JP2010040916A5 - - Google Patents

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JP2010040916A5
JP2010040916A5 JP2008204289A JP2008204289A JP2010040916A5 JP 2010040916 A5 JP2010040916 A5 JP 2010040916A5 JP 2008204289 A JP2008204289 A JP 2008204289A JP 2008204289 A JP2008204289 A JP 2008204289A JP 2010040916 A5 JP2010040916 A5 JP 2010040916A5
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Japan
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group
composition according
electronic member
flux
compound represented
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JP2008204289A
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JP5247291B2 (en
JP2010040916A (en
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Claims (8)

下記式（ａ）で表される化合物から導かれる少なくとも１種の重合単位（Ａ）と、下記式（ｂ）で表される化合物または不飽和結合を有する環状のカルボン酸無水物から導かれる少なくとも１種の重合単位（Ｂ）とを含有する重合体を含むはんだ用フラックス這い上がり防止組成物：
ＣＨ２＝Ｃ（Ｒ1）−ＣＯＯ−Ｑ１−Ｒｆ （ａ）
式中、Ｒ１：水素原子またはメチル基、
Ｑ１：単結合または２価の連結基、
Ｒｆ：主鎖の鎖長が炭素数１〜６のポリフルオロアルキル基またはポリフルオロエーテル基を示す。
ＣＨ２＝Ｃ（Ｒ1）−ＣＯＯ−Ｑ２−ＣＯＯＨ （ｂ）
式中、Ｒ１：前記式（ａ）と同じ、Ｑ２：２価の連結基。 At least one polymer unit (A) derived from a compound represented by the following formula (a) and at least a compound represented by the following formula (b) or a cyclic carboxylic acid anhydride having an unsaturated bond A solder flux creep-up preventing composition comprising a polymer containing one type of polymerized unit (B):
CH 2 = C (R 1) -COO-Q 1 -R f (a)
In the formula, R 1 : a hydrogen atom or a methyl group,
Q 1 : a single bond or a divalent linking group,
R f represents a polyfluoroalkyl group or polyfluoroether group having a main chain length of 1 to 6 carbon atoms.
CH 2 = C (R 1) -COO-Q 2 -COOH (b)
Wherein, R 1: same as in the formula (a), Q 2: 2 divalent linking group. 前記Ｒｆ基が炭素数１〜６の直鎖のパーフルオロアルキル基またはパーフルオロエーテル基である請求項１に記載の組成物。 The composition according to claim 1, wherein the R f group is a linear perfluoroalkyl group or perfluoroether group having 1 to 6 carbon atoms. 前記重合体中の前記重合単位（Ｂ）の割合が１０質量％以下である請求項１、２のいずれかに記載の組成物。   The composition according to any one of claims 1 and 2, wherein the proportion of the polymerized units (B) in the polymer is 10% by mass or less. 前記式（ｂ）で表される化合物が、下記式（ｂ１）で表される化合物である、請求項１〜３のいずれかに記載の組成物。  The composition according to any one of claims 1 to 3, wherein the compound represented by the formula (b) is a compound represented by the following formula (b1).
ＣＨCH ２2 ＝Ｃ（Ｒ= C (R １1 ）−ＣＯＯ−Ｑ) -COO-Q ３3 −ＣＯＯＨ （ｂ１）-COOH (b1)
（式中、Ｒ(Wherein R １1 は前記と同じである。ＱIs the same as above. Q ３3 は、アルキレン基、フェニレン基、シクロヘキシレン基、エステル結合、アミド結合、−ＣＯ−、−Ｏ−、−（ＣＨIs an alkylene group, a phenylene group, a cyclohexylene group, an ester bond, an amide bond, -CO-, -O-,-(CH ２2 ＣＨCH ２2 Ｏ）O) ｎn −、−（ＣＨ-,-(CH ２2 ＣＨCH ２2 ＣＨCH ２2 Ｏ）O) ｎn −、またはこれらの組合せであり（ここでのｎは１〜３０の整数）、これらの基は、置換基を有していてもよい。）-, Or a combination thereof (where n is an integer of 1 to 30), and these groups may have a substituent. ) 前記不飽和結合を有する環状のカルボン酸無水物が、無水マレイン酸または無水イタコン酸である、請求項１〜３のいずれかに記載の組成物。  The composition according to any one of claims 1 to 3, wherein the cyclic carboxylic acid anhydride having an unsaturated bond is maleic anhydride or itaconic anhydride. 電子部材の少なくともフラックスで処理する部分に、請求項１〜５のいずれかに記載の組成物からなる被膜を有し、はんだ用フラックス這い上がり防止性能を有する電子部材。 The electronic member which has the film which consists of a composition in any one of Claims 1-5 in the part processed with a flux at least of an electronic member, and has the flux climbing prevention performance for solder. 電子部材の少なくともフラックスで処理する部分に、請求項１〜５のいずれかに記載の組成物からなる被膜を形成し、該被膜の上にはんだ用フラックスを塗布した後、はんだ付けする、電子部材のはんだ付け方法。 An electronic member formed by forming a film made of the composition according to any one of claims 1 to 5 on at least a part of the electronic member to be treated with a flux, applying a solder flux on the film, and then soldering the film. Soldering method. 請求項７に記載の方法ではんだ付けした電子部材を含む電気製品。 An electrical product comprising an electronic member soldered by the method of claim 7 .
JP2008204289A 2008-08-07 2008-08-07 Solder flux creeping-up composition, electronic member for solder coated with the composition, method for soldering the member, and electrical product Active JP5247291B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008204289A JP5247291B2 (en) 2008-08-07 2008-08-07 Solder flux creeping-up composition, electronic member for solder coated with the composition, method for soldering the member, and electrical product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008204289A JP5247291B2 (en) 2008-08-07 2008-08-07 Solder flux creeping-up composition, electronic member for solder coated with the composition, method for soldering the member, and electrical product

Publications (3)

Publication Number Publication Date
JP2010040916A JP2010040916A (en) 2010-02-18
JP2010040916A5 true JP2010040916A5 (en) 2011-07-07
JP5247291B2 JP5247291B2 (en) 2013-07-24

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JP2008204289A Active JP5247291B2 (en) 2008-08-07 2008-08-07 Solder flux creeping-up composition, electronic member for solder coated with the composition, method for soldering the member, and electrical product

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5595110B2 (en) 2010-05-10 2014-09-24 三菱重工業株式会社 Iodine filter leak test method, leak test apparatus, and fluorine-containing reagent
JP6993605B1 (en) * 2021-03-31 2022-02-04 千住金属工業株式会社 Flux and solder paste

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049859A (en) * 1983-08-30 1985-03-19 Asahi Glass Co Ltd Agent for preventing creeping up of flux for soldering
JP3613855B2 (en) * 1995-11-10 2005-01-26 大日本インキ化学工業株式会社 Method for producing fluororesin solution

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