JP2009278052A - Attaching structure of semiconductor element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor element attaching structure capable of attaching/detaching a semiconductor element to/from a heat radiation fin without being influenced by peripheral apparatuses. <P>SOLUTION: A semiconductor attaching member composed of a fixing piece formed so as to have an approximately chevron cross section and allowed to be deformed to a flat shape when screwed into a printed broad from a lower portion and a pressing piece extended obliquely upward like an acute angle from the fixing piece and allowed to be further warped like an acute angle by the deformation of the fixing piece caused by screwing into the printed board is formed by a plate material, the fixing piece is screwed into the printed board, the pressing piece is warped by the deformation of the fixing piece caused by the screwing, and the semiconductor element is pressed and held onto the heat radiation fin formed on the printed board by the pressing piece. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a structure for attaching a semiconductor element to a radiation fin.

  As shown in Patent Document 1 or FIG. 8, conventionally, the semiconductor element 1 has three linear lead terminals 5 arranged in parallel at the same pitch P below the element body 3 made of synthetic resin. Then, the semiconductor element 1 is attached to the printed circuit board 7 by providing through holes 9 in the printed circuit board 7 in accordance with the pitch P of the lead terminals 5 and inserting the lead terminals 5 into the through holes 9 from the back side of the printed circuit board 7. The lead terminal 5 is soldered.

  By the way, in the structural design of electronic equipment, heat dissipation of the heat generating component is an important issue, and conventionally, a structure in which the heat generating component is attached to the heat radiating fin is widely adopted as a heat dissipation measure.

And the semiconductor element as a heat-generating component is also radiated by attaching it to the radiating fin. Conventionally, when the semiconductor element is attached to the radiating fin, it is screwed to the printed circuit board 9 as shown in FIG. The semiconductor element 1 is screwed directly or indirectly to the radiation fin 11 from the lateral direction by bringing the side surface 11a of the radiation fin 11 into contact with the back surface 3a side of the element body 3.
JP-A-8-46106

  However, in the mounting structure shown in FIG. 9, due to the relationship with the peripheral device mounted on the printed circuit board, it is not possible to use a tightening tool because the peripheral device becomes an obstacle when the semiconductor element is retrofitted to the heat radiating fin. In some cases, mounting by screwing was not possible. Therefore, there is a restriction that the semiconductor element must be screwed to the heat radiating fin prior to mounting of other peripheral devices.

  In addition, when other peripheral devices are soldered to the printed circuit board, when it is desired to remove the semiconductor element from the printed circuit board by replacing parts or the like, the peripheral device becomes in the way and the tightening tool cannot be used. It was also pointed out that it could not be removed.

  The present invention has been devised in view of such circumstances, and an object of the present invention is to provide a semiconductor element mounting structure capable of mounting / removing a semiconductor element on / from a heat radiating fin without being affected by peripheral devices.

  In order to achieve such an object, a mounting structure of a semiconductor device according to claim 1 is formed in a substantially mountain shape in cross section, and a fixing piece that is deformed into a flat shape by screwing from below to a printed circuit board, A semiconductor mounting member is formed of a plate material, which is formed of a plate member which is extended obliquely upward from the fixed piece and is further deformed by fixing the screw by screwing to the printed circuit board, and printed on the fixed piece. A screw is fixed to the substrate, and the pressing piece is warped by deformation of the fixing piece by screwing, and the semiconductor element is pressed and held on the heat radiation fin on the printed board by the pressing piece.

  According to a second aspect of the present invention, in the semiconductor element mounting structure according to the first aspect, the radiating fin is fastened to the printed circuit board with the semiconductor mounting member and a screw. The invention according to item 3 is the semiconductor element mounting structure according to claim 1, wherein the heat dissipating fins are screwed from below the printed circuit board separately from the semiconductor mounting member.

  According to a fourth aspect of the present invention, in the semiconductor element mounting structure according to any one of the first to third aspects, the radiating fin has a cross section in which a mounting piece to a printed circuit board is formed. The mounting piece is provided with a notch through which the lead terminal of the semiconductor element can be inserted.

  Furthermore, the invention according to claim 5 is the mounting structure of the semiconductor element according to any one of claims 1 to 4, further comprising an insulating sheet interposed between the semiconductor element and the radiation fin. The semiconductor according to any one of claims 1 to 5, wherein the semiconductor sheet is extended to the fixed piece, and the insulating sheet is fastened together with the fixed piece with a screw. The element mounting structure is characterized in that the pressing piece extends in the lateral direction to form a semiconductor mounting member elongated in the lateral direction, and a plurality of the fixing pieces are provided.

  According to a seventh aspect of the present invention, in the semiconductor element mounting structure according to the sixth aspect, a plurality of semiconductor elements are arranged laterally on the printed circuit board, and all the semiconductor elements are attached to the one semiconductor mounting section. It is characterized by being pressed and held by a member on a heat radiating fin.

  According to the invention according to each claim, even when peripheral devices are already mounted on the printed circuit board, it is possible to attach and remove the heat radiation fins and the semiconductor element from the lower side of the printed circuit board to the printed circuit board. As a result, the degree of freedom in structural design was improved.

  The invention according to claim 2 has the advantage that the number of screwing steps can be reduced as compared with the prior art, and the workability can be improved and the work cost can be reduced because the radiating fin and the semiconductor mounting member can be fastened together.

  The invention according to claim 3 has the advantage that the heat dissipating fins do not rattle when the semiconductor element is removed from the printed circuit board.

  Furthermore, according to the invention according to claim 4, it is possible to cope with the lateral displacement of the mounting position of the semiconductor element. According to the invention according to claim 5, when the semiconductor element is removed from the printed board, the insulating sheet Since it does not come off, there is an advantage that workability such as maintenance is improved.

  According to the inventions according to claims 6 and 7, since a plurality of semiconductor elements can be attached to the heat radiating fins by one semiconductor attachment member, the workability is remarkably improved as compared with the conventional case, and further work is performed. There is an advantage that the cost can be reduced.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same thing as the prior art example shown in FIG. 9, and those description is abbreviate | omitted.

  1 to FIG. 4 relate to a semiconductor element mounting structure according to one embodiment of claims 1, 2 and 4 to 6. In FIG. 1, reference numeral 21 denotes the semiconductor element 1 of FIG. 9. Similarly, a semiconductor element 25 in which three lead terminals 5 are arranged in parallel at the same pitch on the lower side of the element body 23, and a pair of left and right mounting pieces 25a to the printed circuit board 7 are notched 27 as shown in FIG. The heat radiating fins 25 are formed in the lower part with a L-shaped cross section, and the heat radiating fins 25 are formed wider in the lateral direction than the semiconductor elements 21.

  As shown in FIG. 1, the radiating fins 25 are arranged on the printed circuit board 7 in the opposite direction to the radiating fins 11 of FIG. 9, and the mounting pieces 25a have screw insertion holes provided in the printed circuit board 7. A screw hole 31 is provided corresponding to 29. As shown in FIGS. 1 and 4, the radiating fins 25 are fastened by screws 33 inserted into the screw insertion holes 29 from below the printed circuit board 7 and nuts 35 disposed on a fixing piece 37a described later. The through-hole 9 of the printed circuit board 7 is opened in the notch 27 by being attached to the printed circuit board 7.

  A semiconductor mounting member (hereinafter referred to as “mounting member”) 37 formed of a plate material such as phosphor copper or stainless steel and having substantially the same lateral width as that of the heat radiating fin 25 is disposed on the mounting piece 25 a of the radiating fin 25. ing.

  As shown in FIGS. 1 and 3, the mounting member 37 includes a pair of left and right fixing pieces 37a formed corresponding to the mounting piece 25a, and a pressing piece extending obliquely upward from the both fixing pieces 37a at an acute angle. 37b, and the lateral width of the fixing piece 37a is substantially the same as that of the mounting piece 25a. The fixing piece 37a is formed in a substantially mountain shape in cross section along the pressing piece 37b, and is deformed into a flat shape as shown in FIG. As the fixing piece 37a is deformed by screwing to the printed circuit board 7, the pressing piece 37b warps more acutely in the direction of arrow A. And the front-end | tip of the press piece 37b is curving in the reverse direction.

  The fixing piece 37 a is provided with a so-called fool hole 39 larger than the screw hole 31 corresponding to the screw hole 31, and the mounting member 37 (fixing piece 37 a) is formed by the screw 33 and the nut 35. The printed circuit board 7 is fastened together with the heat radiating fins 25 (mounting pieces 25a). As described above, when the screw 33 is tightened from below the printed circuit board 7, the fixing piece 37a is deformed into a flat shape by the tightening force of the screw 33 and the nut 35 disposed on the fixing piece 37a. The heat radiation fin 25 is fastened together with the printed circuit board 7 while being fixed on the mounting piece 25a. As the fixing piece 37a is deformed, the pressing piece 37b is warped in the direction of arrow A, and the back surface 23a side of the element body 23 is pressed from the front surface of the semiconductor element 21 to the side surface 25b of the radiation fin 25 as shown in FIG. The semiconductor element 21 is held by the heat radiating fins 25.

  Therefore, when attaching the radiation fin 25 and the attachment member 37 to the printed circuit board 7, the semiconductor element 21 is brought into contact with the side surface 25b of the radiation fin 25 as shown in FIG. It is necessary to keep. And after fixing the radiation fin 25 and the attachment member 37 to the printed circuit board 7 and holding the semiconductor element 21 on the radiation fin 25 with the attachment member 37 (pressing piece 37b), the lead terminals 5 are soldered from the back side of the printed circuit board 7, respectively. By attaching, the attachment of the semiconductor element 25 to the printed circuit board 7 and the radiation fin 25 is completed.

  As shown in FIGS. 1 and 4, a well-known insulating sheet 41 is interposed between the radiation fin 25 and the semiconductor element 21 (element body 23). The insulating sheet 41 is a fixed piece of the mounting member 37. Each piece 37a extends to the fixed piece 37a and is sandwiched between the fixed piece 37a and the mounting piece 25a of the radiation fin 25. The insulating sheet 41 is fastened together with the fixing piece 37 a and the mounting piece 25 a and the screw 33. Therefore, the insulating sheet 41 is provided with screw insertion holes (not shown) corresponding to the screw holes 31.

  Since the present embodiment is configured as described above, a plurality of devices 43, 45, 47 are already mounted around the mounting portion of the semiconductor element 21 and the radiation fin 25 as shown in FIG. 1 can be used, after disposing the radiation fin 25 on the printed circuit board 7 as shown in FIG. 1 and placing the attachment member 37 on the attachment piece 25a via the insulating sheet 41, The screw 33 is lightly screwed from below the printed board 7 to the nut 35 disposed on the screw hole 31 and the fixing piece 37a from the screw insertion hole 29, and the heat radiation fin 25 and the mounting member 37 are temporarily fixed on the printed board 7. . In this state, the fixed piece 37a is slightly deformed, and accordingly, the pressing piece 37b slightly warps in the direction of the arrow A.

  After that, while the lead terminal 5 of one semiconductor element 21 is inserted into the through hole 9 of the printed circuit board 7, the semiconductor element 21 is disposed between the radiation fin 25 and the pressing piece 37b as shown in FIG. Then, the back surface 23 a of the element body 23 is brought into contact with the side surface 25 b of the heat radiation fin 25. If the screw 33 is strongly tightened in this state, the fixing piece 37a is deformed into a flat shape by the tightening force of the screw 33 and the nut 35 as described above, and is fixed to the mounting piece 25a of the radiation fin 25. At the same time, the heat radiating fins 25 are fastened together with the printed circuit board 7. Then, along with the deformation of the fixed piece 37a, the pressing piece 37b further warps in the direction of arrow A, pressing the back surface 23a side of the element body 23 from the front surface of the semiconductor element 21 to the side surface 25b of the radiation fin 25 as shown in FIG. The semiconductor element 21 is held by the heat radiation fin 25.

  Further, when a situation occurs in which the semiconductor element 21 is replaced due to long-term use, the screw 33 is loosened from below the printed circuit board 7 even if other peripheral devices 43, 45, 47 are soldered to the printed circuit board 7. Then, the pressing piece 37b that presses the semiconductor element 21 against the heat radiating fin 25 moves in the direction of arrow B in FIG. 4 and moves away from the element main body 23, so that the solder of the printed circuit board 7 and the lead terminal 5 is removed. The semiconductor element 21 can be removed from the printed circuit board 7.

  And even if it removes the semiconductor element 21 from the printed circuit board 7 in this way, since the insulating sheet 41 is clamped between the fixing piece 37a and the attachment piece 25a, the insulating sheet 41 will not come off. Thereafter, a new semiconductor element may be attached to the radiation fin 25 by the procedure described above.

  Thus, according to the present embodiment, even if the peripheral devices 43, 45, 47 are already mounted on the printed circuit board 7, the heat radiation fins 25 and the semiconductor elements 21 from the lower side of the printed circuit board 7 to the printed circuit board 7 are provided. And the semiconductor element 21 can be detached, and the degree of freedom in structural design is improved. In addition, even if the mounting position of the semiconductor element 21 is laterally shifted in the notch 27, it can be dealt with.

  Further, compared with the conventional example of FIG. 9, the screwing man-hour is reduced, and the heat radiation fin 25 and the mounting member 37 can be fastened together, so that the workability is improved and the cost can be reduced.

  Furthermore, according to this embodiment, since the insulating sheet 41 does not come off when the semiconductor element 21 is removed from the printed board 7, workability such as maintenance is improved.

  In the above embodiment, the mounting of one semiconductor element 21 has been described. However, as an example, two semiconductor elements 21 can be mounted side by side in the notch 27, and a plurality of semiconductor elements 27 are further aligned. When attaching, the attachment member which changed the width | variety of the notch 27 according to the attachment number should just be used.

  FIGS. 5 and 6 relate to a semiconductor element mounting structure according to one embodiment of claims 1 and 3 to 6. In this embodiment, the direction of the radiating fins 25 is opposite to that of the above embodiment. The screw insertion hole 49 is provided on the printed circuit board 7 in correspondence with the screw hole 31 of the heat radiating fin 25.

  Since other configurations are the same as those of the embodiment of FIG. 1, the same components are denoted by the same reference numerals and description thereof is omitted.

  Since the present embodiment is configured as described above, when attaching the semiconductor element 21, first, the screw 33 is inserted into the screw insertion hole 49 from below the printed circuit board 7, and then tightened into the screw hole 31 of the attachment piece 25a. The heat radiation fin 25 is fixed on the printed circuit board 7 first. Then, the insulating sheet 41 is stretched over the side surface 25 b of the radiating fin 25 and the printed board 7, and the screw insertion hole of the insulating sheet 41 is made to coincide with the screw insertion hole 29, and then the mounting member 37 is placed on the insulating sheet 41. And the insulating sheet 41 is sandwiched between the fixed piece 37a and the printed circuit board 7.

  Next, the screw 33 is inserted into the screw insertion hole 29 and the flaw hole 39 from below the printed board 7, and lightly screwed onto the nut 35 disposed on the fixed piece 37 a to temporarily fix the mounting member 37 onto the printed board 7. . In this state, the fixed piece 37a is slightly deformed, and accordingly, the pressing piece 37b of the mounting member 37 slightly warps in the arrow A direction.

  Thereafter, while the lead terminal 5 of the semiconductor element 21 is inserted into the through hole 9, the semiconductor element 21 is disposed between the radiation fin 25 and the pressing piece 37 b, and the back surface 23 a of the element body 23 is disposed on the radiation fin 25. It is made to contact | abut to the side surface 25b. If the screw 33 is strongly tightened in this state, the fixing piece 37 a is deformed into a flat shape by the tightening force of the screw 33 and the nut 35 and is fixed to the printed circuit board 7. Then, along with the deformation of the fixed piece 37a, the pressing piece 37b further warps in the direction of arrow A, pressing the back surface 23a side of the element body 23 from the front surface of the semiconductor element 21 to the side surface 25b of the radiation fin 25 as shown in FIG. The semiconductor element 21 is held on the heat radiation fin 25.

  Thereafter, when a situation occurs in which the semiconductor element 21 is replaced after long-term use, if the screw 33 is loosened from the lower side of the printed circuit board 7, the pressing piece 37 b pressing the semiconductor element 21 against the radiating fin 25 is illustrated in FIG. 6 moves away from the element main body 23 in the direction of arrow B, so that the semiconductor element 21 can be removed from the printed board 7 by removing the solder of the printed board 7 and the lead terminals 5.

  Even when the semiconductor element 21 is removed from the printed board 7 in this manner, the insulating sheet 41 is sandwiched between the fixed piece 37 a and the printed board 7, so that the insulating sheet 41 does not come off. Thereafter, a new semiconductor element may be attached to the heat radiating fin 25 by the procedure described above.

  Thus, according to the present embodiment, the semiconductor element 21 can be attached to the heat radiation fin 25 from the lower side of the printed circuit board 7, so that the peripheral devices 43, 45, 47 are already mounted on the printed circuit board 7. It is possible to attach the radiating fins 25 and the semiconductor element 21 to the printed circuit board 7 and to remove the semiconductor element 21, and the degree of freedom in structural design is improved as compared with the conventional case. And even if the mounting position of the semiconductor element 21 is shifted laterally, it can be dealt with.

  Further, as described above, when the semiconductor element 21 is removed from the printed circuit board 7, the insulating sheet 41 is not detached, so that workability such as maintenance is improved.

  Furthermore, according to this embodiment, when removing the semiconductor element 21 from the printed circuit board 7, there is an advantage that the radiation fins 25 do not rattle.

  In this embodiment, the mounting of one semiconductor element 21 has been described. However, a plurality of semiconductor elements 21 may be mounted side by side on the radiation fin 25.

  FIG. 7 shows radiating fins and mounting members used in the mounting structure according to one embodiment of claims 1, 3 to 7, and the mounting member 51 has more semiconductors than the embodiment of FIG. 5. Used when mounting elements on a printed circuit board in a row, it has a long shape such that three of the mounting members 37 are juxtaposed in the horizontal direction, and is fixed to the bottom of the pressing piece 51b in the same shape as the fixing piece 37a. Six pieces 51a are provided.

  In addition, although not shown, the radiating fin used in the present embodiment is also formed to be long in the horizontal direction corresponding to the mounting member 51, and the mounting piece is formed corresponding to each fixing piece 51a. The heat dissipating fins are screwed to the printed circuit board 7 in the same direction as the heat dissipating fins 25 in FIG. 5, and the insulating sheet is extended to the fixing pieces 51 a for each fixing piece 51 a of the mounting member 51.

  The mounting member 51, the radiating fin, and the insulating sheet of the present embodiment are configured in this way, and also in the present embodiment, a plurality of semiconductor elements are arranged on the radiating fin from the lower side of the printed board, as in the embodiment of FIG. Since it can be attached, even if peripheral devices are already mounted on the printed circuit board 7, it is possible to attach and remove the heat dissipating fins and the semiconductor elements to the printed circuit board, and the degree of freedom in structural design compared to the conventional case. Will improve.

  Further, in this embodiment, for example, when the two fixing pieces 51a on the left side of the mounting member 51 are tightened to fix the semiconductor element between the fixing pieces 51a, the pressing piece 51b on the adjacent fixing piece 51a side also warps, The semiconductor element can be temporarily fixed to the heat dissipating fin on the adjacent fixed piece 51a side by the warping of the pressing piece 51b.

  For this reason, according to the present embodiment, there is an advantage that it is excellent in workability when mounting many semiconductor elements, and can be handled even when the mounting position of the semiconductor elements is shifted in the lateral direction.

  And also in this embodiment, when removing a semiconductor element from the printed circuit board 7 similarly to embodiment of FIG. 5, since an insulating sheet does not come off, workability, such as maintenance, improves, When removing the semiconductor element from the printed circuit board, there is an advantage that the radiating fin does not rattle.

It is a side view of the attachment structure which concerns on one Embodiment of Claim 1, Claim 2, and Claim 4 thru | or 6 before the attachment of a semiconductor element. It is explanatory drawing of the attachment condition of a peripheral device. It is a whole perspective view of a radiation fin and an attachment member. It is a side view after a semiconductor element attachment. It is a side view of the attachment structure which concerns on one Embodiment of Claim 1 and Claim 3 thru | or 6 before the attachment of a semiconductor element. It is a side view after a semiconductor element attachment. It is a perspective view of the attachment member used for the attachment structure of the semiconductor element which concerns on one Embodiment of Claim 1 and Claim 3 thru | or 7. It is explanatory drawing of the attachment method of the conventional semiconductor element. It is a side view of the conventional semiconductor element mounting structure.

Explanation of symbols

5 Lead terminal 7 Printed circuit board 9 Through hole 21 Semiconductor element 25 Radiation fin 25a Mounting piece 27 Notch 37, 51 Mounting member (semiconductor mounting member)
37a, 51a Fixed pieces 37b, 51b Pressing piece 41 Insulating sheet

Claims (7)

A fixed piece that is formed in a substantially mountain shape in cross section and deforms into a flat shape as a result of being screwed onto the printed circuit board from below, and extends obliquely upward from the fixed piece at an acute angle. Forming a semiconductor mounting member made of a plate material with a pressing piece that warps more acutely by deformation of the fixed piece,
The fixing piece is screwed to a printed board, the pressing piece is warped by deformation of the fixing piece by screwing, and the semiconductor element is pressed and held on the heat radiation fin on the printed board by the pressing piece. A semiconductor element mounting structure.   2. The semiconductor element mounting structure according to claim 1, wherein the heat dissipating fins are fastened to a printed circuit board with the semiconductor mounting member and a screw.   2. The semiconductor element mounting structure according to claim 1, wherein the heat dissipating fins are screwed from below the printed circuit board separately from the semiconductor mounting member.   The heat radiation fin is formed in an L-shaped cross section in which a mounting piece to a printed board is formed, and the mounting piece is provided with a notch through which a lead terminal of a semiconductor element can be inserted. The semiconductor element mounting structure according to any one of claims 1 to 3.   5. The insulating sheet interposed between the semiconductor element and the radiating fin is extended to the fixed piece, and the insulating sheet is fastened together with the fixed piece with a screw. The semiconductor element mounting structure according to any one of the preceding claims.   6. The semiconductor device according to claim 1, wherein the pressing piece extends in a lateral direction to form a semiconductor mounting member in a lateral direction and a plurality of the fixing pieces are provided. The semiconductor element mounting structure described. The semiconductor element mounting structure according to claim 6, wherein a plurality of semiconductor elements are arranged in a lateral direction on the printed circuit board, and all the semiconductor elements are pressed against and held by the heat radiating fins by one semiconductor mounting member. .

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