JP2009214278A5 - - Google Patents

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Publication number
JP2009214278A5
JP2009214278A5 JP2008063432A JP2008063432A JP2009214278A5 JP 2009214278 A5 JP2009214278 A5 JP 2009214278A5 JP 2008063432 A JP2008063432 A JP 2008063432A JP 2008063432 A JP2008063432 A JP 2008063432A JP 2009214278 A5 JP2009214278 A5 JP 2009214278A5
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JP
Japan
Prior art keywords
grinding wheel
wheel according
grinding
abrasive grains
cushion layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008063432A
Other languages
Japanese (ja)
Other versions
JP2009214278A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2008063432A priority Critical patent/JP2009214278A/en
Priority claimed from JP2008063432A external-priority patent/JP2009214278A/en
Publication of JP2009214278A publication Critical patent/JP2009214278A/en
Publication of JP2009214278A5 publication Critical patent/JP2009214278A5/ja
Pending legal-status Critical Current

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Claims (8)

被研削物を研削するための研削用砥石であって、
弾性体からなるクッション層と、
前記研削を行うための砥粒を有する砥粒層とを備え、
前記砥粒は、金属からなる結合剤により結合されて前記クッション層に重なることを特徴とする研削用砥石。
A grinding wheel for grinding an object to be ground,
A cushion layer made of an elastic body ;
And a abrasive layer having abrasive grains for performing the grinding,
The grindstone for grinding , wherein the abrasive grains are bonded by a binder made of metal and overlap the cushion layer .
前記クッション層と前記砥粒層との間に配置された金属薄板を有する薄板層を備え、Comprising a thin plate layer having a thin metal plate disposed between the cushion layer and the abrasive layer,
前記砥粒は、前記クッション層に接合された前記金属薄板に結合されることを特徴とする請求項1に記載の研削用砥石。The grinding wheel according to claim 1, wherein the abrasive grains are bonded to the metal thin plate bonded to the cushion layer.
前記砥粒は、前記結合剤の電着もしくは焼結により前記金属薄板に結合されることを特徴とする請求項2に記載の研削用砥石。The grinding wheel according to claim 2, wherein the abrasive grains are bonded to the metal thin plate by electrodeposition or sintering of the binder. 前記金属薄板は、ステンレスもしくはチタンからなることを特徴とする請求項2または3に記載の研削用砥石。The grinding wheel according to claim 2 or 3, wherein the metal thin plate is made of stainless steel or titanium. 前記弾性体は、発泡ポリウレタンもしくは軟質ゴムであることを特徴とする請求項1から4のいずれか一項に記載の研削用砥石。 The grinding wheel according to any one of claims 1 to 4, wherein the elastic body is foamed polyurethane or soft rubber. 前記砥粒は、粒度が1000以上のダイヤモンド砥粒であることを特徴とする請求項1から5のいずれか一項に記載の研削用砥石。 The grinding wheel according to any one of claims 1 to 5, wherein the abrasive grains are diamond abrasive grains having a particle size of 1000 or more. 略平面状の表面を有する基材を備え、Comprising a substrate having a substantially planar surface;
前記クッション層が前記基材の前記表面に重なって設けられることを特徴とする請求項1から6のいずれか一項に記載の研削用砥石。The grinding wheel according to any one of claims 1 to 6, wherein the cushion layer is provided so as to overlap the surface of the base material.
前記研削用砥石は、半導体ウェハの裏面側を研削するための研削用砥石であることを特徴とする請求項1から7のいずれか一項に記載の研削用砥石。 The grinding wheel according to any one of claims 1 to 7, wherein the grinding wheel is a grinding wheel for grinding the back side of a semiconductor wafer.
JP2008063432A 2008-03-13 2008-03-13 Grinding wheel Pending JP2009214278A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008063432A JP2009214278A (en) 2008-03-13 2008-03-13 Grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008063432A JP2009214278A (en) 2008-03-13 2008-03-13 Grinding wheel

Publications (2)

Publication Number Publication Date
JP2009214278A JP2009214278A (en) 2009-09-24
JP2009214278A5 true JP2009214278A5 (en) 2011-10-13

Family

ID=41186702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008063432A Pending JP2009214278A (en) 2008-03-13 2008-03-13 Grinding wheel

Country Status (1)

Country Link
JP (1) JP2009214278A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8901703B2 (en) 2004-05-06 2014-12-02 Nxp, B.V. Electronic device
JP5460537B2 (en) 2010-06-17 2014-04-02 東京エレクトロン株式会社 Substrate back surface polishing apparatus, substrate back surface polishing system, substrate back surface polishing method, and recording medium recording substrate back surface polishing program

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59105365U (en) * 1982-12-29 1984-07-16 三和研磨工業株式会社 stone polishing board
JPS62184970U (en) * 1986-05-14 1987-11-25
JPS6438256U (en) * 1987-08-31 1989-03-07
JPH0740069U (en) * 1993-12-27 1995-07-18 柳瀬株式会社 Polishing disc
JPH0885067A (en) * 1994-09-14 1996-04-02 Nippon Electric Glass Co Ltd Polishing tool for polishing device for plate glass, etc.
JP2000084856A (en) * 1998-09-09 2000-03-28 Osaka Diamond Ind Co Ltd Super abrasive grinding wheel for mirror finishing provided with super abrasive layer through elastic body
JP2001205548A (en) * 2000-01-28 2001-07-31 Nippei Toyama Corp One side grinding device and method
JP4153857B2 (en) * 2003-04-30 2008-09-24 株式会社日平トヤマ Mirror finishing device
JP2005040899A (en) * 2003-07-22 2005-02-17 Fanuc Ltd Diamond whetstone
JP4103808B2 (en) * 2004-01-22 2008-06-18 信越半導体株式会社 Wafer grinding method and wafer
JP2006055964A (en) * 2004-08-23 2006-03-02 Olympus Corp Smoothing tool
JP2006159323A (en) * 2004-12-03 2006-06-22 Asahi Diamond Industrial Co Ltd Grinding wheel
JP2006218577A (en) * 2005-02-10 2006-08-24 Read Co Ltd Dresser for polishing cloth

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