JP2010010520A - Ball mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ball mounting device having a ball removing means for reliably removing a deviating minute ball adhered on a lower surface of a ball arrangement mask and an insertion hole of the mask. <P>SOLUTION: The following means are adopted in the ball mounting device for mounting the minute ball on an object for mounting a ball by dropping the minute ball housed in a ball insertion means into an insertion part of an arrangement mask: the ball mounting device includes a first roller which moves along the lower surface of the arrangement mask and adheres the minute ball adhered on the arrangement mask on an outer periphery after the arrangement mask is separated from the object for mounting a ball; and an adhered ball removing means for removing the minute ball adhered on the first roller from the first roller with stronger force than adhesion force of the first roller. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an improvement in an apparatus for mounting a minute ball on a mounting position of a mounting object using an array mask provided with an insertion portion in accordance with the mounting position formed in a predetermined pattern on the mounting object. In particular, the ball mounting device focuses on ball removing means that removes from the array mask the fine balls that have wrapped around and adhered to the lower surface of the array mask.

  Conventional devices and methods for mounting conductive micro-balls on the mounting location of the mounting object using an array mask provided with insertion holes in accordance with the mounting location formed in a predetermined pattern on the mounting object are conventionally used. More known. For example, as disclosed in Patent Document 1, there has been an apparatus that arranges conductive minute balls by moving a ball cup accommodating a large number of conductive balls on an arrangement mask.

  However, in this type of conductive ball mounting apparatus, excessive conductive balls deviating from the ball cup may remain on the array mask. Such extra balls may fall into the insertion hole and become double balls. Therefore, as shown in Patent Document 1, means for removing with a brush and means for removing by sucking or blowing off with air have been adopted. However, although these means are effective, it is necessary to repeatedly perform the removing operation to remove the ball that deviates from the ball pool, which is time consuming and often cannot be completely removed.

  In order to solve this problem, a conductive ball mounting apparatus according to Japanese Patent Application No. 2007-216604 has already been proposed by the present patent applicant. The present invention removes, from the rotating roller, the rotating roller that moves along the upper surface of the arrangement mask and attaches the conductive ball to the outer peripheral surface, and the conductive ball that adheres to the rotating roller with a force stronger than that of the rotating roller. The present invention relates to a conductive ball mounting device including a deviation ball removing unit that can reliably remove a deviation ball from an array mask by employing a deviation ball removing unit having a roller adhering ball removing unit.

  However, in the invention according to the above-mentioned patent application, it was not possible to remove the minute balls that wrap around and adhered to the lower surface of the arrangement mask or the minute balls remaining in the insertion portion (through hole) of the minute balls of the arrangement mask.

  Needless to say, a technique of wiping with a cloth as described in Patent Document 2 in order to remove the minute balls that have adhered to the lower surface of the array mask has been considered. This technology eliminates stray balls adhering to the lower surface of the array mask due to static electricity, etc., but when wiping with a cloth, the stray balls escape to the through holes of the array mask, It fell from the cloth and lacked certainty. Furthermore, the cloth used for wiping was disposable and uneconomical.

Japanese Patent Laid-Open No. 2006-173195 Japanese Patent Laid-Open No. 2007-287893

  In order to solve the above-mentioned problems, the present invention has an object to provide a ball mounting apparatus having a ball removing means that can reliably remove the deviating minute balls attached to the bottom surface of the ball arrangement mask and the insertion hole of the mask. And

In order to solve the above problems, the first invention employs the following means in the ball mounting apparatus.
1stly, the to-be-mounted object support means which supports the to-be-mounted object in which a micro ball is mounted, the array mask in which the insertion part of the micro ball was formed in the predetermined array pattern, and an array mask above the to-be-mounted object A ball mounting device that includes a mask support unit for supporting and a ball insertion unit that drops a microball into an insertion portion of the array mask, and mounts the microball on the mounted object.

  Second, after separating the array mask from the object to be mounted, the first roller moves along the bottom surface of the array mask and attaches the microballs attached to the array mask to the outer peripheral surface; and It is assumed that there is an adhering ball removing means for removing from the first roller the fine ball adhering to the first roller with a force stronger than the adhering force of the first roller.

  The second invention is a ball mounting device in which the first roller according to the first invention is added with a point having an adhesive force on the surface, and the third invention is attached to the second invention with the attachment described above. The ball removing means is a ball mounting device to which a second roller having an adhesive force stronger than that of the first roller is added.

  A fourth invention is the third roller according to any one of the first to third inventions, wherein a minute ball can be attached to the outer peripheral surface and moves together with the first roller with the arrangement mask interposed therebetween. This is a ball mounting device to which a point provided is added. Further, a fifth invention is a ball mounting apparatus according to any one of the first to fourth inventions, wherein the first roller is added with elasticity.

  According to the present invention, the first rotating roller that can move along the lower surface of the arrangement mask and attach the minute ball to the outer peripheral surface, and the first rotating roller is attached to the first rotating roller with a force stronger than the adhesion force of the first rotating roller. Adhering ball removing means for removing the minute balls from the first rotating roller ensures that the deviating ball that adheres to the lower surface of the array mask or partially protrudes from the insertion hole to the lower surface of the array mask. The ball mounting device can be removed more.

  As an effect of the fourth invention, the first roller and the third roller to which a minute ball can be attached are provided, and both the rollers are moved with the arrangement mask interposed therebetween. The ball mounting device can reliably remove the deviating balls that have adhered or partly protruded from the insertion hole to the upper and lower surfaces of the array mask from the lower surface of the array mask.

  Further, as an effect of the fifth invention, by making the first roller elastic, it is possible to surely remove a deviation ball that does not protrude from the insertion hole to the upper and lower surfaces of the arrangement mask. Is possible.

  Hereinafter, embodiments of the present invention will be described together with examples according to the drawings. In the present invention, the fine balls include conductive balls such as solder balls, and the mounted objects of the fine balls include electronic circuit boards, ceramic boards, and the like. An electrode as a ball mounting location is formed. Of course, the semiconductor wafer is also included in the mounted object. The embodiment is a solder ball mounter in which a solder ball 1 which is a conductive ball is used as a minute ball and a substrate 2 is used as an object to be mounted.

  A solder ball mounter generally has a board delivery section for loading, a flux printing section, a ball mounting section, and a board delivery section for unloading. The ball mounting apparatus according to the present invention relates to a ball mounting section. It is.

  In the ball mounting portion of the embodiment, as shown in FIGS. 1 and 4, insertion holes 31 (shown in FIG. 2, FIG. 3, etc.) arranged in accordance with the electrode pattern on the substrate 2 are formed. The ball array mask 3, the ball insertion device 5 for dropping the solder ball 1 (shown in FIG. 2, FIG. 3, etc.) into the insertion hole 31, the solder ball supply device 4, and the bottom surface of the ball array mask 3. And a deviating ball removing device 7 (shown in FIG. 4) that moves and a drive mechanism 71 of the ball removing device 7.

  As shown in FIG. 5, the thickness of the ball array mask 3 is substantially equal to the diameter of the supplied solder ball 1 in the embodiment, and the diameter of the insertion hole 31 is slightly larger than the diameter of the solder ball 1. is there. However, the insertion hole 31 has a lower opening diameter larger than the upper opening diameter so that the flux printed on the substrate 2 does not adhere to the ball array mask 3. Instead of increasing the opening diameter, a flux adhesion preventing gap may be provided between the ball array mask 3 and the substrate 2 as shown in FIG. The ball array mask 3 is attached to a mold 33 (shown in FIG. 1) and held by a fixed part such as a frame.

  The ball insertion device 5 includes a ball cup 50 and a drive mechanism for the ball cup 50. As shown in FIG. 2 and FIG. 3, the ball cup 50 has a space inside, a lower end surface is an opening 51, and the internal space is partitioned into an upper space 53 and a lower space 54 by a ball adsorber 52. ing. For this reason, the upper part from the attachment position of the ball adsorber 52 of the ball cup 50 is a casing of the ball adsorber 52. The ball adsorbent 52 is made of a metal mesh such as a stainless mesh that allows the gas to pass therethrough without allowing the solder ball 1 to pass through.

  In the illustrated embodiment, the ball cup 50 has a single rectangular shape. However, the number, shape, and size of the ball cup 50 take into consideration the shape and mounting efficiency of the mounted object such as the substrate 2 that is the mounted object. It is decided. For example, when a wafer or the like is used as an object to be mounted, the opening 51 at the lower end may be made circular, or a plurality of ball cups 50 each having a ball adsorbing body 52 may be provided.

  The upper space 53 of the ball cup 50 is connected to a vacuum source 59 by a suction passage 55 via an electromagnetic on-off valve 57 serving as a vacuum switching means and a regulator 58 capable of adjusting the pressure and flow rate of the gas. A gas flow passage as shown by an arrow in FIG. In addition, by opening the electromagnetic on-off valve 57 as a vacuum switching means for switching ON / OFF of the suction state in the ball cup 50 by the vacuum source, the suction state in the ball cup 50 is turned ON and exists below the ball cup 50. After the solder ball 1 is attracted to the ball adsorber 52 as shown in FIG. 2, the attracting state in the ball cup 50 is turned off by closing the electromagnetic on-off valve 57, and the solder adsorbed to the ball adsorber 52. The solder balls 1 are mounted on the substrate 2 by dropping the balls 1 as shown in FIG.

  The ball cup 50 and the ball adsorber 52 are made of a conductive material, and are grounded by a ground 60 as shown in FIG. 2 or FIG. This prevents the electrostatically charged solder ball 1 from adhering to the inner surface of the ball cup 50 or the ball adsorber 52. Furthermore, a vibrator 61 for applying minute vibrations to the ball cup 50 is attached to the outside of the ball cup 50. The vibrator 61 vibrates at least when the suction state in the ball cup 50 is OFF and is attached to the ball cup 50. Vibration is transmitted to the ball adsorbing body 52, and the falling of the solder ball 1 is promoted.

  The ball cup 50 moves in the X axis direction and the Y axis direction to cover the entire surface of the substrate 2. As shown in FIG. 1, the moving unit 10 serving as a moving means of the ball cup 50 on the horizontal plane includes an X-axis drive mechanism and a Y-axis drive mechanism, and a ball screw 14 that is rotated by an X-axis drive motor 13. It moves along the X-axis guide 11 in the X-axis direction, and moves along the Y-axis guide 12 along the Y-axis direction by the ball screw 16 rotated by the Y-axis drive motor 15 together with the X-axis drive mechanism.

  The elevating device 18 for the ball cup 50 is attached to an elevating base 8 on which the ball cup 50 is mounted via a nut member on a ball screw that is rotated by a Z-axis drive motor 17 provided in the moving unit 10. The base 8 moves up and down along the guide rail provided in parallel with the nut member, thereby moving the ball cup 50 up and down. The lower end of the ball cup 50 and the upper surface of the ball array mask 3 may be larger than the diameter of the solder ball 1 as long as a predetermined gas flow is obtained during the ball suction operation.

  The solder ball supply device 4 supplies a large number of solder balls 1 from a ball hopper storing the solder balls 1 to the ball cup 50 through a ball supply path 56. The ball hopper is replaced depending on the size and material of the solder ball 1. The solder ball supply device 4 moves integrally with the ball cup 50 and supplies the solder balls 1 into the ball cup 50. However, the solder ball supply device 4 may be provided separately from the ball cup 50. It is also possible to supply the solder balls 1 to the mounting position by once supplying the solder balls 1 onto the ball arrangement mask 3 outside the, and moving the ball cup 50 while adsorbing the solder balls 1 with the ball adsorber 52. It is.

  As shown in FIG. 4, the first embodiment of the deviation ball removing device 7 moves along the bottom surface of the ball arrangement mask 3, and deviates from the ball cup 50 and adheres to the bottom surface of the ball arrangement mask 3. 7A) and a deviating solder ball 1A (shown in FIG. 7B) in which a part of the solder ball protrudes from the insertion hole 31 is attached to the outer peripheral surface, and the first rotating roller 19 From a second rotating roller 20 that removes the solder ball 1A attached to the outer peripheral surface by attaching it to the outer peripheral surface, an air cylinder 21 that raises and lowers both rollers 19 and 20, and a moving device 22 that moves along the lower surface of the ball array mask 3. Become. Both rollers 19 and 20 are formed to be longer than the insertion hole forming region of the ball arrangement mask 3.

  The first rotating roller 19 in the first embodiment is made of an elastic member such as an adhesive rubber having an adhesive force capable of adhering the deviation solder ball 1A to the surface. If there exists a recessed part like 31, it can deform | transform so that it may enter. The second rotating roller 20 is made of an elastic member such as an adhesive rubber having a stronger adhesive force than the first rotating roller 19. As shown in FIG. 4, the first rotating roller 19 is disposed above the second rotating roller 20, and both the rollers 19 and 20 are in contact with each other.

  If both the rollers 19 and 20 are in a state where the first rotating roller 19 is in contact with the ball arrangement mask 3, the first rotating roller is moved to the right in FIG. 4 by the X-axis drive mechanism of the ball cup 50. 19 rotates clockwise by the frictional force. The rotational force of the first rotating roller 19 is transmitted to the second rotating roller 20 by the frictional force caused by the contact, and the second rotating roller 20 is also rotated. 4 shows a state immediately before the deviation ball removing device 7 moves for removal to the left with respect to the ball arrangement mask 3, and FIG. 8 shows a case where the deviation solder balls 1A on the ball arrangement mask 3 are removed. Indicates the state.

  In addition, as shown in FIG. 9, even if the first rotating roller 19 is separated from the ball arrangement mask 3 by a distance less than the solder ball diameter, the deviation ball removing effect can be obtained. In this way, when the deviating solder ball is attached without contacting the ball arrangement mask 3, a drive motor (not shown) is connected to the second rotating roller 20 and rotated. In this case, the rotational force of the driving motor of the second rotating roller 20 is transmitted to the first rotating roller 19 by the frictional force caused by the contact, and the first rotating roller 19 is also rotated. Conversely, the first rotating roller 19 may be connected to a drive motor, and the second rotating roller 20 may be driven by the first rotating roller 19.

  In the above example, the first rotating roller 19 and the second rotating roller 20 connected to the drive motor are in contact with each other to apply a rotational force to the first rotating roller 19. And the second rotating roller 20 connected to the drive motor are separated so that the deviating solder ball 1A attached to the first rotating roller 19 contacts the outer peripheral surface of the second rotating roller 20, and the rollers 19 and 20 are separated from each other by a timing belt. The first rotating roller 19 may be rotated in conjunction with each other. The rotation direction of the first rotating roller 19 and the second rotating roller 20 may be counterclockwise or clockwise.

  In the first embodiment described above, the adhesive force of the first rotating roller 19 is used for the first rotating roller 19 to attach the deviating solder ball 1A. In order to adhere 1A, an adsorption force by air suction or an electrostatic adhesion force can be used.

  As an example of suction by air suction, it is conceivable that the first rotating roller 19 is a suction roller in which a communication hole is provided in a hollow shaft and a continuous foam sponge is provided outside thereof. At this time, the second rotating roller 20 may use an adhesive force, or may be a suction roller similar to the first rotating roller 19.

  As an example of adhesion due to static electricity, the first rotating roller 19 is made of silicon. When the deviating solder ball 1A comes into contact with the silicon (first rotating roller 19), static electricity is generated, and adheres to the first rotating roller 19 with an electrostatic adhesion force. In addition, when the 1st rotation roller 19 is comprised with a silicon | silicone, the 2nd rotation roller 20 cannot be comprised with the same silicon | silicone, and the 2nd rotation roller 20 is taken as the adhesion roller or the suction roller by air suction. Further, the attached ball removing means for removing the solder balls attached from the first rotating roller 19 may be scraped with a squeegee instead of the second rotating roller 20. The solder ball 1A attached to the second rotating roller 20 can be easily pressed by pressing it against a disposable adhesive sheet (not shown) having a stronger adhesive force than the adhesive force of the second rotating roller 20. It can be removed.

  The operation of the embodiment will be described below. First, as a pre-process for transferring the substrate 2 to the ball mounting portion, the flux is applied to the ball mounting portion on the substrate 2 in advance by the flux printing portion.

  When the substrate 2 is transferred to the ball mounting portion, as shown in FIG. 4, the substrate 2 is placed on the substrate placing stage 6, and the ball array mask 3 is placed on the substrate 2. In the embodiment, since the flux is prevented from adhering to the ball arrangement mask 3 due to the shape of the insertion hole 31 of the ball arrangement mask 3, the ball arrangement mask 3 and the substrate 2 are in contact with each other, as shown in FIG. Thus, when it is going to perform flux adhesion prevention in the gap between upper and lower sides, both do not contact.

  Next, after opening the electromagnetic on-off valve 57 as a vacuum switching means to turn on the suction state in the ball cup 50, the moving unit 10 moves the ball cup 50 to the initial mounting position. When the suction state in the ball cup 50 is turned ON, a gas flow path indicated by an arrow in FIG. 2 is formed between the ball cup 50 and the ball arrangement mask 3. Due to this suction force, the solder ball 1 existing below the ball cup 50 floats and is attracted to the ball adsorber 52. This state is a movable state of the ball cup 50. When the suction state is OFF, the ball cup 50 is not moved.

  After the ball cup 50 has moved to the initial mounting position, the electromagnetic on-off valve 57 is closed to turn off the suction state in the ball cup 50 and vibrate the vibrator 61. When the suction is stopped, the ball cup 50 is released to the atmosphere, so that the solder ball 1 attached to the ball adsorbing body 52 falls as shown in FIG. Mounted on.

  In order to ensure that the solder ball 1 is dropped into the insertion hole 31, that is, mounted on the substrate 2, the suction state is repeatedly turned ON (suction) and OFF (stop), and the vibrator 61 opens and closes the electromagnetic on-off valve 57. Repeatedly stop and generate vibration according to. Since the ball adsorber 52 is disposed above the ball arrangement mask 3, the adsorbed solder ball 1 has potential energy, and comes into close contact with the electrode when the solder ball 1 falls on the flux. It will be.

  After the mounting is completed, the suction state in the ball cup 50 is turned ON by the vacuum switching means, and suction is performed again. The solder ball 1 mounted on the substrate 2 does not rise due to contact with the flux and generates an adhesive force, and the solder ball 1 not in contact with the flux is sucked up, floated, and adsorbed on the ball adsorber 52. Become.

  Next, the ball cup 50 moves to the next mounting position, performs ball mounting in the same manner as described above, and performs all the ball mounting by sequentially repeating this operation. When all the balls have been mounted, the ball cup 50 is raised by the lifting device 18 and the substrate placement table 6 is lowered. At this time, the deviating solder ball 1A may remain on the inner surface of the insertion hole 31 of the ball arrangement mask 3 or the lower surface of the ball arrangement mask 3. Therefore, after the ball array mask 3 is separated from the substrate 2 to be mounted, the air cylinder 21 is operated, and the deviation ball removing device 7 is lifted from the retracted position as shown in FIG. The roller 19 contacts the lower surface of the ball array mask 3. Of course, when a drive motor is connected to the second rotating roller 20, it is sufficient that the first rotating roller 19 rises to a height at which the first rotating roller 19 can contact the deviation solder ball 1A. The raising is performed by the air cylinder 21.

  In this state, the deviation ball removing device 7 of the first embodiment is moved. That is, it moves from the moving device 22 in the X-axis direction (left-right direction in FIG. 4). Since the deviation solder ball 1A does not adhere to a position far away from the insertion hole formation region of the ball arrangement mask 3, the first rotating roller 19 moves within a slightly wider range than the insertion hole formation region. It is controlled as follows. Due to this movement, the first rotating roller 19 that has been in contact with the ball array mask 3 moves while rolling on the ball array mask 3, and attaches the deviation solder ball 1 </ b> A to the outer periphery of the first rotating roller 19. At the same time, since the second rotating roller 20 is also rotated by friction, the deviating solder ball 1A adhering to the first rotating roller 19 contacts the second rotating roller 20, and adheres to the second rotating roller 20 with a stronger adhesion force. To do. In this way, the deviation ball removing device 7 is moved so as to cover the entire lower surface of the insertion hole forming region of the ball arrangement mask 3, and the deviation solder balls 1A are removed. The removal of the deviation ball is performed every time the mounting of the ball on one substrate 2 is completed. The deviation balls accumulated on the second rotating roller 20 are removed at appropriate intervals such as after a plurality of times of ball mounting or during product type switching.

  As described above, the deviation ball removing apparatus has been described in the case where the deviation solder ball 1A is attached to the lower surface of the ball arrangement mask 3 or has a portion protruding from the lower surface. As shown in FIG. When there is no projecting portion on the lower surface of the ball arrangement mask 3 and remains in the insertion hole 31, the deviation ball removing device 7 in the first embodiment uses the elastic force of the first rotating roller 19 to cause the surface of the first rotating roller 19. Is deformed and enters the insertion hole 31 to attach the deviating solder ball 1B and pull out and remove it, but it is difficult to completely remove it. In order to solve this point, the departure ball removing device shown in FIGS. 10 to 13 as the second embodiment is constituted by an upper departure ball removing device 7B and a lower departure ball removing device 7A.

  The lower departure ball removal device 7A is the same as the departure ball removal device 7 in the first embodiment, and the upper departure ball removal device 7B has substantially the same configuration although the top and bottom are reversed. Since the lower departure ball removing device 7A has already been described in the first embodiment, the upper departure ball removing device 7B will be described below.

  The upper deviating ball removing device 7B moves along the upper surface of the ball arrangement mask 3 and adheres to the third rotating roller 29 and the third rotating roller 29 that adheres the deviating solder ball 1A deviating from the ball cup 50 to the outer peripheral surface. A fourth rotating roller 30 for removing the deviating solder ball 1A by attaching it to the outer peripheral surface and an air cylinder 9 for raising and lowering both rollers 29, 30 are provided on the elevating base 8 so as to move horizontally along with the ball cup 50. It is attached. As a result, the ball array mask 3 is sandwiched between the first rotating roller 19 and the third rotating roller 29.

  The material of the third rotating roller 29 is the same as that of the first rotating roller 19, and the material of the fourth rotating roller 30 is also the same as that of the second rotating roller 20. The third rotating roller 29 is disposed below the fourth rotating roller 30, and both the rollers 29 and 30 are in contact with each other.

  If the third rotating roller 29 is in contact with the ball array mask 3, the third rotating roller 29 is rotated to the right by the Y-axis drive mechanism of the ball cup 50. It rotates counterclockwise by friction force. The rotational force of the third rotating roller 29 is transmitted to the fourth rotating roller 30 by the frictional force caused by the contact, and the fourth rotating roller 30 is also rotated.

  Further, when the third rotating roller 29 attaches the deviating solder ball without contacting the ball arrangement mask 3, the fourth rotating roller 30 is connected to a drive motor (not shown) and rotates. In this case, the rotational force of the drive motor of the fourth rotating roller 30 is transmitted to the third rotating roller 29 by the frictional force caused by the contact, and the third rotating roller 29 is also rotated. Conversely, the third rotating roller 29 may be connected to a drive motor, and the fourth rotating roller 30 may be driven by the third rotating roller 29.

  Further, the third rotating roller 29 and the fourth rotating roller 30 connected to the driving motor are separated so that the deviating solder ball 1A attached to the third rotating roller 29 contacts the outer peripheral surface of the fourth rotating roller 30, The third rotating roller 29 may be rotated by interlocking the rollers 29 and 30 with a timing belt or the like. The rotation direction of the third rotating roller 29 and the fourth rotating roller 30 may be counterclockwise or clockwise. Further, the third rotating roller 29 and the fourth rotating roller 30 can use the attracting force by air suction and the adhering force of static electricity to attach the deviation solder ball 1A, similarly to the first embodiment. It is.

  The operation of the second embodiment will be described below. First, the operation until the completion of ball mounting is the same as that described in the first embodiment. When the ball mounting is completed, the deviating solder ball 1A may remain on the lower surface of the ball arrangement mask 3 and the deviating solder ball 1B may remain in the insertion hole 31. Accordingly, the ball cup 50 is raised by the elevating device 18, the substrate mounting table 6 is lowered, and after the ball array mask 3 is separated from the ball cup 50 and the substrate 2 that is a mounted object, the air cylinder 21 is activated. The first rotating roller 19 is in contact with the lower surface of the ball array mask 3. The raising is performed by the air cylinder 21. At this time, both the third rotating roller 29 are lowered by the operation of the air cylinder 9 and come into contact with the upper surface of the ball arrangement mask 3.

  In this state, the deviation ball removing devices 7A and 7B are moved. That is, the lower departure ball removing device 7A moves in the X-axis direction (left and right direction in FIG. 10) from the moving device 22. On the other hand, the upper departure ball removing device 7B is moved in the X-axis direction by the X-axis drive device of the ball cup 50. The range of movement is controlled such that the first rotating roller 19 and the third rotating roller 29 move within a range slightly wider than the insertion hole forming region.

  Due to this movement, the first rotating roller 19 and the third rotating roller 29 that are in contact with the ball array mask 3 move while rolling on the upper and lower surfaces of the ball array mask 3, and the deviation solder ball 1 </ b> A is placed on the outer periphery of both rollers 19 and 29. Adhere. At the same time, the second rotating roller 20 and the fourth rotating roller 30 are also rotated by friction, and the deviation solder ball 1A adhering to the first rotating roller 19 and the third rotating roller 29 becomes the second rotating roller 20 and the fourth rotating roller. 30, and adheres to both rollers 20 and 30 with a stronger adhesion force.

  In this way, the deviation ball removing devices 7A and 7B are moved so as to cover the entire lower surface of the insertion hole forming region of the ball arrangement mask 3, and the deviation solder balls 1A are removed. The deviating solder balls 1A accumulated on the second rotating roller 20 and the third rotating roller 30 are removed at an appropriate time.

  As shown in FIG. 7C, when the deviation solder ball 1B does not protrude on the upper and lower surfaces of the ball array mask 3 and remains attached in the insertion hole 31, the first rotating roller 19 and the third rotating roller 29 Due to the elastic force, the surfaces of both rollers 19 and 29 are deformed and enter into the insertion hole 31, and either of the rollers 19 or 29 attaches the deviating solder ball 1B and removes it.

  Further, if the first rotating roller 19 and the third rotating roller 29 are made of rubber and have elasticity, when either of the rollers 19 and 29 is slightly bited into the upper portion of the insertion hole 31, the contact between the rollers is reduced. The contact portion is pushed into the insertion hole 31 and pushes the deviation solder ball 1B downward or upward, and adheres to the first rotating roller 19 or the third rotating roller 29 located above or below the insertion hole 31 and easily It is possible to remove.

  In the embodiment, the case where a rectangular cup-shaped member is used as the ball insertion means has been described. However, the ball insertion means is capable of dropping the solder ball 1 into each insertion portion of the array mask. What is necessary is just and it is not limited to what uses a cup-shaped ball cup. For example, the thing by the squeegee which consists of a brush, a wire, etc. which are shown by patent document 1 is also contained.

Plane explanatory view showing the entire ball mounting portion according to the embodiment Explanatory drawing of the ball cup of the state which made the solder ball adsorb | suck in an Example Explanatory drawing of the ball cup which shows the state in the middle of fall of the solder ball in an Example Explanatory drawing which shows 1st Example of a deviation ball removal apparatus. Explanatory drawing which shows the relationship between the solder ball and the insertion hole of the ball arrangement mask Explanatory drawing showing the relationship between the substrate and the ball array mask In the explanatory view showing the state of the deviating ball, (A) is attached to the lower surface of the ball array mask, (B) is attached to the insertion hole with a part protruding from the lower surface of the ball array mask, (C) The case where there is no part which protrudes on the lower surface of the ball arrangement mask and it remains attached to the insertion hole is shown. Explanatory drawing of the state where the first rotating roller and the ball arrangement mask are in contact with each other Explanatory drawing of the state where the first rotating roller and the ball array mask are not in contact Explanatory drawing which shows 2nd Example of a deviation ball removal apparatus. Explanatory drawing which shows the upper deviation ball removal apparatus in 2nd Example. Explanatory drawing of the principle of adhesion ball removal by the up-and-down deviation ball removal apparatus of 2nd Example Explanatory drawing of the removal of the ball | bowl which remained in the insertion hole without the part which protrudes in the ball | bowl arrangement mask upper and lower surfaces in 2nd Example

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Solder ball 1A, 1B ... Deviation solder ball 2 ... Board | substrate 3 ... Ball arrangement | positioning mask 4 ... Solder ball supply apparatus 5 ... Ball insertion apparatus 6 ... Board | substrate mounting stage DESCRIPTION OF SYMBOLS 7 ... Deviation ball removal apparatus 8 ... Elevating base 9 ... Air cylinder 10 ... Moving unit 11 ... X-axis guide 12 ... Y-axis guide 13, 15, 17 ... Drive motor 14, 16 ... Ball screw 18 ... Elevating device 19 ... First rotating roller 20 ... Second rotating roller 21 ... Air cylinder 22 ... Moving device 29 .... 3rd rotation roller 30 ... 4th rotation roller 31 ... Insertion hole 33 ... Formwork 50 ... Ball cup 51 ... Opening part 52 ... Ball adsorber 53 ... Upper space 54 ... Lower space 55 ... Suction passage 56 ... Ball supply passage 57 ... Electromagnetic on-off valve 58 ... Regulator 59 ... Vacuum source 60 ... Earth 61 ... Vibrator

Claims (5)

Mounted object support means for supporting a mounted object on which microballs are mounted, an array mask in which microball insertion portions are formed in a predetermined array pattern, and a mask support for supporting the array mask above the mounted object A ball mounting device for mounting a microball on the mounted object, and a ball insertion unit for dropping a microball into the insertion portion of the array mask,
After the array mask is separated from the object to be mounted, the first mask can move along the lower surface of the array mask, and the microballs attached to the array mask can adhere to the outer peripheral surface, and the first roller An apparatus for mounting a ball, comprising: attached ball removing means for removing a minute ball attached to the first roller from the first roller with a force stronger than an attached force.
The ball mounting apparatus according to claim 1, wherein the first roller has an adhesive force on a surface thereof.
The ball mounting apparatus according to claim 2, wherein the attached ball removing unit is a second roller having an adhesive force stronger than that of the first roller.
4. The ball mounting device according to claim 1, further comprising a third roller capable of adhering a minute ball to an outer peripheral surface and moving together with the first roller with the arrangement mask interposed therebetween.
The ball mounting apparatus according to claim 1, wherein the first roller has elasticity.

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