JP2009302437A - Component built-in printed wiring board and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a highly reliable component built-in printed wiring board which does not increase manufacturing costs, prevents the formation of a void between a chip component and a base plate, and prevents the occurrence of an electrical connection failure on an inner layer when an electronic component is soldered to an outer layer. <P>SOLUTION: The component built-in printed wiring board includes a printed wiring board intermediate element which has a component-attached inner layer substrate made by disposing a chip component along a through-hole on a base plate composed of an insulating resin plate having the through-hole and a wiring layer, the chip component having an electrode soldered to the wiring layer and being thicker than the base plate, a first insulating resin layer formed by laminating open prepregs on the side of the chip component on the component-attached inner layer substrate, the open prepregs avoiding the chip component through prepreg openings, and a second insulating resin layer formed by laminating open prepregs on the surface opposite to the chip component formation surface on the component-attached inner layer substrate. The component built-in printed wiring board also includes a wiring layer as an outer layer on the printed wiring board intermediate element, and a through-hole penetrating the printed wiring board intermediate element. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a component built-in printed wiring board having a multilayer wiring layer and a multilayer chip component installation layer, and a method for manufacturing the same.

  2. Description of the Related Art In recent years, a printed wiring board on which a semiconductor device is mounted has been required due to the development of semiconductor mounting technology, and a multilayer printed wiring board having a high-density and high-precision wiring layer is required. As one method for realizing high density, printed wiring boards incorporating chip parts such as resistors and capacitors have been developed. In a conventional method for manufacturing a component-embedded printed wiring board, as disclosed in Patent Document 1, the electrodes of an electronic component are soldered to a land of a base plate by heating and melting connection using a solder paste. Then, the inner layer board with the first component on which the electronic component is installed and the inner layer board with the second component on which the electronic component is similarly installed are stacked via the interlayer insulating layer with the installed electronic components facing each other. Was producing printed wiring boards with built-in components.

The known literature is described below.
JP 2005-142178 A

  In this prior art printed wiring board with built-in components, when an electronic component is installed on a base plate and the electronic component is sealed using a lamination method, the insulating interlayer resin does not enter the gap between the electronic component and the base plate. There was a problem that a laminated void was generated in which a space remained in the gap. When this layered void occurs, the solder reflow process in the soldering process of the component to the outer layer of the printed wiring board with built-in component deteriorates the heat resistance of the bonded portion between the insulating interlayer resin and the insulating layer, and easily causes delamination failure. There was a problem. In addition, this laminated void is re-applied to the solder that soldered the electrodes of the built-in electronic components to the multiple lands on the inner layer by the solder reflow process in the soldering process of the components to the outer layer of the printed wiring board with built-in components. There is a problem that the melted and flowed into the laminated void formed in the space between the lands of the inner layer, the solders of a plurality of lands contacted, and the lands of the inner layer were short-circuited with the solder.

  For this reason, in order not to short-circuit between the lands of the inner layer with solder, an improvement measure for soldering the electrode of the electronic component to the land of the inner layer with a melting point change type solder can be considered, but in that case, the manufacturing cost increases was there. In addition, improvement measures to solder the electrode of the electronic component to the land with high temperature solder can be considered, but in that case, the soldering temperature of the high temperature solder is high, so the damage of the base plate to which the electronic component is soldered becomes large, There was a problem of deteriorating the quality of the printed wiring board with built-in components. Alternatively, in order not to generate laminated voids, if an underfill resin is filled in the gap between the base plate and the electronic component after the electronic component is soldered to the base plate, there is a problem that the manufacturing cost is significantly increased.

  The present invention has been devised in view of the above problems, and does not increase the manufacturing cost, does not generate a laminated void between the chip component and the base plate, and also when the electronic component is soldered to the outer layer, An object of the present invention is to obtain a printed wiring board with a built-in component that does not cause poor connection and has high reliability.

In order to solve this problem, the present invention is configured such that a chip component thicker than the thickness of the base plate is placed on a base plate in which a through hole is formed in an insulating resin plate and a wiring layer is formed so as to cover the through hole. A first step of manufacturing an inner layer substrate with components in which component electrodes are soldered to the wiring layer, and an open prepreg in which the chip components are avoided by a prepreg opening on the inner layer substrate with components are installed. A second step of manufacturing a printed wiring board intermediate by installing a prepreg on the surface opposite to the chip component setting surface on the inner layer substrate with components, laminating, heating and pressing, and the printed wiring board; A third step of forming a through-hole prepared hole in the intermediate body, and forming a through-hole plating formed in the through-hole prepared hole by copper plating and an outer wiring layer of the printed wiring board intermediate body It is a manufacturing method of the electronic component embedded printed wiring board and having a fourth step of.

  According to the present invention, in the above-described method for manufacturing a printed wiring board with built-in components, in the first step, the inner substrate with components is manufactured, and a chip component or an integrated circuit chip is formed on the wiring layer of the second base plate. An inner layer substrate with an electronic component to which an electrode is soldered is manufactured, and in the second step, the inner layer substrate with a component and the inner layer substrate with an electronic component are disposed so that the chip component and the electronic component face each other. A method for producing a printed wiring board with built-in components, wherein a printed wiring board intermediate is produced by laminating the opening prepreg between the inner layer board with components and the inner layer board with electronic components, and heating and pressing. It is.

  In the present invention, a chip component thicker than the thickness of the base plate in which an electrode is soldered to the wiring layer is installed on the base plate in which a through hole is formed in the insulating resin plate and the wiring layer is formed, covering the through hole. An inner layer substrate with components, a first insulating resin layer formed by laminating an opening prepreg avoiding the chip components by a prepreg opening on the chip component side on the inner layer substrate with components, and with the components A printed wiring board intermediate comprising a second insulating resin layer formed by laminating a prepreg on the side opposite to the chip component installation surface on the inner layer substrate, and an outer layer of the printed wiring board intermediate A printed wiring board with a built-in component, comprising a wiring layer and a through hole penetrating the printed wiring board intermediate body.

  According to the present invention, in the printed wiring board with built-in components, together with the inner layer substrate with components, an inner layer substrate with electronic components in which a chip component or an electrode of an integrated circuit chip is soldered to the wiring layer of the second base plate. The inner layer substrate with components and the inner layer substrate with electronic components are arranged so that the chip component and the electronic component face each other, and the opening prepreg is sandwiched between the inner layer substrate with components and the inner layer substrate with electronic components. A printed wiring board with a built-in component, comprising the first insulating resin layer formed by laminating.

  In the component built-in printed wiring board of the present invention, a through hole is formed in the base plate, a chip-mounted inner layer substrate is manufactured on the through hole of the base plate, and a prepreg is installed on both sides of the component inner layer substrate. Since the printed wiring board with built-in components is manufactured by laminating, the prepreg resin flows into the gap between the chip component and the base plate from the through hole of the base plate and fills the gap, so there is no highly reliable component without laminated voids. There is an effect that a built-in printed wiring board can be obtained.

<First Embodiment>
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 6 are cross-sectional views schematically showing the steps of the method for producing a component built-in printed wiring board of the present invention.

(Process 1)
First, as shown in FIG. 1A, the method of manufacturing a component-embedded printed wiring board has a thickness of 0.04 mm to 0.1 mm, preferably 0.03 mm, having a plurality of wiring layers 11. A land 1 embedded in the inner layer after the subsequent lamination in a part of the outer wiring layer 11 of the 0.1 mm insulating resin plate
The base plate 10a having the pattern 3 is manufactured. As the base plate 10a, a multilayer substrate having the wiring layer 11 in the inner layer as well as the front and back wiring layers 11 can be used. Further, a through hole or a filled via hole that conducts the front and back may be formed in the base plate 10a. This base plate 10a contains glass fibers in its insulating resin plate, and has a thermal expansion coefficient in the surface direction of the substrate (thermal expansion coefficient at 30 to 120 ° C. tested according to JIS-C6481) of 8 to 12 × 10 −6 / A material having a small Tg value of about Kelvin and a glass transition temperature Tg value obtained by testing under the processing condition TMA of about 160 to 170 ° C. is used. The base plate 10a can withstand the temperature at which the built-in component is soldered by using a material having this characteristic, and has an effect of excellent dimensional stability in the manufacturing process.

(Process 2)
Next, as shown in FIG. 1B, an opening 14 of a desired size is hollowed out at a desired position using a press, drilling, laser, or the like on the base plate 10a. Then, a through hole 14 a in the chip component area is cut out at a planned installation location of the chip component 20. The through hole 14a in the chip component region is formed to be smaller than the size of the chip component 20 installed thereon, and formed to have a size covered with the chip component 20 by installing the chip component 20. Here, the through-hole 14a in the chip component region may be formed so that a part thereof protrudes from the region of the chip component 20 installed thereon.

(Process 3)
Next, as shown in FIG. 1C, the land 13 of the base plate 10a and the electrode 21 of the chip component 20 are soldered with the solder 22 as follows, and the chip component 20 is inserted into the through hole in the chip component region. The inner layer substrate 17 with components installed so as to cover 14a is produced. The chip component 20 installed here has a size of 0603 type (0.6 mm × 0.3 mm × 0.23 mm), 0402 type (0.4 m × 0.2 mm × 0.12 mm), 3 mm × 0.15 mm × 0.07 mm microchip parts,
Alternatively, a chip component 20 such as a 10005 low-profile type multilayer ceramic chip capacitor, a resistor, or an inductor element having a size of the same is installed. Since the base plate 10a is thinner than the chip components 20 and the depth of the through-holes 14a in the chip component region is shallower than the height of the chip components 20, there is an effect that it can be easily filled with resin.

  Next, as shown in FIG. 2A, the second base plate 10b having a thickness of 0.03 mm to 0.1 mm, in which the patterns of the lands 13 and 13b are formed on the wiring layer 11 by the step 1 described above, is formed. To manufacture. Next, as shown in FIG. 2B, in step 2, an opening 14b having a desired size is hollowed out at a desired position of the second base plate 10b. Then, the chip component region through-hole 14c is hollowed out at a planned installation location of the chip component 20. Next, as shown in FIG. 2C, in step 3, the electrode 21 of the chip component 20 is joined to the land 13 of the base plate 10b with the solder 22 to produce the component-attached inner layer substrate 17b on which the chip component 20 is mounted. To do.

(Process 4)
Next, as shown in FIG. 3D, an integrated circuit chip 30 having a height of 300 μm or less and a metal bump electrode 31 such as copper or gold is used, and the metal bump electrode 31 is used. A solder bump 32 is formed at the tip of the semiconductor chip, and the solder bump 32 of the integrated circuit chip 30 is heated to about 200 ° C. with infrared rays, so that the solder bump 32 is melted and the integrated circuit chip 30 is attached to the base plate 10b on the bump electrode 31 side. (Face down), the melted solder bump 32 is brought into contact with the land 13b of the base plate 10b. Thus, as shown in FIG. 3E, the bump electrodes 31 of the integrated circuit chip 30 are soldered to the lands 13b of the base plate 10b with the solder bumps 32.

(Process 5)
Next, as shown in FIG. 3 (f), a sealing resin is injected into the connecting portion between the land 13b of the space between the lower surface of the integrated circuit chip 30 of the base plate 10b and the base plate 10b and the bump electrode 31 with a dispenser or the like. The component-attached inner layer substrate 17b on which the protective resin layer 33 is formed by heat curing is created. Similarly, the inner layer substrate 17 with components prepared on the base plate 10a is similarly protected by applying a resin having chemical resistance to the connecting portion between the chip component 20 and the land portion 13 with a dispenser or the like, followed by heat curing. The component-attached inner layer substrate 17 on which the layer 33 is formed is produced. As the resin having chemical resistance, a UV-thermosetting epoxy resin is preferable.

(Step 6)
Next, the surface of the wiring layer 11 on the inner layer substrates 17 and 17b with components is roughened using a roughening solution. This roughening treatment is performed by a strong alkali chemical treatment, and a blackening reduction treatment, a sulfuric acid-hydrogen peroxide blackening alternative treatment (copper roughening treatment), or the like can be used. By performing this roughening treatment, complex and fine irregularities are formed on the surface of the wiring layer 11, and the adhesion of the resin when forming an insulating resin layer to be described later is improved. It is possible to prevent breakage of the bonded portion. Thus, when the surface of the wiring layer 11 is roughened, the protective resin layer 33 is contaminated with the solder 22, the solder bump 32, the integrated circuit chip 30, and the electrode 21 of the chip component 20 with the processing liquid, thereby insulating the substrate. To prevent deterioration of heat resistance and heat resistance.

(Modification 1)
The above steps 5 and 6 can also be performed in the following deformation step 5-1 and deformation step 6-1.
(Deformation step 5-1)
As shown in FIG. 3F, a sealing resin is injected into the connecting portion between the land 13b and the bump electrode 31 in the space between the lower surface of the integrated circuit chip 30 of the base plate 10b and the base plate 10b and the bump electrode 31, and is cured by heating. Thus, the component-attached inner layer substrate 17b on which the protective resin layer 33 is formed is prepared. At this time, the protective resin layer 33 is not particularly formed at the connection portion between the chip component 20 and the land 13 for the component-attached inner layer substrate 17 previously formed on the base plate 10a. (Deformation step 6-1)
Next, the surface of the copper wiring layer 11 on the inner substrates 17 and 17b with parts contains 2 mol or more of alkanolamine with respect to 1 mol of fatty acid carboxylic acid, and contains a copper ion source and a halogen ion source. Next, the surface of the wiring layer 11 is contacted with an aqueous solution containing an azole compound and an organic acid to form a thick film of the azole compound on the surface of the wiring layer 11. A treatment for improving the adhesiveness of the resin is performed. Since the microetching agent in the process of the deforming step 6-1 has low corrosiveness, it can be roughened without damaging the connection part between the chip component 20 and the land 13. Application of a resin having can be omitted.

(Step 7)
Next, an opening prepreg 42 in which the prepreg opening 41 having the size of the integrated circuit chip 30 and the chip component 20 is formed by drilling, punching, laser processing or the like at a predetermined position of the prepreg 40 (FIG. 4). (See (a)). Here, since the prepreg opening 41 is processed with holes according to the sizes of the integrated circuit chip 30 and the chip component 20, when forming the printed wiring board intermediate 50 to be described later, during heating and pressure molding This pressure pressure can be prevented from concentrating on the chip component 20, and there is an effect of preventing the chip component displacement, chip component destruction, and cracks in the electrode 21 of the chip component 20 and the solder 22 of the land 13. Moreover, the insulating material of the prepreg 40 has a small coefficient of thermal expansion coefficient (thermal expansion coefficient at 30 to 120 ° C. tested in accordance with JIS-C6481) in the direction of the substrate surface after curing of about 8 to 12 × 10 −6 / Kelvin. Yes, a glass transition temperature Tg value obtained by testing under processing conditions TMA is used, and a material having a high Tg of about 160 to 170 ° C. is used. By using materials with this characteristic,
Matching with the characteristics of the insulating resin plates of the base plates 10a and 10b, there is an effect that in the subsequent manufacturing process, no stress remains in the substrate and the substrate is not warped and the manufacturing is stabilized.

(Process 8)
Next, as shown in FIG. 4 (a), a prepreg 40 having a thickness of about 0.06 mm on the copper foil 52, an inner layer substrate 17b with components thereon, and a chip component 20 thereon are mounted. The opening prepreg 42 avoided by the opening 41, the inner layer substrate 17 with components thereon, the prepreg 40 having a thickness of about 0.06 mm thereon, and the copper foil 51 are aligned and laminated thereon, Heat and pressurize. The condition of this lamination process is that the degree of vacuum between about 30 minutes and 60 minutes from the start of lamination is reduced to 4 kPa or less, and then returned to atmospheric pressure. Pressurization of the substrate is performed at 0.5 MPa for 10 to 30 minutes from the start of lamination, and then the pressure is increased to 2 to 3 MPa. The hot platen temperature is raised from 80 ° C. to 130 ° C. in 1.5 to 2.5 minutes, and after returning the degree of vacuum to atmospheric pressure, the substrate temperature is allowed to reach 170 ° C. or higher. The holding time is 40 minutes or more (for example, 45 minutes) and the layers are stacked. The degree of vacuum is returned to the atmospheric pressure before the substrate temperature reaches 170 ° C. or higher. However, if the degree of vacuum is not returned to the atmospheric pressure at this timing, there is a problem that bubbles are generated in the resin. Further, if the substrate temperature is not kept at 170 ° C. or higher for 40 minutes or more, the filling property of the printed wiring board intermediate 50 by the resin from the opening prepreg 42 and the gap between the integrated circuit chip 30 and the opening prepreg 42 by the resin This causes a problem that makes it worse.

  In this laminating process, the resin melted from the prepreg passes through the chip component region through holes 14a and 14c from the surface of the base plate opposite to the mounting surface of the chip component 20, and the chip component 20 and the base plate 10a. 10b. The depths of the through hole 14 a and 14 c in the chip component region are shallower than the height of the chip component 20 because the base plates 10 a and 10 b are thinner than the chip component 20. Therefore, these through-holes 14a and 14c in the chip component region have an effect of being easily filled with resin. When the through-hole 14a in the chip component region is formed so that a part thereof protrudes from the region of the chip component 20 installed thereon, the resin flowing in from the through-hole 14a in the chip component region protrudes from the region of the chip component 20. Chip part 20 by pushing the chip part 20 through the through hole 14a in the chip part region from the surface opposite to the chip part 20 of the base plate 10a or 10b. There is an effect of avoiding the occurrence of a problem that 20 is removed from the base plate 10a or 10b.

  Since the chip component 20 is soldered and mounted on the flat base plates 10a and 10b and the chip component 20 is avoided by the prepreg opening 41, the opening prepreg 42 is installed on the base plates 10a and 10b. The periphery of the chip component 20 is supported by an opening prepreg 42 having the same height as the chip component 20, and the entire space is filled. As a result, there is an effect that no laminated void is generated in the gap between the chip component 20 and the base plates 10a and 10b. In this way, as shown in FIG. 4B, the inner substrates 17 and 17b with components are placed facing the chip component 20 and the integrated circuit chip 30, the opening prepreg 42 is placed between them, and the outer side is insulated by the prepreg 40. The printed wiring board intermediate body 50 in which the resin layers 46 and 47 and the copper foils 51 and 52 are laminated is manufactured.

  In this step 8, in addition to the above method, the printed wiring board intermediate 50 can be manufactured as follows. That is, in the second manufacturing method, a copper foil with resin is used instead of the copper foil 52 and the prepreg 40 thereon, and the copper foil with resin is used instead of the copper foil 51 and the prepreg 40 thereunder. The printed wiring board intermediate 50 can also be manufactured.

  As a third manufacturing method, only the inner layer substrate 17b with components, the opening prepreg 42 thereon, and the inner layer substrate 17 with components thereon are stacked, and the substrate temperature is maintained at 170 ° C. or higher for 40 minutes or longer. A printed wiring board intermediate 50 shown in FIG. 4B can be manufactured by laminating a substrate in a laminating step and then laminating a copper foil with resin on both sides of the substrate.

(Step 9)
Next, the copper foils 51 and 52 on the outer layer of the printed wiring board intermediate 50 are removed by etching. Next, as shown in FIG. 5C, a through-hole prepared hole 53 having a diameter of 0.06 mm to 2 mm is formed in the printed wiring board intermediate 50 by drilling. Next, the insulating resin layers 46 and 47 are punched with an ultraviolet laser such as a harmonic YAG laser or an excimer laser, or an infrared laser such as a carbon dioxide gas laser, so that the diameter of the wiring layer 11 is 0.04 mm. A 0.2 mm via hole 54 is formed.

(Process 10)
Next, desmear, plating catalyst application, and electroless copper plating are performed on the surfaces of the insulating resin layers 46 and 47 to form a plating base layer (not shown). Next, a photosensitive layer is formed by applying a resist or a photosensitive dry film on the outside of the plating base layer, and a series of patterning processes such as pattern exposure and development are performed to form a plating resist pattern. Form. Next, the wiring layer 56 is formed on the surfaces of the insulating resin layers 46 and 47 as shown in FIG. 5D by dipping in a copper sulfate plating bath and performing electrolytic copper plating using the plating base layer as a cathode. Then, a filled via hole 55 in which the via hole hole 54 is filled with copper plating is formed integrally with the wiring layer 56, and a through hole plating 57 by copper plating is formed on the side wall surface of the through hole lower hole 53. Next, the plating resist pattern is peeled off, and the plating base layer under the plating resist pattern is removed by flash etching, thereby forming a pattern of the wiring layer 56.

  In the above processing, the semi-additive method is used for forming the pattern of the wiring layer 56. However, the present invention is not limited to this, and the pattern of the total wiring 56 can be formed as follows. That is, first, filled via holes 55 and through-hole plating formed integrally with the wiring layer 56 formed on the entire surface by electrolytic copper plating using the plating base layer as a cathode outside the plating base layer on the surfaces of the insulating resin layers 46 and 47. 57 is formed, and then a photosensitive dry film is attached to the outside of the wiring layer 56 formed on the entire surface to form a photosensitive layer, and a series of patterning processes such as pattern exposure and development are performed to form an etching resist pattern. Form. Then, the wiring layer 56 can be formed by etching the wiring layer 56 using the etching resist pattern as a protective film.

(Step 11)
Next, as shown in FIG. 5E, insulating resin layers 48 are formed on both surfaces of the substrate.
(Step 12)
Next, as shown in FIG. 6 (f), through-hole lower holes 53 b and via hole holes 54 b are formed at predetermined positions of the insulating resin layer 48.
(Step 13)
Next, as shown in FIG. 6 (g), a filled via hole 55b is formed in the via hole 54b by copper plating, a wiring layer 56b is formed on the surface of the insulating resin layer 48, and the sidewall surface of the through hole lower hole 53b is formed. Through-hole plating 57b is formed. If necessary, the wiring layers 56b having a desired number of layers are formed by repeating the formation of the insulating resin layer, the filled via hole, and the wiring layer 56b a predetermined number of times.

(Step 14)
Next, the substrate is subjected to CZ treatment, and then a photosensitive solder resist is applied to a thickness of about 20 μm by spray coating, roll coating, curtain coating, or screen method and dried to form a solder resist on the outer layer. Alternatively, a photosensitive dry film / solder resist is attached to a substrate by roll lamination to form a solder resist. Next, the solder resist is exposed and developed to open an opening for the external connection pad, and is cured by heating. Next, 3 μm or more of electroless Ni plating is formed in the external connection pad opening, and 0.03 μm or more of electroless Au plating is formed thereon. The electroless Au plating can be formed to 1 μm or more. Further, it is possible to pre-coat with solder. Further, instead of electroless plating, electrolytic Ni plating can be formed to 3 μm or more, and electrolytic Au plating can be formed thereon to 0.5 μm or more. Alternatively, an organic rust preventive film such as tough ace can be formed in addition to the plating treatment.
(Step 15)
The printed circuit board with built-in components is obtained by processing the outer shape of the finished board with a dicer.

  Further, in this embodiment, the through-hole plating 57 of FIG. 5D and the through-hole plating 57b of FIG. 6G are replaced with a filling-type through-hole plating 57 that fills the entire space of the through-hole lower holes 53 and 53b, It is also possible to form with 57b.

  In this embodiment, the component-attached inner layer substrates 17a and 17b are formed by joining the chip component 20 and the integrated circuit chip 30 to the lands 13 and 13b of the base plates 10a and 10b with the solder 22 and the solder bumps 312. The printed circuit board intermediate 50 was formed by stacking the chip component 20 and the integrated circuit chip 30 of the inner layer substrates 17a and 17b with components facing each other and sandwiching the opening prepreg 42 between the substrates. During the lamination, the gap between the chip component 20 and the base plates 10a and 10b is sufficiently filled with the resin through the through-holes 14a and 14c in the chip component region to prevent the generation of laminated voids. Even if the solder for joining the electrode 21 and the land 13 of the chip component 20 is remelted by heat treatment when soldering the component to the printed wiring board with built-in component, the solder does not move, and the embedded chip component There is an effect that a highly reliable printed wiring board with a built-in component can be obtained without causing a problem that the 20 lands 13 are short-circuited with remelted solder. Therefore, since it is not necessary to use high-temperature solder for soldering to join the electrode 21 and the land 13 of the chip component 20, it is possible to reduce damage to the base plates 10 a and 10 b without increasing the soldering temperature, so that high-quality component built-in printing is possible. There is an effect that a wiring board is obtained.

<Second Embodiment>
As a second embodiment, as shown in FIG. 7, a protective resin liquid is applied to the surface of the chip component 20 with a dispenser or the like on the base plate 10b in which the through hole 14c in the chip component region is formed, and the protective resin liquid is applied to the base plate 10b. The protective resin layer 33 in which the gap between the chip component 20 and the base plate 10b is filled with the protective resin may be formed by flowing out of the through hole 14c in the chip component region. On the other hand, the integrated circuit chip 30 is placed with the bump electrode 31 facing upward (face up) and the back surface adhered to the base plate 10b with an adhesive 34 to form the component-attached inner substrate 17b. As shown in FIG. 4, a printed wiring board intermediate body is formed by laminating the thus formed inner substrate 17b with components, the opening prepreg 40, etc., and a desired built-in printed wiring board is obtained through a subsequent build-up process. It is also possible to manufacture.

  Further, the present invention provides a base plate 10a in which a through hole 14a in a chip component region is formed in an insulating resin plate thinner than the thickness of the chip component 20 and a wiring layer 11 and a land 13 are formed on the through hole 14a in the chip component region. The chip component 20 is installed on the inner layer substrate 17 and the component inner layer substrate 17 is manufactured by soldering the electrode 21 to the land 13 of the wiring layer 11. In the stacking step of step 8 shown in FIG. 4, the prepreg 42 and the prepreg in which the prepreg opening 41 that avoids the chip component 20 of the inner layer substrate 17 with components is formed without necessarily facing the inner layer substrate 17b with second components. By laminating 40 and copper foils 51 and 52, a component built-in printed wiring board can be obtained. Even in such a case, during the stacking, the gap between the chip component 20 and the base plate 10a is sufficiently filled with the resin through the through hole 14a in the chip component region to prevent the generation of the stacked void, and the completed component built-in printing The solder for joining the electrode 21 and the land 13 of the chip component 20 does not move even by the heat treatment when soldering the component to the wiring board, and the land 13 of the built-in chip component 20 is short-circuited by remelting solder. There is an effect that a highly reliable printed wiring board with built-in components that does not cause defects can be obtained.

  In addition, a land 13 for forming a built-in element is formed on the wiring layer 11 of the base plate 10a or 10b of the present invention, and a resistor paste electrically connected to the land 13 is screen printed to form an internal resistance component. The chip component 20 can be installed on the base plate 10a or 10b to form the component-attached inner layer substrate 17 or 17b. On the other hand, the component built-in printed wiring can be manufactured by the following manufacturing steps from Step 5 to Step 15 of the first embodiment.

It is sectional drawing which shows typically the manufacturing process of the 1st component-attached inner layer board | substrate of the 1st Embodiment of this invention. It is sectional drawing which shows typically a part of manufacturing process of the 2nd layer inner board | substrate with a component of the 1st Embodiment of this invention. It is sectional drawing which shows typically a part of manufacturing process of the 2nd layer inner board | substrate with a component of the 1st Embodiment of this invention. It is sectional drawing which shows typically the manufacturing process of the printed wiring board intermediate body of embodiment of this invention. It is sectional drawing which shows typically a part of manufacturing process of the component built-in printed wiring board of embodiment of this invention. It is sectional drawing which shows typically a part of manufacturing process of the component built-in printed wiring board of embodiment of this invention. It is sectional drawing which shows typically the inner layer board | substrate with components of the 2nd Embodiment of this invention.

Explanation of symbols

10a, 10b ... Base plates 11, 56, 56b ... Wiring layers 13, 13b ... Lands 14, 14b ... Openings 14a, 14c ... Through holes 17, 17b in the chip component region Inner layer substrate 20 ... chip component 21 ... electrode 22 ... solder 30 ... integrated circuit chip 31 ... bump electrode 32 ... solder bump 33 ... protective resin layer 34 ... adhesion Agent 40 ... Prepreg 41 ... Prepreg opening 42 ... Opening prepreg 46, 47, 48 ... Insulating resin layer 50 ... Printed wiring board intermediate 51, 52 ... Copper foil 53, 53b ..Through hole lower holes 54, 54b ... Via hole holes 55, 55b ... Filled via holes 57, 57b ... Through hole plating

Claims (4)

  A component in which a chip component thicker than the thickness of the base plate is installed on a base plate in which a through hole is formed in an insulating resin plate and a wiring layer is formed, and the electrode of the chip component is soldered to the wiring layer A first step of manufacturing an inner layer substrate with a chip, and an opening prepreg avoiding the chip component by a prepreg opening on the chip component side on the inner layer substrate with a component, and the chip component on the inner layer substrate with a component A second step of producing a printed wiring board intermediate by installing a prepreg on the opposite side of the installation surface, laminating, heating and pressurizing, and a third step of forming a through-hole prepared hole in the printed wiring board intermediate; And a fourth step of forming a through hole plating formed in the through hole prepared hole by copper plating and an outer wiring layer of the printed wiring board intermediate body. Method for producing that component embedded printed wiring board.   2. The method of manufacturing a component built-in printed wiring board according to claim 1, wherein in the first step, the inner substrate with the component is manufactured, and an electrode of a chip component or an integrated circuit chip is soldered to the wiring layer of the second base plate. In the second step, the inner layer substrate with components and the inner layer substrate with electronic components are arranged so that the chip components and the electronic components face each other, and with the components A method of manufacturing a printed wiring board with a built-in component, wherein a printed wiring board intermediate is manufactured by laminating an opening prepreg between an inner layer board and the inner layer board with electronic components, and heating and pressing.   An inner layer substrate with components in which a chip component thicker than the thickness of the base plate in which an electrode is soldered to the wiring layer is installed on the base plate in which a through hole is formed in an insulating resin plate to form a wiring layer; A first insulating resin layer formed by laminating an opening prepreg on which the chip component is avoided by a prepreg opening on the chip component side on the inner layer substrate with the component, and the chip on the inner layer substrate with the component A printed wiring board intermediate having a second insulating resin layer formed by laminating a prepreg on the side opposite to the component installation surface, and a wiring layer on the outer layer of the printed wiring board intermediate; A component built-in printed wiring board comprising a through hole penetrating the printed wiring board intermediate body.   4. The component built-in printed wiring board according to claim 3, further comprising an inner layer substrate with an electronic component in which an electrode of a chip component or an integrated circuit chip is soldered to a wiring layer of a second base plate together with the inner layer substrate with the component. The inner layer substrate with an electronic component and the inner layer substrate with an electronic component are arranged such that the chip component and the electronic component face each other and the opening prepreg is sandwiched between the inner layer substrate with the component and the inner layer substrate with the electronic component. A printed wiring board with a built-in component, comprising the first insulating resin layer formed as described above.

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