JP2009298912A - Base material having bonding film, method for bonding, and bonded body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a base material having a bonding film capable of bonding to an adherend firmly with high dimensional accuracy and efficiently at low temperature; to provide a method to bond the base material having a bonding film to other adherend efficiently at low temperature; and to provide a highly reliable bonded body comprising the base material having a bonding film and an adherend bonded firmly to each other with high dimensional accuracy. <P>SOLUTION: The present base material having a bonding film 1 includes a substrate 2 and a bonding film 3 provided on the substrate 2 and containing a silicone material and an energy beam absorbing material 4 absorbing energy beams. Upon irradiation with an energy beam, such bonding film 3 will develop adhesion to other adherend and the energy beam absorbing material 4 contained in the bonding film 3 will partly absorb the energy beam and generate heat, thus enhancing adhesion developed in the bonding film 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate with a bonding film, a bonding method, and a bonded body.

When joining (adhering) two members (base materials), conventionally, a method of using an adhesive such as an epoxy adhesive, a urethane adhesive, or a silicone adhesive is often used.
The adhesive can exhibit adhesiveness regardless of the material of the member. For this reason, members composed of various materials can be bonded in various combinations.
For example, a droplet discharge head (inkjet recording head) provided in an inkjet printer is assembled by bonding parts made of different materials such as a resin material, a metal material, and a silicon material using an adhesive. ing.
When the members are bonded together using the adhesive as described above, a liquid or paste adhesive is applied to the bonding surface, and the members are bonded together via the applied adhesive. Thereafter, the adhesive is cured by the action of heat or light to bond the members together.

However, such an adhesive has the following problems.
・ Low bonding strength ・ Low dimensional accuracy ・ Long curing time, so it takes a long time to bond In addition, in many cases, it is necessary to use a primer to increase the bonding strength. Cost and complexity.

On the other hand, there is a solid bonding method as a bonding method that does not use an adhesive.
Solid bonding is a method of directly bonding members without an intermediate layer such as an adhesive (see, for example, Patent Document 1).
According to such solid bonding, since an intermediate layer such as an adhesive is not used, a bonded body with high dimensional accuracy can be obtained.

However, solid bonding has the following problems.
-There are restrictions on the material of the members to be joined-In the joining process, heat treatment is performed at a high temperature (for example, about 700 to 800 ° C)-The atmosphere in the joining process is limited to a reduced pressure atmosphere. There is a need for a method of joining members firmly with high dimensional accuracy and efficiently at low temperatures regardless of the material of the provided members.

JP-A-5-82404

  An object of the present invention is to provide a substrate with a bonding film provided with a bonding film that can be firmly bonded to an adherend with high dimensional accuracy and efficiently at a low temperature, the substrate with the bonding film, and the like. A bonding method for efficiently bonding the adherend to each other at a low temperature, and a highly reliable bonded body in which the substrate with the bonding film and the adherend are firmly bonded with high dimensional accuracy. There is.

Such an object is achieved by the present invention described below.
The substrate with a bonding film of the present invention comprises a substrate and
A bonding film that is provided on the substrate, contains a silicone material, and exhibits adhesiveness to other adherends by irradiation with energy rays;
The bonding film further has an adhesive property with the other adherend due to heat generation due to absorption of the energy rays in the energy ray absorbing material by adding an energy ray absorbing material that absorbs the energy rays. It is characterized by being promoted.
Thereby, the base material with a bonding film provided with the bonding film which can be firmly bonded to the adherend with high dimensional accuracy and efficiently at a low temperature is obtained.

In the substrate with the bonding film of the present invention, the bonding film forms a liquid film by supplying a liquid material containing the silicone material and the energy ray absorbing substance onto the substrate, and the liquid film It is preferable that it is formed by drying.
Thereby, the energy ray absorbing substance can be more uniformly dispersed in the bonding film. For this reason, the bonding film is more reliably developed to adhere to the adherend when irradiated with energy rays. Further, since the adhesiveness is surely exhibited even by irradiation with a relatively small amount of energy rays, the substrate with the bonding film can be bonded to the adherend with more energy saving. Further, the smoothness of the bonding film surface is particularly high, and the substrate with the bonding film can be bonded to the adherend with higher dimensional accuracy.

In the base material with a bonding film of the present invention, it is preferable that the main skeleton of the silicone material is composed of polydimethylsiloxane.
Thereby, as for the bonding film which comprises a base material with a bonding film, the hydroxyl groups which adjacent silicone materials have will couple | bond together, and the film | membrane intensity | strength of the bonding film obtained will become especially excellent.
In the base material with a bonding film of the present invention, the silicone material preferably has a silanol group.
As a result, when the liquid film is dried to obtain a bonding film, the reactivity of the silanol groups is further improved, and the bonding between the hydroxyl groups of adjacent silicone materials can be performed more smoothly, and the resulting bonding film The film strength is particularly excellent.

In the base material with a bonding film of the present invention, the energy ray absorbing substance includes at least one material selected from titanium oxide, cerium oxide, indium tin oxide (ITO), and carbon black as a constituent component. preferable.
As a result, the bonding film is more reliably developed to adhere to the adherend when irradiated with a smaller amount of energy rays. As a result, the substrate with the bonding film can be bonded to the adherend with more energy saving. In addition, by including an energy ray absorbing material composed of such a material in the bonding film, the heat resistance, weather resistance, and dimensional stability of the bonding film are further improved.

In the base material with a bonding film of the present invention, the energy ray absorbing substance is preferably in the form of particles.
Thereby, when energy rays are applied to the bonding film, the bonding film can efficiently exhibit adhesiveness.
In the base material with a bonding film of the present invention, the average particle diameter of the energy ray absorbing substance is preferably 100 to 1000 nm.
Thereby, when an energy ray is irradiated to a bonding film, adhesiveness can be efficiently expressed by the bonding film. Further, such a bonding film can easily control the light transmittance by adjusting the content of the energy ray absorbing substance in the bonding film.

In the substrate with a bonding film of the present invention, when the average thickness of the bonding film is T [nm] and the average particle diameter of the energy ray absorbing material is L [nm], 1.5 ≦ T / L ≦ 10. It is preferable to satisfy this relationship.
As a result, the bonding surface of the bonding film with the adherend can be made sufficiently smooth. As a result, the substrate with the bonding film can be firmly bonded to the adherend with particularly high dimensional accuracy.

In the base material with a bonding film of the present invention, the content rate of the energy ray absorbing substance in the bonding film is preferably 1 to 30 wt%.
Thereby, when an energy beam is applied to the bonding film, the bonding film can efficiently exhibit adhesiveness.
In the base material with a bonding film of the present invention, the energy beam is preferably ultraviolet light.
Thereby, a base material with a joining film can be joined to an adherend more firmly. In the present invention, the bonding film can suitably exhibit adhesiveness by irradiation with ultraviolet rays for a relatively short time, and the substrate with the bonding film can be bonded to the adherend with more energy saving.

The substrate with a bonding film of the present invention comprises a substrate and
A bonding film that is provided on the substrate, contains a silicone material, and exhibits adhesiveness to other adherends by irradiation with energy rays;
In the bonding film, when an energy ray absorbing material that absorbs the energy rays is partially added, heat generated by absorption of the energy rays in the energy ray absorbing material is caused in the portion including the energy ray absorbing material. Adhesion with the other adherend is promoted,
The portion of the bonding film that includes the energy ray absorbing substance and the portion of the bonding film that does not include the energy ray absorbing substance have different bonding strengths to the adherend.
Thereby, while joining with a high dimensional accuracy with respect to a to-be-adhered body, the base material with a joining film by which joining strength was adjusted according to the joining location with a to-be-adhered body can be provided.

The bonding method of the present invention includes a step of preparing a substrate and an adherend,
A liquid film is formed on the substrate by supplying a liquid material containing a silicone material and an energy ray absorbing substance that absorbs energy rays, and then the liquid film is dried to form a bonding film. Process,
By irradiating the bonding film with the energy beam, the bonding film exhibits adhesiveness, and the heat generated by the absorption of the energy beam in the energy beam absorbing material promotes the bonding film adhesion, And a step of obtaining a joined body in which the base material and the adherend are joined via a joining film.
Thereby, the base material can be firmly bonded to the adherend with high dimensional accuracy and efficiently at a low temperature.

The bonding method of the present invention includes a step of preparing a substrate and an adherend,
A liquid film is formed on the substrate by supplying a liquid material containing a silicone material and a liquid material containing an energy ray absorbing substance that absorbs energy rays in addition to the silicone material to different regions. And then drying the liquid film to form a bonding film;
By irradiating the bonding film with the energy beam, the bonding film is made to exhibit adhesiveness, and heat generated by absorption of the energy beam in the energy beam absorbing material causes the covering in the portion including the energy beam absorbing material. A step of promoting adhesion with an adherend and obtaining a joined body in which the substrate and the adherend are joined via the joining film.
Thereby, while being able to join a base material with a high dimensional accuracy and low temperature efficiently to a to-be-adhered body, the joining strength of a base material and a to-be-adhered body can be adjusted easily.
The joined body of the present invention has the base material with the joined film of the present invention and an adherend,
These are bonded through the bonding film.
Thereby, it is possible to obtain a highly reliable bonded body in which the substrate with the bonding film is firmly bonded to the adherend with high dimensional accuracy.

Hereinafter, the base material with a bonding film, the bonding method, and the bonded body of the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings.
<First Embodiment>
First, each base material with a bonding film of the present invention, a bonding method for bonding the base material with a bonding film and a counter substrate (another adherend), and a bonded body including the base material with a bonding film of the present invention. One embodiment will be described.
FIG. 1 is a view (longitudinal sectional view) for explaining a first embodiment of a substrate with a bonding film of the present invention, and FIGS. 2 and 3 are bonded using the substrate with a bonding film of the present embodiment. It is a figure (longitudinal section) for explaining a 1st embodiment of a joining method which joins a substrate with a film and a counter substrate. In the following description, the upper side in FIGS. 1 to 3 is referred to as “upper” and the lower side is referred to as “lower”.

Below, 1st Embodiment of the base material with a bonding film of this invention is described first.
A base material 1 with a bonding film shown in FIG. 1 includes a substrate (base material) 2 having a plate shape and a bonding film 3 provided on the substrate 2. The substrate 1 with a bonding film is used by bonding the substrate 2 to another adherend through the bonding film 3.
The substrate 2 is bonded to another adherend through the bonding film 3.

The constituent materials of the substrate 2 are not particularly limited, but polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-acrylic acid ester copolymer, ethylene-acrylic acid copolymer, polybutene-1, ethylene- Polyolefin such as vinyl acetate copolymer (EVA), cyclic polyolefin, modified polyolefin, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyamide, polyimide, polyamideimide, polycarbonate, poly- (4-methylpentene-1), ionomer, Acrylic resin, polymethyl methacrylate (PMMA), acrylonitrile-butadiene-styrene copolymer (ABS resin), acrylonitrile-styrene copolymer (AS resin), butadiene-styrene copolymer, polyoxymethyl , Polyvinyl alcohol (PVA), ethylene-vinyl alcohol copolymer (EVOH), polyethylene terephthalate (PET), polyethylene naphthalate, polybutylene terephthalate (PBT), polyester such as polycyclohexane terephthalate (PCT), polyether, poly Ether ketone (PEK), polyether ether ketone (PEEK), polyether imide, polyacetal (POM), polyphenylene oxide, modified polyphenylene oxide, polysulfone, polyether sulfone, polyphenylene sulfide, polyarylate, aromatic polyester (liquid crystal polymer) , Polytetrafluoroethylene, polyvinylidene fluoride, other fluororesins, styrene, polyolefin, polyvinyl chloride Various thermoplastic elastomers such as polyurethane, polyester, polyamide, polybutadiene, trans polyisoprene, fluororubber, chlorinated polyethylene, epoxy resin, phenol resin, urea resin, melamine resin, aramid resin, unsaturated Polyester, silicone resin, polyurethane, etc., or resin materials such as copolymers, blends, polymer alloys, etc., Fe, Ni, Co, Cr, Mn, Zn, Pt, Au, Ag, Cu, Pd , Al, W, Ti, V, Mo, Nb, Zr, Pr, Nd, Sm, or alloys containing these metals, carbon steel, stainless steel, indium tin oxide (ITO), gallium arsenide Silicon-based materials such as metallic materials, single crystal silicon, polycrystalline silicon, amorphous silicon Materials, glass materials such as silicate glass (quartz glass), alkali silicate glass, soda lime glass, potash lime glass, lead (alkali) glass, barium glass, borosilicate glass, alumina, zirconia, MgAl ₂ O ₄ , Ferrite, silicon nitride, aluminum nitride, boron nitride, titanium nitride, silicon carbide, boron carbide, titanium carbide, a carbonaceous material such as tungsten carbide, a carbonaceous material such as graphite, or one or each of these materials The composite material etc. which combined 2 or more types are mentioned.

Further, the surface of the substrate 2 may be subjected to a plating treatment such as Ni plating, a passivation treatment such as a chromate treatment, or a nitriding treatment.
Further, the shape of the substrate (base material) 2 may be any shape that has a surface for supporting the bonding film 3 and is not limited to a plate shape. That is, the shape of the substrate may be, for example, a block shape (block shape) or a rod shape.

In the present embodiment, since the substrate 2 has a plate shape, the substrate 2 is easily bent, and the substrate 2 can be sufficiently deformed along the shape of the counter substrate 5. Adhesion becomes higher. Moreover, in the base material 1 with a bonding film, the adhesiveness between the substrate 2 and the bonding film 3 is enhanced, and the stress generated at the bonding interface can be relaxed to some extent by bending the substrate 2.
In this case, the average thickness of the substrate 2 is not particularly limited, but is preferably about 0.01 to 10 mm, and more preferably about 0.1 to 3 mm. In addition, it is preferable that the average thickness of the counter substrate (other adherend) 5 described later is also in the same range as the average thickness of the substrate 2 described above.

The bonding film 3 is located between the substrate 2 and the other adherend when the substrate 1 with the bonding film is bonded to another adherend, and bears the bonding therebetween.
The bonding film 3 includes a silicone material and an energy ray absorbing material 4 that absorbs energy rays.
The silicone material contained in the bonding film 3 exhibits adhesiveness with other adherends when irradiated with energy rays.

The energy ray absorbing material 4 contained in the bonding film 3 absorbs energy rays and generates heat.
Such a bonding film 3 exhibits adhesiveness with other adherends in the vicinity of the surface thereof by irradiation with energy rays, and the energy ray absorbing material 4 absorbs the energy rays and generates heat. Thus, adhesion with other adherends is promoted.
The base material 1 with a bonding film having such a bonding film 3 can be firmly bonded to other adherends with high dimensional accuracy and efficiently at a low temperature.
The detailed configuration of the bonding film 3 will be described in the following bonding method.

Next, the joining method of the base material with a joining film of this embodiment and another adherend will be described.
In the bonding method according to the present embodiment, the step of preparing the base material 1 with the bonding film and the bonding film 3 of the base material 1 with the bonding film are irradiated with energy rays to adhere to the vicinity of the surface of the bonding film 3. And a counter substrate (other adherend) 5 are prepared, and these are bonded together so that the bonding film 3 and the counter substrate 5 included in the base material 1 with the bonding film are in close contact with each other, 10 is obtained.

Hereinafter, each process of the joining method concerning this embodiment is demonstrated one by one.
[1] First, a base material 1 with a bonding film is prepared.
This base material 1 with a bonding film includes the substrate 2 and the bonding film 3 as described above.
Such a base material 1 with a bonding film can be obtained using, for example, the following method for forming a base material with a bonding film.
Specifically, a step of preparing the substrate 2, and a step of forming a liquid film 30 by supplying a liquid material containing a silicone material and an energy ray absorbing material 4 that absorbs energy rays on the substrate 2. The substrate 1 with a bonding film is formed by drying the liquid film 30 and forming the bonding film 3 on the substrate 2.

Hereinafter, each of these steps will be described in detail.
[1A] First, the substrate 2 is prepared (see FIG. 2A).
As the substrate 2, those described above can be used.
Further, the surface 25 on which the bonding film 3 of the prepared substrate 2 is formed is subjected to a surface treatment for improving the adhesion with the bonding film 3 to be formed, if necessary. Thereby, the surface 25 is cleaned and activated, and the bonding film 3 easily acts on the surface 25 chemically. As a result, when the bonding film 3 is formed on the surface 25 in the process described later, the bonding strength between the surface 25 and the bonding film 3 can be increased. Thereby, the base material 1 with a bonding film can be firmly fixed to the counter substrate (other adherend) 5.

This surface treatment is not particularly limited, for example, physical treatment such as sputtering treatment, blast treatment, plasma treatment using oxygen plasma, nitrogen plasma, corona discharge treatment, etching treatment, electron beam irradiation treatment, Examples thereof include a chemical surface treatment such as ultraviolet irradiation treatment, ozone exposure treatment, or a combination thereof.
As such surface treatment, the surface 25 can be further cleaned and activated by performing plasma treatment or ultraviolet irradiation treatment in particular. As a result, the bonding strength between the surface 25 and the bonding film 3 can be particularly increased.

Further, depending on the constituent material of the substrate 2, the bonding strength with the bonding film 3 is sufficiently high without performing the above-described surface treatment. Examples of the constituent material of the substrate 2 that can obtain such an effect include those mainly composed of various metal-based materials, various silicon-based materials, various glass-based materials and the like as described above.
The surface of the substrate 2 made of such a material is covered with an oxide film, and a relatively active hydroxyl group is bonded to the surface of the oxide film. Therefore, when the substrate 2 made of such a material is used, the base material with a bonding film 1 and the counter substrate 5 can be firmly bonded without performing the surface treatment as described above.
In this case, the entire substrate 2 may not be made of the above material, and at least the vicinity of the surface of the region where the bonding film 3 is to be formed needs to be made of the above material.

[1B] Next, by supplying a liquid material containing a silicone material and an energy ray absorbing material 4 that absorbs energy rays onto the surface 25 of the substrate 2, the liquid coating 30 is formed on the surface 25 of the substrate 2. Is formed (see FIG. 2B).
Such a supply method is not particularly limited, but a coating method is preferably used.
The coating method is not particularly limited. For example, spin coating method, casting method, micro gravure coating method, gravure coating method, bar coating method, roll coating method, wire bar coating method, dip coating method, spray coating method, screen Examples thereof include a printing method, a flexographic printing method, an offset printing method, a microcontact printing method, a droplet discharge method, and the like, but it is particularly preferable to use a droplet discharge method. According to the droplet discharge method, as shown in FIG. 1B, the liquid material can be supplied to the surface 25 as droplets 31, so that the liquid coating 30 is selectively applied to a partial region of the surface 25. Even if it is formed by patterning, the liquid material can be (selectively) supplied corresponding to the shape of this region.

  The droplet discharge method is not particularly limited, but an ink jet method in which a liquid material is discharged using vibration by a piezoelectric element is preferably used. According to the inkjet method, a liquid material can be supplied as a droplet 31 to a target region (position) with excellent positional accuracy. Further, since the size (size) of the droplet 31 can be adjusted relatively easily by appropriately setting the frequency of the piezoelectric element, the viscosity of the liquid material, and the like, if the size of the droplet 31 is reduced, for example. Even if the shape of the region where the film is formed is fine, the liquid coating 30 corresponding to the shape of this region can be reliably formed.

  In general, the viscosity (25 ° C.) of the liquid material is preferably about 0.5 to 200 mPa · s, more preferably about 3 to 20 mPa · s. By setting the viscosity of the liquid material within such a range, it is possible to discharge the droplets more stably and to easily finely adjust the discharge amount. Thereby, the bonding film 3 having a uniform film thickness can be formed on the substrate 2 (on the surface 25). As a result, the base material 1 with the bonding film and the counter substrate 5 can be bonded with high dimensional accuracy. Furthermore, when the liquid film 30 composed of this liquid material is dried in the next step [1C], a sufficient amount of silicone material to form the bonding film 3 is included in the liquid material. Can do.

Further, if the viscosity of the liquid material is within such a range, specifically, the amount of the droplets 31 (the amount of one droplet of the liquid material) is more realistically about 0.1 to 40 pL on average. Can be set to about 1 to 30 pL. Thereby, since the landing diameter of the droplet 31 when supplied to the surface 25 becomes small, fine adjustment of the discharge amount is further facilitated.
The liquid material contains a silicone material as described above. However, when the silicone material alone is liquid and has a desired viscosity range, the silicone material can be used as it is as a liquid material. When the silicone material alone forms a solid or highly viscous liquid, a solution or dispersion of the silicone material can be used as the liquid material.

Examples of the solvent or dispersion medium for dissolving or dispersing the silicone material include inorganic solvents such as ammonia, water, hydrogen peroxide, carbon tetrachloride, and ethylene carbonate, and ketone solvents such as methyl ethyl ketone (MEK) and acetone. Alcohol solvents such as methanol, ethanol and isobutanol, ether solvents such as diethyl ether and diisopropyl ether, cellosolve solvents such as methyl cellosolve, aliphatic hydrocarbon solvents such as hexane and pentane, toluene, xylene, benzene, etc. Aromatic hydrocarbon solvents, aromatic heterocyclic compound solvents such as pyridine, pyrazine, furan, amide solvents such as N, N-dimethylformamide (DMF), halogen compound solvents such as dichloromethane and chloroform, ethyl acetate Esters such as methyl acetate Various organic solvents such as solvents, sulfur compound solvents such as dimethyl sulfoxide (DMSO), sulfolane, nitrile solvents such as acetonitrile, propionitrile, acrylonitrile, organic acid solvents such as formic acid, trifluoroacetic acid, or the like A mixed solvent containing can be used.
The silicone material is contained in the liquid material and is configured as a main material of the bonding film 3 formed by drying the liquid material in the next step [1C].

The bonding film 3 composed mainly of such a silicone material exhibits adhesiveness on its surface 35 when irradiated with energy rays in the next step [2].
Here, the “silicone material” is a compound having a polyorganosiloxane skeleton, and usually refers to a compound in which the main skeleton (main chain) portion is mainly composed of repeating organosiloxane units, and from a part of the main chain. It may have a protruding branched structure, may be a cyclic body in which the main chain is cyclic, or may be a straight chain in which the ends of the main chain are not connected to each other.
For example, in a compound having a polyorganosiloxane skeleton, the organosiloxane unit has a structural unit represented by the following general formula (1) at the terminal portion and a structural unit represented by the following general formula (2) at the connecting portion. In addition, the branch part has a structural unit represented by the following general formula (3).

［式中、各Ｒは、それぞれ独立して、置換または無置換の炭化水素基を表し、各Ｚは、それぞれ独立して、水酸基または加水分解基を表し、Ｘはシロキサン残基を表し、ａは０または１〜３の整数を表し、ｂは０または１〜２の整数を表し、ｃは０または１を表す。］

[In the formula, each R independently represents a substituted or unsubstituted hydrocarbon group, each Z independently represents a hydroxyl group or a hydrolyzable group, X represents a siloxane residue, a Represents an integer of 0 or 1 to 3, b represents an integer of 0 or 1 to 2, and c represents 0 or 1. ]

In such a silicone material, the polyorganosiloxane skeleton is branched, that is, the structural unit represented by the general formula (1), the structural unit represented by the general formula (2), and the general formula (3). It is preferable that it is comprised by the structural unit represented by this. The compound having a branched polyorganosiloxane skeleton (hereinafter sometimes abbreviated as “branched compound”) is a compound in which the main skeleton (main chain) portion is mainly composed of repeating organosiloxane units. The repeating of the organosiloxane unit branches in the middle of the main chain, and the ends of the main chain are not connected to each other.
By using this branched compound, in the next step [1C], the bonding film 3 is formed so that the branched chains of this compound contained in the liquid material are entangled with each other. The film 3 is particularly excellent in film strength.

  In the general formula (1) to the general formula (3), examples of the group R (substituted or unsubstituted hydrocarbon group) include, for example, an alkyl group such as a methyl group, an ethyl group, and a propyl group, a cyclopentyl group, Examples thereof include cycloalkyl groups such as cyclohexyl group, aryl groups such as phenyl group, tolyl group and biphenylyl group, aralkyl groups such as benzyl group and phenylethyl group. In addition, some or all of the hydrogen atoms bonded to the carbon atoms of these groups are I) halogen atoms such as fluorine, chlorine and bromine atoms, II) epoxy groups such as glycidoxy groups, III) methacryl (Meth) acryloyl group IV) such as a group, and a group substituted with an anionic group such as a carboxyl group and a sulfonyl group.

Hydrolysis groups include alkoxy groups such as methoxy group, ethoxy group, propoxy group and butoxy group, ketoxime groups such as dimethyl ketoxime group and methylethyl ketoxime group, acyloxy groups such as acetoxy group, isopropenyloxy group, isobutenyl Examples include alkenyloxy groups such as oxy groups.
Further, the branched compound preferably has a molecular weight of about 1 × 10 ⁴ to 1 × 10 ^6, more preferably about 1 × 10 ⁵ to 1 × 10 ⁶ . By setting the molecular weight within such a range, the viscosity of the liquid material can be relatively easily set within the above-described range.

  Such branched compounds are preferably those having a silanol group. That is, in the structural units represented by the general formula (1) to the general formula (3), each group Z is preferably a hydroxyl group. Thus, in the next step [1C], when the liquid film 30 is dried to obtain the bonding film 3, the hydroxyl groups of the adjacent branched compounds are bonded to each other, and the film strength of the bonding film 3 obtained is increased. It will be excellent. Further, as described above, when the substrate 2 having a hydroxyl group exposed from the bonding surface (surface) 25 is used, the hydroxyl group included in the branched compound is bonded to the hydroxyl group included in the substrate 2. Therefore, the branched compound can be bonded to the substrate 2 not only by physical bonding but also by chemical bonding. As a result, the bonding film 3 is firmly bonded to the surface 25 of the substrate 2.

  Moreover, it is preferable that the hydrocarbon group connected to the silicon atom of the silanol group is a phenyl group. That is, the group R present in the structural unit represented by the general formula (1) to the general formula (3) in which the group Z is a hydroxyl group is preferably a phenyl group. Thereby, since the reactivity of a silanol group improves more, the coupling | bonding of the hydroxyl groups which an adjacent branched compound has comes to be performed more smoothly.

Furthermore, the hydrocarbon group linked to the silicon atom in which no silanol group is present is preferably a methyl group. That is, the group R present in the structural unit represented by the general formula (1) to the general formula (3) in which the group Z does not exist is preferably a methyl group. Thus, a compound in which the group R present in the structural unit represented by the general formula (1) to the general formula (3) in which the group Z does not exist is a methyl group is relatively easily available and inexpensive. In addition, in the next step [2], by applying bonding energy to the bonding film 3, the methyl group is easily cleaved, and as a result, the bonding film 3 can surely exhibit adhesiveness. Therefore, it is suitably used as a branched compound (silicone material).
Considering the above, as the branched compound, for example, a compound in which the main skeleton represented by the following general formula (4) is composed of polydimethylsiloxane is preferably used.

［式中、ｎは、それぞれ独立して、０または１以上の整数を表す。］

[Wherein n independently represents an integer of 0 or 1 or more. ]

  Furthermore, the above-mentioned branched compound is a material having a relatively high flexibility. Therefore, when the counter substrate 5 is bonded to the substrate 2 via the bonding film 3 to obtain the bonded body 10 in the next step [3], for example, the constituent materials of the substrate 2 and the counter substrate 5 are different from each other. Even if it is a case where is used, the stress accompanying the thermal expansion which arises between the board | substrate 2 and the opposing board | substrate 5 can be relieve | moderated reliably. Thereby, it can prevent reliably that peeling arises in the bonded body 10 finally obtained.

Further, since the branched compound is excellent in chemical resistance, it can be effectively used for joining members that are exposed to chemicals for a long time. Moreover, since such a branched compound is excellent also in heat resistance, it can be effectively used for joining members exposed to high temperatures.
The energy ray absorbing material 4 generates heat by absorbing energy rays. Specific examples of such energy rays include light such as ultraviolet rays and laser beams, electromagnetic waves such as X-rays and γ rays, electron beams, and particle beams such as ion beams.

  Such an energy ray absorbing material 4 absorbs a part of the energy rays irradiated to the bonding film 3 and generates heat in the next step [2], and the counter substrate (another adherend) 5 of the bonding film 3. It promotes adhesion to the surface. Thereby, the adhesive property with respect to the counter substrate 5 can be surely expressed in the bonding film 3. In addition, the bonding film 3 including the energy ray absorbing material 4 exhibits adhesiveness with the counter substrate 5 when irradiated with a relatively small amount of energy rays. Therefore, in order to obtain the bonded body 10, in the next step [2], it is possible to shorten the irradiation time of the energy beam irradiated to the bonding film 3, or to suppress the intensity of the irradiated energy beam, and to save energy of the bonding method. Can be achieved.

The material constituting the energy ray absorbing substance 4 is not particularly limited as long as it generates heat by absorbing energy rays as described above, and carbon-based pigment powder such as carbon black, Ti, Cu, Fe, Zn, Mn, Mg, Ce, other metal oxides (for example, TiO ₂ , CeO _2, etc.), indium tin oxide (ITO), etc. are mentioned. They can be used in combination.

Among such materials, the energy ray absorbing substance 4 preferably includes at least one material selected from titanium oxide (TiO ₂ ), cerium oxide (CeO ₂ ), or ITO. These materials absorb the energy rays as described above and generate heat efficiently. In the next step [2], the effect of promoting the adhesiveness of the bonding film 3 that is manifested by irradiation with the energy rays. Is particularly high. Therefore, by using the above-described material as the energy ray absorbing substance 4, it is possible to cause the bonding film 3 to exhibit adhesiveness to the counter substrate 5 more reliably.

  In the present embodiment, the energy ray absorbing material 4 is in the form of particles. As a result, the bonding film 3 obtained by drying the liquid film 30 has the energy ray absorbing material 4 dispersed throughout the film, and the adhesiveness developed in the bonding film 3 has no variation in the entire surface 35. , It will be uniform. As a result, the base material 1 with the bonding film can be reliably bonded to the counter substrate 5, and the occurrence of problems such as partial peeling of the bonded body 10 can be reliably prevented.

  The average particle size of the energy ray absorbing material 4 is preferably 100 to 1000 nm, more preferably 200 to 800 nm, and even more preferably 300 to 500 nm. Thereby, the surface 35 of the bonding film 3 to be formed is surely smooth, and the base material 1 with the bonding film can be bonded to the counter substrate 5 with higher dimensional accuracy. Further, the heat (thermal energy) generated by the energy ray absorbing material 4 by absorbing the energy rays can be efficiently transferred to the silicone material around the energy ray absorbing material 4, and the bonding film 3 has a shorter energy. High adhesiveness with respect to the counter substrate 5 is expressed by the irradiation of the line.

  The content of the energy ray absorbing material 4 contained in the bonding film 3 is preferably 1 to 30 wt%, more preferably 3 to 25 wt%, and further preferably 5 to 20 wt%. Thereby, the adhesiveness of the bonding film 3 is more efficiently promoted, and the base material 1 with the bonding film can be bonded to the counter substrate 5 with higher bonding strength. Moreover, sufficient adhesiveness can be expressed in the bonding film 3 by irradiation with a relatively small amount of energy rays.

[1C] Next, the bonding film 3 is formed by drying the liquid film 30 provided on the substrate 2 (see FIG. 2C).
The thus formed bonding film 3 has the energy ray absorbing material 4 dispersed throughout the film. When such a bonding film 3 is irradiated with energy rays, uniform adhesiveness with no variation is exhibited in the entire area of the surface 35.

The temperature at which the liquid coating 30 is dried is preferably 25 ° C. or higher, more preferably about 25 to 100 ° C.
Further, the drying time is preferably about 0.5 to 48 hours, more preferably about 15 to 30 hours.
By drying the liquid material under such conditions, in the next step [2], it is possible to reliably form the bonding film 3 in which the adhesiveness is suitably developed by irradiation with energy rays. Moreover, when what has a silanol group which was demonstrated at the said process [1B] as a silicone material is used, the silanol group which a silicone material has, and also the silanol group which a silicone material has, and the board | substrate 2 have. Since the hydroxyl group can be reliably bonded, the formed bonding film 3 is excellent in film strength and can be firmly bonded to the substrate 2.

Furthermore, the atmospheric pressure during drying may be under atmospheric pressure, but is preferably under reduced pressure. Specifically, the degree of decompression is preferably about 133.3 × 10 ^{−5 to} 1333 Pa (1 × 10 ^{−5 to} 10 Torr), preferably 133.3 × 10 ^{−4 to} 133.3 Pa (1 × 10 ^{-4 to 1} Torr) is more preferable. Thereby, the film density of the bonding film 3 is densified, and the bonding film 3 can have more excellent film strength.
As described above, the film strength and the like of the formed bonding film 3 can be made desired by appropriately setting the conditions for forming the bonding film 3.

  The average thickness of the bonding film 3 is preferably about 300 to 10000 nm, and more preferably about 500 to 8000 nm. By appropriately setting the amount of the liquid material to be supplied and setting the average thickness of the formed bonding film 3 within the above range, the bonding film 3 is obtained by uniformly dispersing the energy ray absorbing material 4 over the entire film. It becomes. As a result, the adhesiveness developed in the bonding film 3 is uniform with no variation in the entire area of the surface 35. As a result, the base material 1 with the bonding film can be reliably bonded to the counter substrate 5, and the occurrence of problems such as partial peeling of the bonded body 10 can be reliably prevented. Moreover, the base material 1 with a bonding film can be bonded to the counter substrate 5 with higher dimensional accuracy.

That is, when the average thickness of the bonding film 3 is less than the lower limit, sufficient bonding strength may not be obtained. On the other hand, when the average thickness of the bonding film 3 exceeds the upper limit, the dimensional accuracy of the bonded body may be significantly reduced.
Furthermore, by setting the average thickness of the bonding film 3 within such a range, the bonding film 3 becomes highly elastic to some extent. Therefore, in the next step [3], the substrate 1 with the bonding film is bonded to the counter substrate. At this time, even if particles or the like adhere to the bonding surface 55 of the counter substrate 5 to be brought into contact with the bonding film 3, the bonding film 3 and the bonding surface 55 are bonded so as to surround the particles with the bonding film 3. Become. For this reason, it is possible to accurately suppress or prevent the bonding strength at the interface between the bonding film 3 and the bonding surface 55 from being reduced or the separation from occurring at this interface due to the presence of the particles.

  Further, when the average thickness of the bonding film 3 is T [nm] and the average particle diameter of the energy ray absorbing material 4 is L [nm], it is preferable that the relationship of 1.5 ≦ T / L ≦ 10 is satisfied. It is more preferable to satisfy the relationship of 2 ≦ T / L ≦ 8, and it is even more preferable to satisfy the relationship of 3 ≦ T / L ≦ 7. Thereby, the energy ray absorbing material 4 can be more uniformly dispersed in the bonding film 3. Thereby, in the next step [2], by irradiating the bonding film 3 with energy rays, the entire surface 35 of the bonding film 3 can be more efficiently expressed with adhesiveness. In particular, even with a relatively small amount of energy beam irradiation, the bonding film 3 can reliably exhibit adhesion to the counter substrate 5. In addition, the energy ray absorbing material 4 is reliably prevented from segregating on the surface of the bonding film 3, the surface 35 of the bonding film 3 is surely smooth, and the substrate 1 with the bonding film is attached to the counter substrate 5. , It can be joined with higher dimensional accuracy.

In the present embodiment, since the bonding film 3 is formed by supplying the liquid material, even if the bonding surface 25 of the substrate 2 has unevenness, the unevenness of the unevenness is present. Although it depends on the height, the bonding film 3 can be formed so as to follow the uneven shape. As a result, the bonding film 3 absorbs the unevenness, and the surface thereof is constituted by a substantially flat surface.
The base material 1 with a bonding film can be obtained as described above.

[2] Next, the surface 35 of the bonding film 3 of the substrate 1 with bonding film is irradiated with energy rays.
When the bonding film 3 is irradiated with energy rays, a part of the molecular bond in the vicinity of the surface 35 (for example, Si—CH ₃ bond when the main skeleton of the silicone material is made of polydimethylsiloxane) is formed in the bonding film 3. As a result of the cutting and activation of the surface 35, adhesion with the counter substrate 5 appears in the vicinity of the surface 35. Furthermore, part of the energy rays irradiated to the bonding film 3 is absorbed by the energy ray absorbing material 4 included in the film, and the energy ray absorbing material 4 generates heat. Thereby, thermal energy is given to the silicone material around the energy ray absorbing substance 4, and a part of the molecular bond of the silicone material is easily broken. That is, the bonding film 3 is promoted to adhere to the counter substrate 5 by the heat generated by the energy ray absorbing material 4.

  As described above, the bonding film 3 includes the energy ray absorbing material 4, so that the surface 35 is efficiently activated by the energy ray irradiation, and the adhesiveness to the counter substrate 5 is surely exhibited. Thereby, the base material 1 with a bonding film can be strongly bonded to the counter substrate 5 based on the chemical bond. In addition, such a bonding film 3 can be reliably applied to the surface 35 by the synergistic action of the light energy by the energy beam and the heat energy by the heat generation of the energy beam absorbing material 4 even when irradiated with a relatively small amount of energy beam. Adhesiveness will be developed. Therefore, for example, the irradiation time of the energy beam applied to the bonding film 3 can be shortened, the intensity of the energy beam irradiated can be suppressed, and energy saving of the bonding method can be achieved.

  Here, in this specification, the state in which the surface 35 is “activated” means a part of molecular bonds on the surface 35 of the bonding film 3 as described above, specifically, for example, a polydimethylsiloxane skeleton. In addition to the state in which the methyl group included in is cleaved to form a bond not terminated in the bonding film 3 (hereinafter also referred to as “unbonded bond” or “dangling bond”), In this case, the bonding film 3 is referred to as an “activated” state including a state in which is terminated by a hydroxyl group (OH group) and a state in which these states are mixed.

Examples of the energy rays applied to the bonding film 3 include light such as ultraviolet rays and laser beams, electromagnetic waves such as X-rays and γ rays, particle beams such as electron beams and ion beams, and these energy rays. The thing which combined 2 or more types is mentioned.
Among these energy rays, it is particularly preferable to use ultraviolet rays having a wavelength of about 126 to 300 nm (see FIG. 2D). In the case of ultraviolet rays within such a range, the amount of energy applied is optimized, so that the molecular bond forming the skeleton in the bonding film 3 is prevented from being broken more than necessary and the bonding film 3 to the surface 35. Nearby molecular bonds can be selectively cleaved. As a result, it is possible to reliably cause the bonding film 3 to exhibit adhesiveness while preventing the characteristics (mechanical characteristics, chemical characteristics, etc.) of the bonding film 3 from deteriorating.

In addition, since ultraviolet rays can be processed over a wide range in a short time without unevenness, molecular bonds can be efficiently cut. Furthermore, ultraviolet rays also have the advantage that they can be generated with simple equipment such as UV lamps.
The wavelength of the ultraviolet light is more preferably about 126 to 200 nm.
In the case of using the UV lamp, the output may vary depending on the area of the bonding film 3 is preferably from ^1mW / cm ^{2 ~1W} / cm 2 or ^so, at 5mW / cm ² ~30mW / cm 2 of about More preferably. In this case, the distance between the UV lamp and the bonding film 3 is preferably about 3 to 3000 mm, more preferably about 10 to 1000 mm. The bonding film 3 reliably develops adhesiveness on the surface 35 by irradiation with energy rays having a relatively low energy amount.

  The time for irradiating the ultraviolet rays is such a time that the molecular bond in the vicinity of the surface 35 of the bonding film 3 can be cut, that is, a time in which the molecular bond existing in the vicinity of the surface of the bonding film 3 can be selectively cut. Is preferable. Specifically, although it varies slightly depending on the amount of ultraviolet light, the constituent material of the bonding film 3, etc., it is preferably about 1 second to 30 minutes, more preferably about 1 second to 8 minutes. As described above, the bonding film 3 reliably exhibits adhesiveness on the surface 35 by irradiation with energy rays for a relatively short time.

  As described above, the bonding film 3 is irradiated with a smaller amount of energy rays than the bonding film that does not include the energy ray absorbing material due to the action of the energy ray absorbing material 4 contained in the film generating heat by absorbing the energy rays. Thus, the vicinity of the surface 35 can be activated efficiently. Thus, since the energy dose irradiated to the bonding film 3 can be reduced and the surface 35 and its vicinity can be activated without excessively breaking the molecular bond of the silicone material, the mechanical strength of the bonding film 3 can be increased. Adhesiveness to the counter substrate 5 can be surely expressed on the surface 35 while being particularly excellent.

Further, the ultraviolet rays may be irradiated continuously in time or intermittently (pulsed).
The bonding film 3 may be irradiated with energy rays in any atmosphere. Specifically, the atmosphere, an oxidizing gas atmosphere such as oxygen, a reducing gas atmosphere such as hydrogen, nitrogen, An inert gas atmosphere such as argon, or a reduced pressure (vacuum) atmosphere in which these atmospheres are decompressed may be mentioned. Among them, it is preferable to perform in an inert gas atmosphere or a reduced pressure atmosphere. As a result, ozone gas is generated in the vicinity of the surface 35, and the surface 35 is activated more smoothly. Furthermore, it is not necessary to take time and cost to control the atmosphere, and the irradiation of energy rays can be performed more easily.

Moreover, according to the method of irradiating energy rays, the magnitude of the energy dose to be applied can be easily adjusted with high accuracy. Therefore, by increasing the amount of molecular bonds that are cut in the vicinity of the surface 35 of the bonding film 3, more active hands are generated in the vicinity of the surface 35 of the bonding film 3. Can be further enhanced. On the other hand, by reducing the amount of molecular bonds cleaved in the vicinity of the surface 35, the number of active hands generated in the vicinity of the surface 35 of the bonding film 3 can be reduced, and the adhesiveness expressed in the bonding film 3 can be suppressed.
In order to adjust the magnitude of the bonding energy to be applied, for example, conditions such as the type of energy beam, the output of the energy beam, and the irradiation time of the energy beam may be adjusted.

[3] A counter substrate (another adherend) 5 is prepared. Then, as shown in FIG. 3E, the base material 1 with the bonding film 1 and the counter substrate 5 are bonded together so that the activated bonding film 3 and the counter substrate 5 are in close contact with each other. Thereby, the joined body 10 as shown in FIG.
In such a bonded body 10, the substrate 2 and the counter substrate 5 are firmly bonded with high dimensional accuracy via the bonding film 3. Further, in the previous step [2], the bonding film 3 can be efficiently expressed by irradiation with a relatively small amount of energy rays, so that the bonded body 10 can be obtained with energy saving.

  Moreover, in the joined body 10 obtained in this way, it is not an adhesive based mainly on a physical bond such as an anchor effect, but a covalent bond like an adhesive used in a conventional bonding method. The base material 1 with the bonding film and the counter substrate 5 are bonded to each other on the basis of a strong chemical bond generated in a short time. For this reason, the joined body 10 can be formed in a short time, is extremely difficult to peel off, and is difficult to cause unevenness of joining.

Moreover, according to the method of obtaining the joined body 10 obtained using such a base material 1 with a joining film, heat treatment at a high temperature (for example, 700 ° C. or more) is not required unlike conventional solid joining. Therefore, the substrate 2 and the counter substrate 5 made of a material having low heat resistance can also be used for bonding.
Further, since the substrate 2 and the counter substrate 5 are bonded via the bonding film 3, there is an advantage that there are no restrictions on the constituent materials of the substrate 2 and the counter substrate 5.

From the above, according to the present invention, the selection range of each constituent material of the substrate 2 and the counter substrate 5 can be expanded.
When the thermal expansion coefficient of the substrate 2 and the thermal expansion coefficient of the counter substrate 5 are different from each other, it is preferable to perform bonding at as low a temperature as possible. By performing the bonding at a low temperature, it is possible to further reduce the thermal stress generated at the bonding interface.

  Specifically, depending on the difference in thermal expansion coefficient between the substrate 2 and the counter substrate 5, the substrate 2 and the counter substrate 5 are opposed to the base material 1 with the bonding film in a state where the temperature of the substrate 2 and the counter substrate 5 is about 25 to 50 ° C. It is preferable to bond the substrate 5 together, and it is more preferable to bond the substrate 5 at a temperature of about 25 to 40 ° C. Within such a temperature range, even if the difference in thermal expansion coefficient between the substrate 2 and the counter substrate 5 is large to some extent, the thermal stress generated at the bonding interface can be sufficiently reduced. As a result, it is possible to reliably prevent warpage, peeling, and the like in the joined body 10.

In this case, when the difference in thermal expansion coefficient between the substrate 2 and the counter substrate 5 is 5 × 10 ⁻⁵ / K or more, the bonding is performed as low as possible as described above. It is particularly recommended.
The substrate 2 and the counter substrate 5 preferably have different rigidity. Thereby, the base material 1 with a bonding film and the counter substrate 5 can be bonded more firmly.

In the region to be joined to the substrate 1 with the bonding film of the counter substrate 5, the counter substrate 5, the bonding film 3, and the like are bonded in advance according to the constituent material of the counter substrate 5 before bonding. It is preferable to carry out a surface treatment that enhances the adhesion. Thereby, the joining strength of the base material 1 with a joining film | membrane and the opposing board | substrate 5 can be raised more.
As the surface treatment, the same treatment as the above-described surface treatment performed on the substrate 2 can be applied.

Further, depending on the constituent material of the counter substrate 5, the bonding strength between the substrate 1 with the bonding film 1 and the counter substrate 5 is sufficiently high without performing the surface treatment as described above. As the constituent material of the counter substrate 5 capable of obtaining such an effect, the same constituent materials as those of the substrate 2 described above, that is, various metal materials, various silicon materials, various glass materials and the like can be used. .
Furthermore, in the case where the region provided for bonding with the substrate 1 with the bonding film of the counter substrate 5 includes the following groups and substances, the substrate with the bonding film does not have to be subjected to the surface treatment as described above. 1 and the counter substrate 5 can be sufficiently increased in bonding strength.

  Examples of such groups and substances include functional groups such as hydroxyl groups, thiol groups, carboxyl groups, amino groups, nitro groups, and imidazole groups, radicals, ring-opened molecules, double bonds, and triple bonds. And at least one group or substance selected from the group consisting of a saturated bond, a halogen such as F, Cl, Br, and I, and a peroxide. The surface having such a group or substance can realize further improvement in the bonding strength of the substrate 1 with bonding film to the bonding film 3.

Moreover, the counter substrate 5 that can be particularly strongly bonded to the base material with the bonding film 1 is obtained by appropriately selecting and performing various surface treatments as described above so that a surface having such a material can be obtained. .
Further, instead of the surface treatment, an intermediate layer having a function of improving the adhesion with the bonding film 3 is formed in advance in a region used for bonding the counter substrate 5 with the base material 1 with the bonding film. Is preferred. Thereby, the base material 1 with the bonding film and the counter substrate 5 are bonded via the intermediate layer, and the bonded body 10 having higher bonding strength can be obtained.

As the constituent material of the intermediate layer, the same constituent material as that of the intermediate layer formed on the substrate 2 can be used.
Here, a mechanism for bonding the substrate 2 and the counter substrate 5 in this step will be described.
For example, a case where a hydroxyl group is exposed on the bonding surface 55 of the counter substrate 5 will be described as an example. In this step, the bonding film 3 formed on the substrate 2 and the bonding surface 55 of the counter substrate 5 are in contact with each other. When these are bonded together, the hydroxyl group present on the surface 35 of the bonding film 3 and the hydroxyl group present on the bonding surface 55 of the counter substrate 5 are attracted to each other by hydrogen bonding, and an attractive force is generated between the hydroxyl groups. . It is presumed that the substrate 2 and the counter substrate 5 are joined by this attractive force.

Further, the hydroxyl groups attracting each other by the hydrogen bond are cleaved from the surface with dehydration condensation depending on the temperature condition or the like. As a result, at the contact interface between the substrate 2 and the counter substrate 5, the bonds in which the hydroxyl groups are bonded are bonded. Thereby, it is guessed that the board | substrate 2 and the opposing board | substrate 5 are joined more firmly.
Further, when there are unterminated bonds, i.e., dangling bonds, on the surface and inside of the bonding film 3 of the substrate 2 and the bonding surface 55 and inside of the counter substrate 5, When the substrate 2 and the counter substrate 5 are bonded together, these unbonded hands are recombined. Since this recombination occurs in a complicated manner so as to overlap (entangle) with each other, a network-like bond is formed at the bonding interface. Thereby, the bonding film 3 and the counter substrate 5 are particularly strongly bonded.

  Note that the active state of the surface of the bonding film 3 activated in the step [2] relaxes with time. For this reason, it is preferable to perform this process [3] as soon as possible after completion of the process [2]. Specifically, after the completion of the step [2], the step [3] is preferably performed within 60 minutes, and more preferably within 5 minutes. Within this time, the surface of the bonding film 3 maintains a sufficiently active state, and therefore, when the substrate 2 and the counter substrate 5 are bonded together, sufficient bonding strength can be obtained between them. .

  In other words, since the bonding film 3 before activation is a bonding film obtained by drying a silicone material containing the energy ray absorbing substance 4, it is chemically relatively stable and has excellent weather resistance. Yes. In particular, it is possible to reliably prevent the silicone material constituting the bonding film 3 from being discolored or deteriorated by ultraviolet rays or the like. For this reason, the bonding film 3 before being activated is suitable for long-term storage. Therefore, a large amount of the substrate 2 provided with such a bonding film 3 is manufactured or purchased and stored, and the energy described in the step [2] is applied only to a necessary number immediately before bonding in this step. It is effective from the viewpoint of the manufacturing efficiency of the joined body 10 if the irradiation is performed.

As described above, the joined body (joined body of the present invention) 10 shown in FIG. 3F can be obtained.
The bonded body 10 thus obtained preferably has a bonding strength between the substrate 2 and the counter substrate 5 of 5 MPa (50 kgf / cm ² ) or higher, preferably 10 MPa (100 kgf / cm ² ) or higher. Is more preferable. The joined body 10 having such joining strength can sufficiently prevent the peeling. Moreover, according to the joining method of this structure, the joined body 10 with which the board | substrate 2 and the opposing board | substrate 5 were joined by the above big joining strengths can be produced efficiently.
In addition, after obtaining the bonded body 10, at least one of the following three steps ([4A], [4B], and [4C]) (bonded body) is performed on the bonded body 10 as necessary. The step of increasing the bonding strength of 10) may be performed. Thereby, the joint strength of the joined body 10 can be further improved.

[4A] As shown in FIG. 3G, the obtained bonded body 10 is pressed in a direction in which the substrate 2 and the counter substrate 5 approach each other.
Thereby, the surface of the bonding film 3 is closer to the surface of the substrate 2 and the surface of the counter substrate 5, respectively, and the bonding strength in the bonded body 10 can be further increased.
Further, by pressurizing the bonded body 10, the gap remaining at the bonded interface in the bonded body 10 can be crushed and the bonded area can be further expanded. Thereby, the joint strength in the joined body 10 can be further increased.

At this time, the pressure at the time of pressurizing the bonded body 10 is a pressure that does not damage the bonded body 10 and is preferably as high as possible. Thereby, the joint strength in the joined body 10 can be increased in proportion to the pressure.
In addition, what is necessary is just to adjust this pressure suitably according to conditions, such as each constituent material of each of the board | substrate 2 and the opposing board | substrate 5, each thickness, and a joining apparatus. Specifically, although it is slightly different depending on the constituent materials and thicknesses of the substrate 2 and the counter substrate 5, it is preferably about 0.2 to 10 MPa, more preferably about 1 to 5 MPa. Thereby, the joining strength of the joined body 10 can be reliably increased. The pressure may exceed the upper limit, but depending on the constituent materials of the substrate 2 and the counter substrate 5, the substrate 2 and the counter substrate 5 may be damaged.
The time for pressurization is not particularly limited, but is preferably about 10 seconds to 30 minutes. In addition, what is necessary is just to change suitably the time to pressurize according to the pressure at the time of pressurizing. Specifically, the higher the pressure at which the bonded body 10 is pressed, the more the bonding strength can be improved even if the pressing time is shortened.

[4B] As shown in FIG. 3G, the obtained bonded body 10 is heated.
Thereby, the joint strength in the joined body 10 can be further increased.
At this time, the temperature at the time of heating the bonded body 10 is not particularly limited as long as it is higher than room temperature and lower than the heat resistance temperature of the bonded body 10, but is preferably about 25 to 100 ° C., more preferably 50 to 100 ° C. About ℃. By heating at a temperature in such a range, it is possible to reliably increase the bonding strength while reliably preventing the bonded body 10 from being altered or deteriorated by heat.

The heating time is not particularly limited, but is preferably about 1 to 30 minutes.
Moreover, when performing both said process [4A] and [4B], it is preferable to perform these simultaneously. That is, as shown in FIG. 3G, it is preferable to heat the bonded body 10 while applying pressure. Thereby, the effect by pressurization and the effect by heating are exhibited synergistically, and the joint strength of the joined body 10 can be particularly increased.

[4C] The obtained bonded body 10 is irradiated with ultraviolet rays.
Thereby, the chemical bond formed between the bonding film 3 and the substrate 2 and the counter substrate 5 can be increased, and the bonding strength between the substrate 2 and the counter substrate 5 and the bonding film 3 can be increased. As a result, the bonding strength of the bonded body 10 can be particularly increased.
The conditions of the ultraviolet rays irradiated at this time may be equivalent to the conditions of the ultraviolet rays shown in the step [2].

Moreover, when performing this process [4C], it is required for either one of the board | substrate 2 and the opposing board | substrate 5 to have translucency. The bonding film 3 can be reliably irradiated with ultraviolet rays by irradiating the ultraviolet rays from the light transmitting substrate side.
By performing the steps as described above, it is possible to easily further improve the bonding strength in the bonded body 10.
In the above description, the bonding film 3 is provided on the substrate 2. However, the bonding film 3 may be provided on both the substrate 2 and the counter substrate 5. In this case, the surface treatment and the formation of the intermediate layer may be performed on both the substrate 2 and the counter substrate 5, or may be selectively performed on either one.

Second Embodiment
Next, the second embodiment of the base material with the bonding film of the present invention, the bonding method for bonding the base material with the bonding film and the counter substrate, and the joined body including the base material with the bonding film of the present invention will be described. .
FIG. 4 is a view (longitudinal sectional view) for explaining a second embodiment of the substrate with a bonding film of the present invention, and FIGS. 5 and 6 are bonded using the substrate with the bonding film of the present embodiment. It is a figure (longitudinal section) for explaining a 2nd embodiment of a joining method which joins a substrate with a film and a counter substrate. In the following description, the upper side in FIGS. 4 to 6 is referred to as “upper” and the lower side is referred to as “lower”.

Hereinafter, although the base material with a bonding film and the bonding method according to the second embodiment will be described, differences from the first embodiment will be mainly described, and description of similar matters will be omitted.
The substrate with a bonding film according to this embodiment is the same as that of the first embodiment except that the bonding film included in the substrate with a bonding film partially contains an energy ray absorbing substance.
In this embodiment, the base material 1a with the bonding film is provided on the substrate 2 and the outer peripheral portion 251 on the substrate 2, and includes a bonding film 32 containing a silicone material and an energy ray absorbing substance 4 that absorbs energy rays. And a bonding film 33 provided in a region 252 surrounded by the bonding film 32 on the substrate 2 and containing a silicone material.

  The bonding film 32 and the bonding film 33 included in such a substrate with a bonding film 1a have different adhesiveness expressed by energy beam irradiation. More specifically, if the bonding film 32 and the bonding film 33 are evenly irradiated with energy rays, the bonding film 32 containing the energy ray absorbing material 4 is deposited other than the bonding film 33. Adhesiveness with the body develops more quickly, and bonding strength with other adherends becomes higher. Thereby, the base material 1a with the bonding film has a higher bonding strength in the vicinity of the outer peripheral portion (region where the bonding film 32 is provided) than in the vicinity of the central portion (region where the bonding film 33 is provided). It becomes possible to join to the adherend. Such a base material 1a with a bonding film can easily adjust the bonding strength with other adherends by controlling the areas of the bonding film 32 and the bonding film 33 formed on the substrate 2. It will be a thing.

  Further, the material as described above as the energy ray absorbing substance 4 contained in the bonding film 32 has a function of scattering or absorbing visible light. Therefore, the bonding film 32 can be bonded to the counter substrate 5 with higher bonding strength than the bonding film 33, but on the other hand, the light transmittance is inferior. The base material 1a with the bonding film of the present embodiment is such that such a bonding film 32 is provided only in the vicinity of the outer peripheral portion, and in the vicinity of the central portion surrounded by the bonding film 32, the energy ray absorbing material 4 is provided. And a bonding film 33 having sufficient light transmittance is provided. Such a base material 1a with a bonding film can be suitably used for bonding members for optical devices such that the area where the bonding film 33 is provided is an effective area (light transmission area). .

Next, the joining method of the base material with a joining film according to the present embodiment and another adherend will be described.
The bonding method according to this embodiment is the same as that of the first embodiment except that the configuration of the substrate with a bonding film used for bonding is different.
That is, the bonding method according to the present embodiment includes a step of preparing the base material 1a with the bonding film, and irradiating the bonding film 32 and the bonding film 33 of the base material 1a with the bonding film with an energy beam. 32 and the process of expressing adhesiveness in the vicinity of the surface of the bonding film 33, and the counter substrate (other adherend) 5 are prepared, and the bonding film 32, the bonding film 33, and the counter substrate 5 included in the substrate 1a with the bonding film are prepared. And bonding them so that they are in close contact with each other, and obtaining a bonded body 10a.

Hereinafter, each process of the joining method concerning this embodiment is demonstrated one by one.
[1] First, a base material 1a with a bonding film is prepared.
As described above, the base material 1a with the bonding film includes the substrate 2, the bonding film 32, and the bonding film 33.
Such a base material 1a with a bonding film can be obtained using, for example, the following method for forming a base material with a bonding film.
That is, the step of preparing the substrate 2, the liquid material containing the silicone material on the substrate 2, and the liquid material containing the energy ray absorbing substance 4 that absorbs the energy rays in addition to the silicone material are in different regions. After supplying and forming a liquid film, the base material 1a with a bonding film is formed by obtaining the step of drying the liquid film and forming a bonding film.

Hereinafter, each of these steps will be described in detail.
[1A] First, the substrate 2 is prepared (see FIG. 5A).
[1B] Next, a liquid material (droplet 311) containing a silicone material and an energy ray absorbing substance 4 that absorbs energy rays is supplied onto the outer peripheral portion 251 of the substrate 2 to form a liquid coating 301. (See FIG. 5 (b)).
As such a supply method, the supply method as described above can be used, but it is particularly preferable to use a droplet discharge method (see FIG. 5B). Thereby, the liquid coating 301 can be reliably patterned in the region of the outer peripheral portion 251 of the substrate 2.

[1C] Next, the liquid film 301 provided on the substrate 2 is dried to form the bonding film 32 on the outer peripheral portion 251 of the substrate 2 (see FIG. 5C).
As such a drying method, for example, the drying method described in the first embodiment can be used.
[1D] Next, a liquid material (droplet 312) containing a silicone material is supplied to a region 252 surrounded by the bonding film 32 on the substrate 2 to form a liquid film 302 (see FIG. 5D). ).
In the present embodiment, such a liquid coating 302 does not contain the energy ray absorbing material 4. Examples of the material constituting the liquid film 302 include a material obtained by removing the energy ray absorbing substance 4 from the material constituting the liquid film 301 described above.
Moreover, as a supply method of a liquid material, the supply method as mentioned above can be used.

[1E] Next, by drying the liquid film 302 provided on the substrate 2, a bonding film 33 is formed in a region surrounded by the bonding film 32 on the substrate 2 (see FIG. 5E). .
In this embodiment, after forming the bonding film 32 containing the silicone material and the energy ray absorbing substance 4 on the outer peripheral portion 251 of the substrate 2 through the steps [1B] and [1C], [1D] Through each step [1E], a bonding film 33 containing a silicone material is formed in a region 252 surrounded by the bonding film 32 on the substrate 2. In this way, the liquid material containing the silicone material on the substrate 2 and the liquid material containing the energy ray absorbing substance 4 in addition to the silicone material are supplied to different regions, respectively, and the liquid coating (the liquid coating 301 and the liquid coating 301) is supplied. By forming the liquid coating 302) and drying them, the bonding films (the bonding film 32 and the bonding film 33) are formed.

The base material 1a with a bonding film can be obtained as described above.
In the above description, after the bonding film 32 is formed through the steps [1B] and [1C], the bonding film 33 is formed through the steps [1D] and [1E]. The attached substrate 1a was obtained, but after forming the bonding film 33 through the steps [1D] and [1E], the bonding film 32 may be formed through the steps [1B] and [1C]. .

[2] Next, as shown in FIG. 6F, the bonding film 32 and the bonding film 33 are irradiated with energy rays. Thereby, the base material 1a with a bonding film exhibits adhesiveness to the counter substrate 5 in the bonding film 32 and the bonding film 33.
[3] Next, as shown in FIG. 6G, a counter substrate (another adherend) 5 is prepared, and the surface 325 of the bonding film 32 and the surface 335 of the bonding film 33 and the bonding surface of the counter substrate 5 are prepared. The base material 1 a with the bonding film and the counter substrate 5 are bonded together so that the substrate 55 is in close contact therewith. Thereby, the joined body 10a shown in FIG.

  The bonded body 10a thus obtained is bonded to the substrate 2 and the counter substrate 5 in the vicinity of the outer peripheral portion (the region where the substrate is bonded via the bonding film 32) and the vicinity of the central portion (bonded via the bonding film 33). The region is more firmly bonded than the region that is being connected). In such a bonded body 10 a, the bonding strength of the bonded body 10 a can be easily adjusted by controlling the formation region of the bonding film 32 and the bonding film 33 formed on the substrate 2.

In addition, since the bonding film 33 has sufficient light transmission properties, the bonded body 10a is also preferably used when light transmission is required as the bonded body 10a. For example, the bonded body 10a can be suitably used for bonding members for an optical device in which an area where the bonding film 33 is provided is an effective area (light transmission area).
The bonded body 10a can be obtained as described above.

Moreover, after obtaining the joined body 10a, at least one of the steps [4A], [4B] and [4C] of the first embodiment is performed on the joined body 10a as necessary. It may be.
In the above, the bonding film 32 having the energy ray absorbing material 4 is provided on the outer peripheral portion of the substrate 2, and the bonding film 33 having the bonding film 33 is provided in the region surrounded by the bonding film 32 on the substrate 2. Although the base material 1a has been described, for example, the bonding film 32 and the bonding film 33 may be interchanged, and the bonding film 32 and the bonding film 33 are each provided in an arbitrary pattern. Also good.

The joining method according to each of the embodiments as described above can be used to join various members.
Examples of members used for such bonding include semiconductor elements such as transistors, diodes, and memories, piezoelectric elements such as crystal oscillators, optical elements such as reflectors, optical lenses, diffraction gratings, and optical filters. , Photoelectric conversion elements such as solar cells, semiconductor substrates and semiconductor elements mounted thereon, insulating substrates and wiring or electrodes, inkjet recording heads, microreactors, microelectromechanical system (MEMS) components such as micromirrors, pressure Sensor parts such as sensors, acceleration sensors, package parts for semiconductor elements and electronic parts, magnetic recording media, magneto-optical recording media, recording media such as optical recording media, liquid crystal display elements, organic EL elements, electrophoretic display elements Such display element parts, fuel cell parts, and the like.

Hereinafter, a liquid crystal display device in which a polarizing plate and a liquid crystal display element are bonded, to which the bonded body of the above-described second embodiment is applied, will be described as a representative.
7 is a perspective view of a polarizing plate with a bonding film to which the second embodiment of the substrate with a bonding film of the present invention is applied, and FIG. 8 is a liquid crystal display device obtained using the polarizing plate with a bonding film shown in FIG. FIG. In the following description, the upper side of FIGS. 7 and 8 is referred to as “upper” and the lower side is referred to as “lower”.

As shown in FIG. 7, the liquid crystal display device 60 includes a liquid crystal display element 70 and two polarizing plates 68 and 69 with bonding films. Such a liquid crystal display device 60 has a configuration in which each polarizing plate with a bonding film (71, 72) is bonded to the liquid crystal display element 70 as an adherend via the bonding film 32 and the bonding film 33. ing.
Among them, the liquid crystal display element 70 includes a substrate 611, a plurality of partitions (banks) 613 formed on the substrate 611, and a coloring portion 612 formed on the substrate 611 and provided between the plurality of partitions 613. A color filter 61, a substrate (counter substrate) 67 disposed on the side of the color filter 61 where the coloring portion 612 is provided, and a liquid crystal layer made of liquid crystal sealed in a gap between the color filter 61 and the substrate 67 63. A common electrode 62 is provided on the surface of the color filter 61 where the coloring portion 612 and the partition 613 are provided (the surface opposite to the surface of the coloring portion 612 and the partition 613 facing the substrate 611). Pixel electrodes 66 are arranged in a matrix on the surface of the (opposite substrate) 67 facing the liquid crystal layer 63 and the color filter 61 at positions corresponding to the colored portions 612 of the color filter 61. Further, an alignment film 65 is provided between the common electrode 62 and the liquid crystal layer 63, and an alignment film 64 is provided between the substrate 67 (pixel electrode 66) and the liquid crystal layer 63.

On the other hand, the two polarizing plates 68 and 69 are obtained by applying the above-described second embodiment of the base material with a bonding film of the present invention. And these polarizing plates 71 and 72 with a joining film are joined to the board | substrates 611 and 67 which respectively comprise the liquid crystal display element 70 through the joining film 32 and the joining film 33, respectively.
As shown in FIG. 6, the polarizing plate 71 with a bonding film is provided on the outer periphery of the polarizing plate 68, the bonding film 32 containing the silicone material and the energy ray absorbing substance 4, It is provided in a region surrounded by the bonding film 32 on the plate 68 and has a bonding film 33 containing a silicone material. Similarly, the polarizing plate 72 with the bonding film is provided on the outer periphery of the polarizing plate 69, the bonding film 32 containing the silicone material and the energy ray absorbing material 4, and the polarizing plate 69. It is provided in a region surrounded by the upper bonding film 32 and has a bonding film 33 containing a silicone material.

  The bonding film 32 and the bonding film 33 are less likely to cause thickness unevenness than an adhesive that is generally used to bond a polarizing plate and a color filter substrate or the like. Therefore, the polarizing plate 71 with the bonding film (or the polarizing plate 72 with the bonding film) can be bonded to the substrate 611 (or the substrate 67) with high dimensional accuracy, and the dimensional accuracy of the liquid crystal display device 60 is It will be excellent.

  Further, the bonding film 33 included in the polarizing film 71 with the bonding film (or the polarizing film 72 with the bonding film) has an image display region (light emitted from a backlight described later) when the liquid crystal display device 60 is viewed in plan. A transparent region). In other words, in the liquid crystal display device 60, the bonding film 32 containing the energy ray absorbing material 4 included in the polarizing plate 71 with the bonding film (or the polarizing plate 72 with the bonding film) is provided in a region outside the image display region. ing. In such a liquid crystal display device 60, the polarizing plate 68 (or the polarizing plate 69) and the substrate 611 (or the substrate 67) are bonded via the bonding film 33 having excellent light transmittance. The brightness of the camera is prevented from decreasing. In addition, outside the image display area of the liquid crystal display device 60, the liquid crystal display element 70 and each polarizing plate (polarizing plate 68, polarizing plate) are provided via the bonding film 32 that is superior in bonding strength to other adherends than the bonding film 33. 69) is bonded to the liquid crystal display element 70, the two polarizing plates 68, and the polarizing plate 69 can be reliably prevented.

The substrate 611 and the substrate 67 are substrates having optical transparency with respect to visible light, and are, for example, glass substrates.
The partition wall 613 constituting the color filter 61 is provided in order to prevent the adjacent colored portions 612 from being mixed with each other or to prevent light leakage from between adjacent pixels. It is comprised with the material which has property. Further, the coloring portion 612 is made of a material mainly including pigments corresponding to the respective colors (for example, red, green, and blue).

The common electrode 62 and the pixel electrode 66 are made of a material having optical transparency to visible light, and are made of, for example, ITO.
Although omitted in the drawing, a plurality of switching elements (for example, TFT: thin film transistor) are provided so as to correspond to the respective pixel electrodes 66. For each pixel electrode 66 corresponding to each coloring portion 612, by controlling the voltage application state between the common electrode 62, in the region corresponding to each coloring portion 612 (each pixel electrode 66), Light transmittance can be controlled.

In the liquid crystal display device 60, light emitted from a backlight (not shown) is incident from the polarizing film-attached polarizing plate 72 side (upper side in FIG. 8). And the light which permeate | transmitted the liquid crystal layer 63 and entered into each coloring part 612 of the color filter 61 is radiate | emitted from the polarizing plate 71 with a bonding film (lower side in FIG. 8) as light of the color corresponding to each coloring part 612. To do. As described above, in the liquid crystal display device 60, in the image display region, the liquid crystal display element 70 and each polarizing plate (polarizing plate 68, polarizing plate 69) are bonded via the bonding film 33 having excellent light transmittance. Yes. Therefore, the backlight light incident from the side of the polarizing plate 72 with the bonding film can be emitted from the polarizing plate 71 with the bonding film with a sufficiently high transmittance, and the display image of the liquid crystal display device 60 is sufficiently bright. Become. In addition, outside the image display area of the liquid crystal display device 60, the liquid crystal display element 70 and each polarizing plate (polarizing plate 68, polarizing plate) are provided via the bonding film 32 that is superior in bonding strength to other adherends than the bonding film 33. 69) is bonded, and the liquid crystal display element 70 and each polarizing plate (polarizing plate 68, polarizing plate 69) are bonded with sufficiently high bonding strength, and the durability of the liquid crystal display device 60 is excellent. Become.
The liquid crystal display device 60 as described above can be applied to an electronic device as described below, for example.

In the following description, a mobile phone will be described as an electronic device including the liquid crystal display device 60.
FIG. 9 is a perspective view showing an embodiment of a mobile phone.
A cellular phone shown in FIG. 9 has a cellular phone main body 1000 including a display unit 1001. The mobile phone main body 1000 incorporates the liquid crystal display device 60 described above, and these are used as the display unit 1001 and the like in the mobile phone main body 1000.

Such a liquid crystal display device 60 can be applied to various electronic devices in addition to the mobile phone described in FIG.
For example, TV, video camera, viewfinder type, monitor direct view type video tape recorder, laptop personal computer, car navigation device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device , Word processors, workstations, videophones, security TV monitors, electronic binoculars, POS terminals, devices equipped with touch panels (for example, cash dispensers and ticket vending machines at financial institutions), medical devices (for example, electronic thermometers, blood pressure monitors, blood glucose meters) , ECG display device, ultrasonic diagnostic device, endoscope display device), fish detector, various measuring instruments, instruments (for example, vehicles, aircraft, ship instruments), flight simulators, and other various monitors, The present invention can be applied to a projection display device such as a projector.

As mentioned above, although the base material with a joining film | membrane and joined body of this invention were demonstrated based on embodiment of illustration, this invention is not limited to these.
For example, the joined body of the present invention may be any one or a combination of two or more of the above embodiments.
In each of the above embodiments, a method of bonding two substrates of a substrate and a counter substrate is described, but when bonding three or more substrates, the substrate with a bonding film of the present invention and You may make it use the joining method of this invention.

It is a longitudinal cross-sectional view which shows 1st Embodiment of the base material with a bonding film of this invention. It is a figure (longitudinal sectional view) for demonstrating 1st Embodiment of the joining method which joins the base material with a joining film, and a counter substrate using the base material with a joining film shown in FIG. It is a figure (longitudinal sectional view) for demonstrating 1st Embodiment of the joining method which joins the base material with a joining film, and a counter substrate using the base material with a joining film shown in FIG. It is a longitudinal cross-sectional view which shows 2nd Embodiment of the base material with a bonding film of this invention. It is a figure (longitudinal sectional view) for demonstrating 2nd Embodiment of the joining method which joins the base material with a joining film, and a counter substrate using the base material with a joining film shown in FIG. It is a figure (longitudinal sectional view) for demonstrating 2nd Embodiment of the joining method which joins the base material with a joining film, and a counter substrate using the base material with a joining film shown in FIG. . It is a perspective view of the polarizing plate with a joining film which applied 2nd Embodiment of the base material with a joining film of this invention. It is sectional drawing of the liquid crystal display device obtained using the polarizing plate with a joining film shown in FIG. It is a perspective view which shows embodiment of a mobile telephone.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Base material with a bonding film 10, 10a ... Bonded body 2 ... Substrate 25 ... Surface 251 ... Outer peripheral part 252 ... Area 3, 32, 33 ... Bonding film 35, 325, 335 ... Surface 30, 301, 302 ... Liquid film 31, 311, 312, droplet 4, energy ray absorbing substance 5, counter substrate 55, bonding surface 60, liquid crystal display device 61, color filter 611, substrate 612, colored portion 613, partition wall 62, common electrode 63, liquid crystal layer 64 , 65 ... Alignment film 66 ... Pixel electrode 67 ... Substrate (counter substrate) 68, 69 ... Polarizing plate 70 ... Liquid crystal display element 71, 72 ... Polarizing plate with bonding film 1000 ... Mobile phone body 1001 ... Display unit

Claims (14)

A substrate;
A bonding film that is provided on the substrate, contains a silicone material, and exhibits adhesiveness to other adherends by irradiation with energy rays;
The bonding film further has an adhesive property with the other adherend due to heat generation due to absorption of the energy rays in the energy ray absorbing material by adding an energy ray absorbing material that absorbs the energy rays. A substrate with a bonding film, which is promoted.   The bonding film is formed by supplying a liquid material containing the silicone material and the energy ray absorbing substance onto the base material to form a liquid film, and drying the liquid film. The substrate with a bonding film according to claim 1.   The base material with a bonding film according to claim 1 or 2, wherein the silicone material has a main skeleton made of polydimethylsiloxane.   The base material with a bonding film according to claim 1, wherein the silicone material has a silanol group.   The bonding according to any one of claims 1 to 4, wherein the energy ray absorbing substance includes at least one material selected from titanium oxide, cerium oxide, indium tin oxide (ITO), and carbon black as a constituent component. Substrate with film.   The base material with a bonding film according to claim 1, wherein the energy ray absorbing substance is in a particulate form.   The base material with a bonding film according to claim 6, wherein an average particle diameter of the energy ray absorbing substance is 100 to 1000 nm.   8. The relationship of 1.5 ≦ T / L ≦ 10 is satisfied, where T is the average thickness of the bonding film and L is the average particle diameter of the energy ray absorbing material. The base material with a bonding film as described in 1.   The substrate with a bonding film according to any one of claims 1 to 8, wherein a content ratio of the energy ray absorbing substance in the bonding film is 1 to 30 wt%.   The substrate with a bonding film according to claim 1, wherein the energy ray is ultraviolet light. A substrate;
A bonding film that is provided on the substrate, contains a silicone material, and exhibits adhesiveness to other adherends by irradiation with energy rays;
In the bonding film, when an energy ray absorbing material that absorbs the energy rays is partially added, heat generated by absorption of the energy rays in the energy ray absorbing material is caused in the portion including the energy ray absorbing material. Adhesion with the other adherend is promoted,
The bonding film of the bonding film containing the energy ray absorbing substance and the portion of the bonding film not containing the energy ray absorbing substance have different bonding strengths to the adherend. With base material. Preparing a substrate and an adherend;
A liquid film is formed on the substrate by supplying a liquid material containing a silicone material and an energy ray absorbing substance that absorbs energy rays, and then the liquid film is dried to form a bonding film. Process,
By irradiating the bonding film with the energy beam, the bonding film exhibits adhesiveness, and the heat generated by the absorption of the energy beam in the energy beam absorbing material promotes the bonding film adhesion, And a step of obtaining a joined body in which the base material and the adherend are joined via a joining film. Preparing a substrate and an adherend;
A liquid film is formed on the substrate by supplying a liquid material containing a silicone material and a liquid material containing an energy ray absorbing substance that absorbs energy rays in addition to the silicone material to different regions. And then drying the liquid film to form a bonding film;
By irradiating the bonding film with the energy beam, the bonding film is made to exhibit adhesiveness, and heat generated by absorption of the energy beam in the energy beam absorbing material causes the covering in the portion including the energy beam absorbing material. And a step of obtaining a bonded body in which the base material and the adherend are bonded through the bonding film by promoting adhesion with the bonded body. A substrate with a bonding film according to any one of claims 1 to 11, and an adherend,
A joined body obtained by joining them through the joining film.

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