JP2010000523A - Joining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a joining device which is not limited by the shapes and dimensions of the materials to be joined by uniformly and closely adhering and fixing the materials to be joined to each other when joining a plurality of joining places and also making the structure of pressing members compact. <P>SOLUTION: This joining device is provided with the pressing member 40 with which the material to be joined can be pressed to a table on which the material is placed. The pressing member 40 includes a base plate 41, a plurality of pressing members 43 which are fixed to positions corresponding to a plurality of joining places in the base plate 41 and brought into contact with the material when joining the material and spacer members 42 which are interposed between the base plate 41 and the pressing members 43 so as to form a gap 434 between the plate 41 and the member 43. The pressing member 43 includes an elastic body which is elastically deformed to load when pressing the material. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a joining device, and more particularly, to a joining device that joins objects to be joined while being pressed.

  2. Description of the Related Art Conventionally known as a joining technique for joining objects to be joined is a technique for joining (brazing, soldering, welding, welding, etc.) by irradiating a laser beam as a heating source while pressing and fixing the joined articles. ing.

  An important point in such laser bonding is that the objects to be bonded or the brazing material and the brazing material are closely fixed to each other and laser irradiation is performed. Many joining apparatuses or joining methods having a jig for tightly fixing an object to be joined have been proposed. For example, Japanese Patent No. 2554994 (Patent Document 1), Japanese Patent Application Laid-Open No. 7-335697 (Patent Document 2), Japanese Patent Application Laid-Open No. 5-305470 (Patent Document 3), Japanese Patent Application Laid-Open No. 2004-134654 (Patent Document 4). ) Etc.

  As an example of joining a single location, there has been proposed a method of laser joining by pressing and fixing an object to be joined with a jig having a through hole as described in Patent Document 1 or a laser light transmitting plate. Yes.

  Moreover, as an example in the case of joining a plurality of places at once, Patent Documents 2 to 4 propose a laser joining method in which a plurality of joining places are collectively pressed and fixed by a leaf spring or a spring spring.

By the way, the method of joining a plurality of locations at once using a laser is as follows.
i) A method of scanning a laser beam ii) A method of scanning a stage on which a joint is placed is roughly divided into two types.

Furthermore, as a method of scanning the laser beam,
ia) a method of scanning the entire lens system by a mechanical means such as a slide guide,
ib) A method of scanning by an optical means such as a combination of a scanner mirror and an fθ lens is used industrially, and is selectively used depending on the shape and size of the joining object, the number of joining points, the processing time, and the like.

  As an example of the scanning method using the optical means of ib), an optical means using a combination of a galvano scanner mirror and an fθ lens is widely used industrially. This method is a very effective method with high throughput as a method of irradiating a laser beam within a limited region of about 300 mm square, for example, by scan irradiation or repeated spot irradiation by step-and-repeat. However, in order to enlarge the collective irradiation area by this method, it is necessary to enlarge the fθ lens system. When the collective irradiation area is 300 mm square or more, it is difficult to manufacture the fθ lens. Not suitable for scanning.

  In an optical beam scan using another scanner mirror, for example, a combination of a polygon mirror and an fθ lens, a beam scan is possible even in a relatively wide range of 300 mm square or more, but the beam scan is limited to a uniaxial direction. When scanning in the axial direction, another scanning method, for example, combined use with mechanical means such as a slide guide is essential, and there is a disadvantage that the mechanism is complicated.

  In addition, when several places are spot-bonded to a large-area substrate, or when long distances are continuously joined, it is effective to move the joining places by the mechanical means of ia).

  In the case of scanning parallel to the bonding surface by the method of scanning the entire lens system of ia) by mechanical means or the method of scanning the stage on which the bonded product of ii) is mounted, Although the incident angle of the laser beam irradiated on the joint is constant, in the method using the scanner mirror and the fθ lens, the incident angle of the laser beam irradiated on the joint is not necessarily constant.

In order to allow the laser beam to reach the object to be bonded, it is necessary to consider the apparatus components and shape so as not to obstruct the laser beam path. Consideration of the beam diameter is inevitable.
Japanese Patent No. 2554994 JP-A-7-335697 JP-A-5-305470 JP 2004-134654 A

However, the conventional bonding apparatus described above has the following problems.
The method described in Patent Document 1 is a method of laser joining a single location. Even if you try to press and fix multiple joints at once by applying this method, the joints cannot be pressed evenly due to factors such as thickness unevenness of the joint, pressing unevenness, accuracy of pressed parts, etc. Since gaps are formed between the members, poor laser bonding occurs. In order to solve such a problem, a method in which a metal spring is mainly provided on a pressing member, such as the methods described in Patent Documents 2 to 4, has been proposed.

  That is, in the method described in Patent Document 2, a plurality of joints are pressed and fixed by a solid pressing member (FIGS. 3, 4, and 5 of Patent Document 2) or a coil spring (FIG. 6 of Patent Document 2). . Moreover, also in the method of patent document 3, the some joining location is press-fixed with the coil spring. Furthermore, in the method described in Patent Document 4, a plurality of joints are pressed and fixed by leaf springs or pressing pins.

  However, in the inventions described in Patent Documents 2 to 4, a pressing member having a shape that does not interfere with the laser beam path is used, but these methods are effective for extremely limited objects to be joined. However, the laser light path is limited to a very limited method and has a shape that does not obstruct the light path.

  Specifically, since the methods described in these documents use a coil spring or a leaf spring, a space for installing the spring component in the plane direction or the vertical (height) direction is required. For this reason, if the objects to be joined are different, it is extremely difficult to dispose the holding parts so as not to disturb the laser light path. For example, it is extremely difficult to apply the method of Patent Literature 2 to the methods described in Patent Literature 3 and Patent Literature 4.

  More specifically, the method described in Patent Document 2 is a method of irradiating a laser beam from above vertically in order to join a plurality of leads of a TAB film carrier and a mounting substrate, and is at most several tens of mm square. In this method, a large number of leads existing in the region are joined. As long as a space is provided in the vertical upper part of the area of several tens of mm square, it becomes possible not to disturb the laser light path. Therefore, such as a pressing member that spreads in the planar direction as shown in FIGS. 2, 3, and 4 of Patent Document 2, and a spring that hardly needs to consider the height restriction as shown in FIG. 6 of Patent Document 2. A pressing member using elastic means can be employed.

  The method described in Patent Document 3 is a method of irradiating two laser beams from the oblique direction to the substrate in order to join the leaf spring and the substrate. Here, since the arrangement of the pressing member only prevents a limited number of laser light paths from being interrupted, such a method can be employed.

  The method described in Patent Document 4 is a method of irradiating two laser beams from vertically above the substrate in order to join the solar battery cell and the interconnector. Since the electrodes of the solar battery cells are limited to two rows, a leaf spring-like pressing member that spreads in the plane direction as described in Patent Document 4 can be employed. That is, if three or more electrodes are laid out, it is extremely difficult to employ such a pressing member.

  The present invention has been made in view of the above problems, and an object of the present invention is to uniformly fix and fix the objects to be joined together when joining a plurality of joining locations, and to structure the pressing member. It is to provide a joining apparatus in which the shape and dimensions of the objects to be joined are not limited by making the structure compact.

  The joining device according to the present invention is a joining device that joins a plurality of joints while pressing and fixing the objects to be joined, and a table on which the objects are placed and positions corresponding to the plurality of joints. A pressing member having an opening and capable of pressing an object to be joined to the table, the pressing member being fixed at a position corresponding to a plurality of joining locations in the base plate and joining the object to be joined; A plurality of pressing members abutting against the bonded object, and a spacer member interposed between the base plate and the pressing member so as to form a gap between the base plate and the pressing member, the pressing member pressing the object to be bonded The elastic body which elastically deforms with respect to the load at the time of doing is included.

  According to the said structure, the some pressing member contact | abutted to a to-be-joined object elastically deforms, the unevenness | corrugation of a to-be-joined object can be absorbed, and a some joining location can be closely_contact | adhered and fixed. Moreover, since only the vicinity of a joining location can be selectively pressed and the overall height of the pressing member can be reduced, the path of the heating source reaching the joint is prevented from being obstructed by the pressing member, thus ensuring good joining. It can be carried out.

  Preferably, the joining apparatus further includes a laser light source, and joins the objects to be joined using laser light from the laser light source that has passed through the opening of the pressing member. Thereby, since a laser beam can be used as a heat source, a favorable laser joining can be performed reliably.

  Preferably, in the above-described bonding apparatus, the laser light is incident on the bonded portion of the object to be bonded from an oblique direction. Thereby, laser joining can be performed more efficiently.

  Preferably, in the above bonding apparatus, the pressing member has a property of transmitting laser light. As a result, it is possible to avoid damage to the pressing member and thermal effects (thermal deformation, etc.) due to reflection and scattering of the laser light applied to the joint.

  Preferably, in the joining apparatus, the base plate and the spacer member are integrally formed. Thereby, the number of parts can be reduced.

  Preferably, in the above-described joining device, the base plate has rigidity capable of maintaining a non-deformed state with respect to a load when the object to be joined is pressed. Thereby, the pressing member can be easily elastically deformed to absorb the unevenness of the object to be joined.

  In one aspect, in the above-described joining device, the pressing member includes a flange portion and a cylindrical portion that protrudes from the flange portion toward the workpiece. The joining apparatus further includes a fixing member that fixes the flange portion to the base plate via the spacer member.

  In another aspect, in the above-described joining device, the pressing member is a cap-shaped member having an opening. The joining apparatus further includes a fixing member that fixes a part of the top of the cap-shaped member to the base plate via the spacer member.

  According to the present invention, when joining a plurality of joints, the objects to be joined are fixed firmly in contact with each other, and the shape and dimensions of the objects to be joined are limited by making the structure of the pressing member compact. It is possible to obtain a joining device that does not occur.

  Embodiments of the present invention will be described below. Note that the same or corresponding portions are denoted by the same reference numerals, and the description thereof may not be repeated.

  Note that in the embodiments described below, when referring to the number, amount, and the like, the scope of the present invention is not necessarily limited to the number, amount, and the like unless otherwise specified. In the following embodiments, each component is not necessarily essential for the present invention unless otherwise specified. In addition, when there are a plurality of embodiments below, it is planned from the beginning to appropriately combine the configurations of the embodiments unless otherwise specified.

(Embodiment 1)
FIG. 1 is a diagram showing an overall configuration of a bonding apparatus according to Embodiment 1 of the present invention. Referring to FIG. 1, the bonding apparatus according to the present embodiment includes a laser oscillator 10, a stage 20, an optical mechanism 30, a pressing member 40, and an elevating mechanism 50.

  The laser oscillator 10 generates laser light as a heating source. The laser light emitted from the laser oscillator 10 reaches the optical mechanism 30 through the optical fiber 11. On the stage 20, the workpiece 1 is placed. The stage 20 and the optical mechanism 30 are configured such that the laser beam emitted from the laser oscillator 10 and the workpiece 1 can be moved relative to each other. The optical mechanism 30 includes a collimator 31, a galvano scanner mirror 32, and an fθ lens 33. The pressing member 40 presses the workpiece 1 when the workpiece 1 is joined. The lifting mechanism 50 moves the pressing member 40 up and down.

Since the laser light emitted from the end face of the optical fiber 11 has a predetermined divergence angle determined by the numerical aperture of the optical fiber, it is converted into parallel light by the collimator 31. Further, the irradiation position and the beam diameter on the irradiation object (the object to be bonded 1 in the case of FIG. 1) are determined by the galvano scanner mirror 32 and the fθ lens 33. The galvano scanner mirror 32 is configured to be able to scan two orthogonal axes, and when the irradiation object is at the focal position of the lens system,
h = f × θ
(Where h: image height, f: lens focal length, θ: light incident angle on the lens)
A laser beam is irradiated to a position that satisfies the above.

The beam diameter at the focal position of the lens system is expressed by the following equation.
d _0f = (f / f _c ) × d _k
However,
d _0f : Beam diameter at the focal position f: Focal length f _c of the fθ lens 33: Focal length of the collimator 31 d _k : Core diameter of the optical fiber 11 Note that if the fθ lens system has an image-side telecentric configuration, it is bonded. Although the laser beam is incident perpendicularly on the object 1, in order to widen the irradiation area, it is necessary to make the fθ lens diameter larger than the irradiation area, and the lens becomes large in diameter, which makes it difficult to design and manufacture the lens. In FIG. 1, the fθ lens system has a non-telecentric configuration, and laser light is irradiated to the object 1 at a predetermined incident angle from an oblique direction.

  In FIG. 1, the beam scanning method is described using the combination of the galvano scanner mirror 32 and the fθ lens 33. However, similar beam scanning is possible using the combination of the polygon scanner mirror and the fθ lens. It is also possible to perform beam scanning by mechanical means such as an XY stage (that is, the stage 20 is moved in the X and Y directions).

  As the laser oscillator 10, a solid laser such as a YAG laser having a wavelength in the near infrared region (0.7 to 2.5 μm), a semiconductor laser, a disk laser, a fiber laser, or the like is preferably used.

  The workpiece 1 is installed on the stage 20 by, for example, vacuum suction. In laser bonding, it is necessary to closely fix a plurality of objects to be bonded 1 arranged in a stacked manner, and the objects to be bonded 1 installed on the stage 20 are configured to be pressed and fixed by a pressing member 40. Yes. The pressing member 40 is fixed to an elevating mechanism 50 that is configured by a drive source such as pneumatic pressure or hydraulic pressure and a slide guide, and is capable of moving up and down. It is comprised so that 1 can be fixed closely.

  FIG. 2 is a cross-sectional view showing the pressing member 40 in the joining apparatus shown in FIG. FIG. 3 is an exploded perspective view of the pressing member 40. With reference to FIGS. 2 and 3, the pressing member 40 includes a base plate 41, a plurality of spacer members 42, a plurality of pressing members 43, and a plurality of fixing members 44. The base plate 41 has a plurality of holes so that laser light can pass through. The spacer member 42, the pressing member 43, and the fixing member 44 are configured to be attachable to the window opening portion of the base plate 41, and, like the base plate 41, a hole is formed so that laser light can pass through. ing.

  More specifically, the pressing member 43 includes an opening 431 that allows laser light to pass therethrough, a flange portion 432, and a cylindrical portion 433 that protrudes from the flange portion 432 toward the workpiece 1. The pressing member 43 is fixed to the base plate 41 by fixing the flange portion 432 to the base plate 41 by the fixing member 44. That is, as shown in FIG. 3 (disassembled perspective view), a ring-shaped spacer member 42 and a pressing member 43 are disposed on the lower surface side of the base plate 41, and a fixing member 44, for example, a bolt (not shown). The spacer member 42 and the pressing member 43 are fixed to the base plate 41 using, for example.

  Among the components constituting the pressing member 40, the base plate 41, the spacer member 42, and the fixing member 44 are configured by an inelastic body so as to be a rigid body that does not deform with respect to the pressure acting on the pressing member 40 by the lifting mechanism 50. The On the other hand, the pressing member 43 is formed of an elastic body so as to be deformed with respect to the pressure. Thus, as an advantage which comprises pressing member 43 with an elastic body, damages, such as a crack of a thing 1 to be joined 1, a crack, and a chip, can be mentioned, for example.

  FIG. 4 is a diagram for explaining a joining process using the joining apparatus shown in FIG. Referring to FIG. 4A, solder plating layer 4 and electrode 5 are formed on substrate 3. The wiring member 2 is brought into contact with the electrode portion, and the substrate 3, the wiring member 2, and the pressing member 40 are positioned so that the pressing member 43 comes into contact with the wiring member 2. In this state, pressure is applied to the pressing member 40 by the elevating mechanism 50 (see FIG. 1). When the pressure by the elevating mechanism 50 is applied, the wiring member 2 is tightly fixed to the substrate surface including the solder plating layer 4 and the electrode 5 as shown in FIG. On the other hand, only a part of the flange portion 432 is fixed to the pressing member 43, and the flange portion 432 is bent with this fixed portion as a fulcrum. When the pressure is further increased, compression deformation and buckling deformation occur in the cylindrical portion 433. As described above, the pressing member 43 of the pressing member 40 is configured to be deformable, thereby causing irregularities and undulations in the substrate 3, variations in the thickness of the solder plating layer 4, variations in the thickness of the wiring material 2, uneven pressing, and the like. However, the wiring member 2 and the solder plating layer 4 can be closely adhered to each other at all of the plurality of joint portions. If laser irradiation is performed in this state, heat is transmitted from the wiring member 2 to the electrode 5 through the solder plating layer 4, and good soldering is possible. If there is a gap between the wiring material 2 and the solder plating layer 4, thermal energy due to the laser beam is accumulated only in the wiring material 2, and there is a concern that poor soldering may occur.

  2 to 4, a tapered hole is formed in the laser beam passing portion of the base plate 41. This is because the angle and diameter in consideration of the incident angle of the laser beam and the beam diameter. Is formed.

With the above configuration, the pressing member 40 is configured in a compact manner. In particular,
1) Joining at a narrow pitch is possible.
2) The overall height of the pressing member can be reduced.

  Thus, even if an optical means in which the laser beam is incident obliquely is adopted, the laser beam path is not disturbed before the laser beam reaches the object 1 to be bonded.

  FIG. 5 is a diagram illustrating a difference between a bonding process by the bonding apparatus according to the present embodiment and a bonding process by the bonding apparatus according to the comparative example. FIG. 5A shows the structure of the pressing member 40 according to the present embodiment. The base plate 41, the spacer member 42, and the fixing member 44 are made of a material that is not deformed by the pressure of the lifting mechanism 50 (see FIG. 1). The pressing member 43 is made of a material that is elastically deformed by the pressure of the elevating mechanism 50, such as an elastomer. On the other hand, FIG. 5B shows a pressing member according to the comparative example (part 1), and the base plate 41A, the pressing member 44A, and the fixing member 43A are made of a material that is not deformed by the pressure of the elevating mechanism 50. The spacer member 42A is made of a material that is elastically deformed by the pressure of the elevating mechanism 50, for example, an elastomer. FIG. 5C shows a pressing member according to the comparative example (No. 2), such as a base plate 41B that is not deformed by the pressure of the lifting mechanism 50 and an elastomer that is elastically deformed by the pressure of the lifting mechanism 50. It is comprised with the pressing member 43B comprised with the material.

  When pressure is applied by the lifting mechanism 50, in the case of FIG. 5 (a), bending deformation occurs in the flange portion of the elastomer (pressing member 43), whereas in the case of FIGS. 5 (b) and 5 (c). Simply deforms the elastomer by compressive deformation. Therefore, in the case of FIG. 5A, the elastomer can be greatly deformed even at the same pressure as compared with the case of FIGS. 5B and 5C according to the comparative example.

  As described above, even if the unevenness and undulation of the article to be joined 1 and the pressure distribution of the pressing member 40 are generated, it is necessary to closely fix the articles to be joined 1 at all of the plurality of joining locations. According to the configuration of the present embodiment shown in (2), it is possible to absorb the unevenness with a small pressing force, or to increase the unevenness that can be absorbed even with the same pressure, as compared with the configuration according to the comparative example.

  FIG. 6 is a diagram for explaining a difference in deformation amount of the pressing member between the joining process by the joining device according to the present embodiment and the joining process by the joining device according to the comparative example.

  In the case of the configuration according to the present embodiment, as shown in FIG. 6A, it can be modeled by bending deformation of a perforated thin plate disk, and the deformation amount Wmax is as shown in [Equation 1].

However,
α: Coefficient P: Load (kg)
E: Young's modulus (MPa)
It is.

  On the other hand, in the case of the configuration according to the comparative example, as shown in FIG. 6B, it can be modeled by compressive deformation of a perforated disk, and the deformation amount Wmax is as shown in [Equation 2].

However,
P: Load (kg)
E: Young's modulus (MPa)
S: sectional area (mm ² )
It is.
Examples of specific values of parameters appearing in FIGS. 6A and 6B and [Equation 1] and [Equation 2] are, for example,
α: about 0.015 (d3 / d2 = 1.33)
d1: 10 mm
d2: 6 mm
d3: 8 mm
t: 1mm
(Reference, pages 229 to 231 of Modern Materials Mechanics (supervised by Shuji Hira, published by Ohmsha)).

  An example of the above specific value is adopted, and the deformation amounts of FIGS. 6A and 6B are compared. The deformation amount W1 of the configuration according to FIG. 6 (a) [that is, FIG. 5 (a)] and the deformation amount W2 of the configuration according to FIG. 6 (b) [that is, FIGS. 5 (b) and (c)] are respectively become that way.

W1 = 0.015 × (8/2) ² × (P / E) = 0.24 × (P / E)
W2 = 1 / [π (8/2) ² −π (6/2) ² ] × (P / E) = 0.035 × (P / E)
Therefore, when members having the same dimensions and the same elastic modulus are used, the configuration according to FIG. 5 (a) is about 6.8 times the same pressure as the configuration according to FIGS. 5 (b) and 5 (c). A displacement amount can be obtained. As a result, even if there is unevenness in the thickness of the object to be bonded 1, uneven pressing, etc., the adherence between the objects to be bonded 1 becomes good, so that it is possible to improve the quality and yield of laser bonding.

  From the viewpoint different from the above, in the configuration according to FIG. 5 (a), the same amount of displacement is obtained when members having the same dimensions and the same elastic modulus are used as compared with the configurations according to FIGS. 5 (b) and 5 (c). Pressure to obtain 0.15 times. Therefore, according to the structure which concerns on Fig.5 (a), the damage and damage of the to-be-joined object 1 can be reduced, and the quality of laser joining can be improved.

  Next, the influence of reflected light will be described with reference to FIG. Referring to FIG. 7, the light reflected and scattered on the surface of object 1 during irradiation with laser light incident in the direction of arrow DR <b> 1 is applied to a part of the inner wall of pressing member 43. At this time, when the pressing member 43 is made of a laser absorbing material, the temperature of the pressing member 43 rises, causing thermal deformation or thermal damage. For this reason, it is preferable that the pressing member 43 is made of a material that transmits laser light. Since the laser light that has passed through the inner wall of the pressing member 43 is repeatedly reflected and scattered, it is possible to avoid thermal deformation and thermal damage of a specific part. In general, many elastomers have laser absorptivity, but silicon-based resins have high light transmittance in the visible to near infrared region, and therefore can be suitably used as the pressing member 43. Silicon has a transmittance of about 90% for light of 700 nm to 1600 nm.

  FIG. 8 is a cross-sectional view showing a modification of the pressing member 40. As shown in FIG. 8, the base plate 41 and the spacer member 42 may be integrally formed. With this configuration, the number of parts can be reduced.

As in the present embodiment, as an essential requirement when laser joining a plurality of joint locations,
・ Fix multiple joints evenly,
-The member constituting the joining device, such as the above-mentioned member for tight fixation, does not disturb the laser light path,
Can be mentioned. Furthermore, in addition to the above, in order to make an effective joining method for various objects to be joined,
・ Compact material for the above-mentioned close fixation,
・ Suppresses damage and damage to joints.
It will be necessary.

Therefore, in the bonding apparatus that laser-bonds a plurality of bonding locations as in the present embodiment,
1. The pressing member 40 includes elastic means;
2. The total height of the pressing member 40 is lowered, and the elastic deformation is configured to be as large as possible.
3. The pressing member 40 has a structure that presses only the vicinity of the joining portion.
It is necessary to satisfy all three conditions.

  In contrast, in the joining apparatus according to the present embodiment, the pressing member 40 is provided with an elastic means by providing the pressing member 43 that can be elastically deformed by the pressure of the elevating mechanism 50. As described with reference to FIGS. 5 and 6, it is possible to reduce the overall height of the pressing member 40 and to increase the amount of elastic deformation as much as possible. In addition, by selectively providing the pressing member 43 at a position corresponding to the joint location, it is possible to have a structure that presses only the vicinity of the joint location.

  According to the present embodiment, as described above, the plurality of pressing members 43 in contact with the article to be joined 1 are elastically deformed to absorb the unevenness of the article to be joined 1 so that the plurality of joints are made uniform. It can be fixed tightly. Moreover, since only the vicinity of a joining location can be selectively pressed and the overall height of the pressing member 40 can be reduced, the laser beam reaching the joining portion is prevented from being hindered by the pressing member 40, and good joining is ensured. Can be done.

  The above contents are summarized as follows. That is, the joining apparatus according to the present embodiment is a joining apparatus that joins a plurality of joints while pressing and fixing objects to be joined (for example, the wiring member 2 and the substrate 3), and includes a laser light source 10 and a joined object. A table 20 on which the object 1 is placed, and a pressing member 40 having openings at positions corresponding to a plurality of joints and capable of pressing the object 1 to the table 20 are provided. The joining apparatus joins the workpiece 1 using the laser light from the laser light source 10 that has passed through the opening of the pressing member 40.

  The pressing member 40 is fixed at a position corresponding to a plurality of joining locations in the base plate 41, the spacer member 42, and the base plate 41, and a plurality of pressing members 43 that come into contact with the article 1 when the article 1 is joined. And a fixing member 44 that fixes the top of the pressing member 43 to the base plate 41 via the spacer member 42.

  The base plate 41 has a rigidity capable of maintaining an undeformed state against a load when the workpiece 1 is pressed. The spacer member 42 is interposed between the base plate 41 and the pressing member 43 so as to form a gap 434 between the base plate 41 and the pressing member 43. The pressing member 43 includes an elastic body that is elastically deformed with respect to a load when the workpiece 1 is pressed. The pressing member 43 has an opening 431 as a “laser passing portion” that allows laser light to pass therethrough.

  More specifically, the pressing member 43 includes a flange portion 432 and a cylindrical portion 433 that protrudes from the flange portion 432 to the workpiece 1 side. The fixing member 44 fixes the flange portion 432 to the base plate 41 via the spacer member 42.

  In this embodiment, an example in which the laser oscillator 10 is used as a heating unit has been described. However, the heating source is not limited to laser light, and heat ray irradiation such as infrared light and halogen light, hot air injection, Alternatively, heating means such as soldering iron pressing can be applied to the present invention.

(Embodiment 2)
FIG. 9 is a partial cross-sectional view of the bonding apparatus according to the second embodiment. Referring to FIG. 9, the joining device according to the present embodiment basically has the same structure as that of the joining device according to Embodiment 1, but the shape of pressing member 43 is a perforated cap shape ( The first embodiment is characterized in that it has a cylindrical shape with a flange. That is, in the present embodiment, the pressing member 43 is a cap-shaped member having an opening, and the fixing member 44 fixes a part of the top of the cap-shaped member to the base plate 41 via the spacer member 42. .

  Since other configurations and operations are the same as those in the first embodiment, detailed description will not be repeated.

(Embodiment 3)
FIG. 10 is an exploded perspective view showing the bonding apparatus according to the third embodiment. Referring to FIG. 10, the joining device according to the present embodiment has basically the same structure as the joining device according to the first embodiment, but includes a base plate 41, a spacer member 42, a pressing member 43, and a fixing member. A feature is that the hole formed in 44 has a square hole shape (round hole shape in the first embodiment).

  Since other configurations and operations are the same as those in the first and second embodiments, detailed description will not be repeated.

(Embodiment 4)
FIG. 11 is an exploded perspective view showing the bonding apparatus according to the fourth embodiment. Referring to FIG. 11, the joining device according to the present embodiment has basically the same structure as the joining device according to the third embodiment, but the pressing member 43 attached to one opening is divided. Further, it is characterized in that it is constituted by a plurality of members (in the first to third embodiments, constituted by an integral member).

  Since other configurations and operations are the same as those in the first to third embodiments, detailed description will not be repeated.

  Although the embodiments of the present invention have been described above, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is a figure which shows the whole structure of the joining apparatus which concerns on Embodiment 1 of this invention. It is sectional drawing which shows the press member in the joining apparatus shown by FIG. It is a disassembled perspective view of the press member in the joining apparatus shown by FIG. It is a figure explaining the joining process using the joining apparatus shown by FIG. It is a figure explaining the difference between the joining process by the joining apparatus shown by FIG. 1, and the joining process by the joining apparatus which concerns on a comparative example. It is a figure explaining the difference in the deformation amount of the press member by the joining process by the joining apparatus shown by FIG. 1, and the joining process by the joining apparatus which concerns on a comparative example. It is a figure explaining the influence of reflected light. It is sectional drawing which shows the modification of the press member shown in FIG. It is a fragmentary sectional view of the joining device concerning Embodiment 2 of the present invention. It is a disassembled perspective view which shows the joining apparatus which concerns on Embodiment 3 of this invention. It is a disassembled perspective view which shows the joining apparatus which concerns on Embodiment 4 of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 To-be-joined object, 2 Wiring material, 3 Substrate, 4 Solder plating layer, 5 Electrode, 10 Laser oscillator, 11 Optical fiber, 20 Stage, 30 Optical mechanism, 31 Collimator, 32 Galvano scanner mirror, 33 f (theta) lens, 40 Press member 41, 41A, 41B Base plate, 42, 42A Spacer member, 43, 43A, 43B Holding member, 44, 44A Fixing member, 50 Elevating mechanism, 431 Opening, 432 Flange, 433 Cylindrical, 434 Gap.

Claims (8)

A joining device for joining a plurality of joints while pressing and fixing objects to be joined,
A table on which the object to be joined is placed;
An opening at a position corresponding to the plurality of joints, and a pressing member capable of pressing the object to be joined to the table,
The pressing member is
A base plate;
A plurality of pressing members that are fixed at positions corresponding to the plurality of joining locations in the base plate, and abut against the workpiece when the workpiece is joined;
A spacer member interposed between the base plate and the pressing member so as to form a gap between the base plate and the pressing member;
The said pressing member is a joining apparatus containing the elastic body elastically deformed with respect to the load at the time of pressing the said to-be-joined thing. A laser light source;
The bonding apparatus according to claim 1, wherein the objects to be bonded are bonded using laser light from the laser light source that has passed through the opening of the pressing member.   The bonding apparatus according to claim 2, wherein the laser light is incident on the bonding portion of the object to be bonded from an oblique direction.   The joining device according to claim 2, wherein the pressing member has a property of transmitting the laser light.   The joining apparatus according to claim 1, wherein the base plate and the spacer member are integrally formed.   The said base plate is a joining apparatus in any one of Claims 1-5 which has the rigidity which can maintain an undeformed state with respect to the load at the time of pressing the said to-be-joined object. The pressing member includes a flange portion and a cylindrical portion protruding from the flange portion toward the workpiece.
The joining apparatus according to any one of claims 1 to 6, further comprising a fixing member that fixes the flange portion to the base plate via the spacer member. The pressing member is a cap-shaped member having an opening,
The joining apparatus according to any one of claims 1 to 6, further comprising a fixing member that fixes a part of the top of the cap-shaped member to the base plate via the spacer member.

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