JP2009244559A - Method for manufacturing active matrix substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To quickly detect a positional shift of an area irradiated with laser light from a preset laser light irradiation area. <P>SOLUTION: A method for manufacturing an active matrix substrate includes: a preparation step S1 for preparing an active matrix forming substrate 50 provided with a display area D on which a plurality of display wires 11 are formed, a short-circuit wires 19, 20 connected to respective display wires 11 on the outside of the display area D and a position confirming pattern 23 formed for the short-circuit wires 19, 20; a connection release step S7 for releasing mutual electric connection between respective display wires 11 by irradiating respective display wires 11 with laser light on the outside of the display area D; and a position confirmation step S8 for confirming positional relation between the position confirming pattern 23 and an area B irradiated with laser light. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an active matrix substrate.

  An active matrix liquid crystal display device includes an active matrix substrate in which a plurality of pixel electrodes are arranged in a matrix, a counter substrate in which a common electrode is formed so as to be opposed to the active matrix substrate, A liquid crystal display panel having a liquid crystal layer sealed with a frame-shaped sealing material is provided, and a mounting component such as an LSI (Large Scale Integration) driver chip is attached to the liquid crystal display panel. In this liquid crystal display device, a predetermined charge is written to each pixel electrode to apply a voltage to the liquid crystal layer between each pixel electrode and the common electrode, thereby controlling the orientation of the liquid crystal molecules for each pixel. The image display is performed.

  The active matrix substrate includes a plurality of display wirings such as the pixel electrodes, a plurality of TFTs (Thin Film Transistors) electrically connected to the pixel electrodes, and gate lines and source lines connected to the TFTs. Is provided. In the active matrix substrate, an overcurrent flows to each TFT by applying a high voltage caused by static electricity to the terminal portion of each display wiring for connecting the LSI driver chip in the manufacturing process, and each of these TFTs flows. There is a risk of causing electrostatic breakdown or characteristic deterioration of the TFT. As countermeasures against electrostatic breakdown and characteristic deterioration of each TFT due to this static electricity, the active matrix substrate is specified by electrically connecting the ends of each display wiring to each other and holding each wiring at the same potential. A short-circuit wiring called a short ring that suppresses application of a high voltage only to the display wiring is formed.

  Since this short ring needs to release the electrical connection between the display wirings and drive the display wirings independently, the short-rings are separated from the display wirings at the end of the production of the liquid crystal display panel. Is disconnected. As a method of separating the short ring from each display wiring, a method of cutting each display wiring by laser light irradiation is known (for example, see Patent Document 1).

  FIG. 25 is a diagram illustrating a conventional method of separating the short ring 100 from each display wiring 101 by laser light irradiation.

In order to separate the short ring 100 from each display wiring 101, first, as shown in FIG. 25, the laser light irradiation region 103 is set so as to cross all the display wirings 101 connected to the short ring 100. . Then, the laser beam spot S emitted from the laser cutting device is irradiated with the laser beam in accordance with the start point on one end side (right end side in the figure) of the irradiation region 103, and the other end side (left end side in the figure side) from the start point. ) By moving the laser light spot S toward the irradiation region 103 and irradiating the entire irradiation region 103 with the laser light, thereby melting and evaporating the irradiated portion of each display wiring 101 overlapping the region 104 irradiated with the laser light. Thus, each display wiring 101 is cut to separate the short ring 100 from each display wiring 101.
Japanese Patent Laid-Open No. 11-305261

  FIG. 26 and FIG. 27 are diagrams showing states of the respective display wirings 101 that are irradiated with the laser light that deviates from the preset irradiation region 103 of the laser light.

  When the short ring 100 is separated from each display wiring 101 by laser light irradiation as described above, as shown in FIG. 26, the actual laser light irradiation area 104 becomes a desired irradiation area due to a malfunction of the laser cutting device. By gradually deviating from 103, the area where each display wiring 101 is cut may deviate from the desired area. If the laser cutting device is continuously used in such a state that the laser light irradiation region 104 is shifted as described above, the laser light irradiation region 104 is greatly shifted from the desired irradiation region 103 as shown in FIG. Eventually, the display wiring 101a that cannot be disconnected is generated, and there is a possibility that a disconnection failure occurs while the display wirings 101a remain connected to each other.

  If the display wirings become defective in cutting, the display wirings connected to each other cannot be driven independently when they are driven as a liquid crystal display device, and leakage occurs between the wirings. As a result, the display quality deteriorates. In addition, when each display wiring becomes defective in cutting as described above, the LSI driver chip is mounted on the liquid crystal display panel and the liquid crystal display panel is driven by the driver. The cutting failure cannot be eliminated before the chip is mounted, resulting in a decrease in manufacturing yield.

  The present invention has been made in view of such various points, and an object of the present invention is to early detect a positional shift of a region irradiated with laser light with respect to a predetermined laser light irradiation region. .

  In order to achieve the above object, according to the present invention, the positional relationship between the position confirmation pattern and the region irradiated with the laser light after the electrical connection between the display wirings is released by the laser light irradiation. To check.

  Specifically, the manufacturing method of the active matrix substrate according to the present invention includes a display area provided with a plurality of display lines, a short-circuit line connected to each of the display lines outside the display area, A preparatory step of preparing an active matrix forming substrate provided with a position confirmation pattern provided for a short-circuit wiring, and by irradiating each display wiring with laser light outside the display area, A connection release step for releasing the electrical connection between the display wirings; and a position check step for checking a positional relationship between the position check pattern and the region irradiated with the laser beam. And

  According to this manufacturing method, after performing a connection releasing step of cutting each display wiring by laser light irradiation and releasing each electrical connection of each display wiring, the position confirmation pattern and the laser light are irradiated. By performing a position confirmation process that confirms the positional relationship with the region that has been made, the actual laser light was irradiated to the laser light irradiation area that was set in advance due to a defect in the laser cutting device when performing the connection release process Even if a position shift occurs in the region, the position shift of the region irradiated with the laser light is detected early in the position confirmation step. Furthermore, when a position shift of the laser light irradiation area is detected, the electrical connection between the laser light irradiation areas is subsequently canceled by correcting the position of the laser light irradiation area to the position of the desired irradiation area. For each of the display wirings, it is possible to suppress a disconnection failure in which the display wirings remain connected to each other even after the connection releasing step.

  In the active matrix forming substrate, the plurality of display wirings are arranged side by side and drawn out of the display area to form a wiring group outside the display area, and the position confirmation pattern is formed on both sides of the wiring group. It is preferable that each display wiring is cut by irradiating each display wiring with a laser beam between the pair of position confirmation patterns in the connection release step.

  According to this manufacturing method, a pair of position confirmation patterns are provided on both sides of a wiring group configured outside the display area by a plurality of display wirings that are pulled out to the outside of the display area side by side. By cutting the display wirings between the position confirmation patterns, the display wirings and the short-circuiting wirings are disconnected, and the electrical connections of the display wirings are released. By doing this, the positional relationship between the position confirmation pattern and the region irradiated with the laser light in the position confirmation step is confirmed by the region irradiated with the laser light from one of the pair of position confirmation patterns to the other. It is possible to easily carry out by confirming whether or not is extended.

  In the active matrix forming substrate, it is preferable that notches are respectively formed in the portions of the display wirings where the laser light is irradiated.

  According to this manufacturing method, the notched portions are formed in the portions of the display wirings that are irradiated with the laser light, so that the portions of the display wiring that are irradiated with the laser light are the portions of the display wirings. Since it is formed thinner than the other portions, each display wiring is more reliably cut in the connection release step. And since the amount of the wiring material of each display wiring that is melted by the irradiation of the laser beam is reduced, it is suppressed that the adjacent display wirings are newly electrically connected by the melted wiring material. The

  After the disconnection step, based on the resistance measurement step of measuring the electric resistance between the portions sandwiching the region irradiated with the laser light in each display wiring, and the electric resistance measured by the resistance measurement step, When it is determined that a cutting failure has occurred in at least a part of each of the display wirings, the display wirings are again irradiated with laser light to release the electrical connection between the display wirings. It is preferable to include a reconnection release step.

  According to this manufacturing method, in the resistance measurement step, when the electrical resistance between the portions sandwiching the region irradiated with the laser light in each display wiring is measured, there is a disconnection failure in each display wiring ( The predetermined electrical resistance is measured when each display wiring is not released from the electrical connection), whereas when each display wiring is disconnected (each display wiring is connected to each other) When the electrical connection is released), the electric resistance measured with respect to the predetermined electric resistance is remarkably increased, and it is confirmed whether each display wiring is surely cut. Then, when a predetermined electrical resistance is measured by this resistance measurement process and it is determined that a cutting failure has occurred in each display wiring, each display wiring is again irradiated with laser light to display each of the display wirings. Since the reconnection release step of releasing the mutual electrical connection is performed, it is possible to more reliably release the electrical connection between the display wirings.

  In the reconnection release step, it is preferable that the display wirings are irradiated with laser light in a region different from the region irradiated with the laser light in the connection release step.

  By the way, depending on the surface state of the substrate to which the laser beam is irradiated, when the laser beam is irradiated, the laser beam is diffused and reflected on the surface, etc. If the energy is not sufficiently applied, a part of each display wiring remains without being removed, and there is a risk that a cutting failure may occur in each display wiring. In this way, when a disconnection failure occurs in each display wiring due to the surface state of the substrate irradiated with the laser light, the laser light is applied to each display wiring in the same region as the connection release process in the reconnection release process. Even if the display wiring is not removed, the remaining part of the display wiring is not sufficiently energized by the laser light irradiation in the same way as the connection release step, and even if the reconnection release step is performed. There is a possibility that cutting defects remain in each display wiring.

  On the other hand, according to the manufacturing method described above, in the reconnection release step, each display wire is irradiated with laser light in a region different from the region irradiated with laser light in the connection release step. It becomes possible to cut more reliably.

  The active matrix forming substrate includes a plurality of display regions defined in a matrix, and a first dividing unit that forms a plurality of strip substrates by dividing the active matrix forming substrate into each row of the plurality of display regions. And a second dividing step of dividing each strip-shaped substrate into each display region, and in the connection releasing step, laser light is continuously emitted from each strip-shaped substrate to each display wiring. Irradiation is preferred.

  According to this manufacturing method, in the connection release step, each strip wiring board is irradiated with laser light continuously on each display wiring, whereby each display wiring for each display area is electrically connected to each other. It is released continuously. As a result, each strip-shaped substrate is divided into individual substrates for each display area, and then each substrate is irradiated with laser light to electrically connect each display wiring on each substrate. Compared with the case where the display is released, the electrical connection of the display wirings in the plurality of display areas is efficiently released.

  Prior to the cutting step, it is preferable to include an inspection step of inspecting each display wiring in each display region by supplying a predetermined signal to the short-circuit wiring in each strip-shaped substrate.

  According to this manufacturing method, by supplying a predetermined signal to the short-circuit wiring in each strip-shaped substrate, a signal is supplied to each display wiring through the short-circuit wiring. At this time, if any one of the display wirings is disconnected, the signal is not supplied to the point where the disconnected display wiring is disconnected. Thereby, the presence or absence of disconnection of each display wiring in each strip substrate is inspected. In this way, each display in a plurality of display areas is compared to a case where each strip-like substrate is divided into individual substrates for each display area and then each display wiring is inspected for each substrate. The presence or absence of disconnection of the work wiring is efficiently inspected.

  The active matrix substrate manufacturing method according to the present invention includes a display area provided with a plurality of display lines, a short-circuit line connected to each of the display lines outside the display area, and the short-circuit line. A preparatory step of preparing an active matrix forming substrate provided with a position confirmation pattern provided for the wiring; and laser light on at least one of the display wiring and the short-circuiting wiring outside the display area. , A connection release step for releasing the electrical connection between the display wirings, and a position check step for checking the positional relationship between the position check pattern and the region irradiated with the laser beam. It is characterized by including.

  Also in this manufacturing method, after performing a disconnection process for canceling the electrical connection of each display wiring by laser light irradiation, the positional relationship between the position confirmation pattern and the region irradiated with the laser light is determined. In order to perform the position confirmation process to confirm, the position shift of the area | region where the laser beam irradiated with respect to the irradiation area | region of the laser beam previously set in the position confirmation process is detected at an early stage. Furthermore, when a position shift of the laser light irradiation area is detected, the electrical connection between the laser light irradiation areas is subsequently canceled by correcting the position of the laser light irradiation area to the position of the desired irradiation area. It is possible to prevent the display wirings from being connected to each other even after the connection release step.

  According to the present invention, the positional relationship between the position confirmation pattern and the region irradiated with the laser light is obtained after performing the connection releasing step of releasing the electrical connection between the display wirings by laser light irradiation. Since the position confirmation process to confirm is performed, the position shift of the area irradiated with the laser beam with respect to the preset irradiation area of the laser beam can be detected at an early stage.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments.

Embodiment 1 of the Invention
1 to 3 show Embodiment 1 of the present invention. FIG. 1 is a plan view schematically showing the liquid crystal display device 1. FIG. 2 is a sectional view schematically showing the liquid crystal display device 1 along the line II-II in FIG. FIG. 3 is a plan view schematically showing the active matrix substrate 10 constituting the liquid crystal display device 1.

  As shown in FIGS. 1 and 2, the liquid crystal display device 1 includes a liquid crystal display panel 44 and an LSI (Large Scale Integration) driver chip 47 which is an integrated circuit chip mounted on the liquid crystal display panel 44. .

  The liquid crystal display panel 44 includes an active matrix substrate 10, a counter substrate 40 disposed to face the active matrix substrate 10, and a liquid crystal layer 43 provided between the active matrix substrate 10 and the counter substrate 40. ing. The liquid crystal display panel 44 has a display area D composed of a plurality of pixels (not shown) arranged in a matrix.

  The active matrix substrate 10 and the counter substrate 40 are formed in a rectangular shape or the like, and an alignment film (not shown) is provided on the surface on the liquid crystal layer 43 side, and a polarizing plate on the surface opposite to the liquid crystal layer 43. 45 and 46 (not shown in FIG. 1) are provided.

  A substantially frame-shaped sealing material 41 is disposed between the active matrix substrate 10 and the counter substrate 40, and a liquid crystal material is sealed inside the sealing material 41, whereby the liquid crystal layer 43 is provided. ing. As shown in FIG. 1, the sealing material 41 is formed with an injection port 41 a for injecting a liquid crystal material inside, and this injection port 41 a is closed by a sealing material 42. The sealing material 41 is formed from an adhesive having insulating properties, and conductive particles are dispersed therein.

  As shown in FIG. 1, the active matrix substrate 10 has a terminal region 10 a provided on one side (lower side in the drawing) protruding outside the counter substrate 40 outside the display region D. A mounting area 10b on which the LSI driver chip 47 is mounted is defined in 10a.

  The LSI driver chip 47 is mounted via, for example, an anisotropic conductive film (not shown: Anisotropic Conductive Film, hereinafter referred to as ACF) in which conductive particles are dispersed in an insulating adhesive. Are connected to the terminals 18 and 24 on the mounting region 10b described later via the conductive particles.

  In the present embodiment, the LSI driver chip 47 is connected to the terminals 18 and 24 via the ACF, but the LSI driver chip 47 is connected to the terminals 18 and 24 via the silver paste. You may mount by other connection systems, such as a connection system and the wire bonding system connected to each terminal 18 and 24 via a gold wire.

  As shown in FIG. 3, the active matrix substrate 10 has a plurality of gate lines 11 extending in parallel to each other as display wirings in the display region D, and extends in parallel to each other in a direction intersecting each gate line 11. A plurality of source lines 12 are provided. Although not shown, thin film transistors (hereinafter referred to as TFTs) connected to the gate lines 11 and the source lines 12 are located near the intersections of the gate 11 lines and the source 12 lines, respectively. A plurality of pixel electrodes provided in a matrix corresponding to each pixel are connected to each TFT.

  Each gate line 11 is provided in a linear shape so as to extend in the row direction (for example, the horizontal direction in the figure) between the pixels, and each source line 12 extends in the column direction (for example, the vertical direction in the figure) between the pixels. It is provided in the shape of a line. The plurality of gate lines 11 are provided so as to extend from one side (right side in the drawing) to the outside of the display region D and to extend between the first gate lines 11a. A plurality of second gate lines 11b led out of the display area D from the opposite side (left side in the figure) to the direction in which the gate lines 11a are drawn.

  Further, auxiliary capacitance lines 15 are formed between the gate lines 11 so as to extend along the gate lines 11. As shown in the drawing, each auxiliary capacitance line 15 is connected to both sides in the left-right direction of a common wiring 16 formed in a rectangular ring shape so as to surround the display region D. At the four corners of the common wiring 16, common transition portions 17 that are electrically connected to a common electrode of the counter substrate 40 described later via conductive particles in the sealing material 41 are provided.

  In addition, the first gate lines 11a and the second gate lines 11b that are alternately drawn to the outside of the display region D in the left-right direction in the drawing are drawn to the terminal region 10a alongside the source lines 12, respectively. The first wiring group 13 and the second wiring group 14 are configured outside the display area D, respectively. Each first gate line 11a and each second gate line 11b pass through the mounting area 10b, and a gate driver mounting terminal 18 for connecting to the LSI driver chip 47 is provided in the mounting area 10b. ing. Each of the first gate lines 11a and the second gate lines 11b is formed to have a wiring width of about 5 μm to 10 μm, for example, and is provided at an interval of about 20 μm to 40 μm.

  Further, the active matrix substrate 10 includes short rings 19 and 20 which are short-circuit wirings provided outside the mounting region 10b in the terminal region 10a, and position confirmation provided for the short rings 19 and 20. And a pattern 23.

  The short rings 19 and 20 are provided at the leading ends of the first gate lines 11a and the second gate lines 11b, respectively, and gate signal input terminals 21 and 22 are provided at one ends, respectively. Each first gate line 11a and each second gate line 11b are disconnected between each gate driver mounting terminal 18 and the short rings 19 and 20, respectively. Each of these gate lines 11 is cut on the mounting region 10b so that the cut surface is covered with the ACF for mounting the LSI driver chip 47 in order to suppress oxidation corrosion and the like from the cut surface.

  As shown in the drawing, the cut portions of the gate lines 11 are provided on both sides of the first wiring groups 13 and the second wiring groups 14 arranged outside the gate driver mounting terminals 18. A pair of position confirmation patterns 23 are provided so as to sandwich the. The pair of position confirmation patterns 23 are formed of the same metal material as that of the gate lines 11 or the source lines 12 in a regular triangular shape with one corner facing each other (one side is about 100 μm, for example). Further, the pair of position confirmation patterns 23 are provided at intervals such that a short circuit does not occur between each wiring group 13 and 14 and each gate line 11 (for example, about 50 μm).

  In the present embodiment, each position confirmation pattern 23 is formed in a regular triangle shape, but each position confirmation pattern 23 is formed in various shapes such as other polygonal shapes and circular shapes. May be.

  One end of each source line 12 is led out to the mounting region 10b, and a source driver mounting terminal 24 for connecting to the LSI driver chip 47 is provided at the drawn end. The other end of each source line 12 is connected to the drain electrode of the TFT 25.

  The source electrode of each of these TFTs 25 is a pair of lead-out wirings 26 led out to the terminal region 10a so as to extend to the gate signal input terminal 21 side along the respective first gate lines 11a outside the respective first wiring groups 13. They are alternately connected to one side. A source signal input terminal 27 is provided at each end of each lead-out wiring 26 drawn out.

  Further, the gate electrode of each TFT 25 is also connected to the lead-out wiring 28 led out to the terminal region 10a so as to extend to the gate signal input terminal 21 side along the first gate line 11a outside the first wiring group 13. Has been. A TFT drive signal input terminal 29 is provided alongside the source signal input terminal 27 at the end of the lead-out wiring 28 drawn out.

  Further, the common wiring 16 is connected to a common lead wiring 30 led out to the terminal region 10a so as to extend to the gate signal input terminal 22 side along the second gate lines 11b outside the second wiring groups 14. ing. A common signal input terminal 31 is provided at the drawn end of the common lead wiring 30.

  Although the illustration of the counter substrate 40 is omitted, a plurality of color filters are provided in the display area D so as to overlap each pixel electrode, and a black matrix is provided so as to partition these color filters. A common electrode is provided so as to cover these color filters and the black matrix. The common electrode is electrically connected to the common signal input terminal 31 through the conductive particles in the sealing material 41, the common transition portion 17, the common wiring 16, and the common lead-out wiring 30.

  Thus, the liquid crystal display device 1 supplies a predetermined gate signal to each gate line 11 by the LSI driver chip 47 and inputs a predetermined source to each source line 12 while inputting a certain common signal to the common signal input terminal 31. By supplying a signal, the TFT connected to each gate line 11 is sequentially turned on, and a predetermined charge is written to each pixel electrode via the drain electrode. As a result, a predetermined voltage is applied to the liquid crystal layer 43 between each pixel electrode and the common electrode, thereby controlling the orientation of liquid crystal molecules for each pixel and performing a desired image display. Yes.

-Manufacturing method-
Next, a method for manufacturing the liquid crystal display device 1 will be described with reference to FIGS. FIG. 4 is a diagram schematically showing a flow of a manufacturing method of the liquid crystal display device 1. 5 and 6 are diagrams for explaining the active matrix forming substrate 50. FIG. FIG. 7 is a plan view schematically showing the counter-forming substrate 52. FIG. 8 is a plan view schematically showing the bonded mother substrate 55. 9 and 10 are plan views schematically showing the strip-shaped panel 60 before and after the liquid crystal layer sealing step S5. FIGS. 11-16 is a figure for demonstrating connection cancellation | release process S7, position confirmation process S8, resistance measurement process S9, and 2nd parting process S11.

  As shown in FIG. 4, the manufacturing method of the liquid crystal display device 1 includes an active matrix forming substrate preparing step S1, an opposing forming substrate preparing step S2, a bonding step S3, a first dividing step S4, Includes a liquid crystal layer sealing step S5, an inspection step S6, a connection release step S7, a position confirmation step S8, a resistance measurement step S9, a reconnection release step S10, a second dividing step S11, and a mounting step S12. It is.

(Active matrix formation substrate preparation process)
In the active matrix forming substrate preparation step S1, a plurality of display areas D are defined in a matrix form on a glass mother substrate, which is an aggregate of a plurality of glass substrates, and a plurality of display areas D are provided for each display area D. Wirings 11, 12, 15, 16, 19, 20, 26, 28, 30, terminals 18, 21, 22, 24, 27, 29, 31, position confirmation patterns 23, TFTs, pixel electrodes, etc. (in FIG. 5) An active matrix forming substrate 50 on which is not shown) is prepared.

  That is, in this active matrix forming substrate 50, regions (hereinafter referred to as active matrix substrate regions) 51 for forming a plurality of active matrix substrates 10 are arranged in a matrix, and each first gate line 11a and each second gate is formed. It is fabricated as an aggregate of a plurality of active matrix substrates in a state before the line 11b is cut. That is, as shown in FIG. 6, each active matrix substrate region 51 is connected to different short rings 19 and 20 at which drawn ends of the first gate lines 11a and the second gate lines 11b are connected to each other. Electrically connected. Thereby, in each wiring group 13, 14, each gate line 11 is held at the same potential, and a high voltage due to static electricity is applied only to the specific gate line 11 during the manufacturing process, and electrostatic breakdown or damage of each TFT. It is suppressed that characteristic deterioration is caused. Between the pair of position confirmation patterns 23, an irradiation area A of a laser beam having a length of about 2500 μm is set so as to cross all the first gate lines 11a and the second gate lines 11b. ing.

  The length of each irradiation region A varies depending on the number of gate lines 11 corresponding to the number of pixels in the liquid crystal display device 1, and can be set as appropriate. All the first gate lines 11a and each first gate line 11 can be set appropriately. It is only necessary to set so as to cross the two gate lines 11b.

  Thereafter, the active matrix forming substrate 50 is cleaned by, for example, irradiation with pure water, ultrasonic waves, or ultraviolet rays to remove particles and impurities attached to the substrate surface. Subsequently, an alignment film is provided on the active matrix forming substrate 50 by a printing method.

(Opposite forming substrate preparation process)
In the counter forming substrate preparation step S2, as shown in FIG. 7, a plurality of display regions D are defined on the glass mother substrate, and a plurality of color filters and common electrodes are formed for each display region D. 52 is prepared. That is, the counter forming substrate 52 is manufactured as an aggregate of a plurality of counter substrates 40 in which regions (hereinafter referred to as counter substrate regions) 53 on which a plurality of counter substrates 40 are formed are arranged in a matrix.

  Thereafter, similarly to the active matrix forming substrate 50, the counter forming substrate 52 is cleaned, and an alignment film is provided on the counter forming substrate 52 after the cleaning by a printing method.

(Lamination process)
Next, in the bonding step S3, first, the uncured sealing material 41 is supplied to each counter substrate region 53 in a substantially frame shape on the surface of the counter forming substrate 52 by screen printing or a dispenser. Subsequently, after bonding the active matrix forming substrate 50 and the counter forming substrate 52 so that each active matrix substrate region 51 and each counter substrate region 53 except the terminal region 10a overlap each other via the sealant 41, Each sealing material 41 is hardened by performing exposure processing, heat treatment, or the like using ultraviolet rays. Then, as shown in FIG. 8, a bonded mother substrate 55 including a plurality of bonded substrate regions 56 in which each active matrix substrate region 51 and each counter substrate region 53 are bonded through the sealing material 41 is manufactured. To do. Each bonded substrate region 56 has void cells 57 partitioned by the sealing material 41 between the active matrix substrate region 51 and the counter substrate region 53.

  In this embodiment, the sealing material 41 is described as being supplied to the counter forming substrate 53. However, the sealing material 41 is supplied to each active matrix substrate region 51 with respect to the surface of the active matrix forming substrate 50. You may do it.

(First parting process)
In the first dividing step S4 to be performed next, the bonded mother substrate 55 is divided into a plurality of bonded substrate regions 56 (display regions) on the dividing lines 58 and 59 by, for example, laser light irradiation or a scribe break method using a cutter wheel. Divide every line in D). At this time, the dividing line 58 divides both the active matrix forming substrate 50 and the opposing forming substrate 52. On the other hand, in the dividing line 59, only the opposing formation substrate 52 is divided to expose each terminal region 10 a from the opposing formation substrate 52. Then, the bonded mother substrate 55 is divided to form a plurality of strip-shaped panels 60 shown in FIG. At this time, the active matrix forming substrate 50 is divided for each row of the plurality of active matrix substrate regions 51 to form a plurality of strip-shaped substrates 61 constituting the respective strip-shaped panels 60, and the counter-forming substrate 52 is configured to have a plurality of counter-facing substrates 52. A plurality of strip-shaped substrates 62 constituting the respective strip-shaped panels 60 are divided by each row of the substrate region 53.

(Liquid crystal layer sealing process)
In the subsequent liquid crystal layer sealing step S5, first, each strip-shaped panel 60 is carried into a vacuum processing chamber, and then the inlet 41a of each bonded substrate region 56 in each strip-shaped panel 60 is immersed in a liquid crystal material. Then, the inside of the vacuum processing chamber is evacuated to fill the gap cells 57 of the bonded substrate regions 56 with the liquid crystal material.

  Thereafter, the atmospheric pressure in the vacuum processing chamber is returned to atmospheric pressure, and each strip-shaped panel 60 is unloaded from the vacuum processing chamber, and a sealing material 42 is applied so as to cover the injection port 41a of each bonded substrate region 56, and the injection port Block 41a. Then, as shown in FIG. 10, by encapsulating the liquid crystal layer 43 inside the sealing material 41 of each bonded substrate region 56, each bonded substrate region 56 has the structure of the liquid crystal display panel 44. It becomes.

(Inspection process)
In the next inspection step S6, a predetermined gate inspection signal is supplied to each short ring 19 and 20 in each strip panel 60 (strip substrate 61), whereby each first gate line 11a for each display region D is supplied. And each 2nd gate line 11b is test | inspected.

  Specifically, in this inspection step S6, a constant common inspection signal is input to the common signal input terminal 31 and a TFT drive signal is input to the TFT drive signal input terminal 29 to turn on the TFTs 25 and turn on the gates. By inputting predetermined gate inspection signals to the signal input terminals 21 and 22 while shifting the timing by the writing time, the TFTs connected to the first gate lines 11a and the second gate lines 11b are sequentially turned on. . Then, by inputting a predetermined source inspection signal to each source signal input terminal 27, a predetermined charge is written to a specific pixel electrode via the drain electrode. Then, when a predetermined voltage is applied to the liquid crystal layer 43 between the specific pixel electrode and the common electrode, the pixel including the pixel electrode is turned on.

  At this time, when each gate line 11 is disconnected, when the gate inspection signal is supplied to each gate line 11, the gate inspection signal is connected to the disconnected gate line 11 when the gate inspection signal is disconnected. A pixel that is not supplied and includes a pixel electrode that is connected at a disconnected point is in a non-lighting state. From this, disconnection of each gate line 11 is detected.

  In addition, when a leak occurs between each first gate line 11a and each second gate line 11b, the gate inspection signal is not supplied when the gate inspection signal is supplied to each first gate line 11a. The signal is also supplied to the leaked second gate line 11b, and the pixel including the pixel electrode connected to the leaked second gate line 11b is also turned on. When a gate inspection signal is supplied to each second gate line 11b, a pixel including a pixel electrode connected to the first gate line 11a to which the gate inspection signal should not be supplied is turned on. . From this, a leak between each first gate line 11a and each second gate line 11b is detected.

(Disconnection process)
In the next connection release step S7, in each strip-shaped panel 60, the first gate line 11a and the second gate line 11b are continuously connected in each irradiation region A preset between the pair of position confirmation patterns 23. By irradiating the laser beam, the electrical connection between the first gate lines 11a and the second gate lines 11b is released.

  In the connection release step S7, first, each strip-shaped panel 60 is placed on the stage 63 as shown in FIG. At this time, the strip-shaped substrate 62 is disposed on the stage 63 side, and the strip-shaped substrate 62 is held by adsorbing the strip-shaped substrate 62 by the stage 63. That is, in the strip-shaped substrate 61, the side where each gate line 11 is provided faces the stage side. And each irradiation area | region A is irradiated with a laser beam from the opposite side to the side in which each gate line 11 in the strip-shaped board | substrate 61 was provided. Here, an arrow 64 in FIG. 11 indicates a direction in which the laser beam is irradiated.

  When the electrical connection between the first gate lines 11a is canceled, as shown in FIG. 12, a spot S of the laser beam emitted from the laser cutting device is set to one end side of a preset irradiation area A ( Laser light is irradiated in accordance with the start point on the right end side in the figure, and the laser light spot S is moved from the start point toward the other end side (left end side in the figure) to apply laser light to the entire irradiation area A. Irradiate. Then, by irradiating each first gate line 11a with a laser beam, the irradiated portion of each first gate line 11a overlapping the region B irradiated with the laser beam is melted and evaporated to each first gate. The line 11a is cut, and each first gate line 11a and the short ring 19 are cut off. As a result, the electrical connection between the first gate lines 11a is released.

  Subsequently, even when the electrical connection between the second gate lines 11b is released, similarly to the first gate lines 11a described above, each second gate line 11b is cut by irradiating laser light. Then, each of the second gate lines 11b and the short ring 20 are separated. Then, the cutting of each gate line 11a and second gate line 11b by this laser light irradiation is continuously performed on each first gate line 11a and each second gate line 11b in each strip-shaped panel 60. By doing so, the electrical connection between each first gate line 11a and each second gate line 11b is continuously released.

(Position confirmation process)
In the subsequent position confirmation step S8, the positional relationship between the pair of position confirmation patterns 23 and the region B irradiated with the laser light is visually confirmed using a simple loupe. Here, as the simple loupe, one that can enlarge the visible region, for example, about 30 times is used.

  In this position confirmation step S8, in the connection release step S7, as shown in FIG. 13, when laser light is irradiated with high precision onto a predetermined desired irradiation area A, a pair of laser light irradiation traces is formed. It is visually recognized that the position confirmation pattern 23 remains so as to extend from one of the pair of position confirmation patterns 23 to the other so as to connect opposite corners. On the other hand, as shown in FIG. 14, when laser light is irradiated off the desired irradiation region A in the connection release step S7 due to a defect of the laser cutting device, the irradiation mark of the laser light is It is visually recognized that the pair of position confirmation patterns 23 remain so as to extend obliquely with respect to the direction from one to the other. From this, the position shift of the region B irradiated with the laser beam with respect to the preset irradiation region A is detected.

  And when position shift of the area | region B where the laser beam was irradiated with respect to the desired irradiation area | region A is detected in position confirmation process S8, it judges that it is a malfunction of a laser cut apparatus, and the position of the irradiation area | region B of a laser beam is The setting of the laser cutting apparatus is corrected so that the position of the desired irradiation area A is obtained. The position confirmation step S8 need not be performed on all the bonded substrate regions 56 in each strip-shaped panel 60, and may be performed by, for example, extracting from about several to several hundred strip-shaped panels 60.

(Resistance measurement process)
In the resistance measurement step S9 to be performed next, in each strip-shaped panel 60, as shown in FIG. 15, between the portions sandwiching the region B irradiated with the laser light in each first gate line 11a and each second gate line 11b. Measure the electrical resistance of each. In this resistance measurement step S <b> 9, the electrical resistance between the connection portions of the gate lines 11 with the short rings 19 and 20 and the gate driver mounting terminals 18 is measured by the resistance measuring device 65. The resistance measuring device 65 has an electrode 66 that is in contact with the connection portion of each gate line 11 and each terminal 18, and this electrode 66 is in view of bringing the connection portion of each gate line 11 and the entire surface of each terminal 18 into contact with each other. It is made of conductive rubber.

  In the present embodiment, the electrode 66 of the resistance measuring device 65 is formed of conductive rubber, but the electrode 66 is not particularly limited as long as it is formed of a conductive material.

  In this resistance measurement step S9, as shown on the left side in the figure, when a disconnection failure occurs in each gate line (second gate line 11b) 11, a predetermined electric resistance (for example, about several tens kΩ to several hundred kΩ). ) Is measured, as shown on the right side of the figure, when each gate line (each first gate line 11a) 11 is cut, the electric resistance measured with respect to the predetermined electric resistance. Becomes significantly larger. From this, it is confirmed whether or not each gate line 11 is surely cut, that is, whether or not each gate line 11 is cut off.

  As described above, when it is determined that at least a part of each gate line 11 is defective in cutting based on the electric resistance measured in the resistance measuring step S9, that is, the predetermined electric resistance is measured in the resistance measuring step S9. If so, a reconnection release step S10 is performed.

(Reconnection release process)
In the reconnection release step S10, a pair of position confirmation patterns 23 is applied to each gate line 11 that is determined to have at least partly disconnected in the resistance measurement step S9, as in the connection release step S7. In between, the gate lines 11 are again irradiated with laser light, and the electrical connections of the gate lines 11 are released. Thereafter, the resistance measurement step S9 is performed again to check whether or not each gate line 11 has a cutting defect. As described above, the resistance measurement step S9 and the reconnection release step S10 are repeated until it is determined that the gate lines 11 are surely disconnected in the resistance measurement step S9, and then the second dividing step S11 is performed.

(Second parting process)
In the second dividing step S11 to be performed next, each strip-shaped panel 60 is attached to each bonded substrate region 56 (display region D) by laser light irradiation or a scribe break method using a cutter wheel, as in the first dividing step S4. ) To form a plurality of liquid crystal display panels 44 as shown in FIG. At this time, each strip substrate 61 is divided into each active matrix substrate region 51 to produce a plurality of active matrix substrates 10, and each strip substrate 62 is divided into each counter substrate region 53 to form a plurality of counter substrates. 40 is produced.

  Thereafter, polarizing plates 45 and 46 are respectively attached to both surfaces of each liquid crystal display panel 44 by a pressure roller or the like, and a mounting step S12 is performed on each liquid crystal display panel 44 to which the polarizing plates 45 and 46 are attached.

(Mounting process)
In the mounting step S12, after the ACF is arranged in the mounting area 10b of each liquid crystal display panel 44, the LSI driver chip 47 is pressure-bonded to the mounting area 10b via the ACF, whereby the LSI driver chip 47 is applied to each liquid crystal display panel 44. Is implemented. The liquid crystal display device 1 is manufactured by performing the above steps.

-Effect of Embodiment 1-
Therefore, according to the first embodiment, the first gate lines 11a and the second gate lines 11b are cut by laser light irradiation, and the first gate lines 11a and the second gate lines 11b are electrically connected to each other. After performing the connection release step S7 for releasing each of the individual connections, the connection release step S7 is performed by performing a position confirmation step S8 for confirming the positional relationship between the position confirmation pattern 23 and the region B irradiated with the laser beam. Even if a position shift occurs in the region B where the actual laser beam is irradiated with respect to the preset laser beam irradiation region A due to a defect in the laser cutting device, the laser beam is irradiated in the position confirmation step S8. It is possible to detect the positional deviation of the region B that has been performed at an early stage.

  And when the position shift of the area | region B irradiated with the laser beam is detected, in order to correct the position of the irradiation region B of the laser beam to the position of the desired irradiation region A, the mutual electrical connection is performed thereafter. It is possible to suppress a disconnection failure in each gate line 11 to be released.

  Incidentally, in the connection release step S7, as shown in FIG. 17, when the irradiation region A is irradiated with laser light from the side where the gate lines 11 are provided in the strip-shaped substrate 61, FIG. 18 and FIG. As shown in FIG. 4, since the melted wiring material of each gate line 11 is scattered as fine particles 67 and scattered around the region B irradiated with the laser beam, the adjacent gate lines 11 are scattered by the scattered fine particles 67. There is a risk of secondary defects such as being electrically connected again. Here, the arrow 68 in FIG. 18 indicates the scattering direction of the fine particles 67 of the wiring material.

  On the other hand, in the present embodiment, the irradiation region A is irradiated with laser light from the side opposite to the side where each gate line 11 is provided in the strip-shaped substrate 61. Therefore, as shown in FIG. The fine particles 67 of the wiring material of the respective gate lines 11 that have been scattered due to the above are physically dropped to the stage 63 side by gravity. Here, an arrow 69 in FIG. 20 indicates the scattering direction of the fine particles 67 of the wiring material. As a result, as shown in FIG. 21, the wiring material fine particles 67 scattered around the region B irradiated with the laser light can be reduced, and the adjacent gate lines 11 are again connected by the scattered fine particles 67. Secondary defects such as electrical connection can be suppressed.

  Further, a pair of position confirmation patterns 23 are provided on both sides of each of the wiring groups 13 and 14 respectively constituted by the first gate lines 11a and the second gate lines 11b outside the display area D, and the pair of positions. In order to cut each first gate line 11a and each second gate line 11b between the confirmation patterns 23, confirmation of the positional relationship between the position confirmation pattern 23 and the region B irradiated with the laser beam in the position confirmation step S8. Can be easily performed by confirming whether or not the region B irradiated with the laser beam extends from one of the pair of position confirmation patterns 23 to the other.

  Further, when a predetermined electrical resistance is measured in the resistance measuring step S9 and it is determined that at least a part of each gate line 11 has a cutting defect, each gate line 11 is again irradiated with a laser beam to detect them. Since the reconnection release step S10 for releasing the electrical connection of the gate lines 11 is performed, the electrical connection of the gate lines 11 can be more reliably released.

  Further, in the connection releasing step S7, each strip-shaped panel 60 is irradiated with laser light continuously on each first gate line 11a and each second gate line 11b, so that each first gate for each display region D is provided. The electrical connection between the line 11a and each second gate line 11b is continuously released. As a result, after the strip-shaped panel 60 is divided into individual substrates for each bonded substrate region 56, each substrate is irradiated with laser light, and the first gate lines 11a and each of the substrates are respectively irradiated. Compared to the case where the electrical connection between the second gate lines 11b is canceled, the electrical connection between the first gate lines 11a and the second gate lines 11b in the plurality of display regions D can be efficiently performed. Can be canceled.

  Further, in the inspection step S6, each strip-shaped panel 60 is supplied with a predetermined gate inspection signal by shifting the timing to the respective short rings 19 and 20 via the respective terminals 21 and 22 by the writing time. The presence or absence of disconnection of each gate line 11 in the substrate 61 and the presence or absence of leakage between each first gate line 11a and each second gate line 11b are inspected. As a result, the strip-shaped panel 60 is divided into individual substrates for each bonded substrate region 56 and then the gate lines 11 are inspected for the individual substrates, respectively. The presence or absence of disconnection of each gate line 11 and the presence or absence of leakage between each first gate line 11a and each second gate line 11b can be efficiently inspected.

<< Embodiment 2 of the Invention >>
22 and 23 show Embodiment 2 of the present invention. In the following embodiments, the same portions as those in FIGS. 1 to 21 are denoted by the same reference numerals, and detailed description thereof is omitted. 22 and 23 are plan views showing the active matrix substrate region 51 of the active matrix forming substrate 50 in the present embodiment.

  In the first embodiment, a pair of position confirmation patterns 23 is provided on both sides of each of the wiring groups 13 and 14, but in this embodiment, as shown in FIG. The pair of position confirmation patterns 23 are provided on both sides of the wiring groups 13 and 14 so as to be arranged in the direction in which the gate lines 11 are drawn out.

  That is, the two pairs of position confirmation patterns 23 are provided so as to sandwich the wiring groups 13 and 14 in different regions. A laser beam irradiation area A is set between each of the pair of position confirmation patterns 23. As shown in FIG. 23, each gate line 11 has a notch 70 formed in a portion irradiated with laser light, that is, a portion overlapping the irradiation region A.

  In the connection release step S7 of this embodiment, each gate line 11 is irradiated with a laser beam between one position confirmation pattern 23 of the two pairs of position confirmation patterns 23 to thereby each of the gate lines 11. Disconnect. Then, when it is determined that a disconnection failure has occurred in at least a part of each gate line 11 based on the electrical resistance measured in the resistance measurement step S9, the other pair of position confirmations is performed in the reconnection release step S10. By irradiating each gate line 11 with a laser beam between the pattern 23, the gate line 11 is irradiated with a laser beam in a region different from the region irradiated with the laser beam in the disconnection step S7. The line 11 is cut.

-Effect of Embodiment 2-
Therefore, according to the second embodiment, the notches 70 are formed in the portions of the gate lines 11 that are irradiated with the laser light, so that the portions of the gate lines 11 that are irradiated with the laser light are the respective portions. Since the gate line 11 is formed thinner than other portions of the gate line 11, each gate line 11 can be more reliably cut in the connection release step S7. And since the quantity of the wiring material of each gate line 11 fuse | melted by irradiation of a laser beam decreases, it can suppress that each gate line 11 adjacent by the fuse | melted wiring material is newly electrically connected. .

  By the way, depending on the surface state of the substrate to which the laser beam is irradiated, when the laser beam is irradiated, the laser beam is diffusely reflected on the surface, and the portion of the gate line 11 irradiated with the laser beam is applied. If the energy is not sufficiently applied, a part of each gate line 11 remains without being removed, and there is a possibility that a disconnection failure occurs in each gate line 11. As described above, when a disconnection failure occurs in each gate line 11 due to the surface state of the substrate irradiated with the laser beam, each gate line 11 is connected to each gate line 11 in the same region as the connection release step S7 in the reconnection release step S10. Even when the laser beam is irradiated, the remaining part of each gate line 11 without being removed is not given sufficient energy by the laser beam irradiation as in the connection release step S7, and the reconnection release step S10 is performed. Even if it is performed, there is a possibility that a defective cutting may remain in each gate line 11.

  In contrast, according to the manufacturing method of the present embodiment, in the reconnection release step S10, each gate line 11 is irradiated with laser light in a region different from the region irradiated with laser light in the connection release step S7. Each gate line 11 can be cut more reliably.

<< Embodiment 3 of the Invention >>
FIG. 24 shows Embodiment 3 of the present invention. FIG. 24 is a plan view showing an active matrix substrate region 51 of the active matrix forming substrate 50 in the present embodiment.

  In the first and second embodiments, the gate lines 11a and 11b are irradiated with laser light to release the electrical connection between the gate lines 11a and 11b. By irradiating the short rings 19 and 20 with laser light, the electrical connection between the gate lines 11a and 11b is released.

  As shown in FIG. 24, each active matrix substrate region 51 of the active matrix forming substrate 50 in the present embodiment is connected to each short ring 19, 20 on both sides of the short ring 19, 20 and each gate line 11. A pair of position confirmation patterns 23 are provided so as to sandwich the portion, and a laser light irradiation area A is set between the pair of position confirmation patterns 23.

  In the connection release step S7 in the present embodiment, each short ring 19 and 20 is irradiated with laser light between the pair of position confirmation patterns 23, and each short ring 19 overlapping the region B irradiated with the laser light. , 20 are removed by melting and evaporating, thereby releasing the electrical connection between the gate lines 11a and 11b.

-Effect of Embodiment 3-
Therefore, also in the third embodiment, the position confirmation pattern 23 and the laser beam are irradiated after the connection release step S7 for releasing the electrical connection between the gate lines 11a and 11b by the laser beam irradiation. Since the position confirmation step S8 for confirming the positional relationship with the region B is performed, the positional deviation of the region B irradiated with the laser light with respect to the laser light irradiation region A set in advance in the position confirmation step S8 can be detected at an early stage.

<< Other Embodiments >>
In each of the above embodiments, the pair of position confirmation patterns 23 are provided. However, the present invention is not limited to this, and the position confirmation pattern 23 may be provided singly, and laser light may be emitted. If the positional relationship with the irradiated region B can be confirmed, it can be provided at an arbitrary position.

  In the second embodiment, two pairs of position confirmation patterns 23 are provided on both sides of each of the wiring groups 13 and 14, respectively, but the present invention is not limited to this, and a plurality of sets of three or more sets are provided. The pair of position confirmation patterns 23 may be provided on both sides of each of the wiring groups 13 and 14, respectively. When the reconnection release step S10 is repeatedly performed a plurality of times, each gate line 11 may be irradiated with laser light between a pair of different position confirmation patterns 23 in each reconnection release step S10.

  In the first embodiment, the liquid crystal layer 43 is provided by a so-called vacuum injection method in which a liquid crystal material is injected from the injection port 41a of the sealing material 41 after the active matrix formation substrate 50 and the counter formation substrate 52 are bonded together. However, the present invention is not limited to this, and each sealing material 41 is supplied in a frame shape to one of the active matrix forming substrate 50 and the opposing forming substrate 52, and a predetermined amount of liquid crystal material is dropped inside each sealing material 41. After that, the liquid crystal layer 43 may be provided by a so-called drop dropping method (ODF: One Drop Filling) in which the two formation substrates 50 and 52 are bonded together.

  In the first embodiment, in the inspection step S6, the gate lines 11 for each display area D are inspected by turning on the display areas D in the state of the strip-shaped panel 60. However, the present invention is not limited to this. In the inspection process, before the bonding process, a predetermined gate inspection signal is supplied to each gate line 11 to write a charge to each pixel electrode, and the written charge is read after a lapse of a predetermined time. It may be performed by other inspection methods such as a charge detection method for detecting disconnection or short circuit.

  In each of the above embodiments, the manufacturing method of the active matrix substrate 10 according to the present invention has been described along the manufacturing method of the liquid crystal display device 1, but the present invention is not limited thereto, and other displays such as an organic electroluminescence display device and the like. The present invention can also be applied to a method for manufacturing an active matrix substrate constituting the apparatus.

  As described above, the present invention is useful for a method of manufacturing an active matrix substrate, and in particular, it is desired to detect a positional deviation of a laser beam irradiation region with respect to a preset laser beam irradiation region at an early stage. It is suitable for a manufacturing method of an active matrix substrate.

1 is a plan view schematically showing a liquid crystal display device of Embodiment 1. FIG. It is sectional drawing which shows the II-II line cross section of FIG. 1 roughly. 1 is a plan view schematically showing an active matrix substrate of Embodiment 1. FIG. It is a figure which shows the flow of the manufacturing method of a liquid crystal display device. It is a top view which shows the board | substrate for active matrix formation roughly. It is a top view which shows an active matrix substrate area | region schematically. It is a top view which shows the board | substrate for opposing formation schematically. It is a top view which shows a bonded mother board | substrate schematically. It is a top view which shows a strip-shaped panel roughly. It is a top view which shows roughly the strip-shaped panel with which the liquid crystal layer was enclosed. It is sectional drawing which shows the state by which the laser beam was irradiated to the irradiation area | region in the connection cancellation | release process. It is a top view which shows roughly the active-matrix substrate area | region of the state which cut | disconnected each gate line by irradiation of the laser beam. It is a top view which shows the state with which the desired irradiation area | region was irradiated with the laser beam accurately. It is a top view which shows the state which the irradiation area | region of the actual laser beam shifted | deviated with respect to the desired irradiation area | region. It is a top view which shows the state which is measuring the electrical resistance of the part which pinches | interposes the area | region where the laser beam in each gate line was irradiated in a position confirmation process. It is a top view which shows the state by which the strip-shaped panel was divided for every bonding board | substrate area | region in a 2nd cutting process. It is sectional drawing which shows the state which irradiated the laser beam to the irradiation area | region from the side in which each gate line in the strip-shaped board | substrate was provided. It is sectional drawing which shows the scattering state of the microparticles | fine-particles of wiring material at the time of irradiating a laser beam to an irradiation area | region from the side in which each gate line in the strip-shaped board | substrate was provided. It is a top view which shows the scattering state of the microparticles | fine-particles of the wiring material at the time of irradiating a laser beam to the irradiation area | region from the side in which each gate line in the strip-shaped board | substrate was provided. It is sectional drawing which shows the scattering state of the microparticles | fine-particles of the wiring material at the time of irradiating a laser beam to an irradiation area | region from the opposite side to the side in which each gate line was provided in a strip-shaped board | substrate. It is a top view which shows the scattering state of the microparticles | fine-particles of wiring material at the time of irradiating a laser beam to an irradiation area | region from the opposite side to the side in which each gate line was provided in a strip-shaped board | substrate. 6 is a plan view schematically showing an active matrix substrate region of an active matrix forming substrate in Embodiment 2. FIG. It is a top view which expands and schematically shows the irradiation area of the laser beam in FIG. FIG. 6 is a plan view schematically showing an active matrix substrate region of an active matrix forming substrate in Embodiment 3. It is a top view which shows the state by which the laser beam was irradiated to the desired irradiation area | region in the cutting | disconnection of each display wiring by the irradiation of the laser beam in the past. It is a top view which shows the state which the area | region where the laser beam was irradiated with respect to the desired irradiation area | region has shifted | deviated slightly in the cutting | disconnection of each display wiring by the irradiation of the laser beam in the past. It is a top view which shows the state which the area | region where the laser beam was irradiated with respect to the desired irradiation area | region shifted significantly in the cutting | disconnection of each display wiring by the irradiation of the laser beam in the past.

Explanation of symbols

A Preliminary laser light irradiation area B Laser light irradiation area D Display area 1 Liquid crystal display device 10 Active matrix substrate 11 Gate line (wiring for display)
11a First gate line (display wiring)
11b Second gate line (display wiring)
13 First wiring group (wiring group)
14 Second wiring group (wiring group)
19, 20 Short ring (short circuit wiring)
23 Position confirmation pattern 50 Active matrix formation substrate 61 Strip substrate 70 Notch

Claims (8)

A display area provided with a plurality of display wirings; a short-circuiting wiring connected to each of the display wirings outside the display area; and a position confirmation pattern provided for the shorting wiring. A preparation step of preparing a substrate for forming an active matrix;
Outside the display region, by irradiating each display wiring with laser light, a connection releasing step for releasing the electrical connection between the display wirings,
A method for manufacturing an active matrix substrate, comprising: a position confirmation step for confirming a positional relationship between the position confirmation pattern and the region irradiated with the laser beam. In the manufacturing method of the active-matrix board | substrate of Claim 1,
In the active matrix forming substrate, the plurality of display wirings are arranged side by side and drawn out of the display area to form a wiring group outside the display area, and the position confirmation pattern is formed on both sides of the wiring group. Are provided in a pair,
In the connection release step, the display wiring is cut by irradiating the display wiring with a laser beam between the pair of position confirmation patterns. In the manufacturing method of the active-matrix board | substrate of Claim 1,
The method for manufacturing an active matrix substrate, wherein the active matrix forming substrate is formed with a notch in each of the display wirings where the laser light is irradiated. In the manufacturing method of the active-matrix board | substrate of Claim 1,
After the disconnection step, a resistance measurement step of measuring the electrical resistance between the portions sandwiching the region irradiated with the laser light in each display wiring,
Based on the electrical resistance measured in the resistance measurement step, when it is determined that at least a part of each display wiring is defective in cutting, the display wiring is again irradiated with laser light to And a reconnection release step of releasing the electrical connection of the display wirings. In the manufacturing method of the active-matrix board | substrate of Claim 4,
The method of manufacturing an active matrix substrate, wherein, in the reconnection release step, each display wiring is irradiated with laser light in a region different from the region irradiated with laser light in the connection release step. In the manufacturing method of the active-matrix board | substrate of Claim 1,
The active matrix forming substrate has a plurality of display areas defined in a matrix,
A first dividing step of forming a plurality of strip-shaped substrates by dividing the active matrix forming substrate into each row of the plurality of display regions;
A second dividing step of dividing each strip-shaped substrate into each display region,
In the connection release step, a laser beam is continuously irradiated on each of the display wirings in each of the strip-shaped substrates. In the manufacturing method of the active-matrix board | substrate of Claim 6,
Including an inspection step of inspecting each display wiring for each display region by supplying a predetermined signal to the short-circuit wiring in each of the strip-shaped substrates before the connection releasing step. A method for manufacturing an active matrix substrate. A display area provided with a plurality of display wirings; a short-circuiting wiring connected to each of the display wirings outside the display area; and a position confirmation pattern provided for the shorting wiring. A preparation step of preparing a substrate for forming an active matrix;
Outside the display area, by irradiating at least one of the display wires and the short-circuit wire with laser light, a connection release step of releasing the electrical connection between the display wires,
A method for manufacturing an active matrix substrate, comprising: a position confirmation step for confirming a positional relationship between the position confirmation pattern and the region irradiated with the laser beam.

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