JP2009267082A

JP2009267082A - Led bulb

Info

Publication number: JP2009267082A
Application number: JP2008114901A
Authority: JP
Inventors: Kiyomi Mizohata; 喜代美溝畑
Original assignee: San & K kk
Current assignee: San & K kk
Priority date: 2008-04-25
Filing date: 2008-04-25
Publication date: 2009-11-12

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED bulb which is easy to assemble and has superior heat dissipation properties. <P>SOLUTION: The LED bulb 10 includes an outside body 12, having ribs 16 on the outer surface thereof. An LED element 36 is mounted on one surface side of the outside body 12, and then a cover member 44 is put on the LED element. In the outside body, a through-hole which penetrates the outside body from the cover member 44 side to the opposite side is formed, and first grooves 32, which communicate with the outside through the through-hole, are formed in the inside surface of the outer body 12. A substrate-bearing portion 46, a circuit board 50, an inner body 58, and a mouthpiece 78 are assembled in the outer body 12, and a filter 76, formed of a material having proper air permeability, is arranged between the outer body 12 and the inner body 58. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

この発明は、ＬＥＤ電球に関し、特にたとえば、白熱電球用のレセプタクルに取り付けて使用することができるＬＥＤ電球に関する。 The present invention relates to an LED bulb, and more particularly to an LED bulb that can be used by being attached to a receptacle for an incandescent bulb, for example.

近年、省エネルギーおよび地球温暖化ガスの排出規制などの問題により、発光効率の悪い白熱電球は敬遠されている。しかしながら、これまで白熱電球を使用していた白熱電球用のレセプタクルを使った照明の需要があるため、依然として白熱電球型の蛍光灯などが開発されている。さらに、蛍光灯よりも長寿命のＬＥＤが照明用として使用されるようになり、白熱電球型のＬＥＤ電球も開発されている。 In recent years, incandescent lamps with low luminous efficiency have been avoided due to problems such as energy saving and emission regulations of global warming gas. However, since there is a demand for lighting using an incandescent light bulb receptacle that has been using an incandescent light bulb, an incandescent light bulb type fluorescent lamp is still being developed. Furthermore, LEDs having a longer life than fluorescent lamps have been used for illumination, and incandescent bulb type LED bulbs have also been developed.

白熱電球型のＬＥＤ電球は、ＬＥＤ素子の周囲がガラス球などで覆われた構造であるため、ＬＥＤチップおよびインバーター，回路部品から発生する熱により、ガラス球内の温度が上昇する。ＬＥＤ素子は、熱による劣化により、寿命が短くなるため、たとえばＬＥＤ電球内に放熱用ファンを取り付けるなどの取り組みがなされている（特許文献１参照）。 The incandescent light bulb type LED light bulb has a structure in which the periphery of the LED element is covered with a glass bulb or the like. Therefore, the temperature in the glass bulb rises due to heat generated from the LED chip, the inverter, and the circuit components. Since LED elements have a short life due to deterioration due to heat, efforts have been made, for example, to install a heat dissipation fan in an LED bulb (see Patent Document 1).

特開２００７−２６５８９２号公報JP 2007-265892 A

しかしながら、放熱用ファンなどを取り付けたＬＥＤ電球は、その構造が複雑であるため、組み立てが困難である。 However, an LED bulb with a heat-dissipating fan or the like is difficult to assemble because of its complicated structure.

それゆえに、この発明の主たる目的は、組み立てが容易で、かつ放熱性に優れたＬＥＤ電球を提供することである。 Therefore, a main object of the present invention is to provide an LED bulb that is easy to assemble and has excellent heat dissipation.

この発明は、筒状体と前記筒状体の軸方向の一端側に形成される板状のＬＥＤ取付け部とを有する外側ボディと、前記ＬＥＤ取付け部に取り付けられるＬＥＤ素子と、前記ＬＥＤ素子を覆うようにして前記外側ボディに取り付けられる透光性のカバー部材と、前記ＬＥＤ素子の反対側において前記筒状体内に設けられる基板受け部と、前記基板受け部に取り付けられる前記ＬＥＤ素子を発光させるための回路基板と、前記回路基板を覆うようにして前記筒状体の軸方向の他端側から前記筒状体内に嵌め込まれる内側ボディと、前記内側ボディの外側端部に形成されて前記回路基板に接続される口金と、前記外側ボディと前記内側ボディとの間に取り付けられる通気性を有するフィルタとを備え、前記ＬＥＤ取付け部に形成される貫通孔、および前記筒状体の軸方向の他方端側から前記貫通孔に向かって前記筒状体の内面および前記ＬＥＤ取付け部に連続して形成される溝を含む、ＬＥＤ電球である。
ＬＥＤ取付け部に貫通孔が形成され、貫通孔につながる溝が外側ボディの筒状体の内面およびＬＥＤ取付け部に連続して形成されることにより、ＬＥＤ電球を組み立てたとき、ＬＥＤ素子が取り付けられたカバー部材内の空間と筒状体の口金側端部とが連通される。そのため、ＬＥＤチップおよびインバーター，回路部品から発生する熱が貫通孔および溝を介して外部に放出される。このとき、外側ボディと内側ボディとの間に通気性を有するフィルタを取り付けることにより、内部の熱を放出することができるとともに、外部から埃などが進入することを防止することができる。
ＬＥＤ取付け部に貫通孔が形成され、外側ボディの筒状体の内面およびＬＥＤ取付け部に連続して溝が形成されることにより、外側ボディ、ＬＥＤ素子、カバー部材、基板受け部、回路基板、内側ボディ、口金、フィルタを組み立てることにより、ＬＥＤ素子が取り付けられたカバー部材内部と外部とが連通したＬＥＤ電球を作製することができる。したがって、特に複雑な構成がなく、単純な組み立て作業で、放熱性の良好なＬＥＤ電球を作製することができる。 The present invention includes an outer body having a tubular body and a plate-shaped LED mounting portion formed on one end side in the axial direction of the tubular body, an LED element mounted on the LED mounting portion, and the LED element. A translucent cover member attached to the outer body so as to cover, a substrate receiving part provided in the cylindrical body on the opposite side of the LED element, and the LED element attached to the substrate receiving part to emit light A circuit board for covering the circuit board, an inner body fitted into the cylindrical body from the other axial end of the cylindrical body, and an outer end portion of the inner body formed on the circuit A through hole formed in the LED mounting portion, and a base having a base connected to a substrate, and a breathable filter attached between the outer body and the inner body. It includes a groove that is formed continuously to the inner surface and the LED attachment portion of the tubular member from the other end side in the axial direction of the tubular body toward the through hole, an LED light bulb.
A through hole is formed in the LED mounting portion, and a groove connected to the through hole is continuously formed in the inner surface of the cylindrical body of the outer body and the LED mounting portion, so that the LED element is mounted when the LED bulb is assembled. The space in the cover member communicates with the end of the cylindrical body on the base side. Therefore, heat generated from the LED chip, the inverter, and the circuit component is released to the outside through the through hole and the groove. At this time, by attaching a breathable filter between the outer body and the inner body, the internal heat can be released and dust and the like can be prevented from entering from the outside.
A through hole is formed in the LED mounting portion, and a groove is continuously formed in the inner surface of the cylindrical body of the outer body and the LED mounting portion, so that the outer body, the LED element, the cover member, the substrate receiving portion, the circuit board, By assembling the inner body, the base, and the filter, it is possible to produce an LED bulb in which the inside of the cover member to which the LED element is attached communicates with the outside. Therefore, there is no particularly complicated configuration, and an LED bulb with good heat dissipation can be manufactured by a simple assembly operation.

このようなＬＥＤ電球において、基板受け部に脚部が形成され、脚部がＬＥＤ取付け部側に配置されることにより、ＬＥＤ取付け部と基板受け部との間に空間を形成することが好ましい。
ＬＥＤ取付け部と基板受け部との間に空間を形成することにより、ＬＥＤ素子の周囲に空気の層を形成することができ、貫通孔および溝を介した熱の放出を効率的に行うことができる。 In such an LED bulb, it is preferable to form a space between the LED mounting portion and the substrate receiving portion by forming a leg portion on the substrate receiving portion and arranging the leg portion on the LED mounting portion side.
By forming a space between the LED mounting portion and the substrate receiving portion, an air layer can be formed around the LED element, and heat can be efficiently released through the through hole and the groove. it can.

さらに、ＬＥＤ取付け部と基板受け部との間に、通気性を有する別のフィルタを配置してもよい。
ＬＥＤ取付け部と基板受け部との間にフィルタを配置することにより、外側ボディと内側ボディとの間に配置されたフィルタを通り抜けた埃も、ＬＥＤ素子が取り付けられたカバー部材内部に侵入することが防止される。ここで、フィルタは通気性を有するため、ＬＥＤチップおよびインバーター，回路部品から発生する熱が貫通孔を通して溝に導かれる。 Furthermore, you may arrange | position another filter which has air permeability between a LED attachment part and a board | substrate receiving part.
By disposing a filter between the LED mounting portion and the substrate receiving portion, dust that has passed through the filter disposed between the outer body and the inner body also enters the inside of the cover member to which the LED element is mounted. Is prevented. Here, since the filter has air permeability, heat generated from the LED chip, the inverter, and the circuit component is guided to the groove through the through hole.

また、外側ボディは熱伝導性の良好な材料で形成され、外側ボディの外面を凹凸状にするためにリブが形成されてもよい。
外側ボディを熱伝導性の良好な材料で形成することにより、ＬＥＤ取付け部に形成された貫通孔および外側ボディの筒状体の内面とＬＥＤ取付け部とに形成された溝を介した放熱に加えて、外側ボディの表面から内部の熱を放射することができる。ここで、外側ボディの外面にリブを形成して凹凸状とすることにより、外側ボディの表面積を大きくすることができ、放熱性を良好にすることができる。 The outer body may be formed of a material having good thermal conductivity, and ribs may be formed to make the outer surface of the outer body uneven.
By forming the outer body from a material with good thermal conductivity, in addition to heat dissipation via the through-hole formed in the LED mounting portion and the groove formed in the inner surface of the cylindrical body of the outer body and the LED mounting portion. The internal heat can be radiated from the surface of the outer body. Here, by forming ribs on the outer surface of the outer body so as to have an uneven shape, the surface area of the outer body can be increased, and heat dissipation can be improved.

さらに、リブは、外側ボディの周方向および外側ボディの軸方向に形成されることが好ましい。
外側ボディの周方向および軸方向の両方にリブを形成することにより、外側ボディの表面積をさらに大きくすることができ、放熱性の良好なＬＥＤ電球とすることができる。 Furthermore, the rib is preferably formed in the circumferential direction of the outer body and the axial direction of the outer body.
By forming ribs in both the circumferential direction and the axial direction of the outer body, the surface area of the outer body can be further increased, and an LED bulb with good heat dissipation can be obtained.

この発明によれば、簡単な部品の組み立て作業により、ＬＥＤ素子の周辺部と外部とが連通したＬＥＤ電球を作製することができる。したがって、放熱性の良好なＬＥＤ電球を得ることができ、ＬＥＤ素子の周辺部の温度上昇を防止することができ、長寿命のＬＥＤ電球を得ることができる。 According to the present invention, an LED bulb in which the peripheral portion of the LED element communicates with the outside can be manufactured by a simple component assembling operation. Therefore, an LED bulb with good heat dissipation can be obtained, a temperature rise around the LED element can be prevented, and a long-life LED bulb can be obtained.

この発明の上述の目的，その他の目的，特徴および利点は、図面を参照して行う以下の発明を実施するための最良の形態の説明から一層明らかとなろう。 The above object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.

図１Ａは、この発明のＬＥＤ電球の一例を示す断面図解図であり、図１Ｂは、この発明のＬＥＤ電球の一例を示す断面図解図であり、図２は、図１に示すＬＥＤ電球の分解斜視図であり、図３は、図１に示すＬＥＤ電球に用いられる外側ボディを示す平面図であり、図４は、図３に示す外側ボディの正面図であり、図５は、図３に示す外側ボディの底面図であり、図６は、図３に示す外側ボディのＡ−Ａ断面図であり、図７は、図５に示す外側ボディのＣ−Ｃ断面図である。
ＬＥＤ電球１０は、外側ボディ１２を含む。外側ボディ１２は、図３〜図７に示すように、筒状体１４を含む。
筒状体１４は、たとえばアルミニウムなどの熱伝導性の良好な材料で形成される。筒状体１４は、軸方向の一端側が大径で他端側が小径の略円筒状に形成される。そして、筒状体１４の軸方向の一端側と他端側との間において、外壁面が内側に反るような曲面状に形成される。筒状体１４の外表面には、周方向に延びる複数のリブ１６が形成される。これらのリブ１６が形成されることにより、筒状体１４の表面積が大きくなり、放熱性を良好にすることができる。筒状体１４の内側には、均一な直径を有する空洞が形成される。 1A is a cross-sectional schematic view showing an example of the LED bulb of the present invention, FIG. 1B is a cross-sectional schematic view showing an example of the LED bulb of the present invention, and FIG. 2 is an exploded view of the LED bulb shown in FIG. FIG. 3 is a plan view showing an outer body used in the LED bulb shown in FIG. 1, FIG. 4 is a front view of the outer body shown in FIG. 3, and FIG. 6 is a bottom view of the outer body shown, FIG. 6 is a cross-sectional view of the outer body shown in FIG. 3, taken along the line AA, and FIG. 7 is a cross-sectional view of the outer body shown in FIG.
The LED bulb 10 includes an outer body 12. As shown in FIGS. 3 to 7, the outer body 12 includes a cylindrical body 14.
The cylindrical body 14 is formed of a material having good thermal conductivity such as aluminum. The cylindrical body 14 is formed in a substantially cylindrical shape having a large diameter at one end in the axial direction and a small diameter at the other end. And between the one end side and the other end side of the axial direction of the cylindrical body 14, it forms in the curved surface shape in which an outer wall surface curves inside. A plurality of ribs 16 extending in the circumferential direction are formed on the outer surface of the cylindrical body 14. By forming these ribs 16, the surface area of the cylindrical body 14 is increased, and the heat dissipation can be improved. A cavity having a uniform diameter is formed inside the cylindrical body 14.

筒状体１４の軸方向の一端側、つまり先端の大径側には、ＬＥＤ取付け部１８が形成される。ＬＥＤ取付け部１８は、筒状体１４の周縁端部から筒状体１４の軸方向において奥まった位置に形成され、中央部に平面視円板状のＬＥＤ取付けベース部２０が形成される。外側ボディ１２の軸方向の一端側において、ＬＥＤ取付けベース部２０の周囲には、平面視円形の段差部２２が形成される。段差部２２の周端部から外側、すなわち筒状体１４の先端側に向かうにしたがって、外側ボディ１２の開口部側に拡開するように傾斜する截頭円錐状の反射部２４が筒状体１４の外周縁の内側に環状に形成される。反射部２４の周囲には、平面視円形の溝部２６が筒状体１４の外周縁の内側に環状に形成される。反射部２４には、光を反射するように鏡面仕上げされたリフレクタ（図示せず）が、たとえばシリコン系接着剤などで接着される。リフレクタは、たとえば、アルミニウム、鉄、シリコンの合金などのような熱伝導性の良好な材料で形成される。 An LED mounting portion 18 is formed on one end side of the cylindrical body 14 in the axial direction, that is, on the large diameter side of the tip. The LED mounting portion 18 is formed at a position recessed from the peripheral edge of the cylindrical body 14 in the axial direction of the cylindrical body 14, and an LED mounting base portion 20 having a disk shape in plan view is formed at the center. On one end side in the axial direction of the outer body 12, a step portion 22 having a circular shape in plan view is formed around the LED mounting base portion 20. The frustoconical reflecting portion 24 that inclines so as to expand toward the opening side of the outer body 12 from the peripheral end portion of the stepped portion 22 to the outside, that is, toward the distal end side of the cylindrical body 14. 14 is formed in an annular shape inside the outer peripheral edge. Around the reflecting portion 24, a groove portion 26 having a circular shape in plan view is formed in an annular shape inside the outer peripheral edge of the cylindrical body 14. A reflector (not shown) that is mirror-finished so as to reflect light is bonded to the reflecting portion 24 with, for example, a silicon-based adhesive. The reflector is formed of a material having good thermal conductivity such as aluminum, iron, silicon alloy, and the like.

ＬＥＤ取付けベース部２０には、複数の貫通孔２８が形成される。貫通孔２８は、たとえば矩形に形成され、平面視円形の段差部２２の内側縁に沿って等間隔で配置される。さらに、ＬＥＤ取付けベース部２０には、２つのねじ孔３０が形成される。ねじ孔３０は、貫通孔２８の間において、ＬＥＤ取付けベース部２０の中心を通る径線上に形成される。 A plurality of through holes 28 are formed in the LED mounting base portion 20. The through holes 28 are formed in a rectangular shape, for example, and are arranged at equal intervals along the inner edge of the stepped portion 22 that is circular in plan view. Further, two screw holes 30 are formed in the LED mounting base portion 20. The screw hole 30 is formed on a radial line passing through the center of the LED mounting base portion 20 between the through holes 28.

筒状体１４の内側において、ＬＥＤ取付け部１８および筒状体１４の内面には、連続して形成される複数の第１の溝３２が形成される。第１の溝３２は、貫通孔２８形成部からＬＥＤ取付け部１８の外周側に向かって等間隔にＬＥＤ取付け部１８の中心から軸方向と直交した方向に放射状に形成され、さらに、その外周側から軸方向と平行に、筒状体１４の軸方向の他端部側、つまり小径部側に向かって延びるように形成される。したがって、筒状体１４の軸方向の他端部と貫通孔２８とが、第１の溝３２によって連通される。 A plurality of first grooves 32 that are continuously formed are formed on the inner surface of the LED mounting portion 18 and the cylindrical body 14 inside the cylindrical body 14. The first groove 32 is formed radially from the center of the LED mounting portion 18 in a direction perpendicular to the axial direction from the through hole 28 forming portion toward the outer peripheral side of the LED mounting portion 18, and further on the outer peripheral side thereof. In parallel with the axial direction, the cylindrical body 14 is formed to extend toward the other end side in the axial direction, that is, toward the small diameter side. Accordingly, the other end portion of the cylindrical body 14 in the axial direction and the through hole 28 are communicated with each other by the first groove 32.

また、筒状体１４の内面には、それぞれの第１の溝３２の間において等間隔に、後述する内側ボディ５８を固定するための第２の溝（内側ボディ固定溝）３４が形成される。第２の溝（内側ボディ固定溝）３４は、筒状体１４の軸方向の他端部すなわち後端側から、第１の溝３２に沿って軸方向に延びるように形成される。第２の溝（内側ボディ固定溝）３４は、ＬＥＤ取付け部１８から間隔を隔てた位置、つまり筒状体１４の中間部まで延びるように形成される。 In addition, on the inner surface of the cylindrical body 14, second grooves (inner body fixing grooves) 34 for fixing an inner body 58 described later are formed at equal intervals between the first grooves 32. . The second groove (inner body fixing groove) 34 is formed so as to extend in the axial direction along the first groove 32 from the other end portion in the axial direction of the cylindrical body 14, that is, the rear end side. The second groove (inner body fixing groove) 34 is formed to extend to a position spaced from the LED mounting portion 18, that is, to an intermediate portion of the cylindrical body 14.

反射部２４の内側において、ＬＥＤ取付けベース部２０の上面に、ＬＥＤ素子３６が取り付けられる。ＬＥＤ素子３６は、たとえば板状に形成され、ＬＥＤ取付けベース部２０に形成されたねじ孔３０に対応して、２つの取付孔３８が形成されている。ＬＥＤ素子３６には２つのリード端子４０が形成され、これらのリード端子４０が貫通孔２８を通るようにして、ＬＥＤ素子３６がＬＥＤ取付けベース部２０上に載置される。そして、ねじ４２を取付孔３８に通して、ＬＥＤ取付けベース部２０に形成されたねじ孔３０に螺入されることにより、ＬＥＤ素子３６がＬＥＤ取付けベース部２０に固定される。 The LED element 36 is attached to the upper surface of the LED attachment base portion 20 inside the reflection portion 24. The LED element 36 is formed in a plate shape, for example, and two attachment holes 38 are formed corresponding to the screw holes 30 formed in the LED attachment base portion 20. Two lead terminals 40 are formed on the LED element 36, and the LED element 36 is placed on the LED mounting base portion 20 so that these lead terminals 40 pass through the through holes 28. Then, the LED 42 is fixed to the LED mounting base portion 20 by passing the screw 42 through the mounting hole 38 and screwed into the screw hole 30 formed in the LED mounting base portion 20.

ＬＥＤ素子３６上には、カバー部材４４が被せられる。カバー部材４４は、図８に示すように、ガラスなどの透光性の材料でドーム状に形成される。カバー部材４４の端部４４ａは、絞った形状で底面視円環状に形成され、ＬＥＤ取付け部１８の溝部２６に嵌め込まれるように形成される。カバー部材４４は、耐熱性を有するシリコン系接着剤などで外側ボディ１２に固着される。カバー部材４４は、すりガラスで形成することにより、ＬＥＤ素子３６から放射された光を分散させることができる。 A cover member 44 is placed on the LED element 36. As shown in FIG. 8, the cover member 44 is formed in a dome shape with a light-transmitting material such as glass. The end portion 44 a of the cover member 44 is formed in a constricted shape in an annular shape when viewed from the bottom, and is formed so as to be fitted into the groove portion 26 of the LED attachment portion 18. The cover member 44 is fixed to the outer body 12 with a heat-resistant silicon adhesive or the like. The cover member 44 can be made of ground glass to disperse the light emitted from the LED element 36.

筒状体１４の内部において、ＬＥＤ取付け部１８に隣接して、基板受け部４６が配置される。基板受け部４６は、たとえば合成樹脂などで形成される。基板受け部４６は、図９および図１０に示すように、リング状に形成される。基板受け部４６の一方面側において、その外周端部には、基板受け部４６の厚み方向に突出する環状の突出部４８が形成され、突出部４８の内周縁には、後述する回路基板５０の設置板５２の厚みと同様の深さと、外周面に対応する内周縁を有する段差部４８ａが形成されている。基板受け部４６の外径は、筒状体１４の内側に嵌合する寸法に形成される。基板受け部４６は、その突出部４８がＬＥＤ取付け部１８の反対側となるようにして、筒状体１４内に嵌め込まれる。 A substrate receiving portion 46 is disposed adjacent to the LED attachment portion 18 inside the cylindrical body 14. The substrate receiving part 46 is formed of, for example, a synthetic resin. The substrate receiving part 46 is formed in a ring shape as shown in FIGS. On one side of the substrate receiving portion 46, an annular protruding portion 48 that protrudes in the thickness direction of the substrate receiving portion 46 is formed at the outer peripheral end portion, and a circuit board 50 described later is formed on the inner peripheral edge of the protruding portion 48. A stepped portion 48 a having a depth similar to the thickness of the installation plate 52 and an inner peripheral edge corresponding to the outer peripheral surface is formed. The outer diameter of the substrate receiving portion 46 is formed to a size that fits inside the cylindrical body 14. The substrate receiving portion 46 is fitted into the cylindrical body 14 such that the protruding portion 48 is on the opposite side of the LED mounting portion 18.

基板受け部４６の突出部４８内には、回路基板５０が配置される。回路基板５０は、図１１〜図１３に示すように、設置板５２を含む。設置板５２は、基板受け部４６の突出部４８の内側の段差部４８ａに嵌る直径の円板状に形成され、その両端に位置決め部５４が形成される。位置決め部５４は、組み立て時の位置決めないしは方向決めのために形成される。
設置板５２の一方面側には、複数の電子部品５６が設置される。これらの電子部品５６によって、ＬＥＤ素子３６を発光させるための回路が形成される。そして、電子部品５６がＬＥＤ取付け部１８の反対側に配置されるようにして、回路基板５０の設置板５２が、基板受け部４６の突出部４８の段差部４８ａ内に嵌め込まれる。 A circuit board 50 is disposed in the protruding portion 48 of the substrate receiving portion 46. As shown in FIGS. 11 to 13, the circuit board 50 includes an installation plate 52. The installation plate 52 is formed in a disk shape having a diameter that fits into the stepped portion 48a inside the protruding portion 48 of the substrate receiving portion 46, and positioning portions 54 are formed at both ends thereof. The positioning portion 54 is formed for positioning or direction determination during assembly.
A plurality of electronic components 56 are installed on one surface side of the installation plate 52. These electronic components 56 form a circuit for causing the LED element 36 to emit light. Then, the installation plate 52 of the circuit board 50 is fitted into the stepped portion 48 a of the protruding portion 48 of the board receiving portion 46 so that the electronic component 56 is disposed on the opposite side of the LED mounting portion 18.

電子部品５６を覆うようにして、合成樹脂などで形成された内側ボディ５８が取り付けられる。内側ボディ５８は、図１４〜図１６に示すように、大径円筒状の大径部６０と小径円筒状の小径部６２とを含む。これらの大径部６０と小径部６２とが、傾斜する連結部６４で連結される。内側ボディ５８の外面において、大径部６０と連結部６４との間には、段差部６６が形成され、小径部６２と連結部６４との間にも、段差部６８が形成される。また、内側ボディ５８の内面において、大径部６０と連結部６４との間には、段差部７０が形成され、小径部６２と連結部６４との間にも、段差部７２が形成される。 An inner body 58 formed of synthetic resin or the like is attached so as to cover the electronic component 56. As shown in FIGS. 14 to 16, the inner body 58 includes a large-diameter cylindrical large-diameter portion 60 and a small-diameter cylindrical small-diameter portion 62. The large diameter portion 60 and the small diameter portion 62 are connected by a connecting portion 64 that is inclined. On the outer surface of the inner body 58, a stepped portion 66 is formed between the large diameter portion 60 and the connecting portion 64, and a stepped portion 68 is also formed between the small diameter portion 62 and the connecting portion 64. Further, on the inner surface of the inner body 58, a stepped portion 70 is formed between the large diameter portion 60 and the connecting portion 64, and a stepped portion 72 is also formed between the small diameter portion 62 and the connecting portion 64. .

大径部６０の外径は、筒状体１４の内側に嵌るような寸法であって、基板受け部４６の突出部４８の外周の径と同じ寸法で且つ内周の径と同じ寸法に形成される。さらに、大径部６０の外面には、複数の凸部７４が形成される。凸部７４は、筒状体１４の内面に形成された第２の溝（内側ボディ固定溝）３４に対応する位置において、大径部６０の軸方向に延びるように形成される。これらの凸部７４は、大径部６０の端部からさらに延びて、若干突出するように形成される。 The outer diameter of the large-diameter portion 60 is a dimension that fits inside the cylindrical body 14 and is the same dimension as the outer diameter of the protrusion 48 of the substrate receiving portion 46 and the same diameter as the inner diameter. Is done. Furthermore, a plurality of convex portions 74 are formed on the outer surface of the large diameter portion 60. The convex portion 74 is formed to extend in the axial direction of the large-diameter portion 60 at a position corresponding to the second groove (inner body fixing groove) 34 formed on the inner surface of the cylindrical body 14. These convex portions 74 are formed so as to further extend from the end portion of the large-diameter portion 60 and slightly protrude.

内側ボディ５８は、大径部６０が電子部品５６を覆うようにして、筒状体１４の内側に嵌め込まれる。このとき、凸部７４が筒状体１４の内面に形成された第２の溝（内側ボディ固定溝）３４に沿うようにして、内側ボディ５８が外側ボディ１２に嵌合される。
大径部６０の前端部が基板受け部４６の突出部４８の後端に当たったところで、内側ボディ５８は停止され、基板受け部４６の突出部４８の段差部４８ａに嵌合された設置板５２を大径部６０の先端面で支持する。このとき、大径部６０の端部から突出した凸部７４の内側に、基板受け部４６が配置され、凸部７４の内面で基板受け部４６の突出部４８を支持される。そして、基板受け部４６と大径部６０の空洞とで形成される空間内に、電子部品５６が収納される。
凸部７４は、第２の溝（内側ボディ固定溝）３４に密嵌するような形状にしてもよく、又、耐熱性を有するシリコン系接着剤などの接着剤で固定するようにしてもよい。 The inner body 58 is fitted inside the cylindrical body 14 so that the large diameter portion 60 covers the electronic component 56. At this time, the inner body 58 is fitted to the outer body 12 so that the convex portion 74 is along the second groove (inner body fixing groove) 34 formed on the inner surface of the cylindrical body 14.
When the front end portion of the large diameter portion 60 hits the rear end of the protruding portion 48 of the substrate receiving portion 46, the inner body 58 is stopped and the installation plate fitted to the stepped portion 48 a of the protruding portion 48 of the substrate receiving portion 46. 52 is supported by the front end surface of the large diameter portion 60. At this time, the substrate receiving portion 46 is disposed inside the protruding portion 74 protruding from the end portion of the large diameter portion 60, and the protruding portion 48 of the substrate receiving portion 46 is supported by the inner surface of the protruding portion 74. The electronic component 56 is accommodated in a space formed by the substrate receiving portion 46 and the cavity of the large diameter portion 60.
The convex portion 74 may have a shape that fits closely into the second groove (inner body fixing groove) 34, or may be fixed with an adhesive such as a silicon-based adhesive having heat resistance. .

外側ボディ１２と内側ボディ５８との間には、リング状のフィルタ７６が取り付けられる。フィルタ７６は、内側ボディ５８の外面において大径部６０と連結部６４との間に形成された段差部６６と外側ボディ１２の筒状体１４の下側の内周縁に環状に形成された段差部１４ａとの間に嵌め込まれる。そして、必要に応じて、フィルタ７６は、段差部６６及び段差部１４ａと接し合う面に接着剤で固定してもよい。
フィルタ７６は、通気性の良好な材料で形成される。このようなフィルタ材料としては、たとえばステンレス鋼繊維の綿状のウェブを焼結圧縮成形して、繊維を相互に接着させたウェブ焼結体が用いられる。このようなウェブ焼結体の粗い層と蜜な層とを積層し、その両面をステンレス鋼などで形成されたサポートメッシュで挟み込んだフィルタ材料が用いられる。このようなフィルタ材料としては、たとえば、樹脂製フィルタ,ステンレス製フィルタ,スーパーボアー（商品名）などの製品を使用することができる。 A ring-shaped filter 76 is attached between the outer body 12 and the inner body 58. The filter 76 has a stepped portion 66 formed between the large-diameter portion 60 and the connecting portion 64 on the outer surface of the inner body 58 and a step formed annularly on the inner peripheral edge of the outer body 12 on the lower side of the cylindrical body 14. It is inserted between the part 14a. If necessary, the filter 76 may be fixed with an adhesive to the surface that contacts the stepped portion 66 and the stepped portion 14a.
The filter 76 is made of a material having good air permeability. As such a filter material, for example, a sintered web in which a cotton-like web of stainless steel fibers is sintered and compression-molded and the fibers are bonded to each other is used. A filter material is used in which a coarse layer and a honey layer of such a sintered web are laminated and sandwiched between both sides by a support mesh formed of stainless steel or the like. As such a filter material, for example, products such as a resin filter, a stainless steel filter, and a super bore (trade name) can be used.

内側ボディ５８の小径部６２には、口金７８が取り付けられる。口金７８は、白熱電球用のレセプタクルにねじ込むことができる所定の規格のものが用いられる。つまり、金属製のねじ込み部８０と端部電極８２とが、絶縁体８４を介して形成されたものである。この口金７８のねじ込み部８０が、内側ボディ５８の小径部６２と連結部６４との間の段差部６８部分まで嵌め込まれて固定される。必要に応じて、口金７８は、小径部６２の外周面と口金７８のねじ込み部８０の内面との間に耐熱性を有するシリコン系接着剤などの接着剤を塗布して固定してもよい。 A base 78 is attached to the small diameter portion 62 of the inner body 58. The base 78 is of a predetermined standard that can be screwed into an incandescent bulb receptacle. That is, the metal screw-in part 80 and the end electrode 82 are formed via the insulator 84. The screwed portion 80 of the base 78 is fitted and fixed to the stepped portion 68 between the small diameter portion 62 and the connecting portion 64 of the inner body 58. If necessary, the base 78 may be fixed by applying an adhesive such as a silicon-based adhesive having heat resistance between the outer peripheral surface of the small-diameter portion 62 and the inner surface of the screwed portion 80 of the base 78.

口金７８のねじ込み部８０および端部電極８２は、回路基板５０の入力部に接続され、回路基板５０の出力部は、ＬＥＤ素子３６のリード端子４０に接続される。したがって、レセプタクルにねじ込まれた口金７８に電力が与えられると、回路基板５０でＬＥＤ素子３６を発光させるための出力が得られ、それによってＬＥＤ素子３６が発光する。そして、ＬＥＤ素子３６から放射された光は、リフレクタで反射してカバー部材４４を透過し、外部に放出される。このとき、カバー部材４４をすりガラスで形成することにより、光を分散させることができる。 The screwed part 80 and the end electrode 82 of the base 78 are connected to the input part of the circuit board 50, and the output part of the circuit board 50 is connected to the lead terminal 40 of the LED element 36. Therefore, when electric power is applied to the cap 78 screwed into the receptacle, an output for causing the LED element 36 to emit light is obtained by the circuit board 50, thereby causing the LED element 36 to emit light. And the light radiated | emitted from the LED element 36 reflects with a reflector, permeate | transmits the cover member 44, and is discharge | released outside. At this time, the light can be dispersed by forming the cover member 44 from ground glass.

ここで、ＬＥＤ素子３６を発光させることにより、ＬＥＤ素子３６から発熱する。しかしながら、貫通孔２８と第１の溝３２とでＬＥＤ素子３６の周辺部がＬＥＤ電球１０の外部に連通されているため、これらの貫通孔２８および第１の溝３２を介して、ＬＥＤ素子３６で発生した熱が外部に放出される。さらに、このＬＥＤ電球１０では、外側ボディ１２と内側ボディ５８との間にフィルタ７６が取り付けられているため、外部から埃などが進入することを防止することができる。このフィルタ７６は、通気性を有するため、ＬＥＤ素子３６周辺の熱を放出する妨げとはならない。 Here, when the LED element 36 emits light, the LED element 36 generates heat. However, since the peripheral portion of the LED element 36 is communicated with the outside of the LED bulb 10 by the through hole 28 and the first groove 32, the LED element 36 is interposed through the through hole 28 and the first groove 32. The heat generated in is released to the outside. Furthermore, in this LED bulb 10, since the filter 76 is attached between the outer body 12 and the inner body 58, it is possible to prevent dust and the like from entering from the outside. Since this filter 76 has air permeability, it does not prevent the heat around the LED element 36 from being released.

また、外側ボディ１２が熱伝導性の良好な材料で形成されているため、外側ボディ１２の表面からの熱放射によって、ＬＥＤ素子３６で発生した熱が外部に放出される。ここで、外側ボディ１２の外表面にリブ１６が形成されていることにより、外側ボディ１２の外面の表面積を大きくすることができ、熱放射を大きくなって、効率よく熱の放出を行うことができる。さらに、リフレクタを熱伝導性の良好な材料で形成することにより、カバー部材４４内の熱を効率よく外側ボディ１２の外面に伝達することができる。このように、このＬＥＤ電球１０では、貫通孔２８および第１の溝３２を介した熱放出に加えて、外側ボディ１２の表面からの熱放射によって、ＬＥＤ素子３６で発生した熱を外部に放出することができる。 Further, since the outer body 12 is made of a material having good thermal conductivity, heat generated in the LED element 36 is released to the outside by heat radiation from the surface of the outer body 12. Here, since the rib 16 is formed on the outer surface of the outer body 12, the surface area of the outer surface of the outer body 12 can be increased, heat radiation can be increased, and heat can be efficiently released. it can. Furthermore, by forming the reflector with a material having good thermal conductivity, the heat in the cover member 44 can be efficiently transmitted to the outer surface of the outer body 12. As described above, in this LED bulb 10, heat generated in the LED element 36 is released to the outside by heat radiation from the surface of the outer body 12 in addition to heat release through the through hole 28 and the first groove 32. can do.

このＬＥＤ電球１０は、筒状体１４と前記筒状体１４の軸方向の一端側に形成される板状のＬＥＤ取付け部１８とからなる外側ボディ１２と、前記ＬＥＤ取付け部１８に取り付けられるＬＥＤ素子３６と、前記ＬＥＤ素子３６を覆うようにして前記外側ボディ１２に取り付けられる透光性のカバー部材４４と、前記ＬＥＤ素子３６の反対側において前記筒状体１４内に設けられる基板受け部４６と、前記基板受け部４６に取り付けられる前記ＬＥＤ素子３６を発光させるための回路基板５０と、前記回路基板５０を覆うようにして前記筒状体１４の軸方向の他端側から前記筒状体１４内に嵌め込まれる内側ボディ５８と、前記内側ボディ５８の外側端部に形成されて前記回路基板５０に接続される口金７８と、前記外側ボディ１２と前記内側ボディ５８との間に取り付けられる通気性を有するフィルタ７６とを備え、そして、外側ボディ１２に、カバー部材４４と、ＬＥＤ素子３６と、基板受け部４６と、回路基板５０と、内側ボディ５８と、フィルタ７６と、口金７８とを順に組み立てることにより作製されるが、それらを嵌め込む等により、容易に組み立てることができる。
しかも、単にこれらの部材を組み立てるだけで、前記ＬＥＤ取付け部１８に形成される貫通孔２８、および前記筒状体１４の軸方向の他方端側から前記貫通孔２８に向かって前記筒状体１４の内面および前記ＬＥＤ取付け部１８に連続して形成される溝を形成されるので、上述のようなＬＥＤ素子３６周辺の熱を放出することができる構成を得ることができる。 The LED bulb 10 includes an outer body 12 including a cylindrical body 14 and a plate-shaped LED mounting portion 18 formed on one end side of the cylindrical body 14 in the axial direction, and an LED mounted on the LED mounting portion 18. An element 36, a translucent cover member 44 attached to the outer body 12 so as to cover the LED element 36, and a substrate receiving portion 46 provided in the tubular body 14 on the opposite side of the LED element 36. A circuit board 50 for causing the LED element 36 attached to the board receiving portion 46 to emit light, and the cylindrical body from the other end side in the axial direction of the cylindrical body 14 so as to cover the circuit board 50 14, an inner body 58 fitted into the inner body 58, a base 78 formed at the outer end of the inner body 58 and connected to the circuit board 50, the outer body 12 and the inner body A filter 76 having air permeability that is attached between the outer body 12 and the cover 58, the LED element 36, the board receiving portion 46, the circuit board 50, and the inner body 58. The filter 76 and the base 78 are assembled in order, but can be easily assembled by fitting them.
Moreover, by simply assembling these members, the tubular body 14 is formed from the other end side in the axial direction of the tubular body 14 and the through hole 28 formed in the LED mounting portion 18 toward the through hole 28. Since the groove formed continuously in the inner surface of the LED and the LED mounting portion 18 is formed, a configuration capable of releasing the heat around the LED element 36 as described above can be obtained.

図１および図２に示す構成のＬＥＤ電球１０において、基板受け部の構成を変更することができる。この場合、例えば図１７および図１８に示すように、別の基板受け部８６を用いることができる。基板受け部８６は、円板状の底板部８８を含み、底板部８８には、回路基板５０とＬＥＤ素子３６のリード端子４０とを電気的に接続するために、２つの孔９０が形成される。底板部８８の外周端部から、底板部８８の一方面側に延びるリング状部９２が形成される。リング状部９２の内側端部には、段差部９４が形成され、この段差部９４に回路基板５０が取り付けられる。さらに、底板部８８の他方面側の外周端部には、複数の脚部９６が形成される。これらの脚部９６は、底板部８８の外周端部に沿って、等間隔で形成される。 In the LED bulb 10 having the configuration shown in FIGS. 1 and 2, the configuration of the substrate receiving portion can be changed. In this case, for example, as shown in FIGS. 17 and 18, another substrate receiving portion 86 can be used. The board receiving portion 86 includes a disc-shaped bottom plate portion 88, and two holes 90 are formed in the bottom plate portion 88 in order to electrically connect the circuit board 50 and the lead terminal 40 of the LED element 36. The A ring-shaped portion 92 extending from the outer peripheral end portion of the bottom plate portion 88 to one surface side of the bottom plate portion 88 is formed. A stepped portion 94 is formed at the inner end of the ring-shaped portion 92, and the circuit board 50 is attached to the stepped portion 94. Further, a plurality of leg portions 96 are formed on the outer peripheral end portion on the other surface side of the bottom plate portion 88. These leg portions 96 are formed at equal intervals along the outer peripheral end portion of the bottom plate portion 88.

この基板受け部８６は、脚部９６がＬＥＤ取付け部１８側となるようにして外側ボディ１２内に嵌め込まれる。このとき、ＬＥＤ取付け部１８に、脚部９６が嵌る凹部（図示せず）を形成しておくことにより、配線用の孔９０が所定の位置にくるように、基板受け部８６の位置決めを行うことができる。そして、脚部９６によって、ＬＥＤ取付け部８６と底板部８８との間に空間が形成され、脚部９６の間を通して、この空間と第１の溝３２とを連通させることができる。したがって、第１の溝３２を介して、ＬＥＤ素子３６周辺の熱を効率よく放出することができる。 The board receiving portion 86 is fitted into the outer body 12 such that the leg portion 96 is on the LED attachment portion 18 side. At this time, a concave portion (not shown) in which the leg portion 96 is fitted is formed in the LED mounting portion 18 so that the substrate receiving portion 86 is positioned so that the wiring hole 90 is at a predetermined position. be able to. A space is formed between the LED mounting portion 86 and the bottom plate portion 88 by the leg portion 96, and the space and the first groove 32 can be communicated with each other through the leg portion 96. Therefore, the heat around the LED element 36 can be efficiently released through the first groove 32.

なお、基板受け部８６とＬＥＤ取付け部１８との間に、通気性の良好な材料で形成されたフィルタ７６を取り付けてもよい。このようなフィルタとしては、たとえば、外側ボディ１２と内側ボディ５８との間に取り付けられたフィルタ７６と同じ材料を使用することができる。そして、フィルタ材料からフィルタ７６を切り抜いた内側部分を基板受け部８６とＬＥＤ取付け部１８との間に配置するフィルタとして用いることができる。このようなフィルタを使用すれば、ＬＥＤ取付けベース部２０に形成された貫通孔２８を介して、埃などがカバー部材４４側に侵入することを防止することができる。しかも、フィルタは通気性を有するため、カバー部材４４内の熱の放出に問題はない。 Note that a filter 76 formed of a material having good air permeability may be attached between the substrate receiving portion 86 and the LED attachment portion 18. As such a filter, the same material as the filter 76 attached between the outer body 12 and the inner body 58 can be used, for example. The inner part obtained by cutting out the filter 76 from the filter material can be used as a filter disposed between the substrate receiving part 86 and the LED attachment part 18. If such a filter is used, dust or the like can be prevented from entering the cover member 44 through the through hole 28 formed in the LED mounting base portion 20. In addition, since the filter has air permeability, there is no problem in the release of heat in the cover member 44.

このＬＥＤ電球１０は、図１７において示すように、筒状体１４と前記筒状体１４の軸方向の一端側に形成される板状のＬＥＤ取付け部１８とからなる外側ボディ１２と、前記ＬＥＤ取付け部１８に取り付けられるＬＥＤ素子３６と、前記ＬＥＤ素子３６を覆うようにして前記外側ボディ１２に取り付けられる透光性のカバー部材４４と、前記ＬＥＤ素子３６の反対側において前記筒状体１４内に設けられる基板受け部８６と、前記基板受け部８６に取り付けられる前記ＬＥＤ素子３６を発光させるための回路基板５０と、前記回路基板５０を覆うようにして前記筒状体１４の軸方向の他端側から前記筒状体１４内に嵌め込まれる内側ボディ５８と、前記内側ボディ５８の外側端部に形成されて前記回路基板５０に接続される口金７８と、前記外側ボディ１２と前記内側ボディ５８との間に取り付けられる通気性を有するフィルタ７６及び基板受け部８６とＬＥＤ取付け部１８との間に取り付けられる通気性を有するフィルタ７６とを備え、そして、図１９において示すように、外側ボディ１２に、カバー部材４４と、ＬＥＤ素子３６と、基板受け部８６と、回路基板５０と、内側ボディ５８と、フィルタ７６と、口金７８とを順に組み立てることにより作製されるが、それらを嵌め込む等により、容易に組み立てることができる。 As shown in FIG. 17, the LED bulb 10 includes an outer body 12 including a tubular body 14 and a plate-shaped LED mounting portion 18 formed on one end side in the axial direction of the tubular body 14, and the LED. An LED element 36 attached to the attachment portion 18, a translucent cover member 44 attached to the outer body 12 so as to cover the LED element 36, and the inside of the cylindrical body 14 on the opposite side of the LED element 36 A circuit board 50 for causing the LED element 36 attached to the circuit board receiver 86 to emit light, and the axial direction of the cylindrical body 14 so as to cover the circuit board 50. An inner body 58 fitted into the cylindrical body 14 from the end side, a base 78 formed at the outer end of the inner body 58 and connected to the circuit board 50, and a front 19 is provided with a breathable filter 76 attached between the outer body 12 and the inner body 58 and a breathable filter 76 attached between the substrate receiving portion 86 and the LED attachment portion 18. As shown in FIG. 4, the outer body 12 is fabricated by assembling the cover member 44, the LED element 36, the board receiving portion 86, the circuit board 50, the inner body 58, the filter 76, and the base 78 in this order. However, it can be easily assembled by fitting them.

また、図１７に示すように、外側ボディ１２の外表面において、周方向に形成されたリブ１６のほかに、外側ボディ１２の軸方向に延びるリブ９８が形成されてもよい。このように、外側ボディ１２の周方向および軸方向の両方に、リブ１６およびリブ９８を形成することにより、外側ボディ１２の表面積をさらに大きくすることができ、熱放射特性を良好にすることができる。 As shown in FIG. 17, a rib 98 extending in the axial direction of the outer body 12 may be formed on the outer surface of the outer body 12 in addition to the rib 16 formed in the circumferential direction. Thus, by forming the rib 16 and the rib 98 in both the circumferential direction and the axial direction of the outer body 12, the surface area of the outer body 12 can be further increased, and the heat radiation characteristics can be improved. it can.

このように、このＬＥＤ電球１０では、ＬＥＤ取付け部１８に貫通孔２８を形成し、ＬＥＤ素子３６周辺部と外部とを連通する第１の溝３２を外側ボディ１２内に形成することにより、容易に組み立てることができ、かつ放熱性に優れた構成を有するＬＥＤ電球１０を得ることができる。 Thus, in this LED bulb 10, the through hole 28 is formed in the LED mounting portion 18, and the first groove 32 that communicates the peripheral portion of the LED element 36 and the outside is formed in the outer body 12. It is possible to obtain the LED bulb 10 having a structure that can be assembled to each other and excellent in heat dissipation.

この発明のＬＥＤ電球の一例を示す断面図解図である。It is a cross-sectional solution figure which shows an example of the LED bulb of this invention. この発明のＬＥＤ電球の一例を示す断面図解図である。It is a cross-sectional solution figure which shows an example of the LED bulb of this invention. 図１に示すＬＥＤ電球の分解斜視図である。It is a disassembled perspective view of the LED bulb shown in FIG. 図１に示すＬＥＤ電球に用いられる外側ボディを示す平面図である。It is a top view which shows the outer side body used for the LED light bulb shown in FIG. 図３に示す外側ボディの正面図である。FIG. 4 is a front view of the outer body shown in FIG. 3. 図３に示す外側ボディの底面図である。FIG. 4 is a bottom view of the outer body shown in FIG. 3. 図３に示す外側ボディのＡ−Ａ断面図である。It is AA sectional drawing of the outer side body shown in FIG. 図５に示す外側ボディのＣ−Ｃ断面図である。It is CC sectional drawing of the outer side body shown in FIG. 図１に示すＬＥＤ電球に用いられるカバー部材を示す断面図である。It is sectional drawing which shows the cover member used for the LED bulb shown in FIG. 図１に示すＬＥＤ電球に用いられる基板受け部を示す平面図である。It is a top view which shows the board | substrate receiving part used for the LED light bulb shown in FIG. 図９に示す基板受け部のＡ−Ａ断面図である。It is AA sectional drawing of the board | substrate receiving part shown in FIG. 図１に示すＬＥＤ電球に用いられる回路基板を示す平面図である。It is a top view which shows the circuit board used for the LED light bulb shown in FIG. 図１１に示す回路基板の正面図である。It is a front view of the circuit board shown in FIG. 図１１に示す回路基板の側面図である。It is a side view of the circuit board shown in FIG. 図１に示すＬＥＤ電球に用いられる内側ボディを示す平面図である。It is a top view which shows the inner body used for the LED light bulb shown in FIG. 図１４に示す内側ボディの側面図である。It is a side view of the inner body shown in FIG. 図１４に示す内側ボディのＡ−Ａ断面図である。It is AA sectional drawing of the inner body shown in FIG. この発明のＬＥＤ電球の他の例を示す分解斜視図である。It is a disassembled perspective view which shows the other example of the LED bulb of this invention. 図１７に示すＬＥＤ電球に用いられる基板受け部を示す斜視図である。It is a perspective view which shows the board | substrate receiving part used for the LED light bulb shown in FIG. この発明のＬＥＤ電球の一例を示す断面図解図である。It is a cross-sectional solution figure which shows an example of the LED bulb of this invention. この発明のＬＥＤ電球の一例を示す断面図解図である。It is a cross-sectional solution figure which shows an example of the LED bulb of this invention.

Explanation of symbols

１０ＬＥＤ電球
１２外側ボディ
１４筒状体
１６リブ
１８ＬＥＤ取付け部
２０ＬＥＤ取付けベース部
２２段差部
２４反射部
２６溝部
２８貫通孔
３０ねじ孔
３２第１の溝
３４第２の溝（内側ボディ固定溝）
３６ＬＥＤ素子
３８取付孔
４０リード端子
４２ねじ
４４カバー部材
４４ａ端部
４６基板受け部
４８突出部
４８ａ段差部
５０回路基板
５２設置板
５４位置決め部
５６電子部品
５８内側ボディ
６０大径部
６２小径部
６４連結部
６６段差部
６８段差部
７０段差部
７２段差部
７４凸部
７６フィルタ
７８口金
８０ねじ込み部
８２端部電極
８４絶縁体
８６基板受け部
８８底板部
９０孔
９２リング状部
９４段差部
９６脚部
９８リブ DESCRIPTION OF SYMBOLS 10 LED bulb 12 Outer body 14 Tubular body 16 Rib 18 LED attachment part 20 LED attachment base part 22 Step part 24 Reflection part 26 Groove part 28 Through-hole 30 Screw hole 32 1st groove | channel 34 2nd groove | channel (inner body fixing groove) )
36 LED element 38 Mounting hole 40 Lead terminal 42 Screw 44 Cover member 44a End part 46 Substrate receiving part 48 Projection part 48a Step part 50 Circuit board 52 Installation board 54 Positioning part 56 Electronic component 58 Inner body 60 Large diameter part 62 Small diameter part 64 Connecting portion 66 Stepped portion 68 Stepped portion 70 Stepped portion 72 Stepped portion 74 Projected portion 76 Filter 78 Base 80 Screwed portion 82 End electrode 84 Insulator 86 Substrate receiving portion 88 Bottom plate portion 90 Hole 92 Ring-shaped portion 94 Stepped portion 96 Leg portion 98 Ribs

Claims

An outer body having a tubular body and a plate-like LED mounting portion formed on one end side in the axial direction of the tubular body;
An LED element attached to the LED attachment portion;
A translucent cover member attached to the outer body so as to cover the LED element;
A substrate receiving portion provided in the cylindrical body on the opposite side of the LED element;
A circuit board for emitting light from the LED element attached to the board receiving part;
An inner body that is fitted into the cylindrical body from the other end side in the axial direction of the cylindrical body so as to cover the circuit board;
A base formed on the outer end of the inner body and connected to the circuit board;
Comprising a breathable filter attached between the outer body and the inner body;
A through hole formed in the LED mounting portion, and a groove formed continuously from the other end side in the axial direction of the cylindrical body toward the through hole toward the inner surface of the cylindrical body and the LED mounting portion. Including LED bulbs.

The leg is formed in the board receiving part, and the space is formed between the LED attaching part and the board receiving part by arranging the leg on the LED attaching part side. The described LED bulb.

The LED bulb according to claim 1, further comprising another air-permeable filter disposed between the LED mounting portion and the substrate receiving portion.

The LED bulb according to any one of claims 1 to 3, wherein the outer body is formed of a material having good thermal conductivity, and ribs are formed to make the outer surface of the outer body uneven.

The LED bulb according to claim 4, wherein the rib is formed in a circumferential direction of the outer body and an axial direction of the outer body.