JP2009300123A - Current sensor - Google Patents

Current sensor Download PDF

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JP2009300123A
JP2009300123A JP2008152297A JP2008152297A JP2009300123A JP 2009300123 A JP2009300123 A JP 2009300123A JP 2008152297 A JP2008152297 A JP 2008152297A JP 2008152297 A JP2008152297 A JP 2008152297A JP 2009300123 A JP2009300123 A JP 2009300123A
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core
current sensor
substrate
gap
end surface
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JP4814283B2 (en
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Kenji Sakawaki
賢二 坂脇
Tetsuo Ishikawa
哲郎 石川
Masakazu Kobayashi
正和 小林
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Tamura Corp
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Tamura Corp
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Priority to PCT/JP2009/060366 priority patent/WO2009151011A1/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/207—Constructional details independent of the type of device used
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices

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  • General Physics & Mathematics (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a current sensor which can measure a high-voltage AC current without increasing the numbers of part items and man-hours. <P>SOLUTION: The current sensor includes: a magnetoelectric conversion element which is installed in a substrate so that its magnetosensitive surface is nearly perpendicular to the substrate; a circular core formed with a gap; a shield means having a first portion covering one side of the magnetosensitive surface, a second portion which is connected to the first portion and covers the other side of the magnetosensitive surface, and a third portion which extends from one sides of the first portion and the second portion and is connected to a ground pad on the substrate; and a first pressing means which is arranged between the first portion and a first end face facing the first portion out of both end faces constituting the gap in the core, is connected to the first portion, and presses the first end face, thereby establishing conduction between the core and the shield means. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、磁電変換素子を使用する電流センサに関する。   The present invention relates to a current sensor using a magnetoelectric conversion element.

電流の大きさを検出する電流センサとして、ホール素子などの磁電変換素子を使用したものが広く利用されている。このような電流センサは環状のコアを有しており、コアの穴の部分に通過させた電線に電流を流すと、コアの周方向に沿ってコア内部を周回する磁束が発生する。この磁束の磁束密度は電線を流れる電流の大きさに略比例するため、磁電変換素子により磁束密度を検出することによって電線に流れる電流の大きさを計測することができる。   As a current sensor for detecting the magnitude of current, one using a magnetoelectric conversion element such as a Hall element is widely used. Such a current sensor has an annular core, and when a current is passed through an electric wire passed through the hole of the core, a magnetic flux that circulates in the core along the circumferential direction of the core is generated. Since the magnetic flux density of this magnetic flux is substantially proportional to the magnitude of the current flowing through the electric wire, the magnitude of the current flowing through the electric wire can be measured by detecting the magnetic flux density with a magnetoelectric transducer.

このような電流センサに用いられる磁電変換素子は、磁束密度をより正確に計測するため、近接する他の電子回路からの静電場に素子が曝されないように、シールド部材によってシールドされていることが望ましい。磁電変換素子に対するこのようなシールド部材としては、例えば特許文献１に記載されているものがある。特許文献１に記載の磁電変換素子用のシールド部材は、金属板をコの字状に折り曲げたものを、磁電変換素子において検出する磁束が通過する面（感磁面）を覆うように素子に取り付けたものである。このシールド部材の一方の先端部は、素子が実装される基板と略平行になるよう折り曲げられており、基板上に設けられたグランドパッドに当接して、当接部にてはんだ付けされるようになっている。
特開２００５−０２４５１９号 In order to measure the magnetic flux density more accurately, the magnetoelectric conversion element used in such a current sensor may be shielded by a shield member so that the element is not exposed to an electrostatic field from other nearby electronic circuits. desirable. An example of such a shield member for the magnetoelectric conversion element is described in Patent Document 1. The shield member for a magnetoelectric conversion element described in Patent Document 1 is formed by bending a metal plate into a U-shape so as to cover a surface (magnetic sensitive surface) through which a magnetic flux detected by the magnetoelectric conversion element passes. It is attached. One end portion of the shield member is bent so as to be substantially parallel to the substrate on which the element is mounted, and comes into contact with a ground pad provided on the substrate and is soldered at the contact portion. It has become.
JP 2005-024519 A

また、このシールド部材は、コの字状部分で磁電変換素子を把持できるようになっている。このため、磁電変換素子をコの字状部分の奥まで差し込むことにより、シールド部材先端部に直交する方向（すなわち基板の法線方向）におけるシールド部材に対する磁電変換素子の位置決めを行うことができる。このように、特許文献１のシールド部材は、磁電変換素子のシールドのみならず、位置決めを行うための部材としても機能する。   Further, this shield member can hold the magnetoelectric conversion element at the U-shaped portion. For this reason, the magnetoelectric conversion element can be positioned with respect to the shield member in the direction perpendicular to the tip of the shield member (that is, the normal direction of the substrate) by inserting the magnetoelectric conversion element to the back of the U-shaped portion. As described above, the shield member of Patent Document 1 functions not only as a shield of the magnetoelectric conversion element but also as a member for positioning.

以上の構成による電流センサは、コアよりも一回り大きい程度の大きさの小型のものである。しかしながら、上記構成の電流センサは、一次側の電位が急激に変化すると静電結合によりコアの電位が振られて電気回路にノーマルモードのノイズが発生し、これによってセンサにノイズが出力されるため、正確に電流の大きさを計測できないという問題があった。この問題を解消するためには、コアを接地する必要がある。しかし、この場合には、コアを接地するための機構を別途電流センサに追加する必要があり、電流センサの大型化や、部品点数の増大、延いては電流センサの組立工数の大幅な増大を招くことになる。このように、従来の電流センサにおいては、例えば三相モータの駆動回路のように電位が急激に変化する導体を流れる電流を計測する場合は、大型で部品点数が多く、組立工数の多い電流センサを選択せざるを得なかった。   The current sensor having the above configuration is a small sensor having a size slightly larger than the core. However, in the current sensor having the above configuration, when the potential on the primary side changes abruptly, the core potential is shaken by electrostatic coupling, and noise in the normal mode is generated in the electric circuit, which outputs noise to the sensor. There was a problem that the magnitude of the current could not be measured accurately. In order to solve this problem, it is necessary to ground the core. However, in this case, it is necessary to add a mechanism for grounding the core to the current sensor separately, which increases the size of the current sensor, the number of parts, and the increase in the number of assembly steps of the current sensor. Will be invited. Thus, in a conventional current sensor, when measuring a current flowing through a conductor whose potential changes abruptly, such as a three-phase motor drive circuit, the current sensor is large, has a large number of parts, and has a large number of assembly steps. I had to choose.

本発明は上記の問題を解決するためになされたものである。すなわち、本発明は部品点数や工数をほとんど増大させることなく、高電圧交流の電流の大きさを正確に計測可能な電流センサを提供することを目的とする。   The present invention has been made to solve the above problems. That is, an object of the present invention is to provide a current sensor that can accurately measure the magnitude of a high-voltage alternating current without substantially increasing the number of parts and man-hours.

上記の目的を達成するため、本発明の電流センサは、感磁面が前記基板と略垂直となるよう該基板に実装されている磁電変換素子と、ギャップが形成されている環状のコアと、感磁面の一方を覆う第１部とこの第１部と接続されて感磁面の他方を覆う第２部と第１部と第２部の一方から延びて基板上のグランドパッドに接続されている第３部とを有するシールド手段と、コアにおいてギャップを構成する両端面のうち第１部と対向する第１端面と第１部との間に配置されており、第１部に接続されると共に該第１端面を圧迫して該コアと前記シールド手段とを導通させる第１の圧迫手段と、を有する。
また、第１部を第１端面に向かって折り曲げて形成した板ばね状部材を第１の圧迫手段とすることがより好ましい。 In order to achieve the above object, a current sensor according to the present invention includes a magnetoelectric conversion element mounted on a substrate so that a magnetosensitive surface is substantially perpendicular to the substrate, an annular core having a gap formed therein, A first part that covers one of the magnetic sensitive surfaces and a second part that is connected to the first part and covers the other of the magnetic sensitive surfaces, extends from one of the first part and the second part, and is connected to a ground pad on the substrate. The shield means having the third part, and is disposed between the first end part and the first part facing the first part among the both end faces constituting the gap in the core, and is connected to the first part And a first pressing means for compressing the first end face and electrically connecting the core and the shielding means.
It is more preferable that a leaf spring-like member formed by bending the first portion toward the first end face is used as the first compression means.

このように、本発明によれば、第１の圧迫手段をシールド手段とコアの間に設けることのみによってコアの電位をグランドに落とすことができるようになっており、部品点数及び工数をほとんど増やすことなく高電圧交流に対応した小型の電流センサが実現される。特に、第１部を第１端面に向かって折り曲げて形成した板ばね状部材を第１の圧迫手段とすると、工数や部品点数を増やすことなく上記の電流センサを実現することができる。   As described above, according to the present invention, the potential of the core can be dropped to the ground only by providing the first pressing means between the shield means and the core, and the number of parts and man-hours are almost increased. A small current sensor corresponding to high-voltage alternating current can be realized without any problems. In particular, when a leaf spring-like member formed by bending the first portion toward the first end surface is used as the first compression means, the above-described current sensor can be realized without increasing the number of steps and the number of parts.

以下、本発明の実施の形態について図面を用いて詳細に説明する。図１は、本発明の実施の形態の電流センサの斜視図である。また、図２は図１のＡ矢視図である。図１に示されるように、本実施形態の電流センサ１は、ホール素子４０が実装されている基板２０と環状のコア３０とがケース１０内に収められたものである。図２に示されるように、ケース１０の内部には突出部１４ａ、１４ｂ、１５ａ及び１５ｂが設けられている。コア３０は突出部１４ａ及び１４ｂに、基板２０は突出部１５ａ及び１５ｂに夫々ガイドされて保持されるようになっている。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of a current sensor according to an embodiment of the present invention. FIG. 2 is a view taken in the direction of arrow A in FIG. As shown in FIG. 1, the current sensor 1 of the present embodiment is a case in which a substrate 20 on which a Hall element 40 is mounted and an annular core 30 are housed in a case 10. As shown in FIG. 2, protrusions 14 a, 14 b, 15 a and 15 b are provided inside the case 10. The core 30 is guided and held by the protrusions 14a and 14b, and the substrate 20 is held by the protrusions 15a and 15b.

本実施形態の電流センサ１は、コア３０の穴３５に電線Ｗを通し、電線Ｗに電流を流してコア３０の内部にコア３０を周回する磁束を発生させる。この磁束の大きさは、電線Ｗに流れる電流の大きさに比例するので、磁電変換素子の一種であるホール素子４０によってコア３０内の磁束の磁束密度を計測することによって、電線Ｗを流れる電流の大きさを測定することができる。このため、図２に示されるように、電線Ｗをコア３０の穴３５に通すための開口１２、１３及び２２がケース１０の上下面又は基板２０に形成されている。   In the current sensor 1 of the present embodiment, the electric wire W is passed through the hole 35 of the core 30, and a current flows through the electric wire W to generate a magnetic flux that goes around the core 30 inside the core 30. Since the magnitude of the magnetic flux is proportional to the magnitude of the current flowing through the electric wire W, the current flowing through the electric wire W is measured by measuring the magnetic flux density of the magnetic flux in the core 30 by the Hall element 40 which is a kind of magnetoelectric conversion element. Can be measured. For this reason, as shown in FIG. 2, openings 12, 13, and 22 for passing the electric wires W through the holes 35 of the core 30 are formed in the upper and lower surfaces of the case 10 or the substrate 20.

また、基板２０には、ホール素子４０を駆動するための電力を供給すると共に電流の計測結果を出力するための４本の端子２１が設けられている。図１及び２に示されるように、端子２１は基板２０に平行な方向に延びており、ケース１０の側面にはこの端子２１を通過させるための開口１１が設けられている。すなわち、端子２１の先端部はケース１０の外側に突出しており、この端子２１を介してホール素子４０へ駆動電力を供給するとともに電線Ｗを流れる電流の大きさを取得することができる。   The substrate 20 is provided with four terminals 21 for supplying electric power for driving the Hall element 40 and outputting a current measurement result. As shown in FIGS. 1 and 2, the terminal 21 extends in a direction parallel to the substrate 20, and an opening 11 for allowing the terminal 21 to pass through is provided on a side surface of the case 10. That is, the tip of the terminal 21 protrudes outside the case 10, and driving power is supplied to the Hall element 40 through the terminal 21 and the magnitude of the current flowing through the electric wire W can be acquired.

図１に示されるように、ホール素子４０は、矩形プレート形状のパッケージ本体４１の一端面から４本のリード端子４２が延びる、いわゆるＳＩＰ（Ｓｙｓｔｅｍ−ｉｎ−ｐａｃｋａｇｅ）形状のデバイスであり、パッケージ本体４１は基板２０に対して略垂直に配置されるように基板２０に実装されている。   As shown in FIG. 1, the Hall element 40 is a so-called SIP (System-in-package) -shaped device in which four lead terminals 42 extend from one end surface of a rectangular plate-shaped package body 41. 41 is mounted on the substrate 20 so as to be arranged substantially perpendicular to the substrate 20.

コア３０の一部は周方向と直交する２つの互いに平行な面によって切り欠かれており、ギャップ３１が形成されている。ホール素子４０は、このギャップ３１に収納されるように配置されている。具体的には、図２に示されるように、ギャップ３１を形成するコア３０の第１端面３２と第２端面３３と、ホール素子４０のパッケージ本体４１の両面に設けられた第１感磁面４１ａ及び第２感磁面４１ｂとが夫々対向するようにホール素子４０がギャップ３１内に配置されている。これによって、コア３０内を周回する磁束線がホール素子４０の感磁面４１ａ、４１ｂに対して略垂直にホール素子を通過することになる。   A part of the core 30 is cut away by two mutually parallel surfaces orthogonal to the circumferential direction, and a gap 31 is formed. The hall element 40 is disposed so as to be accommodated in the gap 31. Specifically, as shown in FIG. 2, the first magnetosensitive surface provided on both surfaces of the first end surface 32 and the second end surface 33 of the core 30 forming the gap 31 and the package body 41 of the Hall element 40. The Hall element 40 is disposed in the gap 31 so that 41a and the second magnetosensitive surface 41b face each other. As a result, the magnetic flux lines that circulate in the core 30 pass through the Hall element substantially perpendicular to the magnetic sensitive surfaces 41a and 41b of the Hall element 40.

本実施形態においては、ホール素子４０を不要な電磁場からシールドするため、クリップ状のシールド部材５０が使用されている。シールド部材５０は、りん青銅等の非磁性の導体のプレートを折り曲げ加工して形成したものである。図２に示されるように、シールド部材５０は、ホール素子４０の第１感磁面４１ａ及び第２感磁面４１ｂを覆うカバー部５１を有する。カバー部５１は、第１感磁面４１ａと対向する第１部５１ａと、第２感磁面４１ｂと対向する第２部５１ｂと、ホール素子４０のパッケージ本体４１の上面に当接し且つ第１部５１ａ及び第２部５１ｂを連結する連結部５１ｃとを有する。   In the present embodiment, a clip-shaped shield member 50 is used to shield the Hall element 40 from an unnecessary electromagnetic field. The shield member 50 is formed by bending a plate of a nonmagnetic conductor such as phosphor bronze. As shown in FIG. 2, the shield member 50 includes a cover portion 51 that covers the first magnetic sensitive surface 41 a and the second magnetic sensitive surface 41 b of the Hall element 40. The cover portion 51 is in contact with the first portion 51a facing the first magnetic sensitive surface 41a, the second portion 51b facing the second magnetic sensitive surface 41b, the upper surface of the package body 41 of the Hall element 40, and the first portion 51a. It has the connection part 51c which connects the part 51a and the 2nd part 51b.

第１部５１ａは、連結部５１ｃに対して略垂直である。一方、第２部５１ｂと連結部５１ｃとがなす角は直角よりも小さい大きさである。このため、第１部５１ａと第２部５１ｂとの間隔は、連結部５１ｃから遠ざかるに従って小さくなる。第１部５１ａと第２部５１ｂとの最小間隔ｄ１は、自然状態ではパッケージ本体４１の厚さよりも小さい。このため、カバー部５１にパッケージ本体４１を差し込むと、第２部５１ｂが図２中反時計回りに移動して、間隔ｄ１が広がる。そして、この時に第２部５１ｂに生じる弾性力によって、パッケージ本体４１は、第１部５１ａと第２部５１ｂとの間で挟み込まれ、容易には移動しないようシールド部材５０によって保持される。また、前述のように第１部５１ａは、連結部５１ｃに対して略直角であるので、カバー部５１にパッケージ本体４１を奥まで差し込んだ状態では、パッケージ本体４１の上面４１ｃは、連結部５１ｃの内面（図２中下側）と当接し、且つ第１感磁面４１ａが第１部５１ａの内面（図２中右側）と当接する。このように、パッケージ本体４１をカバー部５１の内面に当接させることによって、シールド部材５０に対するホール素子４０の位置決めを行うことができる。 The first part 51a is substantially perpendicular to the connecting part 51c. On the other hand, the angle formed by the second part 51b and the connecting part 51c is smaller than a right angle. For this reason, the space | interval of the 1st part 51a and the 2nd part 51b becomes small as it distances from the connection part 51c. Minimum distance d 1 between the first part 51a and second part 51b is smaller than the thickness of the package body 41 in a natural state. Therefore, when inserting the package body 41 to the cover portion 51, second portion 51b is moved in the counterclockwise direction in FIG. 2, spreads distance d 1. At this time, the package body 41 is sandwiched between the first part 51a and the second part 51b by the elastic force generated in the second part 51b, and is held by the shield member 50 so as not to move easily. Further, as described above, the first portion 51a is substantially perpendicular to the connecting portion 51c, and therefore the upper surface 41c of the package body 41 is connected to the connecting portion 51c when the package main body 41 is fully inserted into the cover portion 51. The first magnetosensitive surface 41a contacts the inner surface (right side in FIG. 2) of the first portion 51a. Thus, the Hall element 40 can be positioned with respect to the shield member 50 by bringing the package body 41 into contact with the inner surface of the cover portion 51.

第１部５１ａの先端（図２中下部）からは第３部５２が基板２０に向かって延びている。第３部５２はその途中で屈曲しており、その先端部５２ａは第１部５１ａと略直交する方向を向いている。そのため、第３部５２の先端部５２ａを基板２０に当接させると、第１部５１ａは基板２０に対して略垂直になる。このように、第３部５２の先端部５２ａと基板との当接により、シールド部材５０と基板２０との位置決めがなされるので、シールド部材５０によって位置決めされているホール素子４０もまた、基板２０に対して位置決めされることになる。このように、シールド部材５０はホール素子４０を基板２０に対して位置決めするための位置決め部材としての機能を有する。   A third portion 52 extends toward the substrate 20 from the tip of the first portion 51a (the lower portion in FIG. 2). The third portion 52 is bent in the middle thereof, and the tip portion 52a faces a direction substantially orthogonal to the first portion 51a. Therefore, when the tip end portion 52 a of the third portion 52 is brought into contact with the substrate 20, the first portion 51 a is substantially perpendicular to the substrate 20. Thus, since the shield member 50 and the substrate 20 are positioned by the contact between the tip 52a of the third portion 52 and the substrate, the Hall element 40 positioned by the shield member 50 is also used by the substrate 20. Will be positioned. Thus, the shield member 50 has a function as a positioning member for positioning the Hall element 40 with respect to the substrate 20.

基板２０上の４本の端子２１のうち一本はグランド端子であり、基板２０の表面にはこのグランド端子と接続されているグランドパッド２３が形成されている（図１）。図２に示されるようにシールド部材５０の第３部５２の先端部５２ａをグランドパッド２３に当接させ、且つグランドパッド２３にはんだ付けすることにより、シールド部材５０を接地することができる。これによって、ホール素子４０は、電流検出誤差の原因となる不要な静電場から保護される。   One of the four terminals 21 on the substrate 20 is a ground terminal, and a ground pad 23 connected to the ground terminal is formed on the surface of the substrate 20 (FIG. 1). As shown in FIG. 2, the shield member 50 can be grounded by bringing the tip 52 a of the third portion 52 of the shield member 50 into contact with the ground pad 23 and soldering to the ground pad 23. Thus, the Hall element 40 is protected from an unnecessary electrostatic field that causes a current detection error.

本実施形態による電流センサ１のシールド部材５０は、ホール素子４０のシールドや位置決めを行うと共に、コア３０の電位を接地する機能を有する。コア３０の電位が変化することによってコア３０内の磁束の大きさが変化するが、本実施形態の構成では、コア３０が接地電位に保たれるため、コア３０内の磁束の大きさから電線Ｗに流れる電流の大きさを正確に算出することができる。これは、コア３０、電線Ｗ、基板２０の静電結合によってコア３０内の電位が大きく変化しうる環境、例えば電線Ｗに流れる電流が高電圧の交流電流である場合に特に有効である。   The shield member 50 of the current sensor 1 according to the present embodiment functions to shield and position the Hall element 40 and to ground the potential of the core 30. Although the magnitude of the magnetic flux in the core 30 changes as the potential of the core 30 changes, in the configuration of the present embodiment, the core 30 is kept at the ground potential. The magnitude of the current flowing through W can be accurately calculated. This is particularly effective in an environment where the potential in the core 30 can change greatly due to electrostatic coupling of the core 30, the electric wire W, and the substrate 20, for example, when the current flowing through the electric wire W is a high-voltage AC current.

シールド部材５０によるコア３０の接地機能について以下説明する。図３は、本実施形態によるシールド部材５０を図１の正面側から見た斜視図である。また、図４は、本実施形態によるシールド部材５０を図１の背面側から見た斜視図である。図３及び４に示されるように、シールド部材５０の第１部５１ａの一部にはコの字状に切断されて外側（図３中左上側、図４中左下側）に引き出された第１圧迫部５３が形成されている。また、シールド部材５０の第２部５１ｂの一部にはコの字状に切断されて外側（図３中右下側、図４中右上側）に引き出された第２圧迫部５４が形成されている。ここで、自然状態における第１圧迫部５３と第２圧迫部５４の先端部の間隔ｄ２は、コア３０のギャップ３１の幅、すなわち、第１端面３２と第２端面３３の間隔ｄ３（図１）よりも大きくなるように形成されている。このため、ギャップ３１の中にシールド部材５０のカバー部５１を差し込むと、第１圧迫部５３及び第２圧迫部５４は夫々内側に向かって押し込まれる。この時に両圧迫部に生じる弾性力によって、第１端面３２及び第２端面３３は圧迫される。この結果、第１圧迫部５３及び第２圧迫部５４は夫々第１端面３２及び第２端面３３に密着するため、コア３０とシールド部材５０とが２面で接触して確実に導通することになる。また、前述のように、シールド部材５０は基板２０のグランドパッド２３にはんだ付けされているため、コア３０の電位は接地電位に保たれる。 The grounding function of the core 30 by the shield member 50 will be described below. FIG. 3 is a perspective view of the shield member 50 according to the present embodiment as viewed from the front side of FIG. FIG. 4 is a perspective view of the shield member 50 according to the present embodiment as viewed from the back side of FIG. As shown in FIGS. 3 and 4, a part of the first portion 51a of the shield member 50 is cut into a U-shape and pulled out to the outside (upper left in FIG. 3, lower left in FIG. 4). One compression part 53 is formed. Further, a part of the second portion 51b of the shield member 50 is formed with a second compression portion 54 that is cut into a U-shape and pulled out to the outside (lower right side in FIG. 3, upper right side in FIG. 4). ing. Here, the distance d 2 between the distal ends of the first compression portion 53 and the second compression portion 54 in the natural state is the width of the gap 31 of the core 30, that is, the distance d 3 between the first end surface 32 and the second end surface 33 ( It is formed to be larger than FIG. For this reason, when the cover part 51 of the shield member 50 is inserted into the gap 31, the first pressing part 53 and the second pressing part 54 are each pushed inward. At this time, the first end face 32 and the second end face 33 are pressed by the elastic force generated in the both pressing portions. As a result, since the first pressing portion 53 and the second pressing portion 54 are in close contact with the first end surface 32 and the second end surface 33, respectively, the core 30 and the shield member 50 are in contact with each other on the two surfaces to be surely connected. Become. Further, as described above, since the shield member 50 is soldered to the ground pad 23 of the substrate 20, the potential of the core 30 is maintained at the ground potential.

以上説明した本実施形態の電流センサ１においては、シールド部材５０の第１部５１ａと第２部５１ｂの一部が一種の板ばねとしてコア３０を圧迫するようになっている。しかしながら、本発明はこの構成に限定されるものではない。すなわち、圧迫部は必ずしもシールド部材５０の第１部側と第２部側の双方に設けられている必要はなく、いずれか一方のみに圧迫部が設けられる構成としてもよい。   In the current sensor 1 of the present embodiment described above, a part of the first part 51a and the second part 51b of the shield member 50 presses the core 30 as a kind of leaf spring. However, the present invention is not limited to this configuration. That is, the compression part does not necessarily need to be provided on both the first part side and the second part side of the shield member 50, and the compression part may be provided only on one of them.

或いは、他の構成によりコア３０を圧迫し、シールド部材５０とコア３０を導通させる構成としてもよい。例えば、図５のように、シールド部材５０の第１部５１ａとコア３０の第１端面３２の間、及び第２部５１ｂと第２端面３３の間に、プレート状の導電性材料５３’、５４’を挟み込む構成を採用してもよい。更に、図６に示されるように、図５の導電性材料５３’、５４’を一体化したコの字断面の導電性材料５５をギャップ３１に配する構成をとってもよい。   Or it is good also as a structure which presses the core 30 with another structure, and makes the shield member 50 and the core 30 electrical conduction. For example, as shown in FIG. 5, a plate-shaped conductive material 53 ′ between the first portion 51a of the shield member 50 and the first end surface 32 of the core 30 and between the second portion 51b and the second end surface 33, A configuration in which 54 'is sandwiched may be employed. Further, as shown in FIG. 6, a conductive material 55 having a U-shaped cross section in which the conductive materials 53 ′ and 54 ′ of FIG. 5 are integrated may be arranged in the gap 31.

また、図４に示されるように、シールド部材５０のカバー部５１の幅と、第３部５２の先端部５２ａの幅は等しくなっている。しかしながら、先端部５２ａの幅をカバー部５１の幅よりも小さくしてもよい。この構成においては、先端部５２ａが小さくなるため、先端部５２ａのグランドパッド２３（図１、図２）へのはんだ付けが容易なものとなる。   Further, as shown in FIG. 4, the width of the cover portion 51 of the shield member 50 is equal to the width of the tip portion 52 a of the third portion 52. However, the width of the tip 52a may be smaller than the width of the cover 51. In this configuration, since the tip end portion 52a is small, it is easy to solder the tip portion 52a to the ground pad 23 (FIGS. 1 and 2).

本発明の実施の形態による電流センサの斜視図である。1 is a perspective view of a current sensor according to an embodiment of the present invention. 図１のＡ矢視図である。It is A arrow directional view of FIG. 本発明の実施の形態によるシールド部材を図１の正面側から見た斜視図である。It is the perspective view which looked at the shield member by embodiment of this invention from the front side of FIG. 本発明の実施の形態によるシールド部材を図１の背面側から見た斜視図である。It is the perspective view which looked at the shield member by embodiment of this invention from the back side of FIG. 本発明の実施の形態の電流センサの別例を示したものである。It shows another example of the current sensor according to the embodiment of the present invention. 本発明の実施の形態の電流センサのさらなる別例を示したものである。The another example of the current sensor of embodiment of this invention is shown.

符号の説明Explanation of symbols

１ 電流センサ
１０ ケース
２０ 基板
２１ 端子
２３ グランドパッド
３０ コア
３１ ギャップ
３２ 第１端面
３３ 第２端面
３５ 穴
４０ ホール素子
４１ パッケージ本体
４１ａ 第１感磁面
４１ｂ 第２感磁面
５０ シールド部材
５１ カバー部
５１ａ 第１部
５１ｂ 第２部
５２ 第３部
５３ 第１圧迫部
５４ 第２圧迫部
Ｗ 電線 DESCRIPTION OF SYMBOLS 1 Current sensor 10 Case 20 Board | substrate 21 Terminal 23 Ground pad 30 Core 31 Gap 32 1st end surface 33 2nd end surface 35 Hole 40 Hall element 41 Package main body 41a 1st magnetosensitive surface 41b 2nd magnetosensitive surface 50 Shield member 51 Cover part 51a 1st part 51b 2nd part 52 3rd part 53 1st compression part 54 2nd compression part W Electric wire

Claims (6)

基板と、
感磁面が前記基板と略垂直となるよう該基板に実装されている磁電変換素子と、
ギャップが形成されている環状のコアと、
前記感磁面の一方を覆う第１部と、該第１部と接続され前記感磁面の他方を覆う第２部と、該第１部と第２部の一方から延びて基板上のグランドパッドに接続される第３部とを有するシールド手段と、
前記コアにおいてギャップを構成する２端面のうち前記第１部と対向する第１端面と前記第１部との間に配置され、該第１部に接続されると共に該第１端面を圧迫して該コアと前記シールド手段とを導通させる第１の圧迫手段と、
を有する電流センサ。 A substrate,
A magnetoelectric conversion element mounted on the substrate such that the magnetic sensitive surface is substantially perpendicular to the substrate;
An annular core in which a gap is formed;
A first portion covering one of the magnetic sensitive surfaces; a second portion connected to the first portion and covering the other of the magnetic sensitive surfaces; and extending from one of the first and second portions to a ground on the substrate Shielding means having a third part connected to the pad;
Of the two end surfaces constituting the gap in the core, the first end surface is disposed between the first end surface facing the first portion and the first portion, and is connected to the first portion and presses the first end surface. First compression means for conducting the core and the shield means;
A current sensor. 前記第１の圧迫手段は、前記第１部の一部が前記第１端面に向かって折り曲げられて形成された板ばね状部材であることを特徴とする請求項１に記載の電流センサ。   2. The current sensor according to claim 1, wherein the first compression unit is a leaf spring-like member formed by bending a part of the first part toward the first end surface. 前記コアにおいてギャップを構成する両端面のうち前記第２部と対向する第２端面と前記第２部との間に配置され、前記第２部に接続されると共に該第２端面を圧迫して該コアと前記シールド手段とを導通させる第２の圧迫手段をさらに有することを特徴とする請求項２に記載の電流センサ。   Of the both end faces constituting the gap in the core, the second end face is arranged between the second end face facing the second part and the second part, and is connected to the second part and presses the second end face. The current sensor according to claim 2, further comprising second compression means for conducting the core and the shield means. 前記第１の圧迫手段は、前記第１部と前記第１端面との間に挟み込まれる導電性の弾性部材であることを特徴とする請求項１に記載の電流センサ。   2. The current sensor according to claim 1, wherein the first compression unit is a conductive elastic member sandwiched between the first part and the first end surface. 前記弾性部材は、前記コアにおいてギャップを構成する２端面のうち前記第２部と対向する第２端面と前記第２部との間にも挟み込まれるコの字断面形状の部材であることを特徴とする請求項４に記載の電流センサ。   The elastic member is a member having a U-shaped cross-sectional shape that is also sandwiched between the second portion and the second end surface facing the second portion of the two end surfaces constituting the gap in the core. The current sensor according to claim 4. 前記磁電変換素子が前記ギャップ内に配置されるように、前記基板及び前記コアを保持する保持手段を更に有することを特徴とする請求項１から５のいずれかに記載の電流センサ。   The current sensor according to claim 1, further comprising a holding unit that holds the substrate and the core so that the magnetoelectric conversion element is disposed in the gap.
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