JP2010029871A5 - - Google Patents

Claims (16)

A first junction including a first metal atom, a second metal atom having a higher ionization tendency than the first metal atom, and a leaving group composed of an organic component on the first substrate. Forming a film to obtain a first substrate with a bonding film, and comprising a second substrate containing the first metal atom, the second metal atom, and the leaving group on a second substrate; Forming a second bonding film to obtain a second substrate with a bonding film;
Energy is imparted to the first bonding film and the second bonding film, and the leaving group existing near the surfaces of the first bonding film and the second bonding film is removed from these bonding films. Causing the first bonding film and the second bonding film to exhibit adhesion by desorption, and
The first bonding film and the second bonding film-attached substrate are bonded together so that the first bonding film and the second bonding film are in close contact with each other, and the first bonding is performed. And a step of obtaining a bonded body in which the film and the second bonding film are bonded. A first junction including a first metal atom, a second metal atom having a higher ionization tendency than the first metal atom, and a leaving group composed of an organic component on the first substrate. Forming a film to obtain a first substrate with a bonding film, and comprising a second substrate containing the first metal atom, the second metal atom, and the leaving group on a second substrate; Forming a second bonding film to obtain a second substrate with a bonding film;
A step of obtaining a laminate by superimposing the first substrate with a bonding film and the second substrate with a bonding film so that the first bonding film and the second bonding film are in close contact with each other. When,
Energy is imparted to the first bonding film and the second bonding film, and the leaving group present in the vicinity of the surfaces of the first bonding film and the second bonding film is converted into these bonding films. By desorbing from the first bonding film, the first bonding film and the second bonding film are made to exhibit adhesiveness, and a bonded body in which the first bonding film and the second bonding film are bonded is obtained. A bonding method comprising the steps of:   Both the first bonding film and the second bonding film are made from a first organometallic material comprising the first metal atom and a second organometallic material comprising the second metal atom. The bonding method according to claim 1, wherein the film is formed using a metal organic chemical vapor deposition method.   The bonding method according to claim 3, wherein both the first bonding film and the second bonding film are formed in a low reducing atmosphere.   5. The bonding method according to claim 3, wherein the leaving group is one in which a part of an organic substance contained in the first organometallic material and the second organometallic material remains.   6. The leaving group according to any one of claims 3 to 5, comprising a carbon atom as an essential component and an atomic group containing at least one of a hydrogen atom, a nitrogen atom, a phosphorus atom, a sulfur atom and a halogen atom. The joining method described.   The bonding method according to claim 6, wherein the leaving group includes an alkyl group.   The joining method according to claim 3, wherein both the first organometallic material and the second organometallic material are β-diketone complexes.   The bonding method according to claim 1, wherein each of the first bonding film and the second bonding film has conductivity.   The bonding method according to claim 1, wherein the first metal atom is at least one of copper, aluminum, and silver.   The bonding method according to claim 10, wherein when copper is used as the first metal atom, the second metal atom is at least one of aluminum, zinc, iron, nickel, lead, and indium.   The abundance ratio of the total of the first metal atoms and the second metal atoms to the carbon atoms in the first bonding film and the second bonding film is 3: 7 to 7: 3, respectively. Item 12. The joining method according to any one of Items 1 to 11.   13. The first bonding film and the second bonding film, respectively, wherein an active hand is generated after the leaving group existing at least near the surface of the first bonding film and the second bonding film are released from each bonding film. The joining method according to any one of the above.   The joining method according to claim 13, wherein the active hand is a dangling bond or a hydroxyl group. The application of energy is performed by irradiating the first bonding film and the second bonding film with energy rays, heating the first bonding film and the second bonding film, and the first bonding film. bonding film and bonding method according to any one of claims 1 to 14 carried out by at least one of the methods for imparting a compressive force to the second bonding film. Conjugate characterized in that it is joined by the bonding method according to any one of claims 1 to 15.