JP2009214113A - Device and method for cleaning soldering iron - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for cleaning a soldering iron with which the solder residue at the tip of the soldering iron is satisfactorily removed and whose maintenance work is easy. <P>SOLUTION: The soldering iron cleaning device 1 is provided with a suction box 11, a solder residue collecting tube 12, a wonder gun 13 with an ejector and a solder residue collecting part 14. When the ejector of the wonder gun 13 is driven in the state where the tip of the soldering iron 3 is inserted into the insertion hole 33 that the suction box 11 has, negative pressure is generated and the solder residue 5 sticking to the tip of the soldering iron 3 is drawn into the solder residue collecting tube 12. The solder residue collecting part 14 is provided with a separation cylinder 51 in which the solder residue 5 is separated by swirl air current 55 from the air which is sucked in the solder residue collecting tube 12. The solder residue 5 separated in the separation cylinder 51 is collected in a recovery box 52 and the air is cleaned with a cleaning filter 54. In the inside of the suction box 11, labyrinth structure 37 is formed with a plurality of vertical plates 36 for trapping the solder residue 5. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention mainly relates to a cleaning device for removing molten solder adhering to a tip surface of a soldering iron.

This type of soldering iron cleaning device is disclosed in Patent Documents 1 and 2, for example. The solder iron tip cleaner of Patent Document 1 includes a box-shaped cleaner body and a nozzle capable of ejecting compressed air. The solder scum cleaning device of Patent Document 2 includes a box-shaped cleaner case and a spray nozzle inside the cleaner case. Each of the soldering iron cleaning devices of Patent Documents 1 and 2 is configured to blow away solder by compressed air ejected from a nozzle.
JP-A-9-308966 JP 2004-276081 A

Further, a soldering iron cleaning device disclosed in Patent Document 3 includes a cleaning head having an intake hole into which at least a part of a soldering iron tip can be inserted, and an intake air flow generation means for generating a suction gas flow in the intake hole. . With this configuration, the solder in the molten state remaining on the surface of the tip of the solder is removed by suction by bringing the tip of the heated soldering iron close to or inserted into the intake hole.
JP 2006-150408 A

  However, since the configurations of Patent Documents 1 and 2 blow air to the tip of the soldering iron, the blown-off solder scraps may adhere to the soldering iron again due to the reflection of the blowing air in the casing. . As a result, when solder is applied, the solder scraps may drop from the tip of the solder onto the substrate or adhere to a product housing or the like, causing defects.

  In this regard, with the configuration of Patent Document 3 in which the soldering iron tip is sucked by the intake air flow and the residual solder is removed, it is considered that the phenomenon that the residual solder reattaches to the ironing tip can be avoided. However, the cleaning device of Patent Document 3 has a configuration in which all the sucked residual solder is adsorbed by the heat-resistant filter, and maintenance work for replacing the heat-resistant filter has been frequently required. Moreover, the heat-resistant filter is expensive, which causes a running cost to increase.

  The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a soldering iron cleaning apparatus that can satisfactorily remove solder scraps at the tip of the soldering iron and reduce maintenance costs. .

Means and effects for solving the problems

  The problems to be solved by the present invention are as described above. Next, means for solving the problems and the effects thereof will be described.

  According to the 1st viewpoint of this invention, the soldering iron cleaning apparatus of the following structures is provided. That is, this soldering iron cleaning apparatus includes a housing, a solder waste collection path, a suction portion, and a solder waste collection portion. The housing has an insertion hole into which a tip of a soldering iron can be inserted. The solder waste collection path communicates with the inside of the housing. The suction part sucks air into the solder waste collecting path. The solder waste collection unit collects the solder waste sucked into the solder waste collection path. The solder waste collection unit includes a cyclone separation unit, a separation solder waste collection unit, and a filter unit. The cyclone separation unit centrifuges the solder waste from the air sucked into the solder waste collection path by a swirling airflow. The separation solder waste collecting unit collects the solder waste separated by the cyclone separation unit. The filter unit purifies the air separated by the cyclone separation unit. The suction part is configured to be able to generate a negative pressure capable of drawing the solder scraps attached to the tip of the soldering iron into the solder scrap collecting path without blowing air to the soldering iron. A labyrinth structure is formed inside the casing by a plurality of internal walls that trap the solder waste.

  Thereby, it can suppress that the removed solder waste adheres again to the front-end | tip of soldering iron, or can be made almost zero. Therefore, it is possible to satisfactorily reduce the occurrence of defects due to solder scraps during the soldering operation. Moreover, since the labyrinth structure is formed inside the housing, most of the solder waste can be collected by the portion of the labyrinth structure. Therefore, since the amount of solder waste collected by the downstream solder waste collecting part (filter part) can be remarkably reduced, maintenance on the solder waste collecting part side is facilitated, and the necessary maintenance frequency can be reduced. . Furthermore, since the solder waste is separated and collected by the swirling airflow in the solder waste collecting portion, an inexpensive filter portion is sufficient, and the cost can be reduced. In addition, clogging of the filter unit is suppressed, and cleaning of the housing and the separated solder waste collecting unit is easy, so that the burden of maintenance work can be reduced.

  In the soldering iron cleaning device, the suction part preferably includes an ejector-type vacuum pump.

  Thereby, a negative pressure sufficient to collect solder waste can be realized with a simple configuration. Also, running costs can be reduced and maintenance work can be made almost unnecessary.

  In the soldering iron cleaning apparatus, it is preferable that the labyrinth structure is configured to be removable from the housing.

  Thereby, when solder waste accumulates in the housing, the labyrinth structure can be removed from the housing and easily cleaned.

  The soldering iron cleaning apparatus preferably includes a base plate disposed on an inner bottom surface of the housing, and a plurality of inner walls among the inner walls constituting the labyrinth structure are fixed to the base plate. .

  Thereby, the labyrinth structure with a high effect of trapping solder scraps can be realized with a simple configuration.

  In the said soldering iron cleaning apparatus, it is preferable that the said some housing | casing, the said solder waste collection path | route, and the said suction part are connected to the said common solder waste collection part.

  Thereby, since the number of installation of a solder waste collection part can be decreased, equipment cost can be reduced. In addition, since the number of facilities to be maintained is reduced, the burden of maintenance work can be further reduced.

  According to a second aspect of the present invention, a soldering iron that inserts a soldering iron into the housing of the soldering iron cleaning device and drives the suction part in that state to collect the soldering waste by the soldering waste collecting part. A cleaning method is provided.

  Thereby, it can suppress that the removed solder waste adheres again to a soldering tip, or can be made almost zero. Therefore, it is possible to satisfactorily reduce the occurrence of defects due to solder scraps during the soldering operation. In addition, most of the solder scraps can be collected by the labyrinth structure inside the housing. Therefore, since the solder waste collected by the downstream solder waste collection part can be remarkably reduced, the maintenance of the solder waste collection part side becomes easy, and the necessary maintenance frequency can be reduced. Furthermore, since the solder waste is separated and collected by the swirling airflow in the solder waste collecting portion, an inexpensive filter portion is sufficient, and the cost can be reduced. In addition, clogging of the filter unit is suppressed, and cleaning of the housing and the separated solder waste collecting unit is easy, so that the burden of maintenance work can be reduced.

  Next, embodiments of the invention will be described. 1 is a schematic side view showing an overall configuration of a soldering iron cleaning apparatus according to an embodiment of the present invention, FIG. 2 is a side view showing two comparative examples, and FIG. 3 is a side view showing a modification of the soldering iron cleaning apparatus. It is.

  A soldering iron cleaning device 1 shown in FIG. 1 is installed in a production line for a connector (smart connector) incorporating a circuit board. In this production line, a soldering robot 2 for automatically soldering electronic components to a substrate by so-called pulling solder is arranged.

  The soldering iron cleaning device 1 is for cleaning the soldering iron tip 4 of the soldering iron 3 provided in the soldering robot 2. This soldering iron cleaning device 1 includes a suction box (housing) 11, a solder waste collection tube (solder waste collection path) 12, a wonder gun (suction unit) 13 having an unillustrated ejector, and a solder waste collection. Part 14.

  The suction box 11 includes a main body 31 that is formed in a box shape with the top opened, and a cover 32 that closes the upper surface of the main body 31. An insertion hole 33 is formed in the cover 32 in a penetrating manner, and the tip 4 of the soldering iron 3 can be inserted into the insertion hole 33 from above. The cover 32 is openable and closable, and facilitates maintenance work such as cleaning of solder scraps 5 to be described later.

  A collection unit 34 made of, for example, a metal plate is accommodated inside the suction box 11. The collection unit 34 includes a horizontal base plate 35 that substantially covers the inner bottom surface of the suction box 11, and a plurality of vertical plates (inner walls) 36 erected from the base plate 35. The vertical plates 36 are arranged alternately at upper and lower positions or at different intervals while being different in height, whereby a labyrinth structure 37 is formed inside the suction box 11. A connection pipe 38 is installed on the side of the suction box 11 at a position corresponding to the outlet of the labyrinth structure 37.

  The suction side of the wonder gun 13 is connected to the connection pipe 38. A solder waste collecting tube 12 is connected to the discharge side of the wonder gun 13. An unillustrated ejector is disposed in the wonder gun 13, and steam or the like is injected from a nozzle provided in the ejector at a pressure of about 0.5 MPa, for example, from the connecting pipe 38 side to the solder waste collecting pipe 12 side. Air can be aspirated.

  When the ejector of the wonder gun 13 is driven, the inside of the suction box 11 connected to the suction side becomes an appropriate negative pressure, so that a suction flow having an appropriate strength acts on the insertion hole 33. Can do. Therefore, by driving the ejector with the tip 4 inserted into the insertion hole 33, for example, about 1 mm to several mm, the spherical shape attached to the tip 4 (without blowing air to the soldering iron 3). Solder scraps (solder balls) and flux can be sucked and collected.

  From the viewpoint of causing a good suction flow to act on the soldering iron 3, the size of the insertion hole 33 is such that a gap of about 1 mm to several mm can be formed around the inserted tip 4. It is preferable that Further, in order to prevent the solder scrap 5 from adhering to the inner wall of the insertion hole 33 and closing the insertion hole 33, the cover 32 is about 1 mm or less around at least the insertion hole 33. It is preferable to form in thickness.

  The ejector of the wonder gun 13 does not need to be driven at all times, and if the solder tip 3 is driven for a while with the tip of the soldering iron 3 inserted, the solder scraps 5 attached to the tip 4 can be sufficiently removed. The driving time is sufficient even if it is 1 second or less, and can be about 0.5 seconds, for example. Thus, by intermittently driving the ejector, it is possible to save air consumption. In addition, a pressure gauge 42 is installed in the connecting pipe 38 so that it can be confirmed whether, for example, the wonder gun 13 is clogged or the like and the suction force is not reduced.

  As described above, the labyrinth structure 37 is formed inside the suction box 11. Accordingly, a considerable amount of the solder scraps 5 and the flux scattered from the tip 4 of the soldering iron 3 is collected by the labyrinth structure 37 before being discharged from the connecting pipe 38. Therefore, most of the solder scraps 5 and the flux can be collected at the suction box 11, and the maintenance is excellent. The solder scraps 5 trapped at the portion of the labyrinth structure 37 can be easily cleaned by opening the cover 32 of the suction box 11 and removing the collection unit 34 from the suction box 11.

  One end of the solder waste collecting tube 12 is connected to a solder waste collecting portion 14 for collecting the solder waste sucked into the solder waste collecting tube 12. The solder waste collecting unit 14 includes a separation cylinder (cyclonic separation part) 51 formed in a conical cylinder shape, a recovery box (separation solder waste collection part) 52 connected to a lower part of the separation cylinder 51, and a separation cylinder. An exhaust cylinder 53 connected to the upper part of the cylinder 51 and a purification filter (filter part) 54 installed in the exhaust cylinder 53 are provided.

  The solder waste collecting pipe 12 is connected to the separation cylinder 51 in an appropriate direction, and an air flow from the solder waste collection pipe 12 is introduced tangentially to the conical cylindrical separation cylinder 51. It is configured as follows. Therefore, a swirling airflow 55 is generated inside the separation cylinder 51 by introducing an air flow into the separation cylinder 51 by driving the ejector. Centrifugal action is performed by this swirling airflow, and foreign matters such as solder scraps 5 and flux are separated from the air and fall into a lower collection box 52.

  The air from which the foreign matters such as the solder scrap 5 and the flux are separated is guided to the upper exhaust cylinder 53 and purified by passing through the purification filter 54. The purification filter 54 is a filter having a performance capable of collecting about 99% of the solder scrap 5 and the flux having a size of up to 0.3 μm, for example, and a paper pack filter, a HEPA filter, an activated carbon filter, or the like may be used. it can.

  The soldering iron cleaning device 1 having the above-described configuration includes the suction box 11 having the labyrinth structure 37 and the cyclone separation-type solder debris collecting unit 14, so that most of the solder debris 5 before passing through the purification filter 54. Can be trapped with a simple configuration. Therefore, the maintenance cost of the purification filter 54 and the like can be significantly reduced. Hereinafter, the effect of this embodiment will be described in relation to the two comparative examples shown in FIG.

  2A shows a soldering iron cleaning device 1a of a first comparative example. In this soldering iron cleaning device 1a, a paper pack filter type solder waste collecting portion 14a is connected to the tip of the solder waste collecting tube 12. FIG. ing. The solder waste collecting portion 14 a accommodates a bag-shaped paper pack filter 57 inside the casing 56, and the paper pack filter 57 is fixed to one end of the solder waste collecting tube 12. A purification filter 54 is installed on the upper portion of the casing 56. In addition, in this 1st comparative example, since the structure of the upstream from the solder waste collection pipe 12 is the same as that of embodiment of FIG. 1, description is abbreviate | omitted.

  FIG. 2B shows a soldering iron cleaning device 1b of a second comparative example. In this soldering iron cleaning device 1b, a pre-filter type solder waste collecting portion 14b is connected to the tip of the solder waste collecting tube 12. Yes. The soldering iron cleaning device 1 b includes a pre-filter 58 on the wall portion of the casing 56, and a purification filter 54 is installed on a side portion of the casing 56. In the second comparative example, the configuration upstream of the solder waste collecting pipe 12 is the same as that in the embodiment of FIG.

  In the soldering iron cleaning device 1a of FIG. 2A, the configuration of the solder waste collecting portion 14a itself can be slightly simplified, but a large amount of solder waste 5 discharged from the solder waste collecting tube 12 is removed by the paper pack filter 57. Due to the captured configuration, the paper pack filter 57 is immediately clogged, and for example, it is necessary to change the filter twice a day. Moreover, since the paper pack filter 57 cannot be cleaned and reused, the running cost increases. In addition, the soldering iron cleaning device 1b of FIG. 2B can simplify the configuration of the solder waste collecting portion 14b itself, and the filter replacement frequency can be suppressed to several times a month, but the prefilter 58 itself is equivalent. It is difficult to clean and reuse the pre-filter 58. Therefore, the running cost also increases in the configuration of the second comparative example.

  On the other hand, in the cyclone-type solder debris collector 14 of FIG. 1, the purification filter 54 can maintain the same air purification capability as the above comparative example with maintenance twice a month, and suction Since the solder scraps 5 in the box 11 and the recovery box 52 can be removed by simple cleaning, they can be used continuously for a long time. Therefore, the configuration of this embodiment can significantly reduce the running cost as compared with the first comparative example and the second comparative example.

  Furthermore, the inventor of the present application further performs soldering when the suction of the tip of the soldering iron 3 is repeated a predetermined number of times for each of the configuration of the embodiment shown in FIG. 1 and the comparative example in which the labyrinth structure 37 inside the suction box 11 is omitted. An experiment was conducted to examine the amount of waste 5 discharged from the suction box 11. Then, compared with the structure of FIG. 1, in the case without a labyrinth structure, the amount of solder waste discharged from the suction box 11 increased approximately twice. Thereby, it can be said that the labyrinth structure 37 of the suction box 11 also contributes greatly to the reduction of the above-mentioned running cost by reducing the necessary maintenance frequency of the purification filter 54.

  As described above, the soldering iron cleaning device 1 of the present embodiment includes the suction box 11, the solder waste collection tube 12, the wonder gun 13 including the ejector, and the solder waste collection unit 14. The suction box 11 has an insertion hole 33 into which the tip (tip 4) of the soldering iron 3 can be inserted. The solder waste collecting tube 12 is in communication with the inside of the suction box 11. The wonder gun 13 sucks air into the solder waste collecting tube 12 by driving the ejector. The solder waste collection unit 14 collects the solder waste 5 sucked into the solder waste collection pipe 12. The solder scrap collecting unit 14 includes a separation cylinder 51, a recovery box 52, and a purification filter 54. The separation cylinder 51 centrifuges the solder waste 5 from the air flowing through the solder waste collecting pipe 12 by a swirling airflow. The collection box 52 collects the solder waste 5 separated by the separation cylinder 51. The purification filter 54 purifies the air separated by the separation cylinder 51. The wonder gun 13 is driven by the ejector so that a negative pressure capable of drawing the solder scrap 5 attached to the tip of the soldering iron 3 into the solder scrap collecting pipe 12 without blowing air to the soldering iron 3. It is configured to be generated. A labyrinth structure is formed in the suction box 11 by a plurality of vertical plates 36 that trap the solder waste 5.

  Thereby, it can suppress that the removed solder waste 5 adheres again to the iron tip 4, or can be made almost zero. Therefore, it is possible to satisfactorily reduce the occurrence of defects due to the solder scrap 5 during soldering. Further, since the labyrinth structure 37 is formed inside the suction box 11, most of the solder scraps 5 and the like can be collected at this portion. Therefore, since the solder waste 5 collected by the downstream solder waste collection part 14 can be remarkably reduced, the maintenance of the solder waste collection part 14 side becomes easy, and the necessary maintenance frequency can be reduced. Furthermore, since the solder waste 5 is separated and collected by the swirl airflow 55 in the solder waste collecting portion 14, an inexpensive filter (for example, a paper filter) is sufficient as the purification filter 54, and the cost can be reduced. . Further, since the clogging of the purification filter 54 is suppressed, the necessary maintenance frequency can be further reduced, and the inside of the suction box 11 and the collection box 52 can be easily cleaned, and the maintenance work is facilitated.

  Further, the soldering iron cleaning device 1 of the present embodiment is configured to suck air into the solder waste collecting pipe 12 by an ejector type vacuum pump (ejector) provided in the wonder gun 13.

  Thereby, the negative pressure sufficient to collect the solder scraps 5 can be realized with a simple configuration. Also, running costs can be reduced and maintenance work is almost unnecessary.

  Further, in the soldering iron cleaning apparatus 1 of the present embodiment, the labyrinth structure 37 is configured to be removable from the suction box 11 for each collection unit 34.

  Thereby, when the solder waste 5 accumulates in the suction box 11, the labyrinth structure 37 can be removed from the suction box 11 and easily cleaned.

  Further, the soldering iron cleaning apparatus 1 of the present embodiment includes a base plate 35 disposed on the inner bottom surface of the suction box 11. A plurality of vertical plates 36 among the vertical plates 36 constituting the labyrinth structure 37 are fixed to the base plate 35.

  Thereby, the labyrinth structure 37 with a high trap effect is realizable with a simple structure.

  Further, in the soldering iron cleaning device 1 of the present embodiment, the tip 4 of the soldering iron 3 is inserted into the suction box 11 and the ejector of the wonder gun 13 is driven in this state by the solder dust collecting unit 14. The soldering iron 3 is cleaned by a method of collecting the solder waste 5.

  Thereby, it can suppress that the removed solder waste 5 adheres again to the iron tip 4, or can be made almost zero. Therefore, the occurrence of defects in the production line can be effectively reduced. Moreover, since the quantity of the solder waste 5 collected by the downstream solder waste collection part 14 can be remarkably reduced, the maintenance cost of the solder waste collection part 14 side can be reduced.

  Next, a modification of the above embodiment will be described with reference to FIG. FIG. 3 is a side view showing a modified example of the soldering iron cleaning apparatus. In this modification, the same or similar components as those in FIG. 1 may be denoted by the same reference numerals and description thereof may be omitted.

  In the soldering iron cleaning device 1x of the modified example shown in FIG. 3, the two suction boxes 11, the solder waste collecting pipe 12, and the wander gun 13 are commonly connected to one solder waste collecting portion 14. It has become. Specifically, each of the solder waste collecting pipes 12 joins at a Y-shaped joining portion 44 and is then connected to the separation cylinder 51 of the solder waste collecting portion 14. Each solder waste collecting pipe 12 is provided with a check valve 45 so that the air containing the solder waste 5 and the like flows from the solder waste collecting pipe 12 on one side to the solder waste collecting pipe on the other side. Backflow to 12 is prevented.

  In the example of FIG. 3, the state in which the solder scrap 5 of the soldering iron 3 is cleaned in the suction box 11 on the upper side in the drawing is shown. However, the cleaning timing can be arbitrarily determined, and the two suction boxes 11 can be cleaned simultaneously.

  As described above, in the soldering iron cleaning device 1x of the modified example of FIG. 3, the plurality of suction boxes 11, the solder waste collecting pipe 12, and the wonder gun 13 are connected to a common solder waste collecting portion 14. Yes.

  Thereby, the installation number of the solder waste collection part 14 can be decreased, and equipment cost can be reduced. In addition, since the number of facilities to be maintained is reduced, the burden of maintenance work can be further reduced.

  Although the preferred embodiment of the present invention has been described above, the above configuration can be changed as follows, for example.

  The number and interval of the vertical plates 36 in the labyrinth structure 37 are not limited to those shown in FIG.

  Instead of the wonder gun 13 with the ejector, for example, air can be sucked into the solder waste collecting pipe 12 by a vacuum pump or a blower. However, the configuration of the above-described embodiment in which air is sucked using the wonder gun 13 and the ejector is advantageous in that the running cost can be reduced and there is no fear of breakage due to the flux contained in the air.

  The separation cylinder 51 can be changed to be cylindrical, for example, instead of being conical.

  Instead of the configuration in which the purification filter 54 is installed above the exhaust cylinder 53, an appropriate pipe can be connected to the upper portion of the exhaust cylinder 53 and the purification filter 54 can be installed at the end of this pipe.

  In the modification of FIG. 3, the two suction boxes 11, the solder waste collecting pipe 12, and the wonder gun 13 are connected to one solder waste collecting portion 14. For example, three or more suction boxes 11 or the like are used. The configuration can be changed to connect.

  In the above embodiment, an example in which the soldering iron cleaning device 1 is applied to a smart connector production line is shown, but the present invention can also be applied to a soldering process of electronic components in other products.

1 is a schematic side view showing an overall configuration of a soldering iron cleaning apparatus according to an embodiment of the present invention. The side view which shows two comparative examples. The side view which shows the modification of a soldering iron cleaning apparatus.

Explanation of symbols

1 Soldering iron cleaning device 11 Suction box (housing)
12 Solder waste collection path 13 Wonder gun (suction part)
14 Solder waste collection part 51 Separation cylinder (Cyclone separation part)
52 Recovery box (separated solder waste collecting part)
54 Purification filter (filter part)
33 Insertion hole 37 Labyrinth structure

Claims (6)

A housing having an insertion hole into which the tip of the soldering iron can be inserted;
A solder debris collection path in communication with the interior of the housing;
A suction part for sucking air into the solder waste collecting path;
A solder waste collecting section for collecting the solder waste sucked into the solder waste collecting path;
With
The solder scrap collecting part is
A cyclone separation unit that centrifuges the solder waste from the air sucked into the solder waste collection path by a swirling airflow;
A separation solder waste collecting part for collecting solder waste separated by the cyclone separation part,
A filter unit for purifying the air separated by the cyclone separation unit;
With
The suction part is configured to be able to generate a negative pressure capable of drawing the solder scraps attached to the tip of the soldering iron into the solder scrap collecting path without blowing air to the soldering irons,
A soldering iron cleaning apparatus, wherein a labyrinth structure is formed inside the casing by a plurality of internal walls for trapping the solder waste. The soldering iron cleaning device according to claim 1,
The soldering iron cleaning apparatus, wherein the suction part includes an ejector type vacuum pump. The soldering iron cleaning apparatus according to claim 1 or 2,
The soldering iron cleaning device, wherein the labyrinth structure is configured to be removable from the housing. The soldering iron cleaning device according to claim 3,
A base plate disposed on the inner bottom surface of the housing;
A soldering iron cleaning device, wherein a plurality of inner walls among the inner walls constituting the labyrinth structure are fixed to the base plate. The soldering iron cleaning apparatus according to any one of claims 1 to 4,
A plurality of the casings, the solder waste collection path, and the suction part are connected to a common solder waste collection part.   The soldering iron is inserted into the housing of the soldering iron cleaning device according to any one of claims 1 to 5, and the suction unit is driven in this state to collect the soldering waste by the soldering waste collecting unit. A method for cleaning soldering irons.

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