JP2009295370A - Substrate cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of cutting a substrate having a plurality of panel formation regions to efficiently manufacture a plurality of display devices with multiple panels. <P>SOLUTION: The substrate cutting method comprises a step of providing a display part 231 in each of the plurality of panel formation regions 615 of a large base substrate 620 and providing an extraction part 130 while extending an electrode, a step of providing a protecting member 310 on an opposite face 131 of a large sealing substrate 610, a step of pasting the large base substrate 620 and the large sealing substrate 610 to each other via a sealing material 110, a first cutting step of cutting the large base substrate 620 and the large sealing substrate 610 at their predetermined positions to obtain individual display panels, and a second cutting step of cutting the end material part of the large sealing substrate 610. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate cutting method, and more specifically to a substrate cutting method for manufacturing a plurality of display devices by cutting two substrates having a plurality of bonded panel forming regions.

  In a method for manufacturing an organic electroluminescence display device having an organic electroluminescence element as a light emitting element in each display pixel of a display unit having a plurality of display pixels, as shown in Patent Document 1, one organic electroluminescence display is provided. By using two substrates having a plurality of panel formation regions that are sufficiently larger than the panel size of the device, these substrates are bonded together, and then cut into each panel formation region, so that a plurality of organic electroluminescence There is a manufacturing method called multi-chamfering for manufacturing a display device.

  In this multi-cavity manufacturing method, first, a light-emitting element formed by sandwiching an organic electroluminescent layer between electrodes facing each other in a plurality of panel formation regions of a large base substrate partitioned into a plurality of panel formation regions And a lead portion is formed by extending one electrode of the display portion.

  Then, the large base substrate and the large sealing substrate are bonded together through the sealing material so that the display portion is sealed with the sealing material and the lead-out portion is exposed to the outside of the sealing material.

  And a large sized base substrate and a large sized sealing substrate are cut | disconnected for every panel formation area, and a some organic electroluminescent display panel is obtained. Furthermore, in order to form a space for connecting a terminal to the drawer portion of each panel formation region of the large base substrate, an end material portion which is a portion facing each of the panel formation regions of the large sealing substrate is provided. Disconnect.

  At this time, by cutting the end material portion of the large-sized sealing substrate, the end material portion may come into contact with the drawer portion provided on the large-sized base substrate, so that the drawer portion may be damaged.

JP 2003-181825 A

  The present invention has been made in view of such a problem, and in a substrate cutting method for obtaining individual display panels by bonding two substrates having a plurality of panel formation regions and cutting a predetermined portion. In addition, by preventing damage to the lead part provided with the electrode connected to the display part in each panel formation region of one substrate on which the display part is formed, the yield reduction is suppressed and the production efficiency of the display panel is improved. The purpose is to make it. Another object of the present invention is to provide a method for efficiently manufacturing individual substrates in a substrate cutting method for obtaining individual display panels by bonding two large substrates and cutting predetermined portions. It is what.

  In order to achieve the above object, a substrate cutting method according to the present invention includes a first substrate partitioned into a plurality of panel formation regions each having a display portion and a lead portion provided with an electrode connected to the display portion. Each panel forming region of the second substrate partitioned into a plurality of panel forming regions corresponding to the plurality of panel forming regions of the first substrate is opposed to each panel forming region, and each panel of the first substrate The first substrate and the second substrate are bonded together with a protective member interposed between the drawer portion in the formation region and the opposing surface of each panel formation region of the second substrate facing the drawer portion. And a cutting step of cutting an end material portion that forms the facing surface of each panel forming region of the second substrate.

  The protective member absorbs an impact applied to the first substrate by the end member contacting the first substrate through the protective member when the end member of the second substrate is cut. It is also possible to be a cushioning material.

  The protective member may be formed by being attached to the facing surface of each panel forming region of the second substrate.

  The protective member may be formed by dispersing a plurality of spherical fine particles on the facing surface.

  The plurality of spherical fine particles may be a resin having a modulus of elasticity of 10% K and 1 GPa to 10 GPa.

  Further, the protective member is provided with a mask in a portion other than the facing surface of each panel forming region of the second substrate so that the plurality of spherical fine particles do not adhere to a portion other than the facing surface, It is also possible to disperse a plurality of spherical fine particles on the opposite surface side of the second substrate.

  Moreover, the said protection member can also be formed by affixing a sheet-like resin material on the said opposing surface.

  Further, the step of bonding the first substrate and the second substrate opposes the display portion in each panel formation region of the first substrate and the display portion in each panel formation region of the second substrate. It is also possible to include a step of sealing and bonding the region with a sealing material and exposing the lead portion to the outside of the sealing material.

  It is also possible to include a step of cutting the bonded first substrate and second substrate at the panel forming regions to obtain a plurality of individual display panels.

  Moreover, the said opposing surface can also be an area | region from the outer side of the said sealing material to the edge part of each said panel formation area after cut | disconnecting the said 2nd board | substrate to each said panel formation area.

  The display unit formed on the first substrate may include a light emitting element having an organic electroluminescence layer.

  According to the substrate cutting method of the present invention, in the substrate cutting method for obtaining individual display panels by bonding two substrates having a plurality of panel formation regions and cutting a predetermined portion, a display unit is formed. By preventing damage to the lead portion provided with the electrode connected to the display portion in each panel forming region of one substrate, it is possible to efficiently manufacture individual substrates while suppressing a decrease in yield. .

(Embodiment 1)
[Organic EL display device]
An organic electroluminescence (hereinafter referred to as EL) display device 800 manufactured by the substrate cutting method according to this embodiment will be described. As shown in FIG. 1A, the organic EL display device 800 includes a base substrate 160, a sealing substrate 140, and a display unit 231.

  The display unit 231 is configured by laminating a lower electrode (anode) 210, an organic EL light emitting layer 220, and an upper electrode (cathode) 230 facing the lower electrode 210 in this order.

  As will be described later, the base substrate 160 is obtained by dividing a large base substrate (first substrate) 620 into respective panel formation regions 615 as shown in FIG. Further, the sealing substrate 140 is obtained by dividing a large-sized sealing substrate (second substrate) 610 into respective panel formation regions 615 as shown in FIG.

  An end of the lower electrode 210 on the right side of the drawing is extended to the right side to form a lead portion 130. A terminal or the like can be connected to the drawer portion 130.

The lower electrode 210 is made of a transparent conductive material such as doped indium oxide (ITO), zinc-doped indium oxide, or indium oxide (In ₂ O ₃ ). In order to facilitate the electron injection, the upper electrode 230 can use, for example, a metal such as AlLi, FLi, MgIn, Li, Na, Mg, Ca alone or in an alloy. The base substrate 160 is a glass substrate.

  As shown in FIG. 1B, which is an XX cross section of FIG. 1A, the display portion 231 is sealed by being surrounded by a sealing material 110, whereby the display portion 231 is externally provided. Protected from water vapor.

  A recess 171 is provided on the lower inner surface of the sealing substrate 140, and for example, a dry sheet 170 is attached to the recess 171. The dry sheet 170 keeps the internal space surrounded by the sealing material 110 in a dry state.

[Cutting method of substrate for manufacturing organic EL display device]
Next, a method for manufacturing the above-described organic EL display device 800 by bonding two substrates and then cutting the substrate will be described.

  First, a large base substrate (first substrate) 620 formed of a glass substrate is prepared. The large base substrate 620 is partitioned into a plurality of panel forming regions 615 as shown in FIG.

  A lower electrode 210 is formed on the large base substrate 620 by photolithography. The thickness of the lower electrode 210 is, for example, 30 nm to 100 nm. Note that the lower electrode 210 can also be formed by performing a wet etching process or a dry etching process.

  Then, a coating liquid for forming an organic EL light emitting layer is applied on the lower electrode 210. Application is continuously performed from a nozzle coater. The application is desirably performed in a nitrogen gas atmosphere. The organic EL light emitting material may change its characteristics when it comes into contact with oxygen, water vapor or the like. Therefore, it becomes possible to make the characteristic change of the organic EL light emitting material difficult to occur by applying in a nitrogen gas atmosphere.

  After the coating liquid for forming the organic EL light emitting layer is applied, it is dried with a hot plate in a nitrogen atmosphere or dried with a sheathed heater in a vacuum to remove the residual liquid, thereby emitting organic EL light. Layer 220 is formed.

  Next, as illustrated in FIG. 2B, the upper electrode 230 having a thickness of, for example, 100 nm is formed on the organic EL light emitting layer 220. The upper electrode 230 can be formed using, for example, a resistance heating vapor deposition method, an electron beam vapor deposition method, a sputtering method, an ion plating method, or the like. As a result, as shown in FIG. 2C, a display portion 231 including a plurality of display pixels each having a light emitting element made of an organic EL element is formed in each panel formation region 615 of the large base substrate 620. Note that the individual panel formation regions 615 are separated by solid lines for easy-to-understand display.

Next, as shown in FIG. 3A, for example, a large sealing substrate (second substrate) 610 formed of a glass substrate is prepared. The large sealing substrate 610 has the same size as the large base substrate 620, for example. The large sealing substrate 610 is also divided into a plurality of panel formation regions 615 as in the case of the large base substrate 620 (here, each panel formation region of the large base substrate 62 and each panel formation of the large sealing substrate 610). Since the area corresponds to 1: 1, for convenience, the panel formation areas of both substrates are denoted by the same reference numerals).
And as shown in FIG.3 (b), while having the opening part 132 which is an area | region corresponding to the opposing surface 131 in each panel formation area | region 615 on the large sized sealing substrate 610, the other part is shielded. For example, a mask 330 made of a metal material is disposed. As shown in FIG. 6, the facing surface 131 is a surface that faces the drawing portion 130 when the large base substrate 620 and the large sealing substrate 610 are bonded together via the sealing material 110.

  And as shown in FIG. 4, the protection member 310 is spread | dispersed from the spreading | diffusion apparatus 320 to the opposing surface 131 side. Since the mask 330 covers a portion other than the facing surface 131, the protective member 310 is not sprayed on the portion other than the facing surface 131. Thereafter, the protective member 310 is spread only on the facing surface 131 by removing the mask 330. In addition, the part corresponding to each panel formation area 615 of the large sized sealing substrate 610 becomes the sealing substrate 140 of the organic EL display device 800.

  Next, the large-sized sealing substrate 610 provided with the protective member 310 on the facing surface 131 is subjected to heat treatment at 100 to 120 ° C. for several minutes in a nitrogen atmosphere with a moisture content of less than 1 ppm. By this heat treatment, moisture adsorbed on the large sealing substrate 610 and the protective member 310 is removed. As a result, the protection member 310 is attached to the large-sized sealing substrate 610. After that, as shown in FIG. 5, the dry sheet 170 is attached to the recess 171 provided in each panel formation region 615 of the large-sized sealing substrate 610.

  Next, as shown in FIG. 6, the large-sized sealing substrate 610 and the large-sized base substrate 620 are bonded together with the sealing material 110 interposed therebetween. The large sealing substrate 610 and the large base substrate 620 are bonded to each other so that the lead-out portion 130 is exposed to the outside of the sealing material 110. In FIG. 6, the individual panel formation regions 615 are separated by solid lines for easy understanding.

  Next, as shown in FIG. 7, the large sealing substrate 610 and the large base substrate 620 are cut along a longitudinal line 351 and a lateral line 352. In this way, as shown in FIG. 8, the panel is divided into a plurality of individual panel formation regions 615.

Then, as shown in FIG. 9, the scribe groove 331 is formed by the cutting tool 360.
As the cutting tool 360, a jig such as a diamond cutter can be used.

  After that, as shown in FIG. The end material part 350 is cut off with the scribe groove 331 as a boundary by the bending stress caused by the pressing force of the break jig 340.

  In the step of separating the end material portion 350, the protection member 310 is provided on the lower surface (opposing surface 131) of the end material portion 350. Therefore, even if the end material portion 350 comes into contact with the drawer portion 130, the protection member 310 functions as a buffer material between the end material portion 350 and the drawer portion 130, so that the drawer portion 130 is hardly damaged.

  Further, as shown in FIG. 8, a protective member 310 is provided over substantially the entire surface from the outside of the sealing material 110 to the end of the sealing substrate 140. Therefore, any part of the cut off end material part 350 can be prevented from directly contacting the drawer part 130, and the drawer part 130 is hardly damaged.

  The protection member 310 is, for example, a plurality of spherical fine particles. The spherical fine particles preferably have a diameter of 5 μm to 15 μm. When the diameter is smaller than 5 μm, the thickness as the protective member is reduced, and the role as the protective layer may be reduced. On the other hand, when the diameter is larger than 15 μm, the thickness due to the fine particles of the protective member 310 is larger than the thickness of the sealing material 110, and the adhesion between the sealing substrate 140 and the base substrate 160 through the sealing material 110 is deteriorated. there is a possibility.

  Spherical fine particles can be formed of a resin. For example, it is possible to use particles formed of a high molecular resin such as a divinylbenzene polymer and a polyisoprene-butadiene copolymer.

  Further, silica fine particles can be used as the spherical fine particles. As the silica fine particles, for example, silica particles generated by synthesizing alkyl silicate can be used. The alkyl silicate is an alkoxysilane oligomer starting from tetraalkoxysilane.

  When the spherical fine particles are formed of a resin, it is preferable to use a resin of 1 GPa to 10 GPa with the elastic modulus of the spherical fine particles being 10% K value (pressure required to compress the particle diameter by 10%). This is because if the elastic modulus is less than 1 GPa, it may be difficult to mitigate the impact as the protective layer. On the other hand, if the elastic modulus is greater than 10 GPa at a 10% K value, the function as a cushioning material is lowered, and the drawer portion may be damaged. Even when silica fine particles are used as the spherical fine particles, the elastic modulus of the spherical fine particles is preferably 1 GPa to 10 GPa at a 10% K value.

The spherical fine particles are preferably sprayed on the facing surface 131 at a density of 50 to 150 per 1 mm ² . This is because if the spraying amount is less than 50 per 1 mm ^2, the degree of absorbing the impact as the protective member 310 may be reduced. On the other hand, if the amount of application is larger than 150 per 1 mm ² , the amount of material used increases and the manufacturing cost increases.

(Embodiment 2)
In the above-described embodiment, the recessed portion 171 is provided on the lower inner surface of the sealing substrate 140, and the dry sheet 170 is attached to the recessed portion 171. However, the present invention is not limited to such an embodiment.

  As shown in FIG. 11, the same sealing substrate 140 that does not have the recess 171 can be used. In the sealing substrate 140 according to the second embodiment, since the recessed portion 171 is not formed, the thickness of the central portion is not thinner than the end portion. Therefore, in the step of cutting the end material portion 350 as shown in FIG.

  As shown in FIG. 11, a resin 290 is filled in a gap between the display portion 231 and the sealing material 110. The resin 290 can prevent the display portion 231 from coming into contact with external water vapor.

(Embodiment 3)
In the above-described embodiment, the protective member 310 applied spherical fine particles to the facing surface 131. However, the present invention is not limited to such an embodiment. As shown in FIG. 12, an elastic thin film resin sheet can be attached to the facing surface 131 as the protection member 310. As the thin resin sheet having elasticity, a silicone resin sheet can be used.
In each of the embodiments described above, the organic EL display device including the light emitting element in which each display pixel of the display portion of one substrate includes the organic EL element is described. However, the present invention is not limited to this, and the light emitting element is not limited to this. Other than the organic EL element, for example, an inorganic EL element, a light emitting diode or the like may be used. Furthermore, the present invention provides an individual display panel by bonding two substrates and cutting a predetermined portion, and has a lead-out portion in which an electrode connected to the display portion is provided at one end of one substrate In addition to forming the light emitting element on one substrate, liquid crystal is sealed in a region sealed with a sealing material between two bonded substrates, The present invention can also be suitably applied to a liquid crystal display panel in which a connection electrode is provided at one end of the substrate.

(A) is sectional drawing of the organic electroluminescence display manufactured by the board | substrate cutting method of this invention, (b) is sectional drawing in the XX line in Fig.1 (a). (A) is sectional drawing of a large sized base board, (b) is a figure explaining a mode that the display part is provided in each panel formation area of a large sized base board, (c) is each figure. It is a figure which expands and demonstrates a panel formation area. (A) is a figure explaining a large sized sealing substrate, (b) is a figure explaining the mask which has an opening part. It is a figure explaining a mode that a protection member is spread on a large-sized sealing board. It is a figure explaining a mode that a dry sheet is affixed on the dent part of a large sized sealing substrate. It is a figure explaining a mode that a large sized sealing substrate and a large sized base substrate are laminated | stacked with a sealing material interposed. It is a figure explaining the large sized sealing substrate and large sized base board | substrate divided | segmented into each panel formation area. It is a figure explaining the board | substrate divided | segmented into each panel formation area. It is a figure explaining a mode that the scribe groove | channel which divides an end material part is provided. It is a figure explaining a mode that an end material part is divided | segmented. It is a figure explaining a mode that the sealing substrate of another embodiment is used. It is a figure explaining a mode that the protection member of another embodiment is used.

Explanation of symbols

DESCRIPTION OF SYMBOLS 110 ... Sealing material, 130 ... Lead-out part, 131 ... Opposite surface, 140 ... Sealing substrate, 160 ... Base substrate, 170 ... Drying sheet, 171 ... Recessed part, 210 ... Lower electrode, 220 ... Organic EL light emitting layer, 230 ... Upper electrode, 231 ... Display part, 310 ... Protection member, 320 ... Dispersing device, 330 ... Mask, 340 ... Break jig, 350 ... End material part, 360 ... Cutting tool, 610 ... Large sealing substrate, 620 ... Large Base substrate, 800 ... organic EL display device

Claims (11)

The plurality of panels of the first substrate in each panel formation region of the first substrate partitioned into a plurality of panel formation regions each having a display portion and a lead portion provided with an electrode connected to the display portion The panel formation regions of the second substrate partitioned into a plurality of panel formation regions corresponding to the formation regions are opposed to each other, and the drawer portions of the panel formation regions of the first substrate are opposed to the drawer portions. A step of bonding the first substrate and the second substrate with a protective member interposed between the opposing surfaces of the panel formation regions of the two substrates;
A cutting step of cutting an end material portion forming the facing surface of each panel forming region of the second substrate;
A substrate cutting method comprising:   The protection member is a buffer that absorbs an impact applied to the first substrate by the end material portion contacting the first substrate through the protection member when the end material portion of the second substrate is cut. The substrate cutting method according to claim 1, wherein the substrate cutting method is a material.   The substrate cutting method according to claim 1, wherein the protective member is formed by being attached to the facing surface of each panel forming region of the second substrate.   4. The substrate cutting method according to claim 1, wherein the protective member is formed by dispersing a plurality of spherical fine particles on the facing surface. 5.   The substrate cutting method according to claim 4, wherein the plurality of spherical fine particles are a resin having a modulus of elasticity of 10% K and 1 GPa to 10 GPa.   The protective member is provided with a mask in a portion of the second substrate other than the facing surface of each panel forming region so that the plurality of spherical fine particles do not adhere to the portion other than the facing surface. The substrate cutting method according to claim 4, wherein the substrate cutting method is formed by dispersing a plurality of fine particles on the opposite surface side of the second substrate.   The substrate cutting method according to claim 1, wherein the protective member is formed by sticking a sheet-like resin material to the facing surface.   The step of bonding the first substrate and the second substrate includes: the display portion of each panel formation region of the first substrate; and the region facing the display portion of each panel formation region of the second substrate; The substrate cutting method according to any one of claims 1 to 7, further comprising a step of sealing the substrates together with a sealing material and attaching the drawn portions to the outside of the sealing material.   9. The method according to claim 1, further comprising a step of cutting the bonded first substrate and the second substrate in the panel forming regions to obtain a plurality of individual display panels. 10. The substrate cutting method according to claim 1.   The said opposing surface is an area | region from the outer side of the said sealing material after the said 2nd board | substrate is cut | disconnected to each said panel formation area to the edge part of each said panel formation area, It is characterized by the above-mentioned. The substrate cutting method according to claim 1.   11. The substrate cutting method according to claim 1, wherein the display unit formed on the first substrate includes a light-emitting element including an organic electroluminescence layer.

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