JP2009224875A - Data communication equipment - Google Patents

Data communication equipment Download PDF

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JP2009224875A
JP2009224875A JP2008064476A JP2008064476A JP2009224875A JP 2009224875 A JP2009224875 A JP 2009224875A JP 2008064476 A JP2008064476 A JP 2008064476A JP 2008064476 A JP2008064476 A JP 2008064476A JP 2009224875 A JP2009224875 A JP 2009224875A
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communication
electrode
circuit
electric field
data communication
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JP4562781B2 (en
Inventor
Ryusuke Kawano
龍介 川野
Katsuyuki Ochiai
克幸 落合
Naoshi Minoya
直志 美濃谷
Mitsuru Shinagawa
満 品川
Yuichi Kado
門　　勇一
Toshiaki Asahi
利彰 朝日
Seiji Yabe
誠司 矢部
Ryoji Kikuchi
亮二 菊地
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NTT Electronics Corp
Nippon Telegraph and Telephone Corp
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NTT Electronics Corp
Nippon Telegraph and Telephone Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent a deterioration in a reception performance due to noise radiated from a communication circuit. <P>SOLUTION: A shield plate 46 is disposed between the communication circuit 44 and a communication electrode 42. Thus, influence of the noise radiated from the communication circuit 44 on the communication electrode 42 is suppressed, and the deterioration in the reception performance is prevented. Also, a solder surface of a circuit board 15 where the communication circuit 14 is mounted is formed into a solid ground pattern, and a solder surface side is disposed facing the communication electrode 12. Thus, since the solid ground pattern achieves the role of a shield, the need of the shield plate is eliminated, and the data communication equipment 1 is made compact and made light in weight. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、電界伝達媒体に電界を誘起してデータ通信を行うデータ通信装置に関する。   The present invention relates to a data communication apparatus that performs data communication by inducing an electric field in an electric field transmission medium.

人体などの電界伝達媒体に電界を誘起し、この誘起された電界を用いてデータ通信を行うデータ通信装置が提案されている（例えば特許文献１参照、非特許文献１参照）。   There has been proposed a data communication device that induces an electric field in an electric field transmission medium such as a human body and performs data communication using the induced electric field (see, for example, Patent Document 1 and Non-Patent Document 1).

図４は、従来のデータ通信装置の構成を示す断面図である。同図に示すデータ通信装置２００は、利用者がポケットやカバンなどに収納して使用することができる、例えば名刺ケースくらいの大きさである。データ通信装置２００は、筐体２０１、通信電極２０２、グランド電極２０３を有し、筐体２０１の内部に回路基板２０５に実装された通信回路２０４を備えている。グランド電極２０３は回路基板２０５のグランドに接続される。   FIG. 4 is a cross-sectional view showing a configuration of a conventional data communication apparatus. The data communication apparatus 200 shown in the figure is about the size of a business card case, for example, which a user can store and use in a pocket or a bag. The data communication apparatus 200 includes a housing 201, a communication electrode 202, and a ground electrode 203, and includes a communication circuit 204 mounted on a circuit board 205 inside the housing 201. The ground electrode 203 is connected to the ground of the circuit board 205.

通信電極２０２は、電界伝達媒体である電界伝達媒体３００に電界を誘起して信号を送信するとともに、電界伝達媒体３００に誘起された電界を検出して信号を受信する。
特開２００４−１２８５３６号公報 "RedTacton"、［ｏｎｌｉｎｅ］、日本電信電話株式会社、［平成２０年１月１０日検索］、インターネット〈ＵＲＬ：http://www.redtacton.com〉 The communication electrode 202 induces an electric field in the electric field transmission medium 300 that is an electric field transmission medium and transmits a signal, and detects the electric field induced in the electric field transmission medium 300 and receives the signal.
JP 2004-128536 A "RedTacton", [online], Nippon Telegraph and Telephone Corporation, [Search January 10, 2008], Internet <URL: http://www.redtacton.com>

しかしながら、データ通信装置２００が受信を行う際に、通信回路２０４から放射されるノイズが受信信号に重畳してしまい、受信性能低下の原因となっていた。   However, when the data communication apparatus 200 performs reception, noise radiated from the communication circuit 204 is superimposed on the reception signal, causing a decrease in reception performance.

本発明は、上記に鑑みてなされたものであり、その課題とするところは、通信回路から放射されるノイズが受信信号に重畳することを抑制し、受信性能の低下を防ぐことにある。   The present invention has been made in view of the above, and it is an object of the present invention to suppress noise radiated from a communication circuit from being superimposed on a reception signal and prevent deterioration in reception performance.

本発明に係るデータ通信装置は、送信すべき情報に基づく電界を電界伝達媒体に誘起し、当該電界を用いて情報の送受信を行うデータ通信装置であって、通信回路と、通信回路の入出力端子に接続された電界通信用の通信電極と、通信回路の基準電位に接続されたグランド電極と、通信回路と通信電極との間に配置されて基準電位に接続されたシールド板と、を有することを特徴とする。   A data communication apparatus according to the present invention is a data communication apparatus that induces an electric field based on information to be transmitted in an electric field transmission medium and transmits / receives information using the electric field, the communication circuit, and an input / output of the communication circuit A communication electrode for electric field communication connected to the terminal; a ground electrode connected to the reference potential of the communication circuit; and a shield plate disposed between the communication circuit and the communication electrode and connected to the reference potential. It is characterized by that.

本発明にあっては、通信回路と通信電極との間にシールド板を配置することにより、通信回路から放射されるノイズが通信電極に与える影響を抑制するので、受信性能の低下を防ぐことができる。   In the present invention, by arranging a shield plate between the communication circuit and the communication electrode, the influence of noise radiated from the communication circuit on the communication electrode is suppressed. it can.

上記データ通信装置において、シールド板は、通信回路を実装した回路基板のベタグランドパターンであることを特徴とする。   In the data communication apparatus, the shield plate is a solid ground pattern of a circuit board on which a communication circuit is mounted.

本発明にあっては、回路基板のベタグランドパターンをシールド板として利用することにより、新たにシールド板を配置することなく、通信回路から放射されるノイズが通信電極に与える影響を抑制できるので、データ通信装置を小型化・軽量化することが可能となる。   In the present invention, by using the solid ground pattern of the circuit board as a shield plate, it is possible to suppress the influence of noise radiated from the communication circuit on the communication electrode without newly arranging a shield plate. The data communication device can be reduced in size and weight.

本発明によれば、通信回路から放射されるノイズが受信信号に重畳することを抑制し、受信性能の低下を防ぐことができる。   ADVANTAGE OF THE INVENTION According to this invention, it can suppress that the noise radiated | emitted from a communication circuit is superimposed on a received signal, and can prevent the fall of receiving performance.

以下、本発明の実施の形態について図面を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

図１は、本実施の形態におけるデータ通信装置の構成を示す断面図である。同図に示すデータ通信装置１は、通信回路１４などを収納した筐体１１の表面に通信電極１２とグランド電極１３とを対向して配置した構成である。通信回路１４は、回路基板１５上に片面実装される。回路基板１５の半田面（通信回路１４を実装していない面）は、ベタグランドパターンとして、配線パターンも配置しない。回路基板１５は、半田面を通信電極１２に向け、通信回路１４（実装面）をグランド電極１３に向けて配置する。回路基板１５は通信電極１２から数ｍｍ以上離して配置する。通信電極１２は通信回路１４の入出力端子に接続され、グランド電極１３は回路基板１５の基準電位に接続される。   FIG. 1 is a cross-sectional view showing the configuration of the data communication apparatus according to the present embodiment. The data communication apparatus 1 shown in FIG. 1 has a configuration in which a communication electrode 12 and a ground electrode 13 are arranged to face each other on the surface of a housing 11 that houses a communication circuit 14 and the like. The communication circuit 14 is mounted on the circuit board 15 on one side. The solder surface (the surface on which the communication circuit 14 is not mounted) of the circuit board 15 is not arranged as a solid ground pattern. The circuit board 15 is disposed with the solder surface facing the communication electrode 12 and the communication circuit 14 (mounting surface) facing the ground electrode 13. The circuit board 15 is arranged several mm or more away from the communication electrode 12. The communication electrode 12 is connected to the input / output terminal of the communication circuit 14, and the ground electrode 13 is connected to the reference potential of the circuit board 15.

図１に示すデータ通信装置１は、半田面がグランドパターンで覆われているため、通信回路１４が発するノイズが半田面側に放射されない。半田面を通信電極１２側にして、通信回路１４と通信電極１２との間に半田面が存在することで、通信回路１４から放射されるノイズが通信電極１２に与える影響を抑制し、受信性能の低下を防ぐことが可能となる。   In the data communication apparatus 1 shown in FIG. 1, since the solder surface is covered with a ground pattern, noise generated by the communication circuit 14 is not radiated to the solder surface side. With the solder surface facing the communication electrode 12 and the presence of the solder surface between the communication circuit 14 and the communication electrode 12, the influence of noise radiated from the communication circuit 14 on the communication electrode 12 is suppressed, and reception performance is improved. Can be prevented.

次に、本実施の形態における別のデータ通信装置について説明する。図２は、本実施の形態における別のデータ通信装置の構成を示す断面図である。同図に示すデータ通信装置４は、通信回路４４などを収納した筐体４１の表面に通信電極４２とグランド電極４３とを対向して配置した構成である。筐体４１内のグランド電極４３側に回路基板４５を固定し、その回路基板４５上に通信回路４４を実装する。シールド板４６を通信回路４４と通信電極４２との間に配置する。シールド板４６は通信電極４２から数ｍｍ以上離して配置する。通信電極４２は通信回路４４の入出力端子に接続され、グランド電極４３およびシールド板４６は回路基板４５の基準電位に接続される。   Next, another data communication apparatus in the present embodiment will be described. FIG. 2 is a cross-sectional view showing a configuration of another data communication apparatus according to the present embodiment. The data communication device 4 shown in the figure has a configuration in which a communication electrode 42 and a ground electrode 43 are arranged to face each other on the surface of a housing 41 that houses a communication circuit 44 and the like. The circuit board 45 is fixed to the ground electrode 43 side in the housing 41, and the communication circuit 44 is mounted on the circuit board 45. The shield plate 46 is disposed between the communication circuit 44 and the communication electrode 42. The shield plate 46 is arranged several mm or more away from the communication electrode 42. The communication electrode 42 is connected to the input / output terminal of the communication circuit 44, and the ground electrode 43 and the shield plate 46 are connected to the reference potential of the circuit board 45.

図２に示すデータ通信装置４は、回路基板４５の半田面をシールドとして利用しない、あるいは利用できない場合の構成である。通信回路４４と通信電極４２との間にシールド板４６を配置することで、通信回路４４から放射されるノイズが通信電極４２に与える影響が抑制され、受信性能の低下を防ぐことが可能となる。   The data communication device 4 shown in FIG. 2 has a configuration in which the solder surface of the circuit board 45 is not used or cannot be used as a shield. By disposing the shield plate 46 between the communication circuit 44 and the communication electrode 42, the influence of noise radiated from the communication circuit 44 on the communication electrode 42 is suppressed, and it becomes possible to prevent a decrease in reception performance. .

次に、本実施の形態におけるデータ通信装置１が人体などの電界伝達媒体３００に電界を誘起させて通信を行う電界通信について説明する。図３は、電界通信のしくみを説明するための模式図である。同図は、人体などの電界伝達媒体３００を介して左のデータ通信装置１Ｘから右のデータ通信装置１Ｙへデータを送信するときの電界の様子を示している。   Next, electric field communication in which the data communication apparatus 1 according to the present embodiment performs communication by inducing an electric field in the electric field transmission medium 300 such as a human body will be described. FIG. 3 is a schematic diagram for explaining the mechanism of electric field communication. This figure shows the state of the electric field when data is transmitted from the left data communication device 1X to the right data communication device 1Y via the electric field transmission medium 300 such as a human body.

まず、左のデータ通信装置１Ｘは、右のデータ通信装置１Ｙに送信すべきデータに基づく電圧を自身の通信電極１２Ｘとグランド電極１３Ｘとの間に印加する。すると、データ通信装置１Ｘの通信電極１２Ｘ、電界伝達媒体３００、データ通信装置１Ｙの通信電極１２Ｙ、グランド電極１３Ｙ、大地、データ通信装置１Ｘのグランド電極１３Ｘを通って、通信電極１２Ｘに戻る電界の経路が形成される。データ通信装置１Ｙは、自身の通信電極１２Ｙとグランド電極１３Ｙとの間に誘起される電界によって生じる電圧によりデータを検出する。   First, the left data communication device 1X applies a voltage based on data to be transmitted to the right data communication device 1Y between its communication electrode 12X and the ground electrode 13X. Then, the electric field returned to the communication electrode 12X through the communication electrode 12X of the data communication device 1X, the electric field transmission medium 300, the communication electrode 12Y of the data communication device 1Y, the ground electrode 13Y, the ground, and the ground electrode 13X of the data communication device 1X. A path is formed. The data communication device 1Y detects data by a voltage generated by an electric field induced between its own communication electrode 12Y and the ground electrode 13Y.

データ通信装置１Ｘ、１Ｙの通信電極１２Ｘ，１２Ｙおよびグランド電極１３Ｘ，１３Ｙは、電界通信における伝送信号の出入り口に相当する部分であるから、この部分近傍におけるノイズの混入は通信品質を劣化させることになる。   Since the communication electrodes 12X and 12Y and the ground electrodes 13X and 13Y of the data communication devices 1X and 1Y are portions corresponding to transmission / reception ports of transmission signals in electric field communication, mixing of noise in the vicinity of the portions deteriorates communication quality. Become.

したがって、本実施の形態によれば、通信回路１４を実装した回路基板１５の半田面をベタグランドパターンとして半田面側を通信電極１２に向けて配置したり、通信回路４４と通信電極４２との間にシールド板４６を配置することにより、通信回路１４，４４から放射されるノイズが通信電極１２，４２に与える影響を抑制することができ、受信性能の低下を防ぐことが可能となる。   Therefore, according to the present embodiment, the solder surface of the circuit board 15 on which the communication circuit 14 is mounted is arranged as a solid ground pattern with the solder surface side facing the communication electrode 12, or the communication circuit 44 and the communication electrode 42 By arranging the shield plate 46 between them, it is possible to suppress the influence of noise radiated from the communication circuits 14 and 44 on the communication electrodes 12 and 42 and to prevent the reception performance from being lowered.

一実施の形態におけるデータ通信装置の構成を示す断面図である。It is sectional drawing which shows the structure of the data communication apparatus in one embodiment. 一実施の形態における別のデータ通信装置の構成を示す断面図である。It is sectional drawing which shows the structure of another data communication apparatus in one Embodiment. 電界通信のしくみを説明するための模式図である。It is a schematic diagram for demonstrating the structure of electric field communication. 従来のデータ通信装置の構成を示す断面図である。It is sectional drawing which shows the structure of the conventional data communication apparatus.

符号の説明Explanation of symbols

１，４…データ通信装置
１１，４１…筐体
１２，４２…通信電極
１３，４３…グランド電極
１４，４４…通信回路
１５，４５…回路基板
４６…シールド板
３００…電界伝達媒体
１Ｘ，１Ｙ…データ通信装置
１２Ｘ，１２Ｙ…通信電極
１３Ｘ，１３Ｙ…グランド電極
２００…データ通信装置
２０１…筐体
２０２…通信電極
２０３…グランド電極
２０４…通信回路
２０５…回路基板 DESCRIPTION OF SYMBOLS 1,4 ... Data communication apparatus 11, 41 ... Case 12, 42 ... Communication electrode 13, 43 ... Ground electrode 14, 44 ... Communication circuit 15, 45 ... Circuit board 46 ... Shield plate 300 ... Electric field transmission medium 1X, 1Y ... Data communication device 12X, 12Y ... Communication electrode 13X, 13Y ... Ground electrode 200 ... Data communication device 201 ... Housing 202 ... Communication electrode 203 ... Ground electrode 204 ... Communication circuit 205 ... Circuit board

Claims (2)

送信すべき情報に基づく電界を電界伝達媒体に誘起し、当該電界を用いて情報の送受信を行うデータ通信装置であって、
通信回路と、
前記通信回路の入出力端子に接続された電界通信用の通信電極と、
前記通信回路の基準電位に接続されたグランド電極と、
前記通信回路と前記通信電極との間に配置されて前記基準電位に接続されたシールド板と、
を有することを特徴とするデータ通信装置。 A data communication device that induces an electric field based on information to be transmitted in an electric field transmission medium and transmits and receives information using the electric field,
A communication circuit;
A communication electrode for electric field communication connected to an input / output terminal of the communication circuit;
A ground electrode connected to a reference potential of the communication circuit;
A shield plate disposed between the communication circuit and the communication electrode and connected to the reference potential;
A data communication apparatus comprising: 前記シールド板は、前記通信回路を実装した回路基板のベタグランドパターンであることを特徴とする請求項１記載のデータ通信装置。   2. The data communication apparatus according to claim 1, wherein the shield plate is a solid ground pattern of a circuit board on which the communication circuit is mounted.
JP2008064476A 2008-03-13 2008-03-13 Data communication device Expired - Fee Related JP4562781B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009232284A (en) * 2008-03-24 2009-10-08 Nippon Telegr & Teleph Corp <Ntt> Electric field communication device
JP2014060628A (en) * 2012-09-18 2014-04-03 Toshiba Corp Communication device
CN109661785A (en) * 2016-09-13 2019-04-19 索尼半导体解决方案公司 Communication device and communication system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000224083A (en) * 1999-01-20 2000-08-11 Internatl Business Mach Corp <Ibm> Personal area network(pan) communication system
JP2008311960A (en) * 2007-06-14 2008-12-25 Sony Corp Communication system and communication device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000224083A (en) * 1999-01-20 2000-08-11 Internatl Business Mach Corp <Ibm> Personal area network(pan) communication system
JP2008311960A (en) * 2007-06-14 2008-12-25 Sony Corp Communication system and communication device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009232284A (en) * 2008-03-24 2009-10-08 Nippon Telegr & Teleph Corp <Ntt> Electric field communication device
JP4616366B2 (en) * 2008-03-24 2011-01-19 日本電信電話株式会社 Electric field communication device
JP2014060628A (en) * 2012-09-18 2014-04-03 Toshiba Corp Communication device
CN109661785A (en) * 2016-09-13 2019-04-19 索尼半导体解决方案公司 Communication device and communication system
US10958359B2 (en) 2016-09-13 2021-03-23 Sony Semiconductor Solutions Corporation Communication apparatus and communication system

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