JP2009221360A - Anisotropically conductive resin composition, anisotropically conductive member, mounting method therefor, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an anisotropically conductive resin composition can refinement of a connection pitch, and to provide an anisotropically conductive member employing the same. <P>SOLUTION: The anisotropically conductive resin composition contains a rod-shaped and hollow conductive magnetic powder and a binder containing a photopolymerizable composition as a main component, wherein a shrinkage between time points before and after irradiation of the photopolymerizable composition with an active beam is 7% or less when calculated from the following formula 1: shrinkage ratio (%)=100×(dp-dM)/dp (wherein dp represents the density of the photopolymerizable composition after the irradiation with the active beam, and dM represents the density of the photopolymerizable composition before the irradiation with the active beam). <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an anisotropic conductive resin composition. Moreover, it is related with the anisotropic conductive member comprised with an anisotropic conductive resin composition, and its mounting method. Furthermore, it is related with an electronic device provided with the said anisotropically conductive member.

  In recent years, miniaturization and high performance of electronic parts have progressed, and anisotropic conductive films in which conductive particles are dispersed in a binder resin have been frequently used for various fine circuit connections. In recent years, as electronic components are rapidly becoming lighter, thinner, smaller, and higher in performance, COG (Chip on Glass) technology that directly connects a bare chip on a glass substrate, or COB (Chip that directly connects on a printed circuit board) on Boad) technology, etc., using an anisotropically conductive member is becoming increasingly popular.

  An anisotropic conductive film contains a predetermined amount of conductive fine particles in a binder resin, and is sandwiched between electrodes that are relatively wrinkled and subjected to thermocompression bonding (for example, 170 ° C. × 5 s, 50-150 MPa). A plurality of electrodes can be connected together.

Conventionally, studies have been vigorously made to improve the characteristics of thermo-compression-type anisotropic conductive films (for example, Patent Document 1). Conventionally, as the conductive fine particles used for the anisotropic conductive member, organic or inorganic particles coated with metal by metal fine powder, plating or the like have been used. For the purpose of improving the characteristics of anisotropic conductive members, it has been proposed to use fibers having magnetism and conductivity on the surface as conductive fine particles (Patent Documents 2 and 3). In addition, the group of the present inventors recently realized weight reduction while maintaining the conductivity and strength derived from the metal or metal alloy as the conductive fine particles contained in the binder resin, which are easy to control the orientation. The electroconductive magnetic powder which can be produced was proposed (patent documents 4-6). Patent Document 7 will be described later.
JP 2006-335926 A JP 2001-291431 A JP 2002-124318 A JP 2005-264214 A JP 2006-156196 A JP 2008-21513 A WO2005 / 033061

  With the remarkable progress of microfabrication technology, the connection pitch and connection width are rapidly increasing. For this reason, due to the heating at the time of connection, the connection part is displaced due to the elongation of various materials, the connection part is thin and the peripheral members are thermally affected by the temperature at the time of connection. Problems such as warping due to heating and disconnection of wiring have arisen. In recent years, applications and base materials using anisotropic conductive members have been diversified, and anisotropic conductive members are sometimes used for films such as COF (Chip on Film). In such a case, the problem of warping due to heating at the time of connection becomes more serious, and it is difficult to realize a fine connection pitch. Therefore, a technique that can avoid these problems is eagerly desired.

  The present invention has been made in view of the above background, and the object of the present invention is an anisotropic conductive resin composition that can cope with refinement of the connection pitch, an anisotropic conductive member using the same, and It is to provide a method for mounting an anisotropic conductive member.

An anisotropic conductive resin composition according to the present invention contains a rod-shaped and hollow conductive magnetic powder and a binder mainly composed of a photopolymerizable composition, and the active light beam of the photopolymerizable composition. The shrinkage ratio before and after irradiation is 7% or less when calculated by the following <Equation 1>.
<Equation 1> Shrinkage rate (%) = 100 × (dp−dM) / dp
In the formula, dp is the density of the photopolymerizable composition after irradiation with actinic rays by an underwater substitution method (JIS K723-1982), and dM is the photopolymerizability before irradiation with actinic rays by a specific gravity bottle method (JIS K7112). The density of the composition.

  According to the anisotropic conductive resin composition of the present invention, since the photopolymerizable composition is a main component, it is possible to form an anisotropic conductive member by actinic ray irradiation. For this reason, the problem which arises by heating can be solved compared with the conventional thermosetting type anisotropically conductive resin composition. In other words, due to the heating at the time of connection, the connection part is displaced due to the elongation of various materials, the connection part is thin and the peripheral members are thermally affected by the temperature at the time of connection. It is possible to solve the problems of warping due to heating, disconnection of wiring, and the problem of breakage with time due to residual stress strain. Moreover, it is excellent in dimensional stability by making the shrinkage rate before and behind irradiation of actinic light of a photopolymerizable composition into the above thing. Furthermore, by using the conductive magnetic powder, it is possible to improve the orientation and the dispersibility. As a result, it is possible to provide an anisotropic conductive resin composition that can cope with a fine connection pitch.

  The method for mounting an anisotropic conductive member according to the first aspect of the present invention includes forming a coating film of the anisotropic conductive resin composition of the above aspect on a support, and the conductive magnetic powder is in a predetermined direction. A magnetic field is applied so as to be oriented, and the coating is semi-cured by irradiating actinic rays so as to maintain the orientation state of the conductive magnetic powder, and the semi-cured coating is applied to the support. The film is peeled from the electrode, sandwiched between the electrodes and pressure-bonded, and the coating film is irradiated with actinic rays.

  The anisotropic conductive member mounting method according to the second aspect of the present invention is a coating film of an anisotropic conductive resin composition containing conductive magnetic powder and a binder mainly composed of a photopolymerizable composition. On the support, and a magnetic field is applied so that the conductive magnetic powder is uniaxially oriented in the in-plane direction of the coating film, and the active state is maintained so that the orientation state of the conductive magnetic powder is maintained. The coating film is semi-cured by irradiating light, and the semi-cured coating film is peeled off from the support, sandwiched between electrodes, and pressure-bonded, and the coating film is irradiated with actinic rays. .

  The anisotropic conductive member mounting method according to the second aspect of the present invention is the anisotropic conductive material in which the conductive magnetic powder is substantially horizontal and uniaxially oriented with respect to the opposed electrode surface. A sex member can be obtained. Thereby, application development to needs and uses different from the conventional one is possible.

  The anisotropic conductive member according to the first aspect of the present invention is an anisotropic conductive member constituted by the anisotropic conductive resin composition of the above aspect, and the conductive magnetic powder is relatively wrinkled. It is oriented substantially perpendicular to the electrode surface and in the major axis direction of the electrode.

  An anisotropic conductive member according to a second aspect of the present invention is an anisotropic conductive member constituted by the anisotropic conductive resin composition of the above aspect, wherein the conductive magnetic powder is relatively wrinkled. Oriented substantially horizontally with respect to the electrode surface and in the major axis direction of the electrode.

  The electronic apparatus according to the present invention is one in which electronic parts are joined using the anisotropic conductive member of the above aspect.

  ADVANTAGE OF THE INVENTION According to this invention, it has the outstanding effect that the anisotropic conductive resin composition which can respond to refinement | miniaturization of a connection pitch, and an anisotropic conductive member can be provided.

  Hereinafter, an example of an embodiment to which the present invention is applied will be described. It goes without saying that other embodiments may also belong to the category of the present invention as long as they match the gist of the present invention. Also, the size of each member in the figure is for convenience of explanation and is different from the actual size.

  The electronic apparatus according to the first embodiment is, for example, a semiconductor device, a printed circuit board, a liquid crystal display panel, a plasma display panel, an electroluminescence panel, or a field emission display panel, and the anisotropic conductive member according to the first embodiment. The electronic parts are joined using the. In the first embodiment, a liquid crystal display panel will be described as an example of an electronic device.

  FIG. 1 is a schematic side view of a main part of the liquid crystal display panel according to the first embodiment. As shown in FIG. 1, the liquid crystal display panel 100 includes a thin film transistor (TFT) array substrate 1, a counter substrate 2, a polarizing plate 3, a sealing material 4, a liquid crystal 5, a driver IC 6, an anisotropic conductive film 10, and the like.

  As shown in FIG. 1, in the liquid crystal display panel 100, a liquid crystal 5 is sealed in a space surrounded by a TFT array substrate 1 and a counter substrate 2 that are arranged to face each other, and a sealing material 4 that bonds the two substrates together. . As the TFT array substrate 1 and the counter substrate 2, for example, an insulating substrate such as light transmissive glass or polycarbonate is used. A driver IC 6 is directly mounted near the end of the main surface of the TFT array substrate 1. In the vicinity of the driver IC 6, a wiring board (not shown) such as an FPC (Flexible Printed Circuit) is disposed as an external wiring.

  The driver IC 6 is directly mounted on the TFT array substrate 1 via the anisotropic conductive film 10 by COG (Chip On Glass) technology. The anisotropic conductive film 10 adheres and fixes the TFT array substrate 1 and the driver IC 6, and at the same time electrically connects the plurality of electrodes formed on the TFT array substrate 1 and the plurality of electrodes formed on the driver IC 6. The role of connection. The driver IC 6 may be connected to the TFT array substrate 1 by TCP (Tape Carrier Package) instead of the COG technique. Also in this case, the TFT array substrate 1 and the TCP can be connected and fixed using an anisotropic conductive film. Various external signals are supplied to the driver IC 6 via external wiring, and the driver IC 6 sends external control signals to the scanning signal lines and display signal lines of the TFT array substrate 1 via the anisotropic conductive film 10. Supply.

  In FIG. 2, the typical perspective view of the anisotropic conductive film 10 which concerns on this Embodiment 1 is shown. The anisotropic conductive film 10 includes a conductive magnetic powder 11 and a photocurable resin 12. The conductive magnetic powder 11 plays a role of electrically connecting electrodes facing each other through the anisotropic conductive film 10. On the other hand, the photocurable resin 12 plays a role as a medium for maintaining the orientation of the conductive magnetic powder 11 and developing the anisotropic conductivity of the conductive magnetic powder 11. In addition, it functions as a spacer that holds the gap between the opposing electrodes.

The conductive magnetic powder 11 has a rod shape as shown in FIG. 2 and has conductivity and magnetism. The conductive magnetic powder 11 according to the first embodiment is uniaxially oriented in a direction horizontal to the surface of the anisotropic conductive film 10. The direction of this uniaxial orientation is arranged so as to coincide with the major axis direction of the electrodes (the electrode of the TFT array substrate 1 and the electrode of the driver IC 6) that are opposed to each other. Thereby, anisotropic conductivity can be expressed. The photocurable resin 12 is obtained by irradiating the photopolymerizable composition with an actinic ray. The volume resistivity of the photocurable resin is preferably 10 ⁹ Ωcm or more. The upper limit is not particularly limited, but is usually 10 ²⁰ Ωcm or less, and more generally 10 ¹⁵ Ωcm or less.

  Next, a method for manufacturing the anisotropic conductive film 10 according to the first embodiment will be described with reference to schematic manufacturing process diagrams of FIGS. First, an anisotropic conductive resin composition containing at least a binder mainly composed of a photopolymerizable composition serving as a precursor of the photocurable resin 12 and the conductive magnetic powder 11 is prepared. The photopolymerizable composition can be prepared by blending or mixing at least a photopolymerizable compound and a photopolymerization initiator. The photopolymerizable compound is a photopolymerizable monomer, oligomer, and / or polymer. The anisotropic conductive resin composition can be prepared by blending or mixing at least the conductive magnetic powder 11 with this photopolymerizable composition. The anisotropic conductive resin composition may be prepared by dissolving (or suspending) in a diluent described below (in particular, a diluent containing a non-reactive diluent). The blending method (mixing method) is not particularly limited, and a conventional method can be used.

  The viscosity of the anisotropic conductive resin composition may vary depending on the application and coating method, but is usually preferably 100 to 10,000 mPa · s, more preferably 1000 to 4000 mPa · s. . When the viscosity is less than 100, the conductive magnetic powder and the binder may be separated depending on the specific gravity. When the viscosity exceeds 10,000, the orientation of the conductive magnetic powder due to application of a magnetic field may be suppressed. .

  Immediately before forming the coating film of the anisotropic conductive composition, it is filtered using a filter in order to remove dust mixed in the anisotropic conductive resin composition and aggregates of the conductive magnetic powder 11. It is preferable to carry out. Thereby, it can prevent that the aggregate of the electroconductive magnetic powder 11 arises in the anisotropic conductive film 10, or dust etc. mix.

  After the filtration treatment, a coating film 20 of the anisotropic conductive resin composition is formed on the support (base material) 21 on the support 21. As the support body 21, a film, a sheet, a plate-like body, or the like can be used. Here, a sheet-like support 21 is used. As the coating method, a known method can be used. For example, spin coating method, roller coating method, bar coating method, dip coating method, gravure coating method, curtain coating method, die coating method, spray coating method, doctor coating method, kneader coating method, flow coating method, screen printing method, cast Law. In particular, a micro gravure method among a bar coat method, a die coat method, or a gravure coat method can be suitably used. The micro gravure method is a coating method in which a roll is rotated in the transport direction, and has a feature that a film thickness can be easily adjusted according to the number of rotations and a uniform film thickness can be easily obtained. As a gravure roll diameter, about 2-5 cm can be used suitably from a viewpoint which implements replacement | exchange of a roll simply.

  After forming the anisotropic conductive resin coating film 20, it may be dried by a conventional method, and may be dried by heating as necessary. The heating temperature in drying can be appropriately selected according to the type of polymerization initiator and diluent (non-reactive diluent), and is usually about 40 to 250 ° C. The drying treatment may be performed in an inert gas atmosphere such as nitrogen or argon or in the air, or may be performed under normal pressure or reduced pressure.

  The thickness of the anisotropic conductive resin coating film 20 is not particularly limited, but is preferably 1 to 50 μm, and more preferably 2 to 25 μm. If the thickness is less than 1 μm, the orientation of the conductive magnetic powder may be suppressed, or a self-supporting anisotropic conductive film may not be obtained. On the other hand, if the thickness of the coating film is 50 μm or more, the orientation may be disturbed during mounting by pressure bonding.

  Next, the support 21 on which the coating film 20 is formed is conveyed into a magnetic field. A known method can be used as a method of forming the magnetic field. In the first embodiment, the magnetic field is generated by disposing the first magnet 22 and the second magnet 23 so as to face each other at close positions. In the first embodiment, the N pole of the first magnet 22 and the N pole of the second magnet 23 are disposed so as to face each other. Of course, the S poles may be arranged to face each other. Since the first magnet 22 and the second magnet 23 are disposed so that the same poles face each other, at the end of the magnet, the magnetic field lines in a direction substantially horizontal to the facing surface of the magnet are at the center of the magnet. In the region, lines of magnetic force in a direction substantially perpendicular to the opposing surface of the magnet are generated.

  FIG. 4A is a schematic diagram for explaining the direction of the lines of magnetic force when the support 21 on which the coating film 20 is formed is conveyed in a magnetic field, and FIG. The schematic diagram for demonstrating the orientation direction of the conductive magnetic powder 11 is shown. The code | symbol 24 in Fig.4 (a) shows a magnetic force line. Since the conductive magnetic powder 11 is dispersed in the uncured photopolymerizable composition, when transported in a magnetic field, the long axis of the conductive magnetic powder is parallel to the direction of the magnetic lines of force from a random orientation state. Is in an oriented state.

  As shown in FIG. 4 (a), the first magnet 22 and the second magnet 23 have magnetic lines of force in a direction substantially horizontal with respect to the opposing surface of the magnet in the central region of the magnet. Generates magnetic lines of force in a direction substantially perpendicular to the opposing surface of the magnet. Therefore, as shown in FIG. 4 (a), the conductive magnetic powder 11 of the coating film 20 facing the left end region of the magnet in the drawing surrounded by the dotted line A1 is as shown in FIG. 4 (b). The conductive magnetic powders 11 of the coating film 20 arranged in a substantially horizontal direction and opposed to the magnet central region surrounded by the one-dot chain line A2 are arranged in a substantially vertical direction with respect to the magnet surface. Further, the conductive magnetic powders 11 of the coating film 20 facing the magnet right end region in the figure surrounded by the two-dot chain line A3 are arranged in the substantially horizontal direction again.

  The conductive magnetic powder 11 immediately after passing through the first magnet 22 and the second magnet 23 is affected by the magnetic field lines in the substantially horizontal direction at the end of the magnet, in a substantially horizontal direction with respect to the magnet surface. And it arranges in the conveyance direction. Actinic rays are irradiated at a timing at which this state is maintained (during or after passing between the magnetic poles) (see FIG. 3), and photopolymerization is performed so that the orientation of the conductive magnetic powder 11 is maintained. The composition is semi-cured. Thereby, the semi-hardened film | membrane 30 which consists of an anisotropic conductive resin composition is obtained.

Examples of the light irradiation source include a low-pressure mercury lamp, a high-pressure mercury lamp, an ultrahigh-pressure mercury lamp, a hydrogen lamp, a deuterium lamp, a fluorescent lamp, a halogen lamp, an excimer laser, a nitrogen laser, a dye laser, and a helium-cadmium laser. . Irradiation energy amount, applications varies depending on the film thickness of the coating film, usually, 0.1~10000mJ / cm ² or so, preferably 0.5~2000mJ / cm ² approximately. The light irradiation intensity is usually about 1 to 1000 mW / cm ² . The wavelength of light irradiation is in the range of 200 to 1100 nm, and an ultraviolet ray of 250 to 400 nm can be preferably used. In the case where an active ray having a visible light region exceeding 400 nm is used, it is necessary to perform it in a dark room in a semi-curing process of the photopolymerizable composition or a mounting process after semi-curing. The light irradiation may be performed in an atmosphere of an inert gas such as nitrogen or argon, or in the air, and may be performed under normal pressure, increased pressure, or reduced pressure.

  In order to satisfactorily obtain the uniaxial orientation of the conductive magnetic powder 11, the magnitude of the magnetic field, the conveyance speed of the support 21, and the irradiation timing of the actinic rays are important factors. If the conveying speed is too fast or the irradiation timing of the actinic ray is too late, the degree of orientation of the conductive magnetic powder 11 is lowered. The irradiation timing of actinic rays can be set not to pass between magnets but to pass between magnets. “Semi-curing the photopolymerizable composition” means that the orientation of the conductive magnetic powder 11 can be maintained, the support 21 to be described later can be peeled off, and the conductivity in the press-bonding step to be described later can be maintained. Any magnetic powder 11 may be used as long as it can expose the semi-cured film 30.

  Next, the support 21 on which the semi-cured film 30 is laminated is cut into a desired size. The semi-cured film 30 is brought into contact with the surface of the TFT array substrate 1 on which the TFT side electrode 31 is formed at the position where the driver IC 6 near the end of the TFT array substrate 1 is mounted on the cut support 21. (See FIG. 5A). At this time, the TFT side electrode 31 is placed so that the major axis direction of the electrode coincides with the uniaxial orientation direction of the conductive magnetic powder 11 of the semi-cured film 30. Thereafter, the support 21 is peeled off. In addition, the support body 21 selects what can be favorably peeled from the semi-cured film 30 in this peeling step. For example, a peelable film coated with a silicone resin or a fluororesin can be suitably used.

,
After the support 21 is peeled off, the driver IC 6 is mounted on the semi-cured film 30 (see FIG. 5B). At this time, the driver-side electrode 32 of the driver IC 6 and the TFT-side electrode 31 are disposed at a position where they face each other. Next, as shown in FIG. 5C, the TFT array substrate 1 and the driver IC 6 are pressure-bonded. As a result, the conductive magnetic powder 11 embedded in the semi-cured film 30 touches the TFT-side electrode 31 or the driver-side electrode 32 with the semi-cured film 30 scattered. Further, the dispersed conductive magnetic powder 11 can be compressed in the vertical direction and brought into contact with each other. Thereby, the conductive magnetic powder 11 forms a conductive path in the film thickness direction. Then, the plurality of TFT side electrodes 31 and the driver side electrodes 32 that are opposed to each other can be collectively electrically connected via the conductive magnetic powder 11. Since the conductive magnetic powder 11 is oriented in a direction that coincides with the major axis direction of the TFT side electrode 31 and the driver side electrode 32, the conductive magnetic powder 11 does not conduct with adjacent electrodes.

  Actinic rays are irradiated from the TFT array substrate side 1 in a state where the electrodes facing each other through the conductive magnetic powder 11 are electrically connected through the compression process. Thereby, the semi-cured film 30 is further cured. Thereby, the TFT side electrode 31 formed on the TFT array substrate 1 and the driver side electrode 32 formed on the driver IC 6 are electrically connected, and the TFT array substrate 1 and the driver IC 6 are anisotropically conductive. The fixing film 10 is fixed.

  The TFT side electrode 31 is preferably a transparent conductive film such as ITO. Thereby, hardening of a photopolymerizable composition can be advanced without a difference in an electrode formation site | part and a non-electrode formation site | part. Further, instead of the transparent conductive film such as ITO, a metal film such as Al, Cu, Au or the like may be used as an electrode, and the electrode forming portion may be dual-cured. In dual curing, not only a photopolymerizable composition but also a thermal polymerization initiator and a thermal polymerizable composition are added in advance in the binder, and thermal polymerization is performed by heat in the coating film generated by the light irradiation process. It is a method of progress. Thereby, even when non-permeable electrodes, such as Al, are provided, hardening of the photopolymerizable composition of a non-transmissive part can be advanced. In particular, it can be used more effectively when the electrode pitch is narrow.

  The photocurable resin 12 in the anisotropic conductive film 10 does not necessarily need to be sufficiently cured in all regions, and the photopolymerizable composition masked by an impermeable electrode such as Al is not necessarily used. It may be in a semi-cured state. By sufficiently curing the photopolymerizable composition in the light transmission region where no electrode is disposed, the light transmission region can function as a spacer and maintain mechanical strength.

  Next, the anisotropic conductive resin composition suitably used for Embodiment 1 will be described. The anisotropic conductive resin composition according to Embodiment 1 is mainly composed of a conductive magnetic powder 11 and a binder mainly composed of a photopolymerizable composition that becomes a photocurable resin 12 by irradiation with actinic rays. And

  The conductive magnetic powder 11 has a rod shape and is provided with magnetism and conductivity. The amount of the conductive magnetic powder 11 added to the binder may vary depending on the intended use and required performance, but is usually preferably 5 to 40 parts by weight with respect to 100 parts by weight of the binder, and 8 to 30. More preferably, parts by weight are used. When the addition amount of the conductive magnetic powder 11 is less than 5 parts by weight, poor connection between the connection electrodes may occur due to the small amount of the conductive magnetic powder. In some cases, orientation due to a magnetic field is less likely to occur due to the large amount of conductive magnetic powder.

  The main component of the conductive magnetic powder 11 is preferably a metal, a metal alloy, or a metal oxide. Although it does not specifically limit as a metal, The metal (Nickel, cobalt, iron, etc.) which has magnetism is included. In addition to nickel, cobalt, and iron, gold, silver, copper, aluminum, platinum, bell, lead, zinc, titanium, chromium, manganese, zirconium, tungsten, indium, and the like can be given as suitable examples. The metal oxide of the said metal can also be mentioned as a suitable example. The said metal, a metal alloy, or a metal oxide may be used independently, or may be used in combination of 2 or more types.

  A particularly preferable metal of the conductive magnetic powder 11 is nickel which is excellent in workability and conductivity, has a small magnetization coercive force, and is inexpensive. Examples of the Ni compound include various Ni compounds such as Ni-P, Ni-B, Ni-Co, Ni-Fe, Ni-Al, Ni-Sn, and Ni-Au. Among these, Ni-P can be mentioned as a particularly preferable example. When using Ni-P, the phosphorus content in the conductive magnetic powder is preferably 2 to 15% by weight.

  The conductive magnetic powder 11 is preferably hollow. By adopting a hollow shape, it is possible to reduce the weight while maintaining the conductivity and strength derived from the metal or metal alloy. By realizing weight reduction, the conductive magnetic powder can be prevented from settling in the film, and the dispersibility can be improved. In addition, an anisotropic conductive material that is easy to control the orientation can be obtained. The hollow conductive magnetic powder can be produced, for example, by the methods described in Patent Documents 4 to 6.

The coercive force of the conductive magnetic powder 11 is preferably in the range of 1 to 500 Oe, and more preferably 10 to 300 Oe. In the range where the coercive force exceeds 1 to 500 Oe, the orientation direction of the conductive magnetic powder may become uneven when a magnetic field is applied. The saturation magnetization of the conductive magnetic powder 11 is preferably in the range of 0.1 to 55 emu / g, more preferably 5 to 30 emu / g. If the saturation magnetization is less than 0.1 emu / g, the conductive magnetic powder may not be oriented even when a magnetic field is applied. On the other hand, if it exceeds 55 emu / g, the magnetization of the conductive magnetic powder becomes too large, and the distance between the oriented powders increases, which may deteriorate the performance of the anisotropic conductive material. The volume resistivity of the conductive magnetic powder 11 is preferably 10 ⁻⁶ to 10 ² Ω · cm, and more preferably 10 ⁻⁵ to 10 ¹ Ω · cm. When the volume resistivity is less than 10 ² Ω · cm, resistance heating may occur when a voltage is applied to the anisotropic conductive material.

  The inner diameter of the conductive magnetic powder 11 is preferably in the range of 0.1 to 1 μm. In addition, the length of the conductive magnetic powder 11 is preferably 0.5 to 20 μm, and more preferably 1 to 10 μm. If the inner diameter is less than 0.1 μm, it is difficult to obtain the advantage of reducing the weight as a hollow shape. On the other hand, if it exceeds 1 μm, the strength is reduced, and the hollow shape may not be maintained when the anisotropic conductive material is produced. is there. If the length is less than 0.5 μm, the electrical connection may be uneven. If the length is more than 20 μm, the orientation moment increases, and a large applied magnetic field is required. For this reason, the amount of electric power of the electromagnet necessary for controlling the orientation of the conductive magnetic powder increases, and the cost may increase.

  The aspect ratio (the length of the conductive magnetic powder / the outer diameter of the conductive magnetic powder) of the conductive magnetic powder 11 is preferably in the range of 2 to 100, and more preferably 5 to 20. . If the aspect ratio is less than 2, it may be nearly spherical and orientation control may be difficult. On the other hand, when the aspect ratio exceeds 100, the moment of orientation increases, and orientation may become difficult in terms of energy.

  The thickness of the conductive magnetic powder 11 is preferably in the range of 10 nm to 200 nm, more preferably 20 nm to 150 nm. If the wall thickness is less than 10 nm, the strength may decrease, whereas if it exceeds 200 nm, it may be difficult to obtain the advantage of weight reduction. Moreover, there is a case where the template for making the hollow material cannot be removed.

  As described above, the photopolymerizable composition that is the main component of the binder is cured by irradiation with actinic rays to become a photocurable resin. The photopolymerizable composition contains a photopolymerizable monomer, oligomer or / and polymer as a main component. The photopolymerizable composition also contains additives such as a photopolymerization initiator. When performing the above-mentioned dual polymerization, a thermal polymerization initiator (thermal radical polymerization agent or the like) or a thermopolymerizable compound is added to the binder.

As the photopolymerizable composition, it is preferable to use a composition having a shrinkage ratio before and after irradiation with actinic rays of 7% or less when calculated by the following <Equation 1>.
<Equation 1> Shrinkage rate (%) = 100 × (dp−dM) / dp
In the formula, dp is the density of the photopolymerizable composition after irradiation with actinic rays by the underwater substitution method (JIS K7232-1982), and dM is the photopolymerizable composition before irradiation with actinic rays by the specific gravity bottle method (JIS K7112). The density is shown. The term “photopolymerizable composition after irradiation with actinic rays” as used herein refers to a photocurable resin that is actually usable in an electronic device or the like by irradiation with actinic rays.

  By using a photopolymerizable composition having a shrinkage ratio of 7% or less before and after irradiation with actinic rays, stress strain generated after photocuring can be reduced. Since the shrinkage rate is preferably as small as possible, the lower limit is not particularly limited. However, from the viewpoint of easy availability, it is preferably 0.5% or more. A more preferred range is in the range of 1-4%.

  A suitable example of the photopolymerizable composition is a composition containing a photopolymerizable compound containing a fluorene structure as a main component. Moreover, the photopolymerizable compound containing an adamantyl group can also be mentioned as a suitable example. In particular, a photopolymerizable composition containing a photopolymerizable compound containing a fluorene structure as a main component has particularly good dispersibility with the conductive magnetic powder, particularly the above-described hollow conductive magnetic powder. preferable. By adopting these structures, the shrinkage rate before and after photocuring can be reduced.

As a photopolymerizable compound having a particularly preferred fluorene structure, (meth) acrylates containing a fluorene structure represented by the following general formula (1) can be exemplified.

In the formula, R ^1a , R ^1b , R ^2a and R ^2b represent a substituent, R ^3a and R ^3b represent an alkylene group, and R ^4a and R ^4b represent a hydrogen atom or a methyl group. k1 and k2 represent an integer of 0 to 4, m1 and m2 represent an integer of 0 to 4, n1 and n2 represent 0 or an integer of 1 or more, and p1 and p2 represent an integer of 1 to 4. However, m1 + p1 and m2 + p2 are integers of 1-5. The compound of the said General formula (1) can be manufactured according to the said patent document 7.

The substituents represented by the groups R ^1a and R ^1b are not particularly limited, but are usually alkyl groups in many cases. Examples of the alkyl group include C1-6 alkyl groups such as a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, and a t-butyl group (for example, a C1-4 alkyl group, particularly a methyl group). The groups R ^1a and R ^1b may be different from each other or the same. Moreover, group R ^<1a> (or R ^<1b> ) may differ in the same benzene ring, and may be the same. Note that the bonding position (substitution position) of the group R ^1a (or R ^1b ) with respect to the benzene ring constituting the fluorene skeleton is not particularly limited. Preferred substitution numbers k1 and k2 are 0 or 1, in particular 0. The substitution numbers k1 and k2 may be different but are usually the same.

As the substituents R ^2a and R ^2b , an alkyl group (C1-20 alkyl group such as methyl group, ethyl group, propyl group, isopropyl group, butyl group, s-butyl group, t-butyl group, preferably C1-8) An alkyl group, more preferably a C1-6 alkyl group, etc., a cycloalkyl group (C5-10 cycloalkyl group such as a cyclopentyl group, a cyclohexyl group, preferably a C5-8 cycloalkyl group, more preferably a C5-6 cycloalkyl group). Etc.), aryl groups [phenyl group, alkylphenyl group (methylphenyl group (tolyl group), dimethylphenyl group (xylyl group), etc.), etc., preferably C6-10 aryl groups, preferably C6-8 aryl groups, especially phenyl groups, etc. ], An aralkyl group (C6-10 aryl-C1-4a such as benzyl group and phenethyl group) A hydrocarbon group such as a kill group); an alkoxy group (such as a C1-4 alkoxy group such as a methoxy group); a hydroxyl group; a hydroxy (poly) alkyleneoxy group (such as a hydroxy (poly) C2-4 alkyleneoxy group); an acyl Group (C1-6 acyl group such as acetyl group); alkoxycarbonyl group (C1-4 alkoxycarbonyl group such as methoxycarbonyl group); halogen atom (fluorine atom, chlorine atom etc.); nitro group; Can be mentioned.

  The hydroxyl group or hydroxy (poly) alkyleneoxy group reacts with the residue of polyhydric alcohol ((meth) acrylic acid or a derivative thereof as a raw material in the method for producing a polyfunctional (meth) acrylate described later. In many cases, the group is not.

Preferred substituents R ^2a (or R ^2b ) are an alkyl group (C 1-6 alkyl group), a cycloalkyl group (C 5-8 cycloalkyl group), an aryl group (C 6-10 aryl group), an aralkyl group (C 6-8). Aryl-C1-2 alkyl group), hydroxyl group, hydroxy (poly) alkyleneoxy group (hydroxy (poly) C2-4 alkyleneoxy group). Among these, a C1-4 alkyl group, a C1-4 alkoxy group, and a C6-8 aryl group are particularly preferable. The substituent R ^2a (or R ^2b ) may be substituted on the benzene ring alone or in combination of two or more. The groups R ^2a and R ^2b may be the same or different from each other but are usually the same. Further, the groups R2a (or R2b) may be different or the same in the same benzene ring.

The substitution position of the substituent R ^2a (or R ^2b ) is not particularly limited, and is a (meth) acryloyloxy group or a (meth) acryloyloxy (poly) alkoxy group (hereinafter referred to as a (meth) acryloyloxy group-containing group). Depending on the substitution position (which may be collectively referred to), the phenyl group can be substituted at the 2-6 position (for example, the 2-position, 5-position, 2,5-position, etc.).

  Although preferable substitution number m1 and m2 depend on the substitution number of the (meth) acryloyloxy group-containing group, it is 0 to 2, more preferably 0 to 1 (particularly 0). The substitution numbers m1 and m2 may be different but are usually the same in many cases.

Examples of the alkylene group represented by R ^3a and R ^3b include, but are not limited to, C2-4 alkylene groups (ethylene group, trimethylene group, propylene group, butane-1,2-diyl group, etc.) and the like. In particular, a C2-3 alkylene group (particularly an ethylene group or a propylene group) is preferable. R ^3a and R ^3b may be the same or different alkylene groups, but are usually the same alkylene group.

  The substitution number (addition number) n1 and n2 of the alkoxy group is the same or different and can be selected from a range of about 0 to 15, for example, 0 to 12 (for example, 1 to 12), preferably 0 to 8 (for example, 1 to 8), more preferably 0 to 6 (for example, 1 to 6), particularly about 0 to 4 (for example, 1 to 4). Moreover, the sum (n1 + n2) of n1 and n2 can be selected from the range of about 0-30, for example, 0-24 (for example, 2-24), Preferably it is 0-16 (for example, 2-12), More preferably 0 to 12 (for example, 2 to 10), particularly about 0 to 8 (for example, 2 to 8) may be used. When n1 (or n2) is 2 or more, the polyalkoxy (polyalkyleneoxy) group may be composed of the same alkoxy group, and different alkoxy groups (for example, ethoxy group and propyleneoxy group) Although they may be mixed, they are usually composed of the same alkoxy group in many cases.

  The substitution number p1 and p2 of the (meth) acryloyloxy group-containing group is preferably 1 to 2, and particularly preferably 1. The sum of p1 and p2 (p1 + p2) may be, for example, 2 to 8, preferably about 2 to 4 (particularly 2). The substitution numbers p1 and p2 may be different but are usually the same in many cases. The substitution position of the (meth) acryloyloxy group-containing group is not particularly limited, and can be selected from the 2 to 6 positions of the phenyl group substituted at the 9 position of fluorene according to the number of p1 (or p2), and p1 (or When p2) is 2, it may be, for example, 3,4-position, 3,5-position, etc. One (meth) acryloyloxy group-containing group may usually be substituted at the 4-position.

  In addition, the several (meth) acryloyloxy group containing group substituted by the same benzene ring may be the same, and may differ. For example, a plurality of (meth) acryloyloxy group-containing groups may be composed of (i) a (meth) acryloyloxy group alone with n1 = 0 (n2 = 0), and (ii) n1 = 0 (n2 = 0) and a (meth) acryloyloxy (poly) alkoxy group (such as a 2- (meth) acryloyloxyethoxy group) where n1 ≠ 0 (n2 ≠ 0) (Iii) It may be composed of the same (meth) acryloyloxy (poly) alkoxy group alone where n1 ≠ 0 (n2 ≠ 0), and (iv) n1 ≠ 0 (n2 ≠ 0) Different (meth) acryloyloxy (poly) alkoxy groups [for example, 2- (meth) acryloyloxyethoxy group and 2- (2- (meth) acryloyloxyethoxy) ethoxy group]. It may be.

  Typical polyfunctional (meth) acrylates represented by the formula (1) include, for example, 9,9-bis (di (meth) acryloyloxyphenyl) fluorenes, 9,9-bis (tri (meta) ) Acryloyloxyphenyl) fluorenes, and the corresponding (meth) acrylates of alkylene oxide (C2-4 alkylene oxide) adducts of the corresponding polyhydric alcohol [9,9-bis (di or trihydroxyphenyl) fluorenes]. Can be mentioned.

The 9,9-bis (di (meth) acryloyloxyphenyl) fluorenes include, for example, 9,9-bis (di (meth) acryloyloxyphenyl) fluorene [9,9-bis (3,4-di (meth) ) Acryloyloxyphenyl) fluorene, 9,9-bis (2,4-di (meth) acryloyloxyphenyl) fluorene, 9,9-bis (2,5-di (meth) acryloyloxyphenyl) fluorene, etc.], substitution 9,9-bis (di (meth) acryloyloxyphenyl) fluorene having a group {eg, 9,9-bis (alkyl-di (meth) acryloyloxyphenyl) fluorene [9,9-bis (3,4-di (Meth) acryloyloxy 5-methylphenyl) fluorene, 9,9-bis (3,4-di (meth) acryloyloxy 6-methyl 9,9-bis (C1-4alkyl-di (meth) acryloyloxyphenyl) fluorene, 9,9-bis (2,4-di (meth) acryloyloxy 3,6-dimethylphenyl) fluorene, such as phenyl) fluorene 9,9-bis (diC1-4alkyl-di (meth) acryloyloxyphenyl) fluorene and the like], 9,9-bis (alkoxy-di (meth) acryloyloxyphenyl) fluorene [for example, 9,9- 9,9-bis (C1-4alkoxy-di (meth) acryloyloxyphenyl) fluorene such as bis (3,4-di (meth) acryloyloxy-5-methoxyphenyl) fluorene], 9,9-bis ( Aryl-di (meth) acryloyloxyphenyl) fluorene [eg 9,9-bis (3,4-di (meth) Acryloyloxy-5-phenylphenyl) fluorene such as 9,9-bis -, and the like (C6-8 aryl di (meth) acryloyloxy phenyl) fluorene, etc.], etc.}.

  The 9,9-bis (tri (meth) acryloyloxyphenyl) fluorenes include fluorenes corresponding to the 9,9-bis (di (meth) acryloyloxyphenyl) fluorenes such as 9,9-bis ( 2,4,6- (meth) acryloyloxyphenyl) fluorene, 9,9-bis (2,4,5-tri (meth) acryloyloxyphenyl) fluorene, 9,9-bis (3,4,5-tri 9,9-bis (tri (meth) acryloyloxyphenyl) fluorene such as (meth) acryloyloxyphenyl) fluorene is included.

  Examples of the (meth) acrylate of an alkylene oxide adduct of 9,9-bis (dihydroxyphenyl) fluorene include 9,9-bis [3,4-di (2- (meth) acryloyloxyethoxy) phenyl] fluorene. 9,9-bis [di (2- (meth) acryloyloxyC2-4alkoxy) phenyl] fluorene (n1 = n2 = 1), 9,9-bis {3,4-di [2- (2- 9,9-bis {di [2- (2- (meth) acryloyloxy C2-4alkoxy) C2-4alkoxyphenyl] fluorene} (n1 = n2 =) such as (meth) acryloyloxyethoxy) ethoxy] phenyl} fluorene 2) etc. are included.

  Examples of the (meth) acrylate of an alkylene oxide adduct of 9,9-bis (trihydroxyphenyl) fluorene include 9,9-bis [3,4,5-tri (2- (meth) acryloyloxyethoxy). 9,9-bis [di (2- (meth) acryloyloxyC2-4alkoxy) phenyl] fluorene (n1 = n2 = 1), 9,9-bis {3,4,5-tri [ 9,9-bis {tri [2- (2- (meth) acryloyloxy C2-4alkoxy) C2-4alkoxyphenyl] fluorene} such as 2- (2- (meth) acryloyloxyethoxy) ethoxy] phenyl} fluorene} (N1 = n2 = 2) and the like are included.

  Among these polyfunctional (meth) acrylates, in particular, (meth) acrylates of C2-4 alkylene oxide adducts of 9,9-bis (dihydroxyphenyl) fluorenes {for example, 9,9-bis [di (2 -(Meth) acryloyloxy C2-3alkoxy) phenyl] fluorene, 9,9-bis {di [2- (2- (meth) acryloyloxyC2-3alkoxy) C2-3alkoxy] phenyl} fluorene, etc.}, 9 , 9-Bis (trihydroxyphenyl) fluorene C2-4 alkylene oxide adduct (meth) acrylate {eg, 9,9-bis [tri (2- (meth) acryloyloxyC2-3alkoxy) phenyl] fluorene , 9,9-bis {tri [2- (2- (meth) acryloyloxy C2-3 alkoxy) C Such -3 alkoxy] phenyl} fluorene} is preferred.

  Since the polyfunctional (meth) acrylate of the present invention has many highly reactive (meth) acryloyloxy group-containing groups, the polymerization rate can be improved and the crosslinking density of the cured product can be remarkably increased. A hardened product can be obtained efficiently.

  Various known photopolymerization initiators can be used as the photopolymerization initiator contained in the photopolymerizable composition. For example, benzoins (benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin alkyl ethers such as benzoin isopropyl ether), acetophenones (acetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 2 , 2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, etc.), aminoacetophenones {2-methyl-1- [4- (methylthio) phenyl] -2 -Morpholinoaminopropanone-1, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, etc.}, anthraquinones (anthraquinone, 2-methylanthraquinone, 2-ethylanthraquinone, -T-butylanthraquinone, 1-chloroanthraquinone, etc.), thioxanthones (2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone), ketals (acetophenone dimethyl ketal) And benzyl dimethyl ketal), benzophenones (such as benzophenone), and xanthones. These photopolymerization initiators may be used alone or in combination of two or more.

  Moreover, you may combine a photoinitiator with a photosensitizer. As photosensitizers, tertiary amines {eg, trialkylamines, trialkanolamines (such as triethanolamine), ethyl N, N-dimethylaminobenzoate [such as ethyl p- (dimethylamino) benzoate] , N, N-dimethylaminobenzoic acid amyl [p- (dimethylamino) benzoic acid amyl etc.] and other dialkylaminobenzoic acid alkyl esters, 4,4-bis (diethylamino) benzophenone (Michler's ketone) and other bis (dialkylamino) Conventional photosensitizers such as benzophenone, dialkylaminobenzophenone such as 4- (dimethylamino) benzophenone} and the like. The photosensitizers may be used alone or in combination of two or more.

  The amount of the polymerization initiator (and the total amount of the photosensitizer) used is 0.1 to 30 parts by weight (for example, 1 to 30 parts by weight), preferably 1 with respect to 100 parts by weight of the polyfunctional (meth) acrylate. It may be about 20 to 20 parts by weight (for example, 5 to 25 parts by weight), more preferably about 1.5 to 10 parts by weight. When the amount of the photopolymerization initiator used is too small, the polymerizability (or photocuring property) of the composition is lowered. On the other hand, when the amount is too large, photocuring property in a thick film is absorbed by absorption of the photopolymerization initiator itself. May decrease.

  Moreover, the usage-amount of a photosensitizer is 5-200 weight part with respect to 100 weight part of polymerization initiators (photoinitiator), Preferably it is 10-150 weight part, More preferably, it is about 20-100 weight part. It may be.

  As described above, a thermal polymerization initiator may be added in addition to the photopolymerization initiator. A well-known thing can be utilized as a thermal-polymerization initiator. For example, dialkyl peroxides (di-t-butyl peroxide, dicumyl peroxide, etc.), diacyl peroxides [dialkanoyl peroxide (lauroyl peroxide, etc.), dialoyl peroxide (benzoyl peroxide, benzoyl toluyl peroxide) Oxide, toluyl peroxide, etc.).

  Examples of the reactive diluent (polymerizable diluent) include a monofunctional monomer and a polyfunctional monomer. Examples of the monofunctional monomer include alkyl (meth) acrylate [C1-6 alkyl (meth) acrylate such as methyl (meth) acrylate], cycloalkyl (meth) acrylate [cyclohexyl (meth) acrylate, etc. (Meth) acrylic acid C5-8 cycloalkyl, (meth) acrylic acid diborn to tetracycloalkyl esters such as isobornyl (meth) acrylic acid], (meth) acrylic acid aryl [(meth) acrylic acid phenyl etc.], hydroxy Alkyl (meth) acrylate [(Hydroxy C2-10 alkyl (meth) acrylate such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate), etc.], (poly) Oxyalkylene glycol mono (Meth) acrylate (diethylene glycol mono (meth) acrylate, methoxytetraethylene glycol mono (meth) acrylate, (poly) oxy C2-6 alkylene glycol mono (meth) acrylate) such as polyethylene glycol mono (meth) acrylate), alkoxyalkyl (meta ) Acrylate [(meth) acrylic acid 2-methoxyethyl, (meth) acrylic acid 3-methoxybutyl and other (meth) acrylic acid C1-4 alkoxyalkyl, etc.], N-substituted (meth) acrylamide (N, N-dimethyl) N, N-diC1-4 alkyl (meth) acrylamide such as (meth) acrylamide, N-hydroxy C1-4 alkyl (meth) acrylamide such as N-methylol (meth) acrylamide), aminoalkyl (meth) ) Acrylate (N, N-dimethylaminoethyl acrylate), such as glycidyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate such as (meth) acrylic monomers can be exemplified.

  Polyfunctional monomers include difunctional (meth) acrylates, polyfunctional (meth) acrylates, epoxy group-containing compounds (glyceryl diglycidyl ether, trimethylolpropane triglycidyl ether, polyglycidyl ethers such as triglycidyl isocyanurate) Etc.) (for example, di to penta) (meth) acrylate, melamine acrylate, and the like.

  Difunctional (meth) acrylates include alkylene glycol di (meth) acrylate [ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, hexanediol di ( C2-10 alkylene glycol di (meth) acrylate such as meth) acrylate and neopentyl glycol di (meth) acrylate], (poly) oxyalkylene glycol di (meth) acrylate [diethylene glycol di (meth) acrylate, triethylene glycol di (Meth) acrylate, polyethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, polypropylene (Poly) oxy C2-6 alkylene glycol di (meth) acrylates such as recall di (meth) acrylate and polytetramethylene glycol di (meth) acrylate], bisphenol A (or its C2-3 alkylene oxide adduct) di ( (Meth) acrylate, di (meth) acrylate of polyhydric alcohol (or its C2-3 alkylene oxide adduct) [for example, glycerin di (meth) acrylate, trimethylolpropane di (meth) acrylate, tris (hydroxyethyl) isocyanurate Examples include triol di (meth) acrylate such as di (meth) acrylate, tetraol di (meth) acrylate such as pentaerythritol di (meth) acrylate, and the like.

  As the polyfunctional (meth) acrylate, a trifunctional or polyfunctional (meth) acrylate of a polyhydric alcohol (or its C2-3 alkylene oxide adduct), for example, glycerin tri (meth) acrylate, trimethylol ethanetri ( Tri (meth) acrylates of triols such as (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane ethoxytri (meth) acrylate, tris (hydroxyethyl) isocyanurate tri (meth) acrylate; pentaerythritol tri (meth) ) Acrylates, triols of tetraols such as pentaerythritol tetra (meth) acrylate or tetra (meth) acrylates; ditrimethylolpropane tetra (meth) acrylates; dipentaerythritol te La (meth) acrylate; dipentaerythritol hexa (meth) acrylate can be exemplified.

  The reactive diluent may be used alone or in combination of two or more. The usage-amount of a reactive diluent can be selected from the range of 0-100 weight part with respect to 100 weight part of polyfunctional (meth) acrylate, for example, 1-100 weight part, Preferably it is 1-50 weight part, More preferably, it may be about 1 to 30 parts by weight.

Diluents also include non-reactive diluents. When a non-reactive diluent is used, the applicability of the polymerizable composition can be improved. Non-reactive diluents (or solvents) include organic solvents such as aliphatic hydrocarbons such as hexane, heptane, octane and decane; ketones such as ethyl methyl ketone and cyclohexanone; toluene, xylene, tetramethylbenzene and the like Aromatic hydrocarbons: glycols such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, tripropylene glycol monomethyl ether Ethers; carboxylate esters (methyl acetate, ethyl acetate, butyl acetate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbide Ether acetate, propylene glycol monomethyl ether acetate, acetate esters such as dipropylene glycol monomethyl ether acetate, butyl lactate, etc.), esters such as carbonate esters (propylene carbonate, etc.); petroleum solvents such as petroleum ether, petroleum naphtha, solvent naphtha, etc. Can be illustrated. A non-reactive diluent can be used individually or in combination of 2 or more types.

  The amount (addition amount) of the non-reactive diluent varies depending on the coating method and the like, but can be selected from the range of 0 to 500 parts by weight with respect to 100 parts by weight of the polyfunctional (meth) acrylate. It may be 400 parts by weight, preferably 20 to 300 parts by weight, more preferably about 30 to 200 parts by weight.

  Silica particles can be added to the anisotropic conductive resin composition from the viewpoint of improving the dispersibility of the conductive magnetic powder in the binder. The silica particles are preferably 5 parts or more and 30 parts or less with respect to 100 parts by weight of the binder. When the amount is less than 5 parts by weight, the effect of improving the dispersibility may not be exhibited. On the other hand, when the amount exceeds 30 parts by weight, the orientation of the conductive magnetic powder due to the magnetic field may be hindered. A silica particle having a particle diameter in the range of 50 nm to 2 μm can be suitably used. When the particle diameter is less than 50 nm, there may be no effect on dispersibility. On the other hand, if the particle diameter exceeds 2 μm, the orientation of the conductive magnetic powder due to the magnetic field may be hindered. These may be used alone or in combination of two or more.

  Moreover, in order to improve the adhesiveness of an anisotropically conductive member, an adhesive improvement agent can be added. For example, an organic silicon compound, an organic acid allyl ester, an epoxy ring-opening catalyst, or an organic titanium compound can be used. These may be used alone or in combination of two or more.

  Furthermore, in the anisotropic conductive resin composition, if necessary, conventional additives such as colorants, stabilizers (thermal stabilizers, antioxidants, ultraviolet absorbers) are used as long as the original characteristics are not impaired. Etc.), fillers, antistatic agents, flame retardants (phosphorus-containing compounds such as organic phosphorus compounds and inorganic phosphorus compounds, halogen-containing flame retardants, metal oxides, metal hydroxides, metal sulfides, etc.), flame retardant aids , A leveling agent, a silane coupling agent, a polymerization inhibitor (or a thermal polymerization inhibitor) and the like may be contained. You may use an additive individually or in combination of 2 or more types.

  The proportion of the additive (such as a flame retardant) can be appropriately selected depending on the type of the additive. For example, 0.5 to 100 parts by weight, preferably 1 to 100 parts by weight with respect to 100 parts by weight of the polyfunctional (meth) acrylate. It may be about 50 parts by weight, more preferably about 1 to 20 parts by weight.

  According to the first embodiment, the manufacturing process of the anisotropic conductive member (anisotropic conductive film 10) does not include a heating step, and the binder is cured by light irradiation. Problem can be solved. That is, due to the heating at the time of connection, displacement occurs in the connection part due to the elongation of various materials, the peripheral part is thermally affected by the temperature at the time of connection because the connection part is narrow, or the heating at the time of connection Problems such as the occurrence of warping and the disconnection of wiring can be solved. In addition, there is no problem that the orientation of the conductive magnetic powder is lost during thermocompression bonding. Moreover, an anisotropic conductive resin composition having high dimensional stability can be provided by using a polymer having a low shrinkage rate during photocuring. As a result, it is possible to provide an anisotropic conductive resin composition and an anisotropic conductive member that can cope with finer connection pitches.

  Moreover, weight reduction is realizable by using a hollow-shaped electroconductive magnetic powder. As a result, the dispersibility in the anisotropic conductive resin composition can be improved, and the orientation time when the anisotropic conductive resin composition coating film is conveyed in a magnetic field can be shortened.

  In addition, although this invention can provide an anisotropic conductive member by a light irradiation process without performing a heating process, when heating an anisotropic conductive film to an electronic component, all heating processes are excluded. However, depending on the application, required performance, etc., a minimum heating step may be performed without departing from the spirit of the present invention.

  Further, the anisotropic conductive member according to the present invention is not limited to the one that is sandwiched between electrodes and crimped and subjected to a curing process, and the conductive magnetic powder before performing the crimping process is in a predetermined direction. It also includes a semi-cured film that is oriented and semi-cured to such an extent that the orientation is maintained. In the first embodiment, the example in which the conductive magnetic powder is uniaxially oriented in the in-plane direction of the coating film has been described. However, the present invention is not limited to this, and the conductive magnetic powder is formed in a predetermined direction. Includes those that are uniaxially oriented.

  In the first embodiment, an example in which a film is used as the anisotropic conductive member has been described. However, the present invention can be used in various forms such as a sheet, a paint, an adhesive, an adhesive, a paste, and an ink. Moreover, although the example which utilized the anisotropically conductive member for joining the electronic component of a liquid crystal display panel was demonstrated, it is not limited to this, It uses for joining various electronic components including an electronic device. Can do.

[Embodiment 2]
Next, an example of the anisotropic conductive film having a structure different from that of the first embodiment will be described. In the following description, the same elements as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted as appropriate. The anisotropic conductive film according to the second embodiment has the same basic configuration and manufacturing method as those of the first embodiment except for the points described below.

  In FIG. 6, the typical perspective view of the anisotropic conductive film 10a which concerns on this Embodiment 2 is shown. The anisotropic conductive film 10 a includes a conductive magnetic powder 11 a and a photocurable resin 12. The conductive magnetic powder 11a according to the second embodiment is oriented in a direction perpendicular to the surface of the anisotropic conductive film 10a. Thereby, anisotropic conductivity can be expressed.

  Next, the manufacturing method of the anisotropic conductive film 10a which concerns on this Embodiment 2 is demonstrated using FIG.7 and FIG.8. First, an anisotropic conductive resin composition is prepared as in the first embodiment. Then, after the anisotropic conductive resin composition is filtered, the anisotropic conductive resin composition is applied onto the support 21 by, for example, a bar coating method to obtain a coating film 20a (see FIG. 7). Next, the support 21 on which the coating film 20a is formed is conveyed into a magnetic field.

  In the second embodiment, the N pole of the first magnet 22 and the S pole of the second magnet 23 are disposed so as to face each other. Then, the first magnet 22 and the second magnet 23 were installed in a metal container 25. As a result, it is possible to eliminate magnetic field lines in the lateral direction and obtain magnetic field lines that coincide with the normal direction of the coating film 20a. The support 21 may be transported continuously or by a step transport system in which transport is intermittent. According to the step conveyance system, uniaxial orientation can be obtained even if the magnetic field is reduced.

  The conductive magnetic powder 11a immediately after passing through the metal container 25 is arranged in a direction substantially perpendicular to the magnet surface. Actinic rays are irradiated at the timing when this state is maintained (see FIG. 7), and the photopolymerizable composition is semi-cured so that the orientation of the conductive magnetic powder 11 is maintained. Thereby, the semi-hardened film | membrane 30a which consists of an anisotropic conductive resin composition is obtained.

  Next, the support 21 on which the semi-cured film 30a is laminated is cut into a desired size. The semi-cured film 30a is in contact with the surface of the TFT array substrate 1 on which the TFT side electrode 31 is formed at the position where the driver IC 6 near the end of the TFT array substrate 1 is mounted. Placed on. Thereafter, the support 21 is peeled off.

  After peeling off the support 21, the driver IC 6 is mounted on the semi-cured film 30. At this time, the driver-side electrode 32 of the driver IC 6 and the TFT-side electrode 31 are disposed at a position where they face each other. Next, the TFT array substrate 1 and the driver IC 6 are pressure bonded. As a result, the conductive magnetic powder 11 embedded in the semi-cured film 30 touches the TFT-side electrode 31 or the driver-side electrode 32 with the semi-cured film 30 scattered. Further, the dispersed conductive magnetic powder 11 can be compressed in the vertical direction and brought into contact with each other. As a result, the conductive magnetic powder 11 forms a conductive path in a direction perpendicular to the film surface direction, and the plurality of TFT side electrodes 31 and the driver side electrode 32 that are opposed to each other are connected to the conductive magnetic powder 11. And can be electrically connected together (see FIG. 8).

  Actinic rays are irradiated from the TFT array substrate side 1 in a state where the electrodes facing each other through the conductive magnetic powder 11 are electrically connected through the compression process. Thereby, the semi-cured film 30a is further cured. Thereby, the TFT side electrode 31 formed on the TFT array substrate 1 and the driver side electrode 32 formed on the driver IC 6 are electrically connected, and the TFT array substrate 1 and the driver IC 6 are anisotropically conductive. The fixing film 10 is fixed.

  The anisotropic conductive resin composition according to Embodiment 2 is composed mainly of a conductive magnetic powder 11 and a binder mainly composed of a photopolymerizable composition that becomes a photocurable resin 12 by irradiation with actinic rays. And The conductive magnetic powder 11 is rod-shaped and hollow, and is provided with magnetism and conductivity. The preferable addition amount and characteristics of the conductive magnetic powder 11 are as described in the first embodiment. As the photopolymerizable composition that is the main component of the binder, a photopolymerizable composition that is 7% or less when calculated by the above <Equation 1> is used. Thereby, dimensional stability is realizable. As the photopolymerizable composition, those having as a main component a photopolymerizable compound containing a fluorene structure as in Embodiment 1 can be mentioned as a suitable example. A preferred example is as described in the first embodiment.

  The anisotropic conductive resin composition may contain a diluent (reactive diluent, non-reactive diluent). Specific examples and preferred use amounts are the same as those in the first embodiment. Silica particles can be added from the viewpoint of improving the dispersibility of the conductive magnetic powder in the binder. Moreover, in order to improve the adhesiveness of an anisotropically conductive member, an adhesive improvement agent can be added. Furthermore, in the anisotropic conductive resin composition according to the second embodiment, a conventional additive can be added as in the first embodiment as long as the original characteristics are not impaired.

  According to the second embodiment, the manufacturing process of the anisotropic conductive film 10a does not include a heating step, and the binder is cured by light irradiation, so that the problem caused by the conventional thermocompression bonding is solved, and The same effect as in the first embodiment can be obtained.

<Example>
Hereinafter, the present invention will be described in more detail with reference to specific examples. However, the present invention is not limited to the following examples.

Example 1
60 mg (12 parts) of toluene was added to 500 mg (100 parts) of the photopolymerizable composition, and the mixture was stirred for 1 minute at 2800 rpm using a test tube mixer. An anisotropic conductive resin composition was obtained by adding 50 mg (10 parts, 9.1 wt%) of conductive magnetic powder to this solution and mixing and stirring for 5 minutes under the condition of 2800 rpm. As the photopolymerizable composition, Ogsol EA-F5010 (manufactured by Osaka Gas Chemical Co., Ltd.) mainly composed of an acrylate having a fluorene skeleton was used. A hollow Ni-P microrod was used as the conductive magnetic powder. The conductive magnetic powder having a length of 2.6 μm and a width of 0.35 μm was used.

About the manufacturing method of electroconductive magnetic powder, it prepared by the method of the said patent document 4 and the patent document 6. FIG. In Example 1, as the conductive magnetic powder, the coercive force is 160 kOe, the mass saturation magnetization is 13 emu / g, the inner diameter is 0.15 μm, the wall thickness is 0.1 μm, and the volume resistivity of the conductive magnetic powder itself is 10 ¹ Ωcm. The thing of was used.

  After preparing the anisotropic conductive resin composition, filter filtration with an opening of 20 μm was performed. Then, the coating film of the anisotropic conductive resin composition was formed on the peelable film with a bar coater having a groove depth of 9 μm. Conductive magnetic powder was oriented by conveying this peelable film with a coating film between Sama-Koba magnets having a magnetic field of 0.3 T at a speed of 2.4 cm / s. As described with reference to FIG. 3, the first magnet 22 and the second magnet 23 are arranged such that the same poles (N poles) face each other.

UV irradiation (mercury-xenon lamp (San-ei Super Cure 203S), 40 mW / cm ² @ 365 nm) while transporting the coating film immediately after passing between the magnets arranged facing each other at a speed of 2.4 cm / s. The photopolymerizable compound in the coating film was semi-cured. As a result, a semi-cured film in which the conductive magnetic powder was uniaxially oriented in the in-plane direction of the coating film and in the transport direction was obtained. FIG. 9A shows an SEM photograph of the cut surface of the semi-cured film cut in the transport direction, and FIG. 9B shows an SEM photograph of the cut surface of the semi-cured film cut in the direction orthogonal to the transport direction. . As shown in the figure, it can be seen that the conductive magnetic powder 11 is uniaxially oriented in the transport direction.

  Thereafter, the anisotropic conductive film was peeled from the peelable film and sandwiched between substrates with ITO pattern electrodes having a wiring pitch of 100 μm (wiring width 50 μm, wiring spacing 50 μm). And after pressing from the up-down direction of a board | substrate, actinic light was irradiated. This produced the board | substrate with an anisotropic conductive film (film thickness of 7.6 micrometers).

(Example 2)
A substrate with an anisotropic conductive film (film thickness: 7.6 μm) was produced in the same manner as in Example 1 except that the wiring pitch was 40 μm (wiring width 20 μm, wiring spacing 20 μm).

(Example 3)
A substrate with an anisotropic conductive film (film thickness: 1.9 μm) was prepared in the same manner as in Example 1 except that the wiring pitch was 20 μm (wiring width: 10 μm, wiring interval: 10 μm).

Example 4
Using the same anisotropic conductive resin composition as in Example 1, a coating film was formed in the same manner as in Example 1. This peelable film with a coating film was conveyed between cube magnets with a yoke having a magnetic field of 0.3 T and held for 50 s. Thereafter, the film was transported again at a speed of 2.4 cm / s, and UV coating ((San-ei Super Cure 203S), 40 mW while transporting the coating film immediately after passing between the magnets at a speed of 2.4 cm / s. / Cm ² @ 365 nm), and the photopolymerizable compound in the coating film was semi-cured. Thereafter, the anisotropic conductive film was peeled from the peelable film and sandwiched between substrates with ITO pattern electrodes having a wiring pitch of 100 μm (wiring width 50 μm, wiring spacing 50 μm). And after pressing from the up-down direction of a board | substrate, actinic light was irradiated. This produced the board | substrate with an anisotropic conductive film (film thickness of 9.5 micrometers).

(Example 5)
A substrate with an anisotropic conductive film (film thickness: 11.4 μm) was produced in the same manner as in Example 4 except that the wiring pitch was 40 μm (wiring width 20 μm, wiring spacing 20 μm).

(Example 6)
A substrate with an anisotropic conductive film (film thickness: 9.5 μm) was produced in the same manner as in Example 4 except that the wiring pitch was 20 μm (wiring width 10 μm, wiring interval 10 μm).

(Example 7)
To 500 mg (100 parts) of the photopolymerizable composition, 60 mg (12 parts) of toluene and 55.5 mg (11.1 parts) of spherical silica particles having a particle size of 250 nm are added, and the mixture is used for 1 minute at 2800 rpm using a test tube mixer. An anisotropic conductive resin composition was prepared in the same manner as in Example 1 except for stirring. And the coating film was formed by the method similar to the said Example 1, and the photocurable compound in a coating film was semi-hardened similarly to the said Example 4. FIG. Thereafter, the anisotropic conductive sheet was peeled from the peelable film and sandwiched between substrates with ITO pattern electrodes having a wiring pitch of 100 μm (wiring width 50 μm, wiring spacing 50 μm). And after pressing from the up-down direction of a board | substrate, actinic light was irradiated. This produced the board | substrate with an anisotropic conductive film (film thickness 6.7 micrometers).

(Example 8)
A substrate with an anisotropic conductive film (film thickness: 8.6 μm) was produced in the same manner as in Example 7 except that the wiring pitch was 40 μm (wiring width 20 μm, wiring spacing 20 μm).

Example 9
A substrate with an anisotropic conductive film (film thickness: 9.5 μm) was prepared in the same manner as in Example 7 except that the wiring pitch was 20 μm (wiring width 10 μm, wiring interval 10 μm).

(Example 10)
An anisotropic conductive resin composition was prepared in the same manner as in Example 1 except that 134 mg (26.8 parts) of conductive magnetic powder was used, and a coating film was formed in the same manner as in Example 1. The photocurable compound in the coating film was semi-cured in the same manner as in Example 4 above. Thereafter, the anisotropic conductive sheet was peeled from the peelable film and sandwiched between substrates with ITO pattern electrodes having a wiring pitch of 100 μm (wiring width 50 μm, wiring spacing 50 μm). And after pressing from the up-down direction of a board | substrate, actinic light was irradiated. This produced the board | substrate with an anisotropic conductive film (film thickness of 10.5 micrometers).

(Example 11)
A substrate with an anisotropic conductive film (film thickness: 11.4 μm) was produced in the same manner as in Example 10 except that the wiring pitch was 40 μm (wiring width 20 μm, wiring spacing 20 μm).

Example 12
A substrate with an anisotropic conductive film (film thickness: 6.7 μm) was produced in the same manner as in Example 10 except that the wiring pitch was 20 μm (wiring width 10 μm, wiring spacing 10 μm).

(Example 13)
A photopolymerizable composition containing silica particles was prepared in the same manner as in Example 7, and the anisotropic conductive property was the same as in Example 1 except that 134 mg (26.8 parts) of conductive magnetic powder was used. A resin composition was prepared, a coating film was formed by the same method as in Example 1, and the photocurable compound in the coating film was semi-cured in the same manner as in Example 4. Thereafter, the anisotropic conductive sheet was peeled from the peelable film and sandwiched between substrates with ITO pattern electrodes having a wiring pitch of 100 μm (wiring width 50 μm, wiring spacing 50 μm). And after pressing from the up-down direction of a board | substrate, actinic light was irradiated. This produced the board | substrate with an anisotropic conductive film (film thickness of 10.5 micrometers).

(Example 14)
A substrate with an anisotropic conductive film (film thickness: 12.4 μm) was produced in the same manner as in Example 13 except that the wiring pitch was 40 μm (wiring width 20 μm, wiring spacing 20 μm).

(Example 15)
A substrate with an anisotropic conductive film (film thickness: 9.5 μm) was produced in the same manner as in Example 13 except that the wiring pitch was 20 μm (wiring width 10 μm, wiring interval 10 μm).

(Comparative Example 1)
A resin composition was obtained in the same manner as in Example 1 except that no conductive magnetic powder was contained. A coating film was formed in the same manner as in Example 1, and the photocurable compound in the coating film was semi-cured in the same manner as in Example 4. Thereafter, the semi-cured sheet was peeled from the peelable film and adhered to an aluminum flat plate. Then, actinic rays were irradiated to produce a photocured film (film thickness 20 μm) of Ogsol EA-F5010. The volume resistivity of the cured film was measured by Loresta GP manufactured by Dia Instruments Co., Ltd.

(Comparative Example 2)
A non-oriented film in which the conductive magnetic powder is not oriented by a magnetic field by semi-curing the photo-curable compound in the coating film in the same manner as in Example 1 except that no magnetic field magnet having a magnetic field of 0.3 T is used. A substrate with a film thickness of 9.5 μm was produced. Separately, a semi-cured sheet is peeled off from the peelable film, attached to an aluminum flat plate, irradiated with actinic rays to produce a non-oriented film, and this cured by Loresta GP manufactured by Dia Instruments Co., Ltd. The volume resistivity of the film was measured.

(Comparative Example 3)
A non-oriented film in which the conductive magnetic powder is not oriented by a magnetic field by semi-curing the photo-curable compound in the coating film in the same manner as in Example 10 except that no magnetic field magnet having a magnetic field of 0.3 T is used. A substrate with a film thickness of 9.5 μm was produced. Separately, the semi-cured sheet is peeled off from the peelable film, attached to an aluminum flat plate, irradiated with actinic rays to produce a non-oriented film, and this is done by Loresta GP manufactured by Dia Instruments Co., Ltd. The volume resistivity of the cured film was measured.

[Evaluation of the physical properties]
Film thickness direction resistance, film surface direction resistance, film thickness direction volume resistivity, film surface direction volume resistivity, anisotropy ratio of anisotropic conductive films of Examples 1 to 15 and Comparative Examples 1 to 3 The obtained results are shown in FIG. In any of Examples 1 to 15, it was confirmed that anisotropic conductivity was exhibited in the ITO pattern electrode. The volume resistivity in the film thickness direction was in the range of 10 ¹ to 10 ⁴ Ωcm, the volume resistivity in the film surface direction was 10 ¹¹ Ωcm, and the anisotropy ratio was 10 ⁶ to 10 ⁹ . It was confirmed that good conductivity was exhibited even when a photocurable resin was used instead of the thermosetting resin as the binder resin. In addition, anisotropic conductivity could be expressed even between electrodes having a wiring pitch of 20 μm and a narrow pitch.

  FIG. 11A shows an optical microscope image of the substrate with an anisotropic conductive sheet of Example 1, FIG. 11B shows Example 2 and FIG. FIG. 12A shows an optical microscope image of the substrate with an anisotropic conductive sheet of Example 4, FIG. 12B shows Example 5, FIG.

4 is a schematic diagram for explaining a structure of a liquid crystal display panel according to Embodiment 1. FIG. 1 is a schematic perspective view of an anisotropic conductive film according to Embodiment 1. FIG. The schematic diagram for demonstrating the manufacturing process of the anisotropically conductive film which concerns on Embodiment 1. FIG. (A) is a figure for demonstrating the magnetic force line of the magnetic field which concerns on Embodiment 1, (b) is a figure for demonstrating the orientation of electroconductive magnetic powder. (A)-(c) is typical cutting part sectional drawing for demonstrating the manufacturing process of the anisotropically conductive film which concerns on Embodiment 1. FIG. 3 is a schematic perspective view of an anisotropic conductive film according to Embodiment 2. FIG. The schematic diagram for demonstrating the manufacturing process of the anisotropically conductive film which concerns on Embodiment 2. FIG. Sectional drawing of the cutting part of the anisotropically conductive film which concerns on Embodiment 2. FIG. (A) And (b) is the SEM photograph of the semi-hardened film (anisotropic conductive film) which concerns on Example 1. FIG. The table | surface which shows the manufacturing conditions of the anisotropic conductive film which concerns on Examples 1-15 and Comparative Examples 1-3, and a physical-property measured value. (A) is Example 1, (b) is Example 2, (c) is an optical microscope image of an anisotropic conductive film and an ITO substrate according to Example 3. (A) is Example 4, (b) is Example 5, (c) is an optical microscope image of an anisotropic conductive film and an ITO substrate according to Example 6.

Explanation of symbols

1 TFT array substrate 2 Counter substrate 3 Polarizing plate 4 Sealing material 5 Liquid crystal 6 Driver IC
DESCRIPTION OF SYMBOLS 10 Anisotropic conductive film 11 Conductive magnetic powder 12 Binder 20 Coating film 21 Support body 22 First magnet 23 Second magnet 30 Semi-cured film 31 TFT side electrode 32 Driver side electrode 100 Liquid crystal display panel

Claims (13)

A rod-shaped and hollow conductive magnetic powder;
Containing a binder mainly composed of a photopolymerizable composition,
The anisotropic conductive resin composition whose shrinkage | contraction rate before and behind irradiation of actinic light of the said photopolymerizable composition is 7% or less when it calculates by following <Equation 1>.
<Equation 1> Shrinkage rate (%) = 100 × (dp−dM) / dp
(Where dp is the density of the photopolymerizable composition after irradiation with actinic light by the underwater substitution method (JIS K723-1982), and dM is the photopolymerization before irradiation with actinic light by the specific gravity bottle method (JIS K7112)). Density of the composition)   The anisotropic conductive resin composition according to claim 1, wherein the photopolymerizable composition contains a photopolymerizable compound containing a fluorene structure as a main component. The anisotropically conductive resin composition according to claim 2, wherein the photopolymerizable compound containing a fluorene structure is a (meth) acrylate containing a fluorene structure represented by the following formula (1).

(Wherein R ^1a , R ^1b , R ^2a and R ^2b represent a substituent, R ^3a and R ^3b represent an alkylene group, R ^4a and R ^4b represent a hydrogen atom or a methyl group, and k 1 and k 2 represent M1 and m2 represent integers of 0 to 4, n1 and n2 represent 0 or an integer of 1 or more, and p1 and p2 represent integers of 1 to 4, provided that m1 + p1 and m2 + p2 Is an integer from 1 to 5)   The anisotropic conductive resin composition according to claim 1, wherein the conductive magnetic powder contains Ni as a main component. A coating film of the anisotropic conductive resin composition according to any one of claims 1 to 4 is formed on a support,
Applying a magnetic field so that the conductive magnetic powder is oriented in a predetermined direction,
In order to maintain the orientation state of the conductive magnetic powder, the coating film is semi-cured by irradiation with actinic rays,
The semi-cured coating film is peeled off from the support, and is sandwiched between electrodes and pressure-bonded.
A method for mounting an anisotropic conductive member that irradiates the coating film with an actinic ray. A coating film of an anisotropic conductive resin composition containing a conductive magnetic powder and a binder mainly composed of a photopolymerizable composition is formed on a support,
Applying a magnetic field so that the conductive magnetic powder is uniaxially oriented in the in-plane direction of the coating film,
In order to maintain the orientation state of the conductive magnetic powder, the coating film is semi-cured by irradiation with actinic rays,
The semi-cured coating film is peeled off from the support, and is sandwiched between electrodes and pressure-bonded.
A method for mounting an anisotropic conductive member that irradiates the coating film with an actinic ray. In order for the conductive magnetic powder to be uniaxially oriented in the in-plane direction of the coating film, the repelling magnetic poles are arranged facing each other with a gap between them,
Transport the coating film between the magnetic poles,
The anisotropic conductive material according to claim 6, wherein the anisotropically conductive material is irradiated with an actinic ray of the photopolymerizable composition so as to maintain the orientation state of the conductive magnetic powder during or after passing between the magnetic poles. Mounting method of the adhesive member. In the mounting method of the anisotropically conductive member according to claim 6 or 7,
A method for mounting an anisotropic conductive member, comprising using the anisotropic conductive resin composition according to claim 1 as the anisotropic conductive resin composition.   The method for mounting an anisotropic conductive member according to claim 5, wherein the support is continuously coated with a coating film of the anisotropic conductive resin composition. An anisotropic conductive member comprising the anisotropic conductive resin composition according to any one of claims 1 to 4,
An anisotropic conductive member in which the conductive magnetic powder is oriented substantially perpendicularly to the opposed electrode surface. An anisotropic conductive member comprising the anisotropic conductive resin composition according to any one of claims 1 to 4,
An anisotropic conductive member in which the conductive magnetic powder is oriented substantially horizontally with respect to the opposed electrode surface and in the major axis direction of the electrode.   An electronic device in which electronic parts are joined using the anisotropic conductive member according to claim 10.   The electronic device according to claim 12, wherein the electronic component is any one of a semiconductor element, a semiconductor device, a printed circuit board, a liquid crystal display panel, a plasma display panel, an electroluminescence panel, or a field emission display panel.