JP2009288499A - Electrophoretic display device and method for manufacturing electrophoretic display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrophoretic display device having high reliability and to provide a method for manufacturing the electrophoretic display device. <P>SOLUTION: Since both an element substrate and a sealing member sealing an electrophoretic layer comprises essentially silicon oxide, moisture invasion is suppressed as compared with the case in which moisture invasion is sealed by the other material such as a film made of resin. Since the sealing member is welded to the element substrate, adhesiveness of a joint part between the element substrate and the sealing member is heightened as compared with the case in which the sealing member and the element substrate are made adhere to each other by using an adhesive. Such being the case, the electrophoretic display device having high reliability can be obtained by providing the constitution having excellent moisture resistance. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electrophoretic display device and a method for manufacturing the electrophoretic display device.

  In recent years, electrophoretic display devices have been used as display units for electronic paper and the like. The electrophoretic display device has an electrophoretic dispersion liquid in which a plurality of electrophoretic particles are dispersed in a liquid phase dispersion medium. The electrophoretic display device is a device that uses for display that the distribution state of the electrophoretic particles is changed by applying an electric field and the optical characteristics of the electrophoretic dispersion liquid are changed. As a specific configuration of the electrophoretic display device, a configuration in which an electrophoretic sheet is attached to a display area of an element substrate and a protective substrate is attached to the electrophoretic sheet is known.

  The electrophoretic sheet has a configuration in which an electrophoretic layer and an adhesive layer are formed on a transparent sheet on which a transparent electrode such as ITO is deposited. As the electrophoretic layer, for example, a configuration in which a plurality of microcapsules in which an electrophoretic dispersion liquid containing electrophoretic particles is enclosed is spread on one surface of the sheet can be given.

  The electrophoretic display device having a microcapsule has a problem in that the display characteristics are adversely affected if too much or too little moisture is held in the microcapsule. In addition, when the sealing structure of the electrophoretic layer is insufficient, there is a problem in that display characteristics are likely to be deteriorated due to a change in temperature and humidity in an environment where the electrophoretic display device is used.

For this reason, establishment of a highly moisture-proof sealing structure that minimizes the entry and exit of moisture from the periphery of the electrophoretic display device has been demanded. For example, as described in Patent Document 1, an electrophoretic display device is wrapped with a single resin film, and excess portions of the film are joined together with, for example, a resin adhesive. A method for ensuring moisture resistance by sealing has been proposed.
JP 2007-233337 A

  However, in the above configuration, the possibility of moisture entering from the joint has been pointed out. Moreover, since the surplus part of the film and the adhesive are both made of resin, the joint part may peel off as time passes, and there is a problem that moisture easily enters from the peeled part. Furthermore, when using not only a film but the resin-made sealing member, there also was an anxiety that it deteriorates with progress of time and it becomes easy to penetrate moisture. Such a decrease in moisture resistance has been a factor that deteriorates the performance of the electrophoretic display device.

  In view of the circumstances as described above, an object of the present invention is to provide a highly reliable electrophoretic display device and a method for manufacturing the electrophoretic display device.

  In order to achieve the above object, an electrophoretic display device according to the present invention has a display region for displaying an image, and has an element substrate mainly composed of silicon oxide, a transparent substrate, an electrophoretic layer, and an adhesive layer. An electrophoretic sheet bonded to the display region of the element substrate via the adhesive layer, and a main component of silicon oxide, which is welded to the element substrate, and at least the electrophoretic layer is interposed between the element substrate and the element substrate. And a sealing member for sealing.

  According to the present invention, since both the element substrate and the sealing member for sealing the electrophoretic layer are mainly composed of silicon oxide, infiltration of moisture is suppressed compared to the case of sealing with another material such as a resin film. Will be. In addition, since the sealing member is welded to the element substrate, the adhesiveness of the joint portion between the element substrate and the sealing member is enhanced as compared with the case where the sealing member is adhered. With such a structure having excellent moisture resistance, a highly reliable electrophoretic display device can be obtained.

In the electrophoretic display device, the sealing member has a frame portion that surrounds at least the electrophoretic layer in a plan view, and the frame portion is welded to the element substrate.
According to the present invention, the sealing member has a frame portion that surrounds at least the electrophoretic layer in plan view, and the frame portion is welded to the element substrate. An electrophoretic display device having excellent properties can be obtained.

In the electrophoretic display device, the element substrate includes a wiring member provided along an outer periphery of the display region, and the frame portion is provided outside the region where the wiring member is provided in a plan view. It is characterized by.
According to the present invention, the element substrate has the wiring member provided along the outer periphery of the display area, and the frame portion is provided outside the area where the wiring member is provided in plan view. The part and the wiring member are arranged at positions shifted in plan view. Thereby, when welding a frame part and an element substrate, it can prevent that the influence of the heat | fever by welding has exerted on a wiring member directly.

In the electrophoretic display device, the wiring member is provided so as to intersect with the frame portion, and the frame portion has an opening at an intersection with the wiring member.
According to the present invention, since the wiring member is provided so as to intersect the frame portion, and the frame portion has the opening at the intersection with the wiring member, the opening is formed at the intersection between the frame and the wiring member. The parts are separated from each other. Thereby, when welding a frame part and an element substrate, it can prevent that the influence of the heat | fever by welding has exerted on a wiring member directly.

In the electrophoretic display device, the element substrate has a parting member surrounding the display area,
The frame portion is provided outside the parting member in a plan view.
According to the present invention, since the element substrate has the parting member that surrounds the display area, and the frame part is provided outside the parting member in plan view, the color of the frame part affects the display. Can be avoided. For this reason, the range of selection can be expanded about the structure of a frame part, for example, coloring a frame part.

The electrophoretic display device is characterized in that the sealing member has the highest absorption rate for light used for welding in the frame portion.
According to the present invention, since the absorption rate for light used for welding is highest in the frame portion of the sealing member, for example, when the frame portion is welded to the element substrate using the light. The light irradiated to the frame part is efficiently absorbed. Thereby, energy of light can be efficiently supplied to the frame portion, and welding can be performed efficiently.

In the electrophoretic display device, the element substrate includes a parting member that surrounds the display region, the wiring member is provided at a position overlapping the parting member in a plan view, and the frame portion includes It is provided outside the area where the parting member and the wiring member are provided.
According to the present invention, since the element substrate has the parting member that surrounds the display area, and the wiring member is provided at a position overlapping the parting member in plan view, the wiring member is parting member when viewed from the display surface side. As a result, the wiring member can be avoided from being visually recognized. In addition, since the frame part is provided outside the region where the parting member and the wiring member are provided, the influence of heat due to the welding is directly applied to the parting member and the wiring member when the frame part and the element substrate are welded. It can be prevented from reaching.

In the electrophoretic display device, the sealing member includes a display surface protection unit disposed on a display surface side of the electrophoretic layer, and the display surface protection unit and the frame unit are welded. It is characterized by.
According to the present invention, the sealing member has the display surface protection portion disposed on the display surface side of the electrophoretic layer, and the display surface protection portion and the frame portion are welded. Even if it consists of a plurality of parts, the plurality of parts can be reliably adhered by welding.

  In the method for manufacturing an electrophoretic display device according to the present invention, an electrophoretic sheet having a transparent substrate, an electrophoretic layer, and an adhesive layer is bonded to a display region of an element substrate containing silicon oxide as a main component through the adhesive layer. After the bonding step and the bonding step, a sealing member mainly composed of silicon oxide is welded to the element substrate, and at least the electrophoretic layer is sealed between the sealing member and the element substrate. And a sealing step.

  According to the present invention, an electrophoretic sheet having a transparent substrate, an electrophoretic layer and an adhesive layer is bonded to the display region of an element substrate containing silicon oxide as a main component via the adhesive layer, and then silicon oxide is the main component. The sealing member is welded to the element substrate, and at least the electrophoretic layer is sealed between the sealing member and the element substrate. The adhesiveness of the joint part with a member can be improved. In addition, since both the element substrate for sealing the electrophoretic layer and the sealing member are mainly composed of silicon oxide, the infiltration of moisture is less than when the sealing member is made of other materials such as a resin film. It will be suppressed. Thus, a highly reliable electrophoretic display device can be easily manufactured.

In the method of manufacturing an electrophoretic display device, the sealing member includes a display surface protection unit that covers a display surface side of the electrophoretic layer, and a frame portion that surrounds at least the side portion of the electrophoretic layer, In the sealing step, a protective substrate for the display surface protection portion is disposed on the electrophoretic sheet, and the base material for the frame portion is at least in plan view between the protective substrate and the element substrate. The electrophoretic layer is disposed so as to surround, and the element substrate and the base material are welded using heat or light, and the base material and the protective substrate are welded.
According to the present invention, when the sealing member has the display surface protection portion that covers the display surface side of the electrophoretic layer and the frame portion that surrounds at least the side portion of the electrophoretic layer, the display surface protection is performed in the sealing step. The protective substrate for the part is arranged on the electrophoretic sheet, and the base material for the frame part is arranged between the protective substrate and the element substrate so as to surround at least the electrophoretic layer in plan view, and using heat or light Since the element substrate and the base material are welded and the base material and the protective substrate are welded, even when a sealing member is configured using a plurality of members, it has excellent moisture resistance and is reliable. A high electrophoretic display device can be easily manufactured.

In the method for manufacturing an electrophoretic display device, a paste-like member having particles containing the silicon oxide and a binder that holds the particles and evaporates by receiving the heat or the light is used as the substrate. It is characterized by.
According to the present invention, a paste-like member having particles containing silicon oxide and a binder that holds the particles and evaporates when receiving heat or light is used as the frame base material. A base material can be easily disposed between the substrate and the protective substrate, and the base material can be disposed without a gap.

The method for manufacturing an electrophoretic display device is characterized in that a member having the silicon oxide as a main component and having a shape matching at least a part of a region where the frame portion is disposed is used as the base material. .
According to the present invention, the element substrate and the protective substrate are formed by using a member having a shape that includes silicon oxide as a main component and has a shape that coincides with at least a part of the region in which the frame portion is disposed. Positioning at the time of disposing the base material between them becomes easy. As a configuration having a shape that matches a part of the region in which the frame portion is arranged, for example, an L-shaped member having a shape of a planar view corner portion of the frame portion can be cited.

In the method of manufacturing an electrophoretic display device, the base material has a shape that matches a region where the frame portion is disposed.
According to the present invention, since the base material for the frame portion has a shape that matches the region where the frame portion is arranged, the alignment when arranging between the element substrate and the protective substrate is further increased. It can be done easily.

In the method for manufacturing an electrophoretic display device, a linear member containing silicon oxide as a main component is used as the base material, and the linear member is formed along a region including the electrophoretic layer in the sealing step. It is characterized by arranging a plurality.
According to the present invention, a linear member mainly composed of silicon oxide is used as a base material for a frame portion, and in the sealing step, a plurality of linear members are arranged along a region including the electrophoretic layer. Therefore, the linear member can be easily disposed between the element substrate and the protective substrate so as to correspond to the size of the region including the electrophoretic layer.

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a plan view showing a schematic configuration of an electrophoretic display device 1 according to the present embodiment. FIG. 2 is a diagram showing a configuration along the section AA in FIG.

  As shown in FIGS. 1 and 2, the electrophoretic display device 1 includes an element substrate 2, an electrophoretic sheet 3, and a sealing member 50. An electrophoretic sheet 3 is attached to the surface of the element substrate 2, and a sealing member 50 is provided so as to cover the electrophoretic sheet 3. In the electrophoretic display device 1, the electrophoretic sheet 3 is sealed by the element substrate 2 and the sealing member 50. A flexible substrate F (see FIG. 1) is attached to one side of the element substrate 2. The flexible substrate F has a circuit (not shown) that drives the electrophoretic display device 1 and is connected to the element substrate 2 via, for example, a terminal (not shown).

  The electrophoretic display device 1 is provided with a display area 5 for displaying images such as still images and moving images. A plurality of pixels arranged in a matrix are provided in the display area 5, and display is performed for each pixel. A region 6 around the display region 5 is a non-display region 6 where no image is displayed. In the non-display area 6, the vertical conduction member 10 and the wiring members 8 a to 8 c are provided.

The wiring members 8a to 8c are made of a highly conductive material such as a metal such as aluminum or ITO (Indium Tin Oxide).
The wiring member 8 a is a wiring connected to the vertical conduction member 10, and is routed from the upper side to the right side in the drawing of the element substrate 2 along the outer periphery of the display region 5. The wiring member 8a is connected to the flexible substrate F through the connection portion 9a.
The wiring member 8b is a wiring connected to the display area 5, and is connected to the flexible substrate F via the connection portion 9b.
The wiring member 8 c is a wiring connected to the display area 5, and is routed from the lower side to the right side in the drawing of the element substrate along the outer periphery of the display area 5. The wiring member 8c is connected to the flexible substrate F through the connection portion 9c.

  The element substrate 2 includes a substrate 20 having light transparency and a thickness of, for example, about 30 μm to 100 μm, and an element formation layer 21 including pixel electrodes, switching elements, and the like. As the substrate 20, in this embodiment, a substrate mainly composed of silicon oxide such as a glass substrate or a quartz substrate can be used. By using silicon oxide as a main component, the penetration of moisture can be suppressed as compared with the case where the substrate 20 is made of a resin material such as an acrylic substrate.

  The element formation layer 21 is formed in a region including the display region 5 in the substrate 20. The element formation layer 21 includes pixel electrodes 25 and switching elements 26 provided in each pixel, data lines and scanning lines (not shown) connected to the switching elements 26, and these parts are covered with an insulating layer 24. It has been broken. The insulating layer 24 is provided over the entire range of the display area 5 on the element substrate 2 in a plan view and is provided so as to protrude from a part of the non-display area 6. The wiring members 8 a to 8 c provided in the non-display area 6 are covered with a portion of the insulating layer 24 that protrudes from the non-display area 6 and is protected by the protruding portion of the insulating layer 24. ing.

The electrophoretic sheet 3 has a transparent substrate 30, a common electrode 35, an electrophoretic layer 31, and an adhesive layer 33.
The transparent substrate 30 has a thickness of, for example, about 25 μm to 200 μm and holds the electrophoretic layer 31. For example, the transparent substrate 30 has high light transmittance such as polyethylene terephthalate (PET), polyethersulfone (PES), polycarbonate (PC), and the like. A rectangular substrate made of a material. The surface 30 a side of the transparent substrate 30 is the display surface side of the electrophoretic display device 1.

  The common electrode 35 is formed almost on the entire inner surface 30 b of the transparent substrate 30. The common electrode 35 is made of a conductive material having high light transmission, such as ITO, and is connected to the element substrate 2 by the vertical conduction member 10.

The electrophoretic layer 31 has a plurality of microcapsules 32.
The microcapsule 32 is a substantially spherical capsule in which an electrophoretic dispersion is enclosed, and the diameter of each capsule is substantially the same (30 μm to 100 μm). Examples of the material for forming the capsule wall film of the microcapsule 32 include compounds such as a gum arabic / gelatin composite film, urethane resin, urea resin, and urea resin. The electrophoretic dispersion liquid enclosed in the microcapsule 32 includes a plurality of electrophoretic particles and a liquid layer dispersion medium for dispersing the electrophoretic particles.

  Examples of the liquid layer dispersion medium include water, alcohol solvents, various esters, ketones, aliphatic hydrocarbons, alicyclic hydrocarbons, aromatic hydrocarbons, halogenated hydrocarbons, carboxylates, and other various oils. It is possible to use a mixture of a surfactant or the like alone or a mixture thereof.

  As the electrophoretic particles, organic or inorganic particles (polymer or colloid) having a property of moving by electrophoresis due to a potential difference in a liquid phase dispersion medium can be used. Specifically, black pigments such as carbon black and aniline black, white pigments such as titanium dioxide, monoazo azo pigments, yellow pigments such as isoindolinone, monoazo azo pigments, red pigments such as quinacridone red, phthalocyanine One or more of blue pigments such as blue and green pigments such as phthalocyanine green can be used. These pigments include electrolytes, surfactants, metal soaps, resins, rubbers, oils, varnishes, charge control agents composed of particles such as compounds, titanium-based coupling agents, aluminum-based coupling agents, silanes as necessary. A dispersant such as a system coupling agent, a lubricant, a stabilizer, and the like can be added.

  In the microcapsule 32, for example, two types of electrophoretic particles of titanium dioxide which is a white pigment and carbon black which is a black pigment are encapsulated, one of which is negatively charged and the other of which is positively charged. Of course, other electrophoretic particles may be used, or only one type of electrophoretic particle may be used, and the electrophoretic particles may be moved to the common electrode side or the pixel electrode side so that display can be performed.

  The adhesive layer 33 is an adhesive that also serves as a binder. The adhesive layer 33 is preferably an adhesive having good affinity for the capsule wall film of the microcapsule 32, excellent adhesion to the common electrode and the pixel electrode, and good insulation.

The sealing member 50 has a cover glass 4 and a frame member 7.
The cover glass 4 constitutes a display surface protection unit that protects the display surface side of the electrophoretic sheet 3 in the sealing member 50. The cover glass 4 is made of, for example, a light-transmitting substrate. In this embodiment, a substrate mainly composed of silicon oxide such as a glass substrate or a quartz substrate is used. By using silicon oxide as a main component, the penetration of moisture can be suppressed as compared with the case where the cover glass 4 is made of another material such as a resin film. A configuration in which a moisture-proof film (not shown), a buffer member, or the like is disposed between the cover glass 4 and the electrophoretic sheet 3 may be used.

  The frame member 7 constitutes a frame portion that surrounds at least the electrophoretic sheet 3 in the sealing member 50. As shown in FIG. 1, the frame member 7 is provided along the peripheral edge of the cover glass 4 in a plan view, and is provided so as to surround a region where the insulating layer 24 is formed. That is, the frame member 7 is provided outside the display area 5 and the wiring members 8a to 8c area in plan view.

  As shown in FIG. 2, the frame member 7 is disposed between the element substrate 2 and the cover glass 4 in a cross-sectional view. The frame member 7 and the element substrate 2 and the frame member 7 and the cover glass 4 are joined by welding. As described above, since the frame member 7 and the wiring members 8a to 8c are arranged at positions shifted in plan view, the influence of heat during welding hardly affects the wiring members 8a to 8c. .

  A space surrounded by the element substrate 2, the cover glass 4, and the frame member 7 in the electrophoretic display device 1 is in a sealed state. The electrophoretic sheet 3, particularly the electrophoretic layer 31, disposed in the sealed space is in a state of being sealed by the element substrate 2, the cover glass 4, and the frame member 7. Since these are bonded by welding rather than an adhesive, these bonded portions are excellent in adhesion.

  As a material constituting the frame member 7, a material mainly composed of silicon oxide such as glass or quartz is used in the present embodiment. By using silicon oxide as a main component, the penetration of moisture can be suppressed as compared with the case where the frame member 7 is made of another material, for example, a resin material. In the present embodiment, the substrate 20, the cover glass 4 and the frame member 7 are all made of a material mainly composed of silicon oxide. It is preferable that the same material is used for the substrate 20, the cover glass 4, and the frame member 7 out of materials mainly composed of silicon oxide.

  The frame member 7 is in a state of intersecting the connection portions 9a to 9c of the wiring members 8a to 8c on the right side in FIG. The frame member 7 has an opening 7a at an intersection with the wiring members 8a to 8c. By providing the opening 7a, the frame member 7 and the wiring members 8a to 8c are separated from each other, so that the influence of heat at the time of welding the frame member 7 reaches the connection portions 9a to 9c. It has become difficult. The opening 7a is provided with a sealing material 7b for sealing the opening 7a. As a material constituting the sealing material 7b, a material having high moisture resistance such as a resin material or an inorganic material is preferably used.

Next, the operation of the electrophoretic display device 1 configured as described above will be briefly described.
When a voltage is applied between the pixel electrode 25 and the common electrode 35 so that the voltage of the common electrode 35 becomes relatively high, the positively charged black electrophoretic particles are out of the pixels in the microcapsule 32 by the Coulomb force. It is drawn toward the electrode 25 side. On the other hand, negatively charged white electrophoretic particles are attracted toward the common electrode 35 in the microcapsule 32 by Coulomb force. As a result, white electrophoretic particles gather on the transparent substrate 30 side in the microcapsule 32, and the color (white) of the white electrophoretic particles is displayed in the display area 5 of the electrophoretic display device 1. The Rukoto.

  On the contrary, when a voltage is applied between the pixel electrode 25 and the common electrode 35 so that the potential of the pixel electrode 25 becomes relatively high, the negatively charged white electrophoretic particles are moved to the pixel electrode 25 side by Coulomb force. Be drawn to. On the other hand, the positively charged black electrophoretic particles are attracted toward the common electrode 35 by the Coulomb force. As a result, black electrophoretic particles gather on the transparent substrate 30 side in the microcapsule 32, and the color (black) of the black electrophoretic particles is displayed in the display area 5 of the electrophoretic display device 1. It will be.

Next, a method for manufacturing the electrophoretic display device 1 configured as described above will be described with reference to FIGS.
First, the wiring of the wiring members 8a to 8c and the element forming layer 21 are arranged on the substrate 20 to form the element substrate 2, and the electrophoretic sheet 3 is bonded to the display region 5 of the element substrate 2 (bonding) Process). After the electrophoretic sheet 3 is bonded, a sealing process for sealing the electrophoretic sheet 3 is performed.

  In the sealing step, first, as shown in FIG. 3, the adhesive layer 11 is formed on the surface 30 a of the transparent substrate 30 of the electrophoretic sheet 3, and the cover glass 4 as a protective substrate is disposed on the adhesive layer 11. Note that a moisture-resistant film or a buffer member may be disposed on the electrophoretic sheet 3 before the cover glass 4 is disposed.

  After disposing the cover glass 4, as shown in FIG. 4, a paste-like member 60 is disposed between the substrate 20 and the cover glass 4 along the peripheral edge of the cover glass 4 in plan view. The paste-like member 60 is a base material for a frame portion that is welded to the element substrate 2 and the cover glass 4 to form the frame member 7. The paste-like member 60 includes, for example, particles containing silicon oxide and a binder that holds the particles. For the binder, for example, a material that evaporates upon receiving laser light is used. In this step, the paste-like member 60 is arranged without a gap between the substrate 20 and the cover glass 4. Moreover, it arrange | positions so that the part used as the opening part 7a of the frame member 7 may be vacated.

  After arranging the paste-like member 60, the paste-like member 60 is irradiated with laser light L as shown in FIG. The binder contained in the paste-like member 60 evaporates upon receiving the laser beam L. The silicon oxide particles contained in the paste-like member 60 are dissolved by the laser light L, and are integrated in a state where the particles are dissolved, and in this state, the particles are bonded to the cover glass 4 and the element substrate 2. By cooling the joint portion, the frame member 7 in a state of being welded to the element substrate 2 and the cover glass 4 is formed. After the frame member 7 is formed, the opening 7a is closed with the sealing material 7b. By forming the frame member 7 and the sealing material 7b, the electrophoretic layer 31 is sealed.

After forming the frame member 7, as shown in FIG. 6, the surfaces of the element substrate 2 and the cover glass 4 are polished, and the thicknesses of the element substrate 2 and the cover glass 4 are adjusted. Specifically, polishing is performed using a polishing method or a CMP method. For example, mechanical polishing may be performed using a polishing member 61 as shown in FIG. Either the element substrate 2 or the cover glass 4 may be polished first. The element substrate 2 and the cover glass 4 are preferably polished so that the thicknesses thereof are substantially the same. The thicknesses of the element substrate 2 and the cover glass 4 after polishing are preferably set to 30 μm to 100 μm, for example.
In this way, the electrophoretic display device 1 is manufactured.

  According to this embodiment, since both the element substrate 2 and the sealing member 50 that seal the electrophoretic layer 31 are mainly composed of silicon oxide, the moisture content is higher than that in the case of sealing with another material such as a resin film. Intrusion of water is suppressed. In addition, since the sealing member 50 is welded to the element substrate 2, the adhesiveness of the joint portion between the element substrate 2 and the sealing member 50 is improved as compared with the case where the sealing member 50 is adhered by an adhesive. By adopting such a structure with excellent moisture resistance, the electrophoretic display device 1 with high reliability can be obtained.

  According to the present embodiment, the sealing member 50 includes the cover glass 4 that covers the display surface side of the electrophoretic layer 31 and the frame member 7 that surrounds at least the side portion of the electrophoretic layer 31. In the process, the cover glass 4 is disposed on the electrophoretic sheet 3, the paste-like member 60 is disposed between the cover glass 4 and the element substrate 2 so as to surround at least the electrophoretic layer 31 in plan view, and the laser beam L The element substrate 2 and the paste-like member 60 are welded together with the paste-like member 60 and the cover glass 4, so that the sealing member 50 is configured using a plurality of members. However, the electrophoretic display device 1 having excellent moisture resistance and high reliability can be easily manufactured.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
FIG. 7 is a plan view showing the configuration of the electrophoretic display device 101 according to the present embodiment. FIG. 8 is a diagram showing a configuration along the BB cross section in FIG. 7.

  As shown in FIGS. 7 and 8, in the present embodiment, a parting member 62 is provided around the display region 5 of the element substrate 2, and a frame is formed so as to surround the parting member 62 outside the parting member 62. The member 7 is provided. Other configurations are the same as those of the first embodiment.

  The parting member 62 is made of a material such as resin, and is a light-shielding member provided so as to surround the display region 5 of the element substrate 2. Specifically, as shown in FIG. 8, the parting member 62 is provided so as to overlap a part of the insulating layer 24 that protrudes from a part of the non-display area 6. A region where the parting member 62 is provided in a plan view is a parting region.

  The parting member 62 is provided so as to be in contact with the side portion of the electrophoretic sheet 3, for example, and is provided so as to cover both the side portion of the electrophoretic layer 31 and the side portion of the transparent substrate 30. The upper end portion of the parting member 62 in the drawing is provided so as to contact the cover glass 4. The parting member 62 is in a state of sealing the electrophoretic layer 31 by being in close contact with the side portion of the electrophoretic layer 31.

  In a region where the protruding portion of the insulating layer 24 is provided in plan view, wiring members 8a to 8c are arranged on the lower layer side of the protruding portion. Since the parting member 62 is provided on the upper layer side of the region, the wiring members 8 a to 8 c are covered with the parting member 62 provided on the insulating layer 24. For this reason, the wiring members 8a to 8c are not visually recognized from the display surface side.

  When the electrophoretic display device 101 configured as described above is manufactured, the parting member 62 is formed so as to surround the electrophoretic sheet 3 after the electrophoretic sheet 3 is attached to the element substrate 2. . As for the other steps, the same steps as the manufacturing steps described in the first embodiment are performed.

  Thus, according to the present embodiment, the element substrate 2 has the parting member 62 that surrounds the display region 5, and the frame member 7 is provided outside the parting member 62 in plan view. It can be avoided that the color of the member 7 affects the display. For this reason, the range of selection about the structure of the frame member 7 can be expanded, for example, the frame member 7 is colored.

  Specifically, the sealing member 50 can be configured such that the frame member 7 is colored, for example, black or brown so that the absorption rate with respect to the laser light used for welding is highest in the frame member 7. Accordingly, when the frame member 7 is welded to the element substrate 2 using laser light, the light can be efficiently absorbed by irradiating the frame member 7 with the laser light. Thereby, welding can be performed more efficiently.

  Furthermore, according to the present embodiment, the element substrate 2 includes the parting member 62 that surrounds the display region 5, and the wiring members 8 a to 8 c are provided at positions overlapping the parting member 62 in plan view. ˜8c can be avoided from being visually recognized from the display surface side. In addition, since the frame member 7 is provided outside the region in which the parting member 62 and the wiring members 8a to 8c are provided, when the frame member 7 and the element substrate 2 are welded, there is an influence of heat due to welding. Directly reaching the parting member 62 and the wiring members 8a to 8c can be prevented.

The technical scope of the present invention is not limited to the above-described embodiment, and appropriate modifications can be made without departing from the spirit of the present invention.
In the said embodiment, although it was set as the structure which has the cover glass 4 and the frame member 7 as the sealing member 50, it is not restricted to this, For example, the shape of the sealing member 50 is the cover glass 4 and the frame member 7. The present invention can be applied even to a dome shape or the like without distinction.

  Moreover, in the said embodiment, although the frame member 7 was the structure which has the opening part 7a in the part which cross | intersects the wiring members 8a-8c, it is not restricted to this, For example, it is the structure which does not provide the opening part 7a. It doesn't matter. Moreover, as a structure of the opening part 7a, only a part of the lower side in the thickness direction (vertical direction in FIG. 2) of the frame member 7 is removed, for example, in a region where the connection parts 9a to 9b are provided in plan view. The structure may be sufficient, and the structure from which the whole thickness direction of the frame member 7 was removed among the said area | regions may be sufficient.

  In the above embodiment, the paste member 60 is used when forming the frame member 7 in the manufacturing process of the electrophoretic display devices 1 and 101. However, the present invention is not limited to this. For example, FIG. As shown to a), the structure which arrange | positions the frame-shaped member 64 which has the same shape in planar view with the shape of the area | region in which the frame member 7 is provided may be sufficient.

  Moreover, as shown in FIG.9 (b), you may be the structure which arrange | positions the linear linear member 65, such as a fiber which has silicon oxide as a main component. Depending on the shape of the region where the linear member 65 and the frame member 7 are provided, for example, a plurality of combinations can be arranged without gaps. Specifically, when the linear member 65 is used, the linear member 65 can be disposed along the four sides of the electrophoretic layer 31.

  Moreover, it is not restricted to the frame-shaped member 64 corresponding to the whole area | region where the frame member 7 is arrange | positioned, As a shape corresponding to a part of the said area | region, it has silicon oxide as a main component as shown in FIG.9 (c). The configuration may be such that the L-shaped member 66 or the like is disposed. When the L-shaped member 66 is used, the two orthogonal sides of the L-shaped member 66 can be arranged so as to correspond to two of the four sides of the electrophoretic layer 31.

  The frame-shaped member 64, the linear member 65, and the L-shaped member 66 include a wide range of cross-sectional shapes such as a curve including a circle, a triangle, and a polygon including a rectangle. Shaped ones can be used.

  Moreover, in the said embodiment, when welding the frame member 7, although the method of welding using a laser beam was mentioned as an example, it is not restricted to this, For example, the method of welding by heat is employ | adopted. It doesn't matter. In this case, it is preferable to use a material that evaporates by heat as a constituent material of the binder of the paste-like member 60.

  Moreover, in the said embodiment, although the structure of the electrophoretic display device 1 was mentioned as an example as an example of the display apparatus in which moisture resistance is calculated | required, it is not restricted to this, The other display apparatus in which moisture resistance is calculated | required For example, the same effect can be obtained even if the present invention is applied to an EL device such as an organic EL device or an inorganic EL device.

1 is a plan view showing a configuration of an electrophoretic display device according to a first embodiment of the present invention. FIG. 3 is a cross-sectional view showing the configuration of the electrophoretic display device according to the embodiment. FIG. 5 is a process diagram illustrating a manufacturing process of an electrophoretic display device. The process drawing. The process drawing. The process drawing. The top view which shows the structure of the electrophoretic display device which concerns on 2nd Embodiment of this invention. FIG. 3 is a cross-sectional view showing the configuration of the electrophoretic display device according to the embodiment. FIG. 3 is a diagram illustrating a partial configuration of an electrophoretic display device according to the invention.

Explanation of symbols

  F ... Flexible substrate 1, 101 ... Electrophoretic display device 2 ... Element substrate 3 ... Electrophoresis sheet 4 ... Cover glass 5 ... Display region 6 ... Non-display region 7 ... Frame member 7a ... Opening 7b ... Sealing material 8a-8c DESCRIPTION OF SYMBOLS ... Wiring member 9a-9c ... Connection part 20 ... Board | substrate 24 ... Insulating layer 31 ... Electrophoresis layer 33 ... Adhesion layer 35 ... Common electrode 50 ... Sealing member 60 ... Paste-like member 61 ... Polishing member 62 ... Parting member 64 ... Frame -Shaped member 65 ... linear member 66 ... L-shaped member

Claims (14)

An element substrate having a display region for displaying an image and mainly composed of silicon oxide;
An electrophoretic sheet having a transparent substrate, an electrophoretic layer and an adhesive layer, and bonded to the display region of the element substrate via the adhesive layer;
An electrophoretic display device comprising: a sealing member comprising silicon oxide as a main component, welded to the element substrate, and sealing at least the electrophoretic layer with the element substrate. The sealing member has a frame portion that surrounds at least the electrophoretic layer in a plan view,
The electrophoretic display device according to claim 1, wherein the frame portion is welded to the element substrate. The element substrate has a wiring member provided along the outer periphery of the display area,
The electrophoretic display device according to claim 2, wherein the frame portion is provided outside a region where the wiring member is provided in a plan view. The wiring member is provided so as to intersect the frame portion,
The electrophoretic display device according to claim 2, wherein the frame has an opening at an intersection with the wiring member. The element substrate has a parting member surrounding the display area,
The electrophoretic display device according to any one of claims 2 to 4, wherein the frame portion is provided outside the parting member in a plan view. The electrophoretic display device according to claim 5, wherein the sealing member has the highest absorption rate for light used for welding in the frame portion. The element substrate has a parting member surrounding the display area,
The wiring member is provided at a position overlapping the parting member in plan view,
The electrophoretic display device according to claim 3, wherein the frame portion is provided outside a region where the parting member and the wiring member are provided. The sealing member has a display surface protection part disposed on the display surface side of the electrophoretic layer,
The electrophoretic display device according to any one of claims 1 to 7, wherein the display surface protection portion and the frame portion are welded. A bonding step of bonding an electrophoretic sheet having a transparent substrate, an electrophoretic layer, and an adhesive layer to a display region of an element substrate mainly composed of silicon oxide via the adhesive layer;
After the bonding step, a sealing step of welding a sealing member mainly composed of silicon oxide to the element substrate and sealing at least the electrophoretic layer between the sealing member and the element substrate; An electrophoretic display device manufacturing method comprising: The sealing member has a display surface protection part that covers the display surface side of the electrophoretic layer, and a frame part that surrounds at least the side part of the electrophoretic layer,
In the sealing step,
A protective substrate for the display surface protection unit is disposed on the electrophoresis sheet,
The base material for the frame portion is disposed so as to surround at least the electrophoretic layer in a plan view between the protective substrate and the element substrate,
The method for manufacturing an electrophoretic display device according to claim 9, wherein the element substrate and the base material are welded using heat or light, and the base material and the protective substrate are welded. As the substrate,
11. The manufacturing of an electrophoretic display device according to claim 10, wherein a paste-like member having particles containing the silicon oxide and a binder that holds the particles and evaporates by receiving the heat or the light is used. Method. As the substrate,
11. The method for manufacturing an electrophoretic display device according to claim 10, wherein a member having the silicon oxide as a main component and having a shape matching at least a part of a region where the frame portion is disposed is used. The method for manufacturing an electrophoretic display device according to claim 12, wherein the base material has a shape that matches a region where the frame portion is disposed. As the base material, using a linear member mainly composed of the silicon oxide,
The method for manufacturing an electrophoretic display device according to claim 10, wherein in the sealing step, a plurality of the linear members are arranged along a region including the electrophoretic layer.

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