JP2009226557A - Punching die and manufacturing method for film carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a punching die unit capable of lessening a punched gap of opening sections arranged on both ends of a film tape base material and a manufacturing method for a film carrier tape using the punching die unit. <P>SOLUTION: The punching die unit has an opening section punching area A and a guide hole punching area B and is provided with a front guide pin between the guide hole punching area B and the opening section punching area A and a back guide pin at the back of the opening section punching area A. The film tape base material is positioned using the guide pin at the front and back of the opening section punching area A, and the opening section is accurately positioned and then the opening section is drilled. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a film carrier tape having a punching process, and more specifically to an apparatus for improving the punching accuracy in the punching process and a film tape processing method.

With the development of the electronics industry, electronic components packaged with semiconductor chips such as ICs (integrated circuits) and LSIs (large scale integrated circuits) are increasing, while electronic devices are becoming smaller and lighter, more functional, more reliable, and lower. There is a demand for pricing.
As an electronic component mounting method for realizing such a demand, for example, a BGA (Ball Grid Array) is used in which minute solder balls arranged in a matrix are formed on an electronic component, and these solder balls are connected to an external wiring board. ) Method is widespread. Among the packaging materials for electronic components using the BGA method, there are materials using tape, such as TAB (Tape Automated Bonding) tape, T-BGA (Tape Ball Grid Array) tape, CSP (Chip Size Package) tape, ASIC ( Application Specific Integrated Circuit (Tape) (hereinafter simply referred to as “film carrier tape”) is increasing.

  On the other hand, a CSP in which the size of the electronic component package itself is reduced to the size of a semiconductor chip is also being used. In this CSP, a film carrier tape called a tape type CSP is used to change the size of the package itself to a semiconductor chip. A package having the same connection method as the BGA method has appeared.

A film carrier tape for mounting a semiconductor chip is a two-layer substrate in which a conductive metal foil is directly provided on the surface of an insulating film such as a polyimide film, or a conductive metal foil on the surface of the insulating film via an adhesive layer. The three-layer substrate provided is manufactured as a material.
Specifically, openings are formed by punching at predetermined intervals on both edges and the center of the film tape substrate, and then a photosensitive resin is applied onto the conductive metal foil. Is exposed and developed using a mask having a desired pattern to form a desired etching mask, the conductive metal foil exposed from the etching mask is etched, and then the etching mask is removed to remove the conductive metal foil from the conductive metal foil. A wiring pattern is formed, and then Au or Sn plating is performed to electrically connect the formed wiring pattern and the bump electrode formed on the semiconductor chip, and further, a terminal (inner lead) connected to the semiconductor chip It is manufactured by applying a solder resist on the wiring pattern, leaving a portion and a terminal (outer lead) portion for connection to the outside.

  The openings on both edges of the film tape substrate provided by the punching process described above are used as sprocket holes for transporting the film carrier tape, and at the time of the above-described wiring pattern formation or solder resist application. It is used as a positioning guide hole for positioning and when mounting a semiconductor chip. That is, out of the openings formed in the film tape substrate, an opening at a predetermined position is used as a guide hole, which is detected by a guide pin or an image recognition device and used as a position reference, The position for solder resist coating, semiconductor chip mounting, etc. is determined. To form a high-quality film carrier tape, an opening such as a sprocket hole or solder ball connection hole is formed on the film tape base material with an accurate dimension without any deviation to a preset position. There must be.

In such a film tape substrate, for example, necessary openings such as a sprocket hole for conveyance and a hole for connecting a solder ball are perforated by punching using a mold apparatus.
The function of the punching die apparatus will be described. An upper die integrally provided with a punch or a punch and a positioning pin, a lower die having a die hole corresponding to the punch and the like, and the lower die A pair of guide plates fixedly installed on the mold constitutes a film tape substrate conveyance path.
Further, a stripper plate for pressing the film tape substrate is disposed on the lower surface of the upper mold, and after fixing the film tape substrate by pressing the surface of the film tape substrate with the stripper plate from above, A predetermined opening is formed in the film tape substrate by the tip of the punch (see, for example, Patent Document 1).
In addition, a technique is disclosed that uses a progressive punching device that can perform the punching process as described above with high efficiency and high accuracy without causing a positional shift or a defect (see, for example, Patent Document 2).

In the progressive punching apparatus, in order to form the opening at an accurate position, the positioning of the opening of the film tape substrate becomes more important. In the apparatus disclosed in Patent Document 2, a positioning pin is installed for the purpose of positioning the opening, and positioning is performed using a sprocket hole.
As an example, FIG. 3 is a diagram for explaining the outline and function of the configuration of a conventional film tape substrate punching die apparatus. 3A is a side view, and FIG. 3B is a plan view of a punched film tape substrate.
The punching die apparatus 20 shown in FIG. 3 corresponds to an upper die 21 integrally provided with a punching punch 22 and a guide pin 23 for positioning, and a die hole 24 and a guide pin 23 corresponding to the punching punch 22. The film tape substrate 1 is conveyed in the direction of the arrow between the lower mold 26 having the guide pin holes 25 formed therein. (The guard plate is omitted.)

In this punching die apparatus 20 shown in FIG. 3A, an opening 31 is provided in the film tape substrate 1 in a punching area A having a plurality of punching punches 22, and the film tape base provided with the opening 31 is provided. It is generally performed that the material 1 is fed in the right direction of the drawing indicated by an arrow and supported by the guide pin 23 by using a part of the punched opening 31 as a guide hole. The guide pins 23 are inserted into three openings 31 ′ (six edges) of a plurality (10 edges in the drawing) of the openings 31 punched in the punching area A. It is said that the gap accuracy of the guide holes in the traveling direction is particularly maintained by the mold device for supporting (positioning) rearward of the opening punching area.
JP 2004-207374 A JP 2003-127093 A

However, this method only supports the film tape substrate by placing guide pins behind the punching area (the area where the punching process has been completed), and in front of the punching area (the area before the punching process is applied). In this case, the film tape substrate is not supported and is in a free state. FIG. 4 shows a state in which a deviation occurs when drilling is performed using the apparatus of FIG.
As shown in FIG. 4, the film tape base material may be displaced in the rotational direction called θ (theta) displacement with the guide pin 23 behind the opening punching area A as a fulcrum.
The present invention was made for the purpose of reducing such a shift in the rotational direction, and a punching die apparatus capable of reducing punching shifts in openings provided at both edges of a film tape substrate, and the punching thereof It aims at providing the manufacturing method of the film carrier tape for semiconductor chip mounting which used the metal mold | die apparatus.

  In order to solve the above problems, the punching die apparatus of the present invention has a guide hole punching area B and an opening punching area A, and a front guide pin is provided between the guide hole punching area B and the opening punching area A. A punching die apparatus provided with a rear guide pin behind the opening punching area A, and a front guide pin is provided in front of the opening punching area A when drilling in the opening punching area A. A guide hole was used, and a rear guide pin was positioned behind the opening punching area A to position and perforate the film tape substrate using a sprocket hole.

That is, the punching die device for a film tape substrate of the present invention has a guide hole punching area, an opening punching area, a front guide pin and a rear guide pin, and the upper mold has a guide hole punching area in the guide hole punching area. A guide hole punching punch is disposed, and a sprocket hole punching punch is disposed in the opening punching area. A front guide pin is disposed between the guide hole punching area and the opening punching area, and the opening punching is performed. A rear guide pin is disposed behind the area, and the film tape base is composed of the above-described guide hole punch, sprocket hole punch, and a lower die having holes corresponding to the front guide pin and the rear guide pin. It was set as the punching die apparatus for materials.
With the apparatus configured as described above, when the sprocket hole is drilled, the front guide pin uses the guide hole in front of the opening punching area A, and the rear guide pin is behind the opening punching area A. Since the film tape base material can be positioned and punched using the holes, the opening portion is not displaced and the opening can be formed accurately.

In the punching die device of the present invention, the guide hole punching punch has a circular cross section, the sprocket hole punching punch has a square cross section, and the cross sectional area of the guide hole punching punch is larger than the cross sectional area of the sprocket hole punching punch. It is preferable to make it small.
Further, it is preferable that both the guide hole punch and the sprocket hole punch are composed of a plurality, and the pitch interval thereof is an integral multiple of the pitch interval of the sprocket holes to be drilled.
That is, by punching the drilled guide hole into the sprocket hole in the opening punching area, it is possible to obtain a film tape base material without the guide hole and having the sprocket hole drilled when it is unloaded from the punching die device. .

Furthermore, in the punching die apparatus of the present invention, the guide hole punch, the front guide pin, the sprocket hole punch and the rear guide pin are all parallel to each other on the edges of the film tape substrate to be processed in this order. It is preferable to arrange them facing each other.
This is because the openings are efficiently formed on both edges of the film tape substrate.

The film carrier tape manufacturing method of the present invention is a method of forming openings at both edges of a film tape substrate using a punching die device, wherein the film tape substrate is a punching die device as described above The guide hole is punched into the guide hole punching area, and then transferred to the place where the front guide pin is provided. Next, the film tape substrate is punched into the opening punching area of the punching die apparatus described above The film carrier tape is manufactured by positioning the film tape substrate using guide pins before and after the opening punching area to determine the punching position and punching the sprocket hole over the guide hole. The method was adopted.
In the method for producing a film carrier tape of the present invention, a guide hole and a sprocket hole can be simultaneously drilled while intermittently feeding the film tape base material every span.
This is because drilling can be performed with high efficiency.

  In the present invention, since the film tape base material is supported (positioned) before and after the opening punching area, the position of the opening is determined with higher accuracy than a general mold for supporting the opening punching area behind. It is possible to punch while maintaining. For this reason, the positional accuracy in each subsequent process can be improved, and the occurrence of defective products due to positional shift can be prevented.

The schematic mechanism and function of the punching die apparatus used in the present invention are illustrated in FIG. FIG. 1A is a side view, and FIG. 1B is a plan view of a punched film tape substrate.
A punching die device 10 shown in FIG. 1 includes a sprocket hole punching punch 4, a guide hole punching punch 5, an upper die 2 integrally provided with positioning front guide pins 6 and rear guide pins 7. A lower die 3 having a die hole 51 and a guide hole 52 corresponding to the guide hole punching punch 5 and the front guide pin 6, and a die hole 41 and a guide hole 42 corresponding to the sprocket hole punching punch 4 and the rear guide pin 7. The film tape base material conveyance path 11 is comprised between and the film tape base material 1 is comprised so that it may be conveyed.
In the punching die apparatus 10 of the present invention, the film tape substrate 1 is positioned using the guide pins 6 and 7 before and after the opening punching area A to accurately determine the position of the opening. .

As shown in FIG. 1 (b), when the punching die apparatus 10 of the present invention is used, the guide hole 9 is first drilled using the guide hole punching punch 5, and then two before the opening punching area A. Positioning by the front guide pin 6 is performed, and then the sprocket hole punching punch 4 is disposed in the opening punching area A, and the continuous sprocket hole 8 is formed by overlapping the guide hole 9 by the continuous punching. Positioning by two or more rear guide pins 7 behind the part punching area A is performed. In this example, 20 sprocket holes 8 are drilled so as to overlap the four guide holes 9.
FIG. 1B shows an example in which openings serving as sprocket holes 8 are formed on both edge portions of the film tape substrate 1. In the center portion of the film tape substrate 1, a hole for connecting a solder ball, An opening such as a device hole for attaching an IC chip can be formed at the same time.

From here, detailed structure including the manufacturing process of a film carrier tape is demonstrated.
First, the guide hole 9 is punched into the film tape substrate 1 in the guide hole punching area B. A plurality of guide holes 9 are formed on both edges of the film tape substrate 1 according to the pitch interval of the sprocket holes of the film tape substrate transfer device. The pitch of the guide holes 9 may be set at a ratio of one for every three to five sprocket holes in consideration of the length of the subsequent opening punching area A.
The size of the guide hole 9 is set to be smaller than the size of the sprocket hole 8 so as not to be displaced as much as possible during positioning. The size of the guide hole 9 is preferably, for example, a circle having a diameter of 0.6 to 1.2 mm, and two or more are preferably installed.
Therefore, it is preferable that the guide hole punching punch 5 for punching the guide hole provided in the guide hole punching area B is a circular punch having a diameter of 0.6 to 1.2 mm.

  A front guide pin 6 is provided between the guide hole punching area B and the opening punching area A. The front guide pins 6 are provided so as to coincide with the pitch of the plurality of guide holes 9. It is preferable that the front guide pin 6 also has a circular cross section with a diameter of 0.6 to 1.2 mm, which is the same as that of the guide hole 9, and two or more pins with sharp tips are installed.

Next, the film tape substrate 1 in which the guide hole 9 is formed is sent to the opening punching area A, and the opening serving as the sprocket hole 8 is perforated.
At this time, the film tape substrate 1 is positioned by the front guide pins 6 and the rear guide pins 7 before and after the opening punching area A. By positioning the film tape substrate 1 before and after the opening punching area A, it is possible to prevent the occurrence of a shift called θ (theta) shift during the opening punching process.

In the opening punching area A, a plurality of sprocket hole punching punches 4 are arranged. The sprocket hole punch 4 is overlapped with the position of the guide hole 9 opened previously.
For this purpose, a plurality of guide hole punches and sprocket hole punches are both arranged so that the pitch interval is an integral multiple of the pitch interval of the sprocket holes to be drilled.
The sprocket hole 8 drilled here is larger than the previously formed guide hole 9 and has a square shape of, for example, 1.42 mm, and is formed in accordance with the sprocket pitch of a film tape substrate transfer device (not shown).
Accordingly, the sprocket hole punch 4 is preferably a 1.42 mm square punch.

When punching in the opening punching area A, the film tape substrate 1 is positioned by the front guide pins 6 and the rear guide pins 7.
The rear guide pins 7 are squares of 1.405 to 1.425 mm square with a sharp tip, and have two or more. The rear guide hole 61 corresponding to the rear guide pin 7 uses one or two sprocket holes 8 formed earlier.
In the punching die apparatus of the present invention, the guide hole punch, the front guide pin, the sprocket hole punch and the rear guide pin face each other in parallel so as to come to both edges of the film tape substrate to be processed in this order. Then, sprocket holes are continuously drilled on both edges of the film tape substrate.

  The film tape base material 1 is intermittently transferred one span at a time by a transfer device from the leftmost guide hole punching punch 5 shown in FIG. 1 to the front guide pin 6 positioned using the punched guide hole 9 as one span. While forming the opening.

  In the present invention, the punching position accuracy of the opening is made higher, and the punching process with this die is not particularly limited, and there is no limit on the number of rotations and the stroke as long as continuous processing is performed. However, as a general manufacturing process, the rotation speed is preferably 50 spm or more, and the stroke is desirably deeper than the minimum depth at which punching can be completely performed by the thickness of the punched material.

  As the film tape base material to be punched by the present invention, a film carrier tape for 3-layer TAB (polyimide film thickness: 50 to 125 μm, adhesive thickness: 12 μm / protective film: 25 μm thickness) or COF 2-layer copper polyimide film (polyimide film Thickness 30-50 μm / copper thickness 8-15 μm / reinforcement film thickness 50 μm when necessary).

Next, the present invention will be described in more detail with reference to Examples and Comparative Examples of the present invention, but the present invention is not limited thereto.
A continuous punching process of a copper polyimide film substrate was performed in which a reinforcing backing film was bonded to the back surface of a polyimide film on a film carrier tape on which a semiconductor chip was mounted. The material of the polyimide film was Kapton EN, the copper thickness was 8 μm, the thickness of the polyimide film was 38 μm, the thickness of the reinforcing backing film was 50 μm, and the thickness of the adhesive layer was 8 μm.

  The number of rotations of the press machine at this time was 75 spm, and the stroke was set so that the punch blade edge entered the 0.3 mm die hole from the complete punching point. The punching die apparatus used was that shown in FIG. There are three guide pins 7 provided behind the opening punching area A so that every other sprocket hole 8 is spaced on one edge, and the size of the opening of the sprocket hole 8 is 1.42 mm square. It was a thing.

  Further, in the guide hole punching area B provided in front of the opening punching area A, the sprocket hole 8 has positions corresponding to the fourth and ninth openings from the left of the ten openings on one edge. A circular guide hole 9 having a diameter of 0.8 mm was provided, and two sets (four in total) of guide pins 6 having a diameter of 0.79 mm were provided between the opening punching area A and the guide hole punching area B.

  When the θ shift dimension measurement in the rotation direction of the film carrier tape obtained by continuous pressing was performed in this way, the number of processing exceeding 20,000 m (about 350,000 spans) with respect to the reference value 0 ± 0.030 mm. There was no out-of-standard occurrence. The measurement results are shown in FIG. In FIG. 2, the horizontal axis represents the θ shift width, and the vertical axis represents the appearance frequency. It can be seen from FIG. 2 that the θ deviation of the film carrier tape obtained in this example is very small and there is little variation.

(Comparative example)
Continuous press working was performed in the same manner as in Example 1 except that the front guide pin and the guide hole punching punch of the punching die apparatus used in Example 1 were not operated.
FIG. 5 shows the θ shift dimension in the rotation direction of the film carrier tape thus continuously pressed. In FIG. 5, the horizontal axis represents the θ shift width, and the vertical axis represents the appearance frequency.
As shown in FIG. 5, the θ deviation greatly spreads to the left and right, and in the comparative example, the variation in the width of the θ deviation is large.

It is a figure explaining the structure outline and function of the punching die apparatus of this invention, Comprising: (a) is a side view, (b) shows the top view of the film tape after a process. It is a figure which shows (theta) deviation of the rotation direction in a present Example. It is a figure explaining the structure outline and function of the conventional punching die apparatus, Comprising: (a) shows a side view, (b) shows the top view of the film tape after a process. It is a figure explaining the generation | occurrence | production state of the θ shift | offset | difference of a rotation direction at the time of processing a film tape using the conventional die apparatus for punching. It is a figure which shows (theta) deviation of the rotation direction in a comparative example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Film tape base material 2, 21 Upper die 3, 26 Lower die 4 Sprocket hole punching punch 5 Guide hole punching punch 6 Front guide pin 7 Back guide pin 8 Sprocket hole 9 Guide hole 10, 20 Stamping die apparatus 11, 27 Film Tape Substrate Transport Path 22 Punch Punch 23 Guide Pin 24 Die Hole 25 Guide Pin Hole 31 Opening 41 Die Hole 42 Guide Hole 51 Die Hole 52 Guide Hole 61 Rear Guide Hole A Opening Punching Area B Guide Hole Punching Area

Claims (6)

  A punching die apparatus for a film tape substrate, which has a guide hole punching area, an opening punching area, a front guide pin and a rear guide pin, and a guide hole punching in the guide hole punching area in the upper die A punch is disposed, and a sprocket hole punching punch is disposed in the opening punching area, a front guide pin is disposed between the guide hole punching area and the opening punching area, and the rear of the opening punching area. A rear guide pin is disposed on the lower die, and the lower mold is provided with holes corresponding to the respective guide hole punches, sprocket hole punches, and front guide pins and rear guide pins. Punching die device for film tape substrate.   2. The guide hole punching punch has a circular cross-sectional shape, the sprocket hole punching punch has a square cross-sectional shape, and the cross-sectional area of the guide hole punching punch is smaller than the cross-sectional area of the sprocket hole punching punch. The punching die apparatus for film tape base materials as described in 2.   The guide hole punching punch and the sprocket hole punching punch are both formed in plural numbers, and the pitch interval is an integral multiple of the pitch interval of the sprocket hole to be drilled. Punching die device for film tape substrate.     The guide hole punch, front guide pin, sprocket hole punch and rear guide pin are all arranged in parallel and facing each other so as to come to both edges of the film tape substrate to be processed in this order. The punching die apparatus for film tape base materials of any one of Claim 1 to 3   It is a method of forming an opening part in the both edges of a film tape base material using a punching die apparatus, Comprising: A film tape base material of the punching die apparatus of any one of the said Claim 1 to 4 After transferring to the guide hole punching area and punching the guide hole, the film tape substrate is transferred to the opening punching area of the punching die device according to any one of claims 1 to 4, A method of manufacturing a film carrier tape, comprising: positioning a film tape substrate using guide pins before and after an opening punching area to determine a punching position; and punching a sprocket hole over the guide hole .   6. The method for producing a film carrier tape according to claim 5, wherein the guide hole and the sprocket hole are simultaneously drilled while the film tape base material is intermittently forwardly transferred every one span.