JP2010010344A - Differential type spiral inductor, integrated circuit device, and electronic instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a differential type spiral inductor in which improvement in differential characteristics is achieved by improvement of symmetry, and to provide an integrated circuit device and an electronic instrument. <P>SOLUTION: The differential type spiral inductor 10 includes: a terminal 12; a terminal 14 which is in a position symmetrical with the terminal 12 with respect to a symmetry wire 16; a conductive wiring 100 which electrically connects the terminal 12 and the terminal 14; intersection parts 120, 130, 140, and 150 in which a wiring path between A and C and a wiring path between B and C of the conductive wiring 100 intersect on the symmetry wire 16. The number of via holes 160 which connect both ends of the intersecting wiring 122 of the wiring path between A and C and the non-intersecting wiring is equal to the number of via holes 160 which connect both ends of the intersecting wiring 134 of the wiring path between B and C and the non-intersecting wiring. Further, the number of via holes 160 which connect both ends of the intersecting wiring 152 of the wiring path between A and C and the non-intersecting wiring is equal to the number of via holes 160 which connect both ends of the intersecting wiring 144 of the wiring path between B and C and the non-intersecting wiring. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a differential spiral inductor, an integrated circuit device, and an electronic apparatus.

With the rapid development of mobile communication devices typified by mobile phones in recent years, demands for higher functionality, smaller size, and lower power consumption of semiconductor integrated circuit devices (ICs), which are mounted components, have become stricter. . In particular, high performance is required for an RF (Radio Frequency) circuit that transmits and receives high-frequency radio waves. As components of the RF circuit, for example, a voltage controlled oscillator (Voltage Controlled Oscillator: VCO) in FIG. 6A, a low noise amplifier (Low Noise Amplifier: LNA) and a power amplifier (Power Amplifier: PA) in FIG. The differential spiral inductor 1000 is used for these differential circuits. FIG. 6C is an equivalent circuit of the differential spiral inductor 1000. In order to improve the differential characteristics, the impedance of the wiring between A and C is made equal to the impedance of the wiring between B and C. It is important that the resistance components R ₁ and R ₂ and the capacitance components C ₁ and C ₂ are equal. As a conventional technique for improving the differential characteristics, for example, a technique of forming a wiring pattern so that the wiring pattern of the differential spiral inductor is symmetrical is proposed.
JP 2005-191217 A

FIG. 7A to FIG. 7C are diagrams for explaining a conventional differential spiral inductor. FIG. 7A is a plan view schematically showing a wiring pattern on a semiconductor substrate of a conventional differential spiral inductor, and FIG. 7B and FIG. 2) is a cross-sectional view taken along line II and line II-II of FIG. As shown in FIGS. 7A to 7C, in the conventional differential spiral inductor 1000, intersections 1020 and 1030 at which the wiring path between A and C and the wiring path between B and C intersect. The wiring patterns of both wiring paths are formed in different wiring layers at 1040, 1050. For example, at the intersections 1020, 1030, 1040, and 1050, the intersection wirings 1022 and 1052 on the wiring path between A and C and the intersection wirings 1034 and 1044 on the wiring path between B and C are formed in the metal 5 wiring layer. Cross wirings 1032 and 1042 on the wiring path between A and C and cross wirings 1024 and 1054 on the wiring path between B and C are formed in the metal 6 wiring layer. Therefore, in the wiring path between A and C, the wiring patterns 1002 and 1008 of the metal 6 wiring layer are connected to the cross wiring 1022 through the via holes 1060 at the wiring connecting portions 1062 and 1064, and the wiring pattern 1016 of the metal 6 wiring layer and 1018 is connected to the cross wiring 1052 through the via hole 1060 at the wiring connection portions 1066 and 1068. Further, in the wiring path between B and C, the wiring patterns 1006 and 1012 of the metal 6 wiring layer are connected to the cross wiring 1034 through the via holes 1060 at the wiring connecting portions 1072 and 1074, and the wiring pattern 1012 of the metal 6 wiring layer and 1014 is connected to the cross wiring 1044 through the via holes 1060 at the wiring connection portions 1076 and 1078. Here, when the shape of each cross wiring is a taper shape, since the width of the wiring pattern connected to each cross wiring is different, as shown in FIG. 7A, on the wiring path between A and C. The number of certain via holes and the number of via holes on the wiring path between B and C are different. Therefore, only the differences in the resistance of the via hole that is on the wiring route between the resistor and the B-C of the via hole that is on the wire path between A-C, A-C between the wiring resistance component R ₁ and between B-C the difference in the resistance component R ₂ of the wiring may occur. For this reason, it has been difficult to improve the differential characteristics of the differential spiral inductor.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a differential spiral inductor, an integrated circuit device, and an electronic apparatus that can improve differential characteristics by improving symmetry. And

(1) The present invention
A first terminal;
A second terminal in line symmetry with the first terminal with respect to a symmetry line;
Conductive wiring for electrically connecting the first terminal and the second terminal;
A first wiring path of the conductive wiring from the first terminal to a predetermined point on the symmetric line and a second wiring path of the conductive wiring from the second terminal to the predetermined point are First to Nth intersections that intersect the first to Nth (N ≧ 2) on the symmetry line, respectively,
One of the 2n-1 (n ≧ 1) intersection and the 2nth intersection is
The cross wiring of the first wiring path is formed in a first wiring layer and the cross wiring of the second wiring path is formed in a second wiring layer different from the first wiring layer;
The other of the intersection of the 2n-1 and the intersection of the 2n is
A cross wiring of the second wiring path is formed in the first wiring layer and a cross wiring of the first wiring path is formed in the second wiring layer;
The conductive wiring is
A wiring pattern having a line-symmetric shape with respect to the symmetric line is formed in the first wiring layer in a non-intersecting portion other than the first to Nth crossing portions, and each of the crossing wirings is formed in the non-intersecting portion. The width of the non-crossing wiring connected to both ends is different, and both ends of the crossing wiring formed in the second wiring layer are electrically connected to the non-crossing wiring by a conductive member through holes,
The number of the holes connecting both ends of the cross wiring formed in the second wiring layer of the second n-1 crossing portion and the non-crossing wiring; and the second of the second n crossing portions. The differential spiral inductor is characterized in that the number of the holes connecting both ends of the cross wiring formed in the wiring layer and the non-cross wiring is equal.

  The predetermined point may be a point on a symmetric line where the length of the first wiring path and the length of the second wiring path are substantially equal.

  The wiring layer may be a metal wiring layer or a polysilicon wiring layer.

  The hole may be a contact hole for connecting the polysilicon wiring and the metal first layer wiring, or may be a via hole for connecting metal wiring formed in a plurality of continuous metal wiring layers.

  The cross wiring of the first wiring route and the cross wiring of the second wiring route in the first to Nth crossing portions may be formed in different wiring layers, and may be formed in a plurality of wiring layers, respectively. Good.

  According to the present invention, the first terminal and the second terminal are in a line-symmetric position with respect to the symmetry line. In addition, in the conductive wiring that electrically connects the first terminal and the second terminal, a wiring pattern having a line-symmetric shape with respect to the symmetric line is formed in the first wiring layer at the non-intersection. Therefore, the wiring pattern at the non-intersection portion of the wiring of the first wiring path and the wiring pattern at the non-intersection portion of the wiring of the second wiring path have substantially the same wiring resistance and wiring capacitance. In addition, the differential spiral inductor of the present invention includes first to Nth intersections where the first wiring path and the second wiring path intersect the first to Nth lines on the symmetry line, respectively. One of the 2n-1 intersection and the 2n-1 intersection is formed in the first wiring layer by the intersection wiring of the first wiring path, and the other of the intersections of the second wiring path is the first wiring. Formed in layers. Here, since these cross wirings are formed in the same wiring layer as the wiring layer in which the non-cross wiring is formed, a hole for electrically connecting the cross wiring and the non-cross wiring is not necessary. On the other hand, one of the 2n-1 crossing portion and the 2n crossing portion has a cross wiring of the second wiring path formed in the second wiring layer, and the other has the cross wiring of the first wiring path as the first wiring. 2 wiring layers. Here, since these cross wirings are formed in a wiring layer different from the wiring layer in which the non-crossing wiring is formed, a hole for electrically connecting the crossing wiring and the non-crossing wiring is necessary. The number of holes connecting both ends of the cross wiring formed in the second wiring layer of the 2n-1 crossing portion and the non-crossing wiring, and the crossing formed in the second wiring layer of the 2n crossing portion The number of holes connecting both ends of the wiring and the non-crossing wiring is equal. That is, the number of all holes electrically connecting the cross wiring and the non-cross wiring of the first wiring path and the number of all holes electrically connecting the cross wiring and the non-cross wiring of the second wiring path are as follows. equal. Therefore, according to the present invention, there is almost no difference between the resistance of the holes in the first wiring path and the resistance of the holes in the second wiring path, so that the differential characteristics can be improved.

(2) The differential spiral inductor of the present invention is
One end of the cross wiring formed in the second wiring layer at any one of the first to Nth crossing portions, including the hole and a wiring pattern formed in the second wiring layer And 2N wiring connection portions respectively connecting the non-crossing wirings,
The number of holes included in the mth (m ≧ 1) wiring connection portion of the first wiring path and the number of holes included in the mth wiring connection portion of the second wiring path May be equal.

  That is, when the first wiring path is traced from the first terminal toward a predetermined point on the symmetry line, the number of holes included in the wiring connecting portion passing through the mth line and the second wiring path are set to the second The number of holes included in the wiring connecting portion that passes through the mth pass when tracing from the terminal toward a predetermined point on the symmetry line is equal.

(3) In the differential spiral inductor of the present invention,
Each of the 2N wiring connections is
The holes are arranged in an array in a first direction and a second direction;
The mth wiring connection part of the first wiring path is:
The number of the holes arranged in the second direction is an integral multiple of the number of the holes arranged in the first direction of the m-th wiring connection portion of the second wiring path. ,
The mth wiring connection part of the second wiring path is:
The number of the holes arranged in the second direction is an integral multiple of the number of the holes arranged in the first direction of the m-th wiring connection portion of the first wiring path. May be.

  For example, one of the m-th wiring connection part of the first wiring path and the m-th wiring connection part of the second wiring path has p holes in the first direction and q holes in the second direction. It is formed by arranging r wiring connection patterns including (p × q holes) side by side in the second direction, and the m-th wiring connection portion of the first wiring path and the second wiring path of the second wiring path. The other of the m-th wiring connection portions may be formed by rotating the wiring pattern by 90 ° and arranging the wiring patterns in the second direction. In this case, in the layout pattern design of the differential spiral inductor, by creating the layout pattern of the wiring connection pattern, the layout pattern of the mth wiring connection portion of the first wiring path and the second wiring path Since the layout pattern of the mth wiring connection portion can be easily created, the layout pattern design man-hour can be reduced.

(4) In the differential spiral inductor of the present invention,
The mth wiring connection part of the second wiring path is:
When arranged by rotating 90 °, the relative arrangement of the plurality of holes matches the relative arrangement of the plurality of holes in the m-th wiring connection portion of the first wiring path. It may be formed.

  According to the present invention, in the layout pattern design of the differential spiral inductor, the layout of either the mth wiring connection portion of the first wiring path or the mth wiring connection portion of the second wiring path. If the pattern is created, it is not necessary to create the other layout pattern, so the layout pattern design man-hour can be reduced.

(5) In the differential spiral inductor of the present invention,
Each of the 2N wiring connections is
The wiring pattern formed on the second wiring layer may have a rectangular shape in which the length of the first side is substantially the same as the width of the non-crossing wiring connected through the hole. .

(6) In the differential spiral inductor of the present invention,
The mth wiring connection part of the first wiring path is:
The length of the second side orthogonal to the first side of the wiring pattern formed in the second wiring layer is included in the mth wiring connection part of the second wiring path. Approximately the same length as the first side of the wiring pattern formed in the second wiring layer;
The mth wiring connection part of the second wiring path is:
The length of the second side orthogonal to the first side of the wiring pattern formed in the second wiring layer is included in the mth wiring connection part of the first wiring path. The length of the first side of the wiring pattern formed in the second wiring layer may be substantially the same.

(7) The present invention
An integrated circuit device comprising the differential spiral inductor according to any one of the above.

(8) The present invention
An integrated circuit device as described above;
Data input means to be processed by the integrated circuit device;
An electronic device comprising: output means for outputting data processed by the integrated circuit device.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. Also, not all of the configurations described below are essential constituent requirements of the present invention.

1. Differential type spiral inductor 1-1. First Example FIGS. 1A to 1C are diagrams for explaining a first example of the differential spiral inductor of the present embodiment. FIG. 1A is a plan view schematically showing a wiring pattern on a semiconductor substrate of the differential spiral inductor of the present embodiment. FIGS. 1B and 1C are respectively a plan view and a plan view, respectively. It is the II sectional view taken on the line of (A), and the II-II sectional view.

  As shown in FIGS. 1A to 1C, the differential spiral inductor 10 is in a position symmetrical with the terminal 12 with respect to the terminal 12 (an example of the first terminal) and the symmetry line 16. The terminal 14 (an example of a second terminal) includes a conductive wiring 100 that electrically connects the terminal 12 and the terminal 14.

  The differential spiral inductor 10 includes four intersections 120, 130, 140, and 150 (an example of first to Nth intersections).

  At the intersections 120, 130, 140, and 150, the first wiring path (hereinafter referred to as AC wiring path) of the conductive wiring 100 from the terminal 12 (point A) to the point C on the symmetry line 16 and the terminal 14. A second wiring path (hereinafter referred to as a B-C wiring path) of the conductive wiring 100 from the (B point) to the C point intersects the first to fourth on the symmetry line 16 respectively.

  In other words, at the intersection 120, the intersection wiring 122 of the AC wiring path and the intersection wiring 124 of the BC wiring path are in a line-symmetric shape with respect to the symmetry line 16 and intersect on the symmetry line 16. Similarly, at the intersection 130, the intersection wiring 132 of the A—C wiring path and the intersection wiring 134 of the B—C wiring path have a shape symmetrical with respect to the symmetry line 16 and intersect on the symmetry line 16. . Similarly, at the intersection 140, the intersection wiring 142 of the A-C wiring path and the intersection wiring 144 of the B-C wiring path are symmetrical with respect to the symmetry line 16, and intersect on the symmetry line 16. . Similarly, at the intersection 150, the intersection wiring 152 of the A-C wiring path and the intersection wiring 154 of the B-C wiring path are in a line-symmetric shape with respect to the symmetry line 16, and intersect on the symmetry line 16. .

  Here, one of the intersecting portion 120 (first intersecting portion) and the intersecting portion 130 (second intersecting portion) is formed such that the intersecting wiring of the AC wiring path is formed in the first wiring layer and BC. The cross wiring of the wiring path is formed in a second wiring layer different from the first wiring layer, and the other of the crossing portion 120 (first crossing portion) and the crossing portion 130 (second crossing portion) is B-C. Cross wirings of the wiring paths are formed in the first wiring layer, and cross wirings of the AC wiring paths are formed in the second wiring layer. For example, as shown in FIG. 1A, the cross wiring 132 is formed in the metal 6 wiring layer (uppermost metal wiring layer) in the metal 6 layer process and the cross wiring 134 is formed in the metal 5 wiring layer. In the intersection 120, the intersection wiring 124 is formed in the metal 6 wiring layer and the intersection wiring 122 is formed in the metal 5 wiring layer.

  Similarly, one of the intersecting portion 140 (third intersecting portion) and the intersecting portion 150 (fourth intersecting portion) has an intersection wiring of the AC wiring path formed in the first wiring layer and BC. The intersection wiring of the wiring path is formed in a second wiring layer different from the first wiring layer, and the other of the intersection 140 (third intersection) and the intersection 150 (fourth intersection) is B-C Cross wirings of the wiring paths are formed in the first wiring layer, and cross wirings of the AC wiring paths are formed in the second wiring layer. For example, as shown in FIG. 1A, the cross wiring 142 is formed in the metal 6 wiring layer at the crossing portion 140 and the cross wiring 144 is formed in the metal 5 wiring layer, and the cross wiring 154 is formed in the metal 6 wiring at the crossing portion 150. The cross wiring 152 is formed in the metal 5 wiring layer while being formed in the wiring layer.

  The conductive wiring 100 includes non-crossing wirings 102, 104, 106, 108, 110, 112, 114, 116, 118, and crossing wirings 122, 124, 132, 134, 142, 144, 152, 154. Non-intersecting wirings 102, 104, 106, 108, 110, 112, 114, 116, 118 are wirings present in non-intersecting parts that are parts other than the intersecting parts 120, 130, 140, 150.

  Non-intersecting wirings 102, 104, 106, 108, 110, 112, 114, 116, 118 are formed in a metal 6 wiring layer (an example of a first wiring layer). Here, the wiring pattern formed in the metal 6 wiring layer by the non-intersecting wirings 102, 104, 106, 108, 110, 112, 114, 116, 118 has a shape symmetrical with respect to the symmetry line 16.

Here, the shape of the cross wirings 122, 124, 132, 134, 142, 144, 152, 154 is a tapered shape in which the wiring width changes at a constant ratio. Therefore, the width W ₁ of the non-crossing wiring 102 connected to both ends of the crossing wiring 122 is different from the width W ₂ of the non-crossing wiring 108. Further, the width W ₁ of the non-crossing wiring 104 connected to both ends of the crossing wiring 124 is different from the width W ₂ of the non-crossing wiring 106. For example, as shown in FIG. 1A, the non-crossing wirings 108 and 106 may be thinner than the non-crossing wirings 102 and 104, respectively.

Similarly, the width W ₂ of the non-cross wiring 108 connected to both ends of the cross wiring 132 and the width W ₃ of the non-cross wiring 110 are different. Also, different widths _{W 2} and the width _{W 3} of the non-intersecting lines 112 nonintersecting lines 106 connected to both ends of the cross wiring 134. For example, as shown in FIG. 1A, the non-crossing wirings 110 and 112 may be thinner than the non-crossing wirings 108 and 106, respectively.

Similarly, the width W ₃ of the non-cross wiring 110 connected to both ends of the cross wiring 142 is different from the width W ₄ of the non-cross wiring 116. Further, the width W ₃ of the non-crossing wiring 112 connected to both ends of the crossing wiring 144 is different from the width W ₄ of the non-crossing wiring 114. For example, as shown in FIG. 1A, the non-crossing wirings 116 and 114 may be thinner than the non-crossing wirings 110 and 112, respectively.

Similarly, the width W ₄ of the non-cross wiring 116 connected to both ends of the cross wiring 152 is different from the width W ₅ of the non-cross wiring 118. Further, the width W ₄ of the non-crossing wiring 114 connected to both ends of the crossing wiring 154 is different from the width W ₅ of the non-crossing wiring 118. For example, as shown in FIG. 1A, the non-crossing wiring 118 may be thinner than the non-crossing wirings 116 and 114.

  Both ends of the cross wiring 122 are electrically connected to the non-cross wirings 102 and 108 by a conductive member through via holes 160 included in the wiring connection portions 162 and 164, respectively. In addition, both ends of the cross wiring 134 are electrically connected to the non-cross wirings 106 and 112 by conductive members via via holes 160 included in the wiring connection portions 172 and 174, respectively. In addition, both ends of the cross wiring 144 are electrically connected to the non-crossing wirings 112 and 114 by conductive members through via holes 160 included in the wiring connection portions 176 and 178, respectively. In addition, both ends of the cross wiring 152 are electrically connected to the non-crossing wirings 116 and 118 by conductive members via via holes 160 included in the wiring connection portions 166 and 168, respectively.

  In the wiring connection portions 162, 164, 166, 168, 172, 174, 176, 178, the via holes 160 are arranged in an array in the Y direction (an example of the first direction) and the X direction (an example of the second direction). It may be.

  As shown in FIG. 1A, the wiring connection portion 162 includes, for example, 24 (6 × 4) via holes 160 and a wiring pattern 162-2 formed in a metal 5 wiring layer (an example of a second wiring layer). In the intersection 120 (first intersection), one end of the intersection wiring 122 formed in the metal 5 wiring layer is connected to the non-intersection wiring 102. Similarly, the wiring connection portion 164 includes, for example, 12 (4 × 3) via holes 160 and a wiring pattern 164-2 formed in the metal 5 wiring layer, and includes one end of the cross wiring 122 and the non-cross wiring 108. Connect.

  Further, as shown in FIG. 1A, the wiring connection portion 166 includes, for example, 6 (2 × 3) via holes 160 and a wiring pattern 166-2 formed in the metal 5 wiring layer. At 150 (fourth intersection), one end of the intersection wiring 152 formed in the metal 5 wiring layer is connected to the non-intersection wiring 116. Similarly, the wiring connection portion 168 includes, for example, 2 (1 × 2) via holes 160 and a wiring pattern 168-2 formed in the metal 5 wiring layer, and includes one end of the cross wiring 152 and the non-crossing wiring 118. Connect.

  In addition, the wiring connection portion 172 includes, for example, 24 (4 × 6) via holes 160 and a wiring pattern 172-2 formed in the metal 5 wiring layer, and at the intersection 130 (second intersection). One end of the cross wiring 134 formed in the metal 5 wiring layer is connected to the non-cross wiring 106. Similarly, the wiring connection portion 174 includes, for example, 12 (3 × 4) via holes 160 and a wiring pattern 174-2 formed in the metal 5 wiring layer, and includes one end of the cross wiring 134 and the non-crossing wiring 112. Connect.

  In addition, the wiring connection portion 176 includes, for example, 6 (3 × 2) via holes 160 and a wiring pattern 176-2 formed in the metal 5 wiring layer, and at the intersection 140 (third intersection). One end of the cross wiring 144 formed in the metal 5 wiring layer and the non-cross wiring 112 are connected. Similarly, the wiring connection portion 178 includes, for example, 2 (2 × 1) via holes 160 and a wiring pattern 178-2 formed in the metal 5 wiring layer, and includes one end of the cross wiring 144 and the non-crossing wiring 114. Connect.

  Here, the number of via holes 160 that connect both ends of the cross wiring 122 formed in the metal 5 wiring layer (an example of the second wiring layer) of the crossing portion 120 (first crossing portion) and the non-crossing wirings 102 and 108. Is 36 (24 + 12). On the other hand, the number of via holes connecting both ends of the cross wiring 134 formed in the metal 5 wiring layer (an example of the second wiring layer) of the crossing portion 130 (second crossing portion) and the non-crossing wirings 106 and 112 is also 36. (24 + 12). That is, the number of via holes 160 that connect both ends of the cross wiring 122 and the non-crossing wirings 102 and 108 at the wiring connection portions 162 and 164 and the both ends of the cross wiring 134 and the non-crossing wirings 106 and 112 at the wiring connection portions 172 and 174 are connected. The number of via holes to be made is equal.

  Further, the number of via holes 160 that connect both ends of the cross wiring 144 formed in the metal 5 wiring layer (an example of the second wiring layer) of the crossing portion 140 (third crossing portion) and the non-crossing wirings 112 and 114 is as follows. Eight (6 + 2). On the other hand, the number of via holes connecting both ends of the cross wiring 152 formed in the metal 5 wiring layer (an example of the second wiring layer) of the crossing portion 150 (fourth crossing portion) and the non-crossing wirings 116 and 118 is also eight. (6 + 2). That is, the number of via holes 160 connecting both ends of the cross wiring 144 and the non-crossing wirings 112 and 114 in the wiring connection portions 176 and 178 and the both ends of the cross wiring 152 and the non-crossing wirings 116 and 118 in the wiring connection portions 166 and 168 are connected. The number of via holes to be made is equal.

  Since the wiring connecting portions 162, 164, 166, and 168 are included in the AC wiring route, and the wiring connecting portions 172, 174, 176, and 178 are included in the BC wiring route, the cross wiring and the non-crossing wiring are provided. The number of via holes in the A-C wiring path and the number of via holes in the B-C wiring path for connection are both 44 (36 + 8) and are equal.

  Further, as shown in FIG. 1A, the number (24) of via holes included in the first wiring connection portion 162 of the AC wiring path and the first wiring connection portion 172 of the BC wiring path. The number of via holes included in (24) may be equal. Similarly, the number of via holes included in the second wiring connection portion 164 of the AC wiring path (12) and the number of via holes included in the second wiring connection portion 174 of the BC wiring path (12 May be equal. Similarly, the number of via holes included in the third wiring connection portion 166 of the AC wiring path (six) and the number of via holes included in the third wiring connection portion 176 of the BC wiring path (6 May be equal. Similarly, the number of via holes included in the fourth wiring connection portion 168 of the AC wiring path (two) and the number of via holes included in the fourth wiring connection portion 178 of the BC wiring path (2 May be equal.

  Here, as shown in FIG. 1A, when the first to fourth wiring connecting portions 172, 174, 176, and 178 of the BC wiring path are arranged rotated by 90 °, the via hole 160 is used. May be formed so as to coincide with the relative arrangement of the first to fourth wiring connection portions 162, 164, 166, and 168 of the AC wiring path. .

Further, the wiring connecting portions 162, 164, 166, 168, 172, 174, 176, 178 are wiring patterns 162-2, 164-2, 166 formed in the metal 5 wiring layer (an example of the second wiring layer). -2, 168-2, 172-2, 174-2, 176-2, 178-2, the lengths of the sides in the Y direction (an example of the first side) are connected via the via holes 160, respectively. The cross wirings 102, 108, 116, 118, 106, 112, 112, 114 may have a rectangular shape that is substantially the same as the width. For example, the length L ₁ of the side in the Y direction of the wiring pattern 162-2 may be substantially the same as the width W ₁ of the non-crossing wiring 102. Further, for example, the length L ₂ of the side in the Y direction of the wiring pattern 172-2 may be substantially the same as the width W ₂ of the non-crossing wiring 106.

Further, the X-direction of the wiring patterns 162-2, 164-2, 166-2, and 168-2 included in the first to fourth wiring connecting portions 162, 164, 166, and 168 of the AC wiring path. The lengths of the sides (an example of the second side orthogonal to the first side) are the wirings included in the first to fourth wiring connecting portions 172, 174, 176, and 178 of the BC wiring path, respectively. The lengths of the sides in the Y direction of the patterns 172-2, 174-2, 176-2, and 178-2 may be substantially the same. Similarly, the X direction of the wiring patterns 172-2, 174-2, 176-2, and 178-2 included in the first to fourth wiring connecting portions 172, 174, 176, and 178 of the BC wiring path The lengths of the sides of the wiring patterns 162-2, 164-2, 166-2, and 168 included in the first to fourth wiring connecting portions 162, 164, 166, and 168 of the AC wiring path, respectively. -2 may be substantially the same as the length of the side in the Y direction. For example, the length L ₂ of the side in the X direction of the wiring pattern 162-2 may be substantially the same as the length L ₂ of the side in the Y direction of the wiring pattern 172-2. Further, for example, the length L ₁ of the side in the X direction of the wiring pattern 172-2 may be substantially the same as the length L ₁ of the side in the Y direction of the wiring pattern 162-2.

  The differential spiral inductor 10 is provided with a center tap by a wiring pattern 184 formed in the metal 4 wiring layer (the third metal wiring layer from the top) in order to connect the point C to the outside. May be. Here, the non-intersecting wiring 118 formed in the metal 6 wiring layer and the wiring pattern 182 formed in the metal 5 layer are electrically connected by the conductive member through the via hole 180-1, and the wiring pattern 182 and the wiring pattern are connected. 184 is electrically connected by a conductive member through a via hole 180-2. Further, in order to make the resistance values of the via holes 180-1 and 180-2 of the AC wiring path equal to the resistance values of the via holes 180-1 and 180-2 of the BC wiring path, respectively, the via holes 180-1 and 180-2. -2 are arranged so as to be symmetrical with respect to the symmetry line 16.

  According to the differential spiral inductor 10 of the present embodiment, the terminal 12 and the terminal 14 are in a line-symmetric position with respect to the symmetry line 16. Further, in the conductive wiring 100 that electrically connects the terminal 12 and the terminal 14, a wiring pattern having a shape symmetrical with respect to the symmetric line 16 is formed in the metal 6 wiring layer at the non-intersection. For this reason, the wiring pattern of the non-crossing portion of the wiring of the AC wiring path and the wiring pattern of the non-crossing portion of the wiring of the BC wiring path have substantially the same wiring resistance and wiring capacitance. Further, the crossing portion 120 (first crossing portion) and the crossing portion 130 (second crossing portion) are paired, and both ends of the cross wiring 122 of the AC wiring path of the crossing portion 120 and the non-crossing wirings 102 and 108 are connected. The number of via holes in the wiring connection portions 162 and 164 to be connected and the number of via holes in the wiring connection portions 172 and 174 that connect both ends of the cross wiring 134 of the BC wiring path of the crossing portion 130 and the non-crossing wirings 106 and 112 are as follows. equal. In addition, with the intersection 140 (third intersection) and the intersection 150 (fourth intersection) as a pair, both ends of the intersection wiring 144 of the BC wiring path of the intersection 140 and the non-intersection wirings 112 and 114 The number of via holes in the wiring connection portions 176 and 178 to be connected and the number of via holes in the wiring connection portions 166 and 168 that connect the both ends of the cross wiring 152 in the AC wiring path of the crossing portion 150 and the non-crossing wirings 116 and 118 are as follows. equal. That is, the number of via holes 160 that electrically connect the cross wiring and the non-cross wiring of the AC wiring path is equal to the number of via holes 160 that electrically connect the cross wiring and the non-cross wiring of the BC wiring path. Therefore, according to the differential spiral inductor 10 of the present embodiment, there is almost no difference between the resistance of the via hole 160 in the AC wiring path and the resistance of the via hole in the BC wiring path, so that the differential characteristics can be improved. Can do.

  In addition, according to the differential spiral inductor 20 of the present embodiment, the wiring connection portions 162, 164, 166, and 168 are arranged by being rotated by 90 °, thereby forming the wiring connection portions 172, 174, 176, and 178, respectively. Has been. Therefore, in the layout pattern design of the differential spiral inductor 10, if the layout patterns of the wiring connection portions 162, 164, 166, and 168 are created, it is not necessary to create the layout patterns of the wiring connection portions 172, 174, 176, and 178. Therefore, the layout pattern design man-hour can be reduced.

1-2. Second Example FIGS. 2A to 2C are diagrams for explaining a second example of the differential spiral inductor of the present embodiment. 2A is a plan view schematically showing a wiring pattern on the semiconductor substrate of the differential spiral inductor of the present embodiment. FIGS. 2B and 2C are respectively a plan view and FIG. It is the II sectional view taken on the line of (A), and the II-II sectional view. Here, the differential spiral inductor 20 includes wiring connection portions 162, 164, 166, 168, 172, 174, 176, 178 of the differential spiral inductor 10 shown in FIGS. 1 (A) to 1 (C). Is replaced with the wiring connection portions 202, 204, 206, 208, 212, 214, 216, 218, and the configurations other than the wiring connection portions 202, 204, 206, 208, 212, 214, 216, 218 are as follows. Since it is the same as the differential spiral inductor 10, the same reference numerals as those in FIGS. 1A to 1C are attached, and the description thereof is omitted.

  The differential spiral inductor 20 includes wiring connection portions 202, 204, 206, 208, 212, 214, 216, and 218.

  In the wiring connection sections 202, 204, 206, 208, 212, 214, 216, and 218, the via holes 160 are arranged in an array in the Y direction (an example of the first direction) and the X direction (an example of the second direction). ing.

  Here, the first wiring connection portion 202 in the A-C wiring path has the number of via holes 160 (eight) arranged in the X direction (an example of the second direction) equal to that in the B-C wiring path. This is twice the number of via holes 160 arranged in the Y direction (an example of the first direction) of the first wiring connection portion 212 (an example of an integer multiple). Conversely, in the wiring connection part 212, the number of via holes 160 arranged in the X direction (12) is twice the number of via holes 160 arranged in the Y direction of the wiring connection part 202 (6).

  Similarly, the second wiring connection portion 204 of the A-C wiring path has the number of via holes 160 arranged in the X direction (six) that the second wiring connection section 214 of the B-C wiring path. This is twice the number (three) of via holes 160 arranged in the Y direction. Conversely, the number of via holes 160 arranged in the X direction (eight) in the wiring connection portion 214 is twice the number of via holes 160 arranged in the Y direction of the wiring connection portion 204 (four).

  Similarly, the third wiring connection portion 206 of the AC wiring path has the number of via holes 160 arranged in the X direction (six) so that the third wiring connection portion 216 of the BC wiring path is the same. This is twice the number (three) of via holes 160 arranged in the Y direction. Conversely, the number of via holes 160 arranged in the X direction (four) in the wiring connection portion 216 is twice the number of via holes 160 arranged in the Y direction of the wiring connection portion 206 (two).

  Further, the fourth wiring connection portion 208 of the AC wiring path has the number (two) of via holes 160 arranged in the X direction so that the Y of the fourth wiring connection portion 218 of the BC wiring path is Y. The number of via holes 160 arranged in the direction is twice the number (two). Conversely, in the wiring connection part 218, the number of via holes 160 arranged in the X direction (two) is one times the number of via holes 160 arranged in the Y direction of the wiring connection part 208 (two).

  Here, the number of via holes included in the wiring connection portion 202 (6 × 8 = 48) is equal to the number of via holes included in the wiring connection portion 212 (4 × 12 = 48). Further, the number of via holes included in the wiring connection portion 204 (4 × 6 = 24) is equal to the number of via holes included in the wiring connection portion 214 (3 × 8 = 24). The number of via holes included in the wiring connection portion 206 (2 × 6 = 12) is equal to the number of via holes included in the wiring connection portion 216 (3 × 4 = 12). The number of via holes included in the wiring connection portion 208 (1 × 2 = 2) is equal to the number of via holes included in the wiring connection portion 218 (2 × 1 = 2).

  Since the wiring connecting portions 202, 204, 206, and 208 are included in the A-C wiring route, and the wiring connecting portions 212, 214, 216, and 218 are included in the B-C wiring route, the cross wiring and the non-crossing wiring are provided. The number of via holes in the AC wiring path and the number of via holes in the BC wiring path for connection are both 86 (48 + 24 + 12 + 2), which are equal.

  According to the differential spiral inductor 20 of the present embodiment, the wiring pattern of the non-crossing portion of the wiring of the AC wiring path and the wiring pattern of the non-crossing portion of the wiring of the BC wiring path are wiring resistance and wiring capacitance. Are almost equal. Further, the number of via holes 160 that electrically connect the cross wiring and non-cross wiring of the AC wiring path is equal to the number of via holes 160 that electrically connect the cross wiring and non-cross wiring of the BC wiring path. Therefore, according to the differential spiral inductor 20 of the present embodiment, there is almost no difference between the resistance of the via hole 160 in the AC wiring path and the resistance of the via hole in the BC wiring path, so that the differential characteristics can be improved. Can do.

  Further, in the differential spiral inductor 20 of the present embodiment, the number of the via holes 160 of the wiring connection portions 202, 204, 206, 212, 214, and 216 is the same as that of the wiring connection portions 162, 164, and 166 of FIG. , 172, 174 and 176, the number of via holes 160 is twice that of the differential spiral inductor 10 described with reference to FIGS. 1A to 1C. The resistance component of the via hole 160 of the wiring and the wiring of the BC wiring path is about ½. Therefore, according to the differential spiral inductor 20 of the present embodiment, the Q value is improved as compared with the differential spiral inductor 10 described with reference to FIGS. Electric power can be reduced.

  Further, according to the differential spiral inductor 20 of the present embodiment, the wiring connection portion 202 is formed by arranging two wiring connection patterns (via components) 162 side by side in the X direction, and the wiring connection pattern 162 is rotated by 90 °. The wiring connection part 212 is formed by arranging two rotated wiring connection patterns 172 side by side in the X direction. Further, the wiring connection portion 204 is formed by arranging two wiring connection patterns 164 side by side in the X direction, and wiring by arranging two wiring connection patterns 174 obtained by rotating the wiring connection pattern 164 by 90 ° in the X direction. A connection part 214 is formed. Further, the wiring connection portion 216 is formed by arranging two wiring connection patterns 176 in the X direction, and wiring is performed by arranging two wiring connection patterns 166 obtained by rotating the wiring connection pattern 176 by 90 ° in the X direction. A connecting portion 206 is formed. Further, the wiring connection portion 218 is formed by arranging the wiring connection pattern 178, and the wiring connection portion 208 is formed by arranging the wiring connection pattern 168 obtained by rotating the wiring connection pattern 178 by 90 °. Therefore, in the layout pattern design of the differential spiral inductor 20, by creating layout patterns of four via components corresponding to the wiring connection patterns 162, 164, 176, and 178, the wiring connection portion of the AC wiring path is created. Since the layout pattern and the layout pattern of the wiring connection part of the B-C wiring path can be easily created, the layout pattern design man-hour can be reduced.

1-3. 3rd Example FIG. 3: (A)-FIG.3 (C) are the figures for demonstrating the 3rd Example of the differential spiral inductor of this embodiment. FIG. 3A is a plan view schematically showing a wiring pattern on the semiconductor substrate of the differential spiral inductor of the present embodiment. FIGS. 3B and 3C are respectively the same as FIG. It is the II sectional view taken on the line of (A), and the II-II sectional view. Here, the differential spiral inductor 30 is provided with a center tap for connecting the point C to the outside with respect to the differential spiral inductor 10 shown in FIGS. 1 (A) to 1 (C). Absent. When the point C is used without being connected to the outside, the center tap is not necessary. Therefore, the differential spiral inductor 30 used for such a purpose includes the wiring patterns 182, 184, FIG. The via holes 180-1 and 180-2 are not provided.

  Thus, according to the differential spiral inductor 30 of the present embodiment, the parasitic capacitance between the cross wirings 122, 124, 142, 144 and the wiring pattern 184 is mainly reduced by not providing the center tap. can do. Therefore, according to the differential spiral inductor 30 of the present embodiment, the Q value is further improved and the energy loss is reduced as compared with the differential spiral inductor 10 described with reference to FIGS. 1 (A) to 1 (C). It becomes small and can reduce power consumption.

  The differential spiral inductor 30 is the same as that of the differential spiral inductor 10 except that the center tap is not provided, and therefore the same number as that of FIGS. 1A to 1C. The description is omitted.

2. Integrated Circuit Device FIG. 4 is a block diagram of a communication controller that is an example of the integrated circuit device of the present embodiment.

  The communication controller 600 is connected to the antenna 310 via a band pass filter (BPF) 320 and an impedance matching circuit 330.

  A reception signal received by the antenna 310 is input to the BPF 320. The BPF 320 is a filter that passes a signal in a predetermined band. Therefore, the BPF 320 removes an interference signal having a frequency component in the non-pass band.

  The impedance matching circuit 330 performs impedance matching so as to match the characteristic impedance in order to prevent signal reflection. The received signal including the desired signal that has passed through the BPF 320 is supplied to the communication controller 600 via the impedance matching circuit 330.

  The transmission signal is transmitted from the antenna 310 after the interference signal having the frequency component of the non-pass band is removed by the BPF 320 via the impedance matching circuit 330.

  In addition, when the frequency of the radio signal is taken into consideration and the wavelength becomes long and it is difficult to integrate the antenna 310, it is desirable to provide the antenna 310 outside the communication controller 600 as shown in FIG. However, it is a matter of course that the antenna 310 may be built in the communication controller 600.

  Similarly, when the area of the inductance element and the capacitor element constituting the BPF 320 is increased in order to sufficiently increase the attenuation of the non-pass band, the BPF 320 is provided outside the communication controller 600 as shown in FIG. It is desirable. However, it is natural that the BPF 320 may be built in the communication controller 600.

  Further, when it is necessary to adjust impedance matching with an external inductance element and capacitor element, it is desirable to provide an impedance matching circuit 330 outside the communication controller 600 as shown in FIG. However, as a matter of course, the impedance matching circuit 330 may be built in the communication controller 600.

  The communication controller 600 includes a low noise amplifier (LNA) 410 for amplifying a reception signal and a power amplifier (PA) 402 for amplifying a transmission signal corresponding to transmission data. For this reason, the communication controller 600 includes a changeover switch RF_SW. Therefore, at the time of reception, the changeover switch RF_SW supplies the reception signal to the LNA 410, and at the time of transmission, the changeover switch RF_SW supplies the transmission signal amplified by the PA 402 to the impedance matching circuit 330.

The received signal amplified by the LNA 410 is supplied to a mixer 420. The mixer 420 receives the local oscillation signal L ₀ having a predetermined frequency from the frequency divider 422, and converts the frequency of the received signal from the LNA 410 to the vicinity of the intermediate frequency. The BPF 424 passes the reception signal converted to the vicinity of the intermediate frequency by the mixer 420.

  The received signal that has passed through the BPF 424 is amplified by a limiter amplifier 426 and the amplitude is limited to a given level. The signal amplified by the limiter amplifier 426 is supplied to the FM detection circuit 430 and the A / D converter 428, and the A / D converter 428 outputs an RSSI (Received Signal Strength Indicator).

  From the demodulated signal generated by the FM detection circuit 430, high frequency component noise is removed by a low pass filter (LPF) 432, and then binarized reception data is generated by a data slicer 434. . This received data is supplied to the baseband engine 500 as a demodulated signal.

  The RSSI generated by the A / D converter 428 is supplied to the baseband engine 500 by the control circuit 440. The control circuit 440 controls each part of the communication controller 600.

  A PLL (Phased Locked Loop) circuit 444 converges to a target frequency according to the characteristics of the PLL loop filter based on the set value of the control circuit 440. When the frequency matches the set value after convergence, the clock CLK, which is the oscillation output of the crystal oscillator OSC, is multiplied by a corresponding multiplication factor, and the multiplied clock is supplied to a voltage controlled oscillator (VCO) 446. To do. The clock CLK is supplied as a reference clock for the baseband engine 500.

  The output of the VCO 446 is demultiplexed by the demultiplexer 445, and the output is used as a local oscillation signal output at the time of reception or a transmission signal output at the time of transmission, and further used for frequency division of the PLL loop. For frequency division of the PLL loop, it is output to the frequency divider 422, and the frequency divider 422 divides the frequency to substantially the same frequency as that of the crystal oscillator OSC, and the frequency and phase are compared by a comparator (not shown). A voltage is finally generated according to the comparison result to control the frequency of the VCO. The transmission data from the baseband engine 500 is subjected to FM modulation in the VCO 446 after the high frequency component is removed by the LPF 448 and output as a transmission signal via the duplexer 445. This transmission signal is amplified by the PA 402 and supplied to the changeover switch RF_SW. The changeover switch RF_SW performs a changeover operation according to a control signal from the control circuit 440. The transmission signal output from the demultiplexer 445 can reduce out-of-band radiation by the BPF 320, but can also incorporate a BPF if necessary. After removing radiation outside a predetermined frequency band through a BPF (not shown), it may be amplified by the PA 402.

  The bias generation circuit 450 generates a constant current or a constant voltage, and supplies it to each part constituting the communication controller 600.

  In such a communication controller 400, each unit of the RXfront unit 460, the RX unit 462, the PLL circuit 444, and the TX unit 464 shifts to a standby operation by a start signal from the baseband engine 300, or starts from the standby operation. You can do it. Here, the standby operation is an operation for reducing current consumption by stopping a clock or cutting off power supply to a circuit.

  The RXfront unit 460 includes an LNA 410, a mixer 420, a BPF 424, a limiter amplifier 426, and an A / D converter 428, and a start signal RXfrontcnt performs start-up control from the stand-by operation. The RX unit 462 includes an RXfront unit 460, an FM detection circuit 430, an LPF 432, and a data slicer 434, and a transition to a standby operation and activation control from the standby operation are performed by an activation signal RXtcnt. The PLL circuit 444 performs transition to standby operation and activation control from the standby operation by the activation signal PLLcnt. The TX unit 464 includes a PA 402, a duplexer 445, and an LPF 448, and the transition to the standby operation and the activation control from the standby operation are performed by the activation signal Txcnt.

  Here, the VCO 446 can be realized by a circuit having a configuration as shown in FIG. 6A including the differential spiral inductor of the present embodiment. Further, the PA 402 and the LNA 410 can be realized by a circuit having a configuration as shown in FIG. 6B including the differential spiral inductor of the present embodiment.

  By incorporating the differential spiral inductor of this embodiment into the integrated circuit device of FIG. 4, it is possible to provide an integrated circuit device with higher performance than the conventional one.

3. Electronic Device FIG. 5 is a block diagram of a communication device that is an example of the electronic device of this embodiment.

  The communication device 700 (master terminal) performs wireless communication according to a predetermined standard with a slave terminal that is a communication partner via the communication controller 600 (integrated circuit device) and the antenna 310. The antenna 310 functions as a data input unit to be processed by the communication controller 600 (integrated circuit device). The host processor 810 (baseband engine 500) determines the order of changing the plurality of usable bands in the communication frequency band and the hop sequence in each usable band. The communication controller 600 that has received an instruction from the host processor 810 (baseband engine 500) performs wireless communication with the slave terminal.

  In addition to the communication controller 600 and the baseband engine 500, the communication device 700 includes a host processor (application processor) 810 that controls each unit.

  The host processor 810 controls each unit of the communication device 700 based on a program and setting data stored in a read only memory (ROM) 820 and a random access memory (RAM) 830. The host processor 810 can use at least a part of the storage area of the RAM 830 as a work area.

  An audio codec 860 is connected to the host processor 810. The audio codec 860 decodes the audio data received via the communication controller 600, converts it into an analog signal by the D / A converter 870, and then outputs the audio through the speaker 880 (output unit in a broad sense). Can do. The speaker 880 functions as output means for outputting data processed by the communication controller 600 (integrated circuit device). Alternatively, the audio codec 860 converts the audio signal input via the microphone 890 (input unit in a broad sense) into a digital signal by the A / D converter 900, performs encoding, and then performs the communication via the communication controller 600. It can be sent to the other party.

  By incorporating the integrated circuit device of this embodiment into the electronic device of FIG. 5, an electronic device with high cost performance can be provided.

  In addition to the one shown in FIG. 5, various electronic devices such as a portable information terminal and a car navigation device can be considered as electronic devices that can use this embodiment.

  In addition, this invention is not limited to this embodiment, A various deformation | transformation implementation is possible within the range of the summary of this invention.

  For example, in the differential spiral inductors according to the first to third embodiments, the non-crossing wiring and the crossing wiring are formed in any kind and any number of wiring layers that can be used according to the kind of the manufacturing process. be able to.

  In the differential spiral inductors of the first to third embodiments, there are four intersections, but the present invention is not limited to this.

  For example, the conductive wiring of the differential spiral inductor may be formed in a polysilicon wiring layer or a metal 1 wiring layer. When the conductive wiring is formed in a wiring layer close to the semiconductor substrate such as a polysilicon wiring layer or a metal 1 wiring layer, the parasitic capacitance between the conductive wiring and the semiconductor substrate increases. Depending on the operating frequency, the magnitude of the parasitic capacitance hardly affects the Q value of the differential spiral inductor. Therefore, depending on the frequency at which the differential circuit is operated, the Q value can be increased even if the conductive wiring is generated in the polysilicon wiring layer or the metal 1 wiring layer, so that power consumption can be reduced.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

FIG. 1A to FIG. 1C are diagrams for explaining a first example of the differential spiral inductor of the present embodiment. FIG. 2A to FIG. 2C are diagrams for explaining a second example of the differential spiral inductor of the present embodiment. 3A to 3C are diagrams for explaining a third example of the differential spiral inductor of the present embodiment. 1 is an example of a block diagram of an integrated circuit device of an embodiment. 1 is an example of a block diagram of an electronic device including an integrated circuit device. 6A and 6B are diagrams illustrating examples of circuits using a differential spiral inductor, and FIG. 6C is a diagram illustrating an equivalent circuit of the differential spiral inductor. FIG. 7A to FIG. 7C are diagrams for explaining a conventional differential spiral inductor.

Explanation of symbols

10 differential spiral inductors, 12 terminals, 14 terminals, 16 symmetrical lines, 20 differential spiral inductors, 30 differential spiral inductors, 100 conductive wiring, 102 non-crossing wiring, 104 non-crossing wiring, 106 non-crossing wiring , 108 Non-crossing wiring, 110 Non-crossing wiring, 112 Non-crossing wiring, 114 Non-crossing wiring, 116 Non-crossing wiring, 118 Non-crossing wiring, 120 Crossing wiring, 122 Crossing wiring, 124 Crossing wiring, 130 Crossing wiring, 132 Crossing wiring , 134 cross wiring, 140 cross section, 142 cross wiring, 144 cross wiring, 150 cross section, 152 cross wiring, 154 cross wiring, 160 via hole, 162 wiring connection section, 164 wiring connection section, 166 wiring connection section, 168 wiring connection Part, 172 wiring connection part, 174 wiring connection part, 1 76 wiring connection part, 178 wiring connection part, 180 via hole, 182 wiring pattern, 184 wiring pattern, 200 conductive wiring, 202 wiring connection part, 204 wiring connection part, 206 wiring connection part, 208 wiring connection part, 212 wiring connection part , 214 Wiring connection portion, 216 Wiring connection portion, 218 Wiring connection portion, 310 Antenna, 320 Band pass filter (BPF), 330 Impedance matching circuit, 402 Power amplifier (PA), 410 Low noise amplifier (LNA), 420 Mixer 422 frequency divider, 424 BPF, 426 limiter amplifier, 428 A / D converter, 430 FM detector circuit, 432 low-pass filter (LPF), 434 data slicer, 440 control circuit, 444 PLL circuit, 445 duplexer 446 Voltage controlled oscillator (VC ) 448 low pass filter (LPF), 450 bias generation circuit, 460 RXfront section, 462 RX section, 464 TX section, 500 baseband engine, 600 communication controller (integrated circuit apparatus), 700 communication apparatus, 810 host processor ( Application processor), 820 read-only memory (ROM), 830 random access memory (RAM), 860 audio codec, 870 D / A converter, 880 speaker, 890 microphone, 900 A / D converter, 1000 differential spiral inductor 1002 Non-crossing wiring, 1004 Non-crossing wiring, 1006 Non-crossing wiring, 1008 Non-crossing wiring, 1010 Non-crossing wiring, 1012 Non-crossing wiring, 1014 Non-crossing wiring, 1016 Non-crossing wiring, 1018 Non-crossing Line, 1020 intersection, 1022 intersection wiring, 1024 intersection wiring, 1030 intersection, 1032 intersection wiring, 1034 intersection wiring, 1040 intersection, 1042 intersection wiring, 1044 intersection wiring, 1050 intersection, 1052 intersection wiring, 1054 intersection wiring, 1060 Via hole, 1062 Wiring connecting portion, 1064 Wiring connecting portion, 1066 Wiring connecting portion, 1068 Wiring connecting portion, 1072 Wiring connecting portion, 1074 Wiring connecting portion, 1076 Wiring connecting portion, 1078 Wiring connecting portion

Claims (8)

A first terminal;
A second terminal in line symmetry with the first terminal with respect to a symmetry line;
Conductive wiring for electrically connecting the first terminal and the second terminal;
A first wiring path of the conductive wiring from the first terminal to a predetermined point on the symmetric line and a second wiring path of the conductive wiring from the second terminal to the predetermined point are First to Nth intersections that intersect the first to Nth (N ≧ 2) on the symmetry line, respectively,
One of the 2n-1 (n ≧ 1) intersection and the 2nth intersection is
The cross wiring of the first wiring path is formed in a first wiring layer and the cross wiring of the second wiring path is formed in a second wiring layer different from the first wiring layer;
The other of the intersection of the 2n-1 and the intersection of the 2n is
A cross wiring of the second wiring path is formed in the first wiring layer and a cross wiring of the first wiring path is formed in the second wiring layer;
The conductive wiring is
A wiring pattern having a line-symmetric shape with respect to the symmetric line is formed in the first wiring layer in a non-intersecting portion other than the first to Nth crossing portions, and each of the crossing wirings is formed in the non-intersecting portion. The width of the non-crossing wiring connected to both ends is different, and both ends of the crossing wiring formed in the second wiring layer are electrically connected to the non-crossing wiring by a conductive member through holes,
The number of the holes connecting both ends of the cross wiring formed in the second wiring layer of the second n-1 crossing portion and the non-crossing wiring; and the second of the second n crossing portions. A differential spiral inductor characterized in that the number of the holes connecting both ends of the cross wiring formed in the wiring layer and the non-cross wiring is equal. In claim 1,
One end of the cross wiring formed in the second wiring layer at any one of the first to Nth crossing portions, including the hole and a wiring pattern formed in the second wiring layer And 2N wiring connection portions respectively connecting the non-crossing wirings,
The number of holes included in the mth (m ≧ 1) wiring connection portion of the first wiring path and the number of holes included in the mth wiring connection portion of the second wiring path Is a differential spiral inductor characterized by equality. In claim 2,
Each of the 2N wiring connections is
The holes are arranged in an array in a first direction and a second direction;
The mth wiring connection part of the first wiring path is:
The number of the holes arranged in the second direction is an integral multiple of the number of the holes arranged in the first direction of the m-th wiring connection portion of the second wiring path. ,
The mth wiring connection part of the second wiring path is:
The number of holes arranged in the second direction is an integral multiple of the number of holes arranged in the first direction of the m-th wiring connection portion of the first wiring path. A differential spiral inductor characterized by that. In claim 2 or 3,
The mth wiring connection part of the second wiring path is:
When arranged by rotating 90 °, the relative arrangement of the plurality of holes matches the relative arrangement of the plurality of holes in the m-th wiring connection portion of the first wiring path. A differential spiral inductor, characterized in that it is formed as follows. In any of claims 2 to 4,
Each of the 2N wiring connections is
The wiring pattern formed in the second wiring layer has a rectangular shape in which the length of the first side is substantially the same as the width of the non-intersecting wiring connected through the hole. Differential type spiral inductor. In claim 5,
The mth wiring connection part of the first wiring path is:
The length of the second side orthogonal to the first side of the wiring pattern formed in the second wiring layer is included in the mth wiring connection part of the second wiring path. Approximately the same length as the first side of the wiring pattern formed in the second wiring layer;
The mth wiring connection part of the second wiring path is:
The length of the second side orthogonal to the first side of the wiring pattern formed in the second wiring layer is included in the mth wiring connection part of the first wiring path. A differential spiral inductor characterized by being substantially the same as the length of the first side of the wiring pattern formed in the second wiring layer.   An integrated circuit device comprising the differential spiral inductor according to claim 1. An integrated circuit device according to claim 7;
Data input means to be processed by the integrated circuit device;
And an output means for outputting data processed by the integrated circuit device.

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