JP2009538732A - Cleaning device for the back of the object - Google Patents

Cleaning device for the back of the object Download PDF

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Publication number
JP2009538732A
JP2009538732A JP2009513037A JP2009513037A JP2009538732A JP 2009538732 A JP2009538732 A JP 2009538732A JP 2009513037 A JP2009513037 A JP 2009513037A JP 2009513037 A JP2009513037 A JP 2009513037A JP 2009538732 A JP2009538732 A JP 2009538732A
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drive shaft
back surface
cleaning
spindle motor
present
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テ ヨン，ビュン
ギル チョイ，ヤン
ウック クウォン，ヤン
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ユーズテック カンパニー リミテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/0209—Cleaning of wafer backside
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

本発明は対象物の工程進行と同時に対象物の背面に噴射ノズルを通じて液体を噴射させて背面クリーニングをすることができる対象物背面の洗浄装置に関するものである。本発明による対象物背面の洗浄装置は、駆動軸を回転させるスピンドルモーターと; 前記スピンドルモーターによって回転する駆動軸と;前記スピンドルモーターの中央及び駆動軸を貫通して設置され, 水路を形成する水路管と; 前記水路管の末端部に設置される多数の噴射ノズルと;対象物が装着され、駆動軸の回転によって回転する対象物装着部と;対象物の枠を固定するガイドと;前記対象物装着部及びガイドを前記駆動軸と連結する駆動軸連結部とを含んで構成されることを特徴とする。本発明を通じて水路と繋がれている噴射ノズルを通じて液体を噴射させて対象物の背面をクリーニングするようにして、工程を進行しながら同時に背面クリーニングが可能なので、工程時間の短縮及び背面のクリーニングにより不良率を減少させることができる。
【選択図】図２The present invention relates to a cleaning apparatus for a back surface of an object, which can perform back surface cleaning by ejecting liquid through an injection nozzle to the back surface of the object simultaneously with the progress of the process of the object. An apparatus for cleaning a back surface of an object according to the present invention includes: a spindle motor that rotates a drive shaft; a drive shaft that is rotated by the spindle motor; and a water channel that is installed through the center of the spindle motor and the drive shaft to form a water channel A pipe; a number of spray nozzles installed at the end of the water pipe; an object mounting part on which an object is mounted and rotated by rotation of a drive shaft; a guide for fixing a frame of the object; and the object It is characterized by including a drive shaft connecting portion for connecting the object mounting portion and the guide to the drive shaft. Through the present invention, it is possible to clean the back surface of the object by spraying liquid through the spray nozzle connected to the water channel, so that the back surface cleaning can be performed at the same time as the process proceeds. The rate can be reduced.
[Selection] Figure 2

Description

本発明は対象物背面の洗浄装置に関するものであり、より詳細には、対象物の工程進行と同時に対象物の背面に噴射ノズルを通じて液体を噴射させて背面クリーニングをすることができる対象物背面の洗浄装置に関するものである。 The present invention relates to an apparatus for cleaning the back of an object. More specifically, the present invention relates to an apparatus for cleaning the back of an object that can be cleaned by spraying liquid onto the back of the object through an injection nozzle simultaneously with the process of the object. The present invention relates to a cleaning device.

従来の対象物を安着させて工程を処理する装置は、図1に図示したように、真空ホール(Vacuum Hole)を利用したコンタクト方式のスピンチャック(Spin Chuck)を使うから、対象物の下部には空間を形成していなかった。 As shown in Fig. 1, a conventional device that processes a process by seating a target object uses a contact type spin chuck (Spin Chuck) that uses a vacuum hole. Did not form a space.

したがって、対象物のトップ工程進行と同時に対象物の背面をクリーニングするということは不可能なので、クリーニングをする場合には対象物の工程を中断させて別途のクリーニング段階を経るか、または、クリーニング段階なしに工程を進行するしかなくて、不良率が高くなる問題点を持っている。 Therefore, since it is impossible to clean the back surface of the object simultaneously with the progress of the top process of the object, when cleaning, the process of the object is interrupted and a separate cleaning step is performed, or the cleaning step However, there is a problem that the defect rate becomes high because the process can only be carried out.

また、スピンチャックに繋がれているモーターシフト軸にはただ真空ホールだけ形成されている。 Also, only a vacuum hole is formed on the motor shift shaft connected to the spin chuck.

したがって、本発明の目的は、スピンドルモーターの中央及び駆動軸を貫通する水路を形成して対象物の背面に水路と繋がれている噴射ノズルを通じて液体を噴射させて対象物の背面をクリーニングすることができる対象物背面の洗浄装置の提供にある。 Therefore, an object of the present invention is to form a water passage that penetrates the center of the spindle motor and the drive shaft, and to spray the liquid through the injection nozzle connected to the water passage on the back surface of the object to clean the back surface of the object. An object of the present invention is to provide a cleaning device for the back of an object.

前記目的を果たすための本発明の対象物背面の洗浄装置は、駆動軸を回転させるスピンドルモーターと;前記スピンドルモーターによって回転する駆動軸と;前記スピンドルモーターの中央及び駆動軸を貫通して設置され, 水路を形成する水路管と;前記水路管の末端部に設置される多数の噴射ノズルと; 対象物が装着され、駆動軸の回転によって回転する対象物装着部と; 前記対象物の枠を固定するガイドと;前記対象物装着部及びガイドを前記駆動軸と連結する駆動軸連結部とを含んで構成されることを特徴とする。 To achieve the above object, the apparatus for cleaning the rear surface of an object according to the present invention includes a spindle motor that rotates a drive shaft; a drive shaft that is rotated by the spindle motor; and a center of the spindle motor and a drive shaft that passes through the spindle. A water pipe forming a water channel; a number of spray nozzles installed at the end of the water pipe; an object mounting portion on which an object is mounted and rotating by rotation of a drive shaft; and a frame of the object A guide that is fixed; and a drive shaft connecting portion that connects the object mounting portion and the guide to the drive shaft.

望ましくは、前記噴射ノズルは、対象物装着部及びガイドによって装着されて空間が確保された対象物の下部に位置して洗浄をすることを特徴とする。 Preferably, the jet nozzle is mounted at the lower part of the target object that is mounted by the target object mounting unit and the guide to secure a space, and performs cleaning.

前記ように構成される本発明による対象物背面の洗浄装置は、水路と繋がれている噴射ノズルを通じて液体を噴射させて対象物の背面をクリーニングするようにして、工程を進行しながら同時に背面クリーニングが可能なので、工程時間の短縮及び背面のクリーニングにより不良率を減少させることができる效果がある。 The apparatus for cleaning the back surface of an object according to the present invention configured as described above is configured to clean the back surface of the object at the same time as the process is performed by cleaning the back surface of the object by injecting liquid through an injection nozzle connected to a water channel. Therefore, it is possible to reduce the defect rate by shortening the process time and cleaning the back surface.

従来の対象物を安着させて工程を処理する真空(Vacuum)方式の装置を現わす斜視図である。FIG. 6 is a perspective view showing a conventional vacuum type apparatus that processes a process by placing a conventional object. 本発明による対象物背面の洗浄装置の断面図である。It is sectional drawing of the washing | cleaning apparatus of the back surface of the target object by this invention.

以下、添付された図面を参照して本発明による対象物背面の洗浄装置の望ましい実試例を詳細に説明する。 Hereinafter, preferred examples of the apparatus for cleaning an object rear surface according to the present invention will be described in detail with reference to the accompanying drawings.

図２は本発明による対象物背面の洗浄装置の断面図である。 FIG. 2 is a cross-sectional view of an apparatus for cleaning the back of an object according to the present invention.

図２に図示したように、本発明による対象物背面の洗浄装置は、駆動軸を回転させるスピンドルモーター110と；前記スピンドルモーターによって回転する駆動軸120と；前記スピンドルモーターの中央及び駆動軸120を貫通して設置され、水路を形成する水路管130と；前記水路管130の末端部に設置される多数の噴射ノズル140と；対象物が装着され、駆動軸の回転によって回転する対象物装着部150と、対象物の枠を固定するガイド160と;前記対象物装着部及びガイドを前記駆動軸と連結する駆動軸連結部170とを含んで構成されることを特徴とする。 As shown in FIG. 2, the apparatus for cleaning the back of an object according to the present invention includes a spindle motor 110 that rotates a drive shaft; a drive shaft 120 that is rotated by the spindle motor; a center of the spindle motor and a drive shaft 120. A water channel pipe 130 that is installed therethrough to form a water channel; a number of spray nozzles 140 that are installed at the end of the water channel tube 130; 150, a guide 160 for fixing the frame of the object; and a drive shaft connecting part 170 for connecting the object mounting part and the guide to the drive shaft.

ここで、前記噴射ノズル140は、対象物装着部150及びガイド160によって装着されて空間が確保された対象物の下部に位置して洗浄をすることを特徴とする。   Here, the jet nozzle 140 is mounted by the object mounting unit 150 and the guide 160 and is positioned below the object in which a space is secured to perform cleaning.

図１に図示したように、従来の方式は真空ホール(Vacuum Hole)を利用したコンタクト方式のスピンチャック(Spin Chuck)を使うため、対象物の下部には空間を全然形成していなくて背面を洗浄するということは不可能である。 As shown in FIG. 1, the conventional method uses a contact type spin chuck that uses a vacuum hole, so there is no space at the bottom of the object and the back side is not formed. It is impossible to wash.

したがって、図２に図示したように、前記真空ホール(Vacuum Hole)を利用したコンタクト方式のスピンチャック(Spin Chuck)代りに対象物装着部150及びガイド160を使って対象物を載せられておく。こんな構成を通じて対象物の下部(背面)に空間を確保することができるし、確保された空間に前記噴射ノズル140を位置させて水路管を通じて供給される液体を噴射ノズル140を通じて対象物の背面をクリーニングするようになる。 Therefore, as shown in FIG. 2, the object mounting unit 150 and the guide 160 are used to place the object in place of the contact-type spin chuck using the vacuum hole. Through such a configuration, it is possible to secure a space in the lower part (back surface) of the object, and position the injection nozzle 140 in the secured space to allow the liquid supplied through the water channel pipe to pass through the back surface of the object through the injection nozzle 140. Come to clean.

また、スピンドルモーター110の駆動によって駆動軸120が回転して駆動軸連結部170が回転するようになるので、駆動軸連結部170と繋がれている対象物装着部150及びガイド160が一緒に回転するようになって、対象物装着部150及びガイド160に装着された対象物が回転するようになる。 In addition, since the drive shaft 120 is rotated by driving the spindle motor 110 and the drive shaft connecting portion 170 is rotated, the object mounting portion 150 and the guide 160 connected to the drive shaft connecting portion 170 are rotated together. Thus, the object mounted on the object mounting unit 150 and the guide 160 is rotated.

この時、前記噴射ノズル140は回転される対象物の背面に液体を噴射して洗浄するようになる。 At this time, the spray nozzle 140 sprays liquid on the back of the object to be rotated and cleans it.

従来には、洗浄装置があるが、対象物の背面を洗浄するのではないし、本発明が吸入式固定装置を採択しないから、対象物を取ってくれる真空吸入手段代りに水路管及び噴射ノズルを構成して対象物(Wafer、マスク)の背面を洗浄することができるようになる。 Conventionally, there is a cleaning device, but it does not clean the back of the object, and since the present invention does not adopt a suction type fixing device, a water pipe and an injection nozzle are used instead of the vacuum suction means for taking the object. It becomes possible to clean the back of the object (Wafer, mask).

一方、本発明の構成及び作用を通じて対象物の工程進行と同時に対象物の背面に噴射ノズル140を通じて液体を噴射させて背面のクリーニングができる長所を持つようになる。 Meanwhile, through the configuration and operation of the present invention, the back surface can be cleaned by spraying liquid through the spray nozzle 140 on the back surface of the target object simultaneously with the progress of the process of the target object.

以上で説明したものは、本発明による対象物背面の洗浄装置を実施するための一つの実施例に過ぎないものであり、本発明は前記一実施例に限定されずに、本発明の特許の請求範囲で請求するように本発明の要旨を抜け出すことがなく、当該発明が属する分野で通常の知識を有した者ならば誰でも多様な変更実施が可能な範囲まで本発明の技術的精神があるということができる。 What has been described above is only one example for carrying out the apparatus for cleaning the back of an object according to the present invention. The present invention is not limited to the above-described one example, and The technical spirit of the present invention is within the scope of various modifications that can be made by anyone who has ordinary knowledge in the field to which the invention belongs without departing from the gist of the present invention as claimed in the claims. It can be said that there is.

本発明は対象物の工程進行と同時に対象物の背面に噴射ノズルを通じて液体を噴射させて背面クリーニングをすることができる対象物背面の洗浄装置に関するものである。 The present invention relates to a cleaning apparatus for a back surface of an object, which can perform back surface cleaning by ejecting liquid through an injection nozzle to the back surface of the object simultaneously with the progress of the process of the object.

Claims (2)

駆動軸を回転させるスピンドルモーターと;
前記スピンドルモーターによって回転する前記駆動軸と;
前記スピンドルモーターの中央及び駆動軸を貫通して設置され、水路を形成する水路管と;
前記水路管の末端部に設置される多数の噴射ノズルと;
対象物が装着され、前記駆動軸の回転によって回転する対象物装着部と;
前記対象物の枠を固定するガイドと;
前記対象物装着部及び前記ガイドを前記駆動軸と連結する駆動軸連結部とを含んで構成されることを特徴とする対象物背面の洗浄装置。 A spindle motor that rotates the drive shaft;
The drive shaft rotated by the spindle motor;
A water pipe that is installed through the center of the spindle motor and the drive shaft and forms a water channel;
A number of spray nozzles installed at the end of the water conduit;
An object mounting portion that is mounted with an object and rotates by rotation of the drive shaft;
A guide for fixing the frame of the object;
An apparatus for cleaning the back of an object, comprising: an object mounting part; and a drive shaft connecting part for connecting the guide to the drive shaft. 前記多数の噴射ノズルは、前記対象物装着部及び前記ガイドによって形成される前記対象物の下部に位置することによって、前記対象物背面を洗浄することを特徴とする、請求項１に記載の対象物背面の洗浄装置。 The object according to claim 1, wherein the plurality of spray nozzles are disposed under the object formed by the object mounting unit and the guide to clean the back surface of the object. Cleaning device for the back of objects.
JP2009513037A 2006-05-29 2006-05-29 Cleaning device for the back of the object Pending JP2009538732A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2006/002036 WO2007139239A1 (en) 2006-05-29 2006-05-29 Reverse side cleaning device of an object

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JP2009538732A true JP2009538732A (en) 2009-11-12

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CN103506339B (en) * 2012-06-28 2017-04-19 盛美半导体设备（上海）有限公司 Device and method for cleaning reverse side of wafer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060076034A1 (en) * 2001-11-27 2006-04-13 Samsung Electronics Co., Ltd. Cleaning method and cleaning apparatus for performing the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW357389B (en) * 1996-12-27 1999-05-01 Tokyo Electric Ltd Apparatus and method for supplying process solution to surface of substrate to be processed
JP2000331975A (en) * 1999-05-19 2000-11-30 Ebara Corp Wafer cleaning device
KR100643455B1 (en) * 2005-06-14 2006-11-10 동부일렉트로닉스 주식회사 Method for cleaning copper of wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060076034A1 (en) * 2001-11-27 2006-04-13 Samsung Electronics Co., Ltd. Cleaning method and cleaning apparatus for performing the same

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