JP2009218433A - Light receiving apparatus, method for manufacturing the same, and electronic equipment using the light receiving apparatus - Google Patents

Light receiving apparatus, method for manufacturing the same, and electronic equipment using the light receiving apparatus Download PDF

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JP2009218433A
JP2009218433A JP2008061617A JP2008061617A JP2009218433A JP 2009218433 A JP2009218433 A JP 2009218433A JP 2008061617 A JP2008061617 A JP 2008061617A JP 2008061617 A JP2008061617 A JP 2008061617A JP 2009218433 A JP2009218433 A JP 2009218433A
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light receiving
lens
receiving element
laser beam
light
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Takayuki Yanagi
隆之 柳
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Sharp Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding

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  • Laser Beam Printer (AREA)
  • Light Receiving Elements (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light receiving apparatus capable of detecting a laser beam at accurate timing even when the laser beam is made obliquely incident on a light receiving surface of a light receiving element. <P>SOLUTION: A laser beam L is made incident in a direction orthogonal to a longitudinal direction of a cylindrical lens 5a, refracted on the surface of the lens 5a, deflected to the center of the lens 5a, and made incident on the light receiving surface of the light receiving element 3 arranged just under the center of the lens 5a. Even when an incident angle α of the laser beam L on a surface position of the lens 5a is large, an incident angle β of the laser beam L on the light receiving surface of the light receiving element 3 is reduced (α>β), and the laser beam L is made incident from a position near to just above the light receiving surface of the light receiving element 3. Thereby, after the incidence of the laser beam L on the surface of the lens 5a, the laser beam L is not irregularly reflected in translucent resin 5 and no error is caused in the detection timing of the laser beam L by the light receiving element 3. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、走査される入射光もしくはレーザビームの検出に好適な受光装置、その製造方法、及びそれを用いた電子機器に関する。   The present invention relates to a light receiving device suitable for detection of incident light or a laser beam to be scanned, a manufacturing method thereof, and an electronic apparatus using the same.

例えば、レーザビームプリンタやデジタル複写機等の電子写真方式の画像形成装置においては、レーザビームにより感光体表面を走査しつつ、レーザビームの強度を制御して、画像や文字等を感光体表面に1主走査ラインずつ書き込んでいる。このとき、感光体表面に対する書込み開始タイミングを検出する為に、感光体よりも走査方向上流側に受光素子を配置し、受光素子によるレーザビームの検出タイミングに基づき感光体の走査開始タイミングを設定して、レーザビームによる感光体の走査を開始している。   For example, in an electrophotographic image forming apparatus such as a laser beam printer or a digital copying machine, the surface of a photoconductor is scanned with a laser beam and the intensity of the laser beam is controlled so that an image, text, or the like is applied to the photoconductor surface. One main scanning line is written. At this time, in order to detect the writing start timing on the surface of the photosensitive member, a light receiving element is arranged upstream of the photosensitive member in the scanning direction, and the scanning start timing of the photosensitive member is set based on the detection timing of the laser beam by the light receiving element. Thus, the scanning of the photosensitive member by the laser beam is started.

また、特許文献1、2では、受光面の形状が相互に異なる複数の受光素子をレーザビームの主走査ラインに沿って並設し、レーザビームを受光した各受光素子の受光出力のタイミングに基づき各受光素子の副走査方向の位置を求めたり、レーザビームの正確な主走査タイミングを求めている。
特開平11−212004号公報 特開2003−69004号公報
In Patent Documents 1 and 2, a plurality of light receiving elements having different light receiving surfaces are arranged in parallel along the main scanning line of the laser beam, and based on the light reception output timing of each light receiving element that has received the laser beam. The position of each light receiving element in the sub-scanning direction is obtained, and the accurate main scanning timing of the laser beam is obtained.
Japanese Patent Laid-Open No. 11-212004 JP 2003-69004 A

ところで、受光素子の受光面が汚れると、レーザビームの検出感度が低下したり、誤検出が発生する。このため、通常は、受光素子のパッケージに小さな開口部を設けて、この開口部の奥に受光素子の受光面を配置したり、受光素子の受光面を透光性樹脂で覆うことが多い。   By the way, if the light receiving surface of the light receiving element becomes dirty, the detection sensitivity of the laser beam is lowered or erroneous detection occurs. For this reason, usually, a small opening is provided in the package of the light receiving element, and the light receiving surface of the light receiving element is disposed behind the opening, or the light receiving surface of the light receiving element is often covered with a translucent resin.

しかしながら、そのようにパッケージの開口部の奥に受光素子の受光面を配置したり、受光素子の受光面を透光性樹脂で覆うと、レーザビームが開口部の縁や透光性樹脂内で乱反射されて、受光素子によるレーザビームの検出タイミングに誤差が生じることがあった。   However, if the light receiving surface of the light receiving element is arranged in the back of the opening of the package or the light receiving surface of the light receiving element is covered with a light transmitting resin, the laser beam is generated within the edge of the opening or the light transmitting resin. Diffuse reflection may cause an error in the detection timing of the laser beam by the light receiving element.

特に、先に述べたように感光体よりも走査方向上流側に受光素子を配置した場合は、受光素子に対してレーザビームが斜め方向から入射し、受光素子の受光面に対するレーザビームの入射角度が大きくなるため、受光素子の開口部や透光性樹脂内でレーザビームの乱反射が生じ易く、受光素子によるレーザビームの検出タイミングに誤差が生じ易かった。   In particular, when the light receiving element is disposed upstream of the photosensitive member in the scanning direction as described above, the laser beam is incident on the light receiving element from an oblique direction, and the incident angle of the laser beam with respect to the light receiving surface of the light receiving element. Therefore, irregular reflection of the laser beam is likely to occur in the opening of the light receiving element or in the translucent resin, and an error is likely to occur in the detection timing of the laser beam by the light receiving element.

従来は、そのようなレーザビームの入射角度が大きくなったときのレーザビームの乱反射を考慮しておらず、このレーザビームの乱反射を原因とするレーザビームの検出タイミングの誤差を改善するには至っていない。   Conventionally, the irregular reflection of the laser beam when the incident angle of the laser beam becomes large is not considered, and the error in the detection timing of the laser beam due to the irregular reflection of the laser beam has been improved. Not in.

例えば、特許文献1、2では、複数の受光素子を用いて、レーザビームの正確な主走査タイミングを求めようとしているが、受光素子の開口部や透光性樹脂内でレーザビームの乱反射が生じて、レーザビームの検出タイミングに誤差が生じたならば、正確な主走査タイミングを求めることができなくなる。   For example, Patent Documents 1 and 2 attempt to obtain an accurate main scanning timing of a laser beam by using a plurality of light receiving elements. However, irregular reflection of the laser beam occurs in the opening of the light receiving element or in the translucent resin. Thus, if an error occurs in the detection timing of the laser beam, accurate main scanning timing cannot be obtained.

また、受光素子を取り付けるときに、受光素子の受光面をレーザビームの受光方向に向けて、受光素子の受光面に対するレーザビームの入射角度を小さくすることが考えられるが、そのような取り付け作業は容易ではなく、組立誤差による装置性能のバラツキが生じ易くなる。   In addition, when attaching the light receiving element, it is conceivable to reduce the incident angle of the laser beam with respect to the light receiving surface of the light receiving element by directing the light receiving surface of the light receiving element in the light receiving direction of the laser beam. This is not easy, and variations in device performance due to assembly errors are likely to occur.

そこで、本発明は、上記課題を解決するためになされたものであり、レーザビームが受光素子の受光面に斜めに入射しても、つまり受光素子の受光面に対するレーザビームの入射角度が大きくても、受光素子の受光面近傍でレーザビームの乱反射が生じ難く、レーザビームを正確なタイミングで検出することが可能な受光装置、その製造方法、及びそれを用いた電子機器を提供することを目的とする。   Therefore, the present invention has been made to solve the above problems, and even when the laser beam is incident on the light receiving surface of the light receiving element obliquely, that is, the incident angle of the laser beam with respect to the light receiving surface of the light receiving element is large. Another object of the present invention is to provide a light receiving device that can hardly detect irregular reflection of a laser beam in the vicinity of a light receiving surface of a light receiving element and can detect the laser beam at an accurate timing, a manufacturing method thereof, and an electronic device using the same. And

上記課題を解決するために、本発明の受光装置は、リードフレーム上に受光素子を搭載し、受光素子をワイヤーを介してリードフレームに接続し、少なくとも受光素子を透光性樹脂により封止した受光装置において、シリンドリカル型もしくは半紡錘型のレンズを前記透光性樹脂に一体的に設け、入射光をシリンドリカル型もしくは半紡錘型のレンズを通じて前記受光素子に入射させている。   In order to solve the above problems, a light receiving device of the present invention includes a light receiving element mounted on a lead frame, the light receiving element is connected to the lead frame through a wire, and at least the light receiving element is sealed with a light-transmitting resin. In the light receiving device, a cylindrical or semi-spindle lens is provided integrally with the light-transmitting resin, and incident light is incident on the light receiving element through a cylindrical or semi-spindle lens.

例えば、前記シリンドリカル型もしくは半紡錘型のレンズは、前記透光性樹脂の一部を成型してなる。あるいは、前記シリンドリカル型もしくは半紡錘型のレンズは、前記透光性樹脂表面に重ね合わされて透光性樹脂と一体的に設けられたものである。   For example, the cylindrical or semi-spindle lens is formed by molding a part of the translucent resin. Alternatively, the cylindrical type or semi-spindle type lens is provided integrally with the translucent resin so as to overlap the translucent resin surface.

また、前記シリンドリカル型もしくは半紡錘型のレンズは、ポリカーボネート、フルオレン系特殊エポキシ樹脂等の高屈折率樹脂からなる。   The cylindrical or semi-spindle lens is made of a high refractive index resin such as polycarbonate or fluorene special epoxy resin.

一方、本発明の製造方法は、入射光を受光する受光素子を備える受光装置の製造方法において、リードフレーム上に、受光素子を搭載してダイボンドする工程と、ワイヤーボンディングにより受光素子をリードフレームに接続する工程と、少なくとも受光素子を透光性樹脂により樹脂封止し、透光性樹脂の一部をシリンドリカル型もしくは半紡錘型のレンズに成型する工程とを含んでいる。   On the other hand, the manufacturing method of the present invention is a method of manufacturing a light receiving device including a light receiving element that receives incident light, a step of mounting the light receiving element on a lead frame and die bonding, and the light receiving element on the lead frame by wire bonding. And a step of sealing at least the light receiving element with a translucent resin, and molding a part of the translucent resin into a cylindrical or semi-spindle type lens.

また、本発明の製造方法は、入射光を受光する受光素子を備える受光装置の製造方法において、リードフレーム上に、受光素子を搭載してダイボンドする工程と、ワイヤーボンディングにより受光素子をリードフレームに接続する工程と、少なくとも受光素子を透光性樹脂により樹脂封止する工程と、前記透光性樹脂表面にシリンドリカル型もしくは半紡錘型のレンズを重ね合わせて、透光性樹脂及びレンズの縁を遮光性樹脂により封止して、透光性樹脂及びレンズを一体化する工程とを含んでいる。透光性樹脂上にレンズを搭載する方法は、別途成形されたレンズを搭載するという方法であっても良いし、また透光性樹脂により1次モールドされたリードフレームを再度レンズ成型用金型に移し、レンズのみを成型する2次モールドを実施することで、シリンドリカル型もしくは半紡錘型のレンズを透光性樹脂表面に成型するという方法であっても良い。その後、透光性樹脂とレンズの縁を遮光性樹脂により3次モールドすることによって、両者を一体化する。   Further, the manufacturing method of the present invention is a method of manufacturing a light receiving device including a light receiving element that receives incident light, a step of mounting the light receiving element on a lead frame and die-bonding, and the light receiving element to the lead frame by wire bonding. A step of connecting, a step of resin-sealing at least the light receiving element with a translucent resin, and a cylindrical or semi-spindle type lens superimposed on the surface of the translucent resin so that the edge of the translucent resin and the lens is Sealing with light-shielding resin, and integrating the translucent resin and the lens. The method of mounting the lens on the translucent resin may be a method of mounting a separately molded lens, or the lead mold that is primarily molded with the translucent resin is again used as a mold for lens molding. The method may be such that a cylindrical type or semi-spindle type lens is molded on the surface of the translucent resin by performing a secondary mold for molding only the lens. Thereafter, the translucent resin and the edge of the lens are third-molded with the light-shielding resin to integrate them.

更に、本発明の電子機器は、レーザビームの走査ライン上で該レーザビームを検出する受光装置を用いた電子機器において、前記受光装置は、リードフレーム上に受光素子を搭載し、受光素子をワイヤーを介してリードフレームに接続し、少なくとも受光素子を透光性樹脂により封止し、シリンドリカル型もしくは半紡錘型のレンズを透光性樹脂に一体的に設けたものであり、シリンドリカル型もしくは半紡錘型のレンズの長手方向がレーザビームの走査方向と直交するように受光装置を配置し、レーザビームをシリンドリカル型もしくは半紡錘型のレンズを通じて受光素子に入射させている。   Furthermore, the electronic device of the present invention is an electronic device using a light receiving device that detects the laser beam on a scanning line of the laser beam. The light receiving device includes a light receiving element mounted on a lead frame, and the light receiving element is connected to a wire. Is connected to the lead frame, and at least the light receiving element is sealed with a translucent resin, and a cylindrical type or semi-spindle type lens is integrally provided in the translucent resin. The light receiving device is arranged so that the longitudinal direction of the mold lens is orthogonal to the scanning direction of the laser beam, and the laser beam is incident on the light receiving element through a cylindrical or semi-spindle lens.

本発明の受光装置によれば、受光素子を透光性樹脂により封止し、シリンドリカル型もしくは半紡錘型のレンズを透光性樹脂に一体的に設け、入射光をシリンドリカル型もしくは半紡錘型のレンズを通じて受光素子に入射させている。このシリンドリカル型もしくは半紡錘型のレンズの長手方向と略直交する方向に該レンズ表面に入射して来たレーザビームは、レンズ表面で屈折されてレンズ中心向きに偏向されることから、レンズ表面位置でのレーザビームの入射角度が大きくても、受光素子の受光面に対するレーザビームの入射角度が小さくなり、レーザビームが受光素子の受光面の真上近くから入射する。このため、レーザビームがレンズ表面に入射した後では、レーザビームがレンズや透光性樹脂内で乱反射される可能性が極めて低くなり、受光素子によるレーザビームの検出タイミングに誤差が生じることはない。   According to the light-receiving device of the present invention, the light-receiving element is sealed with a light-transmitting resin, a cylindrical or semi-spindle lens is integrally provided in the light-transmitting resin, and incident light is cylindrical or semi-spindle type. The light is incident on the light receiving element through the lens. Since the laser beam incident on the lens surface in a direction substantially orthogonal to the longitudinal direction of the cylindrical or semi-spindle lens is refracted on the lens surface and deflected toward the lens center, the lens surface position Even if the incident angle of the laser beam is large, the incident angle of the laser beam with respect to the light receiving surface of the light receiving element becomes small, and the laser beam is incident from directly above the light receiving surface of the light receiving element. For this reason, after the laser beam is incident on the lens surface, the possibility that the laser beam is irregularly reflected in the lens or the translucent resin is extremely low, and no error occurs in the detection timing of the laser beam by the light receiving element. .

また、レンズの長手方向がレーザビームの走査方向と直交するように該レンズを配置した状態では、受光素子もしくはレンズがその長手方向にずれても、レンズの長手方向と略直交する方向に該レンズ表面に入射して来たレーザビームの入射角度が変わることはない。従って、受光装置の配置位置が僅かにずれても、受光素子の受光面に対するレーザビームの入射角度が小さくなるという効果が損なわれることはない。このため、受光装置の取り付けが容易である。   In the state where the lens is arranged so that the longitudinal direction of the lens is orthogonal to the scanning direction of the laser beam, even if the light receiving element or the lens is displaced in the longitudinal direction, the lens is oriented in a direction substantially orthogonal to the longitudinal direction of the lens. The incident angle of the laser beam incident on the surface does not change. Therefore, even if the arrangement position of the light receiving device is slightly shifted, the effect of reducing the incident angle of the laser beam with respect to the light receiving surface of the light receiving element is not impaired. For this reason, it is easy to attach the light receiving device.

特に、半紡錘型のレンズの表面は、レンズの長手方向及び該長手方向と直交する方向のいずれにおいても曲率を有するため、レンズ中心を通る光軸周りのいずれの方向からレーザビームが入射して来ても、レーザビームがレンズ表面で屈折されてレンズ中心向きに偏向され、受光素子の受光面に対するレーザビームの入射角度が小さくなる。   In particular, the surface of the semi-spindle lens has a curvature in both the longitudinal direction of the lens and the direction orthogonal to the longitudinal direction, so that the laser beam is incident from any direction around the optical axis passing through the center of the lens. Even if it comes, the laser beam is refracted on the lens surface and deflected toward the center of the lens, and the incident angle of the laser beam with respect to the light receiving surface of the light receiving element becomes small.

また、シリンドリカル型もしくは半紡錘型のレンズは、受光素子を封止する透光性樹脂と一体化されるため、シリンドリカル型もしくは半紡錘型のレンズと透光性樹脂間でレーザビームの乱反射が生じることはない。   Further, since the cylindrical or semi-spindle lens is integrated with the light-transmitting resin that seals the light receiving element, irregular reflection of the laser beam occurs between the cylindrical or semi-spindle lens and the light-transmitting resin. There is nothing.

例えば、シリンドリカル型もしくは半紡錘型のレンズは、透光性樹脂の一部を成型したり、透光性樹脂表面に重ね合わされて該透光性樹脂と一体的に設けられる。   For example, a cylindrical or semi-spindle lens is formed integrally with the light-transmitting resin by molding a part of the light-transmitting resin or overlapping the surface of the light-transmitting resin.

また、シリンドリカル型もしくは半紡錘型のレンズは、ポリカーボネート、フルオレン系特殊エポキシ樹脂等の高屈折率樹脂からなる。この場合は、レンズ表面でレーザビームが大きく屈折し、レーザビームがレンズ中心向きに大きく偏向され、受光素子の受光面に対するレーザビームの入射角度が十分に小さくなる。   The cylindrical or semi-spindle lens is made of a high refractive index resin such as polycarbonate or a fluorene special epoxy resin. In this case, the laser beam is largely refracted on the lens surface, the laser beam is largely deflected toward the center of the lens, and the incident angle of the laser beam with respect to the light receiving surface of the light receiving element becomes sufficiently small.

一方、本発明の製造方法では、受光素子を透光性樹脂により樹脂封止し、透光性樹脂の一部をシリンドリカル型もしくは半紡錘型のレンズに成型している。あるいは、受光素子を透光性樹脂により樹脂封止し、透光性樹脂表面にシリンドリカル型もしくは半紡錘型のレンズを重ね合わせて、透光性樹脂及びレンズの縁を遮光性樹脂により封止している。これにより、シリンドリカル型もしくは半紡錘型のレンズを透光性樹脂と一体化することができる。   On the other hand, in the manufacturing method of the present invention, the light receiving element is resin-sealed with a translucent resin, and a part of the translucent resin is molded into a cylindrical or semi-spindle lens. Alternatively, the light-receiving element is sealed with a light-transmitting resin, a cylindrical or semi-spindle lens is overlapped on the surface of the light-transmitting resin, and the edges of the light-transmitting resin and the lens are sealed with a light-blocking resin. ing. Thereby, a cylindrical type or a semi-spindle type lens can be integrated with translucent resin.

更に、本発明の電子機器では、上記本発明の受光装置を用いていることから、上記本発明の受光装置と同様の作用及び効果を達成することができる。   Furthermore, since the electronic device of the present invention uses the light receiving device of the present invention, the same operations and effects as those of the light receiving device of the present invention can be achieved.

以下、本発明の実施形態を添付図面を参照しつつ詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

図1及び図2は、本発明の受光装置の実施形態1を示す斜視図及び断面図である。本実施形態の受光装置1では、リードフレーム2上に受光素子3をダイボンドし、受光素子3をボンディングワイヤー4によりリードフレーム2に結線接続している。そして、透光性樹脂5をモールド成形して、受光素子3を透光性樹脂5内に封止し、更に遮光性樹脂パッケージ6をモールド成形して、透光性樹脂5の縁を遮光性樹脂パッケージ6内に封止している。   1 and 2 are a perspective view and a sectional view showing Embodiment 1 of the light receiving device of the present invention. In the light receiving device 1 of the present embodiment, the light receiving element 3 is die-bonded on the lead frame 2, and the light receiving element 3 is connected to the lead frame 2 by a bonding wire 4. Then, the translucent resin 5 is molded, the light receiving element 3 is sealed in the translucent resin 5, and the light-shielding resin package 6 is molded, and the edge of the translucent resin 5 is shielded. The resin package 6 is sealed.

また、透光性樹脂5の上側半分は、シリンドリカル型のレンズ5aとなっており、シリンドリカル型のレンズ5aの中央直下に受光素子3の受光面を配置し、シリンドリカル型のレンズ5aの中心を通る光軸が受光素子3の受光面の中心を通るようにしている。   The upper half of the translucent resin 5 is a cylindrical lens 5a. The light receiving surface of the light receiving element 3 is disposed immediately below the center of the cylindrical lens 5a and passes through the center of the cylindrical lens 5a. The optical axis passes through the center of the light receiving surface of the light receiving element 3.

更に、透光性樹脂5の縁には、段差部5bが形成されており、この段差部5bにより透光性樹脂5の下側半分が遮光性樹脂6に強固に係合されている。   Further, a step portion 5 b is formed at the edge of the translucent resin 5, and the lower half of the translucent resin 5 is firmly engaged with the light shielding resin 6 by the step portion 5 b.

シリンドリカル型のレンズ5a及び段差部5bは、透光性樹脂5のモールド成形に際し、金型により成形されたものである。   The cylindrical lens 5a and the step portion 5b are formed by a mold when the translucent resin 5 is molded.

透光性樹脂5は、ポリカーボネート、フルオレン系特殊エポキシ樹脂(例えば長瀬産業株式会社により提供されている)等の高屈折率樹脂である。   The translucent resin 5 is a high refractive index resin such as polycarbonate or fluorene-based special epoxy resin (for example, provided by Nagase Sangyo Co., Ltd.).

図3は、受光装置1を適用した電子写真方式の画像形成装置を概略的に示す図である。この画像形成装置11では、半導体レーザ12から出射されたレーザビームLをポリゴンミラー13に入射させ、ポリゴンミラー13を回転駆動して、ポリゴンミラー13で反射されたレーザビームLを主走査範囲Aで繰り返し往復移動させ、レーザビームLを光学系14を介して感光体ドラム15に入射させ、感光体ドラム15を回転させながら、レーザビームLにより感光体ドラム15表面を繰り返し主走査方向Bに走査し、画像や文字等を感光体ドラム15表面に1主走査ラインずつ書き込んでいる。   FIG. 3 is a diagram schematically showing an electrophotographic image forming apparatus to which the light receiving device 1 is applied. In this image forming apparatus 11, the laser beam L emitted from the semiconductor laser 12 is incident on the polygon mirror 13, the polygon mirror 13 is rotationally driven, and the laser beam L reflected by the polygon mirror 13 is moved in the main scanning range A. By repeatedly reciprocatingly moving the laser beam L to the photosensitive drum 15 via the optical system 14 and rotating the photosensitive drum 15, the surface of the photosensitive drum 15 is repeatedly scanned in the main scanning direction B by the laser beam L. Images, characters and the like are written on the surface of the photosensitive drum 15 one main scanning line at a time.

受光装置1は、感光体ドラム15の端部近傍に配置され、レーザビームLの主走査の度に、レーザビームLを検出する。そして、受光装置1によるレーザビームLの検出タイミングに基づき感光体ドラム15の走査開始タイミングを求め、この走査開始タイミングからレーザビームLの強度変調を開始して、レーザビームLによる感光体ドラム15表面への書き込みを行っている。   The light receiving device 1 is disposed in the vicinity of the end of the photosensitive drum 15 and detects the laser beam L every time the laser beam L is scanned. Then, the scanning start timing of the photosensitive drum 15 is obtained based on the detection timing of the laser beam L by the light receiving device 1, the intensity modulation of the laser beam L is started from this scanning start timing, and the surface of the photosensitive drum 15 by the laser beam L is started. Is writing to.

受光装置1のシリンドリカル型のレンズ5aは、その長手方向が主走査方向Bと直交する方向(図3の紙面に対して垂直方向)となるように配置されている。このため、レーザビームLは、図2に示すようにシリンドリカル型のレンズ5aの長手方向と直交する方向に入射して来て、レンズ5a表面で屈折されて該レンズ5aの中心向きに偏向され、レンズ5a中央直下の受光素子3の受光面に入射する。このとき、レンズ5a表面位置でのレーザビームLの入射角度αが大きくても、受光素子3の受光面に対するレーザビームLの入射角度βが小さくなり(α>β)、レーザビームLが受光素子3の受光面の真上近くから入射する。先に述べたように透光性樹脂5として高屈折率樹脂を適用していることから、レーザビームLがシリンドリカル型のレンズ5a表面で大きく屈折し、受光素子3の受光面に対するレーザビームLの入射角度βが十分に小さくなる。また、レーザビームLがレンズ5a表面上を走査して該表面に入射している間は、レーザビームLがレンズ5aの中心向きに偏向されて受光素子3の受光面へと入射する。   The cylindrical lens 5a of the light receiving device 1 is arranged so that its longitudinal direction is perpendicular to the main scanning direction B (perpendicular to the paper surface of FIG. 3). Therefore, the laser beam L is incident in a direction perpendicular to the longitudinal direction of the cylindrical lens 5a as shown in FIG. 2, is refracted on the surface of the lens 5a and deflected toward the center of the lens 5a, The light enters the light receiving surface of the light receiving element 3 immediately below the center of the lens 5a. At this time, even if the incident angle α of the laser beam L at the surface position of the lens 5a is large, the incident angle β of the laser beam L with respect to the light receiving surface of the light receiving element 3 is small (α> β), and the laser beam L is received by the light receiving element. 3 is incident from just above the light receiving surface. Since the high refractive index resin is applied as the translucent resin 5 as described above, the laser beam L is largely refracted on the surface of the cylindrical lens 5a, and the laser beam L with respect to the light receiving surface of the light receiving element 3 is reflected. The incident angle β is sufficiently small. Further, while the laser beam L scans the surface of the lens 5 a and is incident on the surface, the laser beam L is deflected toward the center of the lens 5 a and is incident on the light receiving surface of the light receiving element 3.

このため、レーザビームLがレンズ5a表面に入射した後では、レーザビームLが透光性樹脂5内で乱反射される可能性が極めて低くなり、受光素子3によるレーザビームLの検出タイミングに誤差が生じることはない。   For this reason, after the laser beam L is incident on the surface of the lens 5a, the possibility that the laser beam L is irregularly reflected in the translucent resin 5 is extremely low, and there is an error in the detection timing of the laser beam L by the light receiving element 3. It does not occur.

また、受光装置1がレンズ5aの長手方向にずれても、レンズ5aの長手方向と略直交する方向に該レンズ5a表面に入射して来たレーザビームLの入射角度が変わることはない。従って、受光装置1の配置位置がレンズ5aの長手方向にずれても、受光素子3の受光面に対するレーザビームLの入射角度が小さくなるという効果が損なわれることはない。このため、受光装置1の取り付けが容易であり、組立誤差による画像形成装置11の性能のバラツキが生じ難い。   Even if the light receiving device 1 is displaced in the longitudinal direction of the lens 5a, the incident angle of the laser beam L incident on the surface of the lens 5a is not changed in a direction substantially perpendicular to the longitudinal direction of the lens 5a. Therefore, even if the arrangement position of the light receiving device 1 is shifted in the longitudinal direction of the lens 5a, the effect that the incident angle of the laser beam L with respect to the light receiving surface of the light receiving element 3 becomes small is not impaired. For this reason, it is easy to attach the light receiving device 1 and it is difficult for the performance of the image forming apparatus 11 to vary due to an assembly error.

仮に、図4に示すようにレンズ5aが無く、透光性樹脂5Aの上面が平坦であったならば、レーザビームLが透光性樹脂5Aの端部に至ったときに、レーザビームLが透光性樹脂5A内で乱反射されるため、受光素子3によるレーザビームLの検出タイミングに誤差が生じることがある。   If there is no lens 5a and the upper surface of the translucent resin 5A is flat as shown in FIG. 4, when the laser beam L reaches the end of the translucent resin 5A, the laser beam L Since it is irregularly reflected in the translucent resin 5A, an error may occur in the detection timing of the laser beam L by the light receiving element 3.

図5は、図1及び図2の受光装置の変形例を示す断面図である。この変形例の受光装置1Aでは、リードフレーム2上の受光素子3を透光性樹脂21により封止し、透光性樹脂21の平坦上面にシリンドリカルレンズ型のレンズ22の平坦下面を重ね合わせ、遮光性樹脂パッケージ6をモールド成形して、透光性樹脂21及びシリンドリカル型のレンズ22の縁を遮光性樹脂パッケージ6内に封止し、遮光性樹脂パッケージ6により透光性樹脂21及びシリンドリカル型のレンズ22を一体化している。   FIG. 5 is a cross-sectional view showing a modification of the light receiving device of FIGS. 1 and 2. In the light receiving device 1A of this modification, the light receiving element 3 on the lead frame 2 is sealed with a translucent resin 21, and the flat lower surface of the cylindrical lens type lens 22 is superimposed on the flat upper surface of the translucent resin 21. The light-shielding resin package 6 is molded, the edges of the light-transmitting resin 21 and the cylindrical lens 22 are sealed in the light-shielding resin package 6, and the light-transmitting resin package 6 and the light-transmitting resin 21 and the cylindrical type are sealed. The lens 22 is integrated.

透光性樹脂21上にレンズ22を搭載する方法は、別途成形されたレンズ22を搭載するという方法であっても良いし、また透光性樹脂21により1次モールドされたリードフレーム21を再度レンズ成型用金型に移し、レンズ22のみを成型する2次モールドを実施することで、レンズ22を透光性樹脂21表面上に成型するという方法であっても良い。その後、透光性樹脂21とレンズ22の縁を遮光性樹脂により3次モールドすることによって、両者を一体化する。   The method of mounting the lens 22 on the translucent resin 21 may be a method of mounting a lens 22 that is separately molded, or the lead frame 21 that is primarily molded by the translucent resin 21 is again mounted. A method may be employed in which the lens 22 is molded on the surface of the translucent resin 21 by performing a secondary mold in which only the lens 22 is molded by moving to a lens molding die. Thereafter, the edges of the translucent resin 21 and the lens 22 are third-molded with a light-shielding resin to integrate both.

この受光装置1Aも、図1及び図2の受光装置1と同様に、図3の画像形成装置11に適用することができる。   This light receiving device 1A can also be applied to the image forming device 11 of FIG. 3 in the same manner as the light receiving device 1 of FIGS.

尚、図5において、透光性樹脂21のモールド成型に際し、シリンドリカル型のレンズ22の縁を透光性樹脂21により封止して、透光性樹脂21及びシリンドリカル型のレンズ22を一体化しても良い。   In FIG. 5, when molding the translucent resin 21, the edge of the cylindrical lens 22 is sealed with the translucent resin 21, and the translucent resin 21 and the cylindrical lens 22 are integrated. Also good.

図6は、本発明の受光装置の実施形態2を示す斜視図及び断面図である。本実施形態の受光装置31では、図1及び図2の受光装置1と同様に、リードフレーム32上に受光素子33をダイボンドし、受光素子33をボンディングワイヤー(図示せず)によりリードフレーム32に結線接続し、透光性樹脂35をモールド成形して、受光素子33を透光性樹脂35内に封止し、更に遮光性樹脂パッケージ36をモールド成形して、透光性樹脂35の縁を遮光性樹脂パッケージ36内に封止している。   FIG. 6 is a perspective view and a cross-sectional view showing Embodiment 2 of the light receiving device of the present invention. In the light receiving device 31 of the present embodiment, the light receiving element 33 is die-bonded on the lead frame 32 and the light receiving element 33 is attached to the lead frame 32 by a bonding wire (not shown), as in the light receiving device 1 of FIGS. Wire connection is performed, the translucent resin 35 is molded, the light receiving element 33 is sealed in the translucent resin 35, and the light-shielding resin package 36 is molded, and the edges of the translucent resin 35 are formed. The light shielding resin package 36 is sealed.

また、透光性樹脂35の上側半分は、半紡錘型のレンズ35aとなっており、半紡錘型のレンズ35aの中央直下に受光素子33の受光面を配置し、半紡錘型のレンズ35aの中心を通る光軸が受光素子33の受光面の中心を通るようにされている。半紡錘型のレンズ35aの表面は、その長手方向及び該長手方向と直交する方向のいずれにおいても曲率を有しており(湾曲しており)、図1及び図2の受光装置1におけるシリンドリカル型のレンズ5aをその中央から両端にかけて徐々に細くした形状に近似する。   The upper half of the translucent resin 35 is a semi-spindle type lens 35a. The light receiving surface of the light receiving element 33 is disposed immediately below the center of the semi-spindle type lens 35a. The optical axis passing through the center passes through the center of the light receiving surface of the light receiving element 33. The surface of the semi-spindle type lens 35a has a curvature (curved) in both the longitudinal direction and the direction orthogonal to the longitudinal direction, and is a cylindrical type in the light receiving device 1 of FIGS. The shape of the lens 5a is gradually reduced from the center to both ends.

半紡錘型のレンズ35aは、透光性樹脂35のモールド成形に際し、金型により成形されたものである。   The semi-spindle type lens 35a is formed by a mold when the translucent resin 35 is molded.

また、透光性樹脂35の下側の縁(図示せず)は、遮光性樹脂35により覆われて、遮光性樹脂35に強固に係合している。   The lower edge (not shown) of the translucent resin 35 is covered with the light-shielding resin 35 and is firmly engaged with the light-shielding resin 35.

透光性樹脂35は、ポリカーボネート、フルオレン系特殊エポキシ樹脂等の高屈折率樹脂である。   The translucent resin 35 is a high refractive index resin such as polycarbonate or fluorene special epoxy resin.

このような受光装置31も、図1及び図2の受光装置1と同様に、図3の画像形成装置11における感光体ドラム15の端部近傍に配置され、レーザビームLの主走査の度に、レーザビームLを検出する。そして、このレーザビームLの検出タイミングに基づき感光体ドラム15の走査開始タイミングが設定され、レーザビームLによる感光体ドラム15表面への書き込みが行われる。   Such a light receiving device 31 is also arranged in the vicinity of the end of the photosensitive drum 15 in the image forming apparatus 11 of FIG. 3 in the same manner as the light receiving device 1 of FIGS. The laser beam L is detected. The scanning start timing of the photosensitive drum 15 is set based on the detection timing of the laser beam L, and writing on the surface of the photosensitive drum 15 by the laser beam L is performed.

図3の画像形成装置11において、受光装置31の半紡錘型のレンズ35aは、その長手方向が主走査方向Bと直交する方向(図3の紙面に対して垂直方向)となるように配置される。レーザビームLは、半紡錘型のレンズ35aの長手方向と直交する方向に入射して来て、レンズ35a表面で屈折されて該レンズ35aの中心向きに偏向され、レンズ35a中央直下の受光素子33の受光面に入射する。   In the image forming apparatus 11 of FIG. 3, the semi-spindle type lens 35a of the light receiving device 31 is arranged so that its longitudinal direction is perpendicular to the main scanning direction B (perpendicular to the paper surface of FIG. 3). The The laser beam L is incident in a direction orthogonal to the longitudinal direction of the semi-spindle type lens 35a, is refracted on the surface of the lens 35a, is deflected toward the center of the lens 35a, and the light receiving element 33 just below the center of the lens 35a. Is incident on the light receiving surface.

このため、レーザビームLがレンズ35a表面に入射した後では、レーザビームLが受光素子33の受光面の真上近くから入射し、レーザビームLが透光性樹脂35内で乱反射されることはなく、受光素子33によるレーザビームLの検出タイミングに誤差が生じることはない。   For this reason, after the laser beam L is incident on the surface of the lens 35a, the laser beam L is incident from directly above the light receiving surface of the light receiving element 33, and the laser beam L is irregularly reflected in the translucent resin 35. In other words, no error occurs in the detection timing of the laser beam L by the light receiving element 33.

また、半紡錘型のレンズ35aの表面は、その長手方向及び該長手方向と直交する方向のいずれにおいても曲率を有していることから、仮に、レーザビームLがレンズ35aの長手方向に入射して来たとしても、レーザビームLが該レンズ35a表面で屈折されて該レンズ35aの中心向きに偏向される。   Further, since the surface of the semi-spindle lens 35a has a curvature in both the longitudinal direction and the direction orthogonal to the longitudinal direction, the laser beam L is incident on the longitudinal direction of the lens 35a. Even if it comes, the laser beam L is refracted on the surface of the lens 35a and deflected toward the center of the lens 35a.

すなわち、半紡錘型のレンズ35aの中心を通る光軸周りのいずれの方向からレーザビームLが入射して来ても、レーザビームLがレンズ35a表面で屈折されてレンズ35a中心向きに偏向され、受光素子33の受光面に対するレーザビームLの入射角度が小さくなる。   That is, even if the laser beam L is incident from any direction around the optical axis passing through the center of the semi-spindle lens 35a, the laser beam L is refracted on the surface of the lens 35a and deflected toward the center of the lens 35a. The incident angle of the laser beam L with respect to the light receiving surface of the light receiving element 33 is reduced.

このため、受光装置31の配置位置がレンズ35aの長手方向にずれても、あるいは主走査方向Bに対して受光装置31が斜めに配置されても、受光素子33の受光面に対するレーザビームLの入射角度が小さくなるという効果が損なわれることはない。このため、受光装置31の取り付けが容易であり、組立誤差による画像形成装置11の性能のバラツキが生じ難い。   For this reason, even if the arrangement position of the light receiving device 31 is shifted in the longitudinal direction of the lens 35 a or the light receiving device 31 is arranged obliquely with respect to the main scanning direction B, the laser beam L with respect to the light receiving surface of the light receiving element 33 The effect of reducing the incident angle is not impaired. For this reason, the light receiving device 31 can be easily attached, and the performance of the image forming apparatus 11 does not easily vary due to an assembly error.

尚、本発明は、上記各実施形態に限定されるものではなく、特許請求の範囲を逸脱しない範囲で、多様に変形することができる。また、本発明の電子機器は、画像形成装置に限定されず、本発明の受光装置をレーザビームの走査ライン上に配置して、レーザビームを検出する電子機器であれば良く、画像形成装置と同様の効果を期待することができる。   The present invention is not limited to the above embodiments, and can be variously modified without departing from the scope of the claims. The electronic apparatus of the present invention is not limited to the image forming apparatus, and may be any electronic apparatus that detects the laser beam by arranging the light receiving apparatus of the present invention on the scanning line of the laser beam. Similar effects can be expected.

本発明の受光装置の実施形態1を示す斜視図である。It is a perspective view which shows Embodiment 1 of the light-receiving device of this invention. 図1の受光装置を示す断面図である。It is sectional drawing which shows the light-receiving device of FIG. 図1の受光装置を適用した電子写真方式の画像形成装置を概略的に示す図である。FIG. 2 is a diagram schematically showing an electrophotographic image forming apparatus to which the light receiving device of FIG. 1 is applied. 図1の受光装置に対する比較例を示す断面図である。It is sectional drawing which shows the comparative example with respect to the light-receiving device of FIG. 図1の受光装置の変形例を示す断面図である。It is sectional drawing which shows the modification of the light-receiving device of FIG. 本発明の受光装置の実施形態2を示す斜視図である。It is a perspective view which shows Embodiment 2 of the light-receiving device of this invention.

符号の説明Explanation of symbols

1、31 受光装置
2、32 リードフレーム
3、33 受光素子
4 ボンディングワイヤー
5、35 透光性樹脂
5a シリンドリカル型のレンズ
6、36 遮光性樹脂パッケージ
11 画像形成装置
12 半導体レーザ
13 ポリゴンミラー
14 光学系
15 感光体ドラム
36a 半紡錘型のレンズ
DESCRIPTION OF SYMBOLS 1, 31 Light-receiving device 2, 32 Lead frame 3, 33 Light-receiving element 4 Bonding wire 5, 35 Translucent resin 5a Cylindrical lens 6, 36 Light-shielding resin package 11 Image forming device 12 Semiconductor laser 13 Polygon mirror 14 Optical system 15 Photosensitive drum 36a Half spindle type lens

Claims (8)

リードフレーム上に受光素子を搭載し、受光素子をワイヤーを介してリードフレームに接続し、少なくとも受光素子を透光性樹脂により封止した受光装置において、
シリンドリカル型もしくは半紡錘型のレンズを前記透光性樹脂に一体的に設け、入射光をシリンドリカル型もしくは半紡錘型のレンズを通じて前記受光素子に入射させることを特徴とする受光装置。
In a light receiving device in which a light receiving element is mounted on a lead frame, the light receiving element is connected to the lead frame via a wire, and at least the light receiving element is sealed with a translucent resin,
A light receiving device, wherein a cylindrical or semi-spindle lens is integrally provided in the light-transmitting resin, and incident light is incident on the light receiving element through a cylindrical or semi-spindle lens.
前記シリンドリカル型もしくは半紡錘型のレンズは、前記透光性樹脂の一部を成型してなることを特徴とする請求項1に記載の受光装置。   2. The light receiving device according to claim 1, wherein the cylindrical or semi-spindle lens is formed by molding a part of the translucent resin. 前記シリンドリカル型もしくは半紡錘型のレンズは、前記透光性樹脂表面に重ね合わされて透光性樹脂と一体的に設けられたことを特徴とする請求項1に記載の受光装置。   The light receiving device according to claim 1, wherein the cylindrical or semi-spindle lens is provided integrally with the light-transmitting resin so as to overlap the surface of the light-transmitting resin. 前記シリンドリカル型もしくは半紡錘型のレンズは、ポリカーボネート、フルオレン系特殊エポキシ樹脂等の高屈折率樹脂からなることを特徴とする請求項1に記載の受光装置。   2. The light receiving device according to claim 1, wherein the cylindrical or semi-spindle lens is made of a high refractive index resin such as polycarbonate or fluorene special epoxy resin. 入射光を受光する受光素子を備える受光装置の製造方法において、
リードフレーム上に、受光素子を搭載してダイボンドする工程と、
ワイヤーボンディングにより受光素子をリードフレームに接続する工程と、
少なくとも受光素子を透光性樹脂により樹脂封止し、透光性樹脂の一部をシリンドリカル型もしくは半紡錘型のレンズに成型する工程と
を含むことを特徴とする受光装置の製造方法。
In a manufacturing method of a light receiving device including a light receiving element that receives incident light,
Mounting the light receiving element on the lead frame and die bonding;
Connecting the light receiving element to the lead frame by wire bonding;
And a step of sealing at least the light receiving element with a translucent resin, and molding a part of the translucent resin into a cylindrical or semi-spindle type lens.
入射光を受光する受光素子を備える受光装置の製造方法において、
リードフレーム上に、受光素子を搭載してダイボンドする工程と、
ワイヤーボンディングにより受光素子をリードフレームに接続する工程と、
少なくとも受光素子を透光性樹脂により樹脂封止する工程と、
前記透光性樹脂表面にシリンドリカル型もしくは半紡錘型のレンズを重ね合わせて、透光性樹脂及びレンズの縁を遮光性樹脂により封止して、透光性樹脂及びレンズを一体化する工程と
を含むことを特徴とする受光装置の製造方法。
In a manufacturing method of a light receiving device including a light receiving element that receives incident light,
Mounting the light receiving element on the lead frame and die bonding;
Connecting the light receiving element to the lead frame by wire bonding;
A step of sealing at least the light receiving element with a translucent resin;
A step of superimposing a cylindrical or semi-spindle lens on the surface of the translucent resin, sealing the translucent resin and the edge of the lens with a light-shielding resin, and integrating the translucent resin and the lens; A method for manufacturing a light receiving device, comprising:
前記シリンドリカル型もしくは半紡錘型のレンズは、ポリカーボネート、フルオレン系特殊エポキシ樹脂等の高屈折率樹脂からなることを特徴とする請求項5又は6に記載の受光装置の製造方法。   7. The method for manufacturing a light receiving device according to claim 5, wherein the cylindrical or semi-spindle lens is made of a high refractive index resin such as polycarbonate or fluorene special epoxy resin. レーザビームの走査ライン上で該レーザビームを検出する受光装置を用いた電子機器において、
前記受光装置は、リードフレーム上に受光素子を搭載し、受光素子をワイヤーを介してリードフレームに接続し、少なくとも受光素子を透光性樹脂により封止し、シリンドリカル型もしくは半紡錘型のレンズを透光性樹脂に一体的に設けたものであり、
シリンドリカル型もしくは半紡錘型のレンズの長手方向がレーザビームの走査方向と直交するように受光装置を配置し、レーザビームをシリンドリカル型もしくは半紡錘型のレンズを通じて受光素子に入射させることを特徴とする受光装置を用いた電子機器。
In an electronic apparatus using a light receiving device that detects the laser beam on a scanning line of the laser beam,
The light receiving device includes a light receiving element mounted on a lead frame, the light receiving element is connected to the lead frame through a wire, and at least the light receiving element is sealed with a translucent resin, and a cylindrical or semi-spindle type lens is provided. It is provided integrally with translucent resin,
The light receiving device is arranged so that the longitudinal direction of the cylindrical or semi-spindle lens is orthogonal to the scanning direction of the laser beam, and the laser beam is incident on the light receiving element through the cylindrical or semi-spindle lens. Electronic equipment using a light receiving device.
JP2008061617A 2008-03-11 2008-03-11 Light receiving apparatus, method for manufacturing the same, and electronic equipment using the light receiving apparatus Pending JP2009218433A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008061617A JP2009218433A (en) 2008-03-11 2008-03-11 Light receiving apparatus, method for manufacturing the same, and electronic equipment using the light receiving apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008061617A JP2009218433A (en) 2008-03-11 2008-03-11 Light receiving apparatus, method for manufacturing the same, and electronic equipment using the light receiving apparatus

Publications (1)

Publication Number Publication Date
JP2009218433A true JP2009218433A (en) 2009-09-24

Family

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Country Status (1)

Country Link
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