JP2009302211A - Substrate, composite substrate, semiconductor package, device with semiconductor package, and method of manufacturing substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate, a composite substrate, a semiconductor package and a device with the semiconductor package which have an elastic conductor capable of being self-positioned, and to provide a method of manufacturing the substrate. <P>SOLUTION: The substrate with a connector 8 is characterized in that it includes: the conductor 3 having a projection portion 4 of a conductive member and an elastic split portion 6 of the conductive member; and a substrate 1 with a through-hole 2 for holding the conductor. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention includes a substrate, a composite substrate, a semiconductor package, and a semiconductor package, each including a conductor having a convex portion of a conductive member, an elastic leg portion, and the like, and a through-hole that holds the conductor. The present invention relates to an apparatus and a method for manufacturing a substrate.

In the field of semiconductor packages, it is necessary to determine the wiring form from an integrated circuit consisting of high-density wiring to a motherboard as a connection part to an electronic device with relatively low wiring density via various intermediate substrates. is there. In the actual physical structure of wiring, there are various technical issues, and mounting wiring design is proceeding in response to them. This form of mounting wiring further reduces the product size and simplifies the process. Contributes to improving quality and production efficiency. Among electronic devices, as a form of mounting wiring in computer-related devices, a pin grid array (PGA) as a microprocessor package is widely used by being coupled to a socket on a motherboard of the device. Regarding the connection form between the mother board and the wiring layer of the intermediate substrate, Japanese Patent Application Laid-Open No. 2004-228561 discloses a “wiring layer having a spring-like external electrode” with respect to a mechanism having a buffer property against stress. As for the attachment / detachment of the integrated circuit package to / from the printed board, Patent Document 2 discloses “lead pins that can be easily attached to / detached from the board”.
JP 2001-177010 A JP-A-8-236658

  In the conventional substrate, in the step of providing a spring as a stress buffer material on the substrate, the spring is attached, the relative positional relationship between the hole on the substrate side where the spring is to be placed and the spring body, and the spring is attached. It has been difficult to realize the posture position control of the spring body or the fitting with the substrate. In addition, the attachment of the lead pins at the joints in the integrated circuit package has complicated processes.

  The present invention has been made to solve the above-described problems, and is a substrate, a composite substrate, a semiconductor package, an apparatus and a substrate including a semiconductor package, which can perform self-running positioning and have an elastic conductor. The manufacturing method of can be provided.

  In order to achieve the above object, a substrate of the present invention is a substrate having a connection terminal, and has a conductor having a convex portion of the conductive member and an open leg portion having elasticity of the conductive member, and holds the conductor. It can be configured to have a through hole.

  In order to achieve the above object, the substrate of the present invention is a substrate having connection terminals, a conductor having convex portions of the conductive member, an open leg portion having elasticity of the conductive member, and a position setting rod. And a through hole for holding the conductor.

  In order to achieve the above object, the manufacturing method of the present invention includes a conductive member having a convex portion of a conductive member, an open leg portion having elasticity of the conductive member, and a position setting rod, and a through hole that holds the conductive member. A method of manufacturing a substrate having a hole, wherein the conductor is aligned by an alignment jig, and the conductor and the through-hole aligned in the alignment jig by the alignment process are mutually connected. The positioning may be performed by moving the alignment jig, and may include a positioning process and an insertion process in which the conductor is inserted into the through hole by pressing the alignment jig.

  According to the present invention, it is possible to provide a substrate, a composite substrate, a semiconductor package, an apparatus including the semiconductor package, and a method for manufacturing the substrate, which can perform self-running positioning and have an elastic conductor.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

(First embodiment)
The first embodiment of the present invention is a form of a substrate having a conductor. Such a substrate is used as an intermediate substrate of the entire device in which a semiconductor device or the like is mounted on a motherboard.

  FIG. 1A illustrates an intermediate substrate 10A for electrical connection and mechanical connection between the mounting substrate 100 and the motherboard 90 in the device 10 including the semiconductor package.

  FIG. 1B is a diagram illustrating the configuration of a substrate and a conductor according to the present invention. A conductor 3 having a convex portion 4 and an open leg portion 6 having elasticity is inserted into a space formed by a through hole 2 provided in the main body of the insulating substrate 1. The conductor 3 is electrically connected to the connection terminal 8 by the plating layer 2 a on the surface of the through hole and the conductive paste 7. As the material of the main body of the substrate 1, phenol resin, epoxy resin or the like is used.

(Board form)
In FIG. 1B, the main body of the substrate 1 is used by changing its wiring density and the number of stacked layers in accordance with the mounting design conditions. For example, a substrate having a structure in which a plurality of wiring layers and insulating layers are alternately stacked and the wiring layers are electrically connected to each other is used. In addition, when the substrate is used only for electrical connection with the electrical connection terminal of the motherboard to be connected and plating is not required on the structure of the wiring layer or the surface of the through hole, The structure is such that the conductor 3 is directly attached.

  FIG. 1C illustrates a substrate having a structure in which a conductor is mounted in a through-hole of a main body of the perforated substrate. In this example, the convex portion 14 of the conductor 13 is press-fitted into the through-hole 12 drilled in the main body of the substrate 11, fixed by the conductive paste 17, and connected to the surface 11 a side of the substrate 11.

  FIG. 1D exemplifies a substrate having a shape in which a conductor is dropped into the through hole 106 and fixed from the vertical direction of the plane of the substrate placed horizontally, unlike FIG. 1B or 1C described above. In addition to the resin, a silicon or ceramic material can be used for the substrate body depending on the wiring density or mounting design conditions. For example, the thickness of the substrate is 200 μm, the opening diameter of the through hole is 200 μm or more, the height of the conductor is 300 μm to 600 μm, and the diameter of the conductor is 200 μm to 400 μm. As an example of the conductor, the height is 300 μm and the diameter is 200 μm.

(Conductor form 1)
The conductor according to the present invention includes a convex portion and an elastic leg portion in order to exhibit functions such as self-running positioning in combination with the substrate, elastic connection with the motherboard, and conduction. And a position setting hook. As the shape, a plate-like body, a set of plate-like bodies, a three-dimensional shape, or the like can be used.

  FIG. 2A illustrates a unit of conductors in a set of plate-like bodies. The conductor unit 23 includes a convex portion 24 to be inserted into a through hole (not shown) of the substrate, an open leg portion 26 having elasticity, and a position setting bar 25. The conductor unit 23 is inserted into a through hole (not shown) of the substrate, and the position setting bar 25 comes into contact with the edge of the through hole, whereby the position in the through hole direction is determined. Here, the convex portion 24 is an aggregate of plate-like convex portions 24-1 and 24-2. Although the inclination angle α of the inclined surface 22 of the convex portion 24 is approximately 30 degrees, the inclination angle may be increased or decreased depending on the state of self-propelled positioning or the frictional state at the time of insertion into the through hole of the substrate. Or the surface itself can be formed as a concave curved surface or a convex curved surface.

  FIG. 2B is a cross-sectional view of the conductor unit taken along section line AA (FIG. 2A). The conductor unit 23 is composed of two pieces 20 and 21, and the shape of each piece has an opening β of approximately 90 degrees when viewed from the direction in which it is inserted into the through hole (perpendicular to the plane of FIG. 2B). It is the shape bent as. As the processing method, die bending using a punch and a die, press working of a plate material, or the like is used. Thermal processing is performed according to the plate shape. As shown in FIG. 2B, the positions of the individual pieces 20 and 21 are set by bringing the back surfaces into contact with each other, and as shown in FIG. 2C, concave and convex grooves are formed on the back surfaces of the individual pieces. A more stable position can be maintained by using a combination form. Phosphor bronze, beryllium copper, or the like is used as the material for the conductor having such elasticity.

  In addition, the opening β of the two pieces 20 and 21 of the conductor unit 23 is approximately 90 degrees in the example of FIG. 2B, but if β is less than 180 degrees, the back surfaces of the pieces are butted together. Therefore, β can be appropriately set according to the mounting state of the semiconductor package to which the present substrate is applied on the mother board and the production state of the conductor.

  FIG. 2D is a cross-sectional view taken along the cutting line AA (FIG. 2A) of the conductive unit when β is 120 degrees.

  FIG. 2E is an example of the conductive unit when β is 60 degrees. The number of pieces is not limited to two, and a unit can be formed by using three pieces as in this example. In this case, each piece is placed in at least three directions as viewed from the insertion direction. It becomes the extended form.

(Conductor form 2)
The conductor form 2 of the present invention is an example of a conductor unit formed based on a three-dimensional material.

  FIG. 3A illustrates the shape of the conductor formed by forging or cutting. The conductor unit 13 includes a convex portion 14 whose tip 37 has a cross-sectional area smaller than that of the root portion 38, a position setting bar 15, and an open leg 16 having elasticity. The forged or cut conductor may require thermal processing for distortion correction.

  FIG. 3B illustrates the shape of the conductor used in the substrate of FIG. 1D in a configuration in which the conductor is dropped and secured from the vertical direction of the substrate plane. The contact surface 31 with the through hole of the conductor has a tapered shape so that the conductor itself is dropped along the edge 107 of the through hole 106 in FIG. 1D.

  Similarly, FIG. 3C is an example of a conductor in which the lower part 32 of the contact surface with the through hole of the conductor is chamfered in order to facilitate dropping of the conductor into the through hole.

  Similarly, FIG. 3D is an example of a conductor in which the lower portion 33 of the contact surface with the through hole of the conductor is curved in order to facilitate dropping of the conductor into the through hole.

(Mounting of conductor to substrate 1)
Hereinafter, embodiments of mounting the above-described substrate and conductor will be exemplified.

  4A illustrates a state in which the conductors 3 aligned on the alignment jig 40 are self-running and positioned in the through holes 2 provided in the substrate 1 by the movement of the alignment jig 40, and the insertion is completed. FIG. Here, “self-propelled positioning” means that when the conductor 3 is inserted into the through hole 2 and fixed, the sliding between the oblique side portion 54 of the convex portion 4 of the conductor and the edge 9 of the through hole 2 is performed. The conductor 3 is moved and set to the insertion position.

  FIG. 4B is an illustration of an enlarged view of a dotted line range (FIG. 4A) near one conductor. The convex part 4 of the conductor shows a state immediately before being inserted into the through hole 2 with its tip 4 a in contact with the edge 9 of the through hole 2. The receiving positions (X direction and Y direction) of the respective conductors 3 in the alignment jig 40 are generally matched in advance with the positions of the through holes to be inserted in the substrate, and the tips 4a of the convex portions 4 of the conductors. Is located in a range within the opening of the through hole 2.

  4C, after the initial insertion state of FIG. 4B, the convex portion 4 of the conductor is inserted into the through hole 2 by pressing the alignment jig 40 toward the substrate side in the through hole direction (Z direction). It is a figure which shows the state made. The dimension of the shape of the conductor receiving portion 41 that is formed on the main body of the aligning jig 40 and that receives the conductor 3 is expanded in the X direction (the direction in the plane parallel to the surface 1a of the substrate 1) and the Y direction (the plane of the paper). In a direction perpendicular to the width of the open leg portion 6 of the conductor 3 is larger than the spread dimension. Due to such dimensional allowance, even if the conductor 3 is misaligned with the through-hole 2, the conductor 3 slides between the oblique side portion 54 of the convex portion 4 of the conductor and the edge 9 of the through-hole 2. -By self-propelling along the surface 40a of the alignment jig 40 in the Y direction, it is inserted at the position of the through hole to be inserted.

  FIG. 4D is a diagram illustrating a state in which each conductor 3 has been inserted into the through hole 2 of the substrate 1. The contact surface of the position setting bar 5 of the conductor 3 reaches the edge 9 of the through hole 2, and the position of the through hole in the insertion direction is determined.

  FIG. 4E is a diagram illustrating a state in which the conductive paste 7 is applied from the opposite surface side of the conductor 3 to the substrate 1 for the purpose of ensuring conduction to the conductor and fixing the conductor in the substrate 1.

(Mounting the conductor on the substrate 2)
FIG. 4F is an illustration of a substrate in which the convex portion of the conductor is press-fitted into the through hole of the substrate. The convex portion 14 of the conductor is press-fitted into the through hole 12 of the substrate. When the function of the substrate 11 is a function that does not require rewiring and only the conduction of the conductor 13, plating of the surface of the through hole for conduction is unnecessary, the substrate body is perforated, The substrate is formed by press-fitting a conductor into the through hole. At this time, the degree of fitting between the through hole 12 and the convex portion 14 of the conductor is of a degree due to press-fitting of the conductor 13. Regarding the alignment when the conductor 13 is inserted into the through-hole 12, since the cross-sectional area of the tip of the convex portion 14 of the conductor 13 is smaller than the cross-sectional area of the root portion, precise mutual alignment is required. do not do. The penetrated conductor 13 is held by the elasticity of the substrate 11 having the through hole 12, and the radial position of the through hole 12 is fixed. The state in which the conductor 13 is self-propelled and is inserted into the through hole 12 and the position setting by the position setting bar 15 are the same as in the case of (Attaching the conductor to the substrate 1).

  FIG. 4G is a view showing that the through-hole 12 is filled with the conductive paste 7 from the opposite side of the conductor 13 with respect to the substrate 11. By using a vacuum environment such as vacuum printing at the time of filling and coating, generation of voids can be suppressed and dense filling can be performed, so that a substrate with excellent quality can be manufactured.

  In the case of the substrate of FIGS. 4F and 4G in which a conductor is press-fitted into the through hole, an insulating material such as bakelite or plastic can be appropriately selected as the material of the substrate, so that an inexpensive package can be manufactured effectively.

(Effect 1 of the first embodiment)
Conventional fixing of a conductive material to a substrate or a semiconductor device has to be formed for each terminal as illustrated in FIG.

  FIG. 5 is a diagram illustrating a conventional semiconductor package 50 having spring-like external electrodes 51 for stress buffering. The spring-like external electrode 51 is directly joined to the external electrode 52, and the semiconductor package 50 is further connected to the electrode 55 of the mother board 53 via the spring-like external electrode 51. As described above, according to the first embodiment, the elastic body can be easily installed, and the mounting substrate or the semiconductor can be easily formed with respect to the conventional form that must be formed for each terminal. It is possible to improve the quality and productivity of a device equipped with a package.

(Effect 2 of the first embodiment)
Another effect of the substrate having the conductor according to the present invention is an effect of reducing the thickness of the entire semiconductor package by eliminating the need for the socket in the PGA package or the LGA package that has been necessary for the conventional package.

  FIG. 6A is a diagram illustrating a configuration in which a conventional PGA (pin grid array) 61 is mounted on a mother board 63 by a socket 62.

  FIG. 6B is a diagram illustrating a configuration in which a conventional LGA (Land Grid Array) 64 is mounted on a mother board 66 by a socket 65. As described above, with respect to the form of the mounting wiring in the conventional computer-related equipment, the PGA provided with the connection terminal pins in the microprocessor package, or the socket on the motherboard without the connection terminal pins on the microprocessor package side. An LGA provided with a pin is widely used by being coupled to a socket on a motherboard. According to the present invention, the function of electrical connection and mechanical fixing of the socket shown in the conventional example as shown in FIG. 6A or FIG. 6B is ensured, and the thickness of the socket is unnecessary, and the small shape is featured. A device including the semiconductor package can be provided.

(Application example of the first embodiment)
An application example of the first embodiment of the present invention is one form of a composite substrate comprising a high-density mounting substrate on which a semiconductor chip or a semiconductor device is to be mounted and a substrate according to the present invention.

  FIG. 7A illustrates a composite substrate 120 in which a mounting substrate 100 for mounting a semiconductor device is mounted on an intermediate substrate 10A in a state where a conductor 3 is mounted on the substrate 1. As the mounting substrate 100, a multilayer high-density wiring substrate such as a build-up substrate is used. The reason why multi-layer high-density wiring boards are used is that a rewiring function is required from the high-density wiring level on the surface of the semiconductor chip to be mounted to the wiring level of the motherboard used as a component of electronic equipment. It is because it is said. Further, a stiffener 74 made of a material such as copper is used for the purpose of preventing warpage of the multilayer substrate itself or reinforcing the deflection. The mounting substrate 100 is connected to the intermediate substrate 10A on which the conductor 3 is mounted via the copper core ball 72 on the electrical connection terminal 71 and connected to the electrical connection terminal 8 on the intermediate substrate 10A. Is done. The copper core ball 72 is composed of a sphere made of copper and a surface layer of solder, and has a function as a bump connection body. It should be noted that the number of mounting substrates 100 and the wiring density of each layer can be increased or decreased according to the surface wiring level of the semiconductor chip and the wiring level of the motherboard.

  FIG. 7B illustrates a diagram of the composite substrate 130 when the substrate 109 having the configuration shown in FIG. 1D is used instead of the intermediate substrate 10A on which the conductor is mounted in FIG. 7A. Among the electrical connection terminals on the substrate 109, the end surface 104 of the conductor 105 is different from the case of FIG. 7A in that the end surface itself is an electrical connection terminal. The form of the mounting substrate 100 is the same as in FIG. 7A. Since the copper core ball 72 in FIG. 7B is in contact with and connected to the end face 104 of the conductor 105, unlike the case where the solder is the main connecting member, thermal fatigue or flow of the solder in the case of reflow or the like There is no need to worry about the displacement of the conductor caused by the above. The gap 75 between the mounting substrate 100 and the substrate 109 connected in this manner has a distance corresponding to the outer dimension of the copper core ball, and a filling resin (underfiller) is injected into this space as necessary. Thus, the composite substrate 130 is formed. As for the wiring density, when the pitch P of the connection terminals in each wiring layer is exemplified, P1 = 0.4 mm in the copper core ball and P2 = 1.26 mm in the open leg portion of the conductor. In addition, the external dimensions of the mounting substrate 100 in the composite substrate 120 (FIG. 7A) or 130 (FIG. 7B) are usually designed to be smaller than the external dimensions of the intermediate substrate 10A or 109 to be connected. The effect of minimizing the manufacturing cost in the density mounting can be obtained.

  FIG. 7C illustrates a composite substrate including the electrical connection between the substrate 11 and the mounting substrate 77 shown in FIG. 1C. A gap between the substrate 11 and the mounting substrate 77 is secured by the step 78 provided on the connection surface 11a of the substrate 11 with the mounting substrate, and the filling resin 79 is filled.

(Application example 1 of the first embodiment)
FIG. 8A shows an example of a semiconductor package 80A in which the semiconductor chip 110 is mounted on the mounting substrate 100 in the composite substrate 120 (FIG. 7A).

  FIG. 8B shows an example of a semiconductor package 80B in which the semiconductor chip 110 is mounted on the mounting substrate 100 in the composite substrate 130 (FIG. 7B). 8A and 8B, the connection terminal pitch P0 of the semiconductor chip is, for example, P0 = 0.15 mm. Further, another semiconductor device in which the pitch of the connection terminals is appropriately selected may be mounted in place of the semiconductor chip 110 instead. The gap between the mounting substrate 100 and the substrate 10A (FIG. 8A) or the gap between the mounting substrate 100 and the substrate 109 (FIG. 8B) is filled with the filling resin 81.

(Application example 2 of the first embodiment)
Application example 2 of the first embodiment of the present invention is a form of mounting a semiconductor package on a mother board.

  FIG. 9A illustrates a form of mounting the semiconductor package 80A on the mother board 90. When the semiconductor package 80A is mounted and fixed on the mother board 90, the open leg portion 6 of the conductor 3 on the semiconductor package 80A side is opened by the elasticity, and on the electrical connection terminal 91 of the mother board 90. Crimped. For fixing the semiconductor package 80A to the mother board 90, a mechanical clamp means for holding the semiconductor package 80A and the mother board 90 is used. The pitch P2 of the electrical connection terminals of the motherboard 90 is, for example, P2 = 1.26 mm.

  FIG. 9B illustrates a form of mounting the semiconductor package 80B on the mother board 90. About the form of mounting and fixing, it is the same as that of the case of said FIG. 9A.

(Second Embodiment)
The second embodiment of the present invention exemplifies a form of a substrate manufacturing method. The present embodiment is a method of manufacturing a substrate having a conductive member having a convex portion of a conductive member, an open leg portion having elasticity of the conductive member, and a position setting rod, and a through hole for holding the conductive material. An alignment step in which the conductors are aligned by the alignment jig, a positioning step in which the conductors and the through holes aligned in the alignment step are set by moving the alignment jig, and the pressing of the alignment jig It is an illustration of the form of the manufacturing method of a board | substrate which has an insertion process by which a conductor is inserted in a through-hole by this.

  FIG. 10 is a diagram illustrating a flow of the manufacturing method of the present embodiment. This flow is divided into preparation steps (from step 1 to step 3), conductor positioning and insertion steps (from step 4 to step 7), and manufacturing steps after the composite substrate (from step 8 to step 13). . In the preparation step, step 1 is preparation of an alignment jig, step 2 is preparation of a substrate, and step 3 is preparation of a conductor. These steps can be performed in parallel.

(Preparation process)
Step 1 is a step related to the preparation of the alignment jig. An alignment jig is prepared in advance. The surface of the alignment jig needs to be flattened so that the conductor to be received for alignment can move smoothly along the jig. Further, as described in the explanation of FIG. 4C in (Attachment of Conductor to Substrate 1), the shape of the receiving portion of the conductor formed on the main body of the alignment jig is the dimension of the spread of the open leg portion of the conductor. Larger dimensions.

  FIG. 11A is a diagram illustrating the entire alignment jig.

  FIG. 11B is a cross-sectional view of the alignment jig taken along the cutting line SS of FIG. 11A and shows an example of the conductor receiving portion 44 in a state where the alignment jig 40 receives the conductor 3. The alignment jig having the structure shown in FIG. 11B is in a state of moving freely in both the X direction (left and right direction on the paper surface) and the Y direction (perpendicular direction on the paper surface). The body is self-propelled and the position where the conductor is to be inserted into the through hole is determined. In order to accurately guide the conductor 3 to the position of the through hole, a bearing 42 that can freely slide the main body of the alignment jig 40 in both the X direction and the Y direction without resistance is used. The bearing 42 is configured by combining a retainer that accommodates a needle bearing. Further, if necessary, a bearing 43 having a structure similar to that of the bearing 42 and capable of moving in both the X direction and the Y direction is used for each conductor receiving portion 44, so that the X direction of each conductor 3 is set. Further, the degree of freedom increases in movement in both directions in the Y direction, and the positioning accuracy of the insertion can be improved.

  In FIG. 10, step 2 is a step relating to the preparation of the substrate. A substrate is prepared in advance. The substrate is perforated by machining or laser processing on the substrate body laminated with phenol resin, epoxy resin or other material as described in (form of substrate) in (first embodiment), A plating layer is formed on the surface of the through hole as necessary (FIGS. 1A to 1D).

  Step 3 is a step related to the preparation of the conductor. A conductor is prepared in advance. As the conductor, the conductor exemplified in FIGS. 2A to 3D of (Conductor Form 1) and (Conductor Form 2) of (First Embodiment) is used.

(Process for positioning and inserting conductors)
Step 4 is a step of aligning the conductors with an alignment jig. The conductor formed in the previous step 3 is aligned in the space of the receiving portion of the alignment jig.

  Step 5 is a step of self-running positioning of the conductor. As shown in FIG. 4B (attachment of conductor to substrate 1), the alignment jig 40 and substrate 1 are roughly positioned. Thereafter, the conductor 3 is pressed by the sliding of the oblique side portion 54 of the convex portion 4 of the conductor and the edge 9 of the through hole 2 by pressing the insertion jig 2 in the insertion direction (Z direction) of the alignment jig 40. By moving along the surface 40a (FIG. 4C) of the alignment jig 40 in the XY direction, the alignment jig 40 moves to the position of the through hole to be inserted.

  Step 6 is a step of inserting the conductor into the through hole. By continuing the pressing of the alignment jig 40 in the insertion direction (Z direction) of the through-hole 2, the state of the protrusion 4 of the conductor is reached after the insertion state of FIG. 4C until the state of FIG. 4D is reached. Insertion into the through hole proceeds. In addition, as shown in FIG. 4F in (Installation 2 of Conductor to Substrate), the substrate may be formed by press-fitting the conductor into the through hole of the substrate body.

  Step 7 is a step of applying and filling the conductive paste, and its form is illustrated in FIG. 4E.

(Manufacturing process after composite substrate)
Step 9 is a step of forming the composite substrate shown in (Application Example of First Embodiment). The connection between the mounting substrate prepared in Step 8 in advance and the substrate that has completed Step 7 is illustrated. 7A shows an example of a form in which the mounting substrate 100 and the substrate 10A in FIG. 7A, the mounting substrate 100 and the substrate 109 in FIG. 7B, and the mounting substrate 77 and the substrate 11 in FIG. 7C are connected to each other.

  Step 11 is a step of forming a semiconductor package in which a semiconductor chip is mounted on a mounting substrate. The semiconductor chip prepared in advance in step 10 is mounted on the mounting substrate 100 shown in FIGS. 8A and 8B (application example 1 of the first embodiment) to form semiconductor packages 80A and 80B. The

  Step 13 is a step of mounting the semiconductor package on the mother board. The semiconductor packages 80A and 80B shown in FIGS. 9A and 9B (application example 2 of the first embodiment) are mounted on the mother board prepared in advance in step 12. By this step, the substrates 90A and 90B provided with the semiconductor package are formed.

  The preferred embodiment of the present invention has been described in detail above. However, the present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described embodiment without departing from the scope of the present invention. And substitutions can be added.

It is a figure which illustrates the intermediate | middle board | substrate 10A for the electrical connection and mechanical connection of the mounting board | substrate 100 and the motherboard 90 in the apparatus 10 provided with the semiconductor package based on the 1st Embodiment of this invention. It is a figure which illustrates the composition of the substrate and electric conductor concerning the 1st embodiment of the present invention. It is a figure which illustrates the board | substrate of the structure which attached the conductor to the through-hole of the main body of the pierced board | substrate based on the 1st Embodiment of this invention. It is a figure which illustrates the board | substrate of the form which drops and fixes the conductor based on the 1st Embodiment of this invention from the perpendicular direction of the plane of the board | substrate set horizontally. It is a figure which illustrates the unit of the conductor of the aggregate | assembly of a plate-shaped body based on the 1st Embodiment of this invention. It is a figure which illustrates the section (beta = 90 degrees) by section line AA (Drawing 2A) of the unit of an electric conductor concerning the 1st embodiment of the present invention. It is a figure which illustrates the other cross section by the cutting line AA (FIG. 2A) of the unit of the conductor based on the 1st Embodiment of this invention. It is a figure which illustrates the other cross section ((beta) = 120 degree | times) by the cutting line AA (FIG. 2A) of the conductor unit based on the 1st Embodiment of this invention. It is a figure which illustrates the other cross section ((beta) = 60 degree | times) by the cutting line AA (FIG. 2A) of the conductor unit based on the 1st Embodiment of this invention. It is a figure which illustrates the shape of the conductor formed by the forging or the cutting process based on the 1st Embodiment of this invention. It is a figure which illustrates the shape of the conductor used for the board | substrate of FIG. 1D of the form to which a conductor is dropped and fixed from the perpendicular direction of a board | substrate plane based on the 1st Embodiment of this invention. It is a figure which illustrates the conductor by which the lower part of the contact surface with the through-hole of a conductor is chamfered based on the 1st Embodiment of this invention. It is a figure which illustrates the conductor by which the lower part of the contact surface with the through-hole of a conductor based on the 1st Embodiment of this invention is curved-surface processed. The figure which illustrates the state which the conductor 3 based on the 1st Embodiment of this invention was self-propelled and positioned by the through-hole 2 provided in the board | substrate 1 by the movement of the alignment jig | tool 40, and insertion was completed. It is. It is a figure which illustrates the enlarged view of the dotted-line range (FIG. 4A) near one conductor based on the 1st Embodiment of this invention. According to the first embodiment of the present invention, the conductor protrusion 4 is half inserted into the through hole 2 by pressing the alignment jig 40 against the substrate side in the through hole direction (Z direction). It is a figure illustrated. It is a figure which illustrates the state which the insertion to the through-hole 2 of the board | substrate 1 of each conductor 3 based on the 1st Embodiment of this invention was completed. It is a figure which illustrates the state which has apply | coated the conductive paste 7 from the opposite surface side with respect to the board | substrate 1 of the conductor 3 based on the 1st Embodiment of this invention. It is a figure which illustrates the board | substrate by which the convex part of an electric conductor press-fits into the through-hole of a board | substrate based on the 1st Embodiment of this invention. It is a figure which illustrates the state which has filled the through-hole from the opposite side of the conductor 13 with respect to the board | substrate 11 with the electrically conductive paste 7 based on the 1st Embodiment of this invention. It is a figure which illustrates the conventional semiconductor package 50 which has the spring-like external electrode 51 for stress buffering. FIG. 10 is a diagram illustrating a configuration in which a conventional PGA (pin grid array) 61 is mounted on a mother board 63 by a socket 62. It is a figure which illustrates the form by which the conventional LGA (land grid array) 64 is mounted in the motherboard 66 with the socket 65. FIG. The mounting substrate 100 for mounting the semiconductor device according to the first embodiment of the present invention exemplifies a composite substrate 120 mounted on an intermediate substrate 10A in a state where the conductor 3 is mounted on the substrate 1. FIG. It is a figure which illustrates the composite substrate 130 using the board | substrate 109 of the form shown to FIG. 1D based on the 1st Embodiment of this invention. It is a figure which illustrates the composite substrate which consists of an electrical connection of the board | substrate 11 and the mounting board | substrate 77 which were shown to FIG. 1C based on the 1st Embodiment of this invention. It is a figure which illustrates 80 A of semiconductor packages which mount the semiconductor chip 110 on the mounting board | substrate 100 in the composite substrate 120 (FIG. 7A) based on the 1st Embodiment of this invention. It is a figure which illustrates the semiconductor package 80B which mounted the semiconductor chip 110 on the mounting board | substrate 100 in the composite substrate 130 (FIG. 7B) based on the 1st Embodiment of this invention. It is a figure which illustrates the form of mounting of semiconductor package 80A to mother board 90 concerning a 1st embodiment of the present invention. It is a figure which illustrates the form of mounting of the semiconductor package 80B to the motherboard 90 based on the 1st Embodiment of this invention. It is a figure which illustrates the flow of the manufacturing method of the board | substrate based on the 2nd Embodiment of this invention. It is a figure which illustrates the whole alignment jig based on the 2nd Embodiment of this invention. FIG. 11B is a cross-sectional view of the alignment jig taken along the cutting line SS in FIG. 11A according to the second embodiment of the present invention, and shows the conductor receiving portion 44 in a state where the alignment jig 40 receives the conductor 3. It is a figure illustrated.

Explanation of symbols

1, 11, 109 Substrate 2, 12, 106 Through-hole 2a Plated layer 3, 105 on conductor surface 4, 105 Conductor 4, 14, 24 Convex 4a Tip 5, 15, 25 Position setting rod 6, 16, 26 Open leg Portions 7, 17 Conductive paste 8, 71, 91 Connection terminals 9, 107 Edge 10 of through hole Device 10A with semiconductor package Intermediate substrate 13, 23 Conductor unit 20, 21 Piece 22 Inclination of convex portion 24 Surfaces 24-1, 24-2 Convex portion 37 Tip portion 38 Root portion
40 Alignment jig 40a Alignment jig surface 41, 44 Conductor receiving portion 42, 43 Bearing 54 Oblique side 72 Copper core ball 74 Stiffener 77, 100 Mounting substrate 79, 81 Filling resin 80A, 80B Semiconductor package 90 Mother board 90A, 90B Device 104 with Semiconductor Package End Face 110 Semiconductor Chip 120, 130 Composite Substrate α Inclination Angle β Opening

Claims (14)

A substrate having connection terminals,
A conductor having a projecting portion of the conductive member and an open leg portion having elasticity of the conductive member;
And a substrate having a through-hole for holding the conductor. A substrate having connection terminals,
A conductive member having a convex portion of the conductive member, an open leg portion having elasticity of the conductive member, and a position setting rod;
A substrate having a through hole for holding the conductor.   2. The substrate according to claim 1, wherein a plurality of wiring layers and insulating layers are alternately stacked, and the wiring layers are electrically connected via via holes formed in the insulating layer. Or the board | substrate of 2.   The substrate according to any one of claims 1 to 3, wherein the convex portion of the conductor has a shape capable of self-running positioning and insertion into the through-hole of the substrate.   5. The substrate according to claim 4, wherein the shape allowing the self-propelled positioning and insertion is such that a cross-sectional area of a tip portion is smaller than a cross-sectional area of a root portion.   The shape allowing the self-propelled positioning and insertion is such that the conductor of the plate material having a plurality of plate-like cusps is bent to an opening of less than 180 degrees when viewed from the insertion direction, and the orientation of the cusps is aligned. The substrate according to claim 4, wherein the substrates are assembled to form a three-dimensional pointed head by the plurality of plate-shaped pointed heads.   The substrate according to claim 1, wherein the conductor is fixed to the substrate with a conductive paste.   A composite substrate on which a mounting substrate for mounting a semiconductor device is mounted on the substrate according to claim 1.   The semiconductor package by which the mounting board | substrate with which the semiconductor device is mounted is connected to the board | substrate as described in any one of Claims 1 thru | or 4 via the electrically conductive paste of an electrical connection position.   5. The electrical connection terminal of the mounting board on which the semiconductor device is mounted is connected to the electrical connection terminal of the board via a copper core ball. A semiconductor package wherein the mounting substrate is connected to the substrate described in the item.   11. The semiconductor according to claim 9 or 10, wherein the electrical connection terminal of the semiconductor package according to claim 9 and the electrical connection terminal of the mother board are electrically connected via the conductor. A device with a package. A conductive member having a convex portion of the conductive member, an open leg portion having elasticity of the conductive member, and a position setting rod;
A method of manufacturing a substrate having a through hole for holding the conductor,
An alignment step in which the conductor is aligned by an alignment jig;
A positioning step of performing mutual position setting of the conductor and the through hole aligned in the alignment jig by the alignment step by moving the alignment jig;
And a step of inserting the conductor into the through hole by pressing the alignment jig.   The positioning step includes an alignment jig that has a receiving portion for the conductor and is used for alignment of the conductor so that the conductor is positioned by self-running in a direction perpendicular to the insertion direction into the through hole. The method for manufacturing a substrate according to claim 12, wherein:   The shape of the receiving portion of the conductor has a space wider than a space occupation portion of the conductor in a direction perpendicular to the insertion direction of the conductor into the through hole, and the conductor is perpendicular to the insertion direction. The method of manufacturing a substrate according to claim 13, wherein the substrate moves freely in a direction.

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