US20060207506A1 - Heated gas line body feedthrough for vapor and gas delivery systems and methods of employing same - Google Patents
Heated gas line body feedthrough for vapor and gas delivery systems and methods of employing same Download PDFInfo
- Publication number
- US20060207506A1 US20060207506A1 US11/438,056 US43805606A US2006207506A1 US 20060207506 A1 US20060207506 A1 US 20060207506A1 US 43805606 A US43805606 A US 43805606A US 2006207506 A1 US2006207506 A1 US 2006207506A1
- Authority
- US
- United States
- Prior art keywords
- feedthrough device
- vapor
- feedthrough
- chamber
- plumbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
Definitions
- the present invention relates generally to vapor and gas delivery systems and more particularly to the heating of a gas line body feedthrough used in a vapor delivery system such as a chemical vapor deposition chamber or an atomic layer deposition chamber.
- organometallic precursors such as tantalum tetraethoxide dimethylamino ethoxide (TAT-DMAE) as well as halogen-metallic chemistries such as TiCl 4 and others for metal, metal-oxide and metal-nitride film depositions (collectively referred to herein as organometallic precursors).
- organometallic precursors Conventional precursors have typically been delivered in a gas or vapor state thus making them amenable for use in the vapor deposition process, including ease of maintaining the precursors in the vapor state, as they are delivered to the chamber from the vapor source.
- organometallic precursors are typically delivered for use as a liquid and sometimes as a solid. Many of such precursors have low vapor pressures and others exhibit moderate vapor pressures.
- the organometallic sources are typically vaporized and transported through the delivery plumbing to the process chamber.
- Conventional methods of vaporization include the use of bubbler ampoules or direct liquid injection systems, which comprise a chemical ampoule, a liquid flow meter, a heated injector, a carrier gas mass flow controller (MFC) and heated vapor delivery lines between the precursor source and the chamber.
- MFC carrier gas mass flow controller
- the chamber 100 includes a body 102 and a lid 104 which are configured to allow removal of the lid 104 from the body 102 .
- the removable lid 104 provides for access to and maintenance of the chamber interior including the chamber cavity 106 .
- a vapor delivery path 107 is conventionally defined to pass through the chamber body 102 using a feedthrough device 108 which connects to the heated vapor plumbing (conduit) 110 at the lower side of the chamber at one end 112 thereof and mates to the lid 104 at the opposite end 114 .
- the vapor delivery path 107 may continue through additional vapor plumbing (conduit) 116 before it travels through the lid 104 and is discharged into the chamber cavity 106 through a vapor delivery head 118 , also termed a “showerhead” due to its physical configuration.
- the vapor is then discharged through the vapor delivery head 118 and is deposited on a semiconductor substrate 120 such as a silicon wafer.
- the semiconductor substrate 120 is positioned on a susceptor unit 122 during the deposition process as is understood by those of ordinary skill in the art.
- the chamber body 102 is maintained at a temperature which is lower than that of the heated vapor plumbing 110 .
- the heated vapor plumbing 110 may be maintained at a temperature of approximately 140 to 160° C. while the chamber body 102 is maintained at a temperature of approximately 45 to 65° C.
- the reduced temperature of the chamber body 102 causes, through heat transfer, the temperature of feedthrough device 108 to also be lower than that of the heated vapor plumbing 110 .
- the temperature differential between the feedthrough device 108 and the heated vapor plumbing 110 may cause condensation to occur within the vapor delivery path 107 as the vapor passes through the feedthrough 108 .
- Newly utilized organometallic precursors are particularly susceptible to such condensation due to their relatively low vapor pressures.
- condensation within the feedthrough 108 may negatively impact the chemical vapor deposition process in various ways.
- the condensation may result in particulate contaminants flowing through the vapor delivery path 107 and being deposited on the surface of the substrate or wafer 120 .
- Introduction of such particulates ultimately results in a defective semiconductor wafer or other substrate 120 which is unsuited for use in subsequent semiconductor packaging processes.
- condensation may cause clogging or material build-up within the feedthrough device 108 as well as in the vapor plumbing 116 positioned downstream therefrom along the vapor delivery path 107 .
- Such clogging may have a deleterious effect on the flow characteristics of the vapor passing therethrough.
- material build-up may have a corrosive effect on the feedthrough device 108 and vapor plumbing 116 .
- a conventional mechanical connection used in chemical delivery systems includes a VCR® metal gasket face seal fitting.
- the VCR® fitting provides for the compression of a metal (or sometimes polymer) gasket between two opposing toroid surfaces. After repeated compression (i.e., resulting from repeated disconnection and connection of the piping) the toroid surfaces will flatten out and ultimately fail to seal. This necessitates costly replacement of the fitting and may possibly require the fabrication and welding of new piping hardware.
- a feedthrough device for delivering vapor through the chamber body of a deposition chamber.
- the feedthrough device includes a longitudinal body section having a first end and a second end.
- a bore or lumen is defined within the longitudinal body and extends longitudinally therethrough from the first end to second end for delivering an amount of vapor therethrough.
- a heating device associated with the longitudinal body of the feedthrough device is oriented and configured to heat the feedthrough device to a desired temperature and maintain the temperature thereof.
- the feedthrough device including the longitudinal body and associated heating device, is configured to be complementarily received within an interior portion of the chamber body.
- the feedthrough device is further configured to be sealingly coupled with vapor plumbing externally located relative to the chamber body.
- the vapor plumbing and feedthrough device cooperatively define a vapor delivery path through which vapor is carried to a cavity within the chamber body for deposition on a substrate such as a silicon wafer.
- the feedthrough device may be formed of stainless steel or some other material exhibiting good thermal conductivity and corrosion resistance so as to efficiently transfer the heat from the heating device through the body of the feedthrough device and ultimately to the vapor passing through the bore thereof.
- a deposition chamber which may be suitable for use in conjunction with either a chemical vapor deposition process or an atomic layer deposition process.
- the deposition chamber includes a chamber body having a chamber cavity defined therein for receipt of a substrate such as a silicon wafer to have a material deposited thereon.
- a chamber lid is configured to enclose the chamber cavity of the chamber body in cooperation with the chamber body.
- a vapor delivery path is defined to carry vapor from a vapor source through the chamber body to a vapor delivery head within the chamber cavity.
- a feedthrough device serves to define a portion of the vapor delivery path which extends through the chamber body. To protect against potential condensation of the vapor, the feedthrough device includes an associated heating device to maintain the temperature of the feedthrough device, and the vapor passing therethrough, at a desired temperature.
- the deposition chamber may include additional features to help maintain the temperature of the vapor as it travels along the vapor delivery path.
- the deposition chamber may include a section of vapor plumbing interposed between the feedthrough device and the vapor delivery head.
- the section of vapor plumbing may be insulated to protect against heat loss therefrom.
- the feedthrough device may be thermally insulated with respect the chamber body to increase the efficiency of the heating device associated with the feedthrough device.
- a method for converting a chemical vapor deposition chamber having a chamber body, a chamber lid, and a feedthrough device positioned in a portion of the chamber body, into an atomic layer deposition chamber.
- the method includes removing the feedthrough device from the chamber body and replacing it with a heated feedthrough device.
- the heated feedthrough device may be a new, similarly shaped feedthrough device having a heating device associated therewith.
- the heated feedthrough device may comprise the original feedthrough device modified to include an associated heating device therewith.
- a method for delivering vapor to a vapor delivery head in a deposition chamber.
- the method includes providing a source of vapor and defining a vapor delivery path between the source of vapor and the vapor delivery head. Defining the vapor delivery path includes providing a first section of plumbing between the vapor source and the chamber body of the deposition chamber. Additionally, a feedthrough device is provided within a portion of the chamber body and is sealingly coupled to the first section of plumbing. A second section of plumbing is provided between the feedthrough device and the vapor delivery head and is accordingly coupled with the feedthrough device. Vapor is introduced into the vapor delivery path from the vapor source. The first section of vapor plumbing and the feedthrough device are heated to eliminate the potential for condensation of the vapor as it travels through the vapor delivery path.
- FIG. 1 is a partial cross section of a conventional chemical vapor deposition chamber
- FIG. 2 is a partial cross section of an exemplary deposition chamber according to one embodiment of the present invention.
- FIG. 3 shows a side view of an exemplary heating device for use with the deposition chamber of FIG. 2 ;
- FIGS. 4A and 4B show a side view and end view respectively of an exemplary feedthrough device according to certain aspects of the present invention.
- a deposition chamber 200 according to one embodiment of the present invention is shown. It is noted that the deposition chamber 200 may be a chemical vapor deposition (CVD) chamber or an atomic layer deposition (ALD) chamber. Either type of chamber may be the subject of the present invention and thus, the invention shall generally refer to a deposition chamber 200 without being specifically designated as a CVD or ALD type chamber.
- CVD chemical vapor deposition
- ALD atomic layer deposition
- the deposition chamber 200 includes a chamber body 202 and a chamber lid 204 .
- the chamber lid 204 is removable from the chamber body 202 for purposes of accessing and maintaining the chamber interior including the chamber cavity 206 .
- a vapor delivery path 207 is formed through the chamber body 202 using a feedthrough device 208 disposed in a bore 209 in the chamber body 202 .
- the vapor delivery path 207 connects to the heated vapor plumbing 210 , and an associated vapor source 211 , at the lower side of the chamber at one end 212 of the feedthrough device 208 .
- the feedthrough device 208 is also coupled with additional vapor plumbing 216 via the chamber lid 204 at the second end 214 of the feedthrough device 208 .
- the vapor delivery path 207 ultimately leads to a shower, or vapor delivery head 218 for discharging the vapor into the chamber cavity 206 for deposition onto a substrate 220 such as a silicon wafer which is positioned on a susceptor unit 222 .
- the susceptor unit 222 may be mobile to assist in receiving individual substrates 220 from a location exterior the deposition chamber 200 and subsequently positioning the received substrate 220 for the deposition process.
- the susceptor unit 222 may also include heating mechanisms for heating the substrate 220 during the deposition process as will be understood and appreciated by those of ordinary skill in the art.
- the deposition chamber 200 is located in an interstitial space such as a plenum 224 and that a barrier 226 separates the deposition chamber 200 from a mechanical or maintenance room 228 .
- a barrier 226 separates the deposition chamber 200 from a mechanical or maintenance room 228 .
- the vapor delivery path 207 travels through the chamber body 202 via the feedthrough device 208 and then through the chamber lid 204 .
- a pair of seals 230 , 232 are respectively located to create a fluid tight seal between the second end 214 of the feedthrough device 208 and the chamber lid 204 and chamber body 202 when the chamber lid 204 is in a closed position.
- the feedthrough device 208 may be coupled to the heated vapor plumbing 210 by use of a coupling 236 .
- One exemplary coupling includes a VCR® metal gasket face seal fitting available from Swagelok® whose corporate offices are located at 29500 Solon Road, Solon, Ohio 44139.
- other couplings and connecting devices may be used to couple the feedthrough device 208 to the heated vapor plumbing 210 as is understood by those of ordinary skill in the art.
- the vapor delivery path 207 formed by the above-described arrangement allows for efficient maintenance and service of the deposition chamber 200 since the chamber lid 204 may be removed without the disconnection of any external vapor plumbing which would otherwise be fixedly located and coupled to the chamber lid 204 in a manner preventing raising of the chamber lid 204 without prior disconnection of the vapor plumbing.
- the chamber lid 204 may be removed by rotating it about a hinged connection 234 in order to access the chamber cavity 206 .
- the vapor delivery path 207 will be restored with the seals 230 and 232 again, respectively forming a fluid tight connection between the feedthrough device 208 and chamber lid 204 and chamber body 202 .
- Such simple access would not be possible with fixedly located vapor plumbing attached to the chamber lid 204 .
- the vapor delivery path 207 shown in FIG. 2 is exemplary and need not include the exterior section of vapor plumbing 216 located on the chamber lid 204 .
- a vapor delivery path may include plumbing which is entirely contained in an interior section of the chamber lid 204 as the path extends from the feedthrough device 208 to the vapor delivery head 218 .
- Such a configuration would still allow access to interior of the deposition chamber 200 without requiring mechanical connection and disconnection of hard piping within the plenum 224 .
- such a configuration may also prove to be more difficult and expensive to fabricate than the embodiment depicted in FIG. 2 .
- a heating device 238 is utilized in conjunction with the feedthrough device 208 to maintain the temperature of the feedthrough device 208 and ultimately maintains the temperature of the vapor passing therethrough, at a predetermined level. Desirably, the heating device 238 maintains the temperature of the feedthrough device 208 at a temperature which is elevated relative to the temperature of the chamber body 202 and at a temperature similar to that of the heated vapor plumbing 210 . The heating device 238 enters from the mechanical or maintenance room 228 into the chamber body 202 at the same location where the feedthrough device 208 is coupled with the heated vapor plumbing 210 .
- an exemplary heating device 238 may include a cable heater, otherwise referred to as a resistance heater element, having a first unheated section 240 and a second heated section 242 .
- Heat is provided from a source of alternating current (AC) via two leads 244 which may be configured to operate at 120 VAC and 315 W.
- the leads 244 extend into the resistance heater element where they are wrapped in a stainless steel, cold formable sheath 246 such that the heating device may be shaped and configured in a desired manner.
- a second pair of sensor leads 248 are also wrapped in the sheath 246 and are connected to a temperature sensing device 250 such as a thermocouple located about midway along the second heated section 242 .
- the exemplary heating device 238 including sheath 246 , may be approximately 0.125′′ in diameter and have a length of approximately 31′′. Of the 31′′ length, the unheated section 240 may include 4′′ and the heated section 242 may include 27′′.
- Such an exemplary cable heater is available from Watlow Electric Manufacturing Company with offices at 12001 Lackland Road, St. Louis, Mo. 63146 as part number 125FH031AX-1148.
- heating devices exhibiting other configurations, dimensions and constructions may be utilized with the present invention.
- the sheath need not be formed of stainless steel, but may be formed of other thermally conductive materials.
- the diameter and length of the heating device 238 , as well as the proportions of the heated and unheated sections 242 , 240 may be varied to suit implementation with feedthrough devices 208 of varied design.
- electrical characteristics of the resistance leads 244 may vary depending upon specific implementations, as will be appreciated by those of ordinary skill in the art.
- a feedthrough device 208 configured for cooperative use with the heating device 238 , ( FIGS. 2 and 3 ) is shown.
- the feedthrough device 208 includes a bore or lumen 252 extending longitudinally therethrough and which forms a part of the vapor delivery path 207 .
- the feedthrough device 208 further includes a shoulder portion 254 at its upper end.
- the shoulder portion 254 serves to locate and position the feedthrough device 208 within the chamber body 202 .
- one or more channels or grooves 256 may be formed in the top and bottom surfaces 254 A and 254 B of the shoulder portion 254 to accommodate o-rings or other types of seals 230 , 232 (see FIG. 2 ).
- a longitudinal body portion 258 makes up the majority of the feedthrough device 208 and includes a continual helical groove 260 formed on the surface thereof which is configured for receipt of the heating device 238 .
- the size and pitch of the helical groove 260 may vary but will be determined in part by the size and configuration of the heating device 238 .
- a feedthrough device 208 having a longitudinal body portion 258 with a length of approximately 3.5′′ and an outer diameter of approximately 0.75′′ might be configured with a helical groove which is approximately 0.128′′ and exhibiting a pitch of approximately 0.2′′ for receipt of the exemplary heating device 238 described above herein.
- the helical groove 260 includes a radiused inner portion 262 which serves to complementarily receive the sheath 246 of the exemplary heating device 238 thereby increasing the area of contact between the feedthrough device 208 and the heating device 238 . Increased contact between the feedthrough device 208 and heating device 238 improves the transfer of heat therebetween resulting in an increased efficiency of the heating device 238 in heating the vapor passing therethrough.
- the helical groove 260 makes a transition 264 near the bottom of the longitudinal body portion 258 and extends longitudinally outwardly through a coupling portion 266 of the feedthrough device 208 .
- the coupling portion 266 is configured to be sealingly coupled with heated vapor plumbing 210 .
- the coupling portion 266 may include a series of threads 268 thereon for coupling the feedthrough device 208 to the heated vapor plumbing 210 through use of an appropriate fitting or coupling 236 (see FIG. 2 ).
- the feedthrough device 208 is desirably formed of a material having a high thermal conductivity such as a metal having a relatively low impurity content.
- a material having a high thermal conductivity such as a metal having a relatively low impurity content.
- Such materials may include, for example, stainless steel or aluminum.
- Stainless steel and aluminum are desirable as they also provide protection against corrosion.
- the heating device 238 may include a sheath 246 which is cold formable, as set forth above, meaning that the heating device 238 may be formed into the helical groove 260 and substantially hold its position therein without having to hot work the heating device 238 or otherwise secure it.
- it may by desirable in certain cases to adhere the heating device 238 , or at least a portion thereof, to the feedthrough device 208 regardless of whether a cold formable sheath 246 is being utilized. This may be accomplished, for example, by using conductive adhesive or by spot welding the sheath 246 to the feedthrough device 208 .
- the deposition chamber 200 delivers the vapor from a vapor source 211 through the heated vapor plumbing 210 .
- the temperature of the feedthrough device 208 is at least kept at a temperature sufficient to maintain the vapor state of the precursor material. This is accomplished by virtue of the heating device 238 operated in association with the feedthrough device 208 .
- the temperature sensing device 250 allows for monitoring of the temperature at the feedthrough device 208 so that the temperature may be appropriately altered when required by increasing or providing power through the leads 244 .
- the vapor further travels through the chamber lid 204 and vapor plumbing 216 to the vapor delivery head 218 for deposition on the substrate or wafer 220 without condensation occurring within the vapor delivery path 207 .
- the vapor plumbing 216 which carries the vapor substantially from the feedthrough device 208 to the vapor delivery head 216 may be insulated to curtail any potential heat loss in that particular section of the vapor delivery path 207 .
- heat loss along that section of the vapor delivery path 207 is considered to be less significant than the potential heat loss associated with the passage of vapor through the chamber body 202 via the feedthrough device 208 .
- a layer of insulation may be disposed within the bore 209 between the interior portion of the chamber body 202 and the feedthrough device 208 allowing for greater efficiency in heating the feedthrough device 208 and for further isolation of the feedthrough device 208 from the temperature of the chamber body 202 .
- the present invention further lends itself to various methods employing the feedthrough device 208 disclosed herein.
- a method of delivering vapor from the vapor source 211 to the vapor delivery head 218 can readily be seen with reference to FIG. 2 .
- the method includes defining a vapor delivery path 207 by providing heated vapor plumbing 210 from the vapor source 211 to the chamber body 202 .
- a feedthrough device 208 is provided and coupled to the heated vapor plumbing 210 .
- Additional vapor plumbing 216 is provided to extend between the feedthrough device 208 and the vapor delivery head 218 .
- the feedthrough device 208 is then heated using heating device 238 so as to eliminate condensation within the vapor delivery path 207 caused by cooling of the vapor due to temperature differentials between the chamber body 202 and the vapor as it travels through the feedthrough device 208 .
- a feedthrough device 208 in combination with the heating device 238 lends itself to a method of converting a CVD chamber to an ALD chamber, the ALD chamber requiring greater temperature control to maintain the associated precursors in a vapor state.
- the method of converting a CVD chamber to an ALD chamber includes removing an unheated feedthrough device from the CVD chamber body and replacing it with a heated feedthrough device.
- the heated feedthrough device may be either a new feedthrough device or the original feedthrough device modified in accordance with the present invention to allow heating thereof while positioned within the chamber body.
- the present invention provides an easy and economical means of updating and converting existing equipment in lieu of complete replacement of the same.
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
A feedthrough device for use in deposition chambers such as chemical vapor deposition chambers and atomic layer deposition chambers and methods using the same in association with such chambers as well as chambers so equipped. The feedthrough device includes an associated heating device to maintain the temperature of the feedthrough device above a predetermined level and thus maintain a temperature differential between the deposition chamber body and a vaporize organometallic precursor as it passes therethrough. The feedthrough device may include a helical groove formed along the surface of a longitudinal body portion thereof to complementarily receive a resistance type cable heater. The heater may further include a temperature sensing device to assist in monitoring and controlling the temperature of the feedthrough device.
Description
- This application is a divisional of application Ser. No. 09/932,860, filed Aug. 17, 2001, pending.
- 1. Field of the Invention
- The present invention relates generally to vapor and gas delivery systems and more particularly to the heating of a gas line body feedthrough used in a vapor delivery system such as a chemical vapor deposition chamber or an atomic layer deposition chamber.
- 2. State of the Art
- Modern semiconductor processing equipment, specifically chemical vapor deposition (CVD) and atomic layer deposition (ALD) systems, are migrating to the use of organometallic precursors such as tantalum tetraethoxide dimethylamino ethoxide (TAT-DMAE) as well as halogen-metallic chemistries such as TiCl4 and others for metal, metal-oxide and metal-nitride film depositions (collectively referred to herein as organometallic precursors). Conventional precursors have typically been delivered in a gas or vapor state thus making them amenable for use in the vapor deposition process, including ease of maintaining the precursors in the vapor state, as they are delivered to the chamber from the vapor source. However, organometallic precursors are typically delivered for use as a liquid and sometimes as a solid. Many of such precursors have low vapor pressures and others exhibit moderate vapor pressures. The organometallic sources are typically vaporized and transported through the delivery plumbing to the process chamber. Conventional methods of vaporization include the use of bubbler ampoules or direct liquid injection systems, which comprise a chemical ampoule, a liquid flow meter, a heated injector, a carrier gas mass flow controller (MFC) and heated vapor delivery lines between the precursor source and the chamber.
- Referring to
FIG. 1 , aconventional CVD chamber 100 is shown. Thechamber 100 includes abody 102 and alid 104 which are configured to allow removal of thelid 104 from thebody 102. Theremovable lid 104 provides for access to and maintenance of the chamber interior including thechamber cavity 106. Avapor delivery path 107 is conventionally defined to pass through thechamber body 102 using afeedthrough device 108 which connects to the heated vapor plumbing (conduit) 110 at the lower side of the chamber at oneend 112 thereof and mates to thelid 104 at theopposite end 114. Thevapor delivery path 107 may continue through additional vapor plumbing (conduit) 116 before it travels through thelid 104 and is discharged into thechamber cavity 106 through avapor delivery head 118, also termed a “showerhead” due to its physical configuration. The vapor is then discharged through thevapor delivery head 118 and is deposited on asemiconductor substrate 120 such as a silicon wafer. Thesemiconductor substrate 120 is positioned on asusceptor unit 122 during the deposition process as is understood by those of ordinary skill in the art. - One problem with the above described
deposition chamber 100 is that thechamber body 102 is maintained at a temperature which is lower than that of the heatedvapor plumbing 110. For example, the heatedvapor plumbing 110 may be maintained at a temperature of approximately 140 to 160° C. while thechamber body 102 is maintained at a temperature of approximately 45 to 65° C. The reduced temperature of thechamber body 102 causes, through heat transfer, the temperature offeedthrough device 108 to also be lower than that of the heatedvapor plumbing 110. The temperature differential between thefeedthrough device 108 and theheated vapor plumbing 110 may cause condensation to occur within thevapor delivery path 107 as the vapor passes through thefeedthrough 108. Newly utilized organometallic precursors are particularly susceptible to such condensation due to their relatively low vapor pressures. - The occurrence of condensation within the
feedthrough 108 may negatively impact the chemical vapor deposition process in various ways. For example, the condensation may result in particulate contaminants flowing through thevapor delivery path 107 and being deposited on the surface of the substrate or wafer 120. Introduction of such particulates ultimately results in a defective semiconductor wafer orother substrate 120 which is unsuited for use in subsequent semiconductor packaging processes. - Additionally, the condensation may cause clogging or material build-up within the
feedthrough device 108 as well as in thevapor plumbing 116 positioned downstream therefrom along thevapor delivery path 107. Such clogging may have a deleterious effect on the flow characteristics of the vapor passing therethrough. Additionally, material build-up may have a corrosive effect on thefeedthrough device 108 andvapor plumbing 116. - While it is possible to route the
heated vapor plumbing 110 around thechamber body 102 such that it connects directly through thelid 104 to the vapor delivery head 118 (thereby eliminating thefeedthrough device 108 and additional vapor plumbing 116), in order to provide continual heat to the flowing vapor along thevapor delivery path 107, such a configuration is undesirable for various reasons. - For example, removal of the
lid 104 from thechamber body 102 would require mechanical disconnection of theheated vapor plumbing 110. This would increase the amount of time required to service and maintain theCVD chamber 100. Perhaps even more significantly, mechanical disconnection of theheated vapor plumbing 110 would increase the potential for contamination the CVD process and the products produced thereby. Such increased potential for contamination results from the fact that theCVD chamber 100 is conventionally located and operated in aplenum 124 adjacent a clean room (not shown) which may be separated by abarrier 126 from amechanical room 128.Wafers 120 are passed from the adjacent clean room into theCVD chamber 100 for processing. The implementation of a heated vapor line running exterior to thechamber body 102 in theplenum 124 would require increased maintenance activities within theplenum area 124 resulting in the increased likelihood of particulates and contaminants entering theplenum area 124, or possibly even into the adjacent clean room, each time repair or maintenance is required. - Additionally, the repeated connection and disconnection of the heated gas plumbing (i.e., from the lid 104) leads to the degradation of the mechanical connection. For example, a conventional mechanical connection used in chemical delivery systems includes a VCR® metal gasket face seal fitting. The VCR® fitting provides for the compression of a metal (or sometimes polymer) gasket between two opposing toroid surfaces. After repeated compression (i.e., resulting from repeated disconnection and connection of the piping) the toroid surfaces will flatten out and ultimately fail to seal. This necessitates costly replacement of the fitting and may possibly require the fabrication and welding of new piping hardware.
- In view of the shortcomings in the art, it would be advantageous to provide a deposition chamber which allowed for the use of organometallic precursors having relatively low vapor pressures without condensation of such organometallic precursors occurring during delivery of the vapor to the chamber.
- It would also be advantageous to provide a method of modifying existing deposition chambers to allow the use of organometallic precursors therewith. Particularly, it would be advantageous to provide a method of converting a chemical vapor deposition chamber configured for use with conventional precursors into an atomic layer deposition chamber or a chemical vapor deposition chamber suited for use with organometallic precursors.
- In accordance with one aspect of the invention, a feedthrough device is provided for delivering vapor through the chamber body of a deposition chamber. The feedthrough device includes a longitudinal body section having a first end and a second end. A bore or lumen is defined within the longitudinal body and extends longitudinally therethrough from the first end to second end for delivering an amount of vapor therethrough.
- A heating device associated with the longitudinal body of the feedthrough device is oriented and configured to heat the feedthrough device to a desired temperature and maintain the temperature thereof. The feedthrough device, including the longitudinal body and associated heating device, is configured to be complementarily received within an interior portion of the chamber body.
- The feedthrough device is further configured to be sealingly coupled with vapor plumbing externally located relative to the chamber body. The vapor plumbing and feedthrough device cooperatively define a vapor delivery path through which vapor is carried to a cavity within the chamber body for deposition on a substrate such as a silicon wafer.
- The feedthrough device may be formed of stainless steel or some other material exhibiting good thermal conductivity and corrosion resistance so as to efficiently transfer the heat from the heating device through the body of the feedthrough device and ultimately to the vapor passing through the bore thereof.
- In accordance with another aspect of the invention, a deposition chamber is provided which may be suitable for use in conjunction with either a chemical vapor deposition process or an atomic layer deposition process. The deposition chamber includes a chamber body having a chamber cavity defined therein for receipt of a substrate such as a silicon wafer to have a material deposited thereon. A chamber lid is configured to enclose the chamber cavity of the chamber body in cooperation with the chamber body. A vapor delivery path is defined to carry vapor from a vapor source through the chamber body to a vapor delivery head within the chamber cavity. A feedthrough device serves to define a portion of the vapor delivery path which extends through the chamber body. To protect against potential condensation of the vapor, the feedthrough device includes an associated heating device to maintain the temperature of the feedthrough device, and the vapor passing therethrough, at a desired temperature.
- The deposition chamber may include additional features to help maintain the temperature of the vapor as it travels along the vapor delivery path. For example, the deposition chamber may include a section of vapor plumbing interposed between the feedthrough device and the vapor delivery head. The section of vapor plumbing may be insulated to protect against heat loss therefrom. Additionally, the feedthrough device may be thermally insulated with respect the chamber body to increase the efficiency of the heating device associated with the feedthrough device.
- In accordance with another aspect of the invention, a method is provided for converting a chemical vapor deposition chamber having a chamber body, a chamber lid, and a feedthrough device positioned in a portion of the chamber body, into an atomic layer deposition chamber. The method includes removing the feedthrough device from the chamber body and replacing it with a heated feedthrough device. The heated feedthrough device may be a new, similarly shaped feedthrough device having a heating device associated therewith. Alternatively, the heated feedthrough device may comprise the original feedthrough device modified to include an associated heating device therewith.
- In accordance with yet another aspect of the invention, a method is provided for delivering vapor to a vapor delivery head in a deposition chamber. The method includes providing a source of vapor and defining a vapor delivery path between the source of vapor and the vapor delivery head. Defining the vapor delivery path includes providing a first section of plumbing between the vapor source and the chamber body of the deposition chamber. Additionally, a feedthrough device is provided within a portion of the chamber body and is sealingly coupled to the first section of plumbing. A second section of plumbing is provided between the feedthrough device and the vapor delivery head and is accordingly coupled with the feedthrough device. Vapor is introduced into the vapor delivery path from the vapor source. The first section of vapor plumbing and the feedthrough device are heated to eliminate the potential for condensation of the vapor as it travels through the vapor delivery path.
- The foregoing and other advantages of the invention will become apparent upon reading the following detailed description and upon reference to the drawings in which:
-
FIG. 1 is a partial cross section of a conventional chemical vapor deposition chamber; -
FIG. 2 is a partial cross section of an exemplary deposition chamber according to one embodiment of the present invention; -
FIG. 3 shows a side view of an exemplary heating device for use with the deposition chamber ofFIG. 2 ; and -
FIGS. 4A and 4B show a side view and end view respectively of an exemplary feedthrough device according to certain aspects of the present invention. - Referring to
FIG. 2 , adeposition chamber 200 according to one embodiment of the present invention is shown. It is noted that thedeposition chamber 200 may be a chemical vapor deposition (CVD) chamber or an atomic layer deposition (ALD) chamber. Either type of chamber may be the subject of the present invention and thus, the invention shall generally refer to adeposition chamber 200 without being specifically designated as a CVD or ALD type chamber. - The
deposition chamber 200 includes achamber body 202 and achamber lid 204. Thechamber lid 204 is removable from thechamber body 202 for purposes of accessing and maintaining the chamber interior including thechamber cavity 206. Avapor delivery path 207 is formed through thechamber body 202 using afeedthrough device 208 disposed in abore 209 in thechamber body 202. Thevapor delivery path 207 connects to theheated vapor plumbing 210, and an associatedvapor source 211, at the lower side of the chamber at oneend 212 of thefeedthrough device 208. Thefeedthrough device 208 is also coupled withadditional vapor plumbing 216 via thechamber lid 204 at thesecond end 214 of thefeedthrough device 208. Thevapor delivery path 207 ultimately leads to a shower, orvapor delivery head 218 for discharging the vapor into thechamber cavity 206 for deposition onto asubstrate 220 such as a silicon wafer which is positioned on asusceptor unit 222. Thesusceptor unit 222 may be mobile to assist in receivingindividual substrates 220 from a location exterior thedeposition chamber 200 and subsequently positioning the receivedsubstrate 220 for the deposition process. Thesusceptor unit 222 may also include heating mechanisms for heating thesubstrate 220 during the deposition process as will be understood and appreciated by those of ordinary skill in the art. - It is noted that the
deposition chamber 200 is located in an interstitial space such as aplenum 224 and that abarrier 226 separates thedeposition chamber 200 from a mechanical ormaintenance room 228. As is understood by those of ordinary skill in the art, it is desirable to locate various connections and equipment, such as thevapor plumbing 210, in themaintenance room 228 so as to reduce the likelihood of introducing particulates and contaminants within theplenum 224 or an adjacent clean room (not shown). - Still referring to
FIG. 2 , thevapor delivery path 207 travels through thechamber body 202 via thefeedthrough device 208 and then through thechamber lid 204. A pair ofseals second end 214 of thefeedthrough device 208 and thechamber lid 204 andchamber body 202 when thechamber lid 204 is in a closed position. Thefeedthrough device 208 may be coupled to theheated vapor plumbing 210 by use of acoupling 236. One exemplary coupling includes a VCR® metal gasket face seal fitting available from Swagelok® whose corporate offices are located at 29500 Solon Road, Solon, Ohio 44139. Of course, other couplings and connecting devices may be used to couple thefeedthrough device 208 to theheated vapor plumbing 210 as is understood by those of ordinary skill in the art. - The
vapor delivery path 207 formed by the above-described arrangement allows for efficient maintenance and service of thedeposition chamber 200 since thechamber lid 204 may be removed without the disconnection of any external vapor plumbing which would otherwise be fixedly located and coupled to thechamber lid 204 in a manner preventing raising of thechamber lid 204 without prior disconnection of the vapor plumbing. For example, using the configuration of the present invention, thechamber lid 204 may be removed by rotating it about a hingedconnection 234 in order to access thechamber cavity 206. When thechamber lid 204 is closed, thevapor delivery path 207 will be restored with theseals feedthrough device 208 andchamber lid 204 andchamber body 202. Such simple access would not be possible with fixedly located vapor plumbing attached to thechamber lid 204. - It is noted that the
vapor delivery path 207 shown inFIG. 2 is exemplary and need not include the exterior section ofvapor plumbing 216 located on thechamber lid 204. Alternatively, for example, a vapor delivery path may include plumbing which is entirely contained in an interior section of thechamber lid 204 as the path extends from thefeedthrough device 208 to thevapor delivery head 218. Such a configuration would still allow access to interior of thedeposition chamber 200 without requiring mechanical connection and disconnection of hard piping within theplenum 224. However, such a configuration may also prove to be more difficult and expensive to fabricate than the embodiment depicted inFIG. 2 . - A
heating device 238 is utilized in conjunction with thefeedthrough device 208 to maintain the temperature of thefeedthrough device 208 and ultimately maintains the temperature of the vapor passing therethrough, at a predetermined level. Desirably, theheating device 238 maintains the temperature of thefeedthrough device 208 at a temperature which is elevated relative to the temperature of thechamber body 202 and at a temperature similar to that of theheated vapor plumbing 210. Theheating device 238 enters from the mechanical ormaintenance room 228 into thechamber body 202 at the same location where thefeedthrough device 208 is coupled with theheated vapor plumbing 210. - Referring to
FIG. 3 , anexemplary heating device 238 may include a cable heater, otherwise referred to as a resistance heater element, having a firstunheated section 240 and a secondheated section 242. Heat is provided from a source of alternating current (AC) via twoleads 244 which may be configured to operate at 120 VAC and 315 W. The leads 244 extend into the resistance heater element where they are wrapped in a stainless steel, coldformable sheath 246 such that the heating device may be shaped and configured in a desired manner. A second pair of sensor leads 248 are also wrapped in thesheath 246 and are connected to atemperature sensing device 250 such as a thermocouple located about midway along the secondheated section 242. Theexemplary heating device 238, includingsheath 246, may be approximately 0.125″ in diameter and have a length of approximately 31″. Of the 31″ length, theunheated section 240 may include 4″ and theheated section 242 may include 27″. Such an exemplary cable heater is available from Watlow Electric Manufacturing Company with offices at 12001 Lackland Road, St. Louis, Mo. 63146 as part number 125FH031AX-1148. - It is noted that heating devices exhibiting other configurations, dimensions and constructions may be utilized with the present invention. For example, the sheath need not be formed of stainless steel, but may be formed of other thermally conductive materials. Additionally, the diameter and length of the
heating device 238, as well as the proportions of the heated andunheated sections feedthrough devices 208 of varied design. Additionally, electrical characteristics of the resistance leads 244 may vary depending upon specific implementations, as will be appreciated by those of ordinary skill in the art. - Referring to
FIGS. 4A and 4B , afeedthrough device 208 configured for cooperative use with theheating device 238, (FIGS. 2 and 3 ) is shown. Thefeedthrough device 208 includes a bore orlumen 252 extending longitudinally therethrough and which forms a part of thevapor delivery path 207. Thefeedthrough device 208 further includes ashoulder portion 254 at its upper end. Theshoulder portion 254 serves to locate and position thefeedthrough device 208 within thechamber body 202. Additionally, as seen theFIG. 4B , one or more channels orgrooves 256 may be formed in the top andbottom surfaces shoulder portion 254 to accommodate o-rings or other types ofseals 230, 232 (seeFIG. 2 ). - A
longitudinal body portion 258 makes up the majority of thefeedthrough device 208 and includes a continualhelical groove 260 formed on the surface thereof which is configured for receipt of theheating device 238. The size and pitch of thehelical groove 260 may vary but will be determined in part by the size and configuration of theheating device 238. For example, afeedthrough device 208 having alongitudinal body portion 258 with a length of approximately 3.5″ and an outer diameter of approximately 0.75″ might be configured with a helical groove which is approximately 0.128″ and exhibiting a pitch of approximately 0.2″ for receipt of theexemplary heating device 238 described above herein. - The
helical groove 260 includes a radiusedinner portion 262 which serves to complementarily receive thesheath 246 of theexemplary heating device 238 thereby increasing the area of contact between thefeedthrough device 208 and theheating device 238. Increased contact between thefeedthrough device 208 andheating device 238 improves the transfer of heat therebetween resulting in an increased efficiency of theheating device 238 in heating the vapor passing therethrough. - The
helical groove 260 makes atransition 264 near the bottom of thelongitudinal body portion 258 and extends longitudinally outwardly through acoupling portion 266 of thefeedthrough device 208. Thecoupling portion 266 is configured to be sealingly coupled withheated vapor plumbing 210. For example, thecoupling portion 266 may include a series ofthreads 268 thereon for coupling thefeedthrough device 208 to theheated vapor plumbing 210 through use of an appropriate fitting or coupling 236 (seeFIG. 2 ). - The
feedthrough device 208 is desirably formed of a material having a high thermal conductivity such as a metal having a relatively low impurity content. Such materials may include, for example, stainless steel or aluminum. Stainless steel and aluminum are desirable as they also provide protection against corrosion. Further, it is desirable to select a material which is metallurgically compatible with theconductive sheath 246 of theheating device 238 which is to be positioned in thehelical groove 260 of thefeedthrough device 208. - It is noted that the
heating device 238 may include asheath 246 which is cold formable, as set forth above, meaning that theheating device 238 may be formed into thehelical groove 260 and substantially hold its position therein without having to hot work theheating device 238 or otherwise secure it. However, it may by desirable in certain cases to adhere theheating device 238, or at least a portion thereof, to thefeedthrough device 208 regardless of whether a coldformable sheath 246 is being utilized. This may be accomplished, for example, by using conductive adhesive or by spot welding thesheath 246 to thefeedthrough device 208. - Referring back to
FIG. 2 , in operation, thedeposition chamber 200 delivers the vapor from avapor source 211 through theheated vapor plumbing 210. As the vapor travels through thefeedthrough device 208 it desirably maintains the same temperature as when it passes through theheated vapor plumbing 210. However, the temperature of thefeedthrough device 208 is at least kept at a temperature sufficient to maintain the vapor state of the precursor material. This is accomplished by virtue of theheating device 238 operated in association with thefeedthrough device 208. Thetemperature sensing device 250 allows for monitoring of the temperature at thefeedthrough device 208 so that the temperature may be appropriately altered when required by increasing or providing power through theleads 244. The vapor further travels through thechamber lid 204 andvapor plumbing 216 to thevapor delivery head 218 for deposition on the substrate orwafer 220 without condensation occurring within thevapor delivery path 207. - It is noted that the
vapor plumbing 216 which carries the vapor substantially from thefeedthrough device 208 to thevapor delivery head 216 may be insulated to curtail any potential heat loss in that particular section of thevapor delivery path 207. However, heat loss along that section of thevapor delivery path 207 is considered to be less significant than the potential heat loss associated with the passage of vapor through thechamber body 202 via thefeedthrough device 208. - Additionally, if desired, a layer of insulation, as shown in
broken lines 213 onFIG. 2 , may be disposed within thebore 209 between the interior portion of thechamber body 202 and thefeedthrough device 208 allowing for greater efficiency in heating thefeedthrough device 208 and for further isolation of thefeedthrough device 208 from the temperature of thechamber body 202. - The present invention further lends itself to various methods employing the
feedthrough device 208 disclosed herein. For example, a method of delivering vapor from thevapor source 211 to thevapor delivery head 218 can readily be seen with reference toFIG. 2 . The method includes defining avapor delivery path 207 by providingheated vapor plumbing 210 from thevapor source 211 to thechamber body 202. Afeedthrough device 208 is provided and coupled to theheated vapor plumbing 210.Additional vapor plumbing 216 is provided to extend between thefeedthrough device 208 and thevapor delivery head 218. Thefeedthrough device 208 is then heated usingheating device 238 so as to eliminate condensation within thevapor delivery path 207 caused by cooling of the vapor due to temperature differentials between thechamber body 202 and the vapor as it travels through thefeedthrough device 208. - Additionally, the use of a
feedthrough device 208 in combination with theheating device 238 according to the present invention lends itself to a method of converting a CVD chamber to an ALD chamber, the ALD chamber requiring greater temperature control to maintain the associated precursors in a vapor state. The method of converting a CVD chamber to an ALD chamber includes removing an unheated feedthrough device from the CVD chamber body and replacing it with a heated feedthrough device. The heated feedthrough device may be either a new feedthrough device or the original feedthrough device modified in accordance with the present invention to allow heating thereof while positioned within the chamber body. Thus, the present invention provides an easy and economical means of updating and converting existing equipment in lieu of complete replacement of the same. - While the invention may be susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and have been described in detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following appended claims.
Claims (24)
1. A feedthrough device for conveying liquid through a chamber body of a deposition chamber, the feedthrough device comprising:
a longitudinal body having a first end and a second end;
a lumen defined to extend through the longitudinal body from the first end to the second end; and
a heating device associated with the longitudinal body configured for heating the feedthrough device, wherein the feedthrough device is configured to be complementarily received in an internal portion of the chamber body.
2. The feedthrough device of claim 1 , wherein the heating device includes a resistance heater.
3. The feedthrough device of claim 2 , further comprising a helical groove formed on an exterior surface of the longitudinal body and wherein at least a portion of the resistance heater is disposed within the helical groove.
4. The feedthrough device of claim 3 , wherein the resistance heater includes a conductive sheath and wherein the helical groove is configured to complementarily receive at least a portion of the conductive sheath.
5. The feedthrough device of claim 4 , wherein at least a portion of the conductive sheathing is adhered to the longitudinal body.
6. The feedthrough device of claim 4 , wherein at least a portion of the conductive sheathing is welded to the longitudinal body.
7. The feedthrough device of claim 4 , wherein the conductive sheath is formed of stainless steel.
8. The feedthrough device of claim 1 , further comprising a temperature sensing device associated with the heating device and longitudinal body.
9. The feedthrough device of claim 8 , wherein the temperature sensing device includes a thermocouple.
10. The feedthrough device of claim 8 , wherein the temperature sensing device is positioned within a conductive sheath.
11. The feedthrough device of claim 1 , further comprising a shoulder portion adjacent the first end of the longitudinal body, wherein the longitudinal body exhibits a first diameter and the shoulder portion exhibits a second larger diameter.
12. The feedthrough device of claim 11 , further comprising at least one channel formed in a surface of the shoulder portion, the at least one channel being configured to at least partially receive a sealing member therein.
13. The feedthrough device of claim 11 , further including a coupling portion adjacent the second end of the longitudinal body, the coupling portion being configured to be sealingly coupled to a portion of plumbing associated with a vapor source.
14. The feedthrough device of claim 13 , wherein the coupling portion includes a set of threads.
15. The feedthrough device of claim 13 , wherein at least the longitudinal body comprises stainless steel.
16. The feedthrough device of claim 13 , wherein at least the longitudinal body comprises aluminum.
17. A method of converting a chemical vapor deposition chamber having a chamber body, a chamber lid and a first feedthrough device positioned in an interior portion of the chamber body into an atomic layer deposition chamber, the method comprising:
removing the first feedthrough device from the chamber body; and
inserting a second feedthrough device and an associated heating device into the interior portion of the chamber body.
18. The method according to claim 17 , further comprising configuring the associated heating device to helically surround at least a portion of the second feedthrough device.
19. The method of according to claim 18 , further comprising forming a helical groove in the second feedthrough device to complementarily receive at least a portion of the associated heating device.
20. A method of converting a chemical vapor deposition chamber having a chamber body, chamber lid and a feedthrough device positioned in an interior portion of the chamber body into an atomic layer deposition chamber, the method comprising:
removing the feedthrough device;
fitting the feedthrough device with a heater device;
disposing the feedthrough device and heater device into the interior portion of the chamber body.
21. The method according to claim 20 , wherein fitting the feedthrough device with a heater device includes forming a helical groove in an exterior surface of the feedthrough device and complementarily positioning at least a portion of the heater device into the helical groove.
22. A method of delivering vapor to a vapor delivery head in a deposition chamber, the method comprising:
providing a source of vapor;
defining a vapor delivery path between the source of vapor and the vapor delivery head
including:
providing a first section of plumbing from the source of vapor to a chamber body of the deposition chamber;
providing a feedthrough device in an interior portion of the chamber body;
coupling the feedthrough device to the first section of plumbing;
providing a second section of plumbing from the feedthrough device to the vapor delivery head; and
coupling the second section of plumbing to the feedthrough device;
heating the first section of plumbing; and
heating the feedthrough device.
23. The method according to claim 22 , wherein heating the feedthrough device includes providing a resistance heater and helically positioning a portion of the resistance heater about a length of the feedthrough device.
24. The method according to claim 23 , further comprising forming a helical groove along an exterior surface of the feedthrough device and positioning at least a portion of the resistance heater in the helical groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/438,056 US20060207506A1 (en) | 2001-08-17 | 2006-05-18 | Heated gas line body feedthrough for vapor and gas delivery systems and methods of employing same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/932,860 US7090727B2 (en) | 2001-08-17 | 2001-08-17 | Heated gas line body feedthrough for vapor and gas delivery systems and methods for employing same |
US11/438,056 US20060207506A1 (en) | 2001-08-17 | 2006-05-18 | Heated gas line body feedthrough for vapor and gas delivery systems and methods of employing same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/932,860 Division US7090727B2 (en) | 2001-08-17 | 2001-08-17 | Heated gas line body feedthrough for vapor and gas delivery systems and methods for employing same |
Publications (1)
Publication Number | Publication Date |
---|---|
US20060207506A1 true US20060207506A1 (en) | 2006-09-21 |
Family
ID=25463073
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/932,860 Expired - Fee Related US7090727B2 (en) | 2001-08-17 | 2001-08-17 | Heated gas line body feedthrough for vapor and gas delivery systems and methods for employing same |
US11/438,056 Abandoned US20060207506A1 (en) | 2001-08-17 | 2006-05-18 | Heated gas line body feedthrough for vapor and gas delivery systems and methods of employing same |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/932,860 Expired - Fee Related US7090727B2 (en) | 2001-08-17 | 2001-08-17 | Heated gas line body feedthrough for vapor and gas delivery systems and methods for employing same |
Country Status (1)
Country | Link |
---|---|
US (2) | US7090727B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010123877A2 (en) * | 2009-04-21 | 2010-10-28 | Applied Materials, Inc. | Cvd apparatus for improved film thickness non-uniformity and particle performance |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100473806B1 (en) * | 2002-09-28 | 2005-03-10 | 한국전자통신연구원 | Method and apparatus using large area organic vapor deposition for organic thin film and organic devices |
US9725805B2 (en) * | 2003-06-27 | 2017-08-08 | Spts Technologies Limited | Apparatus and method for controlled application of reactive vapors to produce thin films and coatings |
US20050284568A1 (en) * | 2004-06-28 | 2005-12-29 | International Business Machines Corporation | Removing unwanted film from wafer edge region with reactive gas jet |
DE602005016933D1 (en) * | 2004-06-28 | 2009-11-12 | Cambridge Nanotech Inc | ATOMIC SEPARATION SYSTEM AND METHOD |
US7482037B2 (en) * | 2004-08-20 | 2009-01-27 | Micron Technology, Inc. | Methods for forming niobium and/or vanadium containing layers using atomic layer deposition |
CN102839361A (en) * | 2011-10-24 | 2012-12-26 | 南通天华和睿科技创业有限公司 | Chemical vapor deposition furnace |
KR101389011B1 (en) * | 2012-03-28 | 2014-04-24 | 주식회사 유니텍스 | Source container and reactor for vapor phase deposition |
CN108107707B (en) * | 2017-11-22 | 2020-12-25 | 北京无线电计量测试研究所 | Atomic gas chamber and preparation method |
JP6887688B2 (en) * | 2019-02-07 | 2021-06-16 | 株式会社高純度化学研究所 | A container for evaporative raw materials and a solid vaporization supply system using the container for evaporative raw materials |
JP6901153B2 (en) | 2019-02-07 | 2021-07-14 | 株式会社高純度化学研究所 | Solid vaporization supply system for metal halogen compounds for thin film formation. |
Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4480930A (en) * | 1983-04-14 | 1984-11-06 | Westinghouse Electric Corp. | Pulse cooled thermocouple system for high temperature measurement especially in combustion turbines |
US4638150A (en) * | 1984-07-19 | 1987-01-20 | Raychem Corporation | Modular electrical heater |
US5110407A (en) * | 1990-03-07 | 1992-05-05 | Hitachi, Ltd. | Surface fabricating device |
US5136978A (en) * | 1989-10-30 | 1992-08-11 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe susceptor for epitaxy |
US5455014A (en) * | 1993-07-20 | 1995-10-03 | Hughes Aircraft Company | Liquid deposition source gas delivery system |
US5496410A (en) * | 1992-03-10 | 1996-03-05 | Hitachi, Ltd. | Plasma processing apparatus and method of processing substrates by using same apparatus |
US5595606A (en) * | 1995-04-20 | 1997-01-21 | Tokyo Electron Limited | Shower head and film forming apparatus using the same |
US5616208A (en) * | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
US5704984A (en) * | 1995-12-18 | 1998-01-06 | Samsung Electronics Co., Ltd. | Chemical vapor deposition apparatus with a heat radiation structure |
US5753891A (en) * | 1994-08-31 | 1998-05-19 | Tokyo Electron Limited | Treatment apparatus |
US5882416A (en) * | 1997-06-19 | 1999-03-16 | Advanced Technology Materials, Inc. | Liquid delivery system, heater apparatus for liquid delivery system, and vaporizer |
US5935338A (en) * | 1993-04-05 | 1999-08-10 | Applied Materials, Inc. | Chemical vapor deposition chamber |
US5968276A (en) * | 1997-07-11 | 1999-10-19 | Applied Materials, Inc. | Heat exchange passage connection |
US6021582A (en) * | 1998-03-16 | 2000-02-08 | Novellus Systems, Inc. | Temperature control of parylene dimer |
US6056823A (en) * | 1997-09-11 | 2000-05-02 | Applied Materials, Inc. | Temperature controlled gas feedthrough |
US6106628A (en) * | 1996-09-27 | 2000-08-22 | Japan Process Engineering Ltd. | Heater unit for chemical vapor deposition systems |
US6129043A (en) * | 1999-02-25 | 2000-10-10 | United Microelectronics Corp. | Gas tube with heating apparatus |
US6143077A (en) * | 1996-08-13 | 2000-11-07 | Anelva Corporation | Chemical vapor deposition apparatus |
US6159298A (en) * | 1997-12-27 | 2000-12-12 | Tokyo Electron Limited | Thermal processing system |
-
2001
- 2001-08-17 US US09/932,860 patent/US7090727B2/en not_active Expired - Fee Related
-
2006
- 2006-05-18 US US11/438,056 patent/US20060207506A1/en not_active Abandoned
Patent Citations (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4480930A (en) * | 1983-04-14 | 1984-11-06 | Westinghouse Electric Corp. | Pulse cooled thermocouple system for high temperature measurement especially in combustion turbines |
US4638150A (en) * | 1984-07-19 | 1987-01-20 | Raychem Corporation | Modular electrical heater |
US5136978A (en) * | 1989-10-30 | 1992-08-11 | The United States Of America As Represented By The Secretary Of The Air Force | Heat pipe susceptor for epitaxy |
US5110407A (en) * | 1990-03-07 | 1992-05-05 | Hitachi, Ltd. | Surface fabricating device |
US5496410A (en) * | 1992-03-10 | 1996-03-05 | Hitachi, Ltd. | Plasma processing apparatus and method of processing substrates by using same apparatus |
US5935338A (en) * | 1993-04-05 | 1999-08-10 | Applied Materials, Inc. | Chemical vapor deposition chamber |
US5455014A (en) * | 1993-07-20 | 1995-10-03 | Hughes Aircraft Company | Liquid deposition source gas delivery system |
US5616208A (en) * | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
US5753891A (en) * | 1994-08-31 | 1998-05-19 | Tokyo Electron Limited | Treatment apparatus |
US5595606A (en) * | 1995-04-20 | 1997-01-21 | Tokyo Electron Limited | Shower head and film forming apparatus using the same |
US5704984A (en) * | 1995-12-18 | 1998-01-06 | Samsung Electronics Co., Ltd. | Chemical vapor deposition apparatus with a heat radiation structure |
US6143077A (en) * | 1996-08-13 | 2000-11-07 | Anelva Corporation | Chemical vapor deposition apparatus |
US6106628A (en) * | 1996-09-27 | 2000-08-22 | Japan Process Engineering Ltd. | Heater unit for chemical vapor deposition systems |
US5882416A (en) * | 1997-06-19 | 1999-03-16 | Advanced Technology Materials, Inc. | Liquid delivery system, heater apparatus for liquid delivery system, and vaporizer |
US5968276A (en) * | 1997-07-11 | 1999-10-19 | Applied Materials, Inc. | Heat exchange passage connection |
US6056823A (en) * | 1997-09-11 | 2000-05-02 | Applied Materials, Inc. | Temperature controlled gas feedthrough |
US6159298A (en) * | 1997-12-27 | 2000-12-12 | Tokyo Electron Limited | Thermal processing system |
US6021582A (en) * | 1998-03-16 | 2000-02-08 | Novellus Systems, Inc. | Temperature control of parylene dimer |
US6129043A (en) * | 1999-02-25 | 2000-10-10 | United Microelectronics Corp. | Gas tube with heating apparatus |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010123877A2 (en) * | 2009-04-21 | 2010-10-28 | Applied Materials, Inc. | Cvd apparatus for improved film thickness non-uniformity and particle performance |
US20100294199A1 (en) * | 2009-04-21 | 2010-11-25 | Applied Materials, Inc. | Cvd apparatus for improved film thickness non-uniformity and particle performance |
WO2010123877A3 (en) * | 2009-04-21 | 2011-01-20 | Applied Materials, Inc. | Cvd apparatus for improved film thickness non-uniformity and particle performance |
KR20120027257A (en) * | 2009-04-21 | 2012-03-21 | 어플라이드 머티어리얼스, 인코포레이티드 | Cvd apparatus for improved film thickness non-uniformity and particle performance |
CN102414794A (en) * | 2009-04-21 | 2012-04-11 | 应用材料公司 | Cvd apparatus for improved film thickness non-uniformity and particle performance |
US9312154B2 (en) * | 2009-04-21 | 2016-04-12 | Applied Materials, Inc. | CVD apparatus for improved film thickness non-uniformity and particle performance |
KR101671158B1 (en) | 2009-04-21 | 2016-11-01 | 어플라이드 머티어리얼스, 인코포레이티드 | Cvd apparatus for improved film thickness non-uniformity and particle performance |
Also Published As
Publication number | Publication date |
---|---|
US7090727B2 (en) | 2006-08-15 |
US20030033984A1 (en) | 2003-02-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20060207506A1 (en) | Heated gas line body feedthrough for vapor and gas delivery systems and methods of employing same | |
JP4480274B2 (en) | Chemical vapor deposition vaporizer | |
US6464790B1 (en) | Substrate support member | |
TWI614789B (en) | Plasma reactor with chamber wall temperature control | |
US6907924B2 (en) | Thermally conductive chuck for vacuum processor | |
US8075734B2 (en) | Remote inductively coupled plasma source for CVD chamber cleaning | |
US20020011210A1 (en) | Semiconductor-processing device provided with a remote plasma source for self-cleaning | |
KR100269579B1 (en) | Substrate processing apparatus | |
TW201730369A (en) | Silicon or silicon carbide gas injector for substrate processing systems | |
US20040154746A1 (en) | Apparatus and method for producing a semiconductor device including a byproduct control system | |
US5936829A (en) | Thermally conductive chuck for vacuum processor | |
US20190169743A1 (en) | Advanced coating method and materials to prevent hdp-cvd chamber arcing | |
KR20050120641A (en) | Method and apparatus for silicone oxide deposition on large area substrates | |
CN100452297C (en) | Method of depositing thin film on wafer | |
CN108431923A (en) | For the clean method and apparatus of deposit in pumping line | |
US20130140009A1 (en) | Robust outlet plumbing for high power flow remote plasma source | |
CN106449504A (en) | Annular edge seal with convex inner surface for electrostatic chuck | |
CN101198812A (en) | Isolation valve for energetic and high temperature gases | |
KR102206215B1 (en) | Prevention of SiH4 contact to quartz tube used for deposition of wafer | |
US11600468B2 (en) | Multi channel splitter spool | |
JPH07283292A (en) | Sealing mechanism besides treatment device and treatment method using this sealing mechanism | |
JP2009194006A (en) | Gas transportation route and semiconductor processing apparatus using the same | |
EP1167572A2 (en) | Lid assembly for a semiconductor processing chamber | |
US20210040611A1 (en) | Manifold valve for multiple precursors | |
WO2021091715A1 (en) | High temperature dual channel showerhead |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |