JP2009200273A - Method of manufacturing light-emitting apparatus, and light-emitting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a light-emitting apparatus capable of suppressing a chromaticity variation even if heights of light-emitting elements are different, and a light-emitting apparatus manufactured by the method. <P>SOLUTION: A light-emitting apparatus 1 is formed through: a mounting step of mounting a plurality of light-emitting elements 10 on an insulating substrate 11 on each of which a wiring pattern is formed; a sealing step of sealing the plurality of light-emitting elements 10 with resin not containing a phosphor to form a first resin layer 12; a polishing step of polishing an upper surface of the first resin layer 12; a cutting step of cutting the first resin layer 12 together with the insulating substrate 11 to divide the plurality of light-emitting elements 10 separately; and a phosphor layer formation step of forming a second resin layer 16 with a resin containing phosphor to the first resin layer 12 by potting. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a light-emitting device and a light-emitting device in which a light-emitting element is sealed with a resin layer containing a resin containing a phosphor.

As a conventional light emitting device in which a light emitting element is sealed with a resin containing a phosphor, there is one described in Patent Document 1. In the light emitting device described in Patent Document 1, a flip chip type light emitting element is conductively mounted on a submount element, and the light emitting element is sealed with a resin package containing a fluorescent substance for wavelength conversion. The thickness of the package from the outer surface of the element is substantially equal in all directions in the light emitting direction, and the wavelength conversion degree by the fluorescent material is uniformized in all directions in the light emitting direction of the light emitting element.
JP 2000-208822 A

  By the way, when a light emitting element is sealed with a resin containing a phosphor to form a resin layer, the thickness becomes a problem. That is, the phosphor emits a complementary color by converting the wavelength of light from the light emitting element, and the light from the light emitting element and the light from the phosphor are mixed to obtain desired light. Therefore, if the thickness of the resin layer changes, the desired color will be different.

  Therefore, in the case where a large number of light emitting devices are obtained at a time by mounting a plurality of light emitting elements on the base material, the thickness of the resin layer will be relatively different if the height of the light emitting elements is different. The variation of the will become large. In such a case, the height of the light-emitting element is adjusted by polishing the substrate on which the semiconductor layers are stacked, or one with a large chromaticity variation is excluded.

  Accordingly, an object of the present invention is to provide a method for manufacturing a light emitting device and a light emitting device capable of suppressing variations in chromaticity even if the heights of the respective light emitting elements are different.

  The present invention includes mounting a plurality of light emitting elements on a base material, sealing the plurality of light emitting elements with a phosphor-free resin to form a first resin layer, and polishing an upper surface of the first resin layer. A second resin layer is formed on the first resin layer with a resin containing a phosphor.

  In the present invention, the first resin layer formed of the phosphor-free resin is polished to adjust the thickness, so that the first resin is removed from the substrate even if the height of the light emitting element mounted on the substrate is not uniform. The height to the upper surface of the layer can be made uniform, and even if the surface of the first resin layer is distorted to wave, the subtle difference in height from the base material to the upper surface of the first resin layer is removed. Can do. Furthermore, by forming the second resin layer containing the phosphor, it is possible to suppress chromaticity variation even if the height of the light emitting element is different.

  A first invention of the present application includes a mounting step of mounting a plurality of light emitting elements on a base material, a sealing step of sealing the plurality of light emitting elements with a phosphor-free resin to form a first resin layer, The polishing step includes polishing a top surface of one resin layer, and a phosphor layer forming step of forming a second resin layer with a resin containing a phosphor in the first resin layer.

  First, a plurality of light emitting elements are mounted on a base material, and then each light emitting element is sealed with a phosphor-free resin to form a first resin layer. Then, by forming the second resin layer containing the phosphor on the first resin layer, the height from the base material to the upper surface of the first resin layer is high even if the height of the light emitting element mounted on the base material is not uniform. Can be aligned. In addition, by polishing the upper surface of the first resin layer and adjusting the thickness of the first resin layer before forming the second resin layer, even if the surface of the first resin layer is distorted so as to wave, A subtle difference in height from the material to the upper surface of the first resin layer can be removed. Furthermore, by forming the second resin layer containing the phosphor, it is possible to suppress chromaticity variation even when the height of the light emitting element is different.

  2nd invention of this application is characterized by including after the grinding | polishing process, the 1st resin layer is cut | disconnected with a base material, and the individualization process which divides | segments a several light emitting element separately is characterized.

  Since the second resin layer can be individually formed on the first resin layer by dividing the light emitting elements individually after the polishing step, the second resin layer is formed so as to cover the entire periphery of the first resin layer. can do.

  The third invention of the present application is characterized in that the polishing step is performed so that the entire upper surface of the first resin layer is smoothed to a rough surface. By forming the entire upper surface of the first resin layer as a rough surface, it is possible to suppress total reflection caused by a difference in reflectance at the interface between the first resin layer and the second resin layer.

  The fourth invention of the present application is characterized in that the fluorescent layer forming step is formed by potting.

  High mass productivity can be secured by forming the second resin layer by potting.

  A fifth invention of the present application is a light emitting device manufactured by the method for manufacturing a light emitting device according to any one of the first to fourth inventions.

  By being manufactured in this way, a light emitting device with suppressed chromaticity variation can be obtained.

(Embodiment)
A method for manufacturing a light emitting device according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1A to FIG. 1D are diagrams for explaining the first half of a method for manufacturing a light-emitting device according to an embodiment of the present invention. FIG. 2A to FIG. 2D are diagrams for explaining the second half of the method for manufacturing the light emitting device according to the embodiment of the present invention.

  As shown in FIG. 1A, first, a light emitting element 10 is prepared. The light emitting element 10 is a blue light emitting element, and an n layer, a light emitting layer, and a p layer, which are compound semiconductor layers, are stacked on a sapphire substrate, an n electrode 10a is formed on the n layer, and a p electrode 10b is formed on the p layer. It is provided as a bonding electrode.

  As shown in FIG. 1B, the n-electrode 10a and the p-electrode 10b are wired at predetermined positions on an insulating substrate 11 provided with a wiring pattern (not shown) formed of copper foil. A mounting process is performed so as to be conductive with the pattern. The insulating substrate 11 can be formed of glass epoxy resin, BT resin, or the like.

  As shown in FIG. 1C, a sealing step for sealing the light emitting element 10 is performed. The sealing step is a printing method in which a printing plate in which an opening surrounding the light emitting element 10 is formed is placed on the insulating substrate 11 and a resin layer for sealing the light emitting element 10 is formed by filling the opening with resin. It can be carried out. This resin is a silicone resin that is light transmissive and does not contain a phosphor, and has a thermosetting property. Accordingly, by heating the resin layer formed on the insulating substrate 11, the resin layer is cured and becomes the first resin layer 12.

  As shown in FIG. 1D, a polishing step for polishing the upper surface of the first resin layer 12 is performed after the sealing step. When the first resin layer 12 is formed by a printing method, this polishing step is performed so that the upper surface of the first resin layer 12 is gently waved, so that the distortion is removed to make it flat. By polishing the upper surface of the first resin layer 12 in this way, the height H from the insulating substrate 11 to the upper surface of the first resin layer 12 is uniformly adjusted even if the height of each light emitting element 10 is different. can do. Moreover, even if the upper surface of the first resin layer 12 is distorted, it can be adjusted to a more uniform thickness by polishing.

  In the polishing step, by setting the surface roughness of the grindstone for polishing the upper surface of the first resin layer 12 to be No. 600, the upper surface of the first resin layer 12 can be formed so as to be flattened, and the surface thereof A rough surface on which minute irregularities are formed.

  As shown in FIG. 2A, after the polishing process, an individualizing process for dividing each light emitting element 10 is performed. In the singulation step, a predetermined position from the upper surface of the polished first resin layer 12 is cut with the blade 13 together with the insulating substrate 11 to obtain individual pieces.

  As shown in FIG. 2B, the individual light emitting elements 10 are mounted on the cup portion 14 by adsorbing the upper surface of the first resin layer 12 with a die bonding collet (not shown). The cup portion 14 is formed in a substantially bowl shape formed so that the opening area gradually increases in order to reflect the light from the light emitting element 10 and to direct it in the main light extraction direction F. For example, if the polishing step is omitted when adsorbing the light emitting element 10 separated by a collet, the upper surface of the first resin layer 12 is in a wavy state. A gap is formed between the semiconductor light emitting devices 10 and the separated semiconductor light emitting elements 10 are attracted in an inclined state. If it is adsorbed in an inclined state, there is a risk of misalignment when mounted on the cup portion 14, resulting in mounting failure. In the present embodiment, since the upper surface of the first resin layer 12 is polished in a planar shape in the polishing process, it can be prevented from adsorbing to the collet in an inclined state. Therefore, high reliability can be ensured.

  As shown in FIG. 2C, the wiring pattern formed on the insulating substrate 11 is connected to the anode part (not shown) and the cathode part (not shown) of the cup part 14 by wires 15.

  As shown in FIG. 2D, when wire bonding is completed, a fluorescent layer forming step is performed. In the fluorescent layer forming step, first, a resin containing a phosphor (not shown) is filled into the cup portion 14 by potting to form a fluorescent layer. As the phosphor, a phosphor that converts the wavelength to yellow so as to appear white by mixing with blue light from the light emitting element 10 is adopted. As the resin containing the phosphor, an epoxy resin can be used, and in the present embodiment, a resin having thermosetting properties is selected. Next, when the cup portion 14 is filled with a resin to form a fluorescent layer, the whole is heated to cure the fluorescent layer to form the second resin layer 16. By doing so, a plurality of light emitting devices 1 can be formed.

  The concentration of the phosphor contained in the resin filled by potting is several percent, but the content of the resin used in the printing method is 50% or more. Therefore, by forming the second resin layer 16 by potting, it is possible to use a resin having a low phosphor content, so that the light transmittance of the second resin layer 16 can be increased. That is, the light emitting device 1 with high luminance can be obtained.

  Further, since the upper surface of the first resin layer 12 is formed to be rough, it is possible to reduce the light that is totally reflected at the interface with the second resin layer 16 and returns to the light emitting element 10 due to the difference in reflectance. it can.

  Here, the chromaticity variation between the first resin layer 12 and the second resin layer 16 will be described in detail. The amount of the cup portion 14 filled with resin to form the second resin layer 16 is determined in advance, and the shape of the cup portion 14 is the same in each light emitting device 1. Then, the upper surface of the first resin layer 12 that seals the light-emitting element 10 is polished in a planar manner in the polishing step, and the height from the insulating substrate 11 to the upper surface of the first resin layer 12 is adjusted to the same height H. Yes. Therefore, the second resin layer 16 filled with the same amount by potting can have the same thickness T from the upper surface of the first resin layer 12 in the light emitting device 1. That is, since the light emitted from the light emitting element 10 can pass through the second resin layer 16 with the same thickness in each light emitting device 1, even if the heights of the light emitting elements 10 are different, Variation in chromaticity can be prevented.

  As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above-described embodiments. For example, the lead frame is sealed with the first resin layer 12 instead of the insulating substrate 11. The light emitting element 10 may be mounted and the second resin layer 16 may be further formed. In the present embodiment, the second resin layer 16 is formed by potting, but may be formed by a printing method.

  The present invention is suitable for a light-emitting device in which a light-emitting element is sealed with a resin layer containing a resin containing a phosphor because variation in chromaticity can be suppressed even when the height of the light-emitting element is different.

(A) to (D) are diagrams for explaining the first half of a method for manufacturing a light emitting device according to an embodiment of the present invention. FIGS. 4A to 4D are diagrams for explaining the second half of the method for manufacturing a light emitting device according to the embodiment of the invention. FIGS.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device 10 Light-emitting element 10a n electrode 10b p electrode 11 Insulating substrate 12 1st resin layer 13 Blade 14 Cup part 15 Wire 16 2nd resin layer

Claims (5)

A mounting process for mounting a plurality of light emitting elements on a substrate;
A sealing step of sealing the plurality of light emitting elements with a phosphor-free resin to form a first resin layer;
A polishing step of polishing the upper surface of the first resin layer;
A method of manufacturing a light emitting device, comprising: forming a second resin layer with a resin containing a phosphor in the first resin layer. 2. The method of manufacturing a light emitting device according to claim 1, further comprising an individualization step of dividing the plurality of light emitting elements individually by cutting the first resin layer together with the base material after the polishing step. . 3. The method for manufacturing a light emitting device according to claim 1, wherein in the polishing step, the entire upper surface of the first resin layer is polished to be a rough surface. The method for manufacturing a light emitting device according to claim 1, wherein the fluorescent layer forming step is performed by potting. The light-emitting device manufactured by the manufacturing method of the light-emitting device according to any one of claims 1 to 4.

Images