JP2009259501A - Ring contact connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve connection characteristics, and to reduce manufacturing cost regarding a ring contact connector formed by arranging a plurality of ring contacts each having a micro radius at a predetermined pitch. <P>SOLUTION: The ring contact connector is formed by arranging a plurality of conductive ring contacts 1 each having the micro radius at a predetermined arrangement pitch. The ring contact connector has such a configuration that: an insertion hole 5 of an insulating film 2 which is positioned at the inner diameter part of a ring contact 1 formed of a nickel electro-molded ring or the like, and has a projection 6 for holding the ring contact 1; the ring contact 1 is inserted into the insertion hole 5 of an insulating film formed at a prescribed pitch; the projection 6 is inserted into the inner diameter part of the ring contact 1; and the ring contact 1 is held by being prevented from falling off, or held by inserting an insulated supporting wire into the inner diameter part of the ring contact. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a ring contact connector for positioning and arranging a plurality of conductive micro-rings on an insulating film and connecting a plurality of contacts between one and the other arranged opposite to each other.

  Various configurations of pluggable connectors for electrical connection are already known depending on the application field. For example, a connector for testing a semiconductor integrated circuit enclosed in a package has a multi-terminal configuration, and requires a configuration that can be easily connected to a test apparatus and easily removed after the test is completed. For example, in the case of a BGA (Ball Grid Array) type semiconductor integrated circuit in which a plurality of connection terminals are arranged on the back surface of the package, a plurality of connection terminals constituted by solder balls or the like are arranged at minute intervals. There is known a sheet-like connector for connecting between the test terminal and the connection terminal on the test apparatus side.

As this sheet-like connector, for example, a plurality of ring-shaped conductors, S-shaped conductors, or conductors obtained by rolling metal thin wires into a ball shape are formed at predetermined positions on an insulating sheet such as polyester. In the plurality of through-holes, the upper and lower surfaces of the respective conductors are fixed by positioning and arranging so that the upper and lower contact portions are exposed and heated and pressed, and the insulating sheet is softened and deformed. For example, a configuration in which a contact portion for connecting the semiconductor integrated circuit side on the test apparatus side is proposed (see, for example, Patent Document 1).
JP-A-6-333624

  As the degree of integration of semiconductor integrated circuits improves, the number of connection terminals may increase to exceed 100, and the arrangement pitch of connection terminals may be 1 mm or less. Therefore, it is necessary to arrange the conductor of the connector in a configuration corresponding to that, and in order to manufacture the connector with accurate positioning, a highly accurate device is required, which raises a problem of increasing costs. In addition, in the structure currently disclosed by the above-mentioned patent document 1, since it arranges and manufactures the jig | tool for positioning and heating-pressing up and down, there exists a problem which the cost of a manufacturing apparatus rises. is there.

  An object of the present invention is to provide a ring contact connector in which ring contacts having a small radius are arranged at a predetermined arrangement pitch and the arrangement position can be maintained.

  The ring contact connector of the present invention is a ring contact connector in which a plurality of conductive minute radius ring contacts are arranged at a predetermined arrangement pitch, and is a piece that is located on the inner diameter portion of the ring contact and holds the ring contact It has a configuration in which a ring contact is inserted and held in an insertion hole of an insulating film in which insertion holes having holding projections are formed at a predetermined arrangement pitch.

  In addition, the first insulating support wires inserted into the inner diameter portion of the ring contact are held at intervals according to the arrangement pitch, and the second insulating support wires in the direction intersecting the first insulating support wires are braided, and the ring It has a configuration in which the contacts are held at a predetermined arrangement pitch.

  The ring contact connector of the present invention having a configuration in which conductive ring contacts are arranged and held in accordance with an arrangement pattern corresponding to connection terminals having a minute arrangement interval such as a semiconductor integrated circuit is inserted and held in an insertion hole formed in an insulating film. It has a configuration of positioning arrangement by insulating support wire and arrangement position holding by the relation of warp and weft, and has an advantage that it can be easily manufactured without requiring a large-scale manufacturing apparatus, and a ring contact Therefore, the reliability of connection as a ring contact connector can be improved.

  1 and 2, the ring contact connector of the present invention is a ring contact connector in which a plurality of conductive minute radius ring contacts 1 are arranged at a predetermined arrangement pitch. The ring contact 1 is inserted into the insertion hole 5 of the insulating film 2 which is positioned and formed with the insertion holes 5 having the protrusions 6 for holding the ring contact 1 at a predetermined arrangement pitch. The ring contact 1 is held by inserting the projection 6 into the ring.

  1A and 1B are explanatory views of Embodiment 1 of the present invention, in which FIG. 1A is a top view, FIG. 1B is a perspective view, FIG. 1C is a side view from the direction of arrow c in FIG. The side view from the arrow d direction of (A) is shown, 1 shows a ring contact, 2 shows an insulating film. The number of ring contacts 1 arranged is smaller than the number of contacts of an actual ring contact connector. Actually, the number of ring contacts 1 corresponding to the number of connection terminals of the BGA configuration is arranged, It constitutes a ring contact connector. The ring contact 1 uses a metal having a mechanical strength that does not have a large electrical resistance and is elastically deformable. For example, nickel (Ni) is formed around a metal rod such as stainless steel so as to have a desired thickness. Can be manufactured by electroforming technique, removing the central metal rod and cutting to a desired width. As described above, in the case of the ring contact 1 constituted by nickel electroforming, a desired elastic force and high durability are provided. For example, as a result of repeated pressurization tests for connection as a connector, 1 million times It had the above durability. Further, the outer diameter of the ring contact 1 is set to, for example, several mm to 0.5 mm or less corresponding to the arrangement pitch of the connection terminals of the semiconductor integrated circuit or the like, and the thickness can be elastically deformed. In addition, it is selected according to the outer diameter, and can be, for example, 1 mm or less. The width can be set to 1 mm or less, for example, corresponding to the arrangement pitch of the connection terminals of the semiconductor integrated circuit. The insulating film 2 can be, for example, a synthetic resin film such as polyimide resin, and an insertion hole is formed at the position where the ring contact 1 is disposed. The insulating film 2 is made thinner than the outer diameter of the ring contact 1. That is, the ring contact 1 is inserted into the insertion hole so that both sides are exposed as shown in the side view of (C) and the side view of (D).

  2A and 2B show the positioning and holding configuration of the ring contacts and the connector connection state, where FIG. 2A is an explanatory diagram of an example of the insertion hole arrangement, FIG. 2B is a sectional view of the main part, and FIG. Explanatory drawing of (D) shows explanatory drawing at the time of pressure connection. The insertion hole 5 formed in the insulating film 2 has a length and a width in which the ring contact 1 can be inserted, and the length is larger than the outer diameter of the ring contact 1 and is elastic at the time of press connection to the connection terminal. Select to enable deformation. In addition, it has a shape protruding into the insertion hole 5 and has a protrusion 6 having a width that enters the inner diameter portion of the ring contact 1. The protrusion 6 is elastically curved when the ring contact 1 is inserted, returns after the insertion, and is positioned at the inner diameter portion of the ring contact 1 to prevent the ring contact 1 from falling off. Therefore, the width of the protrusion 6 is made narrower than the inner diameter of the ring contact 1 and the length thereof is set to prevent the ring contact 1 from falling off. Preferably, it is longer than half of the width of the insertion hole, and even if the ring contact 1 approaches the insertion hole 5, the cantilever shape is inserted through more than half of the width. Thereby, the ring contacts 1 can be arranged at a predetermined pitch, inserted into the insertion hole 5 with a slight pressing force, and held. Therefore, it is not necessary to heat and press the insulating film 2, and the manufacturing cost can be reduced.

  Further, as shown in FIG. 2C, the ring contact 1 is inserted and held in the insertion hole 5 of the insulating film 2 so that, for example, the BGA connection terminal 3 of the semiconductor integrated circuit and the connection terminal 4 on the test apparatus side are positioned. When the pressure is applied from the BGA side, the ring contact 1 is elastically deformed as shown in (D), and the connection state between the connection terminal 3 on the BGA side and the connection terminal 4 on the test apparatus side is securely connected. can do. In this case, since the insulating film 2 is sufficiently thin as compared with the thickness of the ring contact 1, even if the elastically deformed ring contact 1 contacts the periphery of the insertion hole 5, the insulating film 2 side is also deformed. There is no practical problem because it is possible.

  3A and 3B are explanatory views of Embodiment 2 of the present invention, in which FIG. 3A is a top view, FIG. 3B is a perspective view, FIG. 3C is a side view from the direction of arrow c in FIG. The side view from the arrow d direction of (A) is shown, 21 shows a ring contact, 22 and 23 show the 1st, 2nd insulation support line. The first insulating support wire 22 is inserted into the inner diameter of the ring contact 21, and the ring contact 21 is fixed at a predetermined interval so that the first insulating support wire 22 and the second insulating support wire 23 are knitted. The first and second insulating support vessels 22 and 23 are made of nylon thread or the like, similar to the insulating support wire 12 of the second embodiment, and the diameter thereof is compared with the inner diameter of the ring contact 21. It should be thin enough. In the case of the third embodiment, the first insulating support wire 22 is a warp yarn and the second insulating support wire 23 is a weft yarn. As shown in the top view of FIG. The arrangement interval of the ring contact 21 in the direction is determined by the arrangement interval of the first insulating support wire 22, and the arrangement interval of the ring contact 21 in the vertical axis direction is determined by the second insulation support wire 23. When the arrangement interval of the contacts 21 in the vertical axis direction is large, it is also possible to weave so that the plurality of second insulating support wires 23 are positioned between the ring contacts 21. In this configuration, an insulating film is not required, and a ring contact connector in which the ring contacts 21 are arranged in a desired arrangement pattern can be constituted by using the technology of a textile machine.

It is explanatory drawing of Example 1 of this invention. It is principal part explanatory drawing of Example 1 of this invention. It is explanatory drawing of Example 2 of this invention.

Explanation of symbols

1, 21 Ring contact 2 Insulating film 3, 4 Connection terminal 5 Insertion hole 6 Projection 22, 23 First and second insulating support wires

Claims (2)

In a ring contact connector in which a plurality of conductive minute radius ring contacts are arranged at a predetermined arrangement pitch,
It has a configuration in which the ring contact is inserted and held in the insertion hole of the insulating film in which an insertion hole having a protrusion for holding the ring contact is formed at a predetermined arrangement pitch, located at the inner diameter portion of the ring contact. And
The protrusion has a cantilever shape protruding from one side of the insertion hole, and has a length that is more than half of the insertion hole, and a length that is approximately half or more of the width of the ring contact. Ring contact connector featuring. In a ring contact connector in which a plurality of conductive minute radius ring contacts are arranged at a predetermined arrangement pitch,
The first insulating support wires inserted into the inner diameter portion of the ring contact are held at intervals according to the arrangement pitch, and a second insulating support wire in a direction intersecting the first insulating support wires is braided. The ring contact connector is characterized in that the ring contacts are held at a predetermined arrangement pitch.

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