JP2009199779A - Lighting fixture for vehicle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve heat dissipation effect of a light-emitting unit in a conventional lighting fixture for a vehicle. <P>SOLUTION: The lighting fixture includes a heat sink member 2 having a mounting surface 8 provided on its top side, a semiconductor type light source 3 directly mounted on the mounting surface 8 of the heat sink member 2, a feeding holder 4 set on the semiconductor type light source 3 and the heat sink member 2 to press the semiconductor light source 3 toward the heat sink member 2 side and feed the semiconductor type light source 3, and a fixing member 5 at least covered on the feeding holder 4 and fixed to the heat sink member 2 to fix the feeding holder 4 to the heat sink member 2 and fix the semiconductor type light source 3 by holding it between the feeding holder 4 and the heat sink member 2. As a result, since the semiconductor type light source 3 is directly mounted on the heat sink member 2, the semiconductor type light source 3 has good heat dissipation effect. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a vehicular lamp that uses a semiconductor-type light source such as an LED as a light source.

  This type of vehicular lamp is conventionally known (for example, Patent Document 1). The vehicle lamp will be described below. A conventional vehicular lamp includes a light source unit mounted on an attachment to form a light source module, and the light source module is fixed to a heat radiator with a clip. In a conventional vehicular lamp, when an LED of a light emitting unit is turned on, light from the LED is irradiated to the outside to illuminate the outside.

  However, in the conventional vehicle lamp, the light source module composed of the light emitting unit and the attachment is fixed to the heat radiating body with a clip in a state where the light emitting unit is sandwiched between the restricting protrusion and the engaging protrusion of the attachment. It is what has been. For this reason, the conventional vehicle lamp has a problem in the heat dissipation effect of the light emitting unit because the light emitting unit is not in direct contact with the heat radiator.

JP 2007-194173 A

  The problem to be solved by the present invention is that the conventional vehicular lamp has a problem in the heat dissipation effect of the light emitting unit.

  The present invention (the invention according to claim 1) includes a heat sink member having a mounting surface on the upper surface, a semiconductor light source directly mounted on the mounting surface of the heat sink member, and the semiconductor light source And a power supply holder that is set on the heat sink member and holds the semiconductor light source on the heat sink member side and supplies power to the semiconductor light source, and is at least covered on the power supply holder and fixed to the heat sink member. And a fixing member for fixing the semiconductor light source by sandwiching the semiconductor-type light source between the power supply holder and the heat sink member.

  Further, according to the present invention (the invention according to claim 2), the fixing member is made of a member having high thermal conductivity and is at least covered on the power supply holder, and screwed into the heat sink member from above the cover member. Thus, the cover member is fixed to the heat sink member, and the power supply holder is fixed to the heat sink member via the cover member.

  Further, according to the present invention (the invention according to claim 3), the fixing member is composed of a cover member which is made of a member having elasticity and high thermal conductivity and is covered on at least the power supply holder. The cover member includes an elastic pressing portion that elastically presses the power supply holder from above to the heat sink member by pressing the cover member into the heat sink member from above, and the elastic pressing portion elastically presses the power supply holder from above to the heat sink member side. The cover member is fixed to the heat sink member by being elastically engaged with the heat sink member at the time, and an elastic engagement portion for fixing the power supply holder to the heat sink member is provided together with the elastic pressing portion. .

  Furthermore, in the present invention (the invention according to claim 4), the heat sink member includes a positioning portion for determining a position in one direction on the plane of the mounting surface of the semiconductor light source, and a positioning direction of the positioning portion. A spring part in which a spring force acts in a direction intersecting on the plane of the mounting surface, and a semiconductor type by facing the spring part with the semiconductor light source sandwiched in the spring force action direction of the spring part. And a receiving portion that receives the light source being pressed against each other.

  Furthermore, in the present invention (the invention according to claim 5), the power supply holder is composed of a contact of an elastic conductive member and a housing of an insulating member that holds the contact, and the contact is Contact portion for electrically elastically contacting the semiconductor light source from above to supply power to the semiconductor light source and sandwiching and fixing the semiconductor light source between the heat sink member and a connector portion for electrically connecting to the power supply side connector It is characterized by the following.

  Furthermore, the present invention (the invention according to claim 6) is characterized in that positioning portions for determining the mutual positions of the heat sink member and the power supply holder are provided in the housing and the heat sink member of the power supply holder, respectively. .

  Furthermore, according to the present invention (the invention according to claim 7), the housing of the power supply holder is provided with a rib for holding the semiconductor-type light source from the top toward the heat sink member and sandwiching and fixing it between the heat sink member. It is characterized by that.

  In the vehicular lamp according to the present invention (the invention according to claim 1), the power supply holder is fixed to the heat sink member by the fixing member in a state where the semiconductor light source is directly mounted on the mounting surface of the heat sink member. A semiconductor light source is sandwiched and fixed between the power supply holder and the heat sink member. As a result, in the vehicular lamp of the present invention (the invention according to claim 1), since the semiconductor-type light source is in direct contact with the heat sink member, heat transfer from the semiconductor-type light source to the heat sink member is improved. The heat dissipation effect is great.

  In addition, the vehicular lamp of the present invention (the invention according to claim 1) has an improved assembly direction of the components including the heat sink member, the semiconductor light source, the power supply holder, and the fixing member by means for solving the above-mentioned problems. One direction from the bottom to the bottom. That is, the semiconductor type light source is directly placed on the mounting surface of the heat sink member from above, the power supply holder is set on the semiconductor type light source and the heat sink member from above, and the semiconductor type light source is pressed toward the heat sink member and the semiconductor type Capable of supplying power to the light source, covering the fixing member from above at least on the power supply holder, fixing the power supply holder to the heat sink member, and fixing the semiconductor light source between the power supply holder and the heat sink member It is. Thus, in the vehicular lamp according to the present invention (the invention according to claim 1), the assembly direction of the parts including the heat sink member, the semiconductor light source, the power supply holder, and the fixing member is one direction from top to bottom. The assembly workability of the parts is good, and further, the assembly of the parts can be automated.

  Further, in the vehicular lamp according to the present invention (the inventions according to claims 2 and 3), since the cover member made of a member having high thermal conductivity is covered at least on the power supply holder, the heat of the semiconductor light source is supplied with power. It is transmitted through the holder or directly to the cover member, and the heat radiation effect of the semiconductor light source is further increased.

  Moreover, in the vehicular lamp of the present invention (the invention according to claim 2), the screw is screwed into the heat sink member from above the cover member, so that the cover member is fixed to the heat sink member and the power supply holder is moved to the heat sink via the cover member. Since the semiconductor-type light source is fixed by being sandwiched between the power supply holder and the heat sink member, the semiconductor-type light source, the power supply holder, the heat sink member, and the cover member can be securely fixed.

  Furthermore, in the vehicle lamp of the present invention (the invention according to claim 3), since the fixing member is formed of a cover member provided with an elastic pressing portion and an elastic engagement portion, the number of parts can be reduced. In the vehicle lamp of the present invention (the invention according to claim 3), the power supply holder is fixed to the heat sink member only by pressing the cover member into the heat sink member from above, and the semiconductor light source is connected to the power supply holder, the heat sink member, and the like. Since the semiconductor light source, the power supply holder, the heat sink member, and the cover member are fixed, the work of assembling the components is further improved.

  Moreover, in the vehicular lamp of the present invention (the invention according to claim 3), since the elastic pressing portion of the cover member as the fixing member elastically presses the power supply holder from above to the heat sink member side, the semiconductor type is provided via the power supply holder. The light source can be pressed against the heat sink member, and the pressing force can be adjusted by adjusting the elastic force of the elastic pressing portion. For this reason, the vehicular lamp of the present invention (the invention according to claim 3) improves heat transfer to the heat sink member of the semiconductor light source, increases the heat radiation effect of the semiconductor light source, Damage can be prevented. That is, if the force with which the semiconductor light source is pressed to the heat sink member is small, thermal resistance is generated between the semiconductor light source and the heat sink member, and if it is large, the semiconductor light source may be damaged.

  Furthermore, in the vehicular lamp of the present invention (the invention according to claim 4), the semiconductor light source can be accurately positioned at a predetermined position of the heat sink member by means for solving the above-described problems. The light from the semiconductor-type light source can be controlled with high accuracy, and the light distribution can be controlled with high accuracy.

  Furthermore, the vehicular lamp of the present invention (the invention according to claim 5) fixes the semiconductor light source to the heat sink member without using a fixing member such as a screw by means for solving the above-mentioned problems. In addition, since power can be supplied to the semiconductor-type light source without using solder or the like, the assembling workability of the components is further improved.

  Furthermore, in the vehicular lamp of the present invention (the invention according to claim 6), the power supply holder can be positioned at a predetermined position of the heat sink member with high accuracy by means for solving the above-described problems. For this reason, the vehicular lamp according to the present invention (the invention according to claim 6) has a high accuracy position of the semiconductor light source sandwiched and fixed between the power supply holder and the heat sink member positioned with high accuracy. Therefore, the light from the semiconductor light source can be controlled with high accuracy, and the light distribution can be controlled with high accuracy.

  Furthermore, in the vehicular lamp of the present invention (the invention according to claim 7), the semiconductor light source is securely sandwiched and fixed between the power supply holder and the heat sink member by means for solving the above-mentioned problems. Can do. Moreover, the vehicular lamp according to the present invention (the invention according to claim 7) can be fixed by being sandwiched between the power supply holder and the heat sink member by pressing the semiconductor light source toward the heat sink member with the rib of the housing of the power supply holder. Therefore, the semiconductor-type light source can be fixed to the heat sink member without using a fixing member such as a screw, and the assembly workability of the parts is further improved.

  Below, two examples of the Example of the vehicle lamp concerning this invention are demonstrated in detail based on drawing. Note that the present invention is not limited to the embodiments. Further, in this specification and claims, “upper” means “upper” in the attractive direction when the vehicle lamp according to the present invention is assembled. Further, in this specification and claims, “up, down, front, back, left, right” means “up, down, front,” and “up, down, front” of the automobile when the vehicular lamp according to the present invention is attached to the automobile. , Back, left, right ".

  1 to 19 show Embodiment 1 of a vehicular lamp according to the present invention. Hereinafter, the configuration of the vehicular lamp in the first embodiment will be described. In the figure, reference numeral 1 denotes a vehicular lamp in the first embodiment. The vehicle lamp 1 is, for example, an automotive headlamp and has a projector type unit structure. As shown in FIGS. 1 to 3, the vehicle lamp 1 includes a heat sink member 2, a semiconductor light source 3, a power supply holder 4, a fixing member 5, a reflector 6, a projection lens 7, and an automobile not shown. A lamp housing of a general headlamp and a lamp lens (for example, a transparent outer lens).

  The heat sink member 2, the semiconductor light source 3, the power supply holder 4, the fixing member 5, the reflector 6 and the projection lens 7 constitute a lamp unit. One or a plurality of the lamp units are arranged, for example, via an optical axis adjusting mechanism in a lamp chamber defined by the lamp housing and the lamp lens of the automotive headlamp.

  The heat sink member 2 is made of a material having high thermal conductivity such as resin or metallic die casting. The upper surface of the heat sink member 2 forms a flat surface. As shown in FIGS. 3, 9, and 10, the heat sink member 2 has a fin shape from the upper end to the lower end.

  As shown in FIG. 8, a flat placement surface 8 is integrally provided behind the center of the upper surface of the heat sink member 2. The mounting surface 8 has a quadrangle substantially the same as the rectangular substrate 9 of the semiconductor-type light source 3, and the substrate 9 of the semiconductor-type light source 3 is directly mounted from above.

  Two rectangular columnar positioning portions (stoppers) 10 and 10 are integrally provided on both the left and right sides of the rear surface of the mounting surface 8 in the upper surface of the heat sink member 2. The positioning units 10 and 10 determine the position of the semiconductor-type light source 3, and determine the position of the semiconductor-type light source 3 in one direction on the plane of the mounting surface 8, that is, the position in the left-right direction. is there. The two positioning portions 10 and 10 have one side surface facing each other, and are separated from each other by the long side of the substrate 9 of the semiconductor light source 3.

  A rectangular storage groove 11 is provided in the center of the upper surface of the heat sink member 2 on the front side of the mounting surface 8. As shown in FIGS. 3, 9, and 10, a spring portion 12 of a U-shaped spring is press-fitted into the storage groove 11 from above. The spring portion 12 has a spring force acting in a direction intersecting on the plane of the mounting surface 8 with respect to the positioning direction (left-right direction) of the positioning portions 10, 10, that is, the front-rear direction. In the spring portion 12, the length of the rear vertical portion is longer than the length of the front vertical portion, and the upper end portion 13 of the rear vertical portion protrudes upward from the upper surface of the heat sink member 2. An upper end portion 13 of the vertical portion on the rear side is slightly inclined to the front side so that the semiconductor light source 3 can be easily placed on the placement surface 8 of the heat sink member 2.

  An elongated square pillar-shaped receiving portion (stopper) 14 is integrally provided at the center of the upper surface of the heat sink member 2 on the rear side of the mounting surface 8 described above. The receiving part 14 is opposed to the spring part 12 with the semiconductor light source 3 sandwiched in the spring force acting direction of the spring part 12, that is, in the rearward direction, and the semiconductor type is caused by the spring force of the spring part 12. The substrate 9 of the light source 3 is pressed against. The receiving part 14 is configured such that the upper end portion on the front side forms an inclined surface so that the semiconductor light source 3 can be easily placed on the placement surface 8 of the heat sink member 2.

  A shade 15 is integrally provided at the upper end portion of the front side of the heat sink member 2. The shade 15 is provided with an edge 16 that forms a cut-off line (not shown) of a light distribution pattern (not shown).

  A concave storage portion 17 is provided in front of the center of the heat sink member 2 (between the placement surface 8 and the shade 15). The storage portion 17 is provided from one side (left side) to the other side (right side) of the heat sink member 2. As shown in FIGS. 3 to 6, 9, and 10, the storage portion 17 includes at least the connector portions 18 and 18 of the power supply holder 4 and a part of the housing 19 that holds the connector portions 18 and 18. The power-side connectors 20 and 20 are accommodated.

  Circular recesses 21 and 21 of the positioning portion are integrally provided at locations slightly apart from the center portions on both the left and right sides of the mounting surface 8 on the upper surface of the heat sink member 2. The circular recesses 21 and 21 determine the mutual positions of the heat sink member 2 and the power supply holder 4 together with the circular protrusions 22 and 22 of the power supply holder 4.

  A circular hole 23 is provided in the center on the rear side of the upper surface of the heat sink member 2. The hole 23 is a hole for screwing a screw 25 for fixing the cover member 24 of the fixing member 5. Similarly, circular holes 26 are respectively provided at one location on the rear side of the upper surface of the heat sink member 2 and two locations on the front and rear sides on the other side. The hole 26 is a hole for screwing a screw 27 for fixing the reflector 6. Further, in the center of the left and right sides of the heat sink member 2 (part corresponding to the storage portion 17), concave portions 28 are provided, respectively. As shown in FIG. 18, the recesses 28 and 28 allow the harnesses 29 and 29 of the connectors 20 and 20 on the power supply side to escape upward.

  As the semiconductor-type light source 3, for example, a self-luminous semiconductor-type light source (LED in this embodiment 1) such as LED and EL (organic EL) is used. As shown in FIGS. 3, 7, and 9 to 12, the semiconductor light source 3 has a rectangular plate shape of the substrate 9 and a minute rectangular parallelepiped shape fixed to one surface (upper surface) of the substrate 9. A light emitting body 30 of a light source chip (semiconductor chip), a hemispherical (dome-shaped) light transmitting member (lens) 31 covering the light emitting body, and the centers of the left and right ends of one surface of the substrate 9 are provided. The conductive members 32 and 32 are configured.

  As shown in FIGS. 5, 6, and 9 to 17, the power supply holder 4 holds the semiconductor light source 3 toward the heat sink member 2 and supplies power to the semiconductor light source 3. And a connector side portion 34 electrically connected to the power source side connectors 20, 20. Further, the power supply holder 4 includes two contacts 35A and 35B, which are conductive members having elasticity, and the housing 19 that is an insulating member that holds the two contacts 35A and 35B in the state shown in FIG. It is composed of As shown in FIGS. 9 and 10, the upper surface of the power feeding side portion 33 and the upper surface of the connector side portion 34 of the housing 19 of the power feeding holder 4 are flush with each other, and the lower surface of the connector side portion 34 is , One step below the lower surface of the power feeding side portion 33.

  Hereinafter, the two contacts 35A and 35B will be described with reference to FIGS. FIG. 13 is a perspective view showing a state in which the two contacts 35A and 35B are held in the housing 19. FIG. 14 shows one of the contacts 35A, FIG. 14A is a view taken along arrow XIVA in FIG. 13, and FIG. 14B is a view taken along arrow XIVB in FIG. Further, FIG. 15 shows the other contact 35B, FIG. 15 (A) is an XVA arrow view in FIG. 13, and FIG. 15 (B) is an XVB arrow view in FIG.

  As shown in FIGS. 13 to 15, the two contacts 35 </ b> A and 35 </ b> B are respectively two contact portions 36, 36, and 36 that are in electrical contact with the semiconductor light source 3 in the vertical direction (from top to bottom). , 36, the connector parts 18, 18 electrically connected to the power supply side connectors 20, 20 in the horizontal direction (left-right direction), the contact parts 36, 36, 36, 36 and the connector parts 18, 18. Are connected in the horizontal direction and electrically connected and wired.

  The connection wiring portions 37 and 37 are composed of a horizontal plate portion and a vertical plate portion formed by bending one end portion of the horizontal plate portion at a right angle or a substantially right angle.

  The two contact portions 36, 36, 36, 36 are bent in a V-shape at the tip of a bifurcated horizontal plate portion provided at the other end of the horizontal plate portion of the connection wiring portions 37, 37. It will be. The two contact portions 36, 36, 36, 36 are electrically elastically brought into contact with the conductive members 32, 32 of the substrate 9 of the semiconductor light source 3 from above to supply power to the semiconductor light source 3. And the said board | substrate 9 of the said semiconductor type light source 3 is inserted | pinched between the said mounting surface 8 of the said heat sink member 2, and is fixed.

  On the other hand, the connector parts 18 and 18 are bent in half by hemming bending one end of the vertical plate part of the connection wiring parts 37 and 37 opposite to the two contact parts 36, 36, 36 and 36. It will be. The connector portions 18 and 18 are electrically connected to the power source side connectors 20 and 20 of a JIS standard flat connection terminal.

  The two contacts 35A and 35B are integrally molded in the housing 19 in the state shown in FIGS. Or it is pinched | interposed and fixed between the said housings 19 divided into two up and down in the horizontal direction. As shown in FIGS. 6, 16, and 17, a rectangular opening 38 is provided in the housing 19 substantially at the center of the power feeding side portion 33. On the other hand, the connector side portion 34 of the housing 19 is provided with two insertion holes 39, 39, respectively.

  The two contact portions 36, 36, 36, 36 of the two contacts 35 A, 35 B and the bifurcated horizontal plate portion extend from the housing 19 of the power supply side portion 33 of the power supply holder 4 to the opening. 38 project and face each other. On the other hand, the connector portions 18, 18 of the two contacts 35 A, 35 B protrude from the housing 19 of the connector side portion 34 of the power supply holder 4 into the two insertion holes 39, 39.

  The maximum vertical dimension among the vertical dimensions of the two contacts 35A and 35B is the vertical dimension of the vertical plate portion of the connection wiring portions 37 and 37, and the connector portions 18 and 18 are doubled by hemming bending. It is a vertical dimension that can be formed by bending. On the other hand, since the connector parts 18 and 18 are electrically connected to the power supply side connectors 20 and 20 of the flat connection terminals of JIS standard products, the vertical dimension is small. As a result, the vertical dimension of the housing 19 that holds the two contacts 35A and 35B can be reduced. Since the power supply side portion 33 of the housing 19 holds the horizontal plate portions of the connection wiring portions 37 and 37, the power supply side portion of the housing 19 is shown in FIGS. The vertical dimension of 33 can be made smaller than the vertical dimension of the connector side portion 34 of the housing 19.

  The power feeding side portion 33 of the power feeding holder 4 is sized to be placed on an intermediate portion from the center to the rear side of the upper surface of the heat sink member 2, and the placement surface 8 and the positioning portion 10, 10, the storage groove 11, the receiving portion 14, and the circular recesses 21, 21 can be covered, and the holes 23, 26 are not covered. On the other hand, the connector side portion 34 of the power supply holder 4 is sized to be housed in the housing portion 17 of the heat sink member 2, and the size of the connector side portion 34 in the left-right direction is the housing portion 17. Is smaller than the horizontal dimension.

  As shown in FIG. 11, on the lower surface of the power feeding side portion 33 of the housing 19 of the power feeding holder 4, the two circular convex portions 22, 22 of the positioning portion are 2 of the positioning portion of the heat sink member 2. It is provided corresponding to each of the circular recesses 21, 21. The circular convex portions 22 and 22, together with the circular concave portions 21 and 21, determine the mutual position of the heat sink member 2 and the power supply holder 4.

  As shown in FIGS. 3, 9, and 10, a stepped portion 40 is provided on the lower surface of the rear edge of the opening 38 of the power feeding side portion 33 in the housing 19 of the power feeding holder 4. It is provided corresponding to the receiving portion 14 of the member 2. The step portion 40 determines the mutual position of the heat sink member 2 and the power supply holder 4 together with the receiving portion 14.

  As shown in FIG. 12, two ribs 41, 41 are integrally formed on the rear lower surface of the left and right side edges of the opening 38 of the power feeding side portion 33 in the housing 19 of the power feeding holder 4. Is provided. The ribs 41, 41 hold the substrate 9 of the semiconductor-type light source 3 from above to the mounting surface 8 side of the heat sink member 2, and are sandwiched and fixed between the mounting surface 8 of the heat sink member 2. To do.

  As shown in FIGS. 3, 4, and 9 to 12, the fixing member 5 includes the cover member 24 and the screw 25. The cover member 24 is made of a member having high thermal conductivity, for example, metal. The cover member 24 covers the power supply side portion 33 of the housing 19 of the power supply holder 4 from above. That is, the cover member 24 includes a horizontal plate portion, and a vertical plate portion formed by bending the entire rear side edge of the horizontal plate portion and the left and right ends of the front side edge at a right angle or substantially a right angle. An opening 42 is provided at the center of the horizontal plate portion of the cover member 24 so as to correspond to the opening 38 of the power supply holder 4. A fixed plate portion 43 is horizontally and integrally provided from the center of the rear vertical plate portion of the cover member 24. The fixing plate portion 43 is provided with a circular through hole 44 corresponding to the hole 23 of the heat sink member 2.

  The reflector 6 is made of a light impermeable resin member or the like. In addition, as shown in FIGS. 1 to 3, the reflector 6 has a semicircular opening at the front portion and an opening at the lower portion, while the rear portion passes through the central portion (upper portion) from the front portion. The part is blocked. An insertion hole (not shown) through which the screw 27 is inserted is provided on one side (right side) of the central portion of the reflector 6 and on both sides (left and right) of the rear portion. The reflector 6 is attached to the heat sink member 2 by the screw 27. A reflective surface 45 is provided on the concave inner surface of the closed portion of at least the central portion of the reflector 6 from the substantially rear half to the rear side portion by aluminum deposition or silver coating.

  The reflection surface 45 is an elliptical reflection surface. That is, the reflecting surface 45 is a free-form surface (NURBS surface) reflecting surface having an ellipse as a basis (reference, basic tone). The free curved surface (NURBS curved surface) reflecting surface based on the ellipse is a reflecting surface in which the vertical cross section in FIG. 3 forms an ellipse, and the horizontal cross section (not shown) forms a parabola or a deformed parabola. The reflective surface 45 has a first focal point (not shown), a second focal point (not shown), and an optical axis (not shown). The second focal point is a focal line on a horizontal section, that is, a curved focal line with both ends positioned on the front side and the center positioned on the rear side as viewed from above (plane). The free curved surface (NURBS curved surface) of the reflective surface 45 is a NURBS free curved surface (Non-Uniform Rational B-Spline Surface) described in “Mathematical Elemennts for Computer Graphics” (Devid F. Rogers, J Alan Adams). is there. The reflection surface 45 may be a reflection surface composed of a simple spheroidal surface having a first focal point, a second focal point, and an optical axis. In this case, the second focal point is not a focal line but a focal point. The reflection surface 45 of the reflector 6 reflects light from the semiconductor light source 3.

  The projection lens 7 is a convex lens of an aspherical lens as shown in FIGS. The front side (external side) of the projection lens 7 has a convex aspheric surface with a large curvature (small curvature radius), while the rear side (the semiconductor-type light source 3 side) of the projection lens 7 has a small curvature. Convex aspherical surface (large curvature radius). By using such a projection lens 7, the focal length of the projection lens 7 is reduced. Therefore, the size of the projection lens 7 of the vehicle lamp 1 in this embodiment in the optical axis direction is compact. Become. The rear side of the projection lens 7 may be a flat aspheric surface (plane). As shown in FIGS. 1 to 3, the projection lens 7 is fixed to the heat sink member 2 via a lens fixing member 46.

  The projection lens 7 includes a front focal point (a focal point on the semiconductor-type light source 3 side, not shown), a rear focal point (an external focal point, not shown), the front focal point, and the rear focal point. And an optical axis (not shown) connecting the side focal points. The optical axis of the reflecting surface 45 and the optical axis of the projection lens 7 are coincident or substantially coincident with each other. The front focal point of the projection lens 7 is a lens focal point (a meridional image plane that is a focal plane on the object space side). The lens focal point of the projection lens 7 is located at or near the second focal point of the reflecting surface 45. The light from the semiconductor-type light source 3 does not have high heat, so that a resin lens can be used as the projection lens 7. The projection lens 7 uses acrylic in this example. The projection lens 7 projects (irradiates) the reflected light from the reflecting surface 45 of the reflector 6 to the outside (in front of the vehicle).

  The vehicular lamp 1 according to the first embodiment is configured as described above, that is, the heat sink member 2 and the semiconductor-type light source 3 (consisting of the substrate 9, the light emitter 30 and the light transmitting member 31) and The power supply holder 4 (consisting of the two contacts 35A and 35B and the housing 19), the fixing member 5, the reflector 6, the projection lens 7, and the lens fixing member 46 are included. Hereinafter, how to assemble each of the above-described components will be described.

  First, the U-shaped spring portion 12 is press-fitted from above into the housing groove 11 of the heat sink member 2 shown in FIG. 8 with the curved portion down and the long vertical portion at the rear side. (See FIGS. 9 and 10).

  Next, the semiconductor light source 3 is directly placed on the placement surface 8 of the heat sink member 2 from above (see FIGS. 7, 9, and 10). At this time, using the positioning portions 10 and 10 and the receiving portion 14 of the heat sink member 2 as a guide, the semiconductor light source 3 is positioned between the positioning portions 10 and 10 and the vertical portion on the rear side of the spring portion 12. Between the upper end portion 13 and the receiving portion 14. In addition, due to the spring force of the spring portion 12, the semiconductor light source 3 crosses the positioning direction (left-right direction) of the positioning portions 10 and 10 on the plane of the mounting surface 8, that is, the rear It is pressed to the receiving part 14 side in the direction. As a result, the semiconductor-type light source 3 is positioned on the placement surface 8 of the heat sink member 2 in the two directions (left-right direction and front-rear direction) intersecting each other on the plane of the placement surface 8. In this state, it is placed directly. When the semiconductor light source 3 is directly placed on the placement surface 8 of the heat sink member 2 from above, the rear side of the spring portion 12 protruding upward from the upper surface of the heat sink member 2 is disposed. Since the upper end portion 13 of the vertical portion is slightly inclined to the front side, the semiconductor-type light source 3 can be easily placed directly on the placement surface 8 of the heat sink member 2.

  Subsequently, the power supply holder 4 is set on the heat sink member 2 and the semiconductor-type light source 3 from above (see FIGS. 5, 6, 9, and 10). That is, the connector side portion 34 of the power supply holder 4 is stored in the storage portion 17 of the heat sink member 2 from above. Further, the circular convex portions 22 and 22 of the power supply holder 4 are fitted into the circular concave portions 21 and 21 of the heat sink member 2 from above (see FIG. 11). Further, the contact portions 36, 36, 36, 36 of the power supply holder 4 are elastically brought into contact with the conductive members 32, 32 on the substrate 9 of the semiconductor light source 3 (see FIGS. 6 and 11). . Furthermore, the ribs 41 and 41 of the power supply holder 4 are set on both ends of the substrate 9 of the semiconductor light source 3 (see FIG. 12). At this time, since the circular convex portions 22 and 22 of the power supply holder 4 are fitted in the circular concave portions 21 and 21 of the heat sink member 2, the mutual positions of the heat sink member 2 and the power supply holder 4. Is decided. The positions of the heat sink member 2 and the semiconductor-type light source 3 are determined by the positioning portions 10 and 10, the spring portion 12, and the receiving portion 14. Therefore, the positions of the semiconductor light source 3 and the power supply holder 4 are determined via the heat sink member 2. That is, the positions of the heat sink member 2, the semiconductor light source 3 and the power supply holder 4 are determined with respect to each other. Further, the contact portions 36, 36, 36, 36 of the power supply holder 4 are elastically brought into contact with the conductive members 32, 32 on the substrate 9 of the semiconductor light source 3, so that the semiconductor light source 3 is Power is supplied to the semiconductor light source 3 while being pressed to the heat sink member 2 side. Furthermore, the ribs 41 and 41 of the power supply holder 4 are set on both ends of the substrate 9 of the semiconductor light source 3, so that the semiconductor light source 3 is pressed to the heat sink member 2 side.

  Then, the cover member 24 of the fixing member 5 is covered from above on the power supply side portion 33 of the power supply holder 4, and the heat sink member 2 is covered from above the fixing plate portion 43 of the cover member 24. The screw 25 of the fixing member 5 is screwed into the hole 23 (see FIGS. 4, 9, and 10). Then, the cover member 24 is fixed to the heat sink member 2 via the screw 25. The power supply holder 4 is fixed to the heat sink member 2 through the cover member 24. That is, the power feeding side portion 33 of the power feeding holder 4 is sandwiched and fixed between the cover member 24 and the heat sink member 2. Further, the semiconductor light source 3 is fixed to the heat sink member 2 via the power supply holder 4. That is, the contact portions 36, 36, 36, 36 of the power supply holder 4 elastically move the substrate 9 toward the mounting surface 8 side of the heat sink member 2 through the conductive members 32, 32 of the semiconductor light source 3. The substrate 9 of the semiconductor-type light source 3 is pressed and fixed between the contact portions 36, 36, 36, 36 of the power supply holder 4 and the mounting surface 8 of the heat sink member 2. Has been. Similarly, the ribs 41, 41 of the power supply holder 4 press both ends of the substrate 9 of the semiconductor light source 3 against the heat sink member 2, and the substrate 9 of the semiconductor light source 3 is connected to the power supply holder 4. The ribs 41 and 41 and the heat sink member 2 are sandwiched and fixed.

  Then, the reflector 6 is set on the heat sink member 2 from above, and the screw 27 is screwed into the hole 26 of the heat sink member 2 from above the reflector 6 to fix the reflector 6 to the heat sink member 2. . Further, the projection lens 7 is fixed to the heat sink member 2 via the lens fixing member 46 (see FIGS. 1, 2, and 3).

  In this way, the heat sink member 2, the semiconductor-type light source 3, the power supply holder 4, the fixing member 5, the reflector 6, the projection lens 7, and the lens fixing member 46 are assembled to each other. A vehicular lamp 1 according to the first embodiment is configured. Note that a plurality of vehicle lamps 1 according to the first embodiment may be attached to the bracket 47 as shown in FIGS.

  The vehicular lamp 1 according to the first embodiment is configured as described above, and the operation thereof will be described below.

  First, as shown in FIGS. 16 and 17, the power supply side connectors 20, 20 are inserted into the insertion holes 39, 39 of the power supply holder 4 of the vehicular lamp 1, and are attached to and removed from the contact portions 18, 18 of the power supply holder 4. Connect as possible and electrically. 18 and 19, when a plurality of vehicle lamps 1 are attached to the bracket 47 as shown in FIGS. 18 and 19, a part of the power connectors 20 and 20 and their harnesses 29 and 29 are provided. Is housed in the housing portion 17 and the recesses 28, 28 of the heat sink member 2 of the vehicle lamp 1, and the rest of the harnesses 29, 29 are wired upward. For this reason, since the vehicular lamp 1 according to the first embodiment does not protrude outward from the heat sink member 2, the heat sink members 2 can be brought into close contact with each other (left and right). As a result, the vehicle lamp 1 according to the first embodiment has good heat dissipation since the heat sink members 2 of the plurality of vehicle lamps 1 can be brought into close contact with each other.

  Then, the light emitter 30 of the semiconductor-type light source 3 of the vehicular lamp 1 is turned on. Then, light is emitted from the light emitter 30 of the semiconductor-type light source 3. This light passes through the light transmitting member 31 of the semiconductor light source 3 and is reflected by the reflecting surface 45 of the reflector 6, and this reflected light is concentrated on the second focal point of the reflecting surface 45. A part of the reflected light concentrated on the second focus is cut off by the shade 15. The reflected light that is not cut off by the shade 15 forms a predetermined light distribution pattern having a cut-off line. In addition, by providing a reflection surface on the shade 15, the reflected light cut off by the shade 15 can be reflected by the reflection surface of the shade 15 to form a predetermined auxiliary light distribution pattern.

  The predetermined light distribution pattern (or the predetermined light distribution pattern and the predetermined auxiliary light distribution pattern) passes through the projection lens 7 and is projected (irradiated), for example, in front of the automobile (vehicle) as a passing light distribution pattern. To light the road surface.

  The vehicular lamp 1 according to the first embodiment is configured and operated as described above, and the effects thereof will be described below.

  In the vehicular lamp 1 according to the first embodiment, the power supply holder 4 is mounted by the cover member 24 and the screw 25 of the fixing member 5 in a state where the semiconductor light source 3 is directly mounted on the mounting surface 8 of the heat sink member 2. The semiconductor light source 3 is fixed to the heat sink member 2 and is sandwiched and fixed between the power supply holder 4 and the heat sink member 2. As a result, in the vehicular lamp 1 according to the first embodiment, since the semiconductor-type light source 3 is in direct contact with the heat sink member 2, heat transfer from the semiconductor-type light source 3 to the heat sink member 2 is improved. The heat dissipation effect is great.

  Moreover, in the vehicular lamp 1 according to the first embodiment, the assembly direction of the parts including the heat sink member 2, the semiconductor light source 3, the power supply holder 4, the cover member 24 of the fixing member 5 and the screw 25 is 1 from top to bottom. Direction. That is, the semiconductor-type light source 3 is directly placed on the placement surface 8 of the heat sink member 2 from above, and the power supply holder 4 is set on the semiconductor-type light source 3 and the heat sink member 2 from above to place the semiconductor-type light source 3 in the heat sink. The power supply to the semiconductor-type light source 3 can be performed while being pressed to the member 2 side, the cover member 24 of the fixing member 5 is covered from above on the power supply side portion 33 of the power supply holder 4, and the screw 25 of the fixing member 5 is covered with the cover member The fixing plate portion 43 of 24 is screwed into the hole 23 of the heat sink member 2 to fix the power supply holder 4 to the heat sink member 2, and the semiconductor light source 3 is sandwiched between the power supply holder 4 and the heat sink member 2. It is to be fixed. As described above, in the vehicle lamp 1 according to the first embodiment, the assembly direction of the components including the heat sink member 2, the semiconductor light source 3, the power supply holder 4, the cover member 24 of the fixing member, and the screw 25 is from top to bottom. Since it is in one direction, the assembling workability of the parts is good, and further, the assembling of the parts can be automated.

  Further, in the vehicular lamp 1 according to the first embodiment, since the cover member 24 of the fixing member 5 made of a member having high thermal conductivity is covered on the power supply side portion 33 of the power supply holder 4, the semiconductor light source 3 This heat is transmitted to the cover member 24 of the fixing member 5 through the power supply holder 4 or directly, and the heat radiation effect of the semiconductor light source 3 is further increased.

  Moreover, the vehicle lamp 1 according to the first embodiment fixes the cover member 24 to the heat sink member 2 by screwing the screw 25 into the heat sink member 2 from above the cover member 24, and the power supply holder 4 via the cover member 24. Is fixed to the heat sink member 2 and the semiconductor-type light source 3 is sandwiched and fixed between the power supply holder 4 and the heat sink member 2, so that the semiconductor light source 3, the power supply holder 4, the heat sink member 2, and the cover member 24 are securely attached. Can be fixed.

  Furthermore, the vehicular lamp 1 according to the first embodiment places the semiconductor light source 3 at a predetermined position of the heat sink member 2 by the positioning action of the positioning portions 10 and 10 of the heat sink member 2 and the spring portion 12 and the receiving portion 14. Since it can be positioned with high accuracy, the light from the semiconductor-type light source 3 can be controlled with high accuracy, and the light distribution can be controlled with high accuracy.

  Furthermore, the vehicular lamp 1 according to the first embodiment can fix the semiconductor-type light source 3 to the heat sink member 2 without using a fixing member such as a screw. Moreover, the semiconductor-type light source 3 can be fixed without using solder or the like. Since power can be supplied to the light source 3, the work of assembling the parts is further improved.

  Furthermore, the vehicular lamp 1 according to the first embodiment is configured such that the power supply holder 4 is fixed to the predetermined heat sink member 2 by the positioning means of the circular concave portions 21 and 21 of the heat sink member 2 and the circular convex portions 22 and 22 of the power supply holder 4. The position can be positioned with high accuracy. For this reason, the vehicular lamp 1 according to the first embodiment makes the position of the semiconductor light source 3 fixed between the power supply holder 4 and the heat sink member 2 positioned with high accuracy highly accurate. Therefore, the light from the semiconductor light source 3 can be controlled with high accuracy, and the light distribution can be controlled with high accuracy.

  Furthermore, the vehicular lamp 1 according to the first embodiment can reliably fix the semiconductor light source 3 between the power supply holder 4 and the heat sink member 2 by the ribs 41, 41 of the power supply holder 4. Moreover, the vehicular lamp 1 according to the first embodiment is sandwiched between the power supply holder 4 and the heat sink member 2 by pressing the semiconductor light source 3 toward the heat sink member 2 with the ribs 41 and 41 of the housing 19 of the power supply holder 4. Since it can fix, the semiconductor type light source 3 can be fixed to the heat sink member 2 without using fixing members, such as a screw, and the assembly | attachment workability | operativity of components further improves.

  In particular, the vehicular lamp 1 according to the first embodiment allows the power supply holder 4 to hold the semiconductor light source 3 placed directly on the heat sink member 2 toward the heat sink member 2 and to supply power to the semiconductor light source 3. In this state, the semiconductor light source 3 and the power supply holder 4 are fixed to the heat sink member 2 by the fixing member 5. As a result, in the vehicular lamp 1 according to the first embodiment, since the semiconductor-type light source 3 is directly mounted on the heat sink member 2, the light emitting unit is fixed to the heat radiating body through the engagement protrusions of the attachment. Compared with the conventional vehicle lamp, the vertical dimension can be reduced by the amount of the engagement protrusion of the attachment between the light emitting unit of the conventional vehicle lamp and the radiator.

  In addition, the vehicular lamp 1 according to the first embodiment includes contacts 35A, 35B of the power supply holder 4 in which the contacts 35A, 35B electrically contact the semiconductor light source 3 in the vertical direction, Connector portions 18 and 18 that are electrically connected to the connectors 20 and 20 in the horizontal direction, and contact portions 36, 36, 36, and 36 and the connector portions 18 and 18 are arranged in the horizontal direction to be electrically connected and wired. Since it consists of the wiring parts 37 and 37, the vertical dimension of the electric power feeding holder 4 can be made small. Thereby, the vehicular lamp 1 according to the first embodiment can further reduce the vertical dimension, and can provide a compact lamp in the vertical direction.

  Further, in the vehicular lamp 1 according to the first embodiment, since the heat sink member 2 is provided with the storage portion 17 in which the connector side portion 34 of the power supply holder 4 is stored, the vertical dimension can be further reduced. Can provide compact lamps up and down.

  20 to 22 show Example 2 of a vehicle lamp according to the present invention. In the figure, the same reference numerals as those in FIGS. 1 to 19 denote the same components. Hereinafter, the vehicular lamp in the second embodiment will be described.

  In the figure, reference numeral 48 denotes a fixing member. The fixing member 48 is made of a member having elasticity and high thermal conductivity, and is composed of a cover member that is covered on the power feeding side portion 33 of the power feeding holder 4. The cover member 48 is substantially the same as the cover member 24 of the fixing member 5 of the first embodiment.

  The cover member 48 includes a rectangular plate-shaped horizontal plate portion 49 and four vertical plate portions 50 that are bent vertically or substantially vertically from four corners of the horizontal plate portion 49. A rectangular opening 51 is provided at the center of the horizontal plate portion 49. Two rectangular plate-shaped (square claw-shaped) elastic pressing portions 52 are provided at both end portions (left and right end portions) of the horizontal plate portion 49, respectively. The outer side (front side or rear side) of the elastic pressing part 52 and the left and right sides are separated from the horizontal plate part 49, and the inner side (rear side or front side) of the two elastic pressing parts 52, 52 is The elastic pressing portion 52 is connected to the horizontal plate portion 49 and is bent on the inner side so that the outer side is slightly directed downward. The elastic pressing portion 52 elastically presses the power supply holder 4 from above to the heat sink member 2 side by pressing the cover member 48 into the heat sink member 2 from above.

  Similarly, the four vertical plate portions 50 are provided with elastic engagement portions 53 each having a square plate shape (square claw shape). The inner side (left side or right side) and the upper side of the elastic engagement part 53 are separated from the vertical plate part 50, and the lower side of the elastic engagement part 53 is connected to the vertical plate part 50, The elastic engagement portion 53 is bent at the lower side so that the upper side is slightly outward (right side or left side). The elastic engaging portion 53 is elastically engaged with the engaging portion 54 of the heat sink member 2 when the elastic pressing portion 52 elastically presses the power supply holder 4 from above to the heat sink member 2 side. The cover member 48 is fixed to the heat sink member 2, and the power supply holder 4 is fixed to the heat sink member 2 together with the elastic pressing portion 52.

  An insertion hole 55 into which the four vertical plate portions 50 of the cover member 48 are inserted is provided in a portion corresponding to the outer side surface of the power supply side portion 33 of the power supply holder 4 set in the heat sink member 2. ing. On the wall surface in the middle of the insertion hole 55, the step-shaped engaging portion 54 is provided.

  Since the vehicular lamp 1 according to the second embodiment is configured as described above, the manner of assembling each of the components is substantially the same as that of the vehicular lamp 1 according to the first embodiment. That is, the heat sink member 2, the semiconductor light source 3, the power supply holder 4, the reflector 6, the projection lens 7, and the lens fixing member 46 are assembled in exactly the same way, and the cover member 48 as a fixing member. The assembly method is slightly different.

  That is, the vertical plate portion 50 of the cover member 48 is inserted into the insertion hole 55 of the heat sink member 2 from above. Further, the cover member 48 is covered from above on the power supply side portion 33 of the power supply holder 4. Then, when the vertical plate portion 50 of the cover member 48 is inserted into the insertion hole 55 of the heat sink member 2, the elastic engagement portion 53 of the cover member 48 is bent inward. . When the elastic pressing portion 52 of the cover member 48 is elastically pressed onto the power supply side portion 33 of the power supply holder 4, the elastic engagement portion 53 of the cover member 48 is bent inward. It returns elastically and protrudes outward to elastically engage with the engaging portion 54 of the heat sink member 2. As a result, the elastic pressing portion 52 and the elastic engagement portion 53 of the cover member 48 elastically hold the power supply side portion 33 of the power supply holder 4 and the engagement portion 54 of the heat sink member 2 from above and below. Then, the heat sink member 2, the semiconductor-type light source 3, and the power supply holder 4 are fixed by a cover member 48 that is a fixing member.

  Since the vehicular lamp 1 in the second embodiment is configured as described above, it is possible to achieve substantially the same operational effects as the vehicular lamp 1 in the first embodiment.

  In particular, in the vehicular lamp 1 according to the second embodiment, since the fixing member includes the cover member 48 provided with the elastic pressing portion 52 and the elastic engagement portion 53, the number of parts can be reduced. Further, in the vehicular lamp 1 according to the second embodiment, the power supply holder 4 is fixed to the heat sink member 2 and the semiconductor light source 3 is connected to the power supply holder 4 and the heat sink member simply by pressing the cover member 48 into the heat sink member 2 from above. Therefore, the fixing operation of the semiconductor light source 3, the power supply holder 4, the heat sink member 2, and the cover member 48 is simplified, and the assembling workability of the parts is further improved.

  Moreover, in the vehicular lamp 1 according to the second embodiment, the elastic pressing portion 52 of the cover member 48 as a fixing member elastically presses the power supply side portion 33 of the power supply holder 4 from the top to the heat sink member 2 side. The semiconductor-type light source 3 can be pressed through the heat sink member 2 side, and the pressing force can be adjusted by adjusting the elastic force of the elastic pressing portion 52. For this reason, the vehicular lamp 1 according to the second embodiment improves the heat transfer of the semiconductor light source 3 to the heat sink member 2, increases the heat radiation effect of the semiconductor light source 3, and damages the semiconductor light source 3. Can be prevented. That is, if the force for pressing the semiconductor-type light source 3 to the heat sink member 2 is small, thermal resistance is generated between the semiconductor-type light source 3 and the heat sink member 2, and if it is large, the semiconductor-type light source 3 may be damaged.

  Hereinafter, examples other than the first and second embodiments will be described. In the first and second embodiments, an automotive headlamp will be described as a vehicular lamp. However, in the present invention, the vehicle lamp is a lamp other than the automotive headlamp, such as a fog lamp, an AFS additional lamp, a cornering lamp, a tail lamp of a rear combination lamp, a brake lamp, a tail brake lamp, and a backup lamp. May be.

It is a top view of the lamp unit which shows Example 1 of the vehicle lamp concerning this invention. Similarly, it is the II arrow directional view (side view) in FIG. Similarly, it is the III-III sectional view taken on the line in FIG. Similarly, it is a partial top view which shows the state which fixed the cover member and screw of the fixing member on the heat sink member, the semiconductor type light source, and the power supply holder. Similarly, it is a partial top view which shows the state which set the electric power feeding holder on the heat sink member and the semiconductor type light source. Similarly, it is a partial plan view showing a connector part and a contact part of a contact by breaking a part of a housing of a power supply holder set on a heat sink member and a semiconductor type light source. Similarly, it is a partial top view which shows the state which mounted the semiconductor type light source directly on the mounting surface of a heat sink member. Similarly, it is the partial top view which showed the mounting surface of the heat sink member, and its peripheral part. Similarly, it is the IX-IX line cross section in FIG. Similarly, it is an exploded sectional view showing how to assemble each component. Similarly, it is the XI-XI line cross section in FIG. Similarly, it is the XII-XII line cross section in FIG. Similarly, it is a perspective view which shows the contact of an electric power feeding holder. Similarly, it is explanatory drawing which shows one contact of an electric power feeding holder. Similarly, it is explanatory drawing which shows the other contact of an electric power feeding holder. Similarly, it is explanatory drawing which shows the state before connecting the connector of a power supply side to the connector part of an electric power feeding holder. Similarly, it is explanatory drawing which shows the state which connected the connector of the power supply side to the connector part of the electric power feeding holder. Similarly, it is a top view which shows the state which attached the three vehicle lamps to the bracket. Similarly, it is a XIX arrow line view (front view) in FIG. It is a partial top view of the state which fixed the cover member of the fixing member on the heat sink member which shows Example 2 of the vehicle lamp concerning this invention, a semiconductor type light source, and the electric power feeding holder. Similarly, it is the XXI-XXI line cross section in FIG. Similarly, it is a perspective view which shows the cover member of a fixing member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Vehicle lamp 2 Heat sink member 3 Semiconductor type light source 4 Power supply holder 5 Fixing member 6 Reflector 7 Projection lens 8 Mounting surface 9 Substrate 10, 10 Positioning part 11 Storage groove 12 Spring part 13 Upper end part 14 of vertical part of back side 14 Reception Part 15 Shade 16 Edge 17 Storage part 18, 18 Connector part 19 Housing 20, 20 Power supply side connector 21, 21 Circular concave part 22, 22 Circular convex part 23 Hole 24 Cover member 25 Screw 26 Hole 27 Screw 28, 28 Concave 29, 29 Harness 30 Light emitter 31 Light transmission member 32, 32 Conductive member 33 Power supply side portion 34 Connector side portion 35A, 35B Contact 36, 36, 36, 36 Connection portion 37, 37 Connection wiring portion 38 Opening portion 39, 39 Insertion hole 40 steps 41, 41 ribs 42 openings 43 fixing plates Portion 44 Through-hole 45 Reflecting surface 46 Lens fixing member 47 Bracket 48 Cover member (fixing member)
49 Horizontal plate portion 50 Vertical plate portion 51 Opening portion 52 Elastic pressing portion 53 Elastic engagement portion 54 Engagement portion 55 Insertion hole

Claims (7)

In a vehicle lamp that uses a semiconductor-type light source as a light source,
A heat sink member provided with a mounting surface on the upper surface;
A semiconductor-type light source mounted directly on the mounting surface of the heat sink member;
A power supply holder that is set on the semiconductor light source and the heat sink member, holds the semiconductor light source on the heat sink member side, and supplies power to the semiconductor light source;
At least the power supply holder is covered and fixed to the heat sink member, the power supply holder is fixed to the heat sink member, and the semiconductor light source is connected to the power supply holder and the heat sink member. A fixing member that is sandwiched between and fixed,
A vehicular lamp characterized by comprising: The fixing member is
A cover member made of a member having a high thermal conductivity and covered on at least the power supply holder;
A screw for fixing the power supply holder to the heat sink member via the cover member by fixing the cover member to the heat sink member by screwing into the heat sink member from above the cover member;
Composed of,
The vehicular lamp according to claim 1. The fixing member is made of a member having elasticity and high thermal conductivity, and is composed of a cover member covered at least on the power supply holder,
In the cover member,
An elastic pressing part that elastically presses the power supply holder from above to the heat sink member by pressing the cover member into the heat sink member from above;
When the elastic pressing portion elastically presses the power supply holder from above to the heat sink member side, the cover member is fixed to the heat sink member by elastically engaging with the heat sink member, and together with the elastic pressing portion, the power supply holder An elastic engagement portion for fixing the heat sink member to the heat sink member;
Are provided,
The vehicular lamp according to claim 1. In the heat sink member,
A positioning part for determining a position in one direction on the plane of the mounting surface of the semiconductor-type light source;
A spring part in which a spring force acts in a direction intersecting with the positioning direction of the positioning part on the plane of the placement surface;
A receiving portion that is opposed to the spring portion with the semiconductor light source sandwiched in a direction in which the spring force acts on the spring portion, and receives the semiconductor light source being pressed by the spring force of the spring portion;
Are provided,
The vehicular lamp according to any one of claims 1 to 3. The power supply holder is composed of a contact of an electrically conductive member having elasticity, and a housing of an insulating member that holds the contact,
The contact is electrically elastically contacted with the semiconductor-type light source from above, feeds power to the semiconductor-type light source, and sandwiches and fixes the semiconductor-type light source between the heat sink member and a power source A connector part electrically connected to the connector on the side,
The vehicular lamp according to any one of claims 1 to 4, wherein the vehicular lamp is provided. The housing and the heat sink member of the power supply holder are respectively provided with positioning portions that determine the mutual positions of the heat sink member and the power supply holder.
The vehicular lamp according to claim 5. The housing of the power supply holder is provided with a rib for holding the semiconductor-type light source from above to the heat sink member and sandwiching and fixing between the heat sink member.
The vehicular lamp according to claim 5 or 6.

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