JP2010018041A - Inkjet head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress discharge defects caused by foreign matters such as dust generated during the manufacturing or use of an inkjet recording head. <P>SOLUTION: The method of manufacturing an inkjet head includes: a step of preparing an Si substrate 1; a step of forming, on a first surface of the Si substrate 1, an SiN film 4 serving as a perforated filter mask, and a membrane having an SiO<SB>2</SB>film layer covering the first surface in such a manner that the first surface is not exposed from the plurality of perforations; a step of forming a close contact enhancing layer 7 on the membrane; a step of forming a coating resin layer 9 for constituting an ink ejection port 11 and an ink channel on the close contact enhancing layer (polyether amide resin layer) 7; a step of forming an ink supply port 11 on the Si substrate 1 by anisotropic etching from the side of a second surface facing the first surface of the Si substrate 1; and a step of forming a membrane filter structure 16 at a portion of the close contact enhancing layer 7 positioned at an opening of the ink supply port 13 with the perforated layer of the membrane serving as a mask. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an inkjet head that performs recording by discharging droplets, an inkjet head, and an inkjet cartridge. More specifically, the present invention relates to a method for manufacturing an inkjet head that includes a filter, an inkjet head, and an inkjet cartridge.

  In recent years, in order to reduce the size and increase the density of an ink jet recording head, a method has been proposed in which an electric control circuit for driving an ink discharge pressure generating element is built in a substrate using a semiconductor manufacturing technique. In order to supply ink to a plurality of ejection openings, such an ink jet recording head penetrates the substrate from the back side of the substrate to communicate with each nozzle and a common ink supply port, and each ink is supplied from the common ink supply port. The ink is supplied to the nozzles. For such a recording head, a method disclosed in Patent Document 1 is known as a manufacturing method for making the distance between the ink discharge pressure generating element for discharging ink from the discharge port and the discharge port with extremely high accuracy. Yes. In addition, when a silicon substrate is used as the substrate of such an ink jet recording head, it is possible to form an ink supply port using an anisotropic etching technique as disclosed in Patent Document 2. .

  One of the reliability required for the ink jet recording head is to suppress the entry of dust and foreign matter into the nozzle. Possible causes are that dust and foreign matter are mixed in the nozzle during the manufacturing process of the ink jet recording head, and that dust and foreign matter are sent together with ink and enter the nozzle. As a countermeasure against this problem, it is known to provide a filter in the ink jet recording head.

  For example, in Patent Document 3, in a recording head configured by bonding a member that forms an ejection port and a flow path to a silicon substrate provided with an ink supply port, an ink supply port is provided on a surface provided with a heater. It discloses that a resistance material layer for etching is provided, and a plurality of holes are provided in the resistance material layer to form a filter at the same time as forming an ink supply port. Further, Patent Document 4 discloses a configuration in which individual ink supply ports corresponding to each of a plurality of ink ejection chambers are provided.

  On the other hand, in Patent Document 5, when forming an ink supply port on a silicon substrate, a membrane filter is used at the same time as the ink supply port by using side etching on an etching resistant mask on the opposite side of the surface provided with the heater. The provision is disclosed.

US Pat. No. 5,478,606 US Pat. No. 6,139,761 US Pat. No. 6,264,309 US Pat. No. 6,543,884 JP 2000-94700 A

  However, in the configurations of Patent Document 3 and Patent Document 4, since a member that forms the discharge port and the flow path is bonded to a silicon substrate provided with an ink supply port, this bonding is performed. There is a risk that dust or foreign matter may enter the nozzle. In addition, as disclosed in these documents, the method of forming an ink supply port in a silicon substrate after previously providing a hole to be a filter in a thin film on a silicon substrate, the anisotropic etching disclosed in Patent Document 2 is performed. The ink supply port is formed with a hole in the stop layer. Therefore, when applying the method disclosed in the above-mentioned document to the method disclosed in Patent Document 1, a soluble resin for forming the flow path is immersed in an etching solution for forming the ink supply port. As a result, the accuracy of the manufactured head and the yield of high-precision head manufacturing may be adversely affected.

On the other hand, in the method of Patent Document 5, an insulating film made of SiO ₂ , SiN or the like is used as an etching resistant mask, but the insulating film (etching resistant mask) exposed on the back side of the silicon substrate is usually sputtered. It is configured as a deposited film formed by chemical vapor deposition (CVD) or chemical vapor deposition, and it is corroded by being exposed to various liquids in the subsequent process, and in the semiconductor manufacturing apparatus during the manufacturing process. Since a minute scratch may be attached when the product is conveyed, it is very difficult to keep the filter made of the insulating film free from defects until the final product is manufactured.

  The present invention has been conceived in order to solve the above-described technical problems, and an object of the present invention is to provide an inkjet head manufacturing method that suppresses ejection failures due to foreign matters such as dust generated during manufacture or use of the inkjet head. An inkjet head and an inkjet cartridge manufactured by the manufacturing method are provided.

  In order to achieve the above object, an inkjet head manufacturing method of the present invention includes a step of preparing a silicon substrate, and a layer provided with a plurality of holes serving as filter masks on a first surface of the silicon substrate. A step of forming a membrane having a layer covering the first surface so that the first surface is not exposed from the plurality of holes, and an adhesion improving layer on the membrane formed on the silicon substrate. Forming a flow path constituting member that forms an ink flow path communicating with a discharge port for discharging ink on the adhesion improving layer; forming the ink flow path on the silicon substrate; The step of forming a communicating ink supply port from the second surface side facing the first surface of the substrate and the ink of the adhesion improving layer using the layer provided with a plurality of holes of the membrane as a mask Open the supply port The portion facing the, and a step of forming a filter, a.

  According to the above-described ink jet head manufacturing method, when the ink supply port is formed, the layer covering the first surface is formed so that the first surface is not exposed from the plurality of holes provided in the layer serving as the filter pattern. Therefore, the ink flow path and the ink supply port do not communicate with each other. Therefore, even when the flow path is formed by a resin mold, the resin forming the mold does not come into contact with the etching solution for anisotropic etching. Furthermore, it is possible to build a filter with an adhesion improving layer on the surface of the substrate where the ink flow path is provided with the ink flow path formed. There is no. Further, in the subsequent processes such as dicing and sticking to the chip plate, the filter is not exposed on the surface of the head chip, so that the filter is not damaged by handling or the like. Accordingly, it is possible to provide a method for manufacturing an ink jet head that solves the above-described problems and suppresses ejection failures due to foreign matters such as dust generated during the manufacture or use of the ink jet head.

  An ink jet head manufacturing method according to another aspect of the present invention is an ink jet head having a flow path communicating with an ejection port for ejecting ink and an ink supply port for communicating with the flow path and supplying ink. In the manufacturing method, a step of preparing a silicon substrate, a step of forming a first inorganic film on the first surface of the silicon substrate, and a step of forming a second inorganic film on the first inorganic film A step of forming an adhesion improving layer on the second inorganic film, a step of forming a flow path constituting member constituting the flow channel on the adhesion improving layer, and the step of forming the adhesion improving layer. A step of forming a plurality of holes serving as a filter at a position facing the opening of the supply port; and the ink supply port on the silicon substrate from the second surface side, which is the back surface of the first surface of the substrate. Forming by anisotropic etching; In the step of providing the ink supply port, at least one of the first inorganic film and the second inorganic film prevents communication between the ink flow path and the ink supply port, and the ink supply port is formed. And a step of communicating the ink flow path with the ink supply port.

  Even in the above-described ink jet head manufacturing method, when the ink supply port is formed, either the first inorganic layer or the second inorganic film prevents communication between the ink flow path and the ink supply port. Even when the flow path is formed by the mold, the resin forming the mold does not come into contact with the etching solution for anisotropic etching. Further, in addition to forming a filter with an adhesion improving layer on the surface of the substrate where the ink flow path is provided with the ink flow path formed, and that the filter is not exposed on the surface of the head chip, It is possible to provide a method for manufacturing an ink jet head that solves the above-described problems and suppresses ejection failures due to foreign matters such as dust generated during the manufacture or use of the ink jet head.

  In addition, an inkjet head according to the present invention includes a silicon substrate including a plurality of energy generating elements for ejecting ink, and an ink supply port for supplying ink to the energy generating elements, and the plurality of energy generating elements. A plurality of ejection openings for ejecting ink corresponding to each of the above, a flow path forming member for forming a plurality of ink flow paths communicating each of the plurality of ejection openings and the ink supply port, An adhesion improving layer made of an organic film formed between the flow path forming member and the silicon substrate, and the adhesion improving layer and the other in the opening of the ink supply port on the flow path forming member side. A filter formed of a laminate with the layers is provided.

  According to the above-described inkjet head, it can be easily manufactured by the above-described manufacturing method.

  According to another aspect of the invention, there is provided an inkjet head including a silicon substrate including a plurality of energy generating elements for ejecting ink, and an ink supply port for supplying ink to the energy generating elements, and the plurality of energies. Corresponding to each of the generating elements, a plurality of discharge ports for discharging ink, and a flow path forming member for forming a plurality of ink flow paths communicating each of the plurality of discharge ports with the ink supply port And an adhesion improving layer made of an organic film formed between the flow path forming member and the silicon substrate, wherein the ink supply port has an opening on the flow path forming member side. A filter formed of an adhesion improving layer is provided, and the flow path forming member supports the filter by a support member in a partial region in the opening. It is characterized in. Thus, for example, when ink flows into the ink flow path from the ink supply port vigorously, the filter can be prevented from being damaged by being pushed by the ink. The strength against can be increased.

  Furthermore, the ink jet cartridge of the present invention is an ink jet cartridge including the ink jet head of the present invention, and includes an ink containing portion for containing ink to be supplied to the ink jet head.

  Still another inkjet head of the present invention includes a silicon substrate including a plurality of energy generating elements for ejecting ink, and an ink supply port for supplying ink to the energy generating elements, and the plurality of energy generating elements A plurality of ejection openings for ejecting ink corresponding to each of the elements, and a flow path forming member for forming a plurality of ink flow paths communicating each of the plurality of ejection openings with the ink supply port; An adhesion improving layer made of a polyetheramide film formed between the flow path forming member and the silicon substrate, and the adhesion improving layer at an opening on the flow path forming member side of the ink supply port The filter formed by is provided.

  Still another inkjet head manufacturing method of the present invention includes a substrate having an energy generating element that generates energy used for discharging ink, an ejection port provided corresponding to the energy generating element, and the substrate. In the method of manufacturing an ink-jet head, comprising: an ink supply port for supplying ink provided on a substrate; and a flow path forming member that forms a flow path of ink that communicates the ink supply port and the discharge port. Forming a first layer provided with a plurality of holes serving as a filter mask on one surface side of the substrate, and forming an organic film so as to cover the first layer Forming a layer including at least the adhesion improving layer, providing a member to be the flow path forming member on the adhesion improving layer, and supplying the ink to the substrate Forming a as a mask the first layer, and a step of forming a filter portion facing the opening of the ink supply port of the adhesion improving layer.

  As described above, according to the present invention, a method for manufacturing an ink jet head, an ink jet head manufactured by the manufacturing method, and an ink jet that suppress ejection failure due to foreign matters such as dust generated during the manufacture or use of the ink jet head. A cartridge can be provided.

FIG. 1A is a schematic view showing an ink jet recording head according to an embodiment of the present invention, and FIG. 2B is a perspective view showing an example of an ink jet cartridge to which the present invention can be applied. FIGS. 4A to 4J are schematic cross-sectional views showing the manufacturing process of the ink jet recording head according to the first embodiment of the present invention in time series. 1 is a cross-sectional view illustrating an ink jet recording head according to a first embodiment of the present invention. It is a schematic diagram which shows the filter comprised by the back surface side of the inkjet head shown in FIG. 3, and the structure of the circumference | surroundings. FIGS. 4A to 4J are schematic cross-sectional views showing the manufacturing process of the ink jet recording head according to the second embodiment of the present invention in time series. It is sectional drawing which shows the inkjet recording head which concerns on the 3rd Example of this invention. FIGS. 9A to 9H are schematic cross-sectional views showing the manufacturing process of the ink jet recording head according to the fourth embodiment of the present invention in time series. FIGS. 9A to 9C are explanatory views of an ink jet recording head according to a fifth embodiment of the present invention, FIG. 9A is a top view thereof, and FIG. B sectional drawing and FIG. (C) are CC sectional drawings of FIG. (B). FIGS. 9A to 9C are explanatory views of an ink jet recording head according to a sixth embodiment of the present invention, FIG. 9A is a top view thereof, and FIG. B sectional drawing and FIG. (C) are CC sectional drawings of FIG. (B).

  Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1A is a schematic diagram showing an ink jet recording head according to an embodiment of the present invention.

  The ink jet recording head of this embodiment has a Si substrate (silicon substrate) 1 in which ink discharge pressure generating elements (ink discharge energy generating elements) 2 are formed in two rows at a predetermined pitch. In the Si substrate 1, ink supply ports 13 formed by anisotropic etching of Si using the etching resistant mask 5 (see FIG. 2A) as a mask are arranged in two rows of the ink discharge pressure generating elements 2. There is an opening in between. On the Si substrate 1, a nozzle forming member (flow path forming member) 9 communicates with each ink discharge port 11 from an ink discharge port 11 opened above each ink discharge pressure generating element 2 and an ink supply port 13. Individual ink flow paths are formed.

  This ink jet recording head is arranged so that the surface on which the ink supply port 13 is formed faces the recording surface of the recording medium. The ink jet recording head ejects ink droplets from the ink ejection port 11 by applying the pressure generated by the ink ejection pressure generating element 2 to the ink filled in the ink flow path via the ink supply port 13. Then, recording is performed by adhering it to a recording medium.

  The ink jet recording head can be mounted on an apparatus such as a printer, a copying machine, a facsimile, a word processor having a printer unit, or an industrial recording apparatus combined with various processing apparatuses. By using this ink jet recording head, recording can be performed on various recording media such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, and ceramics. In the present invention, “recording” means not only giving an image having a meaning such as a character or a figure to a recording medium but also giving an image having no meaning such as a pattern.

  FIG. 1B is a perspective view showing an example of an ink jet cartridge equipped with the ink jet recording head shown in FIG. The ink jet cartridge 300 includes the above-described ink jet recording head 100 and an ink containing portion 200 that contains ink to be supplied to the ink jet recording head 100, and these are integrated.

(First embodiment)
Next, with reference to FIG. 2, the manufacturing process of the ink jet recording head according to the first embodiment of the present invention will be described. FIG. 2 is a schematic cross-sectional view showing the manufacturing process of the ink jet recording head according to the first embodiment of the present invention. Each drawing in FIG. 2 shows a cross section taken along the line AA ′ in FIG.

  The Si substrate 1 shown in FIG. 2A has a <100> plane crystal orientation. In this embodiment, the Si substrate 1 having a <100> plane crystal orientation will be described as an example, but the plane orientation of the Si substrate 1 is not limited to this.

A SiO ₂ film 3 as an insulating layer is formed on the surface (first surface) of the Si substrate 1, and a plurality of ink discharge pressure generating elements 2 made of a heating resistor or the like are formed on the SiO ₂ film 3, and a non-conductive layer is formed. The illustrated electric signal circuit is configured. Further thereon, an SiN film 4 used as a protective film for the ink discharge pressure generating element 2 and the electric signal circuit is formed over the entire surface. Regarding the thickness of these films 3 and 4, the film of the SiO ₂ film 3 is used in order to ensure the balance between heat dissipation and heat storage of the heat generated by the ink discharge pressure generating element 2 and to exhibit the function as a recording head. The thickness was 1.1 μm, and the thickness of the SiN film 4 was 0.3 μm. On the other hand, on the back surface (second surface) of the Si substrate 1, an etching resistant mask 5 made of an insulating film such as SiO ₂ or SiN film and a polysilicon film 6 are formed over the entire surface.

  Next, a positive resist (not shown) is applied on the SiN film 4 on the surface of the Si substrate 1 by spin coating or the like and then dried. As shown in FIG. 2B, ultraviolet rays or deep-UV ( The positive resist is exposed and developed by (far ultraviolet) light or the like. Subsequently, using the pattern of the positive resist as a mask, the exposed SiN film 4 is subjected to dry etching or the like to form a filter pattern 14 and the positive resist is peeled off.

  Next, as shown in FIG. 2C, all of the polysilicon film layer 6 on the back surface side of the Si substrate 1 is removed by dry etching or the like.

  Next, as shown in FIG. 2D, a polyetheramide resin layer (polyetheramide film) is respectively formed on the SiN film 4 on the front surface side of the Si substrate 1 and the etching-resistant mask (insulating film) 5 on the back surface side. ) 7 is formed and predetermined patterning is performed. The polyetheramide resin layer 7 is made of a thermoplastic resin. Since the polyetheramide resin layer 7 plays a role of improving the adhesion of a later-described coating resin layer 29 serving as a nozzle forming member, the polyetheramide resin layer 7 is also referred to as an “adhesion improving layer”. In this example, thermoplastic polyetheramide (manufactured by Hitachi Chemical Co., Ltd., trade name: HL-1200) was used as the material for the adhesion improving layer 7. This product is commercially available in the form of a solution of thermoplastic polyetheramide in a solvent. The adhesion improving layer 7 is formed by coating such a commercially available thermoplastic polyetheramide on both surfaces of the Si substrate 1 by spin coating or the like, forming a positive resist (not shown) thereon, and patterning. 2 (D). In this example, the film thickness of the adhesion improving layer 7 was 2 μm.

  Next, as shown in FIG. 2E, a pattern layer 8 serving as an ink flow path is formed of a soluble resin on the surface of the Si substrate 1 on which the ink discharge pressure generating element 2 is configured. As a soluble resin, for example, Deep-UV resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., trade name: ODUR) can be used. After applying this onto the surface of the Si substrate 1 by spin coating or the like, the pattern layer 8 is formed by performing exposure and development with deep-UV light.

  Next, as shown in FIG. 2F, a coating resin layer 9 made of a photosensitive resin is formed on the pattern layer 8 by spin coating or the like. Further, a photosensitive water repellent layer 10 made of a dry film is provided on the coating resin layer 9. Then, the coating resin layer 9 and the water repellent layer 10 are exposed and developed with ultraviolet rays, deep-UV light, or the like, thereby forming the ink discharge ports 11.

  Next, as shown in FIG. 2G, the surface and side surfaces of the Si substrate 1 on which the pattern layer 8 and the coating resin layer 9 are patterned are covered with a protective material 12 applied by spin coating or the like. The protective material 12 is made of a material that can sufficiently withstand a strong alkaline solution used when anisotropic etching is performed on the Si substrate 1 in a later step. Therefore, when the anisotropic etching is performed, the water repellent layer 10 or the like is formed. It is possible to prevent deterioration. The insulating film 5 on the back side of the Si substrate 1 is patterned by performing wet etching or the like using the polyetheramide resin layer 7 as a mask. Thereby, the starting surface of anisotropic etching is exposed on the back surface side of the Si substrate 1.

Next, as shown in FIG. 2H, an ink supply port 13 is formed in the Si substrate 1. The ink supply port 13 is formed by anisotropically etching the Si substrate 1 using a strong alkaline solution such as TMAH (tetramethylammonium hydroxide) or KOH (potassium hydroxide). Thereafter, the polyetheramide resin layer 7 on the back surface of the Si substrate 1 is removed by dry etching or the like, and the portion of the SiO ₂ film 3 located above the ink supply port 13 is removed by wet etching. Since the burrs of the insulating film 5 that can be generated around the opening edge of the ink supply port 13 are removed when the SiO ₂ film 3 is wet-etched, the burrs generated in the insulating film 5 drop off and become foreign matters. There is no.

  Next, as shown in FIG. 2I, the adhesion improving layer 7 is patterned from the back side of the Si substrate 1 by dry etching using the SiN film 4 as a mask. As a result, the adhesion improving layer 7 is patterned in the same manner as the filter pattern 14 formed on the SiN film 4, and the filter 16 including the SiN film 4 that is an inorganic film and the adhesion improving layer 7 that is an organic film is formed. . Note that the SiN film 4 used as a mask material may be removed after patterning the adhesion improving layer 7 if unnecessary. In this case, the filter 16 is constituted only by the adhesion improving layer 7 which is an organic film.

  Next, the protective material 12 is removed as shown in FIG. Further, the material (thermoplastic resin) of the pattern layer 8 is eluted and removed through the ink discharge port 11 and the ink supply port 13, whereby an ink flow path and a foaming chamber are formed between the Si substrate 1 and the coating resin layer 9. It is formed. The thermoplastic resin that is the material of the pattern layer 8 is exposed to the entire surface of the wafer with Deep-UV light to develop and soften the thermoplastic resin, and the wafer is ultrasonically immersed as necessary during development. Thus, the ink can be eluted through the ink discharge port 11 and the ink supply port 13. Thereafter, the wafer is rotated at a high speed to blow off the ultrasonic immersion liquid, and the inside of the ink flow path and the foaming chamber is dried.

  The wafer on which the nozzle portion is formed by the above process is separated and cut into chips by a dicing saw or the like, and electrical wiring (not shown) for driving the ink discharge pressure generating element 2 is joined to each chip. Thereafter, when a chip tank member (not shown) for storing ink to be supplied to the ink supply port 13 is joined to the ink supply port 13 side of each chip, the ink jet recording head is completed (see FIG. 3).

  The filter hole 16a of the filter 16 serves not only as a filter but also as a passage for ink supplied from a chip tank (not shown) through the ink supply port 13 to the nozzle. In order to improve the performance as a filter, it is preferable to arrange the filter holes 16a with the diameter of the filter holes 16a as small as possible and with as little space as possible between the filter holes 16a. However, on the other hand, if the filter hole 16a is formed in such a manner, pressure loss (flow resistance) occurs and the flow of ink deteriorates, which adversely affects the ink ejection speed. It is not preferable to make it smaller. Thus, there is a trade-off relationship between the performance of the filter formed by the filter hole 16a and the flow resistance.

  FIG. 4 is a schematic diagram illustrating a filter configured on the back surface side of the inkjet head illustrated in FIG. 3 and a configuration around the filter.

  In this embodiment, the diameter of the filter holes 16a of the filter 16 is 6 μm, and the adjacent filter holes 16a are arranged at equal intervals of 3 μm. In the present embodiment, the diameter and the interval of the filter holes 16a are set in this way. However, the dimensions are preferably dimensions suitable for individual ink jet recording heads, that is, dimensions that can satisfy the above trade-off relationship. .

  In order to prevent foreign matter that has passed through the filter 16 from clogging the ink discharge port 11 and the like, in the configuration of this embodiment, the smaller one of the diameter of the ink discharge port 11 and the diameter of the ink flow path of the nozzle forming member 9 ( In the configuration shown in FIG. 3, when the diameter of the ink discharge port 11 is A and the diameter of the filter hole 16a is B, there is a relationship of A ≧ B. If the diameters of the ink discharge port 11 and the ink flow path and the diameter of the filter hole 16a have this relationship, the foreign matter that passes through the filter 16 passes through the ink flow path and the ink discharge port 11 and is discharged to the outside. The foreign matter does not clog the ink flow path and the ink discharge port 11.

(Second embodiment)
Next, with reference to FIG. 5, the manufacturing process of the ink jet recording head according to the second embodiment of the present invention will be described. FIG. 5 is a schematic cross-sectional view showing the manufacturing process of the ink jet recording head according to the second embodiment of the present invention, and each drawing of FIG. 5 shows a cross section taken along the line AA ′ of FIG. ing.

  The Si substrate 21 shown in FIG. 5A has a <100> plane crystal orientation. In this embodiment, similarly to the first embodiment, the Si substrate 21 having a <100> plane crystal orientation will be described as an example. However, the plane orientation of the Si substrate 21 is not limited to this. .

An etching resistant mask 5 made of an insulating film such as SiO ₂ or SiN film and a polysilicon film 6 are formed on the entire back surface (second surface) of the Si substrate 1, and the surface (first surface) of the Si substrate 21 is formed. An SiO ₂ film 23, which is an insulating layer, is formed thereon with a thickness of 1.1 μm.

The SiO ₂ film 23 is coated with a positive resist (not shown) by spin coating or the like and dried, and then exposed and developed with ultraviolet light, deep-UV light, or the like, using the pattern of the positive resist as a mask. The exposed SiO ₂ film 23 is removed by dry etching or the like, and the positive resist is peeled off for patterning. In the present example, a pattern to be a membrane filter structure 36 described later was formed on the SiO ₂ film 23. The diameter and interval of the filter holes were 6 μm and 3 μm, respectively, as in the first example.

Next, as shown in FIG. 5B, a plurality of ink generation pressure generating elements 2 made of heating resistors and the like and an electric signal circuit (not shown) are formed on the SiO ₂ film 23. Further thereon, an SiN film 24 used as a protective film for the ink discharge pressure generating element 2 and the electric signal circuit is formed over the entire surface. Thereafter, the polysilicon film layer 26 on the back surface side of the Si substrate 21 is completely removed by dry etching or the like.

  Next, as shown in FIG. 5C, a polyetheramide resin layer 27 is formed on the SiN film 24 on the front side of the Si substrate 21 and the etching-resistant mask (insulating film) 25 on the back side, respectively. Predetermined patterning is performed. In this embodiment, the film thickness of the adhesion improving layer 27 is 2 μm.

  Next, as shown in FIG. 5D, a pattern layer 28 serving as an ink flow path portion is formed of a soluble resin on the surface of the Si substrate 21 on which the ink discharge pressure generating element 22 is configured. As the soluble resin, for example, a Deep-UV resist can be used. After this is applied onto the surface of the Si substrate 21 by spin coating or the like, the pattern layer 28 is formed by performing exposure and development with deep-UV light.

  Next, as shown in FIG. 5E, a coating resin layer 29 made of a photosensitive resin is formed on the pattern layer 28 by spin coating or the like. Further, a photosensitive water repellent layer 30 made of a dry film is provided on the coating resin layer 29. Then, the coating resin layer 29 and the water repellent layer 30 are exposed and developed with ultraviolet light, deep-UV light, or the like, thereby forming the ink discharge ports 31.

  Next, as shown in FIG. 5F, the surface and side surfaces of the Si substrate 21 on which the pattern layer 28 and the coating resin layer 29 are patterned are covered with a protective material 32 applied by spin coating or the like. The protective material 32 is made of a material that can sufficiently withstand a strong alkaline solution used when performing anisotropic etching in a later step, and therefore, the water-repellent layer 30 and the like deteriorate when performing anisotropic etching. It is possible to prevent. The insulating film 25 on the back side of the Si substrate 21 is patterned by wet etching or the like using the polyetheramide resin layer 27 as a mask. Thereby, the starting surface of anisotropic etching is exposed on the back surface side of the Si substrate 21.

  Next, as shown in FIG. 5G, an ink supply port 33 is formed in the Si substrate 21. The ink supply port 33 is formed by anisotropically etching the Si substrate 21 using a strong alkaline solution such as TMAH (tetramethylammonium hydroxide) or KOH (potassium hydroxide).

Next, as shown in FIG. 5H, the SiN film 24 is patterned from the back side of the Si substrate 21 by dry etching using the SiO ₂ film 23 as a mask. As a result, the SiN film 24 is patterned in the same manner as the filter pattern 35 of the SiO ₂ film 23 (see FIG. 5A).

Next, using the SiO ₂ film 23 and the SiN film 4 patterned as described above as a mask, the adhesion improving layer 27 is patterned from the back side of the Si substrate 21 by dry etching as shown in FIG. . At this time, the SiO ₂ film 23 ′ (see FIG. 5H) attached to the surface on the ink supply port 33 side of the portion of the SiN film 24 that is patterned in the filter pattern shape is the patterning of the adhesion improving layer 27. It is removed during the process. As a result, the adhesion improving layer 27 is patterned in the same manner as the filter pattern 35, and a membrane filter structure 36 composed of the SiN film 24 and the adhesion improving layer 27 is formed. After that, the SiN film 24 used as a mask material may be removed after patterning the adhesion improving layer 27 if unnecessary. In this case, the membrane filter structure 36 is constituted only by the adhesion improving layer 27 that is an organic film.

The burrs of the insulating film 25 that may occur around the opening edge of the ink supply port 33 are removed together with the SiO ₂ film 23 ′ during the patterning process of the adhesion improving layer 27, so that they are generated in the insulating film 25 as in the prior art. The burr does not fall off and become a foreign object.

  Next, the protective material 32 is removed as shown in FIG. Further, the material (thermoplastic resin) of the pattern layer 28 is eluted through the ink discharge port 31 and the ink supply port 33, thereby forming an ink flow path and a foaming chamber between the Si substrate 21 and the coating resin layer 29. .

  The Si substrate 21 on which the nozzle portion is formed by the above process is separated and cut into chips by a dicing saw or the like, and electrical wiring (not shown) for driving the ink discharge pressure generating element 22 is joined to each chip. . Thereafter, when a chip tank member (not shown) for storing ink to be supplied to the ink supply port 33 is joined to the ink supply port 33 side of each chip, the ink jet recording head is completed.

  Even in the configuration of the present embodiment, in order to prevent foreign matters that have passed through the membrane filter structure 36 from clogging the ink discharge ports 31 and the like, as shown in FIG. When the smaller one of the diameters of the ink flow paths (the diameter of the ink discharge port 31 in the configuration shown in FIG. 5) is A and the diameter of the filter hole 36a is B, there is a relationship of A ≧ B. . If the diameters of the ink discharge port 31 and the ink flow path and the diameter of the filter hole 36a have this relationship, the foreign matter that passes through the membrane filter structure 36 passes through the ink flow path and the ink discharge port 31 and is discharged to the outside. The Accordingly, the foreign matter does not clog the ink flow path and the ink discharge port 31.

(Third embodiment)
FIG. 6 is a sectional view showing an ink jet recording head according to a third embodiment of the present invention.

  In the ink jet recording head of this embodiment, the coating resin layer (nozzle forming member) 49 and the adhesion improving layer 47 provided on the first surface (upper surface) of the Si substrate 41 are disposed in the central region of the ink supply port 53. A support portion 60 that supports the membrane filter structure 56 is configured by the existing portion. The support portion 60 can be easily configured by simply changing the shape of the pattern layer in the manufacturing process of the ink jet recording head described in the first and second embodiments. Thereby, for example, when the ink flows into the nozzle flow path from the ink supply port 53, the membrane filter structure 56 can be prevented from being damaged by being pushed by the ink. Therefore, the strength against physical breakage of the membrane filter structure 56 can be increased.

  The other configuration of the ink jet recording head shown in FIG. 6 is the same as that shown in FIG.

  Also in the configuration of the present embodiment, in order to prevent foreign matters that have passed through the membrane filter structure 56 from clogging the ink discharge ports 51 and the like, as shown in FIG. When the smaller one of the diameters of the ink flow paths (the diameter of the ink discharge port 51 in the configuration shown in FIG. 6) is A and the diameter of the filter hole 56a is B, there is a relationship of A ≧ B. Yes. If the diameters of the ink discharge port 51 and the ink flow path and the diameter of the filter hole 56a have this relationship, the foreign matter passing through the membrane filter structure 56 passes through the ink flow path and the ink discharge port 51 and is discharged to the outside. The Accordingly, the foreign matter does not clog the ink flow path and the ink discharge port 51.

(Fourth embodiment)
Next, with reference to FIG. 7, the manufacturing process of the ink jet recording head according to the fourth embodiment of the present invention will be described. FIG. 7 is a schematic cross-sectional view showing the manufacturing process of the ink jet recording head according to the fourth embodiment of the present invention, and each drawing of FIG. 7 shows a cross section taken along the line AA ′ of FIG. ing.

  The manufacturing process of the ink jet recording head described in the first and second embodiments is suitable when the resin used as the adhesion improving layer does not have photosensitivity. On the other hand, the manufacturing process of this example is suitable when the adhesion improving layer is made of a photosensitive resin. Hereinafter, the manufacturing method of the present embodiment will be described in comparison with the first embodiment.

First, as shown in FIG. 7A, a Si substrate 61 having a <100> plane crystal orientation is prepared, and an SiO ₂ film 63 as an insulating layer is formed on the surface (first surface) of this substrate. To do. An ink discharge pressure generating element 62 and an electric signal circuit (not shown) are formed thereon, and a SiN film 64 serving as a protective film is formed over the entire surface. On the other hand, on the back surface (second surface) side of the substrate, an etching resistant mask 65 and a polysilicon film 66 are formed over the entire surface. A sacrificial layer 75 that can be selectively etched with respect to the substrate material is formed on the first surface of the Si substrate 61.

  Next, as shown in FIG. 7B, after removing the polysilicon film 66 on the back surface of the substrate, a resin layer 67 is formed on the front surface and the back surface of the substrate. In the present embodiment, the same material is used for the front surface and the back surface of the substrate, but different materials may be used. Here, as a material of the resin layer 67 formed on the substrate surface, a photosensitive resin material such as a photosensitive polyimide resin is used, so that the filter portion 67a can be easily formed by photolithography as shown in FIG. 7C. It can be formed. The resin layer provided on the back surface of the substrate also forms a pattern serving as an opening of the supply port by a known method.

  Next, as shown in FIG. 7D, a pattern layer 68 serving as an ink flow path is formed. Then, as shown in FIG. 7E, a coating resin layer 69 made of a photosensitive resin is formed thereon, and a water repellent layer 70 is provided. Thereafter, an ink discharge port 71 is formed by patterning, and the member laminated on the first surface of the Si substrate 61 is covered with a protective material 72 as shown in FIG. Further, the etching resistant mask 65 is patterned using the resin layer 67 as a mask.

Thereafter, as shown in FIG. 7G, an ink supply port is formed from the back surface of the Si substrate 61 by anisotropic etching using a strong alkaline solution. Here, when the etching reaches the sacrificial layer, the isotropic etching is started, but the SiO ₂ film 63 and the SiN film 64 are formed on the substrate surface, and the pattern layer 68 does not come into contact with the alkaline solution. Thereafter, when the SiO ₂ film 63 is removed by wet etching and the SiN film 64 is removed by dry etching, the filter portion 67a is exposed. Thereafter, the protective material 72 is removed, and the pattern layer 68 is removed to form an ink flow path and a foaming chamber. Thereafter, the ink jet recording head can be completed in the same manner as in the first embodiment.

(Fifth embodiment)
FIG. 8 is a sectional view showing an ink jet recording head according to a fifth embodiment of the present invention. FIGS. 8A to 8C are views for explaining an ink jet recording head according to a fifth embodiment of the present invention. FIG. 8A is a top view thereof, and FIG. 8 (a) is a cross-sectional view taken along line BB, and FIG. 8 (c) is a cross-sectional view taken along line CC in FIG. 8 (b).

As shown in FIG. 8A, the recording head of the present embodiment includes a first discharge port array composed of first discharge ports 81a having a predetermined discharge port diameter, and a discharge port diameter smaller than the first discharge port 81a. The second ejection port array including the second ejection ports 81 b having the ink supply port 82 is provided so as to sandwich the ink supply port 82. The liquid discharged from the first discharge port 81a is larger than the liquid discharged from the second discharge port 81b. In this embodiment, as is apparent from FIGS. 8B and 8C, the adhesion improving layer 85 forming the filters 85a and 85b is made of SiO except for the vicinity of the ink discharge pressure generating element 83 in the ink flow path. _{The second} film 84a and the SiN film 89 are provided over the entire first surface of the Si substrate 84. Further, as in the third embodiment, a support portion (support member) 86a for supporting the filters 85a and 85b is provided on a part of the coating resin layer (nozzle forming member) 86. Here, reference numeral 87 represents a water repellent layer, and reference numeral 88 represents an etching resistant mask layer.

  In the present embodiment, the filter is partitioned into the first discharge port array side and the second discharge port array side by the support portion 86a. Here, the filter 85a for the first discharge port array and the filter 85b for the second discharge port array have the same opening diameter. However, since the support portion 86a is provided so as to be biased toward the second ejection port array side from the central portion of the ink supply port 82, the area of the filter 85a for the first ejection port array can be reduced. It is larger than the area of the filter 85b for the outlet row.

  In this way, it is possible to supply ink without causing insufficient ink supply to the ink flow path that includes the first discharge port 81a that discharges a large amount of liquid.

(Sixth embodiment)
FIG. 9 is a sectional view showing an ink jet recording head according to a sixth embodiment of the present invention. FIGS. 9A to 9C are views for explaining an ink jet recording head according to a sixth embodiment of the present invention. FIG. 9A is a top view thereof, and FIG. 9 (a) is a cross-sectional view taken along line BB, and FIG. 9 (c) is a cross-sectional view taken along line CC in FIG. 9 (b).

As shown in FIG. 9A, the recording head of this embodiment includes a first discharge port array composed of first discharge ports 91a having a predetermined discharge port diameter, and a discharge port diameter smaller than the first discharge port 91a. The second ejection port array including the second ejection ports 91 b having the ink supply ports 92 is provided. The liquid discharged from the first discharge port 91a is larger than the liquid discharged from the second discharge port 91b. In this embodiment, as is apparent from FIGS. 9B and 9C, the adhesion improving layer 95 forming the filters 95a and 95b is made of SiO except for the vicinity of the ink discharge pressure generating element 93 in the ink flow path. _{The second} film 94a and the SiN film 99 are provided over the entire first surface of the Si substrate 94. Further, as in the third embodiment, a support portion (support member) 96a for supporting the filters 95a and 95b is provided in a part of the coating resin layer (nozzle forming member) 96. Here, reference numeral 97 denotes a water repellent layer, and reference numeral 98 denotes an etching resistant mask layer.

  In the present embodiment, the filter is partitioned by the support portion 96a into a filter 95a on the first discharge port array side and a filter 95b on the second discharge port array side. Here, the filter 95a for the first discharge port array and the filter 95b for the second discharge port array are larger in the filter 95a for the first discharge port array. The filter 95a for the first discharge port array is larger and the area of the filter itself is larger.

  In this way, as in the fifth embodiment, ink can be supplied to the ink flow path including the first discharge port 91a with a large amount of liquid discharge without causing insufficient ink supply.

  In this embodiment, a protective member (reinforcing member) 96b is provided to assist (reinforce) the strength of the support portion 96a. In the present embodiment, the shape of the protection member 96b is a shape in which the support portion 96a and the ink flow path wall are continuous, but is not limited to this shape.

1, 21, 41, 61, 84, 94 Si substrate 3, 23, 43, 63, 84a, 94a SiO ₂ film 4, 24, 44, 64, 89, 99 SiN film 7, 27, 47, 67 Adhesive resin layer 9, 29, 49, 69, 86, 96 Coating resin layer 13, 33, 53, 73, 82, 92 Ink supply port 14, 35 Filter pattern 16, 36, 56 Membrane filter structure 67a, 85a, 85b, 95a, 95b Filter portion 85, 95 Adhesion improving layer

Claims (7)

A silicon substrate comprising a plurality of energy generating elements for discharging ink, and an ink supply port for supplying ink to the energy generating elements;
A plurality of ejection ports for ejecting ink corresponding to each of the plurality of energy generating elements, and a plurality of ink flow paths communicating each of the plurality of ejection ports and the ink supply port. A flow path forming member;
An adhesion improving layer made of an organic film formed between the flow path forming member and the silicon substrate;
In an inkjet head comprising:
A filter formed of the adhesion improving layer is provided in an opening of the ink supply port on the flow path forming member side;
The ink jet head, wherein the flow path forming member supports the filter by a support member at a position facing the opening.   The inkjet head according to claim 1, further comprising a reinforcing member for reinforcing the support member.   The plurality of discharge ports include a first discharge port array including a first discharge port for discharging a first droplet and a second for discharging a droplet larger than the first droplet. And a second ejection port array including the ejection ports so that the ink supply port is provided between the first and second ejection port arrays, and the filter is supported by the support member. The inkjet head according to claim 1, wherein the inkjet head is partitioned into a filter for the discharge port array and a filter for the second discharge port array.   The inkjet head according to claim 3, wherein an area of the filter for the second ejection port array is larger than an area of the filter for the first ejection port array.   The inkjet head according to claim 3 or 4, wherein an opening diameter of the filter for the second ejection port array is larger than an opening diameter of the filter for the first ejection port array.   An ink jet cartridge comprising the ink jet head according to claim 1, wherein the ink jet cartridge comprises an ink containing portion for containing ink to be supplied to the ink jet head. A silicon substrate comprising a plurality of energy generating elements for discharging ink, and an ink supply port for supplying ink to the energy generating elements;
A plurality of ejection ports for ejecting ink corresponding to each of the plurality of energy generating elements, and a plurality of ink flow paths communicating each of the plurality of ejection ports and the ink supply port. A flow path forming member;
An adhesion improving layer made of a polyetheramide film formed between the flow path forming member and the silicon substrate;
With
An ink jet head, wherein a filter formed of the adhesion improving layer is provided at a position facing the opening on the flow path forming member side of the ink supply port.

Images