JP2009295344A - Method for manufacturing metal material with electrical contact layer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal material with an electrical contact layer, which reduces an amount of noble metals used in it while having excellent durability, and is formed by press forming even after forming the electrical contact layer. <P>SOLUTION: In this method for manufacturing the metal material 10 with the electrical contact layer to form the electrical contact layer 3 on the surface of a metal base material 1, an adhesive layer 2 having an average thickness d1 of not less than 5 nm and not more than 100 nm and comprising an alloy having a Y group (either one of titanium, niobium, tantalum, and zirconium) as a main component, and Pd of not less than 0.02 mass% and not more than 5 mass% which is added to the Y group, is deposited on the surface of the metal base material 1 by a vapor deposition method using a chamber, and the electrical contact layer 3 having a noble metal (either one of Au, Pt, Rh, Ir and Ag) and having an average thickness d2 of not less than 1 nm and not more than 20 nm is deposited on the surface of the adhesive layer 2 by the vapor deposition method in the same chamber. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for producing a metal material with an electrical contact layer, which forms a noble metal electrical contact layer on the surface of a metal substrate.

  A typical example of forming an electrical contact layer on a metal substrate is gold plating. As an underlayer for gold plating, tin plating, Ni plating, or Ag plating is often used.

  The metal material with an electrical contact layer on which such an electrical contact layer is formed is used for battery electrode materials and electrical contact portions of connectors.

  In order to produce these parts, the metal material with an electrical contact layer is also variously deformed by press molding.

  The prior art document information related to the invention of this application includes the following.

Japanese Patent No. 39568841 Japanese Patent No. 3161805 JP 2007-9304 A JP 2007-146250 A JP 2007-158437 A International Publication No. 2006/126613 Pamphlet

  The problem with gold plating is that the metal (titanium, aluminum, and stainless steel) that forms the passive film is plated with a high cost to maintain manufacturing costs (due to pretreatment, etc.) and durability ( (Raw material costs) is necessary, and the overall cost is high.

  Therefore, Ni, Sn, Co, and Ag are plated as a base layer before precious metal plating.

  Patent Document 1 discloses that an Ag layer + (NiCo) layer is formed as a base layer, and a Pd layer is formed thereon as an electrical contact layer.

  Patent Document 2 discloses that Ni is used as an underlayer and a Pd—Ni alloy is used as an electrical contact layer.

  Patent Document 3 shows that Sn plating is used as a base layer.

  Thus, when Ni, Sn, Co, or Ag is used as the underlayer, there is a problem in durability when used in an environment where the underlayer itself is electrochemically corroded. Moreover, it is also a problem that such a plated material is difficult to press-mold for forming a part after the plating process (plating is peeled off).

  Patent Document 4 discloses that Au plating is performed on a titanium metal plate without a base layer. However, this method has a problem in durability, and press forming after plating is difficult.

  In patent document 5, as an electrical contact layer formation to the base material of the metal separator for fuel cells, any of Ti, Ni, Ta, Nb, and Pt is formed as a base layer, and then a noble metal layer is formed. It is shown.

  Patent Document 6 shows that a noble metal layer of Pd is formed on Ti, and a surface layer formed by alloying Ti and Pd by heat treatment is used.

  However, press molding after plating is difficult even with these methods.

  Accordingly, an object of the present invention is to provide a method for producing a metal material with an electric contact layer capable of reducing the amount of noble metal used and press forming.

  The present invention has been devised to achieve the above object, and is a method for producing a metal material with an electrical contact layer that forms an electrical contact layer on the surface of a metal substrate. An average of an alloy composed mainly of a Y group (any one of titanium, niobium, tantalum, and zirconium) and added with 0.02 mass% or more and 5 mass% or less of Pd to the Y group. An adhesive layer having a thickness of 5 nm to 100 nm is formed, and an average thickness of noble metal (any of Au, Pt, Rh, Ir, Ag) is formed on the surface of the adhesive layer by a vapor phase method in the same chamber. It is a manufacturing method of the metal material with an electrical contact layer which forms an electrical contact layer of 1 nm or more and 20 nm or less.

  Moreover, this invention is a manufacturing method of the metal material with an electrical contact layer which forms an electrical contact layer on the surface of a metal base material, Comprising: Y-group ( An adhesive layer having an average thickness t1 made of titanium, niobium, tantalum, or zirconium is formed, and Pd having an average thickness t2 made of Pd is formed on the surface of the adhesive layer by a vapor phase method in the same chamber. The average thicknesses t1 and t2 satisfy 5 nm ≦ t1 + t2 ≦ 100 nm and 0.2 nm ≦ t2 ≦ 2 nm, and the surface of the Pd layer is deposited on the surface of the Pd layer by a vapor phase method in the same chamber. This is a method for producing a metal material with an electrical contact layer, in which an electrical contact layer made of any one of Pt, Rh, Ir, and Ag having an average thickness of 1 nm to 20 nm is formed.

  ADVANTAGE OF THE INVENTION According to this invention, the metal material with an electrical contact layer which can reduce the amount of noble metals used and can be press-molded can be manufactured.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a schematic cross-sectional view of a metal material with an electrical contact layer manufactured using the method for manufacturing a metal material with an electrical contact layer according to the first embodiment.

  As shown in FIG. 1, a metal material 10 with an electrical contact layer is formed on a metal substrate 1 and a surface of the metal substrate 1, and mainly includes a Y group (any one of titanium, niobium, tantalum, and zirconium). An adhesive layer (underlying layer) 2 having an average thickness d1 of 5 nm to 100 nm, and a surface of the adhesive layer 2, composed of an alloy containing 0.02 mass% to 5 mass% of Pd as a component And an electrical contact layer 3 having an average thickness d2 made of noble metal (any one of Au, Pt, Rh, Ir, and Ag) of 1 nm or more and 20 nm or less.

  As the metal substrate 1, titanium, titanium alloy, niobium, tantalum, zirconium, nickel, chromium, or an alloy material thereof, an alloy material containing nickel, an invar material (Fe—Co—Cr alloy, Fe—Ni alloy, Fe-Ni-Co alloy), austenitic stainless steel (SUS304, SUS316), Kovar material (Fe-Ni-Co alloy), permalloy material (Fe-Ni alloy), Hastelloy (Ni-Mo-Fe-Co alloy), Inconel (Ni—Fe—Cr—Nb—Mo alloy), ferritic stainless steel (such as SUS430) that does not contain Ni as a main component, a metal material having a composite clad structure of these metal materials, or a nichrome plate may be used.

  As the main component of the material of the adhesive layer 2, when the metal substrate 1 is a single metal such as titanium, niobium, tantalum, zirconium, etc., the same metal as the metal substrate 1 from the Y group (titanium, niobium, tantalum, zirconium) ) Are preferably selected. When the metal substrate 1 is Kovar, Permalloy, Invar alloy, Hastelloy, Inconel, an alloy containing nickel, stainless steel, or a nichrome plate, any of the Y groups may be selected as the main component of the adhesive layer 2.

  As the electrical contact layer 3, a noble metal (any of Au, Pt, Rh, Ir, and Ag) excluding Pd may be selected.

  Now, a method for manufacturing the metal material with an electrical contact layer according to the first embodiment will be described.

  The manufacturing method of the metal material 10 with an electrical contact layer has a Y group (any one of titanium, niobium, tantalum, and zirconium) as a main component on the surface of the metal substrate 1 placed in the chamber. A step of forming an adhesive layer 2 made of an alloy to which 0.02 mass% or more and 5 mass% or less of Pd is added by a vapor phase method with an average thickness of 5 nm or more and 100 nm or less, and on the surface of the adhesive layer 2 in the same chamber The method includes a step of forming the electrical contact layer 3 made of a noble metal (any one of Au, Pt, Rh, Ir, and Ag) by a vapor phase method with an average thickness d2 (1 nm to 20 nm).

  As the film formation method, it is preferable to use a production technique such as vapor deposition, ion beam, sputtering, or CVD as a vapor phase method, but the present invention does not limit the film formation method.

  Moreover, for forming parts, press forming may be performed after the film forming process of each layer 2, 3, or the film forming process of each layer 2, 3 may be performed after press forming of the metal substrate 1.

  In addition, in order to improve durability, after forming the electrical contact layer 3, you may perform the oxidation process, anodizing process, etc. for the purpose of sealing a pinhole.

  The reason why the average thickness d1 of the adhesive layer 2 is 5 nm or more and 100 nm or less is that when the average thickness d1 is less than 5 nm, there arises a problem that the contact resistance increases, and when the average thickness d1 exceeds 100 nm, the metal substrate 1 This is because there is a problem that mechanical peeling easily occurs.

  Adding Pd to the adhesive layer 2 has the following three effects.

  (1) When Pd is mixed as a component in the adhesive layer, the adhesion between the adhesive layer and the electrical contact layer is improved as compared with the case where Pd is not present. This is because noble metals do not chemically bond to many metals, but the presence of chemically active Pd in the adhesive layer improves the chemical bonding force between the adhesive layer and the electrical contact layer. It is thought that.

  (2) Pd has the effect of improving the corrosion resistance of the metal (titanium, niobium, tantalum, zirconium) forming the passive film. Thereby, durability of the adhesive layer is improved, and peeling and elution of the electrical contact layer formed on the surface of the adhesive layer can be suppressed, so that durability of the electrical contact layer is improved.

  (3) When Pd atoms are present near the surface of the adhesive layer, formation of an oxide film is promoted. The oxide film acts as a hydrogen barrier, reduces hydrogen absorption due to generation of hydrogen gas due to metal corrosion, suppresses peeling of the adhesive layer from the metal substrate, and improves the durability of the metal material with an electrical contact layer.

  The reason why the Pd addition amount of the adhesive layer 2 is 0.02 mass% or more and 5 mass% or less is that when the Pd addition amount is less than 0.02 mass%, the above-described effect cannot be obtained, and the Pd addition amount is 5 mass%. If it exceeds, hydrogen is easily absorbed into the adhesive layer 2, which may cause embrittlement, or the adhesive layer 2 may peel off from the metal substrate 1.

  The reason why the average thickness d2 of the electrical contact layer 3 is 1 nm or more and 20 nm or less is that when the average thickness d2 is less than 1 nm, an oxide layer is formed. This is because an increase occurs, and when the average thickness d2 exceeds 20 nm, the distortion of the electrical contact layer 3 increases, and a problem that mechanical peeling from the metal substrate 1 easily occurs.

  The reason why the strain of the electrical contact layer 3 becomes large is that there is a volume expansion accompanying hydrogen absorption of the electrical contact layer 3 by hydrogen gas.

  According to the manufacturing method of the metal material with an electrical contact layer according to the first embodiment, the adhesive layer 2 to which Pd is added and the electrical contact layer 3 are chemically and tightly bonded. By firmly joining the electrical contact layer 3 via the adhesive layer 2, peeling of the electrical contact layer 3 is suppressed, and a metal material with an electrical contact layer having excellent durability can be obtained.

  Since the adhesive layer 2 plays a role of improving durability, it is not necessary to make the electrical contact layer 3 thick in order to maintain durability. Therefore, the electric contact layer 3 can be thinned to reduce the amount of noble metal used. Moreover, if the electrical contact layer 3 can be made thinner, the internal strain of the electrical contact layer 3 can be reduced, and press molding after film formation becomes possible.

  Furthermore, it is possible to form the electrical contact layer 3 that achieves both reduction in the amount of noble metal used and durability even with a metal material that is a difficult-to-plat material, and press forming after film formation becomes possible.

  Next, a second embodiment will be described.

  FIG. 2 is a schematic cross-sectional view of a metal material with an electrical contact layer manufactured using the method for manufacturing a metal material with an electrical contact layer according to the second embodiment.

  As shown in FIG. 2, the metal material 20 with an electrical contact layer is formed on the surface of the metal base material 21 and the metal base material 21, and is an average composed of a Y group (any one of titanium, niobium, tantalum, and zirconium). An adhesive layer 22 having a thickness t1 and an average thickness t2 made of Pd and formed on the surface of the adhesive layer 22 (thicknesses t1 and t2 are t1 + t2 of 5 nm to 100 nm and t2 of 0.2 nm to 2 nm) Pd layer 23 having a thickness satisfying the same), and an average thickness t3 made of noble metal (any of Au, Pt, Rh, Ir, Ag) is 1 nm or more and 20 nm or less. And an electrical contact layer 24.

  As the metal substrate 21, a metal material similar to that of the metal substrate 1 of FIG.

  The main component of the material of the adhesive layer 22 may be selected from the Y group in the same manner as the adhesive layer 2 of the metal material 10 with an electrical contact layer in FIG.

  As the electrical contact layer 24, a noble metal (any one of Au, Pt, Rh, Ir, and Ag) excluding Pd may be selected as in the electrical contact layer 3 of the metal material with electrical contact layer 10 of FIG.

  Now, a method for manufacturing the metal material with an electric contact layer according to the second embodiment will be described.

  In the method of manufacturing the metal material 20 with an electrical contact layer, an adhesive layer 22 made of a Y group (any of titanium, niobium, tantalum, and zirconium) is formed on the surface of a metal substrate 21 placed in a chamber with an average thickness t1. On the surface of the adhesion layer 22, a Pd layer 23 made of Pd is formed on the surface of the adhesive layer 22 with an average thickness t2 (thicknesses t1 and t2 are t1 + t2 of 5 nm to 100 nm and t2 A thickness of 0.2 nm to 2 nm) and a surface of the Pd layer 23 on the surface of the Pd layer 23 in the same chamber (any of Au, Pt, Rh, Ir, Ag) And a step of forming a film of the electrical contact layer 24 having an average thickness t3 (1 nm or more and 20 nm or less) by a vapor phase method.

  As the film formation method, it is preferable to use a production technique such as vapor deposition, ion beam, sputtering, or CVD as a vapor phase method, but the present invention does not limit the film formation method.

  Further, for forming parts, press forming may be performed after the film forming process of each layer 22, 23, 24, or the film forming process of each layer 22, 23, 24 may be performed after press forming of the metal substrate 21. Good.

  In addition, in order to improve durability, after forming the electrical contact layer 24, you may perform the oxidation process for the purpose of sealing a pinhole, an anodizing process, etc.

  The sum (t1 + t2) of the average thickness t1 of the adhesive layer 22 and the average thickness t2 of the Pd layer 23 is 5 nm or more and 100 nm or less. When t1 + t2 is less than 5 nm, there arises a problem that contact resistance increases, and t1 + t2 If the thickness exceeds 100 nm, there is a problem that mechanical peeling easily occurs from the metal substrate 21.

  The role of the Pd layer 23 is to chemically bond the adhesive layer 22 and the electrical contact layer 24 chemically. Further, by providing the Pd layer 23, the same effect as that obtained when Pd is added to the adhesive layer 2 of the metal material 10 with an electrical contact layer in FIG. 1 can be obtained.

  The reason why the average thickness t2 of the Pd layer 23 is 0.2 nm or more and 2 nm or less is that the above-described effect cannot be obtained when the average thickness t2 is less than 0.2 nm, and that the adhesive layer is formed when the average thickness t2 exceeds 2 nm. This is because it is considered that there is a problem that the hydrogen absorption of 22 increases.

  The reason why hydrogen absorption increases is that when the Pd layer becomes a Pd polyatomic layer (thickness greater than 2 nm), stress strain occurs between the Pd atoms, and this local strain becomes a hydrogen adsorption factor.

  On the other hand, when the thickness t2 of the Pd layer is about a single atom (thickness is approximately 2 nm or less), the distortion between Pd atoms becomes extremely small (in the case of a complete single atom, the distance between Pd atoms Therefore, no hydrogen adsorption occurs when the Pd layer is a polyatomic layer of Pd.

  The reason why the average thickness t3 of the electrical contact layer 24 is 1 nm or more and 20 nm or less is the same as when the average thickness d2 of the electrical contact layer 3 is 1 nm or more and 20 nm or less in the metal material 10 with an electrical contact layer in FIG. For reasons.

  According to the manufacturing method of the metal material with an electrical contact layer according to the second embodiment, the electrical contact that can reduce the amount of precious metal and can be press-formed, as in the manufacturing method of the metal material with an electrical contact layer 10 of FIG. A layered metal material can be obtained.

[Evaluation test of electrical contacts]
As the electrical conductivity evaluation, evaluation was made by the change in the surface contact resistance of the plate material (metal material with an electrical contact layer) before and after the environmental test.

Environmental testing:
A solution prepared by adding 1200 ppm of sodium chloride to a solution adjusted to pH 2 with sulfuric acid and pure water was prepared, and the plate material sample was immersed in this solution (24 hours, room temperature of about 25 ° C.).

  Since the end of the plate material was not subjected to the film treatment and the metal substrate was exposed, it was sealed with a vinyl masking tape and immersed in the liquid.

  Specifically, the contact resistance between the carbon paper (product number: TGP-H-060, manufactured by Toray Industries, Inc.) 31 and the plate material sample 32 was used to measure the surface contact resistance, as shown in FIG.

A prepared plate material sample 32 (area: 2 × 2 cm ² ) is sandwiched between Cu (copper) blocks 33 subjected to Au plating via a carbon paper 31 (area: 2 × 2 cm ² ). While applying a weight (10 kg / cm ² ), the resistance R (mΩ) between the plate material sample 32 and the carbon paper 31 was measured by a four-terminal measurement method (manufactured by ADEX Co., Ltd., model number: AX-125A). A value obtained by standardizing this resistance value per surface area was defined as contact resistance (mΩ · cm ² ).

[Preparation of sample]
Examples of the metal substrate include titanium, niobium, tantalum, zirconium, Kovar (Fe—Ni alloy, manufactured by Nilaco: product number = 633321), 78 permalloy (Ni—Fe alloy, manufactured by Nilaco: product number = 783322), Invar (Fe—Ni -Co alloy, manufactured by Nilaco: product number = 623323), Hastelloy C-276 (Ni-Mo alloy, manufactured by Nilaco: product number = 5832321), Inconel 600 (Ni-Fe-Cr alloy, manufactured by Nilaco: product number = 603290), stainless steel 430 Stainless steel 316 having a thickness of 0.1 mm was prepared.

  A Nichrome plate (Ni-Cr alloy, manufactured by Niraco: product number = 693333) was prepared with a thickness of 0.12 mm (thickness is different for convenience of material preparation).

  An adhesive layer and an electrical contact layer were formed on these metal substrates by sputtering in this order. The sputtering treatment here was performed using an RF sputtering apparatus (manufactured by ULVAC, Inc., model: SH-350).

  The atmosphere during film formation was Ar, the pressure was 7 Pa, and the RF output was appropriately adjusted depending on the type of metal. Thickness control was performed by adjusting the film formation time after previously measuring the average film formation rate for each metal species.

  In this experiment, the same film formation process was performed on both surfaces (both front and back) of the metal substrate.

  After the film formation, as a press formation test, a metal mold was used to perform press molding processing with a corrugated shape (uneven shape) as shown in FIG. Here, the length L of the corrugated shape (vertical grooves and concave portions in FIG. 4) is 52 mm, and the pitch P is 2.9 mm × 17 (the concave portions and convex portions are alternately formed in the vertical direction in FIG. 4). The depth D of the wave shape (depth direction in FIG. 4, height difference between the concave portion and the convex portion) was set to 0.6 mm.

  In actual application, the groove shape is not limited to the above, and the film formation surface does not need to be both sides (whether it is a double side or a single side depends on the application method).

[Explanation of evaluation results]
(Explanation of Tables 1 to 3) When the base layer is a Y group-Pd alloy (metal material with electrical contact layer = metal substrate + adhesive layer + electric contact layer)

  Tables 1 to 3 show the measurement results before and after the environmental test of the film formation structure of each sample and the contact electric resistance of the sample.

As evaluation criteria here, those having a contact resistance of 20 mΩ · cm ² or more after environmental testing are not applicable (comparative example), and those having a resistance of less than ²⁰ mΩ · cm ² are applicable as electrical contacts (examples). .

  Table 1 shows examples of noble metal species applicable as the thickness of the adhesive layer, the thickness of the electrical contact layer, and the electrical contact layer.

  When there is no adhesive layer (Comparative Example 1) and when the thickness of the adhesive layer exceeds 100 nm (Comparative Example 10), it is not applicable, and the thickness of the adhesive layer is in the range of 5 nm to 100 nm (Examples 6 and 8). 9).

  The case where the thickness of the electrical contact layer is outside the range of 1 nm or more and 20 nm or less (Comparative Examples 2, 7, 11, 14) is not applicable. The noble metal layer serving as the electrical contact layer can be adapted by forming any one of Au, Pt, Ru, Rh, Ir, and Ag.

  Implementation / comparison experiments of sample Nos. 23 to 28 in Table 2 show that the Pd addition concentration is applicable when the concentration is 0.02 mass% or less and 5 mass% or less.

  When the Pd concentration is small (Pd 0.01 mass%), the contact resistance after the environmental test is large (Comparative Example 23). On the other hand, if the Pd concentration is higher than 5 mass%, the surface layer of the sample is peeled off after the environmental test (Comparative Example 28).

  About the sample after these environmental tests, the hydrogen content of the sample was analyzed. The analysis was performed by burning the exfoliated material and determining the amount of H (hydrogen) generated at that time. The measuring device was a Horiba model EMGA-1110.

  The hydrogen content increased as the Pd concentration increased, and in the case of Comparative Example 28 (Pd concentration 7 mass%), surface layer peeling occurred, and the cause was considered to be due to hydrogen embrittlement due to hydrogen absorption in the surface layer.

  In Examples 29 to 35 in Table 2, when the metal base material is Nb, Ta, or Zr, a Ti—Pd alloy, an Nb—Pd alloy, a Ta—Pd alloy, or a Zr—Pd alloy is selected as the adhesive layer, respectively. It shows that.

  Examples 36 to 43 in Table 2 are examples of various metal substrates when a Ti—Pd alloy is used as the adhesive layer. Also in this case, as shown in Comparative Example 44, it is not applicable when there is no adhesive layer.

  Table 3 shows examples of various metal substrates when Nb—Pd alloy, Ta—Pd alloy, and Zr—Pd alloy are used as the adhesive layer.

  (Explanation of Tables 4 to 6) When the base layer has a two-layer structure of Y group-Pd configuration (metal material with electrical contact layer = metal substrate + adhesive layer + Pd layer + electric contact layer)

  Tables 4 to 6 show Tables 1 to 3 for Examples and Comparative Examples in which the underlayer is applied in a two-layer structure, that is, a Y group-Pd configuration (where Y group = Ti, Nb, Ta, Zr). Fig. 5 shows the measurement results before and after the environmental test of the film formation structure of each sample and the contact electric resistance of the sample.

  When the underlayer has a Y group-Pd configuration, the Y group is selected as the adhesive layer, and Pd is selected as the Pd layer.

  In this case as well, as in Tables 1 to 3, the underlayer (= t1 + t2) can be applied at 5 nm or more and 100 nm or less (Examples 105, 108, and 109). Occurs and becomes a problem (Comparative Example 110).

  Further, when the thickness of the electrical contact layer is outside the range of 1 nm or more and 20 nm or less, the contact resistance is increased and is not applicable (Comparative Examples 102, 107, 111, and 114).

  Implementation / comparison experiments of sample Nos. 123 to 128 in Table 5 show that the average thickness of the Pd layer is applicable to 0.2 nm or more and 2 nm or less. When the Pd layer is thin (Comparative Example 123), the contact resistance after the environmental test is large and becomes a problem. On the other hand, when the thickness of the Pd layer is greater than 2 nm, peeling occurs on the surface layer of the sample after the environmental test (Comparative Example 128).

  About the sample after these environmental tests, the hydrogen content of the sample was analyzed. The analysis was performed by burning the exfoliated material and determining the amount of H (hydrogen) generated at that time. The measuring device was a Horiba model EMGA-1110. The hydrogen content increases as the Pd concentration increases. In the case of Comparative Example 128 (the average thickness of the Pd layer is 2 nm), the surface layer is peeled off due to hydrogen embrittlement due to hydrogen absorption in the surface layer. I thought.

  Examples of the method for confirming the average thickness in the above-described embodiment include an analysis method using ICP (inductively coupled plasma) mass spectrometry and XPS (X-ray photoelectron spectroscopy). If these are used, the average thickness of each film thickness can be calculated | required by using arbitrary several places of the metal material with an electrical contact layer to measure as an analytical sample.

  Besides the analysis using ICP or XPS, the average thickness can also be calculated by analysis using TEM (transmission electron microscope).

It is a cross-sectional schematic diagram of the metal material with an electrical contact layer manufactured using the manufacturing method of the metal material with an electrical contact layer according to the first embodiment. It is a cross-sectional schematic diagram of the metal material with an electrical contact layer manufactured using the manufacturing method of the metal material with an electrical contact layer according to the second embodiment. It is the schematic which showed the measuring method of the contact resistance of an electrical contact layer. It is a shape figure of the board | plate material (metal material with an electrical contact layer) sample after press molding.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Metal base material 2 Adhesive layer 3 Electrical contact layer 10 Metal material with electrical contact layer d1 Average thickness of adhesive layer d2 Average thickness of electrical contact layer

Claims (2)

A method for producing a metal material with an electrical contact layer that forms an electrical contact layer on the surface of a metal substrate,
The surface of the metal substrate is mainly composed of Y group (any of titanium, niobium, tantalum, zirconium) by a vapor phase method using a chamber, and 0.02 mass% or more and 5 mass% or less of the Y group. An adhesive layer having an average thickness of 5 nm or more and 100 nm or less made of an alloy added with Pd is formed, and a noble metal (Au, Pt, Rh, Ir, Ag) is formed on the surface of the adhesive layer by a vapor phase method in the same chamber. A method for producing a metal material with an electrical contact layer, comprising forming an electrical contact layer having an average thickness of 1 nm to 20 nm. A method for producing a metal material with an electrical contact layer that forms an electrical contact layer on the surface of a metal substrate,
An adhesive layer having an average thickness t1 made of Y group (any of titanium, niobium, tantalum, and zirconium) is formed on the surface of the metal substrate by a vapor phase method using a chamber, and the surface of the adhesive layer is formed. A Pd layer made of Pd and having an average thickness t2 is formed in the same chamber by a vapor phase method. The average thicknesses t1 and t2 satisfy 5 nm ≦ t1 + t2 ≦ 100 nm and 0.2 nm ≦ t2 ≦ 2 nm. An electrical contact layer made of a noble metal (Au, Pt, Rh, Ir, or Ag) having an average thickness of 1 nm or more and 20 nm or less is formed on the surface of the Pd layer by a vapor phase method in the same chamber. The manufacturing method of the metal material with an electrical contact layer.

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