JP2009508773A5 - - Google Patents

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Publication number
JP2009508773A5
JP2009508773A5 JP2008531292A JP2008531292A JP2009508773A5 JP 2009508773 A5 JP2009508773 A5 JP 2009508773A5 JP 2008531292 A JP2008531292 A JP 2008531292A JP 2008531292 A JP2008531292 A JP 2008531292A JP 2009508773 A5 JP2009508773 A5 JP 2009508773A5
Authority
JP
Japan
Prior art keywords
film layer
layer
recess
base film
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008531292A
Other languages
Japanese (ja)
Other versions
JP2009508773A (en
Filing date
Publication date
Priority claimed from US11/228,956 external-priority patent/US20070062844A1/en
Application filed filed Critical
Publication of JP2009508773A publication Critical patent/JP2009508773A/en
Publication of JP2009508773A5 publication Critical patent/JP2009508773A5/ja
Pending legal-status Critical Current

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Claims (5)

カバーテープを含む物品であって、
カバーテープは、
向かい合った長手方向縁部がある基材フィルム層、
長手方向縁部に沿って広がる陥凹部、
長手方向縁部にほぼ平行の破断機構、および
陥凹部に塗布された接着剤を備える、物品。 An article including a cover tape,
Cover tape
A base film layer with opposed longitudinal edges,
A recess extending along the longitudinal edge,
An article comprising a breaking mechanism substantially parallel to a longitudinal edge and an adhesive applied to a recess. 前記基材フィルム層が、第１の物質および第２の物質を含み、前記破断機構が第１の物質および第２の物質間の変わり目を含む請求項１に記載の物品。   The article of claim 1, wherein the substrate film layer includes a first material and a second material, and the breaking mechanism includes a transition between the first material and the second material. カバーテープの製造方法であって、
向かい合う長手方向縁部を有する基材フィルム層を提供するステップと、
各長手方向縁部に沿って伸びる基材フィルム層に陥凹部を形成するステップと、
長手方向縁部に実質的に平行な基材フィルム層に破断機構を形成するステップと、
各陥凹部に接着剤を塗布するステップとを含む方法。 A cover tape manufacturing method comprising:
Providing a substrate film layer having opposite longitudinal edges;
Forming a recess in the base film layer extending along each longitudinal edge;
Forming a breaking mechanism in the base film layer substantially parallel to the longitudinal edge;
Applying an adhesive to each recess. 基材フィルム層は、弱い中間面を有するラミネートされたかまたは共押出された２層の材料を含み、陥凹部を形成するステップは、オフセット位置で各層を中間面まで切断するステップを含み、次に、２層の基材フィルム層の区画を切断部および中間面の一部に沿って互いに分離させるステップを含む請求項３に記載の方法。 The base film layer includes a laminated or coextruded two layer material having a weak intermediate surface, and the step of forming the recess includes cutting each layer to the intermediate surface at an offset location, and 4. The method of claim 3 , comprising separating the two substrate film layer sections from each other along a portion of the cut and the intermediate surface. 基材フィルム層が、外層との接着力より弱い結合力を有する中間層によって分離された、２層のラミネートまたは共押出された材料の外層から成り、陥凹部を形成するステップは、各外層を中間層との境界面までオフセット位置で切断するステップを有し、次に、３層の基材フィルム層の区画を切断部および中間層の一部に沿って互いに分離するステップを含む請求項３に記載の方法。 The base film layer consists of two layers of an outer layer of laminate or co-extruded material separated by an intermediate layer having a bonding strength that is weaker than the adhesive strength with the outer layer, and forming a recess comprises comprising the step of cutting at an offset position to the boundary surface between the intermediate layer, then, according to claim 3 in which the compartments of the base film layer of the three layers along a portion of the cutting portion and the intermediate layer comprises the step of separating from each other The method described in 1.
JP2008531292A 2005-09-16 2006-09-13 Cover tape and manufacturing method Pending JP2009508773A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/228,956 US20070062844A1 (en) 2005-09-16 2005-09-16 Cover tape and method for manufacture
PCT/US2006/035704 WO2007035374A1 (en) 2005-09-16 2006-09-13 Cover tape and method for manufacture

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013161370A Division JP2014015263A (en) 2005-09-16 2013-08-02 Cover tape and method for manufacture

Publications (2)

Publication Number Publication Date
JP2009508773A JP2009508773A (en) 2009-03-05
JP2009508773A5 true JP2009508773A5 (en) 2009-10-22

Family

ID=37622523

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008531292A Pending JP2009508773A (en) 2005-09-16 2006-09-13 Cover tape and manufacturing method
JP2013161370A Pending JP2014015263A (en) 2005-09-16 2013-08-02 Cover tape and method for manufacture

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013161370A Pending JP2014015263A (en) 2005-09-16 2013-08-02 Cover tape and method for manufacture

Country Status (9)

Country Link
US (1) US20070062844A1 (en)
EP (1) EP1932408A1 (en)
JP (2) JP2009508773A (en)
KR (1) KR20080052592A (en)
CN (2) CN101273678A (en)
IL (1) IL190163A0 (en)
MY (1) MY154939A (en)
TW (1) TWI418270B (en)
WO (1) WO2007035374A1 (en)

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US20070062844A1 (en) * 2005-09-16 2007-03-22 Velasquez Urey Ruben E Cover tape and method for manufacture
US8247057B2 (en) * 2005-09-16 2012-08-21 3M Innovative Properties Company Cover tape and method for manufacture
WO2007106856A2 (en) * 2006-03-14 2007-09-20 Allux Medical, Inc. Phototherapy device and method of providing phototherapy to a body surface
KR101464780B1 (en) * 2006-08-09 2014-11-24 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Carrier tapes having tear-initiated cover tapes and methods of making thereof
WO2010036790A1 (en) * 2008-09-25 2010-04-01 Illinois Tool Works Inc. Devices and methods for handling microelectronic assemblies
US20110023548A1 (en) * 2009-07-29 2011-02-03 Garner Sean M Glass substrate comprising an edge web portion
CN101879962A (en) * 2010-06-25 2010-11-10 广东风华高新科技股份有限公司 Tape package of chip components and preparation method and device thereof
CN101955015A (en) * 2010-09-15 2011-01-26 吴江耀鑫光电有限公司 Surface mount component carrier tape upper cover tape and processing method thereof
CN103601029B (en) * 2013-11-19 2016-01-20 江西若邦科技股份有限公司 The manufacturing equipment of cover strip on a kind of SMD heat-sealing type
WO2015134215A1 (en) * 2014-03-04 2015-09-11 3M Innovative Properties Company Cover tapes and assemblies and methods for making
WO2016076331A1 (en) * 2014-11-12 2016-05-19 住友ベークライト株式会社 Cover tape for electronic part package, packaging material for electronic part package, and electronic part package
TWI612858B (en) * 2017-02-17 2018-01-21 盟立自動化股份有限公司 Carrier substrate and method for removing adhesive layer from carrier substrate
TWI622532B (en) * 2017-09-28 2018-05-01 Jenimetal Chemical Factory Co Ltd Improved structure of the cover tape
USD896633S1 (en) 2019-01-29 2020-09-22 Golden State Foods Corp. Container
USD896634S1 (en) 2019-01-29 2020-09-22 Golden State Foods Corp. Container
CN111977174B (en) * 2020-09-16 2021-12-21 江西若邦科技股份有限公司 Easily-torn cover tape and preparation method thereof

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US3467250A (en) * 1968-01-25 1969-09-16 Anthony N D Elia Easy tear tape with lift tab
US4584220A (en) * 1982-01-15 1986-04-22 Kroy Inc. Laminated tape
MY103125A (en) * 1987-07-24 1993-04-30 Lintec Corp Cover tape for sealing chip-holding parts of carrier tape
US4944979A (en) * 1989-10-19 1990-07-31 At&T Bell Laboratories Tape conveyers for components
EP0466937B2 (en) * 1990-02-06 1998-03-18 Sumitomo Bakelite Company Limited Plastic carrier tape and cover tape for electronic component chip
TW203624B (en) * 1991-02-28 1993-04-11 Sumitomo Bakelite Co
US5390472A (en) * 1992-06-19 1995-02-21 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
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TW310121U (en) * 1993-12-22 1997-07-01 Lintec Corp Cover tape
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US20070062844A1 (en) * 2005-09-16 2007-03-22 Velasquez Urey Ruben E Cover tape and method for manufacture

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