JP2009241286A5 - - Google Patents

Claims (7)

A solder supply unit for supplying solder to an upper surface of a mask disposed on a substrate and having an opening of a predetermined pattern corresponding to the substrate;
A solder supply adjustment unit for adjusting the amount of solder supplied from the solder supply unit corresponding to the total area of the opening of the mask ;
The solder supply unit contains solder therein and has a supply port for discharging the contained solder, a gas source for supplying a gas of a predetermined pressure to the solder storage unit, A switching means that is provided in a gas passage between the gas source and the solder accommodating portion, and switches the pressure of the solder accommodating portion between a pressurized state based on a gas supplied from the gas source and an atmospheric pressure state;
The solder supply adjusting unit is provided in a gas passage between the gas source and the solder accommodating unit, and the pressure of the gas from the gas source is applied to the solder accommodating unit corresponding to the total area of the opening of the mask. The printing apparatus comprised so that the 1st pressure adjustment part which can be adjusted to the pressure of the gas supplied is comprised . Provided that allows a user to the operating position, further comprising a second pressure adjusting unit capable of adjusting the regulated pressure of the first pressure regulating unit, the printing apparatus according to claim 1. A control unit that controls at least the driving of the solder supply unit;
The solder supply unit further includes a remaining amount detection unit that detects a remaining amount of solder accommodated in the solder accommodation unit,
The control unit holds a set value of the supply amount of solder set corresponding to the total area of the opening of the mask,
The control unit calculates a supply amount of solder supplied from the supply port based on the remaining amount of solder in the solder housing unit detected by the remaining amount detection unit, and the calculated supply amount is the set value. 3. The printing apparatus according to claim 1, wherein the switching unit is configured to control the pressure of the solder housing portion to be in an atmospheric pressure state when the above is reached. A control unit that controls at least the driving of the solder supply unit;
When supplying solder to the upper surface of the mask, the control unit controls the switching unit so that the pressure of the solder accommodating unit is in a pressurized state for a time corresponding to the total area of the opening of the mask. The printing apparatus according to claim 1 , wherein the printing apparatus is configured. The switching means includes a first state in which the gas source side communicates with the solder accommodating portion side with the switching means as a boundary in the gas passage, and the gas source side with the switching means in the gas passage as a boundary. while in a closed state, the said solder housing part side the switching means as a boundary of the gas passage is composed of a valve mechanism for switching to the second state of the atmosphere open state claim 1 The printing apparatus according to item 1. The solder supply unit is provided in the gas passage closer to the solder accommodating unit than the valve mechanism, and when the valve mechanism is switched from the first state to the second state, The printing apparatus according to claim 5 , further comprising an exhaust device that releases internal pressure to the atmosphere. A control unit that controls at least the driving of the solder supply unit;
The solder supply unit further includes a discharge stop member that is movable in the vicinity below the supply port,
The discharge stop member has a cutting member for cutting the solder hanging from the supply port, and a closing member for closing the supply port,
The control unit cuts the solder suspended from the supply port by the cutting member and supplies the supply by the closing member when the switching unit is switched so that the pressure of the solder accommodating unit is changed to an atmospheric pressure state. the discharge is configured to control the stop member, the printing apparatus according to any one of claims 1 to 6 so as to move the discharge stop member so as to close the mouth.