JP2009259946A - Liquid resin injecting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an injecting apparatus capable of performing evacuation quickly when injecting a liquid resin. <P>SOLUTION: The injecting apparatus comprises: a sealing member for airtightly sealing the periphery of a pair of wafers that are overlapped at an interval mutually while their surfaces face each other; an airtight vessel that is airtightly connected to the sealing member and stores a liquid resin; and an exhausting section for air-ventilating a space sandwiched by the pair of wafers. The sealing member has an opening for opening the space into the airtight vessel. After the inside of the space and that of the airtight vessel are decompressed while the sealing member and the airtight vessel are connected airtightly, a portion exposed into the opening at the periphery of the pair of wafers is brought into contact with the liquid resin, thus injecting the liquid resin into the space. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a liquid resin injection device. More specifically, the present invention relates to a liquid resin injecting apparatus that injects a liquid resin into a gap between wafers on which semiconductor elements are formed.

  One technique for improving the effective mounting density of semiconductor devices is a structure in which chips are stacked. A stacked chip semiconductor module in which chips before packaging are stacked can increase the processing density by shortening the wiring between the chips without being limited to an improvement in mounting density.

When manufacturing a laminated chip semiconductor module, a procedure may be employed in which chips are cut after bonding in wafer units. Patent Document 1 below describes a method for manufacturing a semiconductor device in which a silicon wafer having plated bumps and a base substrate are bonded together with an adhesive and then divided. Patent Document 2 described below describes injecting a resin by bringing the mating surfaces of stacked wafers into contact with a liquid agent in a vacuum environment. Furthermore, in the following Patent Document 3, it is described that when a resin is injected between stacked wafers, the liquid resin is defoamed in advance so that air bubbles do not occur between the wafers. .
Japanese Patent Laid-Open No. 10-027827 JP 2006-203084 A JP 2006-094441 A

  The gap between the wafers in the laminated wafer is about several μm to several tens of μm, and the volume of resin injected therein is only a few cc. On the other hand, the diameter of the laminated wafer ranges from 200 mm to 300 mm, and may be further increased in the future. Therefore, when the liquid resin is injected into the laminated wafer in a vacuum environment, a large vacuum chamber corresponding to the diameter of the laminated wafer is used. For this reason, a great amount of time is spent in the exhausting operation for reducing the vacuum chamber to a required degree of vacuum.

  Accordingly, in order to solve the above-described problems, according to the present invention, a sealing member that hermetically seals the peripheral edges of a pair of wafers whose surfaces face each other and are spaced apart from each other, and the sealing member are hermetically coupled. And an airtight container for storing the liquid resin and an exhaust part for exhausting the space sandwiched between the pair of wafers, and the sealing member has an open part for opening the space into the airtight container, and the sealing member In addition, after reducing the pressure in the space and the airtight container in a state where the airtight container is tightly coupled, the liquid resin is injected into the space by bringing the exposed portion of the peripheral edge of the pair of wafers into the open portion into contact with the liquid resin. A liquid resin injection device is provided.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. Also, a sub-combination of these feature groups can also be an invention.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solution of the invention.

  FIG. 1 is a front view of the injection device 100. FIG. 2 is a side view of the injection device 100. The injection device 100 includes an exhaust part 110, a sealing member 120, a sealing plate 130, and an airtight container 140. Also, the implantation apparatus 100 according to this embodiment is loaded with a laminated wafer 190 composed of a pair of wafers laminated with their surfaces facing each other.

  The airtight container 140 is a cubic airtight container, and has a pair of joints 142 and 144 on the side surface. The joint 112 communicates with the inside of the hermetic container 140 and can remove the pressure pipe. Thereby, the inside of the airtight container 140 can be communicated with an external vacuum source or pressure source.

  The sealing plate 130 is a flat plate-like member, and is fixed to the hermetic container 140 with a set screw 150 to hermetically seal the upper surface of the hermetic container 140. Further, the sealing plate 130 can be detached from the airtight container 140. Further, the sealing plate 130 supports the sealing member 120.

  The sealing member 120 has an annular shape and holds the laminated wafer 190 inside. Further, the sealing member 120 is supported by the sealing plate 130 and stands up above the airtight container 140. Inside the sealing member 120, the back surface of the wafer 192 forming the laminated wafer 190 appears.

  As described above, the sealing member 120 may have an opening that exposes the back surface of the laminated wafer 190. Thereby, the sealing member 120 can be formed with a minimum material. Further, since the back surface of the laminated wafer 190 can be observed from the outside, the liquid resin can be injected while monitoring the state of the laminated wafer 190.

  An exhaust part 110 is formed at the upper end of the sealing member 120. The exhaust part 110 has a joint 112 at the upper end. The joint 112 can detach the pressure tube, and can communicate the inside of the sealing member 120 with an external vacuum source. That is, the exhaust unit 110 constitutes a communication unit that communicates the upper end of the laminated wafer 190 with a vacuum source.

  FIG. 3 is an exploded view of the liquid resin injection device 100. Components common to those in FIGS. 1 and 2 are denoted by common reference numerals and redundant description is omitted.

  The exhaust unit 110 and the sealing member 120 can be detached from the sealing plate 130 while maintaining the state in which the laminated wafer 190 is held. As illustrated, the sealing member 120 has an annular shape in which ends of arcs are linearly coupled. Further, the lower end of the laminated wafer 190 is exposed to an opening portion 119. In the open part 119, the peripheral part of the laminated wafer 190 is also exposed.

  In the illustrated example, the sealing member 120 is mounted so that the orientation flat (orientation flat) of the laminated wafer 190 is exposed to the inside of the opening 119. Thereby, the secrecy of the sealing member 120 and the laminated wafer 190 can be kept good, but the arrangement is not limited to this.

  The sealing plate 130 can be removed from the airtight container 140 by removing the set screw 150. Thereby, the upper surface of the airtight container 140 can be opened.

  An O-ring 146 is provided at the upper edge of the airtight container 140 for the purpose of ensuring the adhesion between the sealing plate 130 and the airtight container 140. Moreover, the airtight container 140 has an airtight chamber 141 inside.

  The airtight chamber 141 communicates with a pair of joints 142 and 144 mounted on the side surfaces. In addition, the floor of the airtight chamber 141 is equipped with an elevating unit 160. The elevating unit 160 includes a cylinder 162 fixed to the floor surface of the hermetic chamber 141 and a piston 164 that slides up and down in the cylinder 162.

  An open container 170 is mounted on the elevating unit 160. The open container 170 is a dish-shaped container having an open upper surface and stores the liquid resin 172. The liquid resin 172 is, for example, a liquid thermosetting resin, and a resin having a particularly low viscosity is selected in view of the purpose of pouring into a narrow gap of the laminated wafer 190.

  FIG. 4 is a horizontal sectional view showing the structure of the sealing member 120. FIG. 4 shows a cross section of the portion indicated by arrow X in FIG.

  The laminated wafer 190 includes a pair of wafers 192 bonded with their surfaces facing each other. A device 194 including elements, circuits, and the like is already formed on each wafer 192 by photolithography or the like. For this reason, each surface of the wafer 192 is not flat, and a space is generated between the wafers 192 in the laminated wafer 190.

  Note that the structure of the laminated wafer 190 is not limited to this. When one wafer 192 is an unprocessed flat wafer 192, when a different wafer 192 such as a silicon wafer and a compound semiconductor wafer is combined, the wafer There may be various cases such as when the back surface of 192 is also processed such as polishing. In addition, the laminated wafers 192 themselves may be individually laminated wafers 190.

  The seal member 126 is in contact with the end surface of the laminated wafer 190. The sealing member 126 has elasticity and hermetically seals between the sealing member 120 and the laminated wafer 190. Note that the seal member 126 may be mounted alone in advance on the laminated wafer 190 and assembled by a procedure of attaching the sealing member 120 to the laminated wafer 190 with the seal member 126. This protects the end face of the laminated wafer 190 and facilitates handling.

  The sealing member 120 includes an outer frame portion 122, an inner frame portion 124 and a set screw 150. The outer frame portion 122 has a shape in which a side wall that contacts the side surface of the laminated wafer 190 from the outside via the seal member 126 and a rib portion that prevents the laminated wafer 190 from falling off in the thickness direction are combined.

  The inner frame portion 124 is fixed to the outer frame portion 122 by a set screw 150, and prevents the laminated wafer 190 from dropping off upward in the thickness direction. In other words, the seal member 126 and the laminated wafer 190 can be detached from the sealing member 120 by removing the set screw 150 and removing the inner frame portion 124.

  FIG. 5 is a vertical sectional view showing the structure of the sealing member 120. FIG. 5 shows a cross section of a portion indicated by an arrow Y in FIG. In addition, since the structure of the laminated wafer 190, the sealing member 126, and the sealing member 120 is substantially the same as the structure shown in FIG. 4, the overlapping description is abbreviate | omitted about a common part.

  In this cross section, the exhaust part 110 is disposed above the sealing member 120. The exhaust part 110 has an exhaust hole 114 penetrating downward from a joint 112 at the upper end. The exhaust hole 114 communicates with an exhaust hole 129 that penetrates the outer frame portion 122 and an exhaust hole 127 that penetrates the seal member 126.

  The exhaust hole 127 of the seal member 126 opens toward the mating surface of the wafer 192 in the laminated wafer 190. Thereby, the gap inside the laminated wafer 190 can be connected to a vacuum source or the like via the pressure tube connected to the joint 112.

  FIG. 6 is a partial cross-sectional view of the liquid resin injection device 100. In the following description, the same members as those described above are denoted by common reference numerals, and redundant description is omitted.

  In the liquid resin injection device 100, the laminated wafer 190 is held by the sealing member 120. The sealing member 120 is attached to the sealing plate 130. The sealing plate 130 is fixed to the airtight container 140 by a set screw 150.

  As a result, the gap inside the laminated wafer 190 communicates with the hermetic chamber 141 inside the hermetic container 140 at the opening 119 and is hermetically blocked from the outside. However, the gap between the laminated wafers 190 communicates with the joint 112 through the exhaust holes 114, 127, and 129. In addition, the orientation flat of the laminated wafer 190 is located at the lowermost end in the hermetic chamber 141.

  On the other hand, inside the hermetic chamber 141, the open container 170 containing the liquid resin 172 is mounted on the elevating unit 160. The liquid level of the liquid resin 172 is indicated by a dotted line B. Further, in the elevating part 160, the piston 164 is drawn into the cylinder 162, and the open container 170 is lowered. As a result, the liquid surface of the liquid resin 172 is positioned further below the lower end of the laminated wafer 190.

  Therefore, by closing one of the joints 142 and 144 and communicating the other with a vacuum source, the inside of the hermetic chamber 141 can be decompressed and the liquid resin 172 can be deaerated. In this case, the airtight chamber 141 is sufficient if it has a capacity to accommodate the elevating unit 160 and the open container 170, and the space including the entire laminated wafer 190 need not be decompressed. Therefore, the time required for deaeration is short.

  As described above, the hermetic container 140 may include the joints 142 and 144 that allow the hermetic chamber 141 to communicate with a vacuum source or a pressure source. Thereby, the liquid resin 172 can be deaerated efficiently.

  FIG. 7 is a partial cross-sectional view of the liquid resin injecting apparatus 100 and shows a state where the elevating unit 160 is operated and the open container 170 is raised. As shown in the figure, when the opening container 170 is raised, the liquid level of the liquid resin 172 is also raised, and the lower end of the laminated wafer 190 exposed to the airtight chamber 141 is immersed in the liquid resin 172.

  As described above, the airtight chamber 141 may further include an elevating unit 160 that raises the liquid level of the liquid resin 172 and immerses the other end of the laminated wafer 190 in the liquid resin 172. Thereby, the exposed portion of the laminated wafer 190 can be immersed in the liquid resin 172 without moving the relatively large laminated wafer 190.

  In addition, since it is desirable that the gap between the laminated wafers 190 appearing in the exposed portion of the laminated wafer 190 is fully submerged below the liquid surface of the liquid resin 172, the vicinity of the lower end of the sealing member 120 is also immersed in the liquid resin 172. . However, the liquid resin 172 before curing can be easily wiped off, so that it does not matter. In order to facilitate cleaning of the sealing member 120, it is also preferable to cover the surface of the sealing member 120 with a material having low adhesion to the liquid resin 172.

  Further, when the sealing member 120 and the airtight container 140 are combined, the laminated wafer 190 may stand upright with respect to the liquid surface of the liquid resin 172. As a result, the surface area of the laminated wafer 190 immersed in the liquid resin 172 is reduced, so that the operation of removing unnecessary liquid resin is facilitated.

  Further, in this embodiment, the liquid level of the liquid resin 172 is raised by raising the open container 170 containing the liquid resin 172, but the structure for operating the liquid level is not limited to this. For example, other structures such as a structure in which the liquid level is raised by sinking some member with respect to the liquid resin 172 directly stored in the hermetic chamber 141 can be arbitrarily selected.

  FIG. 8 is a diagram schematically showing the structure of the exhaust system of the liquid resin injection device 100. Of the three joints 112, 142, and 144 provided in the liquid resin injection device 100, the joint 112 attached to the upper end of the sealing member 120 and one joint 144 attached to the airtight container 140 are respectively exhaust valves. Coupled to the dry pump 240 through 210, 220. Vacuum gauges 212 and 222 are arranged between the joint 112 and the exhaust valve 210 and between the joint 144 and the exhaust valve 220, respectively.

  With such a structure, the gap between the laminated wafers 190 can be evacuated by opening the exhaust valve 210 while the dry pump 240 is operated. In addition, the vacuum gauge 212 can monitor how much vacuuming has been performed.

  Further, by opening the exhaust valve 220 while the dry pump 240 is operated, the inside of the hermetic chamber 141 can be evacuated. The progress of evacuation can be monitored by the vacuum gauge 222.

  On the other hand, the other joint 142 of the airtight container 140 is communicated with the atmosphere via the vent valve 230. Therefore, when the inside of the airtight container 140 is depressurized and the vent valve 230 is opened, the atmosphere is introduced into the airtight chamber 141 via the joint 142. Note that a filter or the like may be provided between the vent valve 230 and the atmosphere for the purpose of preventing contamination inside the hermetic chamber 141.

  FIG. 9 is a flowchart showing a procedure for injecting the liquid resin 172 into the laminated wafer 190. When the operation of injecting the liquid resin 172 into the laminated wafer 190 is started, control for maintaining the sealing member 120 and the airtight container 140 at a predetermined set temperature is started (step S101).

  The set temperature is determined within a range in which the viscosity of the liquid resin 172 is reduced and curing is not started. In other words, the set temperature is determined according to the characteristics of the liquid resin 172 to be used. A mechanism for maintaining the set temperature can also be provided in the liquid resin injection device 100 as described later.

  Next, the liquid resin 172 is filled into the open container 170 (step S102). At this time, the higher the liquid level of the liquid resin 172, the easier the operation described later. However, it is preferable to stop the liquid resin 172 from overflowing from the opening container 170 when the laminated wafer 190 is immersed. Thus, the open container 170 containing the liquid resin 172 is mounted on the elevating unit 160. The piston 164 of the elevating unit 160 is at the lowest position.

  Subsequently, the sealing member 120 is mounted on the laminated wafer 190 into which the liquid resin 172 is injected (step S103). When attaching the sealing member 120, first, the sealing member 126 is attached to the laminated wafer 190, and the laminated wafer 190 with the sealing member 126 is inserted into the outer frame portion 122. At this time, attention should be paid so that the exhaust hole 127 of the seal member 126 communicates with the exhaust hole 129 of the sealing member 120. Further, the inner frame portion 124 is attached to the outer frame portion 122 and fastened with a set screw 150.

  Further, the sealing plate 130 is attached to the sealing member 120, and the assembly of the sealing member 120 and the sealing plate 130 is attached to the airtight container 140 (step S104). Thus, the state shown in FIG. 6 is formed.

  Next, the operation of the dry pump 240 is started (step S105), and when the operation of the dry pump 240 reaches a steady state, the exhaust valves 210 and 220 are opened (step S106). At this time, the vent valve 230 is closed. As a result, the gap between the laminated wafers 190 and the gas inside the hermetic chamber 141 are exhausted.

  Defoaming of the liquid resin 172 is started by the decompression in the airtight chamber 141 (step S107). The progress of defoaming may be completed according to the processing time based on known data. Alternatively, the vacuum gauge 222 may be monitored to complete the process when the hermetic chamber 141 reaches a predetermined saturated vapor pressure of the liquid resin 172 (step S108).

  When the defoaming of the liquid resin 172 is completed, the exhaust valve 220 communicating with the hermetic chamber 141 is closed (step S109). Thereby, the inside of the airtight chamber 141 is stabilized by the saturated vapor pressure of the liquid resin 172. On the other hand, the exhaust valve 210 communicating with the sealing member 120 continues to be opened. As a result, the pressure inside the laminated wafer 190 eventually becomes equal to or lower than the pressure inside the hermetic chamber 141.

  Next, the elevating unit 160 is operated to raise the open container 170 (step S110). As a result, the lower end of the laminated wafer 190 exposed to the hermetic chamber 141 is immersed in the liquid resin 172.

  Further, the vent valve 230 is opened while maintaining the above state (step S111). As a result, the degree of vacuum in the airtight chamber 141 into which the air flows is decreasing toward the atmospheric pressure. This state can be monitored by the vacuum gauge 222.

  Further, the hermetic chamber 141 is pressurized toward the atmospheric pressure, while the inside of the laminated wafer 190 is drawn to the dry pump 240 through the upper exhaust hole 114. As a result, the liquid resin 172 is injected into the laminated wafer 190 from the lower end of the laminated wafer 190. Thus, when the liquid resin 172 is filled in the gaps inside the laminated wafer 190, the exhaust valve 210 is closed and the injection of the liquid resin 172 is terminated (step S112). The confirmation of whether or not the liquid resin 172 is filled may monitor the injection amount of the liquid resin 172 or the like. In addition, when the injection of the liquid resin 172 is repeatedly performed under a certain condition, the injection of the liquid resin 172 may be finished in a known required time.

  In this way, the sealing member 120 that hermetically seals the peripheral edges of the pair of wafers 192 that face each other and overlap each other with a space therebetween, and the sealing member 120 are hermetically coupled to accommodate the liquid-liquid resin 172. The sealing member 120 includes an opening portion 119 that opens the space into the hermetic container 140, and the sealing member 120 includes an opening portion 119 that opens the space into the airtight container 140. After the pressure in the space and the hermetic container 140 is reduced in a state where the 120 and the hermetic container 140 are hermetically coupled, the liquid resin 172 is brought into contact with a portion of the peripheral edge of the laminated wafer 190 that is exposed in the open portion 119. A liquid resin injection device 100 for injecting the resin 172 into the space is formed. Thus, when the inside of the laminated wafer 190 is exhausted, the outside of the laminated wafer 190 may not be exhausted.

  Further, the capacity of the hermetic chamber 141 can be made smaller than the volume of the laminated wafer 190 including the gap. Thereby, the exhaust amount required when injecting the liquid resin 172 can be significantly reduced. Therefore, it is possible to reduce the work time required for reducing the pressure in the hermetic chamber 141 and to improve the throughput when manufacturing a device using the laminated wafer 190.

  In addition, when the part exposed in the open part 119 among the peripheral edges of the laminated wafer 190 is brought into contact with the liquid resin 172, it is preferable to sink into the liquid resin 172 without leaving an open space in the part. Thereby, the liquid resin 172 to which the vent valve 230 is opened and the atmospheric pressure is applied is efficiently injected between the wafers 192.

  FIG. 10 is a cross-sectional view showing another structure of the sealing member 120. In addition, this sealing member 120 has the same structure as the sealing member 120 shown so far except the part demonstrated below. The same components as those in the other embodiments are denoted by the same reference numerals, and redundant description is omitted.

  As illustrated, the sealing member 120 includes a heating unit 123. The heating unit 123 is supported by the bridge member 121 in parallel with the back surface of the laminated wafer 190 held by the sealing member 120. The bridge member 121 connects the outer frame portion 122 or the inner frame portion 124 of the sealing member 120 and the back surface of the heating unit 123.

  With such a structure, the heating unit 123 can be handled integrally with the outer frame unit 122 or the inner frame unit 124, and heats the laminated wafer 190 in the immediate vicinity of the back surface of the wafer 192. It can be controlled well. In addition, since air that mediates heat enters between the heating unit 123 and the laminated wafer 190, heat can be transmitted more efficiently than when heating in a vacuum chamber. In addition, as a heating part 123, what has an infrared lamp etc. other than a heating wire can also be used.

  As described above, the sealing member 120 may further include a heating unit 123 that heats the back surface of the laminated wafer 190. Thereby, the laminated wafer 190 can be efficiently heated in a non-vacuum atmosphere. Moreover, since the heating part 123 can be replaced | exchanged according to a use, the heating part 123 of a suitable kind, a characteristic, and a capacity | capacitance can be used.

  FIG. 11 is a cross-sectional view showing still another structure of the sealing member 120. In addition, this sealing member 120 also has the same structure as the sealing member 120 shown so far except the part demonstrated below. The same components as those in the other embodiments are denoted by the same reference numerals, and redundant description is omitted.

  As illustrated, the sealing member 120 has a cover portion 125 that covers the back surface of the held laminated wafer 190. The cover part hermetically seals the space oriented together with the sealing member 120 and the back surface of the laminated wafer 190.

  As described above, the sealing member 120 may include the cover portion 125 that covers the back surface of the laminated wafer 190. Thereby, the back surface of the laminated wafer 190 can be protected from external contact or the like.

  Each of the cover portions 125 includes a joint 128 having a through hole that allows the inside and outside of the space to communicate with each other. Thus, the space facing the back surface of the laminated wafer 190 can be communicated with a vacuum source or the like via the joint 128.

  As described above, the cover 125 covers the back surface of the laminated wafer 190 in an airtight manner, and when the space of the laminated wafer 190 is decompressed, the space facing the back surface may also be decompressed. Thereby, a slight space along the back surface of the laminated wafer 190 is decompressed, and stress can be prevented from acting on the laminated wafer 190 due to a pressure difference between the front and back surfaces.

  Further, the sealing member 120 has a heating part 123 inside the cover part 125. Since the heating unit 123 generates heat in the space defined by the back surface of the laminated wafer 190, the inner surface of the sealing member 120, and the inner surface of the cover portion 125, the laminated wafer 190 can be efficiently heated.

  As described above, the cover unit 125 may include the heating unit 123 that heats the back surface of the laminated wafer 190. Thereby, the heat radiation to the outside is interrupted, and the laminated wafer 190 can be efficiently heated. Moreover, the contact from the outside to the heating part 123 can be prevented.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. Furthermore, it is apparent from the description of the scope of claims that embodiments with such changes or improvements can be included in the technical scope of the present invention.

1 is a front view of a liquid resin injection device 100. FIG. 3 is a side view of the liquid resin injection device 100. FIG. 1 is an exploded view of a liquid resin injection device 100. FIG. 3 is a horizontal sectional view showing a structure of a sealing member 120. FIG. 4 is a vertical sectional view showing a structure of a sealing member 120. FIG. 2 is a partial cross-sectional view of the liquid resin injection device 100. FIG. 2 is a partial cross-sectional view of the liquid resin injection device 100. FIG. 2 is a diagram schematically showing an exhaust system of the liquid resin injection device 100. FIG. It is a flowchart which shows the procedure of liquid resin 172 injection | pouring. 6 is a cross-sectional view showing another structure of the sealing member 120. FIG. 7 is a cross-sectional view showing still another structure of the sealing member 120. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Injection apparatus, 110 Exhaust part, 112, 142, 144, 128 Fitting, 114, 127, 129 Exhaust hole, 119 Open part, 120 Sealing member, 121 Bridge member, 122 Outer frame part, 123 Heating part, 124 Inner frame Part, 125 cover part, 126 sealing member, 130 sealing plate, 140 airtight container, 146 O-ring, 141 airtight chamber, 150 set screw, 160 elevating part, 162 cylinder, 164 piston, 170 open container, 172 liquid resin, 190 Laminated wafer, 192 wafer, 194 device, 210, 220 Exhaust valve, 212, 222 Vacuum gauge, 230 Vent valve, 240 Dry pump

Claims (10)

A sealing member that hermetically seals the peripheral edges of a pair of wafers whose surfaces face each other and overlap each other at an interval;
An airtight container that is airtightly coupled to the sealing member and contains a liquid resin;
An exhaust part for exhausting a space sandwiched between the pair of wafers,
The sealing member has an opening that opens the space into the airtight container,
After decompressing the space and the hermetic container in a state where the sealing member and the hermetic container are hermetically coupled, the exposed portion of the peripheral edge of the pair of wafers in the open portion contacts the liquid resin. A liquid resin injection device that injects the liquid resin into the space.   2. The liquid resin injection according to claim 1, further comprising an elevating unit that raises a liquid level of the liquid resin in the hermetic container so that portions exposed in the open portions of the pair of wafers come into contact with the liquid resin. apparatus.   The liquid resin injecting apparatus according to claim 1, wherein the sealing member has an opening exposing a back surface of the pair of wafers.   The liquid resin injection device according to claim 3, wherein the sealing member further includes a heating unit that heats the back surfaces of the pair of wafers.   The liquid resin injecting apparatus according to claim 1, wherein the sealing member has a cover portion that covers back surfaces of the pair of wafers.   The liquid resin injecting apparatus according to claim 5, wherein the cover part includes a heating part that heats the back surfaces of the pair of wafers.   The liquid resin injecting apparatus according to claim 5, wherein the cover part airtightly covers the back surfaces of the pair of wafers, and when the space is decompressed, the space facing the back surface is also decompressed.   8. The liquid resin injection device according to claim 1, wherein, when the sealing member and the hermetic container are combined, the pair of wafers stands upright with respect to the liquid surface of the liquid resin. 9. .   The liquid resin injecting device according to any one of claims 1 to 8, wherein the airtight container has a pressure coupling portion that communicates the airtight container with a vacuum source or a pressure source.   The said airtight container has a capacity | capacitance smaller than the volume which combined the volume of the said pair of wafer, and the volume of the area | region pinched | interposed into the said pair of wafer. Liquid resin injection device.

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