JP2010010243A - Optical fiber radiation mechanism - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To exert a heat conduction characteristic of a metal substrate as much as possible in an optical fiber radiation mechanism formed of the metal substrate and an optical fiber. <P>SOLUTION: Molecular adhesive layers which are chemically coupled to the metal substrate and the optical fiber are installed on both surfaces. An electroless metal plating layer where metals not inferior in thermal conductivity as compared with the metal substrate are chemically coupled is formed on the surface of each molecular adhesive layers. The electroless metal plating layer is laminated on the surface of the electroless metal plating layer in the optical fiber radiation mechanism. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heat dissipation mechanism for an optical fiber used in a fiber type laser or a fiber type optical amplifier.

As a heat dissipation means for an optical fiber, a Peltier element, a cooling means using cold air or cold water is generally used. Furthermore, as a simple means to replace such a special cooling means, a heat dissipation mechanism has been proposed in which an optical fiber is sandwiched between two metal plates and a thermally conductive grease is filled between the metals (for example, Patent Document 1). reference.).

However, the thermal conductivity of the grease is naturally limited, and there is nothing comparable to the thermal conductivity of the metal plate. Therefore, since the heat dissipation characteristics of the entire heat dissipation mechanism are governed by the thermal conductivity of the grease, there is a disadvantage that the high thermal conductivity characteristics of the metal plate cannot be fully utilized.

JP 2001-274489 A

An object of the present invention is to maximize the heat conduction characteristics of a metal base material in an optical fiber heat dissipation mechanism comprising a metal base material and an optical fiber.

The inventor has conceived that the metal substrate and the optical fiber are fixed integrally with a metal plating layer that is inferior in terms of thermal conductivity as compared with the above metal substrate, and results of further investigation The present invention has been reached.

According to the present invention, in a heat dissipation mechanism in which an optical fiber is placed in contact with a thermally conductive metal substrate, (a) the surface of the metal substrate and the optical fiber is covered with a molecular adhesive layer chemically bonded to both. (B) an electroless metal plating layer chemically bonded thereto is formed on the surface of the molecular adhesive layer; and (c) an electrolytic metal plating layer is placed on the surface of the electroless metal plating layer. An optical fiber heat dissipating mechanism is provided.

In the optical fiber heat dissipation mechanism of the present invention, the metal substrate and the optical fiber are covered with a molecular adhesive layer chemically bonded thereto, and an electroless plating layer chemically bonded to the adhesive layer, and It is coated (overcoated) with an electrolytic metal plating layer placed on the electroless plating layer. That is, the optical fiber, the metal base material, and the metal plating layer form a three-piece integrated adhesion structure. As a result, the heat generated when the optical fiber generates heat is instantaneously transferred from the nano-order molecular adhesive layer to the metal substrate with excellent heat dissipation characteristics, so the heat dissipation characteristics of the entire heat dissipation mechanism are greatly improved. .

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic cross-sectional view showing the basic structure of the optical fiber heat dissipation mechanism of the present invention.
FIG. 2 is a perspective view showing an example of a contact arrangement body of a metal substrate and an optical fiber.
FIG. 3 is a schematic perspective view of a heat dissipation mechanism formed by coating the contact arrangement body of FIG. 2 in the order of a molecular adhesive layer, an electroless plating layer, and an electrolytic metal plating layer.

In FIG. 1, 1 is a contact arrangement body (hereinafter referred to as “contact arrangement body”) between a metal substrate 2 and an optical fiber 3, 4 is a molecular adhesive layer, 5 is an electroless metal plating layer, and 6 is an electrolytic metal. It is a plating layer. Here, what is characteristic is that a molecular adhesive layer 4 chemically bonded to each other is interposed between the contact arrangement body 1 and the electroless metal plating layer 4.

2 to 3 show an example in which the basic principle of the heat dissipation structure is applied to an actual heat dissipation product. In FIG. 2, an optical fiber 3 is spirally arranged on the outer periphery of a hollow cylindrical metal base material 2 to form a contact arrangement body 1. As an advantage of this contact arrangement body, it is possible to efficiently arrange an optical fiber 3 of a certain length required at the time of amplification of laser light, and coupled with the fact that the metal substrate 2 is a hollow cylindrical body, Increase and space saving. 3 shows a state in which the molecular adhesive layer 4, the electroless plating layer 5, and the electrolytic metal plating layer 6 are overcoated on the outer surface of the contact arrangement body 1 shown in FIG.

Furthermore, the present invention will be described.

As the metal substrate 2, one having a high thermal conductivity around room temperature is used. Specific examples include silver, copper, gold, and aluminum. In consideration of heat resistance, weather resistance, and heat dissipation, copper and aluminum are preferably used. At this time, by using a metal having a thermal conductivity of 200 W / m · K as the constituent metal of the metal base 2 and the metal plating layers 5 and 6, the heat dissipation effect is remarkably improved.

As the optical fiber 2, a common glass fiber may be used.

Typical examples of the molecular adhesive constituting the molecular adhesive layer 4 include those having an alkoxy group and a triazine dithiol group. The alkoxy group of this molecular adhesive is ether-bonded to the OH group generated on the surface of the contact arrangement body 1, while the triazine dithiol group is ionically bonded to the electroless metal plating catalyst supported on the molecular adhesive layer 4 To do. Then, the electroless plating layer 5 is deposited on the ion-bonded catalyst. In this way, the molecular adhesive layer 4 is interposed in a form that is chemically bonded to both the contact arrangement body 1 and the electroless plating layer 5. Moreover, the molecular adhesive itself has the ability to form an ultrathin film of 10 nm or less. Therefore, there is an advantage that the heat generated in the optical fiber 2 is instantaneously transferred to the metal substrate 2 through the ultrathin film.

Below, an example of the structure of the molecular adhesive agent which has an alkoxy group and a triazine dithiol group is shown by General formula (1).

（１）

(1)

In the general formula (1), R ₁ is a residue such as H— or C ₂ H ₅ —, nC ₃ H ₇ —, CH ₂ ═CHCH ₂ —, and R ₂ is —CH ₂ CH ₂ —, —CH. ₂ CH ₂ CH ₂ —, —CH ₂ CH ₂ SCH ₂ CH ₂ —, —CH ₂ CH ₂ NHCH ₂ CH ₂ CH ₂ —, — (CH ₂ CH ₂ ) ₂ NCH ₂ CH ₂ CH ₂ —, —C _{6 H 4 -, - C 6 H} 4 C 6 H 4 -, - CH 2 CH 2 OCONHCH 2 CH 2 CH 2 - residue, such as, Y is _{CH 3 O-, C 2 H 5} O-, n-C 3 residue, such as H ₇ O-, n is an integer of 1 to 3, and, M is H or Li, Na, metal substrates, such as Ce, and the like.

The molecular adhesive itself described above is described in Journal of the Japan Adhesion Society, Vol. 43 No. 6 is introduced as an adhesive for metal, plastic and ceramic materials. However, in this document, the multifunctional and selective reactivity of these compounds is applied to a contact arrangement body of a metal substrate and an optical fiber having completely different plating characteristics, and the optical fiber is coated with the metal substrate and the metal plating. The concept of sealing between layers is not shown.

The heat dissipation mechanism of the present invention is preferably formed through the following steps A to E.
A. A step of forming a contact arrangement body 1 having a desired shape.
B. Step of generating OH groups over the entire surface of the obtained contact arrangement 1 The OH group contact arrangement 1 is overcoated (eg, immersed) with a solution of a molecular adhesive having an alkoxy group and a triazine dithiol group, and then the OH group and the alkoxy group of the molecular adhesive are reacted. An ether bond step,
D. A step of supporting an electroless metal plating catalyst on the surface of the molecular adhesive layer 4 generated after the ether reaction, and ion-bonding the catalyst with an SH group of the molecular adhesive layer 4;
E. Depositing the electroless plating layer 5 on the ion-bonded catalyst; and
F. A step of placing an electrolytic metal plating layer 6 on the deposited electroless metal plating layer 5;

In the process A, the contact arrangement body 1 of the metal substrate 2 and the optical fiber 3 is formed into a desired shape. In step B, the contact arrangement body 1 is subjected to well-known corona discharge, tetraetch treatment, and SA treatment to generate surface OH groups.

In step C, the molecular adhesive layer 4 is formed. For this purpose, the surface arrangement OH-grouped contact arrangement body 1 is immersed in a solution of a molecular adhesive having an alkoxy group and a triazinedithiol group. Thereafter, the OH group and the alkoxy group of the molecular adhesive are heated and reacted to form an ether bond. At this time, the alkoxy group is hydrolyzed, and then an ether bond is generated by a dehydration condensation reaction with the surface OH group, and a strong adhesive interface is formed between the contact arrangement body 1 and the molecular adhesive layer 4. As a reaction mode, it is effective to immerse the contact arrangement body 1 in a molecular adhesive solution at 15 ° C. to 90 ° C. for about 1 second to 15 minutes and then to heat at 50 ° C. to 240 ° C. for about 30 seconds to 60 minutes. It is.

The molecular adhesive solution is water, alcohols such as methanol and ethanol, ketones such as acetone and methyl ethyl ketone, esters such as ethyl acetate and ethyl benzoate, ethers such as dibutyl ether and anisole, benzene, It can be obtained using a single or mixed solvent of aromatic hydrocarbons such as toluene. The concentration of the molecular adhesive at this time may be adjusted in the range of 0.01 wt% to 1 wt%. Further, as means for overcoating such a solution, there are dipping, spray coating, padding and the like.

In step D, an electroless metal plating catalyst is supported on the molecular adhesive layer 4. For this purpose, the contact arrangement body 1 having undergone the step C may be immersed in an aqueous solution of a plating catalyst such as a palladium salt, a platinum salt, a silver salt, tin chloride, or an amine complex. The catalyst concentration varies somewhat depending on the type of the catalyst, but generally it may be in the range of 0.5 wt% to 5 wt%. The immersion conditions may be 15 ° C to 70 ° C for about 30 seconds to 60 minutes. During the dipping process, the plating catalyst is ionically bonded to the SH group of the molecular adhesive.

In the process E, the contact arrangement body 1 that has undergone the process D is immersed in an electroless plating bath to deposit the electroless metal plating layer 4 on the catalyst ionically bonded to the SH group of the molecular adhesive layer 4. At this point, the molecular adhesive layer 4 interposed between the contact arrangement body 1 and the electroless metal plating layer 5 is in a form in which both are chemically bonded to each other. The electroless plating bath may be any bath commonly used in this field. The electroless metal plating layer 5 is particularly preferably a copper plating layer having a film thickness of 0.02 μm to 3 μm.

In the final stage F, the electrolytic metal plating layer 6 is placed on the outer surface of the electroless metal plating layer 5 to obtain the heat dissipation mechanism of the present invention. When this electrolytic metal plating layer 6 is formed, a normal plating prescription such as copper sulfate electroplating or copper cyanide electroplating may be employed. The electrolytic metal plating layer 6 is particularly preferably a copper plating layer having a thickness of 0.5 μm to 30 μm.

The following is an example of manufacturing the optical fiber heat dissipation mechanism of FIG.

First, an active optical fiber 3 having a wire diameter of 0.5 mm is wound around the outer surface of a copper hollow cylindrical body (metal substrate) 2 having a length of 10 cm, an outer diameter of 10 cm, and an inner diameter of 8 cm at a pitch of 0.5 mm. The contact arrangement body 1 of the optical fiber-metal base material was obtained by spirally winding with 30 winding times. At that time, both ends of the wound optical fiber were fixed with a holding jig (step A). Next, the contact arrangement body 1 was subjected to corona treatment twice at the entire circumference and the entire surface at a speed of 1 cm / sec to OH-base the surface (Step B).

The OH-based contact arrangement 1 is immersed in a 0.1 g / L ethanol solution of a molecular adhesive at 25 ° C. for 10 minutes, and then heated at 70 ° C. for 30 minutes. The reactive molecular adhesive was washed and removed (step C). Here, the structure of the molecular adhesive used in the general formula (1) is as follows: R ₁ = −H, R ₂ = —CH ₂ CH ₂ CH ₂ —, Y = C ₂ H ₅ O—, M = —H. , And n = 3.

Next, the contact arrangement body 1 that has undergone the process C is immersed in a catalyst treatment solution containing palladium chloride (electroless metal plating catalyst) at a concentration of 0.03 wt% for 3 minutes at 32 ° C., and the molecular adhesive layer 4 The catalyst was supported on. Thereafter, the contact arrangement body 1 carrying the catalyst was taken out from the catalyst treatment liquid and washed with a 0.97 wt% hydrogen fluoride aqueous solution (step D).

Furthermore, the contact arrangement body 1 which passed through the process D was immersed in the electroless plating tank for 30 minutes. In this case, a copper sulfate aqueous solution having a copper sulfate concentration of 7.7 g / L, a reducing agent amount of 2.15 g / L, a sodium hydroxide concentration of 5.7 g / L, and an aqueous solution pH of 12.5 was put into the plating tank. The temperature was set at 36 ° C. The contact arrangement body 1 covered with the electroless metal plating layer 5 was taken out of the plating tank, dried and solidified. The film thickness of the electroless metal plating layer 5 at this time was 0.5 μm (step E). At this point, the molecular adhesive material functions as a molecular adhesive layer 4 that is interposed between the optical fiber / metal substrate-electroless metal plating layer 5 and chemically bonds them both ways.

In the final stage F, the contact arrangement body 1 that had undergone the process E was immersed in a 70 g / L copper sulfate aqueous solution, and was subjected to electrolytic plating under the conditions of a current density of 3.0 A / dm 2 and an energization time of 60 minutes. At this time, an electrolytic metal plating layer 6 having a thickness of 30 μm was formed on the outer surface of the electroless metal plating layer 5 (step F).

When the heat dissipation characteristics of the optical fiber heat dissipation mechanism obtained in this way were tested, the heat dissipation characteristics of the heat dissipation mechanism according to this example exhibited a thermal conductivity of 200 W / m · K or more, and sufficient heat dissipation characteristics at room temperature. It can be seen that is secured.

The test conditions for the heat dissipation characteristics are as follows.

The above examples are merely examples of the present invention, and it goes without saying that various modifications and applications are possible within the scope of the idea of the present invention. For example, it goes without saying that the optical fiber heat dissipation mechanism of the present invention is provided with various modifications corresponding to the shape according to the installation space.

Further, in the hollow cylindrical body 2 of FIG. 2, the optical fiber 3 may be disposed on the inner surface thereof. In this case, since the repulsive force of the wound optical fiber 3 is absorbed by the inner surface, the handleability is improved. In addition, since a separate heat dissipating fin is easily provided on the outer peripheral surface of the hollow cylindrical body 2, it is possible to enhance the heat dissipating effect at high temperatures. Furthermore, it is also useful to provide guide grooves for securing the winding circuit of the optical fiber 3 not only on the inner and outer surfaces of the hollow cylindrical body 2 but also on the surface of the other rod-shaped metal substrate.

Sectional drawing which shows the basic structure of the optical fiber thermal radiation mechanism of this invention. The perspective view which shows an example of the contact arrangement body of a metal base material and an optical fiber. The perspective view of the thermal radiation mechanism formed by coat | covering the contact arrangement body of FIG. 2 in order of the molecular adhesive layer, the electroless plating layer, and the electrolytic metal plating layer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Contact arrangement body of metal base material and optical fiber 2 Metal base material 3 Optical fiber 4 Molecular adhesive layer 5 Electroless metal plating layer 6 Electrolytic metal plating layer

Claims (6)

In a heat dissipation mechanism in which an optical fiber is placed in contact with a metal substrate,
(A) The surface of the metal substrate and the optical fiber is coated with a molecular adhesive layer chemically bonded to both,
(B) On the surface of the molecular adhesive layer, an electroless metal plating layer chemically bonded thereto is formed;
(C) An optical fiber heat dissipation mechanism, wherein an electrolytic metal plating layer is placed on the surface of the electroless metal plating layer. The optical fiber heat radiation mechanism according to claim 1, wherein the metal substrate is a rod-shaped body. The optical fiber heat radiation mechanism according to claim 2, wherein the rod-shaped body is a hollow cylindrical body. The optical fiber heat dissipating mechanism according to claim 3, wherein the optical fiber is spirally disposed on an outer peripheral surface or an inner peripheral surface of the hollow cylindrical body. The optical fiber heat dissipation mechanism according to any one of claims 1 to 4, wherein the molecular adhesive layer is made of a molecular adhesive having an alkoxy group and a triazine dithiol group. The alkoxy group is ether-bonded to the OH group generated on the metal substrate and the optical fiber surface, while the triazine dithiol group is ion-bonded to the electroless metal plating catalyst supported on the molecular adhesive layer. The optical fiber heat dissipation mechanism according to claim 1.

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