JP2010037477A5 - - Google Patents

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Publication number
JP2010037477A5
JP2010037477A5 JP2008204092A JP2008204092A JP2010037477A5 JP 2010037477 A5 JP2010037477 A5 JP 2010037477A5 JP 2008204092 A JP2008204092 A JP 2008204092A JP 2008204092 A JP2008204092 A JP 2008204092A JP 2010037477 A5 JP2010037477 A5 JP 2010037477A5
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JP
Japan
Prior art keywords
insulating layer
group
general formula
forming material
represented
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008204092A
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English (en)
Japanese (ja)
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JP2010037477A (ja
JP5256921B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2008204092A priority Critical patent/JP5256921B2/ja
Priority claimed from JP2008204092A external-priority patent/JP5256921B2/ja
Publication of JP2010037477A publication Critical patent/JP2010037477A/ja
Publication of JP2010037477A5 publication Critical patent/JP2010037477A5/ja
Application granted granted Critical
Publication of JP5256921B2 publication Critical patent/JP5256921B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008204092A 2008-08-07 2008-08-07 絶縁層形成用材料および電子部品。 Expired - Fee Related JP5256921B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008204092A JP5256921B2 (ja) 2008-08-07 2008-08-07 絶縁層形成用材料および電子部品。

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008204092A JP5256921B2 (ja) 2008-08-07 2008-08-07 絶縁層形成用材料および電子部品。

Publications (3)

Publication Number Publication Date
JP2010037477A JP2010037477A (ja) 2010-02-18
JP2010037477A5 true JP2010037477A5 (cg-RX-API-DMAC10.html) 2011-09-22
JP5256921B2 JP5256921B2 (ja) 2013-08-07

Family

ID=42010356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008204092A Expired - Fee Related JP5256921B2 (ja) 2008-08-07 2008-08-07 絶縁層形成用材料および電子部品。

Country Status (1)

Country Link
JP (1) JP5256921B2 (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6097029B2 (ja) * 2012-07-25 2017-03-15 株式会社Ｄｎｐファインケミカル エネルギー線硬化性樹脂組成物、この組成物を用いた保護膜、タッチパネル部材及びタッチパネル部材の製造方法
JP7181094B2 (ja) * 2017-02-01 2022-11-30 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07278424A (ja) * 1994-04-13 1995-10-24 Showa Highpolymer Co Ltd 熱硬化性樹脂組成物
JP3658541B2 (ja) * 2001-02-05 2005-06-08 ニチバン株式会社 光硬化型油面接着性組成物
JP2006330235A (ja) * 2005-05-25 2006-12-07 Fujikura Ltd 難燃性ソルダーレジスト樹脂組成物及び絶縁保護被膜
CN101528781B (zh) * 2006-11-10 2012-05-16 东丽株式会社 光波导用组合物糊和使用其的光波导

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