Interlocking member 72 Cam mechanism 100, 101, 102, 103 Substrate cleaning device W Wafer

Claims (11)

A rotation drive unit that holds a substantially circular substrate and rotates the substrate around a vertical axis;
An elevating member disposed below the substrate;
A lifting device for lifting and lowering the lifting member;
A first cleaning brush attached to the elevating member so as to face the peripheral edge of the lower surface of the substrate;
A second cleaning brush attached to the elevating member so as to come into contact with an end surface portion of the substrate when the elevating member is raised;
A substrate cleaning apparatus comprising: The second cleaning brush is attached so as to face the end surface portion, and the second cleaning brush is rotatably attached to the elevating member so as to be able to approach and separate from the end surface portion of the substrate. A rotating arm,
A rotation moment applying unit that gives the rotation arm a rotation moment that causes one end of the rotation arm to approach the end surface; and
When the elevating member is lowered, it comes into contact with the other end of the rotating arm, when the elevating member is raised, it is separated from the other end, and when it is brought into contact with the other end, one end of the rotating arm is separated from the end surface portion. A fixing member that gives a rotational moment of
The substrate cleaning apparatus according to claim 1, further comprising: The fixing member has an inclined surface that comes into contact with the rotating arm,
The rotating arm is further inclined than the normal of the inclined surface;
3. The fixing member according to claim 2, wherein the fixing member abuts on the other end portion of the rotating arm to give the rotating arm a rotating moment in a direction in which one end of the rotating arm is separated from the end surface portion. The substrate cleaning apparatus as described.   The substrate cleaning apparatus according to claim 2, wherein the fixing member includes a casing that houses the lifting device.   The substrate cleaning apparatus according to claim 2, wherein the rotational moment applying unit includes a balance weight attached to the rotating arm.   The substrate cleaning apparatus according to claim 2, wherein the rotational moment applying unit includes an elastic member that is bridged between the elevating member and the rotating arm. The lifting device is
An actuator for raising and lowering the elevating member;
An adjustment unit for adjusting a force to raise the elevating member,
The substrate cleaning apparatus according to claim 2, wherein A sensor for detecting a pressing force applied to the peripheral edge when the first cleaning brush contacts the peripheral edge;
The adjusting unit adjusts the pressing force based on a detection signal of the sensor;
The substrate cleaning apparatus according to claim 7.   The substrate cleaning apparatus according to claim 1, further comprising a motor that rotates the first cleaning brush. An arm disposed above the substrate;
A third cleaning brush attached to the arm so as to face the peripheral edge of the upper surface of the substrate;
An arm driving device for driving the arm to raise and lower the third cleaning brush;
The substrate cleaning apparatus according to claim 1, further comprising: Rotate the board
By moving a predetermined driving member in the first direction, a driving force is applied to the first and second cleaning brushes so that the first cleaning brush is brought into contact with a peripheral portion of one surface of the substrate, and the first cleaning brush is brought into contact with the first cleaning brush. The cleaning brush of 2 is brought into contact with the end face of the substrate,
With the first cleaning brush and the second cleaning brush in contact with the substrate, the substrate is cleaned,
By moving the predetermined driving member in the second direction, a driving force is applied to the first and second cleaning brushes so as to be separated from the substrate,
Stop the rotation of the substrate;
And a substrate cleaning method.

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