JP2010026020A - Light accumulating chip and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light accumulating chip which is easy to carry and transport, and high in flexibility. <P>SOLUTION: The light accumulating chip 1 has a cavity portion formed on an inner side surface of a light accumulating material layer 2, a transparent facing layer 3 on an outer side surface, and a white resin layer 4 having a reflecting function on the inner side surface of the light accumulating material layer 2. The transparent facing layer 3 is formed of a material having high hardness such as an acrylic resin, a silicon resin, and a polyester resin. The light accumulating material layer 2 is porous while light accumulating material particles 2a are bonded in contact with one another, a transparent resin 5 for maintaining the shape of the light accumulating material layer being charged in gaps among the light accumulating particles 2a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a phosphorescent chip capable of forming a specific label or the like by bonding a plurality thereof and a method for manufacturing the same.

  Conventionally, road signs using phosphorescent materials are known. For example, Patent Document 1 discloses a configuration in which an afterglow upper paint in which a phosphorescent material having a particle size of about 5 to 20 μm is mixed with a glass frit having a particle size of about 100 μm is dispersed in the glass layer after firing. .

  Patent Document 2 describes an evacuation guidance sign for a pedestrian in which a recess is provided in the center of the upper surface of a roadway and a plastic piece containing a phosphorescent material is fixed in the recess.

  Patent Document 3 describes that phosphorescent material particles are finely pulverized and kneaded into a paint, and this is printed by silk screen printing to form a phosphorescent layer.

  In Patent Document 4, an adhesive layer is formed on a translucent member, phosphorescent material particles are sprinkled on the adhesive layer, and a transparent resin is sprayed on the back surface of the adsorbed phosphorescent material particles to obtain phosphorescent material particles. The content of covering this phosphorescent material particle layer with a reflective sheet is described so as not to drop off.

JP-A-10-194971 JP 2001-295231 A Japanese Patent Laid-Open No. 10-884048 Japanese Patent No. 3482407

  The phosphorescent material layers described in Patent Documents 1 to 3 cannot achieve sufficient luminance because the phosphorescent material particles are dispersed in a glass frit or resin matrix.

  Moreover, although sufficient brightness can be obtained by adopting the structure disclosed in Patent Document 4, the shape cannot be strongly maintained because the phosphorescent material layer remains porous, and a place where a large force acts, for example, There is a problem with using it for road markers.

  Furthermore, since the conventional structure is manufactured exclusively for signs and road markers of a specific shape from the beginning, it may be used as the signs or road markers, but other applications are not applicable and the degree of freedom is low. It is getting smaller.

  In order to solve the above-mentioned problems, the phosphorescent chip according to the present invention is formed in a circular shape or a polygonal shape in plan view so that the phosphorescent chip can be applied to any application. Or hemispherical. In addition, a hollow portion is formed on the inner surface of the phosphorescent material layer, and a transparent skin layer is formed on the outer surface, and the phosphorescent material layer is bonded in a state where the phosphorescent material particles are in contact with each other to form a porous shape. A gap between the phosphorescent material particles was filled with a transparent resin for maintaining the shape of the phosphorescent material layer.

  By providing a white resin layer having a reflection function in the cavity on the inner surface of the phosphorescent material layer, the reflection efficiency is increased.

  By filling the cavity on the inner side surface of the phosphorescent material layer with a resin different from the transparent resin filled in the gaps between the phosphorescent material particles, it becomes possible to have the strength, flexibility and weather resistance required for the product.

Moreover, the manufacturing method of the luminous chip | tip which concerns on this invention consists of the following processes 1-7.
Process 1
A transparent resin is applied to the surface of the molding recess that is circular or polygonal in plan view and the overall shape is dish-shaped or cup-shaped to form a thin and uniform transparent resin layer.
Process 2
A transparent resin as a binder is applied thinly and uniformly on the transparent resin layer, and phosphorescent material particles are sprinkled before the transparent resin as a binder is dried.
Process 3
By repeating Step 2 a plurality of times, a porous luminous material layer is formed which is bonded by a transparent resin and has a gap between the luminous material particles.
Process 4
A solvent-type liquid transparent resin is injected from above the porous phosphorescent material layer to enter the gaps between the phosphorescent material particles.
Process 5
After the solvent of the transparent resin supplied to the phosphorescent material layer in Step 4 is evaporated and a cavity is formed inside the phosphorescent layer, white paint is applied.
Step 6
After the white paint is sufficiently dried, a resin different from the transparent resin used in step 4 is filled in the inner cavity of the phosphorescent layer.
Step 7
After the resin used in step 6 is sufficiently cured, the phosphorescent chip is removed from the mold.

Since the phosphorescent chip according to the present invention has a circular shape or a polygonal shape in a plan view, a sign having an arbitrary shape can be obtained by combining a plurality of phosphorescent chips.
Moreover, since the whole shape is made in the shape of a dish, a cup, or a hemisphere, the amount of protrusion in the attached state is large, and the visibility is improved.
Furthermore, the phosphorescent material particles constituting the phosphorescent material layer are bonded to each other in a porous form in which a part of them are in contact with each other to form a gap between the particles, and the gap is filled with a transparent resin, so that it is close to the closest packing. A chip with extremely high brightness can be obtained, and furthermore, it can sufficiently withstand an impact when the car is picked up.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a plan view of a phosphorescent chip according to the present invention, and FIG. 2 is a cross-sectional view of the phosphorescent chip. In this embodiment, the phosphorescent chip 1 has a circular shape in plan view, and the overall shape is a dish.

  In this phosphorescent chip 1, a hollow portion is formed on the inner side surface of the phosphorescent material layer 2, a transparent skin layer 3 is formed on the outer side surface, and a white resin layer 4 having a reflecting function is formed on the hollow surface. As the transparent skin layer 3, for example, a material having high hardness such as an acrylic resin, a silicon resin, or a polyester resin is used.

  The phosphorescent material layer 2 is combined with the phosphorescent material particles 2a in contact with each other to form a porous shape, and a gap between the phosphorescent material particles 2a is filled with a transparent resin 5 for maintaining the shape of the phosphorescent material layer. ing.

  FIG. 3 is a cross-sectional view of an embodiment in which the cavity of the phosphorescent chip is filled with resin. In this embodiment, a resin 6 such as polycarbonate or polyurethane is filled in the concave portion on the back surface side of the phosphorescent chip 1. Further, the adhesive 7 is applied to the entire back surface, and the release paper 8 is provided thereon.

The usage example of the above phosphorescent chip 1 is shown in FIG. In this usage example, a large number of phosphorescent chips 1 are prepared, and the release paper 8 on the back side is peeled off and attached to the wall 9 to form the letters “P” and arrows “→”.
Thus, since the shape of the phosphorescent chip 1 is simple, it can be easily produced by attaching a large number of large signs.

  5 (a) to 5 (f) are diagrams for explaining the manufacturing steps of the phosphorescent chip according to the present invention. First, as shown in FIG. 5 (a), the molding recess (cavity) 11 of the silicon mold 10 is shown. A thin resin having a uniform thickness is formed on the surface. Next, as shown in FIG. 5B, a transparent resin R1 as a binder is formed with a thin and uniform thickness on the thin and uniform transparent skin layer 3, and phosphorescent material particles 2a are sprinkled thereon. As the transparent resin R1, for example, an epoxy resin, a polyester resin, or an acrylic resin is preferable.

  Further, the transparent resin R1 as a binder is formed thin and uniform on the phosphorescent material particles 2a, and the phosphorescent material particles 2a are sprinkled again on the transparent resin layer. In this way, as shown in FIG. 6A, the phosphorescent material layer 2 is formed in which the phosphorescent material particles 2a are bonded to each other by the transparent resin R1 and a gap exists between the phosphorescent material particles 2a. As the transparent resin R1, for example, an epoxy resin, a polyester resin, or an acrylic resin is preferable.

  Next, as shown in FIG. 5C, a solvent-type liquid transparent resin R <b> 2 is injected from the upper part of the porous luminous material layer 2. As a result, as shown in FIG. 6B, the gap between the luminous material particles 2a is filled with the transparent resin R2, and the luminous material particles 2a are firmly bonded. As the transparent resin R2, a material having high light transmittance, for example, an epoxy resin, a polyester resin, or an acrylic resin is preferable, and R1 and R2 may be the same resin.

Next, as shown in FIG. 5D, after the solvent of the injected transparent resin R2 evaporates and a cavity is formed inside the phosphorescent layer, white paint is applied.

Next, as shown in FIG. 5E, after the white paint is sufficiently dried, a resin different from the transparent resin R2 is filled in the inner cavity of the phosphorescent layer.

Finally, if the filled resin is sufficiently cured, the plate-shaped phosphorescent chip 1 as shown in FIG. 3 can be obtained by releasing the mold as shown in FIG.
At this time, when the mold is released after the step of FIG. 5D, a dish-shaped phosphorescent chip 1 as shown in FIG. 2 is obtained. Further, when the mold is released after the process of FIG. 5C, the phosphorescent chip 1 without the white resin layer is obtained.

Here, the transparent resin R2 uses a solvent-type resin solution, and when it is cured, the solvent is vaporized to reduce the volume. As the volume is reduced, the silicon mold 10 is greatly warped. Therefore, it is necessary to increase the strength of the silicon mold 10 by bonding a stainless steel plate to the silicon mold.

  FIGS. 7A to 7D are diagrams illustrating another example of use of the phosphorescent chip. In this embodiment, an example of producing a phosphorescent resin block for the visually impaired using the phosphorescent chip. Show.

  Specifically, as shown in FIG. 7 (a), the phosphorescent chip 1 obtained is set in the molding recess 11 of the injection mold 15, and then the upper mold 12 is put over as shown in FIG. 7 (b). Further, as shown in FIG. 7 (c), the molten polycarbonate resin 13 is filled in the space between the molds, and after cooling, the mold is opened, and the phosphorescent resin block 14 is taken out as shown in FIG. 7 (d).

  FIGS. 8A to 8D are diagrams for explaining another example of use in which a phosphorescent block is manufactured using a phosphorescent chip. The shape of the phosphorescent chip is suitable for embedding, as shown in FIG. It is desirable to use a road dredge type.

  Specifically, as shown in FIG. 8 (b), a hole having the same diameter as the ridge portion of the phosphorescent chip 1 is drilled in a paving stone block 16 used for a pavement or the like, and an adhesive 17 is poured into the ridge portion of the phosphorescent chip 1. Insert and fix. FIG. 8C is a plan view of a phosphorescent block for the visually impaired manufactured by such a method, and FIG. 8D is a plan view of the phosphorescent block for evacuation guidance. If such a roadside type phosphorescent chip is used, it can be installed directly on the floor or road surface.

Plan view of phosphorescent chip according to the present invention Cross-sectional view of the phosphorescent chip Sectional drawing of the Example which filled the cavity of the phosphorescent chip with resin The figure explaining the usage example of the phosphorescent chip (A)-(f) is the figure explaining the manufacturing process of the luminous chip | tip which concerns on this invention. (A), (b) is an enlarged view of the phosphorescent material layer, (a) shows a state where the gap is not filled with a transparent resin, and (b) shows a state where the gap is filled with a transparent resin. (A)-(d) is a figure explaining another example of use of a phosphorescent chip. (A)-(d) is a figure explaining another example of use of a phosphorescent chip.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Luminescent chip, 2 ... Luminescent material layer, 2a ... Luminescent material particle, 3 ... Transparent skin layer, 4 ... White resin layer, 5 ... Transparent resin, 6 ... Resin, such as polycarbonate or polyurethane, 7 ... Adhesive, 8 ... Release paper, 9 ... wall, 10 ... silicone mold, 11 ... molding recess (cavity), 12 ... upper mold, 13 ... polycarbonate resin, 14 ... phosphorescent resin block, 15 ... injection mold, 16 ... block, 17 ... adhesion Agent, R1 ... transparent resin as binder, R2 ... transparent resin as filler.

Claims (5)

A phosphorescent chip having a circular or polygonal shape in plan view and having an overall shape of a dish, cup or hemisphere, the phosphorescent chip being a cavity on the inner side of the phosphorescent material layer and a transparent skin layer on the outer side The phosphorescent material layer is combined with the phosphorescent material particles in contact with each other to form a porous shape, and a gap between the phosphorescent material particles is filled with a transparent resin for maintaining the shape of the phosphorescent material layer. A phosphorescent chip characterized by 2. The phosphorescent chip according to claim 1, wherein a white resin layer having a reflection function is provided on an inner cavity surface of the phosphorescent material layer. 3. The phosphorescent chip according to claim 1, wherein a hollow portion on the inner side surface of the phosphorescent material layer is filled with a resin different from a transparent resin filled in a gap between the phosphorescent material particles. Chip. The manufacturing method of the phosphorescence chip | tip characterized by consisting of the following processes.
<Step 1> A transparent resin is applied to the surface of the molding recess having a circular shape or a polygonal shape in plan view, and the overall shape is a dish shape or a cup shape, thereby forming a thin transparent resin layer having a uniform thickness.
<Step 2> A transparent resin as a binder is applied thinly and uniformly on the transparent resin layer, and the phosphorescent material particles are sprinkled before the transparent resin as the binder is dried.
<Step 3> By repeating the step 2 a plurality of times, a porous phosphorescent material layer in which gaps exist between phosphorescent material particles while being bonded by a transparent resin is formed.
<Step 4> A solvent-type liquid transparent resin is injected from above the porous luminous material layer to enter the gaps between the luminous material particles.
<Step 5> After the solvent of the transparent resin supplied to the phosphorescent material layer in Step 4 evaporates and a cavity is formed inside the phosphorescent layer, white paint is applied.
<Step 6> After the white paint is sufficiently dried, the inner cavity of the phosphorescent layer is filled with a resin different from the transparent resin used in Step 4.
<Step 7> After the resin used in Step 6 is sufficiently cured, the phosphorescent chip is removed from the mold. 6. The method of manufacturing a phosphorescent chip according to claim 5, wherein a resin molding die whose strength is reinforced with a stainless steel plate or the like is used.

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