JP2009242455A5 - - Google Patents
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- Publication number
- JP2009242455A5 JP2009242455A5 JP2008087494A JP2008087494A JP2009242455A5 JP 2009242455 A5 JP2009242455 A5 JP 2009242455A5 JP 2008087494 A JP2008087494 A JP 2008087494A JP 2008087494 A JP2008087494 A JP 2008087494A JP 2009242455 A5 JP2009242455 A5 JP 2009242455A5
- Authority
- JP
- Japan
- Prior art keywords
- mol
- aromatic
- dihydroxybiphenyl
- terephthalic acid
- hydroxybenzoic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Description
上記構造単位の組み合わせとしては、
（Ａ1）
（Ａ1）、（Ｂ1）、（Ｃ1）
（Ａ1）、（Ｂ1）、（Ｂ2）、（Ｃ1）
（Ａ1）、（Ｂ1）、（Ｂ2）、（Ｃ2）
（Ａ1）、（Ｂ1）、（Ｂ3）、（Ｃ1）
（Ａ1）、（Ｂ1）、（Ｂ3）、（Ｃ2）
（Ａ1）、（Ｂ1）、（Ｂ2）、（Ｃ1）、（Ｃ2）
（Ａ1）、（Ａ2）、（Ｂ1）、（Ｃ1）
が好ましく、特に好ましいモノマー組成比としては、ｐ−ヒドロキシ安息香酸、テレフタル酸、4，4’−ジヒドロキシビフェニル（これらの誘導体を含む。）を８０〜１００モル％と、これら以外の芳香族ジオール、芳香族ヒドロキシジカルボン酸及び芳香族ジカルボン酸からなる群から選択される芳香族化合物０〜２０モル％（両者を合わせて１００モル％とする。）である。ｐ−ヒドロキシ安息香酸、テレフタル酸、4，4’−ジヒドロキシビフェニルが８０モル％未満になると、耐熱性が低下する傾向にあり、好ましくない。
As a combination of the above structural units,
(A1)
(A1), (B1), (C1)
(A1), (B1), (B2), (C1)
(A1), (B1), (B2), (C2)
(A1), (B1), (B3), (C1)
(A1), (B1), (B3), (C2)
(A1), (B1), (B2), (C1), (C2)
(A1), (A2), (B1), (C1)
As a particularly preferable monomer composition ratio, p-hydroxybenzoic acid, terephthalic acid, 4,4′-dihydroxybiphenyl (including these derivatives) is 80 to 100 mol%, aromatic diols other than these, Aromatic compounds selected from the group consisting of aromatic hydroxydicarboxylic acids and aromatic dicarboxylic acids, 0 to 20 mol% (both are 100 mol% in total ) . When p-hydroxybenzoic acid, terephthalic acid , and 4,4′-dihydroxybiphenyl are less than 80 mol%, the heat resistance tends to decrease, which is not preferable.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008087494A JP5951169B2 (en) | 2008-03-28 | 2008-03-28 | Liquid crystalline polyester resin composition for camera modules |
| KR1020107024246A KR101591541B1 (en) | 2008-03-28 | 2009-03-24 | Liquid-crystal polyester resin composition for camera modules |
| TW098109567A TWI444427B (en) | 2008-03-28 | 2009-03-24 | Camera module with liquid crystal polyester resin composition |
| US12/933,967 US8192645B2 (en) | 2008-03-28 | 2009-03-24 | Liquid crystal polyester resin composition for camera module |
| PCT/JP2009/056410 WO2009119863A1 (en) | 2008-03-28 | 2009-03-24 | Liquid-crystal polyester resin composition for camera modules |
| CN2009801113254A CN101981123B (en) | 2008-03-28 | 2009-03-24 | Liquid-crystal polyester resin composition for camera modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008087494A JP5951169B2 (en) | 2008-03-28 | 2008-03-28 | Liquid crystalline polyester resin composition for camera modules |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009242455A JP2009242455A (en) | 2009-10-22 |
| JP2009242455A5 true JP2009242455A5 (en) | 2010-12-24 |
| JP5951169B2 JP5951169B2 (en) | 2016-07-13 |
Family
ID=41304753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008087494A Active JP5951169B2 (en) | 2008-03-28 | 2008-03-28 | Liquid crystalline polyester resin composition for camera modules |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5951169B2 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8692272B2 (en) * | 2008-10-28 | 2014-04-08 | Sumitomo Chemical Company, Limited | Resin composition, reflective board and light-emitting apparatus |
| CN103154133B (en) * | 2010-10-13 | 2015-03-11 | 株式会社钟化 | Highly thermally conductive resin molded article, and manufacturing method for same |
| WO2013074467A1 (en) * | 2011-11-15 | 2013-05-23 | Ticona Llc | Low naphthenic liquid crystalline polymer composition for use in molded parts of a small dimensional tolerance |
| CN103930464B (en) * | 2011-11-15 | 2016-02-10 | 提克纳有限责任公司 | Compact camera |
| JP6052848B2 (en) * | 2011-12-20 | 2016-12-27 | 住友化学株式会社 | Liquid crystal polyester resin composition and molded body |
| JP5914934B2 (en) * | 2012-02-28 | 2016-05-11 | 住友化学株式会社 | Liquid crystal polyester composition, molded body and light emitting device |
| WO2014099377A1 (en) * | 2012-12-19 | 2014-06-26 | Ticona Llc | Liquid crystalline composition having a dark black color |
| JP2016510831A (en) | 2013-03-13 | 2016-04-11 | ティコナ・エルエルシー | Liquid crystal polymer composition |
| JP6063373B2 (en) | 2013-12-03 | 2017-01-18 | Ｊｘエネルギー株式会社 | Liquid crystal polyesteramide resin composition, and camera module component including the injection molded body as a constituent member |
| JP6165608B2 (en) | 2013-12-03 | 2017-07-19 | Ｊｘｔｇエネルギー株式会社 | Camera module parts comprising a wholly aromatic liquid crystal polyester resin composition and an injection molded product thereof as constituent members |
| JP6844968B2 (en) * | 2016-07-29 | 2021-03-17 | 上野製薬株式会社 | Liquid crystal polymer composition |
| WO2019112847A1 (en) | 2017-12-05 | 2019-06-13 | Ticona Llc | Aromatic polymer composition for use in a camera module |
| WO2021173411A1 (en) | 2020-02-26 | 2021-09-02 | Ticona Llc | Polymer composition for an electronic device |
| JP2023514820A (en) | 2020-02-26 | 2023-04-11 | ティコナ・エルエルシー | electronic device |
| CN115700014A (en) | 2020-02-26 | 2023-02-03 | 提克纳有限责任公司 | Circuit structure |
| US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09297256A (en) * | 1996-04-30 | 1997-11-18 | Toray Ind Inc | Camera lens barrel and its production |
| JP5951167B2 (en) * | 2008-03-28 | 2016-07-13 | Ｊｘエネルギー株式会社 | Liquid crystalline polyester resin composition for camera modules |
| JP5951168B2 (en) * | 2008-03-28 | 2016-07-13 | Ｊｘエネルギー株式会社 | Liquid crystalline polyester resin composition for camera modules |
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2008
- 2008-03-28 JP JP2008087494A patent/JP5951169B2/en active Active