JP2009209209A - Microcapsule and microcapsule-containing curable resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a microcapsule of a liquid amine compound which is easy to produce, has stabilized quality, and furthermore achieves both handling properties and storage stability when mixed with a curable resin and used as a curing agent or a curing accelerator. <P>SOLUTION: The microcapsule has a component (A) of the liquid amine compound having an acid dissociation constant (pKa) of not smaller than 8.0, a component (B) of a porous fine particle powder capable of absorbing the component (A), and a component (C) of an acid anhydride as constituting components and is obtained by allowing the component (B) as a capsule carrier to absorb the component (A) and subjecting the component (A) present on the surface of the component (B) and the component (C) to chemical treatment to form a film. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

The present invention relates to a microcapsule containing a liquid amine compound optimal as a curing agent or curing accelerator for a curable resin, and a curable resin composition using the microcapsule.

In general, thermosetting resin compositions such as epoxy resins, which are used for applications such as adhesives, sealants, and coating agents, have a curing agent as a component for crosslinking and curing reactions. A curing accelerator is added as a component for improving. In particular, epoxy adduct compounds, organophosphorus compounds, organic amine compounds, imidazole derivative compounds, etc. are known as curing agents or curing accelerators that have the potential to make one liquid, especially organic amine compounds. Is used as a liquid curing agent or curing accelerator.

As the epoxy adduct compound, a reaction product obtained by reacting an epoxy resin typified by a bisphenol A type epoxy resin or the like with an amine compound is generally used. It is known to use a finely pulverized powder of an epoxy adduct compound as a curing agent or curing accelerator for an epoxy resin. Patent Document 1 discloses a method of forming a shell by reacting an epoxy resin on the surface of an epoxy adduct compound powder. However, the manufacturing process is complicated and considerable accuracy is required for manufacturing. In addition, since the core powder is already an amine compound in which an epoxy resin is adducted, the reactivity of the amine has already been reduced, and it takes a considerable time to form a shell. These epoxy adduct compounds are usually highly reactive and easy to handle, but depending on the composition of the components, satisfactory curing properties may not be obtained without sufficient curing. Also, when this epoxy adduct compound is kneaded into a compound having an epoxy group, thixotropy (thixotropy), which is thought to be derived from the amine structure on the surface of the curing agent, is likely to occur, and the handling is hindered due to its properties. It becomes necessary to limit the amount of addition. Naturally, when the added amount is reduced, there is a problem that curability is lowered.

The organophosphorus compound is useful as a catalyst for curing an epoxy resin with phenol novolac, but has the disadvantage of being difficult to disperse because it is solid, and in order to improve dispersibility, it is made into a fine powder form. Although it is used, it is unsatisfactory as a dispersion method, and this method cannot provide catalyst latency. Liquid organic amine compounds or imidazole derivatives are often used as curing agents or catalysts for epoxy resins and phenol resins, but many have unique odors and toxicity. Extremely short. Further, in the case of a solid material, there are problems such as difficulty in dispersion. With regard to the pot life, by using a special imidazole salt, a certain degree of latency can be provided. That is, it may be possible to carry out the dispersion step, the kneading step, and the shaping step in the raw material at or below the catalyst ability expression temperature and the crosslinking step at or above the catalyst ability expression temperature. However, the effect is incomplete and has the disadvantage of slowing the curing reaction.

By the way, DBU (1,8-diazabicyclo [5.4.0] undec-7-ene) represented by Chemical Formula 1 as an amine curing agent / curing accelerator, DBN (1,5- A compound called diazabicyclo [4.3.0] non-5-ene) is known. DBU and DBN are ones that show the strongest basicity in organic compounds. Due to their strong basicity, stability, and solubility in a wide range in organic solvents, in curing systems where curing is promoted by amine compounds such as epoxy resins. It is used as a powerful curing accelerator.

When a strongly basic compound containing DBU and DBN is used as a curing agent for a curable resin composition, the curing reaction proceeds very rapidly due to its high basicity, but simply mixing with a curable resin. It was difficult to maintain storability, and it was difficult to use in a one-component curable resin composition excellent in workability and handling.

In view of this, studies have been conducted to microencapsulate DBU and DBN for the purpose of imparting preservability in a curable resin composition to a curing accelerator such as DBU and DBN. Patent Document 2 exemplifies a technique of microencapsulating a liquid amine compound containing DBU by an interfacial precipitation method, an interfacial polymerization method, a submerged cured coating method, or the like. These general encapsulation methods use at least one of water and a solvent and perform the reaction in a compatible system in which the amine compound is dissolved, so that it was difficult to take out uniform microcapsules. In particular, since DBN and DBU have very good compatibility with water and solvents, it has been extremely difficult to take out uniform capsules with a high yield by the above-described encapsulation. Furthermore, since these general encapsulation methods involve heating for synthesizing the capsule and stirring for a long time, there is also a problem that even if the capsule is formed, the liquid amine compound is eluted from the microcapsule.

On the other hand, Patent Documents 3 to 5 report techniques for microencapsulating a component that can be a curing accelerator in fine particles. In Patent Documents 3 and 4, the fine particles are simply absorbed by a component that can be a curing accelerator, and the capsule contents can be easily eluted with a weak stimulus. For this reason, there is a problem that a curing reaction is easily caused only by mixing with a curable resin, and a component that becomes a liquid curing accelerator is made solid to facilitate handling.

Furthermore, in Patent Document 5, an amine catalyst containing DBU is supported on a fine powder, and then the fine powder is encapsulated by coating the surface of the fine powder with a solid component. However, in this method, since the surface is merely coated with a solid component, the solid component film is easily destroyed by the influence of heat or mechanical stimulation, and stable microcapsules cannot be obtained.

Japanese Patent Publication No. 7-5708 JP-A-1-287131 JP 7-323668 A JP 2001-55473 A JP-A-8-157570

It has been difficult to stabilize the quality of the liquid amine compound microcapsules produced by the above-described technique. Further, when mixed with a curable resin and used as a curing agent or a curing accelerator, the handling property and the storage stability cannot be achieved at the same time. No practical microcapsule shell component and shell formation method that satisfies these characteristics has been devised.

As a result of intensive studies to improve these problems in view of the above circumstances, the present inventors can easily microencapsulate liquid amine compounds including DBU and DBN with little variation in quality. Moreover, since the microcapsule is excellent in stability when used as a curing agent or curing accelerator for a curable resin, a microcapsule capable of forming a one-component curable resin composition having excellent storage stability. A capsule manufacturing method was invented and a patent application was filed.

The gist of the present invention will be described below. In the first embodiment of the present invention, the following components (A) to (C) are used as constituent components, the component (B) is used as a capsule carrier, the component (A) is absorbed, and is present on the surface of the component (B). It is a microcapsule formed by reacting the component (A) and the component (C) to form a film.
(A) Component Liquid amine compound having an acid dissociation constant (pKa) of 8.0 or more, or organic acid salt thereof (B) component Porous fine particle powder (C) component capable of absorbing the component (A) Acid Anhydride

The second aspect of the present invention is a microcapsule in which the component (A) is at least one selected from DBU, DBN, triethylenediamine, derivatives having these as a main skeleton, or organic acid salts thereof.

The 3rd form of this invention is a microcapsule whose said (C) component is an acid anhydride containing a plasticizer.

The 4th form of this invention is a curable resin composition characterized by including the said microcapsule as a hardening | curing agent or a hardening accelerator.

According to a fifth aspect of the present invention, the curable resin composition is at least one curable resin selected from a compound having an epoxy group, a compound having an epithio group, a compound having an isocyanate group, and a compound having a vinyl group. Is a curable resin composition. Here, the curable resin refers to a compound having one or more functional groups having reactivity in one molecule, and these become a cured product by a chemical reaction such as polymerization or addition.

In a sixth aspect of the present invention, the curable resin composition in the fourth aspect is at least one curable resin selected from a compound having an epoxy group and a compound having an epithio group, a polyamine compound, a polyphenol compound, A curable resin composition comprising at least one curing agent selected from a polythiol compound and an acid anhydride and the microcapsule as a curing accelerator.

In this invention, the curable resin composition which can make storage stability and sclerosis | hardenability compatible is provided by using the microcapsule containing the optimal liquid amine compound as a hardening accelerator of curable resin.

Details of the present invention will be described below. The component (A) of the present invention is a liquid amine compound having an acid dissociation constant (pKa) of 8.0 or more. Here, the acid dissociation constant is one index for quantitatively representing the strength of the acid, and is represented by a negative common logarithm of the equilibrium constant (Ka) of the dissociation reaction in which protons are released from the acid. A larger pKa value indicates a stronger base.

The component (A) that can be used in the present invention is not particularly limited as long as it is a liquid amine compound having a pKa of 8.0 or more. For example, DBU (pKa12.7), DBN (pKa12.5), diorthotolyl. Examples thereof include guanidine (pKa10.8), laurylamine (pKa10.6), diphenylguanidine (pKa10.1), diventylamine (pKa9.7), and triethylenediamine (pKa8.8). In particular, DBU, DBN, and triethylenediamine have strong nucleophilicity and can easily react with the component (C) described later to form a shell part of the capsule. Therefore, DBU, DBN, triethylenediamine, or derivatives of these compounds It is preferably used alone or as an organic acid salt with DBU, DBN, triethylenediamine carboxylic acid, sulfonic acid, phenols and the like.

When a liquid amine compound having a pKa of 8.0 or less is used, the reaction with the acid anhydride (C) component does not proceed rapidly in the step of forming the capsule film, and the reaction proceeds unless heated. Absent. On the other hand, if the high temperature state is maintained, since the component (A) leaks from the porous fine particle powder (B) component that has absorbed the component (A), a capsule film cannot be stably formed, When the capsule is blended with the curable resin composition, a problem occurs in storage stability.

The component (B) that can be used in the present invention is not particularly limited as long as it is a porous fine particle powder that can absorb the component (A). Specific examples of the material include carbon black, colloidal silica, and fume. Examples include silica, wet silica, magnesium, calcium, barium and other silicates, copper, zinc, aluminum, titanium, tin, iron, cobalt, nickel and other oxides and nitrides. The following porous silica powder is preferred. Examples of commercially available porous silica powder having an average particle size of 20 μm or less include, for example, Godball (silica spherical powder, hollow spherical powder) (manufactured by Suzuki Yushi Kogyo Co., Ltd.), Mizuka Ace (silicic acid amorphous). Powder) (manufactured by Mizusawa Chemical Industry Co., Ltd.), etc. When the average particle diameter of the porous fine particles exceeds 20 μm, the viscosity of the capsule of the present invention becomes too high when mixed with the curable resin, so that the coating property of the curable resin composition is lowered and the composition is separated during storage.・ It tends to settle.

As an index of absorptivity of the porous fine particle powder which is the component (B) of the present invention, it is preferable that it is in the range of 50 to 500 ml / 100 g in the measurement of the oil absorption specified in JIS-K-5101.

Here, the purpose of using the component (B) in the present invention is to pseudo-solidify the component (A).

The component (C) that can be used in the present invention is not particularly limited as long as it is liquid at room temperature, and the acid anhydride as the main component can be polymerized with the component (A) to form a capsule film. . For example, dodecenyl succinic anhydride, polyazelinic anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenone tetracarboxylic anhydride, Examples include tetrabromophthalic anhydride. Specifically, HN-2200, HN-2000, HN-5500, MHAC-P manufactured by Hitachi Chemical Co., Ltd., Rikacid TH, HT-1A, HH, MH-700, MH-700G manufactured by Shin Nippon Chemical Co., Ltd. , HNA-100, TMEG-S, TMEG-100, TMEG-200, TMEG-500, TMEG-600, TMTA-C, TMA-15, DDSA, HF-08, SA, DSDA, TMEG-100, TDA-100 BT-100, EPICLON B-570, B-650, and B-4400 manufactured by Dainippon Ink and Chemicals, Inc. An acid anhydride that is solid at room temperature can be used if it is dissolved in a liquid acid anhydride at room temperature and finally made liquid at room temperature.

As the compound that can react with the component (A), which is a strong base, at room temperature in a short time to form a capsule shell, it is an acid anhydride represented by the above that is indispensable for the present invention. The present invention can be achieved by combining the components A) and (C). That is, in the present invention, the (A) component remains on the surface of the porous fine particle powder (B) component that has absorbed the component (A), and the remaining (A) component and (C) component react with each other. As a result, a capsule shell is formed on the surface of the component (B) as the capsule carrier.

The brittleness of the capsule can also be controlled by including a plasticizer that is easily compatible with the acid anhydride. That is, the capsule can be made brittle by increasing the amount of the plasticizer, and can be made stiff by decreasing the amount. Preferable examples of the plasticizer that can be used here include phthalate ester, adipic ester, and polyester. (C) As a ratio of a component and a plasticizer, it is preferable that a plasticizer is 0.1-50 weight part with respect to 100 weight part of (C) component.

As a specific method for forming capsules, the component (A) and the component (B) are kneaded with a stirrer or the like so that the component (A) is sufficiently absorbed by the component (B). At this time, absorption heat may be generated, so if it generates heat, it is left to cool to room temperature. After the washing solvent is added to the mixture and further stirred, the solid content is filtered by suction filtration or the like, and the solvent is volatilized by a hot air drying furnace or the like to recover the powder. The component (A) remains on the surface of the component (B) after the series of steps has been completed. Next, the component (B) is added to the liquid phase of the component (C), and the components (A) and (C) are reacted by mixing and stirring with a stirrer or the like. Then, after adding the solvent for washing | cleaning and stirring further, solid content is filtered by suction filtration etc., and solid content which remains by volatilizing a solvent with a hot air drying furnace etc. is collect | recovered. This solid component is a liquid amine compound that is microencapsulated.

Although the mechanism by which the component (A) and the component (C) form a capsule film has not been completely elucidated, the component (A) existing on the porous fine particle powder as a capsule carrier, that is, pKa is A liquid amine compound with a strong base of 8.0 or more opens the acid anhydride, and the resulting carboxy anion reacts with another component (C) to polymerize into the structure shown in Chemical Formula 3. It is thought that.

(R1 and R2 represent hydrocarbon groups derived from the respective acid anhydrides of component (C))

A compound having an epoxy group as shown in Chemical formula 4, a compound having an epithio group as shown in Chemical formula 5, a compound having an isocyanate group, a compound having a vinyl group, etc. are compounds that react with an amine compound as a curing agent or a curing accelerator. Therefore, since the amine compound as the component (B) can be used as a curing agent or a curing accelerator for the curable resin, the microcapsule of the present invention has a curing agent having a potential for the curable resin. It can be used as a curing accelerator. The curable resin refers to a compound having at least one reactive epoxy group, epithio group, isocyanate group, or vinyl group in the molecule, and there is no limitation as long as this condition is met. It may have other functional groups at the same time.

For compounds having an epoxy group, compounds having an epithio group, and compounds having an isocyanate group, the amine compound as the component (B) in the constitution of the present invention can be used as a curing agent. The mechanism is that the amine compound becomes an anion and plays a role of ring-opening polymerization of epoxy groups. On the other hand, if a polyamine compound, a polyphenol compound, a polythiol compound, and an acid anhydride are combined as a curing agent together with a compound having an epoxy group and a compound having an epithio group, the amine compound can be used as a curing accelerator. The mechanism is that the amine compound liberates active hydrogen such as polyamine compounds and polyphenol compounds and reacts them with a plurality of epoxy groups or epithio groups. Further, for a compound having a vinyl group, the amine compound can be used as a curing agent for anionic polymerization, and can be used for radical polymerization as a curing accelerator in combination with an organic peroxide. The mechanism is that the amine compound promotes the decomposition of the organic peroxide and easily generates radical species.

Specific examples of the compound having an epoxy group are those obtained by condensation of epichlorohydrin with polyhydric phenols such as bisphenols and polyhydric alcohols, for example, bisphenol A type, brominated bisphenol A type, hydrogenated bisphenol A type. Glycidyl such as bisphenol F type, bisphenol S type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, novolak type, phenol novolak type, orthocresol novolak type, tris (hydroxyphenyl) methane type, tetraphenylolethane type, etc. An ether type epoxy resin can be exemplified. Other glycidyl ester type epoxy resins obtained by condensation of epichlorohydrin with carboxylic acids such as phthalic acid derivatives and fatty acids, glycidyl amine type epoxy resins obtained by reaction of epichlorohydrin with amines, cyanuric acids, hydantoins, and various Examples thereof include, but are not limited to, epoxy resins modified by the method.

Compounds having an epithio group are often described as thiirane compounds in publications and patent documents. Specific examples of the compound having an epithio group include 2,2-bis (4- (2,3-epithiopropoxy) phenyl) propane, bis (4- (2,3-epithiopropoxy) phenyl) methane, , 6-di (2,3-epithiopropoxy) naphthalene, 1,1,1-tris- (4- (2,3-epithiopropoxy) phenyl) ethane, 2,2-bis (4- (2, 3-epithiopropoxy) cyclohexyl) propane, bis (4- (2,3-epithiopropoxy) cyclohexyl) methane, 1,1,1-tris- (4- (2,3-epithiopropoxy) cyclohexyl) ethane 1,5-pentanediol 2,3-epithiocyclohexyl) ether, 1,6-hexanediol di (3,4-epithiooctyl) ether, and the like. The present invention is not limited to.

Specific examples of the compound having an isocyanate group include aromatic diisocyanates such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4′-diphenylmethane diisocyanate, 2 , 2'-diphenylmethane diisocyanate, polyphenylene polymethylene polyisocyanate, 1,5-naphthylene diisocyanate, 1,4-naphthylene diisocyanate, p-phenylene diisocyanate, m-phenylene diisocyanate, o-xylylene diisocyanate, m-xylylene diisocyanate Examples of the aliphatic diisocyanate include tetramethylene diisocyanate, hexamethylene diisocyanate, 2-methyl-1,5-pentane diisocyanate. Such as theft and the like. Examples of the alicyclic diisocyanate include 1-methylcyclohexane-2,4-diisocyanate, isophorone diisocyanate, and dicyclohexylmethane-4,4′-diisocyanate, but are not particularly limited.

As the compound having a vinyl group, a compound having an acryl group, a methacryl group, or a vinyl ether group is preferable. There are monofunctional, bifunctional, trifunctional and polyfunctional monomers and oligomers as compounds having an acrylic group, a methacrylic group and a vinyl ether group. In some cases, radical species are generated by a peroxide and an amine compound to cause a radical polymerization reaction to polymerize. (Hereafter, acrylic and methacryl are collectively called (meth) acrylic)

Monofunctional compounds having a (meth) acryl group include lauryl (meth) acrylate, stearyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, caprolactone-modified tetrahydrofurfuryl (meth) acrylate, cyclohexyl (meth) acrylate, di Cyclopentanyl (meth) acrylate, isobornyl (meth) acrylate, benzyl (meth) acrylate, phenyl (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxytetraethylene glycol (meth) acrylate, nonyl Phenoxyethyl (meth) acrylate, nonylphenoxytetraethylene glycol (meth) acrylate, methoxydiethylene glycol (Meth) acrylate, ethoxydiethylene glycol (meth) acrylate, butoxyethyl (meth) acrylate, butoxytriethylene glycol (meth) acrylate, 2-ethylhexyl polyethylene glycol (meth) acrylate, nonylphenyl polypropylene glycol (meth) acrylate, methoxydipropylene Glycol (meth) acrylate, glycidyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, glycerol (meth) acrylate, polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, Epichlorohydrin (hereinafter abbreviated as ECH) modified butyl (meth) acrylate, ECH modified phenoxy (Meth) acrylate, ethylene oxide (hereinafter abbreviated as EO) modified phthalic acid (meth) acrylate, EO modified succinic acid (meth) acrylate, caprolactone modified 2-hydroxyethyl (meth) acrylate, N, N-dimethylaminoethyl (meta ) Acrylate, N, N-diethylaminoethyl (meth) acrylate, morpholino (meth) acrylate, EO-modified phosphoric acid (meth) acrylate, and the like, but are not limited thereto.

As the bifunctional compound, 1,3-butylene glycol di (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexane glycol di (meth) acrylate , Ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, EO-modified neopentyl glycol di (meth) acrylate, propylene oxide side (Hereinafter abbreviated as PO) modified neopentyl glycol di (meth) acrylate, bisphenol A di (meth) acrylate, EO modified bisphenol A di (meth) acrylate, ECH modified bisphenol A di (me ) Acrylate, EO modified bisphenol S di (meth) acrylate, hydroxypivalate ester neopentyl glycol diacrylate, caprolactone modified hydroxypivalate ester neopentyl glycol diacrylate, neopentyl glycol modified trimethylolpropane di (meth) acrylate, stearic acid Modified pentaerythritol di (meth) acrylate, dicyclopentenyl diacrylate, EO modified dicyclopentenyl di (meth) acrylate, di (meth) acryloyl isocyanurate, and the like are exemplified, but not limited thereto.

Trifunctional compounds include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, EO-modified trimethylolpropane tri (meth) acrylate, PO-modified trimethylolpropane tri (meth) acrylate, and ECH-modified trimethylolpropane. Examples include, but are not limited to, tri (meth) acrylate, ECH-modified glycerol tri (meth) acrylate, tris (acryloyloxyethyl) isocyanurate, and the like.

As the polyfunctional compound, ditrimethylolpropane tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, alkyl-modified dipentaerythritol pentaacrylate, dipentaerythritol hexa (meth) acrylate, Examples include, but are not limited to, caprolactone-modified dipentaerythritol hexa (meth) acrylate.

Examples of the acrylic oligomer include bisphenol A type, novolak type, polyhydric alcohol type, polybasic acid type, polybutadiene type epoxy (meth) acrylate, polyester type, polyether type urethane (meth) acrylate, and the like. It is not limited to.

Examples of the compound having a vinyl ether group include ethylene glycol divinyl ether, 1,3-propanediol divinyl ether, propylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,3-butanediol divinyl ether, and 1,2-butane. Diol divinyl ether, 2,3-butanediol divinyl ether, 1-methyl-1,3-propanediol divinyl ether, 2-methyl-1,3-propanediol divinyl ether, 2-methyl-1,2-propanediol di Vinyl ether, 1,5-pentanediol divinyl ether, 1,6-hexanediol divinyl ether, cyclohexane-1,4-diol divinyl ether, cyclohexane-1,4-dimethanol divinyl ether, Xylene glycol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, tetraethylene glycol divinyl ether, polyethylene glycol divinyl ether, dipropylene glycol divinyl ether, tripropylene glycol divinyl ether, tetrapropylene glycol divinyl ether, polypropylene glycol divinyl ether, Examples thereof include, but are not limited to, ethylene glycol propylene glycol copolymer divinyl ether.

Specific examples of the organic peroxide used for radical polymerization of the (meth) acrylic compound include methyl ethyl ketone peroxide, cyclohexanone peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, methyl Ketone peroxides such as acetoacetate peroxide and acetylacetone peroxide; 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-butylperoxy) cyclohexane Peroxy such as 2,2-bis (t-butylperoxy) octane, n-butyl-4,4-bis (t-butylperoxy) valerate, 2,2-bis (t-butylperoxy) butane Ketals; t-butyl hydroper Xide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, p-menthane hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide Hydroperoxides such as di-t-butyl peroxide, t-butylcumyl peroxide, dicumyl peroxide, α, α'-bis (t-butylperoxy-m-isopropyl) benzene, 2,5-dimethyl Dialkyl peroxides such as 2,5-di (t-butylperoxy) hexane and 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3; acetyl peroxide, isobutyryl per Oxide, octanoyl peroxide, decanoyl Diacyl peroxides such as oxide, lauroyl peroxide, 3,5,5-trimethylhexanoyl peroxide, succinic acid peroxide, benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, m-toluoyl peroxide; Diisopropyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, di-n-propyl peroxydicarbonate, bis- (4-tert-butylcyclohexyl) peroxydicarbonate, dimyristyl peroxydicarbonate, di-2-ethoxy Ethyl peroxydicarbonate, dimethoxyisopropyl peroxydicarbonate, di (3-methyl-3-methoxybutyl) peroxydicarbonate, diallylperoxydicarbonate Peroxydicarbonates such as t-butyl peroxyacetate, t-butyl peroxyisobutyrate, t-butyl peroxypivalate, t-butyl peroxyneodecanoate, cumyl peroxyneodecanoate , T-butylperoxy-2-ethylhexanoate, t-butylperoxy-3,5,5-trimethylhexanoate, t-butylperoxylaurate, t-butylperoxybenzoate, di-t-butyl Peroxyisophthalate, 2,5-dimethyl-2,5-di (benzoylperoxy) hexane, t-butylperoxymaleic acid, t-butylperoxyisopropylcarbonate, cumylperoxyoctoate, t-hexylper Oxyneodecanoate, t-hexyl peroxypi valley , Peroxyesters such as t-butylperoxyneohexanoate, t-hexylperoxyneohexanoate, cumylperoxyneohexanoate; and acetylcyclohexylsulfonyl peroxide, t-butylperoxyallyl carbonate However, it is not limited to these.

The microcapsules of the present invention can be used as a curing agent or a curing accelerator for each of the curable resins mentioned above, and particularly preferably used as a curing accelerator for a compound having an epoxy group or a compound having an epithio group. be able to. At this time, a compound having an epoxy group, a polyamine compound having two or more amino groups in the molecule as a curing agent for curing the compound having an epithio group, a polyphenol compound having two or more phenol groups in the molecule, 2 in the molecule It is particularly preferable in the present invention to use in combination with the above polythiol compound or acid anhydride having a thiol group.

Specific examples of the polyamine compound include diethylenetriamine, triethylenetetramine, metaxylylenediamine, isophoronediamine, 1,3-bisaminomethylcyclohexane, diaminodiphenylmethane, metaphenylenediamine, diaminodiphenylsulfone, dicyandiamide, organic acid dihydrazide, and piperidine. However, it is not limited to this.

Specific examples of the polyphenol compound include novolac type phenol resins obtained by reacting phenols such as phenol and alkylphenol with aldehydes such as formaldehyde and paraformaldehyde, and zylog type phenol resins which are modified phenol novolac resins. And polyhydric phenol resins such as dicyclopentadiene type phenol resin and polyfunctional type phenol resin, but are not limited thereto. Particularly preferred is a polyphenol compound which is liquid at room temperature.

Specific examples of the polythiol compound include 3-methoxybutyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, tridecyl 3-mercaptopropionate, trimethylolpropane tristhiopropionate, and pentaerythritol. Tetrakisthiopropionate, methylthioglycolate, 2-ethylhexylthioglycolate, ethylene glycol bisthioglycolate, 1,4-butanediol bisthioglycolate, trimethylolpropane tristhioglycolate, pentaerythritol tetrakisthioglycolate , Di (2-mercaptoethyl) ether, 1-butanethiol, 1-hexanethiol, cyclohexyl mercaptan, 1,4-butanedithiol, 3-mercapto-2-butanol , Γ-mercaptopropyltrimethoxysilane, benzenethiol, benzyl mercaptan, 1,3,5-trimercaptomethylbenzene, 1,3,5-trimercaptomethyl-2,4,6-trimethylbenzene, terminal thiol group-containing poly Examples include ether, terminal thiol group-containing polythioether, thiol compound obtained by reaction of epoxy compound and hydrogen sulfide, thiol compound having terminal thiol group obtained by reaction of polythiol compound and epoxy compound, and the like. It is not something.

Specific examples of acid anhydrides include dodecenyl succinic anhydride, polyazeline acid anhydride, hexahydrophthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic acid anhydride, trimellitic anhydride, pyromellitic anhydride, Cyclic acid anhydrides such as benzophenonetetracarboxylic anhydride, tetrabromophthalic anhydride, and head acid anhydride are preferred, but are not limited thereto. In addition, polymer type acid anhydrides having two or more acid anhydride skeletons in one molecule, specifically, LIR403 and LIR-410 manufactured by Kuraray Co., Ltd. and VEMA manufactured by Daicel Chemical Industries, Ltd. are also used. be able to.

In the curable resin composition of the present invention, colorants such as pigments and dyes, metal powders, inorganic fillers such as calcium carbonate, talc, silica, alumina, aluminum hydroxide, and the like are used as long as the characteristics of the present invention are not impaired. An appropriate amount of additives such as a flame retardant, an organic filler, a plasticizer, an antioxidant, an antifoaming agent, a silane coupling agent, a leveling agent, a rheology control agent, and a solvent may be blended. By these additions, a composition excellent in resin strength, adhesive strength, workability, preservability and the like and a cured product thereof can be obtained.

The present invention will be described in more detail with reference to the following examples. However, the present invention is not limited to these examples.

[Example 1]
First step DBU (manufactured by San Apro Co., Ltd.) 200 g and B-6C (manufactured by Suzuki Yushi Kogyo Co., Ltd., porous / hollow silica type) 100 g are put into a beaker and stirred for 30 minutes. Since heat is generated during absorption, the mixture is allowed to stand for 2 hours after stirring and returned to room temperature. Add 300 g of methyl ethyl ketone (hereinafter referred to as MEK) and stir for 30 minutes. No. in the funnel made by Kiriyama Mfg. Co., Ltd. (commonly known as Kiriyama funnel). Suction filtration is performed with the filter paper of No. 3, and excess DBU that has not been absorbed and MEK added for washing are filtered. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours. (Hereafter, the powder processed in the first step is called processed powder)
Second step
To 100 g of the treated powder, 200 g of 3 or 4-methyl-1,2,3,6-tetrahydrophthalic anhydride (NH-2200R manufactured by Hitachi Chemical Co., Ltd.) is added and stirred for 30 minutes. After the stirring is completed, 300 g of MEK is added and stirred for another 30 minutes. No. in Kiriyama funnel. Suction filtration is carried out using filter paper No. 3. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours.

[Example 2, Example 3, Comparative Example 1]
Instead of DBU as the amine compound, capsules were prepared in the same manner as in Example 1 except that DBN, triethylenediamine, and N-methylmorpholine were used as shown in Table 1.

[Comparative Examples 2 to 15]
The following three methods were performed as a method for making the liquid amine compound absorbed in the porous fine powder latent. The raw materials used in each method are shown in Table 2.

(1) Instead of the acid anhydride corresponding to the component (C), a film that reacts with the liquid amine at room temperature in a short time at room temperature is reacted with the liquid amine compound remaining on the surface of the component (B) to form a film. Method to form a film (Comparative Examples 2 to 10)

(2) A latent method for reducing the activity of an amine compound by treating with an organometallic complex that coordinates with an amine compound (Comparative Examples 11 to 12)

(3) Mechanical latentization method by a dry mixing method that forms a film using a non-reactive material such as wax and physically shields it (Comparative Examples 13 to 15). In this method, since the capsule material is charged as a solid, no solvent is used. As a commercially available apparatus, AMS series of Hosokawa Micron Co., Ltd., HYBRIDZER series of Nara Machinery Co., Ltd., etc. are used.

[Comparative Examples 2 to 10]
1st process DBU 200g and B-6C 100g are put into a beaker, and are stirred for 30 minutes. Since it generates heat during absorption, it is allowed to stand at room temperature for 2 hours after stirring. Add 300 g MEK and stir for 30 minutes. No. in Kiriyama funnel. Suction filtration is performed with the filter paper of No. 3, and excess DBU that has not been absorbed and MEK added for washing are filtered. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours.
Second step
200 g of the raw material used in Comparative Examples 1 to 10 is added to 100 g of the treated powder and stirred for 30 minutes. After the stirring is completed, 300 g of MEK is added and stirred for another 30 minutes. No. in Kiriyama funnel. Suction filtration is performed with the filter paper of No. 3. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours.

[Comparative Examples 11-12]
1st process DBU 200g and B-6C 100g are put into a beaker, and are stirred for 30 minutes. Since it generates heat during absorption, it is allowed to stand at room temperature for 2 hours after stirring. Add 300 g MEK and stir for 30 minutes. No. in Kiriyama funnel. Suction filtration is performed with the filter paper of No. 3, and excess DBU that has not been absorbed and MEK added for washing are filtered. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours.
Second step
The raw material 50g used for Comparative Examples 1-10 is added to 100g of processed powders, and it stirs for 30 minutes. After the stirring is completed, 300 g of MEK is added and stirred for another 30 minutes. No. in Kiriyama funnel. Suction filtration is performed with the filter paper of No. 3. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours.

[Comparative Examples 13 to 15]
1st process DBU 200g and B-6C 100g are put into a beaker, and are stirred for 30 minutes. Since it generates heat during absorption, it is allowed to stand at room temperature for 2 hours after stirring. Add 300 g MEK and stir for 30 minutes. No. in Kiriyama funnel. Suction filtration is performed with the filter paper of No. 3, and excess DBU that has not been absorbed and MEK added for washing are filtered. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours.
Second step Dry encapsulation was performed with a hybridization system NHS-0 manufactured by Nara Machinery Co., Ltd. 10 g of the raw material used in Comparative Examples 11 to 13 is added to 10 g of the treated powder and treated at 9700 m / s for 1 minute. The treated product is scraped off and collected.

[State of the second step]
The state during the latent process is visually confirmed in the second step of the examples and comparative examples. When the reaction progresses and thickens during the treatment and the fluidity is lost, the fluidity is judged as rejected (NG), and the fluidity is indicated as acceptable (OK). The test results are shown in “State of the second step” in Table 3. (Hereafter, the state of the second step depends on this method)

[Initial preservation]
Presence or absence of encapsulation using a mixture of 100 parts by weight of bisphenol type epoxy resin (Epicron EXA-835LV, manufactured by Dainippon Ink & Chemicals, Inc.) and 50 parts by weight of jER Cure QX40 (produced by Japan Epoxy Resin Co., Ltd.) as a test solution. It was confirmed. When DBU is added to a mixture of an epoxy resin and a polythiol compound, it rapidly generates heat and hardens instantaneously. Therefore, the powders prepared in Examples and Comparative Examples are added to the test solution, and the subsequent state is visually observed. Confirmed and judged pass / fail. As evaluation conditions, 5 to 3 parts by weight of each of Examples 1 to 3 and Comparative Examples 4, 5, 10, 11, 13, 14, and 15 were added to 30 parts by weight of the test solution, stirred, and allowed to stand at 25 ° C. When the reaction proceeded within 1 hour, the viscosity increased and the fluidity was lost, and the fluidity was lost. The result was NG (NG), and the fluidity was acceptable (OK). The test results are shown in “Initial storage stability” in Table 3. However, “−” indicates “NG” in the “second process state”. (Hereinafter, initial storage stability depends on this method)

[Preservation]
In Examples 1 to 3 and Comparative Examples 11 and 13 having storage stability of 1 hour or more in initial storage stability, storage stability was confirmed at 25 ° C. continuously. It was confirmed whether gelation occurred every day until 5 days had passed. Gelation refers to the time (day) until the viscosity measurement limit is exceeded by an EHD viscometer. The measurement is performed under the conditions of a control temperature of 25 ° C., a measurement time of 3 minutes, and a cone rotor of 1 ° 23 ′ × R24, and the measurement limit corresponds to 100 Pa · s. The test results are shown in “Storage” in Table 3. However, “−” indicates “NG in the“ second process state ”and“ initial storage stability ”. (Hereafter, preservation is based on this method)

From the results in Table 3, it was found that those treated with an acid anhydride had the best storage stability. The electron micrograph which confirmed the surface state of untreated B-6C and Example 1 is shown in FIG.1 and FIG.2, respectively. In FIG. 2, there are also portions that are partially adhered, and it was confirmed that a resin layer was present on the surface of the silica powder.

Preservability was confirmed when a plasticizer compatible with the acid anhydride was added and when the acid anhydride was switched to another compound. Using NH-2200R used in Example 1 and 4-methylhexahydrophthalic anhydride (Ricacid MH-700, manufactured by Shin Nippon Rika Co., Ltd.) as an acid anhydride, bis (2-ethylhexyl) sebacate as a plasticizer Preservability by the addition amount of (San Sizer DOS Shin Nippon Rika Co., Ltd.) was confirmed. The test results are shown in Table 4. When a plasticizer is used, the acid anhydride film becomes soft, and as a result, the capsule is easily broken, so that the reactivity is estimated to be high. By adjusting the addition amount of the plasticizer, it is possible to control the ease of breaking the capsule, and therefore when used as a curing component of the curable resin composition, the curability of the curable resin can be controlled. .

[Examples 4 to 8]
1st process DBU200g and B-6C100g are put into a beaker, and are stirred for 30 minutes. Since it generates heat during absorption, it is allowed to stand at room temperature for 2 hours after stirring. Add 300 g MEK and stir for 30 minutes. No. in the funnel made by Kiriyama Seisakusho Co., Ltd. Suction filtration is performed with the filter paper of No. 3, and excess DBU that has not been absorbed and MEK added for washing are filtered. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours.
Second step
According to Table 4, 100 g of the treated powder is mixed with NH-2200R or Ricacid MH-700 alone, acid anhydride, and sansizer DOS as a plasticizer, and stirred for 30 minutes. After the stirring is completed, 300 g of MEK is added and stirred for another 30 minutes. No. in Kiriyama funnel. Suction filtration is performed with the filter paper of No. 3. The filtrate is spread thinly on a pallet and dried in a hot air drying oven at 40 ° C. for 2 hours.

[Examples 9 to 17]
A curable resin composition using the microcapsules produced in Example 1, Example 4, and Example 5 as a curing accelerator was produced. It was blended according to Table 5 using epiclone EXA-835LV as a compound having an epoxy group, jER cure QX40 as a polythiol compound, MEH-8005 (manufactured by Meiwa Kasei Co., Ltd.) as a polyphenol compound, and RIKACID MH-700 as an acid anhydride. Each compound was stirred with a stirrer for 15 minutes to prepare a curable resin composition.

[Comparative Examples 16 to 18]
Epicron EXA-835LV, jER Cure QX40, Amido PN-23J (Ajinomoto Fine Techno Co., Ltd.), an epoxy adduct type compound as a curing accelerator, Fuji Cure FXE-1000 (Fuji Kasei Kogyo Co., Ltd.), Nova Cure HX-3922HP (Asahi Kasei Chemicals Co., Ltd.) Was formulated according to Table 6. Each formulation was stirred for 15 minutes with a stirrer to prepare a curable resin composition.

[Curability check]
The curing behavior at 90 ° C. and 120 ° C. was confirmed with a rheometer under the following conditions. For Examples 9 to 17 and Comparative Examples 16 to 18, the measurement was performed from the uncured state to the point where the viscosity was not changed after completion of curing, and the time (minutes) when the viscosity was not changed is summarized in Table 7.
Rheometer specification manufacturer: VAR-50, manufactured by REOLOGICA
Measurement conditions: Pre-share: 10 (1 / s) for 30 seconds
Geometry: P25
Gap: 1mm
Measurement mode: Oscillation distortion Control distortion: 0.01
Frequency: 1Hz

[Shear adhesive strength check]
A hot-air drying oven set at 120 ° C. by applying and bonding two 1.6 × 25 × 100 mm SPCC-SD steel plates that have been cleaned with MEK onto a surface that overlaps a 2.5 × 10 mm range. And then allowed to cool to 25 ° C. Then, it measured at the tensile speed of 10 mm / min with the universal tensile testing machine. Details follow JIS K 6850. Examples 9 to 17 and Comparative Examples 16 to 18 were carried out by this method, and the measurement results are summarized in Table 7.

[Examples 18 to 20]
A curable resin composition was produced using the microcapsules produced in Example 1 as a curing agent. Hydrogenated bisphenol A type Epicoat YL7007 (manufactured by Japan Epoxy Resin Co., Ltd.) as a compound having an epithio group as a curable resin, Millionate MR-200 (manufactured by Nippon Polyurethane Co., Ltd.) as a compound having an isocyanate group, or pentane as a compound having an acrylic group It blended according to Table 7 using erythritol tetraacrylate (light acrylate PE-4A manufactured by Kyoeisha Chemical Co., Ltd.). Each compound was stirred with a stirrer for 15 minutes to prepare a curable resin composition.

[Example 21]
A curable resin composition was produced using the microcapsules produced in Example 1 as a curing accelerator. According to Table 8 using dimethylol tricyclodecane diacrylate (Light acrylate DCP-A manufactured by Kyoeisha Chemical Co., Ltd.) and t-butyl peroxy-2-ethylhexyl monocarbonate (Perbutyl E manufactured by NOF Corporation) as the curable resin. Blended. Each compound was stirred with a stirrer for 15 minutes to prepare a curable resin composition.

As in the case of the above-mentioned curability confirmation, curing behavior at 90 ° C. and 120 ° C. was confirmed with a rheometer. The results are shown in Table 9.

From the results of Tables 7 and 9, it can be cured at a low temperature of 90 ° C. even if a polyphenol compound or acid anhydride, which is generally a curing agent having low reactivity, is used as a curing accelerator. found. Further, it was confirmed that the reactivity could be further improved by using a plasticizer as shown in Table 4. Although this method causes a decrease in storage stability at the same time, it can be stored at low temperatures commercially and is an effective method for controlling reactivity. Furthermore, the microcapsules of the present invention have a storage stability comparable to that of an epoxy adduct type compound, and it was also recognized that a tougher shear adhesive force is exhibited in a resin composition using the same. Therefore, the curable resin composition containing the microcapsules of the present invention can exhibit excellent reactivity derived from a strongly encapsulated liquid amine compound that is microencapsulated, and also has good storage stability. Was confirmed.

By using the microcapsules of the present invention as a curing agent or curing accelerator for a curable resin, a curable resin composition having both reactivity and storage stability can be prepared. Such a curable resin composition is a curable resin composition having both storability and reactivity, a mounting underfill agent and a heat radiation resin composition used in the manufacture of semiconductor devices, and a conductive resin composition. Useful in a wide range of fields.

It is a scanning electron micrograph of porous hollow silica powder used as the component (B) in the present invention. It is an example of a scanning electron micrograph of the microcapsule obtained in the present invention.

Claims (6)

The following components (A) to (C) are used as constituent components, the component (B) is used as a capsule carrier, the component (A) is absorbed, and the components (A) and (C) present on the surface of the component (B) A microcapsule formed by reacting components to form a film.
(A) Component Liquid amine compound having an acid dissociation constant (pKa) of 8.0 or more, or organic acid salt thereof (B) component Porous fine particle powder (C) component capable of absorbing the component (A) Acid Anhydride The microcapsule according to claim 1, wherein the component (A) comprises at least one selected from DBU, DBN, triethylenediamine, derivatives having these as a main skeleton, or organic acid salts thereof. The microcapsule according to claim 1 or 2, wherein the component (C) is an acid anhydride containing a plasticizer. A curable resin composition comprising the microcapsule according to claim 1 as a curing agent or a curing accelerator. The curable resin composition according to claim 4, wherein the curable resin composition comprises at least one curable resin selected from a compound having an epoxy group, a compound having an epithio group, a compound having an isocyanate group, and a compound having a vinyl group. Resin composition. The curable resin composition according to claim 4 is selected from at least one curable resin selected from a compound having an epoxy group and a compound having an epithio group, a polyamine compound, a polyphenol compound, a polythiol compound, and an acid anhydride. A curable resin composition comprising at least one kind of curing agent and the microcapsule as a curing accelerator.