JP2009239051A - Substrate bonding tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate bonding tape which neither breaks nor peels and so on even when a plurality of sheet type substrates are connected into a long-sized substrate and subjected to circuit formation processing. <P>SOLUTION: The substrate bonding tape is used for a method of connecting the plurality of sheet type substrates into the long-sized substrate and performing the circuit formation processing, and has thermosetting adhesive layers stacked on a base. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate bonding tape used in a method of connecting a plurality of sheet-like substrates to form a long substrate to perform a circuit forming process.

  In recent years, flexible substrates have been used in mobile phones, liquid crystal displays, digital cameras, hard disks, and many other electronic devices. Because of its flexibility, it is used for hinges and movable parts, and is indispensable for compactly storing substrates in equipment. However, when a flexible substrate is manufactured, the sheet-like substrate is flexible and frequently causes troubles such as winding, dropping, and skewing in the conveyance process. A simple transport mechanism used in manufacturing a rigid printed circuit board having no flexibility cannot transport a sheet-like substrate of a flexible substrate.

  The thickness of the flexible substrate is expected to become thinner and thinner in the future, and roll-to-roll processing is required to ensure transportability. However, there are numerous processes until the product is processed into a final form, and enormous capital investment is required for roll-to-roll processing in all processes. On the other hand, the sheet-like substrate is easy to process, and there are also processes that are preferably performed on the sheet-like substrate in terms of quality, and there is a demand for using existing equipment for sheet-like substrates. For example, the drilling step is more efficient when the sheet-like substrate is stacked and drilled or laser drilled. In addition, the plating process is more uneven when treated in a standing manner, and the alignment accuracy is better when the lamination process is performed on a sheet-like substrate. Thus, it is desired to process in a state suitable for each process, such as processing with a sheet-like substrate or processing with a long substrate.

  Therefore, a method has been proposed in which a part of the process is processed with a sheet-like substrate, and then the sheet-like substrate is connected to be processed as a long substrate (see Patent Documents 1 to 4). For example, laser drilling is performed on a sheet-like substrate, and then connected with a tape to form a long substrate. The long substrate includes a flow of separation into a sheet-like substrate after a plating step, a dry film photoresist lamination or coating step, a pattern exposure step, an alkali development step, an etching step, and a resist stripping step.

When processing a long substrate by connecting sheet-like substrates, the substrate bonding tape must not be cut due to strong tension, twisting or distortion, and chemicals used, such as organic solvents, alkaline solutions, acid solutions Tolerance is necessary. Furthermore, it may be used in a high-temperature process such as a hot press, and it is necessary that the connecting portion does not peel off even in a high-temperature region. However, the substrate bonding tapes described in Patent Documents 1 to 4 have a problem in that they do not have sufficient adhesive strength, chemical resistance, and high temperature resistance, and the substrate bonding tape is easily peeled off or cut.
JP 2004-43848 A JP 2003-342543 A JP 2002-164039 A Japanese Patent Laid-Open No. 9-232724

  An object of the present invention is to provide a substrate bonding tape that does not cause cutting and peeling even when a circuit forming process is performed by connecting a plurality of sheet-like substrates to form a long substrate.

  As a result of investigations, the present inventors have invented the substrate bonding tape of the present invention capable of solving the problems. That is, the substrate bonding tape of the present invention is a substrate bonding tape used in a method of performing circuit formation processing by connecting a plurality of sheet-shaped substrates to form a long substrate, and a thermosetting adhesive layer is provided on a support. This is a laminated substrate bonding tape.

  Moreover, it is said board | substrate joining tape whose said support body is copper foil.

  Moreover, it is said board | substrate joining tape whose said support body is a polyimide.

  Further, in the above substrate bonding tape, the support is polyethylene naphthalate.

  Moreover, the said thermosetting adhesion layer is said board | substrate joining tape containing an epoxy resin.

  By applying the substrate bonding tape of the present invention by heat, when the sheet-like substrates are connected, the thermosetting pressure-sensitive adhesive layer of the substrate bonding tape is cured and can be firmly bonded, and the adhesive strength is improved. In addition, the thermosetting adhesive layer is less fluid with respect to heat after curing, and has an advantage that peeling of the substrate bonding tape does not occur in high-temperature circuit formation processes, for example, processes such as hot pressing and heat melting. . In addition, it does not swell with a chemical solution such as a strong alkali solution, strong acid solution, or organic solvent, and a strong tension can be applied to the long substrate even in the step of using the chemical solution.

  Hereinafter, the substrate bonding tape of the present invention will be described in detail.

  The support in the substrate bonding tape of the present invention may be any material as long as it has sufficient strength to withstand the circuit forming process. Examples thereof include metal materials such as copper, silver, aluminum, stainless steel, nichrome, iron, and tungsten, and alloy materials composed of copper, iron, chromium, zinc, tin, and the like. Examples thereof include resin films such as polyimide, polyethylene naphthalate, polyethylene terephthalate, polyamide, polyetherimide, polycarbonate, polyphenylene sulfide, polyurethane, and polyphenylene ether. Moreover, paper, a nonwoven fabric, a woven fabric etc. are mentioned. The thickness of the support is preferably 1 to 200 μm. By using copper for the support, the tensile strength of the bonded portion by the substrate bonding tape can be increased. Moreover, since the circuit conductor is mainly copper, management becomes easy. Moreover, since conduction between the sheet-like substrates is possible, it is preferable because a plating process or the like on the long substrate can be easily performed. In addition, it is preferable to use polyimide or polyethylene naphthalate for the support because the substrate bonding tape is more excellent in heat resistance and tensile strength than when other resin films are used. In addition, as shown in FIG. 5, the tensile strength of the bonded portion by the substrate bonding tape is obtained by pulling the two sheet-like substrates 2 bonded together with the substrate bonding tape 1 having a certain initial width in the 180 ° C. direction, It can be expressed as the maximum load when the substrate bonding tape is cut or peeled off.

  The thermosetting adhesive layer in the substrate bonding tape of the present invention may be any material as long as it can be attached to a sheet-like substrate and has adhesiveness in the attaching temperature region. Examples of the thermosetting component include epoxy resin, phenol resin, melamine resin, urea resin, alkyd resin, polyimide, polyurethane and the like. These may be used alone or in combination of two or more. Epoxy resins are preferred because they are excellent in adhesion to metals and have a high curing rate. Further, a binder may be mixed in order to improve the initial adhesive force before thermosetting. Examples of the binder include butadiene-acrylonitrile rubber, styrene-butadiene rubber, acrylonitrile-butadiene-styrene rubber, silicone resin, polycarbonate, polyether sulfone, phenoxy resin, polyetherimide, polyvinyl butyral, polyvinyl alcohol, and acrylic resin. It is preferable to use a binder that does not phase separate from the thermosetting component.

  In the substrate bonding tape of the present invention, release paper, polyethylene film, polypropylene film or the like may be laminated on the surface of the thermosetting adhesive layer in order to prevent blocking when the substrate bonding tape is stored in a stacked manner. .

  The board | substrate joining tape of this invention is used for the use which connects several sheet-like board | substrates and makes it an elongate board | substrate. 1 and 2 are cross-sectional views of an elongated substrate. Edges in the conveyance direction of the sheet-like substrate 2, that is, the front side and the rear side in the conveyance direction are connected to each other by the substrate bonding tape 1. The substrate bonding tape is formed by laminating the thermosetting adhesive layer 4 on the support 3, and is attached so that the thermosetting adhesive layer 4 is in contact with the sheet-like substrate 2. The substrate bonding tape 1 may be attached to both surfaces of the sheet-like substrate 1 (FIG. 2), or may be attached to only one surface (FIG. 1). 3 and 4 are plan views of the long substrate, but it may be applied over a wide range in the width direction of the edge of the sheet-like substrate (FIG. 3) or may be attached to the end (FIG. 4). ). That is, any attachment method may be used as long as no conveyance failure occurs due to cutting, deformation, twisting, distortion, or the like during conveyance. The sheet-like substrates are preferably connected so as not to overlap. In actual production, it is difficult to fit the edges closely, and it is preferable to connect the substrate materials with a gap therebetween. The interval varies depending on the length, width, sticking method, adhesion to the material, process, etc. of the tape, and thus cannot be defined unconditionally, but it is preferably 10 mm or less. Preferably it is 5 mm or less.

  The temperature at which the substrate bonding tape of the present invention is applied is preferably applied in the vicinity of the temperature at which the thermosetting adhesive layer is cured. As the pasting device, a method of pressing a rubber roller or a metal plate and pasting it can be applied. The affixing conditions vary depending on the thickness and material of the substrate bonding tape and the thickness and material of the sheet-like substrate, and thus cannot be specified in general, but the temperature is 60 to 250 ° C. and the pressure is 0.1 to 0.6 MPa. Good. The pasting time is preferably the time until the thermosetting adhesive layer is cured, and is preferably 1 second to 5 minutes. In addition, after pasting in a short time, another heating step may be provided for thermosetting the substrate bonding tape.

  As a process for forming a circuit from a long substrate in which a plurality of sheet-like substrates are connected by the substrate bonding tape of the present invention, laser drilling, drilling, desmearing, plating, polishing, pickling, and application of dry film photoresist are performed. Application, liquid resist application, pattern exposure, alkali development, etching, resist peeling, solder resist application, symbol mark printing application, lamination, coverlay film application, and the like. All processes may be manufactured continuously in a roll-to-roll process, but may be divided into several processes and manufactured by a roll-to-roll process. .

  The sheet-like substrate according to the present invention is a circuit-forming substrate, for example, a printed circuit board or a lead frame substrate. If it is a printed circuit board, it will be classified into a flexible circuit board and a rigid circuit board, and polyester and polyimide are usually used as an insulating material for a flexible circuit board. The thickness of the insulating layer of the flexible substrate is about 13 to 125 μm, and copper foil or stainless steel of about 12 to 35 μm is provided on both sides or one side thereof, and the substrate bonding tape of the present invention is very flexible. Are preferably used. Also, if it is a rigid substrate, the necessary number of insulating substrates dipped in epoxy resin or phenolic resin on a paper base material or glass base material are stacked, and metal foil is placed on one or both sides, and heated and pressed to laminate The thing which was done is mentioned. In addition, a multilayer shield plate produced by laminating a prepreg, a metal foil, etc. after the inner layer wiring pattern is processed, and a multilayer plate having through holes and via holes are also included. The thickness is about 60 μm to 3.2 mm, and the material and thickness are selected according to the final use form as a printed circuit board. These printed circuit boards include, for example, “Printed Circuit Technology Handbook-Second Edition” (edited by the Printed Circuit Society of Japan, published by Nikkan Kogyo Shimbun) and “Multilayer Printed Circuit Handbook” (JA Scarlet, edited by Co., Ltd.). What is described in Modern Chemical Co., Ltd.) can be used.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to this Example.

Example 1
An epoxy resin coating solution shown in Table 1 was applied to 18 μm copper foil (manufactured by Nikko Materials Co., Ltd.), and methyl ethyl ketone was dried to prepare a substrate bonding tape having a thermosetting adhesive layer thickness of 7 μm. As shown in FIG. 5, a 50 mm × 100 mm double-sided copper foil thickness of 12 μm and a polyimide base material thickness of 25 μm are adjacent to each other with a 50 mm side, and a substrate bonding tape having a width of 15 mm and a length of 50 mm is obtained at 180 ° C. A heated roll was pressed against and attached for 3 minutes, and then the tensile strength of the portion connected with the substrate bonding tape was measured. The results are shown in Table 2. Tensile strength was measured using a desktop material testing machine STA-1150 manufactured by ORIENTEC, with a speed of 10 mm / sec and a junction temperature of 25 ° C. The cut portion of the substrate bonding tape was the support portion.

Separately, a large number of through holes were formed in a sheet-like substrate (300 mm × 500 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm). Next, as shown in FIG. 3, the substrate bonding tape having a width of 20 mm and a length of 300 mm was attached by pressing a hot roll heated to 180 ° C. for 3 minutes so that the sides of 300 mm were adjacent to each other. The connection was repeated to connect 50 sheet-like substrates. The substrate bonding tape was affixed only on one side as shown in FIG. The obtained long substrate was wound around a metal core to produce a roll-shaped long substrate. Next, the following steps were performed using a roll-to-roll circuit forming apparatus. Electroless plating of copper (trade name: Melplate CU-5100, manufactured by Meltex Co., Ltd.) and electroplating (25 ° C., sulfuric acid-copper sulfate aqueous solution) are applied to the long substrate, and the inside of the through hole and A copper layer was formed on the surface. Next, a dry film photoresist was laminated, and exposure was performed using a mask film. After peeling off the dry film photoresist support film, alkali development (25 ° C., 1 mass% sodium carbonate aqueous solution) was performed to form a resist pattern. Next, an etching process was performed with a ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² ). Next, the resist was stripped with a 3% by mass aqueous sodium hydroxide solution (50 ° C., spray pressure: 3.0 kg / cm ² ). In all the processes, the substrate bonding tape was not cut or peeled, and the substrate jam was not observed.

(Example 2)
A polyimide film (thickness: 50 μm, trade name: Kapton, manufactured by Toray DuPont Co., Ltd.) is coated with the epoxy resin coating solution shown in Table 1, dried with methyl ethyl ketone, and a thermosetting adhesive layer having a thickness of 7 μm A joining tape was produced. As shown in FIG. 5, 50 mm sides of two sheet-like substrates (50 mm × 100 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm) are adjacent to each other, and a substrate bonding tape 15 mm wide and 50 mm long is 180 ° C. A heated roll was pressed against and attached for 3 minutes, and the tensile strength was measured. The cut portion of the substrate bonding tape was the support portion.

Separately, copper electroless plating (trade name: Melplate CU-5100, manufactured by Meltex Co., Ltd.) and electroplating (25) on a sheet-like substrate (300 mm × 500 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm) C., sulfuric acid-copper sulfate aqueous solution). Next, as shown in FIG. 3, the substrate bonding tape having a width of 20 mm and a length of 300 mm was attached by pressing a hot roll heated to 180 ° C. for 3 minutes so that the sides of 300 mm were adjacent to each other. The connection was repeated to connect 50 sheet-like substrates. The substrate bonding tape was affixed only on one side as shown in FIG. The obtained long substrate was wound around a core to produce a roll-shaped long substrate. The following steps were performed using a roll-to-roll circuit forming apparatus. A dry film photoresist was laminated on the long substrate, and exposure was performed using a mask film. After peeling off the dry film photoresist support film, alkali development (25 ° C., 1 mass% sodium carbonate aqueous solution) was performed to form a resist pattern. Next, an etching process was performed with a ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² ). Next, the resist was stripped with a 3% by mass aqueous sodium hydroxide solution (50 ° C., spray pressure: 3.0 kg / cm ² ). No cutting or peeling of the substrate bonding tape was observed in any process, and no substrate jam was observed.

(Example 3)
A polyethylene naphthalate film (thickness 25 μm, trade name: Q51 (manufactured by Teijin DuPont)) is coated with the epoxy resin coating solution shown in Table 1, and methyl ethyl ketone is dried to make the thermosetting adhesive layer have a thickness of 7 μm. As shown in Fig. 5, 50mm sides of two sheet-like substrates (50mm x 100mm, double-sided copper foil thickness 12µm, polyimide base material thickness 25µm) are placed next to each other, 15mm wide and 50mm long The substrate bonding tape was affixed by applying a hot roll heated to 180 ° C. for 3 minutes, and the tensile strength was measured and shown in Table 2. The cut portion of the substrate bonding tape was the support portion.

Separately, copper electroless plating (trade name: Melplate CU-5100, manufactured by Meltex Co., Ltd.) and electroplating (25) on a sheet-like substrate (300 mm × 500 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm) C., sulfuric acid-copper sulfate aqueous solution). Next, as shown in FIG. 3, the substrate bonding tape having a width of 20 mm and a length of 300 mm was attached by pressing a hot roll heated to 180 ° C. for 3 minutes so that the sides of 300 mm were adjacent to each other. The connection was repeated to connect 50 sheet-like substrates. The substrate bonding tape was affixed only on one side as shown in FIG. The obtained long substrate was wound around a core to produce a roll-shaped long substrate. The following steps were performed using a roll-to-roll circuit forming apparatus. A dry film photoresist was laminated on the long substrate, and exposure was performed using a mask film. After peeling off the dry film photoresist support film, alkali development (25 ° C., 1 mass% sodium carbonate aqueous solution) was performed to form a resist pattern. Next, an etching process was performed with a ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² ). Next, the resist was stripped with a 3% by mass aqueous sodium hydroxide solution (50 ° C., spray pressure: 3.0 kg / cm ² ). No cutting or peeling of the substrate bonding tape was observed in any process, and no substrate jam was observed.

Example 4
A substrate in which a polyethylene terephthalate film (thickness: 100 μm, trade name: Lumirror S10, manufactured by Toray Industries, Inc.) is coated with the epoxy resin coating solution shown in Table 1 and methyl ethyl ketone is dried to form a thermosetting adhesive layer having a thickness of 7 μm. A joining tape was produced. As shown in FIG. 5, a 50 mm × 100 mm double-sided copper foil thickness of 12 μm and a polyimide base material thickness of 25 μm are adjacent to each other with a 50 mm side, and a substrate bonding tape having a width of 15 mm and a length of 50 mm is 150 ° C. A heated roll was pressed against and attached for 3 minutes, and the tensile strength was measured. The cut portion of the substrate bonding tape was the support portion.

Separately, copper electroless plating (trade name: Melplate CU-5100, manufactured by Meltex Co., Ltd.) and electroplating (25) on a sheet-like substrate (300 mm × 500 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm) C., sulfuric acid-copper sulfate aqueous solution). Next, as shown in FIG. 3, the substrate bonding tape having a width of 20 mm and a length of 300 mm was attached by pressing a hot roll heated to 150 ° C. for 3 minutes so that the sides of 300 mm were adjacent to each other. The connection was repeated to connect 50 sheet-like substrates. The substrate bonding tape was affixed only on one side as shown in FIG. The obtained long substrate was wound around a core to produce a roll-shaped long substrate. The following steps were performed using a roll-to-roll circuit forming apparatus. A dry film photoresist was laminated on the long substrate, and exposure was performed using a mask film. After peeling off the dry film photoresist support film, alkali development (25 ° C., 1 mass% sodium carbonate aqueous solution) was performed to form a resist pattern. Next, an etching process was performed with a ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² ). Next, the resist was stripped with a 3% by mass aqueous sodium hydroxide solution (50 ° C., spray pressure: 3.0 kg / cm ² ). No cutting or peeling of the substrate bonding tape was observed in any process, and no substrate jam was observed.

(Example 5)
An acrylic urethane resin coating solution described in Table 3 was applied to 18 μm copper foil (manufactured by Nikko Materials Co., Ltd.), and methyl ethyl ketone was dried to produce a substrate bonding tape having a thermosetting adhesive layer thickness of 7 μm. As shown in FIG. 5, 50 mm sides of two sheet-like substrates (50 mm × 100 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm) are adjacent to each other, and a substrate bonding tape 15 mm wide and 50 mm long is 150 ° C. The heated roll was pressed against and attached for 10 minutes, and the tensile strength of the portion connected with the substrate bonding tape was measured. The results are shown in Table 2. Compared to the substrate bonding tape of Example 1 in which the thermosetting adhesive layer contains an epoxy resin, the tensile strength of Example 5 was low. The cut portion of the substrate bonding tape was the support portion.

Separately, a large number of through holes were formed in a sheet-like substrate (300 mm × 500 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm). Next, as shown in FIG. 3, the substrate bonding tape having a width of 20 mm and a length of 300 mm was attached by pressing a hot roll heated to 150 ° C. for 10 minutes so that the sides of 300 mm were adjacent to each other. The connection was repeated to connect 50 sheet-like substrates. The substrate bonding tape was affixed only on one side as shown in FIG. The obtained long substrate was wound around a metal core to produce a roll-shaped long substrate. Next, the following steps were performed using a roll-to-roll circuit forming apparatus. Electroless plating of copper (trade name: Melplate CU-5100, manufactured by Meltex Co., Ltd.) and electroplating (25 ° C., sulfuric acid-copper sulfate aqueous solution) are applied to the long substrate, and the inside of the through hole and A copper layer was formed on the surface. Next, a dry film photoresist was laminated, and exposure was performed using a mask film. After peeling off the dry film photoresist support film, alkali development (25 ° C., 1 mass% sodium carbonate aqueous solution) was performed to form a resist pattern. Next, an etching process was performed with a ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² ). Next, the resist was stripped with a 3% by mass aqueous sodium hydroxide solution (50 ° C., spray pressure: 3.0 kg / cm ² ). In all the processes, the substrate bonding tape was not cut or peeled, and the substrate jam was not observed.

(Comparative Example 1)
A polyimide adhesive tape (polyimide substrate thickness 50 μm, manufactured by Sumitomo 3M Limited) using a silicone adhesive for the adhesive layer is used, and as shown in FIG. 5, two sheet-like substrates (50 mm × 100 mm, both sides) A 50 mm side of a copper foil thickness of 12 μm and a polyimide base material thickness of 25 μm was placed next to each other, a hot roll heated to 150 ° C. was pressed for 10 minutes and attached, and the tensile strength of the portion connected with the substrate bonding tape was measured. As shown in Table 2, it was confirmed that the tensile strength was lower than that of the substrate bonding tape obtained in the example. Further, when a tension was applied during the measurement of the tensile strength, the adhesive layer and the surface of the sheet-like substrate slipped, and the substrate bonding tape was peeled off without the support being cut.

Separately, copper electroless plating (trade name: Melplate CU-5100, manufactured by Meltex Co., Ltd.) and electroplating (25) on a sheet-like substrate (300 mm × 500 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm) C., sulfuric acid-copper sulfate aqueous solution). Next, as shown in FIG. 3, the polyimide adhesive tape having a width of 20 mm and a length of 300 mm was attached so that the sides of 300 mm were adjacent to each other. The connection was repeated to connect 50 sheet-like substrates. The substrate bonding tape was affixed only on one side as shown in FIG. The obtained long substrate was wound around a core to produce a roll-shaped long substrate. The following steps were performed using a roll-to-roll circuit forming apparatus. A dry film photoresist was laminated on the long substrate, and exposure was performed using a mask film. After peeling off the dry film photoresist support film, alkali development (25 ° C., 1 mass% sodium carbonate aqueous solution) was performed to form a resist pattern. Next, an etching process was performed with a ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² ). Next, the resist was stripped with a 3% by mass aqueous sodium hydroxide solution (50 ° C., spray pressure: 3.0 kg / cm ² ). In the process, the polyimide adhesive tape was cut, and the substrate was jammed.

(Comparative Example 2)
Using a copper foil adhesive tape (copper foil thickness 35 μm, manufactured by Teraoka Seisakusho Co., Ltd.) using an acrylic adhesive for the adhesive layer, as shown in FIG. 5, two sheet-like substrates (50 mm × 100 mm, both sides) A 50 mm side of a copper foil thickness of 12 μm and a polyimide base material thickness of 25 μm was placed next to each other, a hot roll heated to 150 ° C. was pressed for 10 minutes and attached, and the tensile strength of the portion connected with the substrate bonding tape was measured. As shown in Table 2, it was confirmed that the tensile strength was lower than that of the substrate bonding tape of the example. When tension was applied during the measurement of the tensile strength, the adhesive layer and the surface of the sheet-like substrate slipped, and the substrate bonding tape was peeled off without the support being cut.

Separately, a large number of through holes were formed in a sheet-like substrate (300 mm × 500 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm). Next, as shown in FIG. 3, the copper foil adhesive tape having a width of 20 mm and a length of 300 mm was attached so that the sides of 300 mm were adjacent to each other. The connection was repeated to connect 50 sheet-like substrates. The copper foil adhesive tape was affixed only on one side as shown in FIG. The obtained long substrate was wound around a metal core to produce a roll-shaped long substrate. The following steps were performed using a roll-to-roll circuit forming apparatus. Electroless plating of copper (trade name: Melplate CU-5100, manufactured by Meltex Co., Ltd.) and electroplating (25 ° C., sulfuric acid-copper sulfate aqueous solution) were performed on the long substrate. Next, a dry film photoresist was laminated, and exposure was performed using a mask film. After peeling off the dry film photoresist support film, alkali development (25 ° C., 1 mass% sodium carbonate aqueous solution) was performed to form a resist pattern. Next, an etching process was performed with a ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² ). Next, the resist was stripped with a 3% by mass aqueous sodium hydroxide solution (50 ° C., spray pressure: 3.0 kg / cm ² ). In the process, cutting of the copper foil adhesive tape was observed, and jamming of the substrate occurred.

(Comparative Example 3)
Using a mending tape (support: acetate film, manufactured by Sumitomo 3M Co., Ltd.) that uses an acrylic adhesive instead of a thermosetting adhesive layer resin as the adhesive, two sheets are used as shown in FIG. Side of 50mm × 100mm, double-sided copper foil thickness 12μm, polyimide base material thickness 25μm side by side, a hot roll heated to 150 ° C. was pressed for 10 minutes and pasted, and connected by substrate bonding tape The tensile strength of was measured. As shown in Table 2, it was confirmed that the tensile strength was lower than that of the substrate bonding tape of the example. The cut portion of the substrate bonding tape was the support portion.

Separately, copper electroless plating (trade name: Melplate CU-5100, manufactured by Meltex Co., Ltd.) and electroplating (25) on a sheet-like substrate (300 mm × 500 mm, double-sided copper foil thickness 12 μm, polyimide base material thickness 25 μm) C., sulfuric acid-copper sulfate aqueous solution). Next, as shown in FIG. 3, the above-mentioned mending tape having a width of 20 mm and a length of 300 mm was attached so that the sides of 300 mm were adjacent to each other. The connection was repeated to connect 50 sheet-like substrates. The mending tape was affixed only on one side as shown in FIG. The obtained long substrate was wound around a core to produce a roll-shaped long substrate. The following steps were performed using a roll-to-roll circuit forming apparatus. A dry film photoresist was laminated on the long substrate, and exposure was performed using a mask film. After peeling off the mylar film, alkali development (25 ° C., 1 mass% sodium carbonate aqueous solution) was performed to form a resist pattern. Next, an etching process was performed with a ferric chloride solution (40 ° C., spray pressure: 3.0 kg / cm ² ). Next, the resist was stripped with a 3% by mass aqueous sodium hydroxide solution (50 ° C., spray pressure: 3.0 kg / cm ² ). In the process, cutting of the mending tape was observed, and jamming of the substrate occurred.

  INDUSTRIAL APPLICABILITY The present invention can be used in the field of connecting thin sheet substrates such as circuit boards, lead frames, and optical waveguides and processing them as long substrates.

Sectional drawing of the elongate board | substrate affixed with the board | substrate joining tape of this invention. Sectional drawing of the elongate board | substrate affixed with the board | substrate joining tape of this invention. The top view of the elongate board | substrate affixed with the board | substrate joining tape of this invention. The top view of the elongate board | substrate affixed with the board | substrate joining tape of this invention. Schematic which showed the connection method and tensile direction of a sheet-like board | substrate and board | substrate joining tape at the time of measuring the tensile strength of a board | substrate joining tape.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate joining tape 2 Sheet-like board | substrate 3 Support body 4 Thermosetting adhesion layer

Claims (5)

  A substrate bonding tape for use in a method of performing a circuit forming process by connecting a plurality of sheet-like substrates to form a long substrate, wherein the thermosetting adhesive layer is laminated on a support.   The substrate bonding tape according to claim 1, wherein the support is a copper foil.   The substrate bonding tape according to claim 1, wherein the support is polyimide.   The substrate bonding tape according to claim 1, wherein the support is polyethylene naphthalate.   The substrate bonding tape according to claim 1, wherein the thermosetting adhesive layer contains an epoxy resin.

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