JP2009212170A5 - - Google Patents

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Publication number
JP2009212170A5
JP2009212170A5 JP2008051396A JP2008051396A JP2009212170A5 JP 2009212170 A5 JP2009212170 A5 JP 2009212170A5 JP 2008051396 A JP2008051396 A JP 2008051396A JP 2008051396 A JP2008051396 A JP 2008051396A JP 2009212170 A5 JP2009212170 A5 JP 2009212170A5
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JP
Japan
Prior art keywords
semiconductor layer
layer
thin film
film transistor
buffer layer
Prior art date
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JP2008051396A
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Japanese (ja)
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JP2009212170A (en
JP5235454B2 (en
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Publication date
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Priority to JP2008051396A priority Critical patent/JP5235454B2/en
Priority claimed from JP2008051396A external-priority patent/JP5235454B2/en
Publication of JP2009212170A publication Critical patent/JP2009212170A/en
Publication of JP2009212170A5 publication Critical patent/JP2009212170A5/ja
Application granted granted Critical
Publication of JP5235454B2 publication Critical patent/JP5235454B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (7)

ゲート絶縁層を介してゲート電極と重畳する微結晶半導体層と、
前記微結晶半導体層上に重ねて設けられたバッファ層と、
前記バッファ層及び前記微結晶半導体層の側面を被覆する非晶質半導体層と、
一端部が前記バッファ層と重なり、前記非晶質半導体層上に設けられ、ソース領域及びドレイン領域を形成する一対の不純物半導体層と
を有し、
前記バッファ層は非晶質半導体材料、無機絶縁材料又は有機絶縁材料からなり、
前記微結晶半導体層の上面はすべて前記バッファ層により被覆され、
前記バッファ層の膜厚が、前記非晶質半導体層の膜厚よりも厚いことを特徴とする薄膜トランジスタ。
A microcrystalline semiconductor layer overlapping with the gate electrode through the gate insulating layer;
A buffer layer provided over the microcrystalline semiconductor layer;
An amorphous semiconductor layer covering side surfaces of the buffer layer and the microcrystalline semiconductor layer;
One end portion overlaps the buffer layer, and is provided on the amorphous semiconductor layer, and has a pair of impurity semiconductor layers forming a source region and a drain region,
The buffer layer is made of an amorphous semiconductor material, an inorganic insulating material or an organic insulating material,
The upper surface of the microcrystalline semiconductor layer is all covered with the buffer layer,
A thin film transistor, wherein the buffer layer is thicker than the amorphous semiconductor layer.
請求項1において、
前記微結晶半導体層の電気伝導度が1×10−5S/cm乃至5×10−2S/cmであることを特徴とする薄膜トランジスタ。
In claim 1,
A thin film transistor, wherein the microcrystalline semiconductor layer has an electric conductivity of 1 × 10 −5 S / cm to 5 × 10 −2 S / cm.
請求項2において、
前記微結晶半導体は微結晶シリコンであることを特徴とする薄膜トランジスタ。
In claim 2,
The thin film transistor, wherein the microcrystalline semiconductor layer is a microcrystalline silicon layer .
請求項1乃至3のいずれか一項において、
前記非晶質半導体層が非晶質シリコンであることを特徴とする薄膜トランジスタ。
In any one of Claims 1 thru | or 3,
A thin film transistor, wherein the amorphous semiconductor layer is an amorphous silicon layer .
請求項1において、
前記バッファ層の膜厚は、前記微結晶半導体層及び前記非晶質半導体層のそれぞれの膜厚よりも厚いことを特徴とする薄膜トランジスタ。
In claim 1,
Thickness of the buffer layer, a thin film transistor, wherein thicker than the film thickness of the microcrystalline semiconductor layer and the amorphous semiconductor layer.
請求項1において、
前記バッファ層の膜厚が500nm乃至3000nmであり、前記非晶質半導体層の膜厚が50nm以上500nm未満であることを特徴とする薄膜トランジスタ。
In claim 1,
A thin film transistor, wherein the buffer layer has a thickness of 500 nm to 3000 nm, and the amorphous semiconductor layer has a thickness of 50 nm to less than 500 nm.
請求項1乃至6のいずれか一項に記載の薄膜トランジスタが画素部の各画素に設けられていることを特徴とする表示装置。 A display device, wherein the thin film transistor according to claim 1 is provided in each pixel of a pixel portion.
JP2008051396A 2008-02-29 2008-02-29 Thin film transistor and display device Expired - Fee Related JP5235454B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008051396A JP5235454B2 (en) 2008-02-29 2008-02-29 Thin film transistor and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008051396A JP5235454B2 (en) 2008-02-29 2008-02-29 Thin film transistor and display device

Publications (3)

Publication Number Publication Date
JP2009212170A JP2009212170A (en) 2009-09-17
JP2009212170A5 true JP2009212170A5 (en) 2011-03-31
JP5235454B2 JP5235454B2 (en) 2013-07-10

Family

ID=41185059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008051396A Expired - Fee Related JP5235454B2 (en) 2008-02-29 2008-02-29 Thin film transistor and display device

Country Status (1)

Country Link
JP (1) JP5235454B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5832780B2 (en) * 2011-05-24 2015-12-16 株式会社半導体エネルギー研究所 Manufacturing method of semiconductor device
KR20150011472A (en) * 2013-07-23 2015-02-02 삼성디스플레이 주식회사 Thin film transistor and method of manufacturing the same
DE102016113049A1 (en) 2016-07-15 2018-01-18 Frank Killich Optical arrangement for compensating for misalignment of a reflector with respect to a light source

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100257158B1 (en) * 1997-06-30 2000-05-15 김영환 Thin film transistor and method for manufacturing the same
JP2005167051A (en) * 2003-12-04 2005-06-23 Sony Corp Thin film transistor and manufacturing method thereof
JP2006156972A (en) * 2004-10-28 2006-06-15 Semiconductor Energy Lab Co Ltd Semiconductor device and preparing method of the same
JP2007121788A (en) * 2005-10-31 2007-05-17 Hitachi Displays Ltd Active matrix substrate and liquid crystal display apparatus using the same

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