JP2009283472A - Method of manufacturing led unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an LED unit excellent in practicality and economical efficiency. <P>SOLUTION: The method of manufacturing the LED unit includes: the first step of arranging a plurality of metal plates in a spaced manner each other so as to be in a substantially annular shape or substantially C-shape as a whole; the second step of supporting LED chips on the surfaces of the metal plates to constitute LED elements; a third step of electrically connecting in a predetermined series order to the LED elements so that a loop of the electric connection is broken at least one place; a fourth step of molding and attaching a translucent member with electric insulation on the surfaces of the metal plates so that the rear surfaces of the metal plates are protruded; and a fifth step of molding and attaching a translucent member with electric insulation or a base member on the rear surfaces of the metal plates. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an LED unit.

  The LED unit usually includes one or a plurality of LED chips (elements). In most cases, a printed circuit board on which a predetermined circuit pattern is formed is prepared by etching the copper foil attached to the entire surface of the insulating substrate, and the LED chip is supported at a predetermined position of the circuit pattern. However, the thickness of the copper foil is generally about 35 μm, and it is not suitable at all for mounting high-intensity LED chips, especially many, and even if special heat dissipation means is added, the temperature of the LED chips is increased. Is unavoidable, and the emission luminance is greatly reduced and the lifetime is shortened. Therefore, it is difficult to adapt to an application that requires a total luminous flux of about 5000 to 10,000 lumens, such as main lighting in a general living room. Further, when the copper foil is etched, the removed copper is wasted, and so-called material loss is greatly generated. If an annular LED unit is to be manufactured, it is necessary to greatly punch out the central portion of the insulating substrate, resulting in a large material loss. By the way, there exists what was disclosed by patent document 1 as a cyclic | annular LED unit which does not use what is called a printed circuit board. However, even in the electrode pattern used in the LED unit, as shown in FIG. 3 of the gazette, the central portion is formed in a ring shape with a large diameter punched out. According to Patent Document 2, an annular LED unit is disclosed. Further, according to Patent Document 3, an LED element is disclosed.

No. 7-23969 JP 2004-335426 A JP 2006-134992 A

  Therefore, the LED units or LED elements disclosed in Patent Documents 1 to 3 do not disclose any method that can easily manufacture an annular LED unit. In view of such problems to be solved, an object of the present invention is to provide a method for easily producing an annular LED unit that is practical and economical.

Next, representative inventions that achieve the above-described object will be summarized.
According to a first aspect of the present invention, there is provided a first step in which a plurality of metal plates are arranged apart from each other so as to form a substantially ring shape or a substantially C shape as a whole, and LED elements are supported on the surface side of each of the metal plates with an LED element. A third step of electrically connecting the LED elements to each LED element in a predetermined series order so that the electrical connection loop is interrupted in at least one place, and the back side of the metal plate is projected. A fourth step of forming and attaching an electrically insulating translucent member to the surface side of the metal plate, and a fifth step of forming and attaching an electrically insulating translucent member or base member to the back side of the metal plate. The manufacturing method of the LED unit provided with these.
According to a second aspect of the present invention, there is provided a first step in which a plurality of LED elements including a metal plate previously supporting an LED chip on the surface side are arranged apart from each other so as to form a substantially ring shape or a substantially C shape as a whole, and each LED element And a second step of electrically connecting in a predetermined series order so that the loop of electrical connection is interrupted at least at one place, and electrical insulation on the surface side of the metal plate so that the back side of the metal plate protrudes The LED unit manufacturing method includes a third step of forming and attaching the translucent member, and a fourth step of forming and attaching the electrically insulating translucent member or the base member to the back side of the metal plate. .

  According to the manufacturing method of the LED unit of 1st invention and 2nd invention, there exists an effect that an LED unit can be manufactured easily.

Sectional drawing which shows one Embodiment of the lighting fixture for ceilings Bottom view with the globe removed Sectional drawing and partial enlarged view which show embodiment of LED unit Bottom view of FIG. Bottom perspective view showing an embodiment of an LED unit Partial longitudinal sectional view showing an embodiment of an LED unit Partial cross-sectional view showing an embodiment of an LED unit (A)-(E) are process drawings which show the manufacturing method example of an LED unit in order. (A) Top view of the first mold used in the manufacturing method, (B) Top view of the third mold used in the manufacturing method (A) Partial expanded sectional view which shows the state which attached the LED unit to the main body (2nd main body) of a lighting fixture, (B) The perspective view which shows the lead wire connected to the terminal and terminal of the same connector A cross-sectional view near the top surface of FIG. Partial longitudinal sectional view showing another embodiment of the LED unit Partial longitudinal sectional view showing still another embodiment of the LED unit Partial longitudinal sectional view showing still another embodiment of the LED unit Partial cross-sectional view showing still another embodiment of the LED unit Partial longitudinal sectional view showing still another embodiment of the LED unit Partial longitudinal sectional view showing still another embodiment of the LED unit Partial longitudinal sectional view showing still another embodiment of the LED unit Partial longitudinal sectional view showing still another embodiment of the LED unit Bottom perspective view showing still another embodiment of the LED unit Bottom perspective view showing still another embodiment of the LED unit Bottom perspective view showing still another embodiment of the LED unit Bottom perspective view showing still another embodiment of the LED unit Furthermore, the fragmentary sectional view which shows the state which attached the LED unit of other embodiment to the main body (2nd main body) of a lighting fixture. The circuit block diagram which shows one Embodiment of the lighting control circuit part of a LED unit

  Next, an embodiment of the present invention will be described. However, this is merely an exemplary embodiment adopted based on the present invention, and the present invention should not be limitedly interpreted based on matters specific to the embodiment. The technical scope of the present invention should be determined based on the matters shown in the claims of the claims and matters substantially equivalent to the matters.

  First, the ceiling lighting apparatus shown in FIGS. 1 and 2 will be described. This lighting fixture includes a metal first main body 1 that is provided on the ceiling C side and constitutes the main body, and a metal second main body that is attached to the lower surface of the first main body 1 with attachment means such as screws 2 and constitutes the main body. 3, preferably the LED unit 4 that is in contact with the lower surface of the second body 3 and attached by means of screws 2 or the like, and is housed in the upper space of the second body 3, for example, provided on the lower surface of the first body 1. The lighting control circuit unit 5 for the LED unit 4 and the globe 6 made of a translucent material (for example, synthetic resin) attached near the outer peripheral portion of the first main body 1 and covering the LED unit 4 are provided.

  As a material of the first main body 1 and the second main body 3, for example, iron, aluminum or the like is used. At least the lower surface side of the first main body 1 and the second main body 3 is formed with a thin film such as a white paint film, a resin coating film, or a ceramic film to have light reflectivity, and the light reflectivity is, for example, 90% or more. . The heat generated by the LED unit 4 is radiated to the first main body 1 and the second main body 3 to suppress the temperature rise of the LED unit 4. A glove support or the like (not shown) is provided on the peripheral surface of the lower surface of the first main body 1, and the glove 6 is detachably supported thereto. A hole 7 is formed in the approximate center of the second body 3. The first main body 1 has a larger diameter than the second main body 3, and a hole 8 is formed at substantially the center thereof, and the vicinity of the hole 8 has a step shape formed lower than the outer peripheral side portion. . In addition, a remote control signal receiver 9 protruding from the lighting control circuit 5 is passed through the second main body 3. The remote control signal receiving unit 9 may be disposed on the upper surface side of the second main body 3, and a hole corresponding to the remote control signal receiving unit 9 may be formed in the second main body 3. A passable resin plate or the like may be attached.

  The main body including the first main body 1 and the second main body 3 is provided with a mounting mechanism to the ceiling C at a substantially central portion, and the LED unit 4 is provided on the lower surface of the main body so as to avoid the mounting mechanism. Is. Next, the attachment mechanism will be described. A hooking rosette 10 is fixed to the ceiling C, and the lighting fixture is attached to the hooking rosette 10. The hooking rosette 10 exemplifies a type having a hook-like locking portion 11 at the lower end thereof. A fixture 12 having an annular shape, for example, is fixed to the lower surface of the stepped portion near the center of the first main body 1, and a substantially inverted L-shaped locked portion 13 is moved toward the center hole by a spring 14 on the back side. The lighting fixture is attached to the ceiling C in a so-called direct-attached state by being biased and locking the lower surface of the distal end of the locked portion 13 to the upper surface of the locking portion 11.

  In order to attach this lighting fixture, it is good to push up this lighting fixture in the state without the globe 6 after aligning the hole 8 with respect to the hook rosette 10. As a result, the locked portion 13 whose upper surface at the tip is inclined with respect to the locking portion 11 whose lower surface is an inclined surface retreats against the urging direction of the spring 14, and then the locked portion 13 as shown in FIG. Is locked to the upper surface of the locking portion 11. Then, the hooking plug 15 that feeds power to the lighting control circuit unit 5 is inserted into a pair of power supply arc holes (not shown) on the lower surface of the hooking rosette 10 and rotated by a predetermined angle to receive power. The received AC power is supplied to the lighting control circuit unit 5 through the cord 16. Further, in order to remove the lighting fixture, the hooking plug 15 is removed from the hooking rosette 10 by rotating in the opposite direction from the hooking rosette 10, and then the hooking plug 15 protrudes from the hole 17 on the lower surface of the fixture 12. The operation unit 18 formed downward may be retracted outward with a finger.

  In addition, the ceiling mounting mechanism of the lighting fixture illustrated above is only an example, and the lighting fixture can be attached to the ceiling via a removable adapter on the lower surface of a general square or round hook rosette fixed to the ceiling. Various attachment mechanisms such as attaching a lighting fixture to a fixed metal fitting or attaching a lighting fixture to a ceiling with a screw can be adopted.

  Next, the LED unit 4 will be described with reference to FIGS. The LED unit 4 includes a plurality of LED elements 23 including a metal plate 22 on which the LED chip 21 is supported. These LED elements 23 are arranged in a substantially annular or substantially C shape as a whole in a state where adjacent metal plates 22 and 22 are separated from each other, and each LED element 23 uses a metal wire 24 such as gold or aluminum. The electrical connection is performed in a predetermined serial order, but the electrical connection loop is interrupted in at least one place. The disconnected portion is electrically connected to the pair of external terminals 25 and 26, and each LED element 23 is fixed to an electrically insulating translucent member 27 such as a ring-shaped epoxy resin or other synthetic resin, A window hole 28 is formed at the center. In FIG. 5, the translucent member 27 is interrupted on the extended line of the arrow X, and even if the translucent member 27 is substantially C-shaped, there is no particular influence on the optical performance. Twist is likely to occur when handled alone, which is not preferable in terms of strength. Each metal plate 22 is formed by cutting a metal base plate having a predetermined large area such as a metal hoop material (not shown). If each metal plate 22 has a substantially rectangular shape, the metal plate 22 is cut without substantial material loss. It can be formed and is extremely practical and economical. In addition, the metal plate 22 can be cut and formed into a substantially arc shape having a predetermined width in the radial direction (substantially an arc shape over a substantially semicircular circumference). Even in this case, the metal plate 22 having a substantially arc shape is cut and formed. In doing so, as long as the metal plates 22 do not overlap each other, it can be cut and formed from the metal base plate as close as possible, so that material loss can be greatly reduced compared to the past, and practical and economical. Become.

  The LED unit 4 is an example in which the LED chip 21 is supported on the metal plate 22 in a conductive state via a conductive SiC substrate (layer) (not shown). Therefore, the electrical connection in a predetermined series order is realized by repeating the connection form in which the metal wire 24 is electrically connected from the surface layer of the LED chip 21 to the adjacent metal plate 22. Although an embodiment in which one LED chip 21 is mounted on each metal plate 22 is illustrated, a plurality of metal plates 22 having a forward current / forward voltage characteristic particularly matched within a predetermined range are illustrated. If the LED chips 21 are mounted and the metal wires 24 are electrically connected to the adjacent metal plates 22 from the LED chips 21, the LED chips 21 are connected in series as a whole while being connected in parallel. Even in such a case, it is naturally included in the scope of the present invention. One external terminal 25 also serves as a metal plate 22 that supports the LED chip 21, while the other external terminal 26 uses a dedicated metal plate 22 a that does not support the LED chip 21. As shown in FIGS. 4 and 5, for example, an outer peripheral portion of the translucent member 27 is integrally provided with a mounting portion 30 having a notch 29 that opens outwardly. 2, the LED unit 4 is attached to the second body 3 by screwing into the second body 3 through the screw 2. The metal plates 22 on which the LED chips 21 are supported all have the same shape in plan view, and the metal plate 22a dedicated to the terminals also has the same shape in plan view before the terminals are bent. And, there is an advantage that all the metal plates 22 and 22a can be cut and formed by using the cutting means having the same tooth shape. Further, instead of forming the external terminal 25 on the metal plate 22 on which the LED chip 21 is supported, a metal plate dedicated to the external terminal may be separately provided in the vicinity of the metal plate 22. Furthermore, the insulation-coated wires electrically connected to the metal plates 22 and 22a may be pulled out from the LED unit 4 without bending the external terminals 25 and 26 in the first place. In this case, it is natural that the drawn insulated wire corresponds to the external terminal, and the connector 41 described later is unnecessary. However, if the connector is connected to the tip of the insulated wire, the light is turned on. This is convenient for connection to the control circuit unit 5.

  Next, the manufacturing method of the LED unit 4 is demonstrated with reference to FIG. 8 and FIG. FIGS. 8A, 8B, and 8C show a pre-process, and the mold is a first that is formed with a plurality of annular grooves, with recessed portions 31 having a predetermined shape spaced apart on the inner bottom surface thereof. A mold 32 and an annular second mold 33 that can close the opening of the first mold 32 are provided. Then, as shown in FIG. 8A, the first step of disposing the metal plates 22 (including the metal plate 22a outside the figure) in the predetermined portions of the recesses 31, and the predetermined portions of the metal plates 22, respectively. The second step of configuring the LED elements 23 by supporting the LED chips 21 respectively, and the electrical connection by the metal wires 24 in a predetermined series order so that the loop of electrical connection to each LED element 23 is interrupted at least at one place. A third step of connecting. Next, as shown in FIGS. 8B and 8C, the second mold 33 closes the opening of the first mold 32 and electrically insulates the space between the first mold 32 and the second mold 33. A fourth step of filling and molding a transparent translucent member (for example, epoxy resin) 27 is provided. As the filling molding, for example, injection molding is used. For example, a plurality of gates (not shown) are provided on the inner peripheral wall of the first mold 32, and the light-transmitting translucent member 27 is provided from the gates to the first mold. The inside of 32 may be injection molded. Next, the second mold 33 and the first mold 32 are separated by removing the second mold 33, and the LED unit 4 including each LED element 23 and the translucent member 27 that are electrically connected is separated. A fifth step of taking out the product 4a is provided.

  The first mold 32 is configured as an inner mold 32a and an outer mold 32b that are separable into an inner peripheral side and an outer peripheral side. When the outer mold 32b is displaced in the direction of the arrow in FIG. The semi-finished product 4a of the unit 4 can be easily taken out. More specifically, as shown in FIG. 9A, the outer mold 32b has a plurality of outer mold elements 32b1, 32b2 separated at least at two locations in the circumferential direction, and the semi-finished product 4a of the LED unit 4. When the plurality of outer mold elements 32b1 and 32b2 are displaced outward in the direction of the two outward arrows in the step of taking out the first mold 32, the semi-finished product 4a of the LED unit 4 can be easily taken out. It should be noted that the outer mold elements 32b1 and 32b2 may be coupled by a hinge mechanism 32c at a predetermined location adjacent thereto. The recesses 31 and the holes 25a and 26a for positioning the external terminals 25 and 26 are formed across the inner mold 32a and the outer mold element 32b1 or 32b2.

  Next, a post process is demonstrated with reference to FIG.8 (D) and (E). In this step, a third mold 34 having an annular groove and a fourth mold 35 capable of closing the opening of the third mold 34 are provided as molds. First, the semi-finished product 4a is placed upside down inside the third mold 34 as shown in FIG. 8D, and then the fourth mold 35 closes the opening of the third mold 34, The space between the semi-finished product 4a and the fourth mold 35 is provided with a sixth step of filling and molding an electrically insulating translucent member (for example, epoxy resin) as shown in FIG. As the filling molding, for example, injection molding is used. For example, several gates (not shown) are provided at height positions corresponding to the space on the inner peripheral wall of the third mold 34, and the melted state is transmitted from these gates. The optical member may be injection molded inside the third mold 34. In the seventh step, the fourth mold 35 is separated from the third mold 34 and the LED unit 4 is taken out. The fourth mold 35 is formed with holes (not shown) through which the external terminals 25 and 26 pass.

Here, as shown in FIG. 9B, the third mold 34 constitutes an inner mold 34a and an outer mold 34b that can be separated into an inner peripheral side and an outer peripheral side, and the outer mold 34b is arranged in the circumferential direction. It has a plurality of outer mold elements 34b1 and 34b2 that can be separated at least in two places. Then, in the step of taking out the LED unit 4 from the third mold 34, a plurality of outer mold elements 34b1, 34b2 are used in the two outward arrow directions in FIG. Is preferably displaced outward (in the direction of the arrow in FIG. 8E). Although this structure is the same as the structure of the first mold 32, a concave portion 30a is formed on the upper surface of the outer wall of the outer mold elements 34b1 and 34b2, and an LED is formed by a translucent member 27 filled in the concave portion 30a. When the attachment portion 30 is formed outwardly on the outer peripheral portion of the unit 4, since the hinge mechanism 32 c is provided, the formation direction of the attachment portion 30 and the opening direction of the outer mold elements 34 b 1, 34 b 2 substantially coincide with each other. There is little risk that it will be damaged without applying excessive force.
In addition, when the manufacturing method of the LED unit 4 shown above is described briefly, the first step of disposing the plurality of metal plates 22 apart from each other so as to form a substantially ring shape or a substantially C shape as a whole, and the respective metals A second step of configuring the LED elements 23 by supporting the LED chips 21 on the surface side of the plate 22, and electrical connection in a predetermined series order so that the electrical connection loop is interrupted at least at one location in each LED element 23. A third step of connecting, a fourth step of forming and attaching an electrically insulative translucent member 27 on the surface side of the metal plate 22 such that the back side of the metal plate 22 protrudes, This is nothing but a fifth step of forming and attaching an electrically insulating translucent member 27 (or a base member 51 described later) on the back surface side.

  In the first step of the previous step described above, the metal plate 22 in the LED element 23 including the metal plate 22 that previously supports the LED chip 21 may be disposed in each of the predetermined recesses 31. In this case, as a second step, electrical connection is made to each LED element 23 in a predetermined series order so that the electrical connection loop is interrupted at least at one location. Next, as a third step, an electrically insulating translucent member is filled in the space between the first mold 32 and the second mold 33 with the second mold 33 closing the opening of the first mold 32. Mold. Next, as a fourth step, the second mold 33 and the first mold 32 are separated, and the semi-finished product 4a of the LED unit 4 including the electrically connected LED element 23 and the translucent member 27 is taken out.

In the post-process described above, the semi-finished product 4a is stored upside down inside the third mold 34, and then the fourth mold 35 closes the opening of the third mold 34, and the half mold 4a is closed. A fifth step of filling and molding an electrically insulating translucent member in the space between the product 4a and the fourth die 35, and a step of separating the fourth die 35 from the third die 34 and taking out the LED unit 4 are performed. The LED unit 4 is manufactured through six steps.
In addition, if the manufacturing method of the LED unit 4 shown above is described briefly, the several LED element 23 containing the metal plate 22 which supported the LED chip 21 in the surface side beforehand so that it may comprise a substantially cyclic | annular form or a substantially C shape as a whole. A second step of electrically connecting the LED plates 23 to each LED element 23 in a predetermined series order so that an electrical connection loop is interrupted at least at one location; A third step of forming and attaching an electrically insulating translucent member 27 to the front surface side of the metal plate 22 so that the rear surface side protrudes, and an electrically insulating translucent member 27 on the rear surface side of the metal plate 22. (Or a base member 51 described later) is nothing but a fourth step of forming and adhering.

  Next, the external terminals 25 and 26 of the LED unit 4 and the connector 41 electrically connected to the external terminals 25 and 26 will be described with reference to FIGS. 10 and 11. The external terminals 25, 26 are formed by bending a part of the metal plates 22, 22 a at a substantially right angle and are exposed on the back surface of the LED unit 4. The connector 41 that is electrically connected to the external terminals 25 and 26 of the LED unit 4 is a recess 3a to the upper side (lower side in the posture of FIG. 10) provided in the second main body 3 constituting a part of the main body. Provided. When the LED unit 4 is attached to the second main body 3, the external terminals 25 and 26 are inserted into the connector 41. The case 42 of the connector 41 includes an electrically insulating synthetic resin, and terminals 44 and 44 having a substantially U-shaped cross section that can be electrically connected to the external terminals 25 and 26 are accommodated in the terminal holding holes 43 and 43, respectively. Lead wires 45 and 45 are electrically connected to the terminals 44 and 44 in advance by appropriate means such as spot welding. Then, a lid 46 formed of an electrically insulating synthetic resin in which holes for passing the external terminals 25 and 26 are formed on the front surface side of the case 42, in FIG. 10, on the upper surface side is attached to the case 42 by an appropriate means such as ultrasonic welding. It is fixed. It should be noted that the distal ends of the terminals 44 and 44 can easily receive the external terminals 25 and 26 and can be elastically and stably contacted and clamped so that the external terminals 25 and 26 are particularly well understood as shown in FIG. It is formed in a curved shape that is convex toward the side surface. A locking claw 47 is formed outwardly on the outer peripheral portion of the back side of the case 42, and the locking claw 47 is a hole formed in the bottom surface of the recess 3a by using the elastic material of the case 42. By being pushed into 3a1, it is locked to the outer edge of the hole 3a1. Further, when the case 42 including the lid 46 is formed of a synthetic resin having a relatively low heat-resistant temperature such as a polypropylene resin, if the actual use state as shown in FIG. It is preferable that the surface of the connector 41 (the lid 46) is not in contact with each other, and if the case 42 including the lid 46 is provided at a position avoiding the LED chip 21 directly above the LED unit 4, the lid 46 and the case 42 are provided. It is easy to prevent thermal deformation. The lead wires 45 are connected to the lighting control circuit unit 5 shown in FIG.

  Next, FIG. 12 shows another embodiment of the present invention, and the tip side of the translucent member 27 has a convex curved shape, so that the amount of the translucent member 27 used can be saved. FIG. 13 shows still another embodiment of the present invention, which includes a base member 51 in contact with the back side of the metal plate 22 where the LED chip 21 is not supported. The base member 51 has a higher thermal conductivity than the translucent member 27. It has sex. As the base member 51, for example, polyphenylene sulfide resin (PPS resin) or ceramic material having high thermal conductivity is used. Thereby, the heat generated by the LED chip 21 is easily conducted to the second main body 3 via the metal plate 22 and the base member 51, and the brightness of the LED chip 21 can be improved. Note that when a white ceramic material is used, light reflectivity is good, so that the light flux emitted from the translucent member 27 to the outside can be improved. Further, the base member 51 may be filled in the space between the semi-finished product 4a of the LED unit 4 and the fourth mold 35 at the stage of FIG. Further, the attachment portion 30 having the notch 29 that opens outward may be integrally provided on the outer peripheral portion of the base member 51.

  FIG. 14 shows still another embodiment of the present invention, in which the back surface of the metal plate 22 is exposed to the outside without being covered with the translucent member 27. In this case, an insulating sheet 52 with good thermal conductivity may be interposed between the second main body 3 and the second main body 3. In addition, if the surface of the second main body 3 is satisfactorily treated with an insulating film, the insulating sheet 52 is not particularly required. FIG. 15 shows still another embodiment of the present invention, in which a metal reinforcing wire 53 that does not contact the LED element 23 is enclosed in a light-transmitting member 27 in a substantially circular or substantially C shape. The rigidity is improved and the LED chip 21 is prevented from being damaged. In addition, since the metal reinforcement wire 53 has only to be formed by simply cutting a long metal wire (not shown), no material loss occurs. Further, the metal reinforcing wire 53 may be enclosed in the base member 51.

  In the LED unit 4 of the above embodiment, the LED chip 21 emits blue light, violet light, or ultraviolet light, and the translucent member 27 converts the blue light, violet light, or ultraviolet light into visible light. A phosphor including a phosphor such as a YAG phosphor to be converted or a phosphor that converts to the three primary colors of light can be used. However, in still another embodiment of the present invention shown in FIG. 16, the LED chip 21 emits blue light, violet light, or ultraviolet light, and the blue light, violet light, or ultraviolet light only in the vicinity of the LED chip 21. A phosphor 61 that converts light into visible light, or a phosphor 61 that converts light into the three primary colors is provided. That is, the vicinity of the LED chip 21 supporting portion of the metal plate 22 is made into a dish shape, and the phosphor 61 is provided therein. Thereby, the quantity of the fluorescent substance 61 to be used can be reduced and it can manufacture at low cost. In addition, in the LED unit 4 of FIGS. 17 to 24 described later, the translucent member 27 includes a phosphor, but the phosphor is included only in the vicinity of the LED chip 21 including the LED unit 4 before FIG. Of course, it may be changed.

  FIG. 17 shows still another embodiment of the present invention, in which the configuration of the LED chip 21 is different. The LED unit 4 includes a plurality of LED elements 23 including a metal plate 22 on which an LED chip 21 is supported in an electrically insulated state. These LED elements 23 are arranged in a substantially annular or substantially C shape as a whole in a state where adjacent metal plates 22 and 22 are separated from each other, and each LED chip 21 is electrically connected in a predetermined series order. At least in one place, the electrical connection loop is broken. The disconnected portion is electrically connected to the pair of external terminals 25 and 26 described above, and each LED element 23 is fixed to an electrically insulating translucent member 27 having a ring shape or a substantially C shape. The window hole 28 is formed in the center. In this embodiment, since an electrically insulating sapphire substrate (layer) (not shown) is interposed between the LED chip 21 and the metal plate 22, the metal wire 24 is electrically connected between the LED chips 21 having a stepped surface. They are connected and not connected to the metal plate 22. Since such a sapphire-based LED chip 21 itself is known, no further explanation is required.

  FIG. 18 shows still another embodiment of the present invention. In FIG. 17, the embodiment of FIG. 13 is applied to include a base member 51 in contact with the back side where the LED chip 21 is not supported on the metal plate 22. The base member 51 has a higher thermal conductivity than the translucent member 27. FIG. 19 shows still another embodiment of the present invention. In FIG. 17, the back surface of the metal plate 22 is exposed to the outside without being covered with the translucent member 27 by applying the embodiment of FIG. In this case, since an electrically insulating sapphire substrate (layer) is interposed between the LED chip 21 and the metal plate 22, in the case of FIG. 19, an insulating sheet is interposed between the second main body 3. It may not be necessary. That is, in this case, there may be no particular problem even with a paint film or a resin film that is normally formed on the surface of the second body 3.

  FIG. 20 shows still another embodiment of the present invention, in which each LED element 23 is electrically connected in a predetermined series order, but the loop of the electrical connection is interrupted at two places. . The disconnected portions are electrically connected to the pair of external terminals 25 and 26, respectively.

  FIG. 21 to FIG. 23 show still another embodiment of the present invention. In these LED units 4, each LED element 23 is arranged in a double substantially annular shape or substantially C shape, and is further formed by one LED unit 4. High luminous flux can be obtained.

  FIG. 24 shows still another embodiment of the present invention. In the LED unit 4, a bent portion 22 b that is bent obliquely downward is formed on the inner peripheral portion of the metal plate 22 that supports the LED chip 21. Light emitted from the inner surface of the chip 21 can be reflected downward by the bent portion 22b. According to this configuration, the light emitted from the inner side of the LED chip 21 can be reflected in the lower surface direction while being attached to the lower surface of the second main body 3, and the lower surface light distribution can be improved. Since the emitted light is radiated sideways as it is, lateral light including a ceiling (not shown) is obtained, and it is easy to achieve both bottom surface light distribution and ceiling light distribution. As described above, since the phosphors are mixed only in the vicinity of the translucent member 27 or the LED chip 21, not only the linear light as indicated by the dotted arrow in FIG. In view of the light distribution curve and the LED unit 4 being annular or substantially C-shaped, the light distribution by the LED unit 4 is approximately equal from the lower surface direction to the lateral direction, which is suitable for a ceiling lighting device. Such an LED unit 4 may be used for the outer LED unit 4 in the case of FIG. 1, but may be used for the inner LED unit 4. As shown in the embodiment of FIG. 16, the inner LED unit 4 is formed in a dish shape in the vicinity where the LED chip 21 is supported on the metal plate 22 to obtain light distribution mainly in the lower surface direction. Also good. Further, the bent portion 22b may be applied to the metal plate 22 of the outer LED element 23 in FIGS. 21 to 23, or may be applied to the metal plate 22 of the inner LED element 23. Further, in the metal plate 22 of the inner LED element 23, as shown in the embodiment of FIG. 16, the vicinity of the metal plate 22 where the LED chip 21 is supported is formed in a dish shape and is arranged mainly in the lower surface direction. You may get light.

  Next, FIG. 25 shows an example of a circuit block including the lighting control circuit unit 5 that can be applied to each of the embodiments described above. For example, the AC power supply 61 received by the hook plug 15 is rectified by a rectifier 62 and then supplied with a DC voltage to the LED unit 4 via a power supply circuit 63 such as a step-up or step-down chopper circuit. A low resistance 64 is connected in series to the LED unit 4, and a voltage generated in the low resistance 64 is converted into a digital signal by the A / D converter 65 according to the current flowing through the LED unit 4, and the digital signal is input to the microcomputer 66. Is done. The microcomputer 66 also receives an output signal from a remote control signal receiving unit 9 that receives a remote control signal transmitted by a remote control transmitter (not shown). Then, the output signal of the remote control signal receiving unit 9 and the digital signal are compared by a program stored in the microcomputer 66, and the output signal generated by the comparison is supplied to the power supply circuit 63, and a desired current is supplied to the LED unit 4. Is controlled to flow. When a chopper circuit is used as the power supply circuit 63, as is well known, a normal circuit provided with a choke coil, a semiconductor switching element, a diode, a smoothing capacitor, a PWM switching control circuit unit, and the like may be used. Also, the output voltage of the power supply circuit 63 is divided by a series-connected resistor (not shown), and the divided voltage is input to another A / D converter to be converted into a digital signal, and this digital signal is also input to the microcomputer 66. The LED unit 4 may be controlled with constant power in combination with the current detection control with the low resistance 64 by performing voltage detection control.

  In order to change the luminance (light flux) of the LED unit 4, for example, the remote control transmitter can transmit a code signal corresponding to several types of luminance, and the luminance is changed or transmitted every time it is operated. It is only necessary that the luminance can be adjusted cyclically by transmitting the same code signal. Then, the luminance of the LED unit 4 can be set substantially continuously or stepwise from an allowable maximum value to a minimum value that can function as a nightlight at night, and of course to a zero value that turns off the light. If it does so, the remote control of the LED unit 4 can be easily performed by the remote control transmitter, and it is preferable for a general living room.

In addition, when using several LED unit 4 like FIG. 1, when the forward voltage of each LED unit 4 differs, since only one power supply circuit 63 will be sufficient if they are connected in series, economical efficiency is good. When the forward voltages of the LED units 4 are substantially the same, they may be connected in parallel. When the forward voltages of the LED units 4 vary somewhat, a resistance such as a low resistance 64 is applied to the LED units 4. What is connected in series should be connected in parallel to reduce adverse effects caused by variations.
In addition, in this specification and a claim, it is natural that LED (light emitting diode) includes OLED (organic light emitting diode). The LED is defined to mean a semiconductor light emitting element and further a light emitting element. The base member 51 may include a single crystal or amorphous diamond layer having excellent thermal conductivity and electrical insulation.
In FIG. 8, the translucent member 27 is molded by pouring molten resin into the mold 32 (34) with the molds 32, 33 (34, 35) opened, and the mold 33 (35). Alternatively, the mold may be closed and solidified, or a heat-meltable annular resin body is placed in the mold 32 (34), and the mold 33 (35) is closed and heated to mold 32, 33 (34). , 35) may be used for forming a predetermined range. As for the molding of the base member 51 of FIGS. 13 and 18, the same molding technique can be adopted. These forming techniques are defined as being included in claims 13, 14, 23, and 24.

C Ceiling 1 First body (main body)
3 Second body (main body)
3a recess 4 LED unit 4a LED product semi-finished product 21 LED chip 22 metal plate 22a metal plate 22b bent portion 23 LED element 24 metal wire 25 external terminal 26 external terminal 27 translucent member 28 window hole 29 notch 30 mounting portion 30a recess 31 recess 32 first mold 32a inner mold 32b outer mold 32b1 outer mold element 32b2 outer mold element 32c hinge mechanism 33 second mold 34 third mold 34a inner mold 34b outer mold 34b1 outer mold element 34b2 outer mold element 35 Fourth mold 41 Connector 42 Case 51 Base member 53 Metal reinforcement wire

Claims (7)

  A first step of arranging a plurality of metal plates apart from each other so as to form a substantially ring shape or a substantially C shape as a whole, and a second step of constituting LED elements by supporting LED chips on the surface side of each metal plate A third step of electrically connecting the LED elements to each LED element in a predetermined series order so that an electrical connection loop is interrupted at least at one location; and a step of forming the metal plate so that the back side of the metal plate protrudes. A fourth step of forming and attaching an electrically insulating translucent member on the front surface side, and a fifth step of forming and attaching an electrically insulating translucent member or base member on the back side of the metal plate Unit manufacturing method.   A first step of disposing a plurality of LED elements including a metal plate that supports the LED chip in advance on the surface side so as to form a substantially ring shape or a substantially C shape as a whole, and at least one place in each LED element A second step of electrical connection in a predetermined series order so that the electrical connection loop is interrupted, and an electrically insulating translucent member on the surface side of the metal plate so that the back side of the metal plate protrudes A method for manufacturing an LED unit, comprising: a third step of forming and adhering to and a fourth step of forming and attaching an electrically insulating translucent member or base member to the back side of the metal plate. An annular groove is formed, and a plurality of first molds formed in a state where recessed portions of a predetermined shape are separated from the inner bottom surface thereof, and a second mold that can close the opening of the first mold,
At least a first step of disposing a metal plate on each predetermined one of the recesses, a second step of supporting an LED chip on each predetermined one of the metal plates to constitute an LED element, and at least each LED element A third step of electrical connection in a predetermined series order so that the electrical connection loop is interrupted at one place, and the first mold and the second mold with the second mold closing the opening of the first mold A fourth step of filling and molding the electrically insulating translucent member in the space between the molds, separating the second mold and the first mold, and electrically connecting each LED element and the translucent member. A fifth step of taking out a semi-finished LED unit product,
A third mold that forms an annular groove, and a fourth mold that can close the opening of the third mold,
The semi-finished product is placed upside down in the third mold and then electrically insulated in the space between the semi-finished product and the fourth mold with the fourth mold closing the opening of the third mold. LED unit manufacturing method comprising: a sixth step of filling and molding a transparent translucent member or a base member; and a seventh step of separating the fourth mold from the third mold and taking out the LED unit. An annular groove is formed, and a plurality of first molds formed in a state where recessed portions of a predetermined shape are separated from the inner bottom surface thereof, and a second mold that can close the opening of the first mold,
A first step of disposing a metal plate in an LED element including a metal plate that preliminarily supports an LED chip in each of the predetermined recesses, and a loop of electrical connection in each LED element is interrupted at least at one location A second step of electrical connection in a predetermined series order, and an electrically insulating translucent property in the space between the first mold and the second mold with the second mold closing the opening of the first mold A third step of filling and molding the member, a fourth step of separating the second mold and the first mold and taking out a semi-finished product of the LED unit including the electrically connected LED element and the translucent member;
A third mold that forms an annular groove, and a fourth mold that can close the opening of the third mold,
The semi-finished product is placed upside down in the third mold and then electrically insulated in the space between the semi-finished product and the fourth mold with the fourth mold closing the opening of the third mold. LED unit manufacturing method comprising: a fifth step of filling and molding a transparent translucent member or a base member; and a sixth step of separating the fourth mold from the third mold and taking out the LED unit.   5. The first mold and / or the third mold according to claim 3, wherein the first mold and / or the third mold constitute an inner mold and an outer mold that are separable into an inner peripheral side and an outer peripheral side, and the outer mold has at least two locations in the circumferential direction. A plurality of outer mold elements that are separable, and in the step of removing the LED unit semi-finished product and / or the LED unit from the first mold and / or the third mold, The manufacturing method of the LED unit made into the state made to displace.   6. The method of manufacturing an LED unit according to claim 5, wherein the plurality of outer mold elements are coupled by a hinge mechanism at a predetermined adjacent position.   6. The light transmitting device according to claim 5, wherein the plurality of outer mold elements of the third mold are coupled by a hinge mechanism at a predetermined adjacent position, a recess is formed on the upper surface side of the outer wall of the outer mold element, and the recess is filled and molded. The manufacturing method of the LED unit which forms an outward attachment part in the outer peripheral part of an LED unit with a property member or a base member.

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