JP2010001542A - Film deposition method and film deposition apparatus - Google Patents

Film deposition method and film deposition apparatus Download PDF

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JP2010001542A
JP2010001542A JP2008162373A JP2008162373A JP2010001542A JP 2010001542 A JP2010001542 A JP 2010001542A JP 2008162373 A JP2008162373 A JP 2008162373A JP 2008162373 A JP2008162373 A JP 2008162373A JP 2010001542 A JP2010001542 A JP 2010001542A
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film
vacuum
polymer film
plasma
processing tank
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JP5235104B2 (en
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Yosuke Kobayashi
洋介 小林
Nobuhiro Hayashi
信博 林
Masayuki Iijima
正行 飯島
Isao Tada
勲 多田
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Ulvac Inc
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Ulvac Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a reflection film deposition technology by which the adhesion of a metal thin film for a reflection film to the surface of a resin can be improved. <P>SOLUTION: The reflection film deposition technology includes: a buffer polymer film deposition process (P2) for depositing a buffer polymer film on a resin surface for film deposition of an article to be film-deposited in vacuum; a plasma treatment process (P4) for treating the surface of the buffer polymer film with a plasma in vacuum; and a reflection film deposition process (P6) for depositing a light reflective metal thin film on the buffer polymer film subjected to the plasma treatment by vacuum vapor deposition. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、真空中で蒸着によって成膜を行う技術に関し、特に、自動車ヘッドライト用反射鏡に用いる反射膜の成膜技術に関する。   The present invention relates to a technique for forming a film by vapor deposition in a vacuum, and more particularly to a technique for forming a reflective film used for a reflector for an automobile headlight.

従来、この種の反射鏡の成型樹脂上にアルミニウム等の金属薄膜を形成する場合には、表面の平滑性や金属薄膜との間の密着性を向上させるため、樹脂上に、湿式前処理で有機溶剤を用いたアンダーコート層を形成するようにしている。
ところで、近年では、環境負荷物質となる有機溶剤の使用を避ける風潮があり、このための代替手段として、アンダーコート層を形成しないポリカーボネート樹脂表面にプラズマ処理(ボンバード処理)を行い、樹脂表面に直接アルミニウム薄膜を形成することも提案されている。
Conventionally, when a metal thin film such as aluminum is formed on a molding resin of this kind of reflecting mirror, in order to improve the smoothness of the surface and the adhesion between the metal thin film, a wet pretreatment is performed on the resin. An undercoat layer using an organic solvent is formed.
By the way, in recent years, there is a trend to avoid the use of organic solvents that are environmentally hazardous substances. As an alternative to this, plasma treatment (bombarding) is performed directly on the surface of the polycarbonate resin without forming an undercoat layer. It has also been proposed to form an aluminum thin film.

しかし、このような処理を行ったポリカーボネート樹脂の表面に金属薄膜を形成した場合、ポリカーボネート樹脂と金属薄膜との間の密着性が低いという問題があり、これを解決する手段が要望されている。
なお、樹脂上に形成された金属薄膜の密着性を向上させるための先行技術としては、例えば、特許文献1に示されたものが知られている。
特開2004−299372号公報
However, when a metal thin film is formed on the surface of a polycarbonate resin subjected to such treatment, there is a problem that the adhesion between the polycarbonate resin and the metal thin film is low, and means for solving this problem is desired.
In addition, what was shown by patent document 1 is known as a prior art for improving the adhesiveness of the metal thin film formed on resin, for example.
JP 2004-299372 A

本発明は、このような従来の技術の課題を解決するためになされたもので、その目的とするところは、樹脂表面と反射膜用の金属薄膜の密着性を向上させることができる反射膜形成技術を提供することにある。   The present invention has been made in order to solve the problems of the conventional technique, and the object of the present invention is to form a reflective film that can improve the adhesion between the resin surface and the metal thin film for the reflective film. To provide technology.

本発明者等は上記課題を解決すべく鋭意努力を重ねた結果、湿式前処理用のアンダーコート層を形成することなく樹脂表面に対して高密着性の金属薄膜を形成しうることを見出し、本発明を完成するに到った。   As a result of intensive efforts to solve the above problems, the present inventors have found that a metal thin film having high adhesion to the resin surface can be formed without forming an undercoat layer for wet pretreatment, The present invention has been completed.

かかる知見に基づいてなされた本発明は、成膜対象物の樹脂からなる成膜面上に真空中で緩衝用重合体膜を形成する緩衝用重合体膜形成工程と、前記緩衝用重合体膜上に真空中でプラズマによる処理を施すプラズマ処理工程と、当該プラズマ処理された前記緩衝用重合体膜上に、真空蒸着によって光反射性の金属薄膜を形成する反射膜形成工程とを有する成膜方法である。
本発明では、前記成膜対象物の成膜面が、ポリカーボネート樹脂からなる場合にも効果的である。
本発明では、前記光反射性の金属薄膜がアルミニウムからなる場合にも効果的である。
本発明では、前記成膜対象物が、反射鏡を構成する立体的な部材である場合にも効果的である。
また、本発明は、成膜対象物を収容可能な真空処理槽と、前記真空処理槽に接続され、処理ガスを導入する処理ガス導入部と、前記真空処理槽に接続され、緩衝用重合体膜形成用のモノマーを導入するモノマー導入部と、前記真空処理槽内に設けられた蒸発源と、前記真空処理槽内に設けられたプラズマ発生源と、前記真空処理槽内において、前記成膜対象物の成膜面上に緩衝用重合体膜を形成し、当該緩衝用重合体膜上にプラズマによる処理を施し、当該プラズマ処理された緩衝用重合体膜上に、真空蒸着によって光反射性の金属薄膜を形成するように制御する制御手段とを有する成膜装置である。
The present invention made on the basis of such knowledge includes a buffering polymer film forming step for forming a buffering polymer film in a vacuum on a film forming surface made of a resin as a film forming target, and the buffering polymer film. A film forming process comprising: a plasma processing step of performing a plasma treatment in a vacuum; and a reflective film forming step of forming a light-reflective metal thin film by vacuum deposition on the plasma-treated polymer film for plasma treatment Is the method.
The present invention is also effective when the film formation surface of the film formation object is made of polycarbonate resin.
The present invention is also effective when the light-reflective metal thin film is made of aluminum.
In this invention, it is effective also when the said film-forming target object is a three-dimensional member which comprises a reflective mirror.
In addition, the present invention provides a vacuum processing tank capable of accommodating a film formation target, a processing gas introduction unit that is connected to the vacuum processing tank and introduces a processing gas, and is connected to the vacuum processing tank and is a buffer polymer. A monomer introduction part for introducing a monomer for film formation, an evaporation source provided in the vacuum processing tank, a plasma generation source provided in the vacuum processing tank, and the film formation in the vacuum processing tank A buffer polymer film is formed on the film-forming surface of the object, a plasma treatment is performed on the buffer polymer film, and the plasma-treated buffer polymer film is light-reflective by vacuum deposition. And a control means for controlling to form a metal thin film.

本発明の場合、成膜対象物の樹脂からなる成膜面上に真空中で緩衝用重合体膜を形成し、この緩衝用重合体膜上に真空中でプラズマ処理を施した後に真空蒸着によって光反射性の金属薄膜を形成することにより、プラズマ処理によって緩衝用重合体膜の表面が荒れ、金属薄膜へのアンカー効果を呈するため、樹脂(特にポリカーボネート樹脂)と金属薄膜(特にアルミニウム薄膜)との密着性を向上させることができる。   In the case of the present invention, a buffer polymer film is formed in a vacuum on a film-forming surface made of a resin as a film formation target, and plasma treatment is performed on the buffer polymer film in a vacuum, followed by vacuum deposition. By forming a light-reflective metal thin film, the surface of the buffer polymer film is roughened by the plasma treatment and exhibits an anchoring effect on the metal thin film. Therefore, a resin (especially polycarbonate resin) and a metal thin film (especially an aluminum thin film) It is possible to improve the adhesion.

その結果、本発明によれば、環境負荷物質となる有機溶剤を使用することなく、樹脂表面に金属薄膜を容易に形成することができる。
また、本発明によれば、構成の簡素化及びコストダウンが可能な反射膜用成膜装置を提供することができる。
As a result, according to the present invention, a metal thin film can be easily formed on the resin surface without using an organic solvent that is an environmentally hazardous substance.
Further, according to the present invention, it is possible to provide a film forming apparatus for a reflective film that can be simplified in structure and reduced in cost.

本発明によれば、湿式前処理用のアンダーコート層を形成することなく樹脂表面に対して高密着性の金属薄膜を形成することができる。   According to the present invention, a metal thin film having high adhesion to the resin surface can be formed without forming an undercoat layer for wet pretreatment.

以下、本発明の好ましい実施の形態を図面を参照して詳細に説明する。
図1は、本実施の形態の成膜装置の内部構成を示す断面図である。
図1に示すように、本実施の形態の成膜装置1は、図示しない真空排気系に接続された真空処理槽2を有している。
この真空処理槽2は、それぞれ真空処理槽2の外部に設けられた処理ガス導入部3とモノマー導入部4が接続されている。
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view showing the internal configuration of the film forming apparatus of the present embodiment.
As shown in FIG. 1, the film forming apparatus 1 of the present embodiment has a vacuum processing tank 2 connected to a vacuum exhaust system (not shown).
In this vacuum processing tank 2, a processing gas introduction part 3 and a monomer introduction part 4 provided outside the vacuum processing tank 2 are connected.

処理ガス導入部3は、例えばアルゴン等の処理ガスを供給する処理ガス供給源30を有している。この処理ガス供給源30は、流量調整弁31を介して導入管32が真空処理槽2に接続され、この導入管32を介して所定量の処理ガスを真空処理槽2内に導入するように構成されている。   The processing gas introduction unit 3 includes a processing gas supply source 30 that supplies a processing gas such as argon. In this processing gas supply source 30, an introduction pipe 32 is connected to the vacuum processing tank 2 through a flow rate adjustment valve 31, and a predetermined amount of processing gas is introduced into the vacuum processing tank 2 through this introduction pipe 32. It is configured.

モノマー導入部4は、撥水性重合体膜形成用のモノマーを供給するモノマー供給源40を有している。このモノマー供給源40は、流量調整弁41を介して導入管42が接続され、この導入管42を介して所定量のモノマーを真空処理槽2内に導入するように構成されている。   The monomer introduction part 4 has a monomer supply source 40 for supplying a monomer for forming a water-repellent polymer film. The monomer supply source 40 is connected to an introduction pipe 42 via a flow rate adjustment valve 41, and is configured to introduce a predetermined amount of monomer into the vacuum processing tank 2 via the introduction pipe 42.

真空処理槽2内には保持機構5が設けられ、この保持機構5によって、例えばポリカーボネート(PC)樹脂からなる立体形状の成膜対象物20を保持するようになっている。
本実施の形態の保持機構5は、真空処理槽2の中央領域において、例えば鉛直方向に向けて設けられた直線状の保持部6を有している。
A holding mechanism 5 is provided in the vacuum processing tank 2, and the holding mechanism 5 holds a three-dimensional film-forming target 20 made of, for example, polycarbonate (PC) resin.
The holding mechanism 5 of the present embodiment has a linear holding portion 6 provided, for example, in the vertical direction in the central region of the vacuum processing tank 2.

この保持部6は、真空処理槽2の外部に設けられた駆動モータ7の回転軸7aに連結され、複数の成膜対象物20における凹部状の成膜面20aを回転外方側に向けて保持した状態で回転させるように構成されている。   The holding unit 6 is connected to a rotation shaft 7a of a drive motor 7 provided outside the vacuum processing tank 2, and the concave film-forming surfaces 20a of the plurality of film-forming objects 20 are directed outward in the rotation direction. It is configured to rotate while being held.

真空処理槽2内の側壁部分には、蒸発源8が設けられている。この蒸発源8は、その蒸気放出面8aが各成膜対象物20の成膜面20aと対向するように配置されている。なお、蒸発源8は、例えば加熱部分としてタングステン(W)からなるフィラメントを有し、蒸発材料としてアルミニウム(Al)を用いるものを有している。   An evaporation source 8 is provided on a side wall portion in the vacuum processing tank 2. The evaporation source 8 is disposed such that the vapor discharge surface 8a faces the film formation surface 20a of each film formation target 20. For example, the evaporation source 8 has a filament made of tungsten (W) as a heating portion and uses aluminum (Al) as an evaporation material.

また、真空処理槽2内の側壁部分には、図示しない交流電源を有するプラズマ発生源9が設けられている。このプラズマ発生源9は、そのプラズマ放出面9aが各成膜対象物20の成膜面20aと対向するように配置されている。   A plasma generation source 9 having an AC power source (not shown) is provided on the side wall portion in the vacuum processing tank 2. The plasma generation source 9 is disposed such that the plasma emission surface 9 a faces the film formation surface 20 a of each film formation target 20.

さらに、上述した処理ガス供給源30、モノマー供給源40、駆動モータ7、蒸発源8、プラズマ発生源9は、それぞれコンピュータ等を有する制御手段10に接続されており、例えば後述するシーケンスに従って制御されるように構成されている。   Furthermore, the processing gas supply source 30, the monomer supply source 40, the drive motor 7, the evaporation source 8, and the plasma generation source 9 described above are each connected to a control means 10 having a computer or the like, and are controlled according to a sequence described later, for example. It is comprised so that.

図2は、本発明に係る成膜方法の一例を示す流れ図、図3(a)〜(e)は、同成膜方法によって形成された膜の構成を示す断面図である。
本例においては、図1に示す成膜装置1を用い、ポリカーボネート(PC)樹脂からなる成膜対象物20上に成膜を行う場合を例にとって説明する。
FIG. 2 is a flowchart showing an example of a film forming method according to the present invention, and FIGS. 3A to 3E are cross-sectional views showing the structure of a film formed by the film forming method.
In this example, the case where film formation is performed on a film formation target 20 made of polycarbonate (PC) resin using the film formation apparatus 1 shown in FIG. 1 will be described as an example.

本例では、まず、図2に示すプロセスP1において、真空処理槽2内を真空排気して所定の圧力にする(例えば、1×10-2Pa)。
次に、モノマー供給源40から重合体膜形成用の原料モノマーを供給し、成膜対象物20を回転移動させながらプラズマ発生源9を動作させ、成膜対象物20の成膜面20a上に緩衝用重合体膜21を形成する(プロセスP2、図3(a))。
この緩衝用重合体膜21の原料モノマーとしては、例えばヘキサメチルジシロキサン(HMDS)等のシリコン系材料を含むモノマーを好適に用いることができる。
In this example, first, in the process P1 shown in FIG. 2, the inside of the vacuum processing tank 2 is evacuated to a predetermined pressure (for example, 1 × 10 −2 Pa).
Next, the raw material monomer for polymer film formation is supplied from the monomer supply source 40, and the plasma generation source 9 is operated while the film formation target 20 is rotated and moved on the film formation surface 20a of the film formation target 20. A buffering polymer film 21 is formed (process P2, FIG. 3A).
As a raw material monomer for the buffer polymer film 21, for example, a monomer containing a silicon-based material such as hexamethyldisiloxane (HMDS) can be suitably used.

本発明の場合、特に限定されることはないが、後述する反射膜23の機能を確保し且つ反射膜23を剥離しにくくする観点からは、緩衝用重合体膜21の厚さを30nm〜150nmに調整することが好ましい。
なお、本発明の場合、緩衝用重合体膜21を形成する前には、成膜対象物20の表面のプラズマ処理(ボンバード処理)は行わない。
In the case of the present invention, although not particularly limited, from the viewpoint of securing the function of the reflective film 23 described later and making the reflective film 23 difficult to peel off, the thickness of the buffering polymer film 21 is set to 30 nm to 150 nm. It is preferable to adjust to.
In the case of the present invention, the plasma treatment (bombarding) of the surface of the object 20 is not performed before the buffer polymer film 21 is formed.

その後、真空処理槽2内を真空排気する(プロセスP3)。
さらに、流量調整弁31を制御して真空処理槽2内に処理ガスを導入して所定の圧力にする(プロセスP4)。
本発明の場合、特に限定されることはないが、安定したプラズマを維持する観点からは、真空処理槽2内の圧力を0.1Pa〜10Paに調整することが好ましい。
Thereafter, the inside of the vacuum processing tank 2 is evacuated (process P3).
Further, the flow rate adjusting valve 31 is controlled to introduce a processing gas into the vacuum processing tank 2 to obtain a predetermined pressure (process P4).
In the present invention, although not particularly limited, it is preferable to adjust the pressure in the vacuum processing tank 2 to 0.1 Pa to 10 Pa from the viewpoint of maintaining stable plasma.

そして、プラズマ発生源9を動作させ(例えば13.56MHz)、真空処理槽2内に例えばアルゴンプラズマを発生させて、成膜対象物20の緩衝用重合体膜21の表面をこのプラズマにさらすことにより、図3(b)に示すように、緩衝用重合体膜21の表面にボンバード処理を施して活性化させ、活性化重合体膜22を形成する(プロセスP4)。このプラズマ処理中は、処理ガスを導入しつつ排気を行いながら、真空処理槽2内の圧力を維持する。   Then, the plasma generation source 9 is operated (for example, 13.56 MHz), for example, argon plasma is generated in the vacuum processing tank 2, and the surface of the buffer polymer film 21 of the film formation target 20 is exposed to this plasma. Thus, as shown in FIG. 3B, the surface of the buffer polymer film 21 is activated by bombarding to form an activated polymer film 22 (process P4). During the plasma processing, the pressure in the vacuum processing tank 2 is maintained while exhausting while introducing the processing gas.

次に、真空処理槽2内の真空排気を行う(プロセスP5)。
その後、保持機構5を動作させて成膜対象物20を回転移動させながら真空蒸着を行う(プロセスP6)。
これにより、図3(c)に示すように、成膜対象物20上の活性化重合体膜22上に例えばアルミニウムからなる反射膜(金属薄膜)23が形成される。
本発明の場合、特に限定されることはないが、反射膜23の機能を確保し且つ反射膜23を剥離しにくくする観点からは、反射膜23の厚さを50nm〜100nmに調整することが好ましい。
Next, the vacuum processing tank 2 is evacuated (process P5).
Then, vacuum deposition is performed while operating the holding mechanism 5 and rotating the film formation target 20 (process P6).
As a result, as shown in FIG. 3C, a reflective film (metal thin film) 23 made of, for example, aluminum is formed on the activated polymer film 22 on the film formation target 20.
In the present invention, although not particularly limited, the thickness of the reflective film 23 can be adjusted to 50 nm to 100 nm from the viewpoint of securing the function of the reflective film 23 and making the reflective film 23 difficult to peel off. preferable.

次に、モノマー供給源40から重合体膜形成用の原料モノマーを供給し、成膜対象物20を回転移動させながらプラズマ発生源9を動作させ、反射膜23上に撥水性重合体膜24を形成する(プロセスP7、図3(d))。
この撥水性重合体膜24は、反射膜23の酸化及び腐食を防止するための耐アルカリ性の保護膜として機能するもので、その原料モノマーとしては、例えばヘキサメチルジシロキサン(HMDS)等のシリコン系材料を含むモノマーを好適に用いることができる。
Next, a raw material monomer for polymer film formation is supplied from the monomer supply source 40, the plasma generation source 9 is operated while rotating the film formation target 20, and the water-repellent polymer film 24 is formed on the reflection film 23. It is formed (process P7, FIG. 3 (d)).
The water-repellent polymer film 24 functions as an alkali-resistant protective film for preventing the reflection film 23 from being oxidized and corroded. As a raw material monomer, for example, a silicon-based material such as hexamethyldisiloxane (HMDS) is used. A monomer containing a material can be preferably used.

その後、真空処理槽2内を真空排気する(プロセスP8)。
さらに、流量調整弁31を制御して真空処理槽2内に処理ガスとして例えばアルゴンガスを導入して所定の圧力にする(プロセスP9)。
本発明の場合、特に限定されることはないが、安定したプラズマを維持する観点からは、真空処理槽2内の圧力を0.1Pa〜10Paに調整することが好ましい。
Thereafter, the inside of the vacuum processing tank 2 is evacuated (process P8).
Further, the flow rate adjusting valve 31 is controlled to introduce, for example, argon gas as a processing gas into the vacuum processing tank 2 to obtain a predetermined pressure (process P9).
In the present invention, although not particularly limited, it is preferable to adjust the pressure in the vacuum processing tank 2 to 0.1 Pa to 10 Pa from the viewpoint of maintaining stable plasma.

そして、プラズマ発生源9を動作させ(例えば40kHz〜13.56MHz)、真空処理槽2内にアルゴンプラズマを発生させて、成膜対象物20の撥水性重合体膜24の表面をアルゴンプラズマにさらすことにより(ボンバード処理)、図3(e)に示すように、撥水性重合体膜24の表面に親水化重合体膜25を形成する(プロセスP9)。プラズマ処理中は、処理ガスを導入しつつ排気を行いながら、真空処理槽2内の圧力を維持する。
これにより、目的とする保護膜付反射膜26が得られる。
Then, the plasma generation source 9 is operated (for example, 40 kHz to 13.56 MHz), and argon plasma is generated in the vacuum processing tank 2 to expose the surface of the water-repellent polymer film 24 of the film formation target 20 to argon plasma. Thereby (bombarding), as shown in FIG. 3E, a hydrophilic polymer film 25 is formed on the surface of the water-repellent polymer film 24 (process P9). During the plasma processing, the pressure in the vacuum processing tank 2 is maintained while exhausting while introducing the processing gas.
Thereby, the target reflective film 26 with a protective film is obtained.

以上述べた本実施の形態では、例えばポリカーボネートからなる成膜対象物20の成膜面20a上に真空中で緩衝用重合体膜21を形成し、この緩衝用重合体膜21上に真空中でプラズマによる処理を施した後に真空蒸着によって例えばアルミニウムからなる金属薄膜23を形成することにより、プラズマ処理によって緩衝用重合体膜21の表面が荒れ、金属薄膜23へのアンカー効果を呈するため、樹脂(特にポリカーボネート樹脂)と金属薄膜23(特にアルミニウム薄膜)との密着性を向上させることができる。   In the present embodiment described above, the buffering polymer film 21 is formed in vacuum on the film forming surface 20a of the film forming object 20 made of, for example, polycarbonate, and the buffering polymer film 21 is vacuumed. Since the metal thin film 23 made of, for example, aluminum is formed by vacuum deposition after the plasma treatment, the surface of the buffer polymer film 21 is roughened by the plasma treatment and exhibits an anchoring effect on the metal thin film 23. In particular, the adhesion between the polycarbonate resin and the metal thin film 23 (particularly the aluminum thin film) can be improved.

その結果、本実施の形態によれば、環境負荷物質となる有機溶剤を使用することなく、樹脂表面に金属薄膜を容易に形成することができる。
また、本実施の形態によれば、構成の簡素化及びコストダウンが可能な反射膜用成膜装置を提供することができる。
As a result, according to the present embodiment, it is possible to easily form a metal thin film on the resin surface without using an organic solvent that becomes an environmental load substance.
Moreover, according to this Embodiment, the film-forming apparatus for reflective films which can simplify a structure and can reduce cost can be provided.

なお、本発明は上述の実施の形態に限られることなく、種々の変更を行うことができる。
例えば、上述の実施の形態においては、同一の真空処理槽において緩衝用重合体膜形成、活性化処理、反射膜形成、撥水性重合体膜形成及び親水化処理を行うようにしたが、本発明は、これら各工程を異なる真空処理槽において行う場合をも含むものである。
The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the above-described embodiment, the buffer polymer film formation, the activation process, the reflection film formation, the water-repellent polymer film formation and the hydrophilization process are performed in the same vacuum processing tank. Includes cases where these steps are performed in different vacuum processing tanks.

以下、本発明の実施例について、比較例とともに詳細に説明する。
<実施例>
図1に示す装置を使用し、ポリカーボネート(PC)からなる成膜対象物上に、原料モノマーとしてヘキサメチルジシロキサンを用い、厚さ50nmの緩衝用重合体膜をプラズマ重合により直接形成した。
Hereinafter, examples of the present invention will be described in detail together with comparative examples.
<Example>
Using the apparatus shown in FIG. 1, a buffer polymer film having a thickness of 50 nm was directly formed by plasma polymerization on a film-forming target made of polycarbonate (PC) using hexamethyldisiloxane as a raw material monomer.

この場合、真空処理槽内の圧力は、10Paとし、プラズマの周波数は、40kHzとした。
そして、真空排気後、真空処理槽内にアルゴンガスを導入してプラズマ化し、緩衝用重合体膜の表面に対してボンバード処理を行った。
In this case, the pressure in the vacuum processing tank was 10 Pa, and the plasma frequency was 40 kHz.
Then, after evacuation, argon gas was introduced into the vacuum processing tank to form plasma, and bombarding was performed on the surface of the buffer polymer film.

この場合、真空処理槽内の圧力は、10Paとし、プラズマの周波数は40kHzとした。また、ボンバード処理の時間は、30秒とした。
さらに、真空排気後、蒸発材料としてアルミニウム(Al)を用い、厚さ100nmの反射膜を抵抗加熱蒸着により形成した。
In this case, the pressure in the vacuum treatment tank was 10 Pa, and the plasma frequency was 40 kHz. The bombardment time was 30 seconds.
Further, after evacuation, a reflective film having a thickness of 100 nm was formed by resistance heating vapor deposition using aluminum (Al) as an evaporation material.

そして、真空排気後、原料モノマーとしてヘキサメチルジシロキサンを用い、厚さ30nmの撥水性重合体膜をプラズマ重合により形成した。
この場合、真空処理槽内の圧力は、10Paとし、プラズマの周波数は、40kHzとした。
Then, after evacuation, hexamethyldisiloxane was used as a raw material monomer, and a water-repellent polymer film having a thickness of 30 nm was formed by plasma polymerization.
In this case, the pressure in the vacuum processing tank was 10 Pa, and the plasma frequency was 40 kHz.

さらに、真空排気後、真空処理槽内にアルゴンガスを導入してプラズマ化し、撥水性重合体膜の表面に対してボンバード処理を行った。
この場合、真空処理槽内の圧力は、10Paとし、プラズマの周波数は40kHzとした。また、ボンバード処理の時間は、30秒とした。
以上のプロセスにより実施例のサンプルを作成した。
Further, after evacuation, argon gas was introduced into the vacuum treatment tank to form plasma, and the bombarding treatment was performed on the surface of the water-repellent polymer film.
In this case, the pressure in the vacuum treatment tank was 10 Pa, and the plasma frequency was 40 kHz. The bombardment time was 30 seconds.
The sample of an Example was created with the above process.

<比較例1>
PC成膜対象物上に実施例と同一の条件で直接反射膜を形成した。さらに、この反射膜上に実施例と同一の条件で撥水性重合体膜を形成してボンバード処理を行い比較例1のサンプルを作成した。
<Comparative Example 1>
A direct reflection film was formed on the PC film formation target under the same conditions as in the example. Further, a water-repellent polymer film was formed on the reflective film under the same conditions as in the Example, and bombarding was performed to prepare a sample of Comparative Example 1.

<比較例2>
PC成膜対象物上に緩衝用重合体膜を形成し、この膜に対してボンバード処理を行うことなく反射膜を形成した以外は、実施例と同一の条件で他の成膜を行い比較例2のサンプルを作成した。
<Comparative example 2>
Comparative example in which another film was formed under the same conditions as in Example except that a buffer polymer film was formed on a PC film formation target and a reflective film was formed without performing bombarding on this film. Two samples were made.

<比較例3>
PC成膜対象物上に緩衝用重合体膜を形成せずその表面に対してボンバード処理を行った以外は、実施例と同一の条件で他の成膜を行い比較例3のサンプルを作成した。
<Comparative Example 3>
A sample of Comparative Example 3 was prepared by performing other film formation under the same conditions as in Example except that the buffer polymer film was not formed on the PC film formation target and the surface was subjected to bombarding. .

〔密着性の評価〕
接着テープ(住友3M社製:スコッチメンディングテープ810)を実施例及び比較例1〜3のサンプルに貼付し、それぞれの被膜に対して接着テープを直角に保ちながら接着テープを急速に引き剥がした。そして、各サンプルの被膜表面を目視で観察した。その結果を表1に示す。
[Evaluation of adhesion]
Adhesive tape (manufactured by Sumitomo 3M Co., Ltd .: Scotch Mending Tape 810) was applied to the samples of Examples and Comparative Examples 1 to 3, and the adhesive tape was rapidly peeled off while keeping the adhesive tape at right angles to each coating. . And the film surface of each sample was observed visually. The results are shown in Table 1.

Figure 2010001542
Figure 2010001542

ここでは、PC成膜対象物上にAl反射膜が残ったものを○、PC成膜対象物上にAl反射膜が残らなかったものを×とした。
表1から理解されるように、PC成膜対象物上に緩衝用重合体膜を形成してボンバード処理を行った後にAl反射膜を形成した実施例にあっては、Al反射膜がPC成膜対象物上に残っており、樹脂と金属薄膜との密着性を向上させることができた。
Here, the case where the Al reflective film remained on the PC film formation target was indicated by ◯, and the case where the Al reflective film did not remain on the PC film formation target was indicated by x.
As can be understood from Table 1, in an example in which an Al reflective film was formed after a buffer polymer film was formed on a PC film formation target and subjected to bombarding, the Al reflective film was formed as a PC film. It remained on the film object, and the adhesion between the resin and the metal thin film could be improved.

一方、上述した比較例1〜3の場合は、いずれもAl反射膜がPC成膜対象物から剥離してしまった。
以上より、本発明による効果を確認することができた。
On the other hand, in each of Comparative Examples 1 to 3 described above, the Al reflective film was peeled off from the PC film formation target.
From the above, the effect of the present invention could be confirmed.

本実施の形態の成膜装置の内部構成を示す断面図Sectional drawing which shows the internal structure of the film-forming apparatus of this Embodiment 本発明に係る成膜方法の一例を示す流れ図Flow chart showing an example of a film forming method according to the present invention (a)〜(e):同成膜方法によって形成された膜の構成を示す断面図(A)-(e): Sectional drawing which shows the structure of the film | membrane formed by the film-forming method

符号の説明Explanation of symbols

1…成膜装置、2…真空処理槽、3…処理ガス導入部、4…モノマー導入部、20…成膜対象物、20a…成膜面、21…緩衝用重合体膜、22…活性化重合体膜、23…反射膜(金属薄膜)、24…撥水性重合体膜、25…親水化重合体膜 DESCRIPTION OF SYMBOLS 1 ... Film-forming apparatus, 2 ... Vacuum processing tank, 3 ... Processing gas introduction part, 4 ... Monomer introduction part, 20 ... Film-forming object, 20a ... Film-forming surface, 21 ... Polymer film for buffer, 22 ... Activation Polymer film, 23 ... Reflective film (metal thin film), 24 ... Water-repellent polymer film, 25 ... Hydrophilized polymer film

Claims (5)

成膜対象物の樹脂からなる成膜面上に真空中で緩衝用重合体膜を形成する緩衝用重合体膜形成工程と、
前記緩衝用重合体膜上に真空中でプラズマによる処理を施すプラズマ処理工程と、
当該プラズマ処理された前記緩衝用重合体膜上に、真空蒸着によって光反射性の金属薄膜を形成する反射膜形成工程とを有する成膜方法。
A buffering polymer film forming step of forming a buffering polymer film in a vacuum on a film-forming surface made of a resin to be formed;
A plasma treatment step of performing a treatment with a plasma in a vacuum on the buffer polymer film;
A reflective film forming step of forming a light-reflective metal thin film on the plasma-treated polymer film for plasma treatment by vacuum deposition;
前記成膜対象物の成膜面が、ポリカーボネート樹脂からなる請求項1記載の成膜方法。   The film forming method according to claim 1, wherein a film forming surface of the film forming object is made of a polycarbonate resin. 前記光反射性の金属薄膜がアルミニウムからなる請求項1又は2のいずれか1項記載の成膜方法。   The film forming method according to claim 1, wherein the light reflective metal thin film is made of aluminum. 前記成膜対象物が、反射鏡を構成する立体的な部材である請求項1乃至3のいずれか1項記載の成膜方法。   The film forming method according to claim 1, wherein the film formation target is a three-dimensional member constituting a reflecting mirror. 成膜対象物を収容可能な真空処理槽と、
前記真空処理槽に接続され、処理ガスを導入する処理ガス導入部と、
前記真空処理槽に接続され、緩衝用重合体膜形成用のモノマーを導入するモノマー導入部と、
前記真空処理槽内に設けられた蒸発源と、
前記真空処理槽内に設けられたプラズマ発生源と、
前記真空処理槽内において、前記成膜対象物の成膜面上に緩衝用重合体膜を形成し、当該緩衝用重合体膜上にプラズマによる処理を施し、当該プラズマ処理された緩衝用重合体膜上に、真空蒸着によって光反射性の金属薄膜を形成するように制御する制御手段とを有する成膜装置。
A vacuum processing tank capable of accommodating a film formation target;
A processing gas introduction unit that is connected to the vacuum processing tank and introduces a processing gas;
A monomer introduction part connected to the vacuum processing tank and introducing a monomer for forming a buffer polymer film;
An evaporation source provided in the vacuum processing tank;
A plasma generation source provided in the vacuum processing tank;
In the vacuum processing tank, a buffer polymer film is formed on the film formation surface of the film formation target, and the buffer polymer film is subjected to a treatment with plasma on the buffer polymer film. A film forming apparatus having control means for controlling to form a light-reflective metal thin film on the film by vacuum deposition.
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JP2014173178A (en) * 2013-03-12 2014-09-22 Stanley Electric Co Ltd Production method of metal coating member, and vehicular lamp including metal coating member
JP2016211051A (en) * 2015-05-12 2016-12-15 株式会社島津製作所 Film deposition apparatus, plasma processing apparatus and film deposition method
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