JP2009187861A - Adapter structure, high-frequency cable, and connection structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low-cost adapter structure capable of keeping impedance matching by supplementarily using it in a connection part of a high-frequency cable, and to provide a high-frequency cable and the like. <P>SOLUTION: An adapter A includes: a flat dielectric layer 10; wires 12 being line conductors formed on the upper surface of the dielectric layer 10 by sandwiching an adhesive layer 11; a coverlay 14 for partially covering the wires 12 by sandwiching an adhesive layer 13; a ground plane 17 formed on the undersurface of the dielectric layer 10 by sandwiching an adhesive layer 16; and a coverlay 19 for covering the ground plane 17 by sandwiching an adhesive layer 18. Impedance matching to a high-frequency cable attached to a region Rb can be achieved by materials and dimension setting of the wires 12 in micro-strip lines and the dielectric layer 10, and signals can be transmitted with low loss. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an adapter structure for connecting a high-frequency cable to various wiring boards, a high-frequency cable, and a connection structure.

  In recent years, transmission and reception of signals between boards and wiring boards in various electronic devices such as LCD TVs, plasma displays, Blu-ray HDD recorders, servers, copiers, printers, and multifunction devices with image scanner functions, High speed transmission is required. As a response to such a demand for high-speed transmission, there is a high-frequency cable, for example, a coaxial cable, in which an outer conductor is provided around a round central conductor with a dielectric layer interposed therebetween.

  As a connector structure for connecting the coaxial cable to a substrate or the like, for example, as disclosed in Patent Document 1, there is one using a plug and a receptacle that can be inserted and removed from each other. That is, by connecting the receptacle to the substrate or the like with solder or the like and connecting the electric wire to the plug with solder or the like, the coaxial cable can be electrically connected to or removed from the substrate or the like.

JP-A-7-73932

  However, in the case of the above structure, there is a problem that the number of parts increases for both the plug and the receptacle, resulting in a very high cost.

  An object of the present invention is to provide a low-cost adapter structure that can maintain impedance matching by being used supplementarily in a connection portion of a high-frequency cable.

In the adapter structure of the present invention, a plurality of line conductors connected to a plurality of center conductors of a high-frequency cable are provided on a flat dielectric layer, and are opposed to the line conductor with the flat dielectric layer interposed therebetween. A ground plane connected to the outer conductor of the high-frequency cable is provided.
Examples of the high-frequency cable include various flat cables and multi-core coaxial cables.

  As a result, in the microstrip line provided in the adapter structure, the material and thickness of the line conductor and dielectric layer are appropriately designed to maintain matching between the impedance of the high-frequency cable and the impedance of the adapter structure, and high transmission It is possible to make a low-loss signal connection with high efficiency, that is, a high-frequency signal with a small attenuation factor. In addition, since the adapter structure is a very simple structure, the cost can be reduced.

  And since such an adapter structure can be easily provided in a connector provided on the wiring board so as to be insertable / removable, it becomes an adapter suitable for a connector such as a ZIF connector. Therefore, it becomes inexpensive and highly usable as an auxiliary member for a connector for connecting a flexible printed wiring board, a rigid printed wiring board, and the like to a high frequency cable.

  When the high-frequency cable is a flat cable having a ground line and a pair of differential signal lines alternately arranged as a central conductor and a drain line conducting to the outer conductor, the wiring of the adapter structure is connected to the ground line. , And a pair of differential signal lines, and the ground plane may be connected to the drain line.

  By using the adapter structure of the present invention, a flat cable using a conductor having a round cross section can be connected to a wiring board via a connector in the same manner as a flexible printed wiring board having a flat conductor cross section. Thus, an inexpensive transmission line having excellent transmission characteristics can be configured.

  The high-frequency cable provided with the adapter structure is a high-frequency cable that can be easily connected to various wiring boards. By inserting the adapter structure of the high-frequency cable into the connector attached to the wiring board, it is easy to reconnect. A simple connection structure.

  According to the adapter structure, high-frequency cable, or connection structure of the present invention, it is possible to provide an adapter structure, high-frequency cable, and connection structure that are easy to impedance match and that are low cost.

(Embodiment)
-Adapter structure-
FIG. 1 is a cross-sectional view showing a structure of an adapter A according to an embodiment of the present invention. 2 is a cross-sectional view of the adapter A taken along the line II-II shown in FIG. As shown in FIG. 2, the adapter A includes a flat dielectric layer 10, a wiring 12 that is a line conductor formed on the upper surface of the dielectric layer 10 with an adhesive layer 11 interposed therebetween, and an adhesive layer. 13, a cover lay 14 covering a part of the wiring 12 with the sandwich 13 interposed therebetween, a ground plane 17 formed with the adhesive layer 16 sandwiched on the lower surface of the dielectric layer 10, and a ground plane 17 sandwiching the adhesive layer 18 And a coverlay 19 for covering.
In the figure, a region Rb shown on the right side of the cover lay 14 is a region where a round flat cable B described later is attached, and a region Rc shown on the left side is a region connected to a connector C described later.

  As shown in FIG. 1, the wiring 12 includes a drain wiring 12d connected to the drain line of the flat cable, a ground wiring 12g for preventing interference, and a first signal wiring 12p and a second signal wiring 12p each transmitting a differential signal. Signal wiring 12n. The drain wiring 12 d is electrically connected to the ground plane 17 through the through hole 15. The three wirings of the ground wiring 12g, the first signal wiring 12p, and the second signal wiring 12n are alternately and repeatedly arranged as one group.

Each member of the adapter A of the present embodiment has the following materials and dimensions, but this is an example, and the adapter A of the present invention is not limited to the following materials.
The dielectric layer 10 is made of a resin such as PI resin (polyimide resin) and has a thickness of about 150 μm to 300 μm. The wiring 12 is formed using a metal foil such as a copper foil having a width of 0.15 mm to 0.4 mm and a thickness of about 10 μm to 30 μm. The ground plane 17 is formed using a metal foil such as a copper foil having a thickness of about 10 μm to 30 μm. The coverlays 14 and 19 are made of a resin such as a PI resin and have a thickness of about 15 μm to 30 μm. The adhesive layers 13, 16, and 18 are made of a resin such as an epoxy resin and have a thickness of about 10 μm to 12 μm. The entire adapter A has a thickness of about 0.25 mm to 0.4 mm, a width of about 10 mm to 14 mm, and a length of about 8 mm to 14 mm.

The adapter A of the present embodiment constitutes a microstrip line in which a wiring 12 as a line conductor is disposed above a ground plane 17 as a conductor layer with a dielectric layer 10 interposed therebetween.
The microstrip line has predetermined impedance characteristics according to the width and thickness of the wiring 12, the thickness of the dielectric layer 10, the relative dielectric constant, and the like. That is, desired impedance characteristics can be obtained by appropriately designing the above elements. As a result, impedance matching with the connected high-frequency cable is achieved, and a high-frequency signal is transmitted from the high-frequency cable to various wiring boards and electronic components with high efficiency, that is, with low loss (low attenuation factor). .

-Connection structure between adapter and high-frequency cable-
FIG. 3 is a perspective view showing a connection state between the adapter A and the flat cable B according to the present embodiment. 4 is a longitudinal sectional view of the flat cable taken along line IV-IV shown in FIG. FIG. 5 is a longitudinal sectional view taken along the line VV shown in FIG.

  As shown in FIG. 4, the flat cable B includes a shield 27 that covers the periphery of the plurality of central conductors 22 with the dielectric layer 20 interposed therebetween, a drain line 25 that extends while being in contact with the shield 27, and the shield 27 and the drain line 25. And an exterior film 29 for covering the film.

  As shown in FIGS. 3 and 5, the center conductor 22 is placed on the wiring 12 in the region Rb of the adapter A, and the center conductor 22 and the wiring 22 are joined by the solder layer 30. In FIG. 3, the solder layer 30 is not shown for easy viewing. Further, a reinforcing resin film 31 shown by a broken line in FIG. 3 may be provided for reinforcement.

The center conductor 22 is made of a metal such as tin-plated mild steel copper and has a diameter of about 0.1 mm to 0.3 mm. The dielectric layer 20 is made of a resin such as a low-loss olefin resin and has an overall thickness of 0.4 mm to 0.6 mm. The shield 27 is made of metal such as Al-attached PET. The drain wire 25 is composed of a metal wire such as seven tin-plated mild steel wires having a diameter of about 0.7 mm to 0.9 mm. The exterior film 29 is made of a flame retardant resin such as PVC resin.
And the thickness of the whole flat cable B is about 0.8 mm-1.2 mm, and a width | variety is about 10 mm-12 mm.

Here, the center conductor 22 is arranged in order from the left in the drawing with a pitch of about 0.4 mm to 0.6 mm, the ground line 22g, and the first signal line 22p and the second signal line 22p that each transmit a differential signal. Signal line 22n. The three central conductors of the ground line 22g, the first signal line 22p, and the second signal line 22n are alternately repeated as one group, and the ground line 22g is disposed at the final end. In other words, the first signal line 22p and the second signal line 22n are sandwiched between the ground lines 22g on both sides, thereby eliminating the crosstalk between the first signal line 22p and the second signal line 22n.
Note that the cross-sectional shape of the center conductor 22 is not necessarily a round shape, and may be a flat shape.

  The flat cable also has a structure in which the central conductor 22 (line) and the shield 27 face each other with the dielectric layer 20 in between, and constitutes a microstrip line. Then, by appropriately designing the material and diameter of the center conductor 22 and the material and thickness of the dielectric layer 20, the impedance can be adjusted so that the attenuation factor is minimized.

  However, the high-frequency cable that can be connected to the region Rb of the adapter A is not limited to the flat cable according to the present embodiment, and includes flat cables such as FFC (flexible flat cable), multi-core coaxial cables, and the like. .

−Connection with connector−
FIG. 6 is a perspective view showing an example in which the connector A-flat cable B connection shown in FIG. 3 is connected to an existing connector.

As shown in the figure, a general-purpose connector C such as a ZIF connector is mounted on a wiring board D such as an FPC (flexible printed wiring board) or PCB (rigid printed wiring board). Then, by inserting the region Rc of the adapter A into the connector C and closing the lid, the wiring of the adapter A and the corresponding connecting member of the connector C are connected. Further, the adapter A can be easily removed by opening the cover of the connector C. That is, the adapter A has a structure that can be inserted into and removed from the connector C.
The member on which the connector C is mounted is not limited to various wiring boards, but may be an electronic component itself, in particular, one having a microstrip circuit.

  According to the adapter A of the present embodiment, by connecting to the terminal of the high-frequency cable B, a structure that can be easily connected to a connector disposed on a wiring board or an electronic component can be realized. In addition, by using a microstrip line, impedance matching with a high-frequency cable can be achieved, and a high-frequency signal can be transmitted to a wiring board or an electronic component with high efficiency, that is, with low loss.

Some types of FPCs are suitable for high-frequency signal transmission, but for manufacturing FPCs, it is necessary to prepare expensive dies for each type having a different length. On the other hand, if it is a flat cable that can be manufactured by extrusion molding, it can correspond to any length as long as it has a mold for extrusion molding, and the cost can be reduced.
However, if a flat cable that cannot use a general-purpose connector such as an FPC is connected to an FPC or the like, soldering or the like at the terminal is difficult to reconnect.
Therefore, by using the adapter A of the present invention as a terminal of a high-frequency cable such as a flat cable, it is possible to smoothly connect to a wiring board such as an FPC or an electronic component while achieving impedance matching.

  Therefore, the connector C is not limited to a ZIF connector, and a general-purpose FFC / FPC connector or the like can be used. Further, since the end wiring 22 is converted into a flat wiring 12 instead of a round shape, connection using an anisotropic conductive film (ACF) or the like is also possible.

(Other embodiments)
The dielectric layer 10 is not limited to the PI resin in the above embodiment. Since the insulator is also a dielectric, various insulating materials such as other resins and inorganic insulating materials can be used.

  The structure of the embodiment of the present invention disclosed above is merely an example, and the scope of the present invention is not limited to the scope of these descriptions. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  The present invention can be used for signal transmission in electronic devices such as a mobile phone, a camera such as a digital camera and a video camera, a portable audio player, a portable DVD player, and a portable notebook computer.

It is sectional drawing which shows the structure of the adapter which concerns on embodiment of this invention. It is sectional drawing of the adapter in the II-II line shown in FIG. It is a perspective view which shows the connection state of the adapter which concerns on embodiment, and a flat cable. It is a longitudinal cross-sectional view of the flat cable in the IV-IV line shown in FIG. It is a longitudinal cross-sectional view in the VV line shown in FIG. It is a perspective view which shows the example which connects the connection body of the adapter-flat cable shown in FIG. 3 to the existing connector.

Explanation of symbols

A adapter B flat cable C connector D wiring board 10 dielectric layer 11 adhesive layer 12 wiring (line conductor)
12d Drain wiring 12g Ground wiring 12p First signal wiring 12n Second signal wiring 13 Adhesive layer 14 Cover lay 15 Through hole 16 Adhesive layer 17 Ground plane 18 Adhesive layer 19 Cover lay 20 Dielectric layer 22 Central conductor 22d Drain line 22g Ground line 22p First signal line 22n Second signal line 25 Drain line 27 Shield 29 Exterior film 30 Solder layer 31 Reinforced resin film Rb, Rc region

Claims (5)

An adapter structure connected to an end of a high-frequency cable having a plurality of center conductors and an outer conductor provided between each center conductor with a dielectric layer interposed therebetween,
A planar dielectric layer;
A plurality of line conductors formed on the planar dielectric layer and connected to the plurality of central conductors;
A ground plane connected to the outer conductor and facing each line conductor across the flat dielectric layer;
With adapter structure. The adapter structure according to claim 1,
The high-frequency cable is
As a central conductor, a ground line and a pair of differential signal lines are alternately arranged,
Having a drain wire conducting to the outer conductor;
The line conductors are alternately connected to the ground line and a pair of differential signal lines,
The ground plane is an adapter structure connected to the drain line. In the adapter structure according to claim 2,
The high-frequency cable has an adapter structure that is a flat cable using a conductor having a round cross section.   A high-frequency cable provided with the adapter structure according to claim 1. A high-frequency cable provided with the adapter structure according to any one of claims 1 to 3,
A wiring board on which a connector is disposed; and
A connection structure comprising:
A connection structure in which the adapter structure is inserted into the connector.

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