JP2009191283A - Gas-heating device, semiconductor processing apparatus using the same, and method for manufacturing gas-heating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a gas-heating device which can be connected to a gas transport pipe in an in-line form, and can be miniaturized. <P>SOLUTION: The gas-heating device has a heater embedded in a heat transfer block itself, and has a linear hollow heating path which is bent on the way and has a circular cross-section. A gas is introduced from a gas introduction port and swirls in the hollow heating path to be heated. Thereby, the gas-heating device can efficiently heat the swirling gas even if the distance of the hollow heating path is short, and besides, can reduce the size of the whole heat transfer block because the hollow heating path is bent on the way. As a result, the whole gas-heating device can be miniaturized, and the heating efficiency is improved. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a gas heating apparatus, a semiconductor processing apparatus using the same, and a method for manufacturing the gas heating apparatus, and more particularly, to a carrier transport gas to a semiconductor processing apparatus including the semiconductor manufacturing apparatus and a gas transport pipe for a reactive gas. The gas can be easily preheated in an in-line form, or the gas can be easily heated in the gas discharge pipe, and further, when a heated inert gas or the like is injected into the gas discharge pipe The present invention relates to a gas heating device that can be easily coupled to a discharge pipe and can be downsized.

For example, in a reaction furnace such as a low-pressure CVD apparatus (LP-CVD), the reaction gas or the like is usually at a temperature of 600 ° C. to 800 ° C., and a carrier gas or reaction is performed in order to improve film formation uniformity and quality. The gas is heated to 200 ° C. or higher and supplied to LP-CVD.
Moreover, there is a problem that unnecessary precipitates such as ammonium chloride are generated from the exhaust gas of the reaction furnace and the like and adhere to the exhaust pipe, the suction pump, etc. In order to eliminate it, the temperature of the exhaust gas is set to 170. It is necessary to take measures to prevent the temperature from dropping below. In order to maintain the exhaust gas at such a temperature or to raise the exhaust gas flowing through the exhaust pipe, the suction pump, etc., it is necessary to heat the exhaust gas with an inert gas such as N ₂ .
Therefore, the gas heating apparatus by the applicant is known as a gas heating apparatus used for this (patent document 1). This is because N ₂ gas is introduced into the cyclone pipe and heated to generate a cyclone-shaped 18,000 G to 200,000 G N ₂ gas of 200 ° C. or higher, which is processed by semiconductor processing. It is injected into the gas transport pipe discharged from the apparatus (reactor) to prevent unnecessary deposits such as ammonium chloride from adhering to the discharge pipe.
Further, as a gas heating apparatus for supplying a high-temperature gas, a gas heating apparatus that supplies gas to a spiral metal tube and inserts a halogen heater at the winding center of the spiral metal tube to heat the gas is also known (Patent Document 2). ).
JP 2007-19089 A JP-A-6-221777

The gas heating device of Patent Document 1 is provided with a heating device outside the cyclone pipeline, and the length of the cyclone heating tube needs to be increased in order to set the exhaust gas to 170 ° C or higher. There is. Further, since it has a structure in which it is directly joined to the discharge pipe from the lateral direction, it cannot be easily joined in an in-line form to the carrier gas and reaction gas transport pipe.
In addition, if it is connected to the carrier gas and reactive gas introduction pipes and inserted in-line, the heating system becomes large, so the middle of the piping system becomes thicker and larger, and the proportion of the piping area in the system Becomes bigger.
The gas heating device of Patent Document 2 has an advantage that a heater can be arranged inside the spiral metal tube, but the tube has to be wound to form a spiral, so that the tube diameter becomes large and the piping system is It grows and this also increases the proportion of the piping area.

An object of the present invention is to solve such problems of the prior art, and can be coupled in an in-line form to a gas transport pipeline connected to various article processing process apparatuses such as a semiconductor processing apparatus. Gas can be easily pre-heated, or can be connected to a gas transport line exhausted from various equipment processing equipment, or can be easily connected to a discharge line when a heated inert gas is ejected. It is another object of the present invention to provide a gas heating device that can be downsized.
Another object of the present invention is that it can be connected in an in-line form to a gas transport pipe and can efficiently preheat the introduced gas such as carrier gas or reaction gas or can efficiently heat the exhaust gas. An object of the present invention is to provide a gas heating apparatus and a semiconductor processing apparatus which can be easily connected to a piping such as a chamber and can be incorporated.
Furthermore, the other object of this invention is to provide the manufacturing method which manufactures the said gas heating apparatus.

  The structure of the gas heating device of the first invention for achieving such an object is that a hollow heating path having a circular cross section and a linear shape is formed inside by being bent in the middle with the positions of both ends corresponding to each other. A linear hollow heating path in which a gas input port communicating with one end of the heat transfer block and the hollow heating path, a gas output port communicating with the hollow heating path at the other end, and a gas input port are connected. And a first heater embedded in the heat transfer block along the direction, and the gas inlet port has an outlet port that is introduced into the inlet port of the gas input port at the outer periphery of a circle having a circular cross section at one end. In order to connect the outlet of the gas input port to the outer periphery, the center of the circular cross section at one end is the flow of the gas input port. The center line of the entrance is the heat transfer block Optionally a predetermined amount offset relative to the direction toward the center of the click, in which the gas introduced from the gas inlet of the gas input port pivots hollow heating path.

The gas heating apparatus and the semiconductor processing apparatus according to the second aspect of the invention comprise a gas heating apparatus and a first transport that is connected to a gas input port of the gas heating apparatus and sends out a carrier gas, a reactive gas, or an inert gas. It has a pipe and a second transport pipe connected to the gas output port of the gas heating device and transporting carrier gas, reaction gas or exhaust gas.
Further, the invention of the method for manufacturing a gas heating device according to the third aspect of the present invention includes a step of manufacturing the first heat transfer block in which the heat transfer block is formed with a heating passage of a portion bent in the middle, and a circular cross section. A step of manufacturing a second heat transfer block in which two linear heating passages are formed adjacent to each other with a predetermined amount offset, and the first heat transfer block and the second heat transfer block are joined together. The process comprises a step of manufacturing a heat transfer block having a circular cross section and a linear hollow heating path by communicating a heating path of a portion bent in the middle with two heating paths having a predetermined offset.

In the first invention, a heater is embedded in the heat transfer block itself, a linear hollow heating path is formed with a circular cross-section bent in the middle, and the gas introduced from the gas input port swirls. Heated in a hollow heating path. Thereby, even if the distance of a hollow heating path is short, since gas turns, it can heat efficiently, and since the hollow heating path is bent in the middle, the whole heat-transfer block can be suppressed small. As a result, the entire gas heating apparatus can be reduced in size and the heating efficiency is improved.
In addition, the gas is injected at the outlet of the gas input port at the outer periphery of the circular cross section at one lower end of the hollow heating path having a predetermined amount of offset and the tangential direction (or a direction parallel thereto). Because it is connected, it is easy to arrange the inlet of the gas input port and the outlet of the gas output port in a straight line when viewed from the plane or at a position rotated 90 ° further from the opposed arrangement of the gas input / output port. Can be. Thereby, the gas input port and the gas output port can be easily connected in-line to other piping. Furthermore, since the circular circle with a circular cross section at one lower end of the hollow heating path has a predetermined amount of offset, the heating path can be biased inside the heat transfer block, and the first heater can be formed inside the heat transfer block. Can be buried in the back. Thereby, the thermal efficiency supplied to the heating passage is improved.
As a result, in the apparatus in the article manufacturing process or the article processing process, the gas can be easily coupled to the gas transport pipeline in an in-line manner, and the gas can be heated efficiently.

In the second invention, since the gas input port and the gas output port can be easily arranged opposite to each other or at a right angle with respect to the heat transfer block, the carrier gas, the reactive gas or the inert gas is sent out. It can be easily connected between the transport pipe and the second transport pipe, and can be easily incorporated into the pipe. Further, when the gas discharged from the second transport pipe is transported, the gas flowing through the second transport pipe can be easily heated, and the inert gas heated to the second transport pipe can be easily heated. Can be sent out.
Furthermore, in the third invention, an inverted U-shaped heating path is easily formed inside the heat transfer block.
As a result, it is possible to easily realize a semiconductor processing system or the like that can be easily incorporated in an in-line form into piping of a reaction furnace or a processing chamber.

FIG. 1 is a partial sectional plan view of a gas heating apparatus used in a semiconductor processing apparatus of an embodiment to which the gas heating apparatus of the present invention is applied, and its AA longitudinal sectional view, FIG. FIG. 2B is a cross-sectional view taken along the line BB of FIG. 2A, FIG. 3 is a cross-sectional view taken along the line CC of FIG. 2A, and FIG. FIG. 5 is an explanatory diagram corresponding to FIG. 1 (a) of another embodiment, FIG. 5 is an explanatory diagram corresponding to FIG. 1 (b) of another embodiment in which the hollow heating path is hollow, and FIG. FIG. 7 is an explanatory view of a semiconductor processing system in which a gas heating device is incorporated in a pipe of the processing apparatus, and FIG. 7 is a cross section of a joint portion in an embodiment in which the gas heating apparatus is a heating joint with respect to the pipe of the semiconductor processing apparatus in FIG. It is explanatory drawing.
FIG. 1A is a partial cross-sectional plan view of a gas heating device, in which 10 is the gas heating device, 1 is a gas input port that forms a gas introduction pipe, and 2 is a gas outflow pipe. The gas output port that forms a passage is denoted by 3, and 3 is a box-shaped vacuum heat insulating cover (housing) having an open bottom. The vacuum heat insulating cover 3 has a cross section at the top so that the inside can be seen in FIG. This is a metal plate in which the vacuum layer 3a is sandwiched between two thin plates having a vacuum layer 3a formed therein, and the heat transfer block 4 (see FIG. 1B) by screws or the like (not shown). ) Is fixed at the head.
FIG. 1B is an AA longitudinal sectional view of the gas heating apparatus 10, and the heat transfer block 4 is made of SUS (stainless steel) and has an inverted U-shaped gas heating passage as a whole. This is a prismatic cylinder formed. The size is 15 mm × 15 mm to 50 mm × 50 mm square when viewed from the plane, and the height is about 40 mm to 80 mm.
Inside the heat transfer block 4, a hollow heating path 5 is formed which has a circular cross section bent in an inverted U shape and forms a straight line. In addition, the diameter of the hollow heating path 5 is 5 mmφ to 15 mmφ.

As shown in FIGS. 1 (a) and 1 (b), the hollow heating path 5 has a cylindrical hollow path 51 having a circular cross section from the lower end of the heat transfer block 4 to which the gas input port 1 is connected. It is connected to a cylindrical communication hollow path 52 in the upper part and is bent sideways in a crank shape. The heat transfer block 4 is provided with a cylindrical hollow passage 53 adjacent to the hollow passage 51, and the tip of the communication hollow passage 52 is connected at the head of the hollow passage 53 so that the hollow passage is formed in a crank shape here. It is bent down. The hollow path 53 falls linearly as it is, is formed up to the end of the hollow path 53 corresponding to the end of the hollow path 51, and the gas output port 2 is connected to the end of the hollow path 53.
In addition, the hollow path 51, the hollow path 53, and the diameter of the hollow circle of these connection hollow paths 52 are substantially equal, the dotted line part of FIG. 1 (a), BB sectional drawing of FIG. As shown in FIG. 3 which shows a CC cross-sectional view of 2 (a), the hollow passage 51 is formed inside the heat transfer block 4 with a predetermined offset with respect to the hollow passage 53 (described later). Accordingly, the communication hollow path 52 has a predetermined inclination in the horizontal direction as indicated by a dotted line in FIGS. 1 (a) and 2 (b).
A space 6 is provided at the head of the heat transfer block 4 between the inside of the vacuum heat insulating cover 3 and the heat transfer block 4, and a temperature control device 7 is provided on the head of the heat transfer block 4. ing. Thereby, it is stored inside the vacuum heat insulating cover 3. The temperature control device 7 has a temperature sensor facing the communication hollow path 52 and controls the hollow heating path 5 or the gas flowing therethrough to a target temperature according to the setting from the outside. Note that the temperature control device 7 controls the amount of heat generated by the resistance heating element by supplying electric power to each of the resistance heating elements 8, 8a, 9, 9a described later as a sheath heater. For example, the temperature control device 7 may be embedded as a temperature controller that heats the transport gas by incorporating a bimetal that is turned ON / OFF at 100 ° ± 5 ° C. Moreover, it is good also as a temperature regulator which can set temperature independently by picking the range of 100 degree +/- 5 degreeC-150 degree +/- 5 degreeC etc. and setting temperature from the exterior. When the temperature control device 7 is a temperature controller, the control device 31 described with reference to FIG.

In FIG.1 (b), although the heat-transfer block 4 has shown as a thing with an integrated head and bottom, this is the rectangular shape in which the communication hollow path 52 in which a channel | path bends in a crank shape was formed. A head block 41, a rectangular column main block 42 in which a hollow path 51 and a hollow path 53 are formed with a predetermined offset, and a rectangular head block 41 whose inner wall is mirror-finished in advance and a main body whose inner wall is mirror-finished in advance. After the block 42 is manufactured, these are joined and integrated later. 43 is a welding line which joined these by laser welding. Therefore, the inner wall surface of the heat transfer block 4 is in a mirror-finished state. In addition, the cylinder of the communication hollow path 52 formed in the head block 41 is cut out so that the head end side of the main body block 42 is cut into a curve and the joining surface forms a cylindrical wall surface.
As shown in FIG. 1B and the AA longitudinal sectional view of FIG. 1B, the gas input port 1 is connected to the lower end of the hollow passage 51 at the bottom of the heat transfer block 4. The inflow port 13 of the output port 2 is also coupled to the lower end portion of the hollow path 51 that becomes the bottom of the heat transfer block 4.
Thereby, the hollow heating path 5 turns into a circular path with a circular section that is folded back and returned to the original direction. Note that 11 is an inlet of the gas input port 1, and 14 is an outlet of the gas input port 2.

In FIG. 1B, the gas input port 1 and the gas output port 2 are shown as being integrated with the main body block 42 as being cut out from the heat transfer block 4 (main body block 42). 1 and the gas output port 2 are constituted by another pipe member whose outer periphery is threaded, and this is screwed into a screw hole drilled slightly upward from the bottom of the heat transfer block 4 so that the heat transfer block 4 (main body It may be provided integrally coupled to the block 42).
The gas input port 1 and the gas output port 2 are, for example, threaded on the outer periphery of the portion protruding from the main body block 42 of the tube forming the gas introduction conduit as shown in the embodiment of FIG. It is coupled to the gas transport pipe by being screwed together with a joint member provided at the end of the pipe, but it may be a joint pipe part.
When the joint of the gas transport pipe is a welded joint, the outer periphery is joined in a form in which the mating welded joint member is fitted directly to the outer periphery of the joint pipe portion without being threaded. Further, a female joint member such as a cap nut may be attached to the joint pipe portion, and in this case, it is screwed with a joint member such as a male nut of the gas transport pipe. In this case as well, it is not necessary to cut off the outer periphery of the joint pipe portion.

In FIG. 2 (a), the vacuum heat insulating cover 3 shows a heat transfer block 4 as a partial cross-section for the sake of convenience of internal description, but the heat transfer block 4 includes the inlet 11 of the gas input port 1 and the gas output port 2. Except for the portion of the outlet 14 and the bottom, it is covered with a vacuum heat insulating cover 3. However, in order to cover the heat insulating block 4 from above with the vacuum heat insulating cover 3, a notch 32 is provided downward from the gas input port 1 portion. There is a similar notch 33 (see FIG. 3) on the gas output port 2 side, but this is not visible in this figure.
As shown in FIGS. 1 (a) and 1 (b), the gas input port 1 and the gas output port 2 are arranged to face each other, and as shown in the CC sectional view of FIG. A center line L connecting the center of the inlet 11 and the center of the outlet 14 of the gas output port 2 passes through the center O 1 of the cross-sectional circle 15 of the cylindrical hollow path at the lower end of the hollow path 53. In this case, the center line L coincides with a line in which the center line of the inlet 11 of the gas input port 1 faces the center of the heat transfer block 4.
On the other hand, the cross-sectional circle 16 of the cylindrical hollow passage at the lower end of the hollow passage 51 to which the outlet 12 of the gas input port 1 is connected is the center O2 of the sectional circle 16 so that the outlet 12 is connected in the tangential direction to the outer periphery thereof. Is at a position offset from the straight line L by a predetermined amount Δd. When the radius of the cross-sectional circle 16 is R and the diameter of the outlet 11 of the gas input port 1 is φ, the predetermined amount Δd is Δd = R−φ / 2.

As shown in FIGS. 1B and 3, a guide hole 17 is drilled to connect the outer periphery of the cross-sectional circle 16 of the cylindrical hollow path and the outlet 12 of the gas input port 1 in the tangential direction of the outer periphery. . The guide hole 17 has a diameter smaller than the diameter of the inlet 11 of the gas input port 1, and the tip of the guide hole 17 becomes the outlet 12 of the gas input port 1, and the inlet 11 and the outlet 12 are connected to each other. In order to communicate with each other, a guide hole 17 is provided so as to be offset from the center line of the inlet 11 of the gas input port 1. Thereby, the gas introduced into the inflow port 11 is injected in the tangential direction of the outer periphery of the cross-sectional circle 16 of the cylindrical hollow path or in a direction parallel thereto.
The guide hole 17 is preferably drilled in the heat transfer block 4 (main body block 42) first. Further, as shown in the drawing, the guide hole 17 or the outlet 12 thereof does not have to have a part of the side wall surface of the hole coincide with the tangential direction of the outer periphery. It may be shifted to the center side of the cross-sectional circle 16.
The center O2 of the cross-sectional circle 16 of the cylindrical hollow passage is shifted by a predetermined amount Δd from the straight line L with respect to the center O1 of the cross-sectional circle 15 of the cylindrical hollow passage, so that the sheath heater is provided in the enlarged region of the heat transfer block 4 vacated by this offset. A cylindrical resistance heating element 8 such as a cylinder is embedded along the hollow path 51 and vertically along the vertical hole 18 drilled in the heat transfer block 4 adjacent thereto.
As a result, a large heating region having a large thickness can be secured around the resistance heating element 8, and the thermal efficiency is improved. In addition, it is possible to increase the heat generation amount by increasing the diameter of the cylindrical resistance heating element 8 by the offset. In addition, a cylindrical resistance heating element 9 such as a sheath heater is also embedded in the hollow passage 53 vertically in a vertical hole 19 that is adjacently drilled in the heat transfer block 4.

  The gas introduced into the gas input port 1 is introduced into the hollow path 51 from below through the guide hole 17 described above. Thereby, the introduced gas rotates along the wall surface of the cross-sectional circle 16 of the cylindrical hollow path, becomes a cyclone, rises up the hollow path 51, contacts the side wall surface of the hollow path 51, and transfers heat from the hollow path 51. Receive. As a result, the contact area per unit time between the gas and the hollow passage 51 is improved, and the gas is heated at a high speed. The gas in the cyclone state reaches the hollow path 53 as it is through the communication hollow path 52, and goes down to the gas output port 2 from the lower side through the hollow path 53. As a result, the introduced gas can be heated to a temperature of 200 ° C. or higher at a high speed in the hollow heating path 5 of a short distance. Moreover, since the hollow heating path 5 has an inverted U shape, the heat transfer block 4 can be small.

FIG. 4 is an explanatory diagram corresponding to FIG. 1A of another embodiment.
4A shows the flow of the gas output port 2 at the lower end of the hollow passage 53 at a position where the gas output port 2 is rotated 90 ° counterclockwise from the opposing arrangement of the gas input / output ports shown in FIG. This is an embodiment in which the inlet 13 is connected to the hollow path 53.
In this case, the outlet 14 of the gas input / output port 2 is bent 90 ° counterclockwise in the direction of the straight line L shown in FIG. 3 at the center of the heat transfer block 4.
The center line O of the inlet 11 of the gas input port 1 toward the center of the heat transfer block 4 and the center line of the outlet 14 of the gas input port 2 cross at a right angle at the center of the heat transfer block 4. The offset Δd of the center of the cross-sectional circle 16 is set with respect to the direction of the center line O of the inlet 11 of the gas input port 1 toward the center of the heat transfer block 4.

The cross-sectional circle 15 and the cross-sectional circle 16 can be brought close to one side of the heat transfer block by the offset of the cross-sectional circle 16, and a cylindrical shape such as a sheath heater is located at the back of the enlarged area of the heat transfer block 4 vacated by the offset. The resistance heating elements 8 and 9 can be easily embedded along the hollow path 51 and the hollow path 53, respectively.
By the way, in this embodiment, the guide hole 17 has one wall surface along the wall surface of the inlet 11 of the gas input port 1 and is coupled to the outer periphery of the cross-sectional circle 16, and the other wall surface is the outer periphery of the cross-sectional circle 16. It is a hole squeezed on a cone in the direction.
4B shows the inlet of the gas output port 2 at the lower end of the hollow passage 53 at a position where the gas output port 2 is rotated clockwise by 90 ° from the opposing arrangement of the gas input / output ports shown in FIG. 13 is an arrangement in which the embodiment of FIG. 4A is mirror-inverted by placing a mirror in the direction of the center line O of the inlet 11 of the input port 1.
In any case, in the pipe connection, the direction of the gas input / output port can be bent.

FIG. 5 is an explanatory view corresponding to FIG. 1B of another embodiment in which the hollow heating path is made cylindrical hollow. The heating device 10 of the embodiment of FIG. 1 is effective because the hollow heating path becomes narrow when applied to a small heating device of 30 mm × 30 mm square or less, for example. Since the hollow heating path can be made larger than 30 mm × 30 mm square or more to about 50 mm × 50 mm square, in this case, the heating method in the following embodiment can be adopted.
The hollow channel 51 and the hollow channel 53 shown in FIG. 1B are formed as a cylindrical hollow channel 51a and a cylindrical hollow channel 53a by cutting the hollow channel 51 and the hollow channel 53 into a cylindrical shape in the main body block 42 of a prism. It is joined to the part block 41. The communication hollow path 52 is as shown in FIG.

The cylindrical hollow passage 51a and the cylindrical hollow passage 53a, which are not hollow hollow cylindrical passages 51b and 53b, have small-diameter cylindrical resistance heating elements (sheath heaters) 8a and 9a respectively connected to the cylindrical hollow passage 51a. The vertical holes 18a and 19a drilled along the cylindrical hollow path 53a are buried vertically. The resistance heating elements 8a and 9a are provided corresponding to the positions O1 and O2 which are the centers of the hollow path 51 and the hollow path 53 in FIG.
The resistance heating elements 8a and 9a are embedded in the support columns 51b and 53b by drilling the vertical holes 18a and 19a in the support columns 51b and 53b from the bottom of the main body block 42 and inserting them from the bottom. The position of the bottom of the heat transfer block 4 in this hole is filled with the fitting member 54. The wiring lines 55 of the embedded resistance heating elements 8 a and 9 a are drawn out through the lateral grooves 56 of the fitting members 54.
Thereby, the gas introduced into each cylindrical hollow path 51a and the cylindrical hollow path 53a is heated at high speed on both the inner wall and the outer walls of the columns 51b and 53b.

FIG. 6 is an explanatory diagram of a semiconductor processing system in which a gas heating device is incorporated in a pipe of the semiconductor processing apparatus. 20 is a vertical reactor such as LP-CVD, 21 is a gas supply system, and 22 is an exhaust gas processing system. It is. In the vertical reactor 20, a large number of wafers 30 are deposited on a deposition shelf 20a, the outside is covered with a bell jar (cover) 20b, and a reaction gas supply path 20c is formed on the lower side surface. A gas transport line 23 is provided connected to the reaction gas supply path 20c.
A filter 24 is provided between the gas supply system 21 and the gas transport line 23, and the gas heating device 10 b is inserted downstream of the filter 24. The gas heating device 10a is also inserted in the middle of the gas transport line 25 with the gas supply system 21, and an air valve AV is incorporated downstream thereof.
The gas supply system 21 includes a carrier gas cylinder (gas supply source) such as N2, a reaction gas cylinder (gas supply source) such as NH3, monosilane, and dichlorosilane, a mass flow controller (MFC), an air valve (AV), and the like. These gas supply paths are respectively connected to the gas transport pipeline 23 via an air valve (AV).

The control device 31 controls each gas cylinder of the gas supply system 21 to control a mass flow controller (MFC), an air valve (AV), and the like, as well as a pressure sensor (not shown), a gas cumulative flow meter (not shown). ) To obtain various measured values.
Furthermore, the control device 31 can control the temperatures of the gas heating devices 10a, 10b, 10c to 10d (described later) according to various measurement values. The gas heating devices 10a to 10d are the gas heating device 10 described in this embodiment.
Further, in the exhaust gas treatment system 22, the vertical reactor 20 and the exhaust pump 27 are connected by a gas transport pipe 26, and the gas heating device 10 c is inserted into the gas transport pipe 26. It passes through the exhaust line of the gas transport line 28 formed behind the exhaust pump 22 and reaches a detoxification treatment device 29 for treating the exhaust gas into harmless gas. Each part of the exhaust gas treatment system 22 is also controlled by the control device 31.

Another gas heating device 10 d is connected to the exhaust pump 27 via a manifold 30 in order to heat an inert gas such as N ₂ . Another gas heating device 10 d is connected to the exhaust pump 27 via a manifold 30 in order to heat an inert gas such as N ₂ . And each pipe | tube of each gas transport pipeline 23-26, 28 is a vacuum heat insulation pipe | tube, and the manifold 30 also has the vacuum heat insulation structure. However, in the case of the vacuum heat insulation pipe for a path exceeding 2 m in the gas transport paths 23 to 26 and 28, the gas transport paths are connected by a pipe joint such as a VCR connector.
The gas supplied from the gas heating devices 10a to 10d to the gas transport pipe and the exhaust pump is supplied in a cyclone state.
Thus, the carrier gas and the reaction gas introduced from the gas supply system 21 to the vertical reaction furnace 20 are introduced as a gas having a temperature of 200 ° C. or higher, and the gas exhausted from the vertical reaction furnace 20 is converted into a gas transport pipe. In the discharge pipe of the path 26, the temperature is maintained at 170 ° or higher.
As a result, the uniformity and quality of the film formation on the wafer 30 in the vertical reactor 20 can be improved, and the unnecessary deposits such as ammonium chloride are prevented from adhering to the discharge pipe, the suction pump, and the like. Can do.
Note that the gas heating devices 10a to 10d may be mounted in front of piping parts that are likely to generate cold spots, thereby preventing the occurrence of cold spots.

FIG. 7 is a cross-sectional explanatory view of a joint portion in an embodiment in which the gas heating device 10 is a heating joint with respect to the pipe of the semiconductor processing apparatus in FIG. 6.
When the outer diameter of each gas transport pipe of the reaction gas supply system is set to about ¼ inch (≈6.3 mm), the gas heating device 10 shown in FIG. 1 has a size of about 25 mm × 25 mm. Below, the height can be suppressed to 60 mm or less. On the other hand, even if the vacuum heat insulating cover 3 is added, the height can be about 90 mm or less.
This size is a cap nut (screw joint member) and joint male nut (fastening bolt / screw joint member), which is called a product name VCR made by CAJON, which is a substantial standard in the field of connecting small gas pipes. ) And a small-diameter gas supply pipe joint that is bonded and sealed through a gasket, and when this is further covered with a heat insulating material such as silicon rubber, the height is, for example, 70 mm to 90 mm Since the width in the tube axis direction is about 40 mm to 50 mm, the width of the gas heating device 10 including the gas input port 1 and the gas output port 2 and the height thereof are almost the same. Become.
Therefore, the gas heating apparatus 10 shown in FIGS. 1A and 1B can be used as a heating pipe joint for coupling the gas transport pipes to each other.
Of course, the gas heating apparatus 10 used as this heating joint can adopt the structure of FIG. 4 (a), (b).

As shown in FIG. 7, the pipe outer peripheral portion of the gas input port 1 forming the gas introduction pipe is threaded to form a threaded groove 60a to form a cylindrical joint pipe portion 60 that becomes a male bolt. 10 to form. Similarly, the pipe outer peripheral part of the gas output port 2 forming the gas outflow pipe line is threaded to form a screwing groove 61a to form a male pipe joint pipe part 61.
Further, a chevron-shaped circular protrusion 60b that presses the gasket 62 along the pipe axis direction is provided on the distal end side of the joint pipe portion 60 of the gas input port 1. A chevron-shaped circular protrusion 61 b that presses the same gasket 62 is also provided on the distal end side of the gas output port 2.

As a result, a cap nut (screwed joint member) 64 provided at the pipe end of the gas transport pipe 63 is screwed to the joint pipe portion 60 via the gasket 62, thereby being connected to the gas input port 1 of the gas heating device 10. The gas transport pipe 64 can be connected in a sealed state.
Similarly, a cap nut (screwed joint member) 66 provided at the pipe end of the gas transport pipe 65 is screwed to the joint pipe portion 61 via a gasket 67 to be connected to the gas output port 2 of the gas heating device 10. The gas transport pipe 65 can be connected in a sealed state.
The cap nuts (threaded joint members) 64 and 66 are illustrated so as to be transparent so that the internal coupling state can be seen.

The above is a case where the joint pipe part 60 and the joint pipe part 61 are male bolt types, but the joint pipe part 60 and the joint pipe part 61 are each formed by providing a cap nut at the pipe end and making it female. Also good. For example, if a flange is provided on the outer periphery of the tube tip side in the tube axis direction of the gas input port 1 and the gas output port 2 of FIGS. Good.
As shown in the figure, gaskets similar to the circular protrusions 60b and the circular protrusions 61b are pressed on the tube tip side of the gas input port 1 and the gas output port 2 in FIGS. 1 (a) and 1 (b). Protrusions are already provided.
Of course, one of the joint pipe portions of the gas input port 1 and the gas output port 2 can be a male type and the other can be a female type, and these can be combined.
Incidentally, as shown in the cross-sectional view of FIG. 7, in this embodiment, a vacuum heat insulating cover 3 b is also provided at the bottom of the gas heating device 10. The vacuum heat insulating cover 3b is attached to the bottom of the vacuum heat insulating cover 3 as a cap and integrated with the vacuum heat insulating cover 3, and covers the gas heating device 10 as a whole. Further, the side walls at both ends of the upper portion of the communication hollow path 52 are formed in a circular shape.

As described above, the hollow heating path of the embodiment is formed inside the rectangular heat transfer block. However, the hollow heating path of the present invention may be formed inside the circular heat transfer block. The block is not limited to SUS, and a metal having high corrosion resistance and high thermal conductivity or an alloy thereof may be used.
In the embodiment, the diameters of the hollow circles of the hollow path 51, the hollow path 53, and the communication hollow path 52 forming the hollow heating path are substantially equal, but these diameters are not necessarily equal. Good. For example, the hollow path 51 and the hollow path 53 may be conical, and each may be connected to the communication hollow path 52.
Furthermore, the gas heating device of the present invention is not limited to the case where it is provided in a pipe coupled to the semiconductor processing device, but in terms of supplying and discharging the same gas and processing liquid as the semiconductor processing device, such as a liquid crystal display device It can also be applied to gas piping of a substrate processing apparatus.

FIG. 1 is a partial cross-sectional plan view of a gas heating apparatus used in a semiconductor processing apparatus according to an embodiment to which the gas heating apparatus of the present invention is applied, wherein (a) is a transverse sectional view thereof, and (b). These are AA longitudinal cross-sectional views of Fig.1 (a). Fig.2 (a) is front view explanatory drawing of a gas heating apparatus, FIG.2 (b) is BB cross-sectional view of Fig.2 (a). FIG. 3 is a cross-sectional view taken along the line CC of FIG. FIG. 4 is an explanatory diagram corresponding to FIG. 1A of another embodiment. FIG. 5 is an explanatory view corresponding to FIG. 1B of another embodiment in which the hollow heating path is made cylindrical hollow. FIG. 6 is an explanatory diagram of a semiconductor processing system in which a gas heating device is incorporated in piping in the semiconductor processing apparatus. FIG. 7 is a cross-sectional explanatory view of a joint portion in an embodiment in which a gas heating device is a heating joint with respect to the pipe of the semiconductor processing apparatus in FIG.

Explanation of symbols

1 ... Gas input port,
2c: circular circle of the cross section of the air passage, 2 ... gas output port,
3 ... Vacuum heat insulating cover, 3a ... Vacuum layer 4 ... Heat transfer block, 5 ... Hollow heating path, 6 ... Space,
7 ... Temperature controller, 8, 8a, 9, 9a ... Resistance heating element,
10 ... Gas heating device, 11, 14 ... Inlet,
12, 13 ... Outlet, 15, 16 ... Cross-sectional circle of cylindrical hollow path,
17 ... Guide hole, 18, 19 ... Vertical hole, 20 ... Vertical reactor,
21 ... Gas supply system, 22 ... Exhaust gas treatment system,
23, 25 ... gas transport pipelines,
24 ... filter, 30 ... wafer, 31 ... control device,
51 ... Hollow path, 52 ... Communication path, 53 ... Hollow path,
51a, 53a ... cylindrical hollow path, 51b, 53b ... strut,
54 ... Main body block of prism, 55 ... Inset member.

Claims (10)

A circular heating path having a circular cross section and a linear shape is bent in the middle with the positions of both ends thereof corresponding to each other and a gas input port communicating with the hollow heating path at one end thereof And a gas output port communicating with the hollow heating path at the other end, and a first heater embedded in the heat transfer block along the linear hollow heating path connected to the gas input port And
The outlet of the gas input port injects the gas introduced into the inlet of the gas input port at the outer periphery of a circle having a circular cross section at the one end in the tangential direction or a direction parallel thereto. In order to connect the outlet of the gas input port to the outer periphery, the center of the circular circle in cross section at the one end is the direction in which the center line of the inlet of the gas input port faces the center of the heat transfer block A gas heating device in which a gas introduced from a gas inlet of the gas input port swirls in the hollow heating path, being offset by a predetermined amount.   The center line which connects the gas inflow port and gas outflow port of the said gas output port is provided along the direction of the straight line which passes along the center of the cross-sectional circle circle in the other end of the said hollow heating path. Gas heating device.   The hollow heating path has first, second, and third passages that are folded back and returned to the original direction, and the first passage is straight from the one end. The second passage extends linearly from the other end, and the tip of the first passage and the second passage extends obliquely by the predetermined amount of offset. The first heater is embedded in the region of the heat transfer block expanded by the predetermined amount of offset along the first passage and adjacent thereto. 2. The gas heating device according to 2.   The hollow heating path is bent in an inverted U shape, the heat transfer block is a prismatic metal body, and the heat transfer block is adjacent to the second heater along the second path. The gas inlet port of the gas input port and the gas outlet port of the gas output port are arranged so as to face each other in a straight line as viewed from above or at a position rotated by 90 ° from the position of the opposed arrangement. The gas heating device according to claim 3.   The first passage and the second passage are cylindrical hollow passages, and third and fourth heaters are respectively embedded in the hollow portions of the hollow passages. Item 5. A gas heating apparatus according to Item 3 or 4.   The gas heating device according to claim 5, wherein the heat transfer block is covered with a vacuum heat insulating plate except for an inlet of the gas input port, an outlet of the gas output port, a peripheral portion thereof, and a bottom surface.   The gas input port and the gas output port are each formed with a joint pipe portion in which a chevron-shaped circular protrusion that contacts the gasket protrudes at the tip end side along the pipe axis direction, and a pipe end portion of the gas transport pipe 2. The gas heating joint that couples the two gas transport pipes by coupling the joint pipe portions to the gas transport pipes via a joint member that is screwed and coupled to each other. Gas heating device.   The said joint pipe part of any one of the said gas input port and the said gas output port has the screwing groove by which the outer periphery was threaded, The screwing of the said coupling member is Claim 1 of Claim 1 Gas heating device.   The gas heating device according to any one of claims 1 to 8, and a first transport pipe connected to the gas input port of the gas heating device to send out a carrier gas, a reactive gas or an inert gas, A semiconductor processing apparatus having a second transport pipe connected to the gas output port of the gas heating apparatus and transporting the carrier gas, the reaction gas or the exhaust gas.   9. The heat transfer block in the gas heating device according to claim 1, wherein the heat transfer block includes a step of manufacturing a first heat transfer block in which a heating passage of a portion that is bent in the middle is formed, and a linear heating with the circular cross section. A step of manufacturing a second heat transfer block having two adjacent passages formed with an offset of the predetermined amount, and joining the first heat transfer block and the second heat transfer block are folded in the middle. 2. The process of manufacturing the heat transfer block having the circular cross section and the linear hollow heating path by communicating the heating path of the bent portion and the two heating paths having the predetermined amount offset. 6. A method for producing a gas heating device according to 6.

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