JP2009246068A - Package for semiconductor light-emitting device, its manufacturing method and the semiconductor light-emitting device - Google Patents

Package for semiconductor light-emitting device, its manufacturing method and the semiconductor light-emitting device Download PDF

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JP2009246068A
JP2009246068A JP2008089337A JP2008089337A JP2009246068A JP 2009246068 A JP2009246068 A JP 2009246068A JP 2008089337 A JP2008089337 A JP 2008089337A JP 2008089337 A JP2008089337 A JP 2008089337A JP 2009246068 A JP2009246068 A JP 2009246068A
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lead
semiconductor light
opening
emitting device
resin
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Japanese (ja)
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Yoshiyuki Sugita
善之 杉田
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Panasonic Corp
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Panasonic Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package with excellent reliability for a semiconductor light-emitting device which does not peel off a translucent resin formed so as to coat the semiconductor light-emitting device, and to provide its manufacturing method and the semiconductor light-emitting device. <P>SOLUTION: A helical projection 2a is formed on an inner wall face of an opening of a resinous envelope 2 from the base to a position at a predetermined height, thereby obtaining certain joint between the resinous envelope 2 and a translucent resin 5. A helical recess corresponding to the helical projection 2a is formed in a core pin of a forming die, whereby the core pin easily comes off by rotation. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、リードフレームを樹脂でインサート成形し、樹脂から成るカップ状の反射面を有する半導体発光装置用パッケージと、それを用いる半導体発光装置に関する。   The present invention relates to a package for a semiconductor light-emitting device having a cup-shaped reflective surface made of resin by insert molding a lead frame with resin, and a semiconductor light-emitting device using the same.

従来の半導体発光装置用パッケージとしては、一方のリードと他方のリードとを対向して配置し、対向する双方のリードの先端側を成形樹脂で包含し、リードの反対側が成形樹脂から外部へ延出するパッケージがあり、パッケージの一方の主面側に形成した開口の底面に双方のリードの先端が露出している。   In a conventional package for a semiconductor light emitting device, one lead and the other lead are arranged to face each other, the tip side of both the opposite leads is covered with molding resin, and the opposite side of the lead extends from the molding resin to the outside. There is a package to be taken out, and the leading ends of both leads are exposed on the bottom surface of the opening formed on one main surface side of the package.

従来の光半導体装置には、例えば図５に示すものがある。図５において、１０１ａは一方のリード、１０１ｂは他方のリード、１０２は樹脂外囲器、１０３は接続部材、１０４はＬＥＤチップ、１０５はワイヤー、１０６は樹脂を各々示している。   An example of a conventional optical semiconductor device is shown in FIG. In FIG. 5, 101a is one lead, 101b is the other lead, 102 is a resin envelope, 103 is a connecting member, 104 is an LED chip, 105 is a wire, and 106 is a resin.

図５に示すように、パッケージは、一方のリード１０１ａと他方のリード１０１ｂとが双方の先端において所定の間隙を保って対向しており、樹脂外囲器１０２により一方のリード１０１ａと他方のリード１０１ｂの先端側を包含している。一方のリード１０１ａと他方のリード１０１ｂは対向し合う側と反対側において双方の先端が各々樹脂外囲器１０２から外部へ延出している。樹脂外囲器１０２の一方の主面には開口が形成してあり、開口の底面において一方のリード１０１ａと他方のリード１０１ｂとが樹脂外囲器１０２から露出している。   As shown in FIG. 5, in the package, one lead 101a and the other lead 101b are opposed to each other with a predetermined gap at both ends, and one lead 101a and the other lead are held by the resin envelope 102. 101b of the front end side is included. The tips of one lead 101a and the other lead 101b extend from the resin envelope 102 to the outside on the opposite side and the opposite side. An opening is formed in one main surface of the resin envelope 102, and one lead 101a and the other lead 101b are exposed from the resin envelope 102 at the bottom of the opening.

樹脂外囲器１０２の開口に配置したＬＥＤチップ１０４は、一方のリード１０１ａの上に接続部材１０３を介して固着し、ＬＥＤチップ１０４と開口の底面に位置する他方のリード１０１ｂとの間をワイヤー１０５にてワイヤーボンドして実装しており、開口に透光性樹脂１０６を満たしてＬＥＤチップ１０４、ワイヤー１０５、リード１０１ａ、１０１ｂを封止して光半導体装置を構成している。   The LED chip 104 disposed in the opening of the resin envelope 102 is fixed on one lead 101a via a connecting member 103, and a wire is connected between the LED chip 104 and the other lead 101b located on the bottom surface of the opening. An optical semiconductor device is constructed by wire bonding at 105 and filling the opening with a translucent resin 106 and sealing the LED chip 104, the wire 105, and the leads 101a and 101b.

この構成の光半導体装置では、一方のリード１０１ａと他方のリード１０１ｂとの間に所定の電圧をかけて通電することでＬＥＤチップ１０４が光を発し、樹脂外囲器１０２の開口の内面が反射面をなしてＬＥＤチップ１０４から発する光を上方へ放射する。   In the optical semiconductor device having this configuration, the LED chip 104 emits light when a predetermined voltage is applied between the one lead 101a and the other lead 101b, and the inner surface of the opening of the resin envelope 102 is reflected. A light is emitted upward from the LED chip 104 in a plane.

また、透光性樹脂１０６を満たした開口の上に蛍光体を含むフィルム（図示せず）を載置する場合には、ＬＥＤチップ１０４が発した光がフィルム（図示せず）に含まれる蛍光体を励起し、蛍光体により決定される色を有する光と、ＬＥＤチップ１０４が発した色の光とが混合されることで、外部からは所定の色を有する光が観測される。このため、ＬＥＤチップ１０４の発色光と上述のフィルム（図示せず）に含まれる蛍光体との組み合わせを適宜に選択することにより、外部から観測される光の色を目的色にすることが可能であった。   When a film (not shown) containing a phosphor is placed on the opening filled with the translucent resin 106, the fluorescence emitted from the LED chip 104 is contained in the film (not shown). By exciting the body and mixing the light having the color determined by the phosphor and the light of the color emitted by the LED chip 104, light having a predetermined color is observed from the outside. For this reason, the color of the light observed from the outside can be made the target color by appropriately selecting the combination of the colored light of the LED chip 104 and the phosphor contained in the above-mentioned film (not shown). Met.

上述したパッケージを形成する一般的な方法としては、熱可塑性樹脂を射出成形にて形成するものと、熱硬化性樹脂をトランスファーモールド成形にて形成するものとが考えられるが、どちらの方法においても、成形金型にリードを挟持し、成形金型に形成したキャビティー内へ熔融樹脂を注入してインサート成形する。   As a general method for forming the above-described package, there are a method in which a thermoplastic resin is formed by injection molding and a method in which a thermosetting resin is formed by transfer molding. Then, the lead is sandwiched between the molding dies, and the molten resin is injected into the cavity formed in the molding dies to perform insert molding.

図６は、上述のインサート成形の方法を示す要部断面図であり、１０１ａは一方のリード、１０１ｂは他方のリード、１０７は成形金型、１０７ａは上金型、１０７ｂは下金型、１０７ｃは突出部を各々示している。   FIG. 6 is a cross-sectional view of the main part showing the above-described insert molding method, wherein 101a is one lead, 101b is the other lead, 107 is a molding die, 107a is an upper die, 107b is a lower die, 107c. Indicates protrusions.

図６に示すように、インサート成形では、成形金型１０７の上金型１０７ａと下金型１０７ｂとの間に、一方のリード１０１ａと他方のリード１０１ｂとを挟持する。一方のリード１０１ａと他方のリード１０１ｂは、双方の先端間に所定の間隙を保って対向するように配置する。   As shown in FIG. 6, in insert molding, one lead 101a and the other lead 101b are sandwiched between an upper die 107a and a lower die 107b of the molding die 107. One lead 101a and the other lead 101b are arranged to face each other with a predetermined gap between the tips.

上金型１０７ａには上述した樹脂外囲器１０２の開口に相当する突出部１０７ｃが設けてある。突出部１０７ｃは、上金型１０７ａと下金型１０７ｂとで一方のリード１０１ａおよび他方のリード１０１ｂを挟持する際に、キャビティー１０８内へ突出して配置し、先端面が一方のリード１０１ａと他方のリード１０１ｂとの先端部周辺の上面に達する。   The upper mold 107a is provided with a protruding portion 107c corresponding to the opening of the resin envelope 102 described above. The protruding portion 107c is disposed so as to protrude into the cavity 108 when the one lead 101a and the other lead 101b are sandwiched between the upper die 107a and the lower die 107b, and the tip end surface thereof is one lead 101a and the other die 101b. It reaches the upper surface around the tip of the lead 101b.

次に、上金型１０７ａと下金型１０７ｂとに形成したキャビティー１０８へ熔融樹脂（図示せず）を注入して充填し、熔融樹脂（図示せず）が固化した後に上金型１０７ａと下金型１０７ｂとを型開きし、インサート成形により一体化した樹脂外囲器（図示省略）と一方のリード１０１ａおよび他方のリード１０１ｂを取り出す。
特開２００１−３４５４８２号公報 特開２００２−１８４９２６号公報 Next, a molten resin (not shown) is injected and filled into the cavity 108 formed in the upper mold 107a and the lower mold 107b, and after the molten resin (not shown) is solidified, the upper mold 107a and The lower die 107b is opened and a resin envelope (not shown) integrated by insert molding, one lead 101a and the other lead 101b are taken out.
JP 2001-345482 A JP 2002-184926 A

しかしながら、上記した従来の構成においては、光半導体装置が特に高輝度で大量の発熱を伴うものである程に、ＬＥＤチップ１０４が発する光や光を発する際の熱が、樹脂外囲器１０２の成形樹脂と透光性の樹脂１０６との界面、および一方のリード１０１ａや他方のリード１０１ｂと透光性の樹脂１０６との界面に経時変化をもたらし、界面における密着強度が低下する。このため、外部から水分が浸入することや、最悪の場合は樹脂１０６の剥離によってワイヤー１０５が断線して不点灯と成る恐れがあった。   However, in the conventional configuration described above, the light emitted from the LED chip 104 and the heat generated when the light is emitted to such an extent that the optical semiconductor device is particularly bright and generates a large amount of heat. The interface between the molding resin and the translucent resin 106 and the interface between the one lead 101a or the other lead 101b and the translucent resin 106 are changed with time, and the adhesion strength at the interface is lowered. For this reason, there is a possibility that moisture enters from the outside or, in the worst case, the wire 105 is disconnected due to the peeling of the resin 106 and the light is not turned on.

また、樹脂１０６が樹脂外囲器１０２から剥離することを防止するために、透過性樹脂１０６と樹脂外囲器１０２との界面に凹凸部等を設けることが考えられる。しかしながら、上金型１０７ａと下金型１０７ｂとを型開きする際には、キャビティー１０８に充填して固化した成形樹脂から成形金型１０７の突出部１０７ｃが抜け去ることが必要であり、突出部１０７ｃの表面に剥離防止に効果を発揮する形状を形成することは困難であった。   Further, in order to prevent the resin 106 from peeling from the resin envelope 102, it is conceivable to provide an uneven portion or the like at the interface between the transparent resin 106 and the resin envelope 102. However, when the upper mold 107a and the lower mold 107b are opened, it is necessary that the protruding portion 107c of the molding die 107 be removed from the molding resin filled in the cavity 108 and solidified. It was difficult to form a shape exhibiting an effect for preventing peeling on the surface of the portion 107c.

本発明は、上記の課題を解決するものであり、半導体発光素子を封止する透光性樹脂が剥離することがなく、信頼性に優れた半導体発光装置用パッケージとその製造方法および半導体発光装置を提供することを目的とする。   SUMMARY OF THE INVENTION The present invention solves the above-described problems, and a translucent resin that seals a semiconductor light-emitting element does not peel off, and has a highly reliable package for a semiconductor light-emitting device, a method for manufacturing the same, and a semiconductor light-emitting device The purpose is to provide.

上記した課題を解決するために、本発明の半導体発光装置用パッケージは、樹脂外囲器の主面に、半導体発光素子を搭載するための開口を有し、前記開口の内壁面に凸部もしくは凹部を形成したことを特徴とする。   In order to solve the above-described problems, a package for a semiconductor light emitting device of the present invention has an opening for mounting a semiconductor light emitting element on the main surface of a resin envelope, and a convex portion or an inner wall surface of the opening. A recess is formed.

また、本発明の半導体発光装置用パッケージにおいて、前記樹脂外囲器の主面に形成する前記開口が軸心方向と直交する断面形状において円形をなし、前記開口の内壁面に形成する前記凸部が一筋または複数筋の螺旋状をなすことを特徴とする。   In the semiconductor light emitting device package of the present invention, the opening formed in the main surface of the resin envelope has a circular shape in a cross-sectional shape perpendicular to the axial direction, and the protrusion is formed on the inner wall surface of the opening. Has a spiral shape of one or a plurality of muscles.

また、本発明の半導体発光装置用パッケージにおいて、前記開口は、底面から樹脂外囲器の主面に向けて口径が広がる上拡がりの形状をなすことを特徴とする。
また、本発明の半導体発光装置用パッケージにおいて、前記開口の内壁面に形成する螺旋状の前記凸部は、前記開口の底面から始まり内壁面の所定の高さ位置まで形成した形状をなすことを特徴とする。 In the package for a semiconductor light emitting device of the present invention, the opening has an upwardly expanding shape from the bottom surface toward the main surface of the resin envelope.
In the semiconductor light emitting device package of the present invention, the spiral convex portion formed on the inner wall surface of the opening has a shape formed from the bottom surface of the opening to a predetermined height position on the inner wall surface. Features.

また、本発明の半導体発光装置用パッケージにおいて、前記樹脂外囲器が第一のリードと第二のリードの一部を包含し、前記樹脂外囲器の開口において第一のリードと第二のリードとが所定の間隙を保って実質的に同一面上で対向し、かつ前記開口の底面に露出することを特徴とする。     In the semiconductor light emitting device package of the present invention, the resin envelope includes a first lead and a part of the second lead, and the first lead and the second lead are opened in the opening of the resin envelope. The lead is substantially on the same plane with a predetermined gap, and is exposed to the bottom surface of the opening.

本発明の半導体発光装置は、第一のリードと第二のリードとを包含する樹脂外囲器を有し、前記樹脂外囲器の主面に形成した開口の底面において、前記第一のリードと前記第二のリードとが所定の間隙を保って実質的に同一面上で対向し、前記第一のリードと前記第二のリードの双方の対向し合う側と反対側の先端が各々前記樹脂外囲器から外部へ延出し、前記開口は内壁面に凸部もしくは凹部を有し、前記開口の底面に位置する前記第一のリードの第一主面に接続部材を介して半導体発光素子を固着し、前記半導体発光素子と前記開口の底面に位置する前記第二のリードとをワイヤーにてワイヤーボンドし、前記開口に前記半導体発光素子を含んで透光性樹脂を満たしたことを特徴とする。   The semiconductor light emitting device of the present invention has a resin envelope including a first lead and a second lead, and the first lead is formed on a bottom surface of an opening formed in a main surface of the resin envelope. And the second lead are opposed to each other on a substantially same plane with a predetermined gap, and the opposite ends of both the first lead and the second lead are opposite to each other. A semiconductor light emitting element extending from a resin envelope to the outside, the opening having a convex portion or a concave portion on an inner wall surface, and a first main surface of the first lead located on the bottom surface of the opening via a connecting member The semiconductor light emitting element and the second lead located on the bottom surface of the opening are wire-bonded with a wire, and the opening includes the semiconductor light emitting element and is filled with a translucent resin. And

また、本発明の半導体発光装置において、前記開口は、軸心方向と直交する断面形状が円形をなして底面から前記樹脂外囲器の主面に向けて口径が広がる上拡がりの形状をなし、前記内壁面に有する前記凸部が一筋または複数筋の螺旋状をなして前記開口の底面から始まり前記内壁面の所定の高さ位置まで形成した形状をなすことを特徴とする。   Further, in the semiconductor light-emitting device of the present invention, the opening has a circular shape with a cross section orthogonal to the axial direction, and a shape in which the diameter increases from the bottom surface toward the main surface of the resin envelope, The convex portion included in the inner wall surface is formed in a spiral shape of one line or a plurality of lines and starts from the bottom surface of the opening to a predetermined height position of the inner wall surface.

本発明の半導体発光装置用パッケージの製造方法は、軸心方向と直交する断面形状において円形をなし、かつ先細りするテーパー状の先端側に一筋または複数筋の螺旋状凹部を形成した第一のコアーピンを、成形金型の上金型と下金型との間に形成したキャビティ内に、前記上金型に設けた貫通孔から回転自在に、かつ軸心方向へスライド自在に挿通し、前記キャビティーに熔融樹脂を注入充填し、前記熔融樹脂が固化した後に、前記第一のコアーピンを前記螺旋状凹部の形状に沿って回転させながら前記キャビティーから外へ退避させ、その後に前記上金型と前記下金型とを型開きして樹脂外囲器を取り出すことを特徴とする。   The method for manufacturing a package for a semiconductor light-emitting device according to the present invention includes a first core pin having a circular shape in a cross-sectional shape orthogonal to the axial direction and having a one or more spiral concave portions formed on a tapered tip side. Is inserted into a cavity formed between the upper die and the lower die of the molding die so as to be rotatable from a through hole provided in the upper die and slidable in the axial direction. After the molten resin is injected and filled into the tee and the molten resin is solidified, the first core pin is retreated from the cavity while rotating along the shape of the spiral recess, and then the upper mold And the lower mold are opened to take out the resin envelope.

また、本発明の半導体発光装置用パッケージの製造方法において、前記成形金型の上金型と下金型との間に、リードフレームの一部である第一のリードと第二のリードとを所定の間隙を保って実質的に同一面上で対向する状態に挟持し、前記第一のコアーピンを前記上金型の貫通孔から前記キャビティ内へ挿通し、前記第一のコアーピンの先端面を前記第一のリードの一部と前記第二のリードの一部に当接させ、前記キャビティーに熔融樹脂を充填し、前記熔融樹脂が固化した後に、前記第一のコアーピンを前記螺旋状凹部の形状に沿って回転させながら前記キャビティーから外へ退避させ、その後に前記上金型と前記下金型とを型開きして、前記第一のリードと前記第二のリードとを一体化した前記樹脂外囲器を取り出すことを特徴とする。   In the method for manufacturing a package for a semiconductor light emitting device according to the present invention, a first lead and a second lead, which are part of a lead frame, are provided between the upper die and the lower die of the molding die. The first core pin is inserted into the cavity from the through hole of the upper mold, and is held in a state of facing the substantially same surface with a predetermined gap, and the tip surface of the first core pin is inserted into the cavity. After contacting a part of the first lead and a part of the second lead, filling the cavity with a molten resin, and solidifying the molten resin, the first core pin is inserted into the spiral recess. The first lead and the second lead are integrated by opening the upper die and the lower die, and then retreating from the cavity while rotating along the shape of The resin envelope is removed.

本発明の半導体発光装置用パッケージの製造方法は、軸心方向と直交する方向に摺動する摺動部を有し、かつ先細りするテーパー状の先端側において前記摺動部に一箇所または複数個所の凸部を有する第二のコアーピンを、成形金型の上金型と下金型との間に形成したキャビティ内に、前記上金型に設けた貫通孔から軸心方向へスライド自在に挿通し、前記キャビティーに熔融樹脂を注入充填し、前記熔融樹脂が固化した後に、前記第二のコアーピンの摺動部を摺動させて前記凸部を前記第二のコアーピンの内部側へ引き込み、前記第二のコアーピンを前記キャビティーから外へ退避させ、その後に前記上金型と前記下金型とを型開きして樹脂外囲器を取り出すことを特徴とする。   The method for manufacturing a package for a semiconductor light-emitting device of the present invention has a sliding portion that slides in a direction orthogonal to the axial direction, and one or more locations on the sliding portion on the tapered tip end side that tapers. A second core pin having a convex portion is inserted into a cavity formed between the upper die and the lower die of the molding die so as to be slidable in the axial direction from the through hole provided in the upper die. The molten resin is injected and filled into the cavity, and after the molten resin is solidified, the sliding portion of the second core pin is slid to draw the convex portion into the inner side of the second core pin, The second core pin is retracted out of the cavity, and then the upper mold and the lower mold are opened to take out the resin envelope.

また、本発明の半導体発光装置用パッケージの製造方法において、前記成形金型の上金型と下金型との間に、リードフレームの一部である第一のリードと第二のリードとを所定の間隙を保って実質的に同一面上で対向する状態に挟持し、前記第一のコアーピンを前記上金型の貫通孔から前記キャビティ内へ挿通し、前記第一のコアーピンの先端面を前記第一のリードの一部と前記第二のリードの一部に当接させ、前記キャビティーに熔融樹脂を充填し、前記熔融樹脂が固化した後に、前記第二のコアーピンの摺動部を摺動させて前記凸部を前記第二のコアーピンの内部側へ引き込み、前記第二のコアーピンを前記キャビティーから外へ退避させ、その後に前記上金型と前記下金型とを型開きして、前記第一のリードと前記第二のリードとを一体化した前記樹脂外囲器を取り出すことを特徴とする。   In the method for manufacturing a package for a semiconductor light emitting device according to the present invention, a first lead and a second lead, which are part of a lead frame, are provided between the upper die and the lower die of the molding die. The first core pin is inserted into the cavity from the through hole of the upper mold, and is held in a state of facing the substantially same surface with a predetermined gap, and the tip surface of the first core pin is inserted into the cavity. After contacting a part of the first lead and a part of the second lead, filling the cavity with a molten resin, and solidifying the molten resin, the sliding portion of the second core pin is Slide the protrusion to the inside of the second core pin, retract the second core pin out of the cavity, and then open the upper mold and the lower mold The first lead and the second lead Characterized in that retrieving the resin envelope ized.

以上のように、本発明によれば、樹脂外囲器の開口側面に凸部もしくは凹部を形成してもインサート成形が可能であり、開口の内壁面に形成した凸部もしくは凹部が、半導体発光素子を覆う透光性樹脂に対してアンカー効果を発揮することで、樹脂外囲器の開口の内壁面と透光性樹脂との確実な接合を得ることができ、両者の剥離を防止して信頼性に優れる半導体発光装置用パッケージおよび半導体発光装置を実現できる。   As described above, according to the present invention, insert molding is possible even if a convex portion or a concave portion is formed on the opening side surface of the resin envelope, and the convex portion or concave portion formed on the inner wall surface of the opening is a semiconductor light emitting device. By exhibiting the anchor effect on the translucent resin that covers the element, it is possible to obtain a reliable bond between the inner wall surface of the opening of the resin envelope and the translucent resin, and prevent both from peeling off. A highly reliable semiconductor light emitting device package and semiconductor light emitting device can be realized.

以下本発明の実施の形態について、図面を参照しながら説明する。
（実施の形態１）
図１は、本発明の実施の形態１における半導体発光装置を示し、（ａ）は、半導体発光素子３を覆う透光性樹脂５を除外した状態の斜視図、（ｂ）は断面図である。図１において、１はリードフレーム、１ａは第一のリード、１ｂは第二のリード、２は樹脂外囲器、２ａは螺旋状凸部、３は半導体発光素子、４はワイヤー、５は透光性樹脂を各々示している。 Embodiments of the present invention will be described below with reference to the drawings.
(Embodiment 1)
1A and 1B show a semiconductor light-emitting device according to Embodiment 1 of the present invention, in which FIG. 1A is a perspective view in a state where a translucent resin 5 covering a semiconductor light-emitting element 3 is excluded, and FIG. 1B is a cross-sectional view. . In FIG. 1, 1 is a lead frame, 1a is a first lead, 1b is a second lead, 2 is a resin envelope, 2a is a spiral projection, 3 is a semiconductor light emitting element, 4 is a wire, and 5 is a transparent wire. Each photopolymer is shown.

図１に示すように、半導体発光装置を構成する半導体発光装置用パッケージは、リードフレーム１の一部である第一のリード１ａと第二のリード１ｂとが双方の先端間に所定の間隙を保って実質的に同一面上で対向しており、第一のリード１ａと第二のリード１ｂとを包含して形成した樹脂外囲器２を備えている。   As shown in FIG. 1, the semiconductor light emitting device package constituting the semiconductor light emitting device has a first lead 1a and a second lead 1b, which are part of the lead frame 1, with a predetermined gap between the tips. The resin envelope 2 is formed to include the first lead 1a and the second lead 1b.

第一のリード１ａと第二のリード１ｂは、対向し合う側と反対側の双方の先端が各々樹脂外囲器２から外部へ延出しており、樹脂外囲器２の一方の主面に形成した開口の底面に第一のリード１ａの第一主面と第二のリード１ｂの第一主面とが樹脂外囲器２の成形樹脂から露出している。
樹脂外囲器２の開口は、底面が第一のリード１ａおよび第二のリード１ｂの第一主面と同一面上にあり、底面から樹脂外囲器２の主面に向けて広がる上拡がりの形状をなし、底面と平行な断面において円形状を成している。 The first lead 1 a and the second lead 1 b have opposite ends on opposite sides extending from the resin envelope 2 to the outside, respectively, on one main surface of the resin envelope 2. The first main surface of the first lead 1a and the first main surface of the second lead 1b are exposed from the molding resin of the resin envelope 2 on the bottom surface of the formed opening.
The opening of the resin envelope 2 has a bottom surface that is flush with the first main surface of the first lead 1a and the second lead 1b, and spreads upward from the bottom surface toward the main surface of the resin envelope 2. And has a circular shape in a cross section parallel to the bottom surface.

開口の内壁面は樹脂外囲器２の表面をなし、開口の内壁面には一筋または複数筋の螺旋状凸部２ａが形成してあり、螺旋状凸部２ａは開口の底面から始まり内壁面の所定の高さ位置まで形成してある。   The inner wall surface of the opening forms the surface of the resin envelope 2, and one or more spiral convex portions 2a are formed on the inner wall surface of the opening. The spiral convex portion 2a starts from the bottom surface of the opening. To a predetermined height position.

半導体発光装置用は、上述した構成の半導体発光装置用パッケージに半導体発光素子３を実装したものであり、半導体発光素子３は樹脂外囲器２の開口の底面に位置する第一のリード１ａの第一主面の上に接続部材（図示せず）を介して固着してあり、半導体発光素子３と樹脂外囲器２の開口の底面に位置する第二のリード１ｂとの間をワイヤー４にてワイヤーボンドし、樹脂外囲器２の開口を満たす透光性樹脂５が半導体発光素子３、第一のリード１ａ、第二のリード１ｂ、ワイヤー４を封止している。   For the semiconductor light emitting device, the semiconductor light emitting element 3 is mounted on the semiconductor light emitting device package having the above-described configuration. The semiconductor light emitting element 3 is formed of the first lead 1 a located on the bottom surface of the opening of the resin envelope 2. A wire 4 is fixed between the semiconductor light emitting element 3 and the second lead 1b located on the bottom surface of the opening of the resin envelope 2 on the first main surface via a connecting member (not shown). The translucent resin 5 that is wire-bonded and fills the opening of the resin envelope 2 seals the semiconductor light emitting element 3, the first lead 1 a, the second lead 1 b, and the wire 4.

かかる構成によれば、樹脂外囲器２の開口の内壁面に形成した螺旋状凸部２ａが透光性樹脂５に入り込むことで樹脂外囲器２と透光性樹脂５との間にアンカー効果を得ることができ、アンカー効果により透光性樹脂５が樹脂外囲器２から剥離することを防止し、樹脂外囲器２と透光性樹脂５との界面から水分が浸入することや、ワイヤー４の断線による不点灯を防止することができる。   According to this configuration, the spiral convex portion 2 a formed on the inner wall surface of the opening of the resin envelope 2 enters the translucent resin 5, thereby anchoring between the resin envelope 2 and the translucent resin 5. An effect can be obtained, the translucent resin 5 is prevented from peeling from the resin envelope 2 due to the anchor effect, and moisture can enter from the interface between the resin envelope 2 and the translucent resin 5. The non-lighting due to the disconnection of the wire 4 can be prevented.

以下に、上述した半導体発光装置用パッケージのインサート成形による製造方法を図２に基づいて説明する。
図２において、１はリードフレーム、１ａは第一のリード、１ｂは第二のリード、７は成形金型、７ａは上金型、７ｂは下金型、８はキャビティー、９は第一のコアーピン、９ａは螺旋状凹部を各々示している。 Below, the manufacturing method by insert molding of the package for semiconductor light-emitting devices mentioned above is demonstrated based on FIG.
In FIG. 2, 1 is a lead frame, 1a is a first lead, 1b is a second lead, 7 is a molding die, 7a is an upper die, 7b is a lower die, 8 is a cavity, and 9 is a first. The core pins 9a respectively indicate spiral recesses.

図２に示すように、インサート成形においては、成形金型７の上金型７ａと下金型７ｂとの間に、リードフレーム１の一部である第一のリード１ａと第二のリード１ｂとを双方の先端間に所定の間隙を保って実質的に同一面上で対向した状態に配置し、第一のリード１ａと第二のリード１ｂとを成形金型７の上金型７ａと下金型７ｂとで挟持する。   As shown in FIG. 2, in insert molding, a first lead 1a and a second lead 1b, which are part of the lead frame 1, are placed between an upper die 7a and a lower die 7b of the molding die 7. Are arranged so as to face each other substantially on the same plane while maintaining a predetermined gap between both ends, and the first lead 1a and the second lead 1b are connected to the upper die 7a of the molding die 7. It is sandwiched between the lower mold 7b.

上金型７ａには円形の貫通孔が設けてあり、この貫通孔に軸心方向と直交する断面が円形状をなす第一のコアーピン９を挿通し、その先端面を第一のリード１ａの一部および第二のリード１ｂの一部にかかるように当接させて配置する。上金型７ａはコアーピン９を回転自在に、かつ軸心方向へスライド自在に保持している。   The upper die 7a is provided with a circular through hole, and a first core pin 9 having a circular cross section perpendicular to the axial direction is inserted into the through hole, and the tip surface of the first lead 1a is inserted into the top die 7a. A part and a part of the second lead 1b are arranged in contact with each other. The upper die 7a holds the core pin 9 so as to be rotatable and slidable in the axial direction.

この第一のコアーピン９は、図１において説明した樹脂外囲器２の開口の形状を型取った先細りするテーパー状をなし、先端面が樹脂外囲器２の開口の底面に相当する。第一のコアーピン９の先端部には一筋または複数筋の螺旋状凹部９ａが先端面から所定の高さ位置まで形成してあり、螺旋状凹部９ａは、図１において説明した樹脂外囲器２の開口における螺旋状凸部２ａを型取った形状をなす。   The first core pin 9 has a taper shape that tapers the shape of the opening of the resin envelope 2 described in FIG. 1, and the front end surface corresponds to the bottom surface of the opening of the resin envelope 2. One or a plurality of spiral recesses 9a are formed at the tip of the first core pin 9 from the tip surface to a predetermined height position, and the spiral recess 9a is formed in the resin envelope 2 described in FIG. The shape of the spiral convex portion 2a at the opening is taken.

次に、上金型７ａと下金型７ｂに形成したキャビティー８に熔融樹脂を充填し、熔融樹脂が固化した後に、第一のコアーピン９を螺旋状凹部９ａの形状に沿って回転させながらキャビティー８から外へ退避させ、その後に上金型７ａと下金型７ｂとを型開きして、樹脂外囲器２（図１参照）と第一のリード１ａと第二のリード１ｂを一体化した半導体発光装置用パッケージを得る。   Next, after filling the cavity 8 formed in the upper mold 7a and the lower mold 7b with the molten resin and solidifying the molten resin, the first core pin 9 is rotated along the shape of the spiral recess 9a. Then, the upper mold 7a and the lower mold 7b are opened, and the resin envelope 2 (see FIG. 1), the first lead 1a, and the second lead 1b are opened. An integrated semiconductor light emitting device package is obtained.

かかる構成によれば、樹脂外囲器２の開口の内壁面に形成する突起が螺旋状をなす螺旋状凸部２ａであるので、開口および螺旋状凸部２ａを形成するための第一のコアーピン９を回転退避させることが可能と成り、インサート成形で容易に製造できる。   According to this configuration, since the protrusion formed on the inner wall surface of the opening of the resin envelope 2 is the spiral convex portion 2a, the first core pin for forming the opening and the spiral convex portion 2a 9 can be rotated and retracted, and can be easily manufactured by insert molding.

この半導体発光装置用パッケージに半導体発光素子３を実装して図１示す半導体発光装置を得る。つまり、半導体発光素子３を樹脂外囲器２の開口の底面に位置する第一のリード１ａの第一主面の上に接続部材（図示せず）を介して固着し、半導体発光素子３と樹脂外囲器２の開口の底面に位置する第二のリード１ｂとの間をワイヤー４にてワイヤーボンドし、樹脂外囲器２の開口に透光性樹脂５を満たし、透光性樹脂５で半導体発光素子３、第一のリード１ａ、第二のリード１ｂ、ワイヤー４を封止する。
（実施の形態２）
図３は、本発明の実施の形態２の半導体発光装置を示すものであり、（ａ）は半導体発光素子を覆う透光性樹脂を除外した状態の斜視図、（ｂ）は断面図である。図３において、２ｂは凹部を示し、図１および図２と同じ構成要素については同じ符号を用いてその説明を省略する。 The semiconductor light emitting device 3 is mounted on the semiconductor light emitting device package to obtain the semiconductor light emitting device shown in FIG. That is, the semiconductor light emitting element 3 is fixed to the first main surface of the first lead 1a located on the bottom surface of the opening of the resin envelope 2 via a connecting member (not shown), Between the second lead 1b located on the bottom surface of the opening of the resin envelope 2 is wire-bonded with the wire 4, and the opening of the resin envelope 2 is filled with the translucent resin 5, and the translucent resin 5 Then, the semiconductor light emitting element 3, the first lead 1a, the second lead 1b, and the wire 4 are sealed.
(Embodiment 2)
3A and 3B show a semiconductor light emitting device according to a second embodiment of the present invention, in which FIG. 3A is a perspective view in a state in which a translucent resin covering a semiconductor light emitting element is excluded, and FIG. 3B is a cross-sectional view. . In FIG. 3, 2b shows a recessed part, About the same component as FIG.1 and FIG.2, the description is abbreviate | omitted using the same code | symbol.

図３に示すように、半導体発光装置の半導体発光装置用パッケージは、樹脂外囲器２の開口が第一のリード１ａおよび第二のリード１ｂの第一主面と平行な断面形状において角を丸めた四角形をなし、開口の内壁面が樹脂外囲器２の表面をなす。開口の内壁面には単数または複数筋の凹部２ｂが形成してあり、凹部２ｂは樹脂外囲器２の開口の底面から始まり内壁面の所定の高さ位置まで形成してある。他の構成は、実施の形態１と同様である。   As shown in FIG. 3, the semiconductor light emitting device package of the semiconductor light emitting device has corners in the cross-sectional shape in which the opening of the resin envelope 2 is parallel to the first main surfaces of the first lead 1a and the second lead 1b. A rounded rectangle is formed, and the inner wall surface of the opening forms the surface of the resin envelope 2. A single or plural concave portions 2b are formed on the inner wall surface of the opening, and the concave portion 2b is formed from the bottom surface of the opening of the resin envelope 2 to a predetermined height position on the inner wall surface. Other configurations are the same as those in the first embodiment.

かかる構成によれば、樹脂外囲器２の開口の内面壁に形成した凹部２ｂにより樹脂外囲器２と透光性樹脂５との間にアンカー効果を得ることができ、アンカー効果により透光性樹脂５が樹脂外囲器２から剥離することを防止し、樹脂外囲器２と透光性樹脂５との界面から水分が浸入することや、ワイヤー４の断線による不点灯を防止することができる。   According to this configuration, the anchor effect can be obtained between the resin envelope 2 and the translucent resin 5 by the recess 2b formed in the inner wall of the opening of the resin envelope 2, and the translucent light is transmitted by the anchor effect. To prevent peeling of the conductive resin 5 from the resin envelope 2 and to prevent moisture from entering from the interface between the resin envelope 2 and the translucent resin 5 and non-lighting due to disconnection of the wire 4. Can do.

以下に、上述した半導体発光装置用パッケージのインサート成形による製造方法を図４に基づいて説明する。
図４に示すように、インサート成形方法においては、成形金型７の上金型７ａと下金型７ｂとの間に、リードフレーム１の一部である第一のリード１ａと第二のリード１ｂとを双方の先端間に所定の間隙を保って実質的に同一面上で対向した状態に配置し、第一のリード１ａと第二のリード１ｂとを成形金型７の上金型７ａと下金型７ｂとで挟持する。 Below, the manufacturing method by insert molding of the package for semiconductor light-emitting devices mentioned above is demonstrated based on FIG.
As shown in FIG. 4, in the insert molding method, a first lead 1a and a second lead which are part of the lead frame 1 are interposed between an upper mold 7a and a lower mold 7b of the molding die 7. The first lead 1a and the second lead 1b are placed on the upper die 7a of the molding die 7 so as to face each other substantially on the same plane while maintaining a predetermined gap between both ends. And the lower mold 7b.

上金型７ａに設けた貫通孔は、軸心方向と直交する断面形状が角を丸めた四角形をなして、図３に示す樹脂外囲器２の開口の上面形状に相当する形状をなす。この貫通孔に第二のコアーピン１０が軸心方向へスライド自在に挿通してあり、第二のコアーピン１０は貫通孔の軸心方向に直交する断面形状が貫通孔と実質的に同じ形状をなす。   The through-hole provided in the upper mold 7a has a shape corresponding to the upper surface shape of the opening of the resin envelope 2 shown in FIG. The second core pin 10 is slidably inserted into the through hole in the axial direction, and the second core pin 10 has a cross-sectional shape perpendicular to the axial direction of the through hole substantially the same as the through hole. .

第二のコアーピン１０は、先端が先細りするテーパー状で角を丸めた四角形の形状をなし、その形状は図３の樹脂外囲器２の開口の形状を型取っており、樹脂外囲器２の開口の底面に相当する先端面を有している。第二のコアーピン１０は、先端側の一箇所または複数個所に凸部１０ａが形成してあり、凸部１０ａはテーパー状の側面の底面部から所定の高さ位置まで形成してあり、その形状は図３の樹脂外囲器２の凹部２ｂの形状を型取っている。   The second core pin 10 has a tapered shape with a tapered tip and rounded corners. The shape of the second core pin 10 is the shape of the opening of the resin envelope 2 shown in FIG. A front end surface corresponding to the bottom surface of the opening. The second core pin 10 has a convex portion 10a formed at one or a plurality of locations on the distal end side, and the convex portion 10a is formed from the bottom surface portion of the tapered side surface to a predetermined height position. Shows the shape of the recess 2b of the resin envelope 2 in FIG.

凸部１０ａは第二のコアーピン１０の摺動部１０ｂに形成してある。摺動部１０ｂは第二のコアーピン１０の側面に形成した溝部１０ｃにおいて第二のコアーピン１０と直交する方向、つまり凸部１０ａの突起方向へ移動可能に配置してあり、先端が樹脂外囲器２の開口底面と平行な方向へ摺動可能である。   The convex portion 10 a is formed on the sliding portion 10 b of the second core pin 10. The sliding portion 10b is disposed so as to be movable in a direction perpendicular to the second core pin 10 in a groove portion 10c formed on the side surface of the second core pin 10, that is, in a protruding direction of the convex portion 10a. 2 is slidable in a direction parallel to the bottom surface of the opening.

第二のコアーピン１０は、摺動部１０ｂを溝部１０ｃの奥端側に後退させた状態で上金型７ａの貫通孔に挿通し、先端面を第一のリード１ａの一部と第二のリード１ｂの一部に当接させて配置し、摺動部１０ｂを第二のコアーピン１０の軸心と直交する方向へ移動させて凸部１０ａを第二のコアーピン１０から突出させる。   The second core pin 10 is inserted into the through hole of the upper mold 7a with the sliding portion 10b retracted toward the back end side of the groove portion 10c, and the tip surface is part of the first lead 1a and the second core pin 10a. Arranged in contact with a part of the lead 1 b, the sliding part 10 b is moved in a direction perpendicular to the axis of the second core pin 10 to project the convex part 10 a from the second core pin 10.

次に、上金型７ａと下金型７ｂに形成したキャビティー８に熔融樹脂を充填し、熔融樹脂が固化した後に、第二のコアーピン１０の摺動部１０ｂを溝部１０ｃにおいて後退させ、凸部１０ａを第二のコアーピン１０の内部側へ引き込んだ状態で、第二のコアーピン１０をキャビティー８から外へ退避させる。   Next, the cavity 8 formed in the upper mold 7a and the lower mold 7b is filled with the molten resin, and after the molten resin is solidified, the sliding portion 10b of the second core pin 10 is retracted in the groove portion 10c, so that the projection The second core pin 10 is withdrawn from the cavity 8 in a state where the portion 10 a is pulled into the second core pin 10.

その後に、上金型７ａと下金型７ｂとを型開きして、樹脂外囲器２と第一のリード１ａと第二のリード１ｂを一体化した半導体発光装置用パッケージを得る。
かかる構成によれば、樹脂外囲器２に形成する開口は、リードフレーム１と平行な方向の断面形状が円形に限定されることはなく、四角形もしくは他の角形を採用することも可能である。 Thereafter, the upper mold 7a and the lower mold 7b are opened to obtain a package for a semiconductor light emitting device in which the resin envelope 2, the first lead 1a, and the second lead 1b are integrated.
According to such a configuration, the opening formed in the resin envelope 2 is not limited to a circular cross-sectional shape in a direction parallel to the lead frame 1, and a quadrangle or other squares can be adopted. .

この半導体発光装置用パッケージに半導体発光素子３を実装して図１示す半導体発光装置を得る。つまり、半導体発光素子３を樹脂外囲器２の開口の底面に位置する第一のリード１ａの第一主面の上に接続部材（図示せず）を介して固着し、半導体発光素子３と樹脂外囲器２の開口の底面に位置する第二のリード１ｂとの間をワイヤー４にてワイヤーボンドし、樹脂外囲器２の開口に透光性樹脂５を満たし、透光性樹脂５で半導体発光素子３、第一のリード１ａ、第二のリード１ｂ、ワイヤー４を封止する。   The semiconductor light emitting device 3 is mounted on the semiconductor light emitting device package to obtain the semiconductor light emitting device shown in FIG. That is, the semiconductor light emitting element 3 is fixed to the first main surface of the first lead 1a located on the bottom surface of the opening of the resin envelope 2 via a connecting member (not shown), Between the second lead 1b located on the bottom surface of the opening of the resin envelope 2 is wire-bonded with the wire 4, and the opening of the resin envelope 2 is filled with the translucent resin 5, and the translucent resin 5 Then, the semiconductor light emitting element 3, the first lead 1a, the second lead 1b, and the wire 4 are sealed.

本発明は、半導体発光装置として有用であり、特に高輝度で大量の発熱を伴うものに適している。   The present invention is useful as a semiconductor light emitting device, and is particularly suitable for a device having high luminance and a large amount of heat generation.

本発明の実施の形態１における半導体発光装置を示し、（ａ）は斜視図、（ｂ）は断面図BRIEF DESCRIPTION OF THE DRAWINGS The semiconductor light-emitting device in Embodiment 1 of this invention is shown, (a) is a perspective view, (b) is sectional drawing. 本発明の実施の形態１における半導体発光装置用パッケージの製造方法を示す断面図Sectional drawing which shows the manufacturing method of the package for semiconductor light-emitting devices in Embodiment 1 of this invention 本発明の実施の形態２における半導体発光装置を示し、（ａ）は斜視図、（ｂ）は断面図1 shows a semiconductor light emitting device according to a second embodiment of the present invention, where (a) is a perspective view and (b) is a cross-sectional view. 本発明の実施の形態２における半導体発光装置用パッケージの製造方法を示す断面図Sectional drawing which shows the manufacturing method of the package for semiconductor light-emitting devices in Embodiment 2 of this invention 従来の半導体発光装置を示す断面図Sectional view showing a conventional semiconductor light emitting device 従来の半導体発光装置の製造方法を示す断面図Sectional drawing which shows the manufacturing method of the conventional semiconductor light-emitting device

符号の説明Explanation of symbols

１ リードフレーム
１ａ 第一のリード
１ｂ 第二のリード
２ 樹脂外囲器
２ａ 螺旋状凸部
２ｂ 凹部
２ｃ 溝部
３ 半導体発光素子
４、１０５ ワイヤー
５ 透光性樹脂
７、１０７ 成形金型
７ａ、１０７ａ 上金型
７ｂ、１０７ｂ 下金型
８、１０８ キャビティー
９ 第一のコアーピン
９ａ 螺旋状凹部
１０ 第二のコアーピン
１０ａ 凸部
１０ｂ 摺動部
１０１ａ 一方のリード
１０１ｂ 他方のリード
１０２ パッケージ
１０３ 接続部材
１０４ ＬＥＤチップ
１０６ 樹脂
１０７ｃ 突出部 DESCRIPTION OF SYMBOLS 1 Lead frame 1a 1st lead 1b 2nd lead 2 Resin envelope 2a Helical convex part 2b Concave part 2c Groove part 3 Semiconductor light emitting element 4, 105 Wire 5 Translucent resin 7, 107 Molding die 7a, 107a Top Mold 7b, 107b Lower mold 8, 108 Cavity 9 First core pin 9a Spiral recess 10 Second core pin 10a Projection 10b Sliding portion 101a One lead 101b The other lead 102 Package 103 Connection member 104 LED chip 106 Resin 107c Projection

Claims (11)

樹脂外囲器の主面に、半導体発光素子を搭載するための開口を有し、前記開口の内壁面に凸部もしくは凹部を形成したことを特徴とする半導体発光装置用パッケージ。   A package for a semiconductor light emitting device, comprising: an opening for mounting a semiconductor light emitting element on a main surface of a resin envelope; and a convex portion or a concave portion formed on an inner wall surface of the opening. 前記樹脂外囲器の主面に形成する前記開口が軸心方向と直交する断面形状において円形をなし、前記開口の内壁面に形成する前記凸部が一筋または複数筋の螺旋状をなすことを特徴とする請求項１に記載の半導体発光装置用パッケージ。   The opening formed in the main surface of the resin envelope has a circular shape in a cross-sectional shape perpendicular to the axial direction, and the convex portion formed on the inner wall surface of the opening has a single or multiple spiral shape. The package for a semiconductor light-emitting device according to claim 1. 前記開口は、底面から樹脂外囲器の主面に向けて口径が広がる上拡がりの形状をなすことを特徴とする請求項１または２に記載の半導体発光装置用パッケージ。   The package for a semiconductor light-emitting device according to claim 1, wherein the opening has an upwardly expanding shape in which the diameter increases from the bottom surface toward the main surface of the resin envelope. 前記開口の内壁面に形成する螺旋状の前記凸部は、前記開口の底面から始まり内壁面の所定の高さ位置まで形成した形状をなすことを特徴とする請求項２に記載の半導体発光装置用パッケージ。   3. The semiconductor light emitting device according to claim 2, wherein the spiral convex portion formed on the inner wall surface of the opening has a shape starting from the bottom surface of the opening to a predetermined height position of the inner wall surface. For package. 前記樹脂外囲器が第一のリードと第二のリードの一部を包含し、前記樹脂外囲器の開口において第一のリードと第二のリードとが所定の間隙を保って実質的に同一面上で対向し、かつ前記開口の底面に露出することを特徴とする請求項１〜３の何れか１項に記載の半導体発光装置用パッケージ。   The resin envelope includes a part of the first lead and the second lead, and the first lead and the second lead substantially maintain a predetermined gap in the opening of the resin envelope. The package for a semiconductor light-emitting device according to claim 1, wherein the package faces the same surface and is exposed at a bottom surface of the opening. 第一のリードと第二のリードとを包含する樹脂外囲器を有し、前記樹脂外囲器の主面に形成した開口の底面において、前記第一のリードと前記第二のリードとが所定の間隙を保って実質的に同一面上で対向し、前記第一のリードと前記第二のリードの双方の対向し合う側と反対側の先端が各々前記樹脂外囲器から外部へ延出し、
前記開口は内壁面に凸部もしくは凹部を有し、
前記開口の底面に位置する前記第一のリードの第一主面に接続部材を介して半導体発光素子を固着し、前記半導体発光素子と前記開口の底面に位置する前記第二のリードとをワイヤーにてワイヤーボンドし、前記開口に前記半導体発光素子を含んで透光性樹脂を満たしたことを特徴とする半導体発光装置。 A resin envelope including a first lead and a second lead, wherein the first lead and the second lead are formed on a bottom surface of an opening formed in a main surface of the resin envelope; The front ends of the first lead and the second lead are opposed to each other on the substantially opposite surface while maintaining a predetermined gap, and the opposite ends of the first lead and the second lead respectively extend from the resin envelope to the outside. broth,
The opening has a convex portion or a concave portion on the inner wall surface,
A semiconductor light emitting element is fixed to the first main surface of the first lead located on the bottom surface of the opening via a connecting member, and the semiconductor light emitting element and the second lead located on the bottom surface of the opening are wired. A semiconductor light-emitting device, wherein the semiconductor light-emitting device is filled with a translucent resin including the semiconductor light-emitting element in the opening. 前記開口は、軸心方向と直交する断面形状が円形をなして底面から前記樹脂外囲器の主面に向けて口径が広がる上拡がりの形状をなし、前記内壁面に有する前記凸部が一筋または複数筋の螺旋状をなして前記開口の底面から始まり前記内壁面の所定の高さ位置まで形成した形状をなすことを特徴とする請求項６に記載の半導体発光装置。   The opening has a circular shape with a circular cross-sectional shape perpendicular to the axial direction, the diameter of the opening expands from the bottom surface toward the main surface of the resin envelope, and the convex portion on the inner wall surface is straight. The semiconductor light emitting device according to claim 6, wherein the semiconductor light emitting device is formed in a spiral shape having a plurality of streaks and formed from a bottom surface of the opening to a predetermined height position of the inner wall surface. 軸心方向と直交する断面形状において円形をなし、かつ先細りするテーパー状の先端側に一筋または複数筋の螺旋状凹部を形成した第一のコアーピンを、成形金型の上金型と下金型との間に形成したキャビティ内に、前記上金型に設けた貫通孔から回転自在に、かつ軸心方向へスライド自在に挿通し、前記キャビティーに熔融樹脂を注入充填し、前記熔融樹脂が固化した後に、前記第一のコアーピンを前記螺旋状凹部の形状に沿って回転させながら前記キャビティーから外へ退避させ、その後に前記上金型と前記下金型とを型開きして樹脂外囲器を取り出すことを特徴とする半導体発光装置用パッケージの製造方法。   A first core pin having a circular shape in a cross-sectional shape orthogonal to the axial direction and having a taper-shaped tapered recess formed on one end of the taper is formed into an upper mold and a lower mold. Is inserted into a cavity formed between the upper mold and a through hole provided in the upper mold so as to be rotatable and slidable in the axial direction, and a molten resin is injected and filled into the cavity. After solidification, the first core pin is retreated from the cavity while rotating along the shape of the spiral recess, and then the upper mold and the lower mold are opened to remove the resin. A method of manufacturing a package for a semiconductor light emitting device, wherein the envelope is taken out. 前記成形金型の上金型と下金型との間に、リードフレームの一部である第一のリードと第二のリードとを所定の間隙を保って実質的に同一面上で対向する状態に挟持し、前記第一のコアーピンを前記上金型の貫通孔から前記キャビティ内へ挿通し、前記第一のコアーピンの先端面を前記第一のリードの一部と前記第二のリードの一部に当接させ、前記キャビティーに熔融樹脂を充填し、前記熔融樹脂が固化した後に、前記第一のコアーピンを前記螺旋状凹部の形状に沿って回転させながら前記キャビティーから外へ退避させ、その後に前記上金型と前記下金型とを型開きして、前記第一のリードと前記第二のリードとを一体化した前記樹脂外囲器を取り出すことを特徴とする請求項８に記載の半導体発光装置用パッケージの製造方法。   Between the upper mold and the lower mold of the molding mold, the first lead and the second lead, which are part of the lead frame, face each other substantially on the same plane while maintaining a predetermined gap. The first core pin is inserted into the cavity from the through hole of the upper mold, and the tip surface of the first core pin is inserted between a part of the first lead and the second lead. A part is brought into contact, and the cavity is filled with a molten resin, and after the molten resin is solidified, the first core pin is retracted from the cavity while rotating along the shape of the spiral recess. Then, the upper mold and the lower mold are opened, and the resin envelope in which the first lead and the second lead are integrated is taken out. A method for manufacturing a package for a semiconductor light emitting device according to claim 8. 軸心方向と直交する方向に摺動する摺動部を有し、かつ先細りするテーパー状の先端側において前記摺動部に一箇所または複数個所の凸部を有する第二のコアーピンを、成形金型の上金型と下金型との間に形成したキャビティ内に、前記上金型に設けた貫通孔から軸心方向へスライド自在に挿通し、前記キャビティーに熔融樹脂を注入充填し、前記熔融樹脂が固化した後に、前記第二のコアーピンの摺動部を摺動させて前記凸部を前記第二のコアーピンの内部側へ引き込み、前記第二のコアーピンを前記キャビティーから外へ退避させ、その後に前記上金型と前記下金型とを型開きして樹脂外囲器を取り出すことを特徴とする半導体発光装置用パッケージの製造方法。   A second core pin having a sliding portion that slides in a direction orthogonal to the axial direction and having one or a plurality of convex portions on the sliding portion on the tapered tip end side that is tapered In a cavity formed between the upper mold and the lower mold of the mold, it is slidably inserted in the axial direction from a through hole provided in the upper mold, and a molten resin is injected and filled into the cavity. After the molten resin is solidified, the sliding portion of the second core pin is slid to draw the convex portion into the inner side of the second core pin, and the second core pin is retracted out of the cavity. And then opening the upper mold and the lower mold to take out the resin envelope, and a method for manufacturing a package for a semiconductor light emitting device. 前記成形金型の上金型と下金型との間に、リードフレームの一部である第一のリードと第二のリードとを所定の間隙を保って実質的に同一面上で対向する状態に挟持し、前記第一のコアーピンを前記上金型の貫通孔から前記キャビティ内へ挿通し、前記第一のコアーピンの先端面を前記第一のリードの一部と前記第二のリードの一部に当接させ、前記キャビティーに熔融樹脂を充填し、前記熔融樹脂が固化した後に、前記第二のコアーピンの摺動部を摺動させて前記凸部を前記第二のコアーピンの内部側へ引き込み、前記第二のコアーピンを前記キャビティーから外へ退避させ、その後に前記上金型と前記下金型とを型開きして、前記第一のリードと前記第二のリードとを一体化した前記樹脂外囲器を取り出すことを特徴とする請求項１０に記載の半導体発光装置用パッケージの製造方法。   Between the upper mold and the lower mold of the molding mold, the first lead and the second lead, which are part of the lead frame, face each other substantially on the same plane while maintaining a predetermined gap. The first core pin is inserted into the cavity from the through hole of the upper mold, and the tip surface of the first core pin is inserted between a part of the first lead and the second lead. A part is brought into contact with the cavity, and the cavity is filled with a molten resin, and after the molten resin is solidified, the sliding portion of the second core pin is slid to move the convex portion into the second core pin. The second core pin is retracted out of the cavity, and then the upper mold and the lower mold are opened to open the first lead and the second lead. The integrated resin envelope is taken out. Method for producing a mounting of the semiconductor light-emitting device package.
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CN102315367B (en) * 2010-07-08 2018-11-09 Lg伊诺特有限公司 Light emitting device package
KR20160145303A (en) * 2015-06-10 2016-12-20 엘지이노텍 주식회사 A light emitting device package
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