JP2009183991A - Laser machining device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve working efficiency of laser machining and to improve machining accuracy. <P>SOLUTION: A laser machining device is provided with a luminous flux regulating means 3 for regulating the luminous flux cross section shape of a laser beam L1 emitted from a laser beam source 2 by a shape regulating part 12 and emitting it, and an objective lens 4 arranged opposite to a workpiece 11, which is machined with the laser beam L1, and condensing the laser beam L1 on the workpiece 11. Further, the laser machining device is provided with: a pinhole member 6, which is provided on optical paths branched from an optical path proceeding to the luminous flux regulating means 3 from the objective lens 4, and in which a plurality of pinholes is formed; a white light source 7 for applying white light L2 to the pinhole member 6; a photographing means 8, which is provided above optical paths branched from an optical path proceeding to the pinhole member 6 from the objective lens 4 and provided with a plurality of light receiving elements to receive reflection light L3 of the white light L2, which is past the pinholes and reflected from the workpiece 11; and a displacement means 10 for displacing the distance between the objective lens 4 and the workpiece 11. Thereby, measurement of minute heights is enabled. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a laser processing apparatus that processes a workpiece by irradiating a laser beam, and particularly relates to a laser processing apparatus that attempts to improve the working efficiency and processing accuracy of laser processing.

A conventional laser processing apparatus is provided with a slit that emits a laser beam emitted from a laser light source while regulating the cross-sectional shape of the light beam to a predetermined shape, and a workpiece that is irradiated with the laser beam. An objective lens that focuses light on the workpiece, and an imaging lens that is provided on an optical path between the slit and the objective lens to form an image of the slit on the workpiece in combination with the objective lens, And an imaging means for observing the surface of the workpiece through the objective lens (see, for example, Patent Document 1).
JP 2006-13343 A

  However, since such a conventional laser processing apparatus has only a single function of laser processing for processing by irradiating the workpiece with laser light, for example, laser processing is performed while measuring the processing amount for the workpiece. Could not do. Therefore, machining accuracy could not be improved.

  Also, in removing abnormal protrusions on the workpiece and pattern correction work, first, the position information of the abnormal protrusions or foreign matter on the pattern and the height of the abnormal protrusions or foreign objects are measured using a separate minute height measuring device. Information is acquired, and then the workpiece is transferred to a laser processing apparatus, laser processing is performed based on the position information and height information, and abnormal protrusions or foreign matters are removed. Therefore, work efficiency was bad.

  Accordingly, an object of the present invention is to provide a laser processing apparatus that addresses such problems and intends to improve the working efficiency and processing accuracy of laser processing.

  In order to achieve the above object, a laser processing apparatus according to a first aspect of the present invention includes a light beam restricting means for restricting and emitting a light beam cross-sectional shape of laser light emitted from a laser light source by a shape restricting portion, and processing using the laser light. An objective lens provided opposite to the workpiece to be collected and condensing the laser beam on the workpiece, wherein an optical path from the objective lens toward the light beam restricting means is provided A pinhole member provided on the branched optical path and formed with a plurality of pinholes, a measurement light source for irradiating the pinhole member with measurement light, and an optical path from the objective lens toward the pinhole member are branched An imaging means that is provided on the optical path and receives a reflected light from the workpiece of the measurement light that includes a plurality of light receiving elements and passes through the pinhole, the objective lens, and the workpiece Provided with a displacement means for displacing the distance between those that enables measurement of very small height.

  With such a configuration, the measurement light source irradiates the measurement light to the pinhole member provided on the optical path where the optical path from the objective lens to the light beam restricting means is branched and forms a plurality of pinholes. The reflected light from the workpiece of the measurement light that has passed through the pinhole member is received by the imaging means provided on the optical path where the optical path toward the member is branched and provided with a plurality of light receiving elements. Displace the distance between the workpiece and measure the minute height, radiate laser light from the laser light source, and control the laser beam cross-sectional shape emitted by the shape restricting part of the light beam restricting means, and emit this laser. Light is focused on the workpiece with an objective lens to laser process the workpiece.

  The laser processing apparatus according to the second aspect of the present invention includes a light beam restricting means for restricting and emitting a light beam cross-sectional shape of laser light emitted from a laser light source by a shape restricting portion, and a workpiece processed by the laser light, An objective lens that is provided oppositely and condenses the laser beam on the workpiece, and is provided on an optical path between the light beam restricting means and the objective lens, and is combined with the objective lens to form the workpiece. An image forming lens for forming an image of the shape restricting portion on the optical processing device, and a plurality of optical processing paths provided on a branched optical path from the image forming lens toward the light beam restricting means. A pinhole member in which a pinhole is formed, a measurement light source for irradiating the pinhole member with measurement light, and an optical path branched from an optical path from the imaging lens toward the pinhole member. An imaging unit that includes a light receiving element and receives reflected light from the workpiece of the measurement light that has passed through the pinhole, and a displacement unit that displaces the imaging lens in the optical axis direction. It is possible to measure the length.

  With such a configuration, the measurement light source irradiates the measurement light to the pinhole member provided on the optical path where the optical path from the imaging lens to the light beam restricting means is branched and formed with a plurality of pinholes, and from the imaging lens. The reflected light from the workpiece of measurement light that has passed through the pinhole member is received by the imaging means provided on the optical path branched from the optical path toward the pinhole member, and imaged by the displacement means The lens is displaced in the direction of its optical axis, the minute height is measured, the laser light is emitted from the laser light source, and the cross-sectional shape of the laser beam is regulated and emitted by the shape regulating unit of the beam regulating means. In combination with an imaging lens, an image of the shape restricting portion is formed on the workpiece, and the workpiece is laser processed.

  Furthermore, the luminous flux regulating means is configured by combining a plurality of members that can slide in a plane, and an opening surrounded by the plurality of members is used as the shape regulating portion. Thereby, the light beam cross-sectional shape of the laser light is regulated by the opening surrounded by the plurality of members that can slide in the plane.

  The light flux restricting means is configured by arranging a plurality of individually rotatable micromirrors in a matrix, and the plurality of micromirrors serve as the shape restricting portion. As a result, the plurality of micromirrors arranged in a matrix are individually rotated to regulate the cross-sectional shape of the laser beam.

  The pinhole member is formed by forming a plurality of pinholes in a matrix at predetermined intervals on a transparent substrate. Thereby, measurement light is allowed to pass through a plurality of pinholes formed in a matrix at predetermined intervals on a transparent substrate.

  The pinhole member is a Nippon disc having a plurality of pinholes formed in a spiral shape. Thereby, measurement light is allowed to pass through a plurality of pinholes spirally formed on the Nippon disc.

  According to the first aspect of the present invention, by providing the laser processing apparatus with the minute height measurement function, for example, laser processing can be performed while measuring the processing amount on the workpiece, and processing accuracy is improved. Can do. Further, for example, in the removal of abnormal protrusions on a workpiece or the removal of foreign matters on a pattern, the detection of abnormal protrusions and foreign matters and the removal of abnormal protrusions or the removal of foreign matters can be performed in the same process. , Work efficiency can be improved.

  Further, according to the invention according to claim 2, by providing the laser processing apparatus with the minute height measurement function, for example, laser processing can be performed while measuring the processing amount for the workpiece, and the processing accuracy is improved. can do. Further, for example, in the removal of abnormal protrusions on a workpiece or the removal of foreign matters on a pattern, the detection of abnormal protrusions and foreign matters and the removal of abnormal protrusions or the removal of foreign matters can be performed in the same process. , Work efficiency can be improved. Furthermore, since the minute height is measured by displacing the imaging lens, the moment of inertia of the imaging lens can be reduced, and the height measurement accuracy can be improved.

  Furthermore, according to the invention which concerns on Claim 3, the structure of a light beam control means is simple, and it can reduce the manufacturing cost of an apparatus.

  According to the fourth aspect of the present invention, the cross-sectional shape of the light beam can be arbitrarily set, and laser processing of any shape can be performed on the workpiece.

  Moreover, according to the invention which concerns on Claim 5, the measurement of micro height becomes simple and it can reduce the manufacturing cost of an apparatus.

  And according to the invention which concerns on Claim 6, the height measurement in an observation area | region can be performed more precisely.

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a front view showing an embodiment of a laser processing apparatus according to the present invention. This laser processing apparatus processes a workpiece by irradiating a laser beam, and includes a stage 1, a laser light source 2, a light beam restricting means 3, an objective lens 4, an imaging lens 5, and a pinhole member. 6, a white light source 7, an imaging unit 8, an illumination light source 9, and a displacement unit 10.

  The stage 1 is configured to place the workpiece 11 on the upper surface and move it in the XY direction in the horizontal plane, and is moved by a driving means that combines a motor, a gear, etc. (not shown). The Y direction is the depth direction in FIG.

  A laser light source 2 is provided above the stage 1. The laser light source 2 emits a laser beam and irradiates the workpiece 11 to process the workpiece 11. For example, the laser light source 2 is a pulse laser that emits a laser beam having a wavelength of 532 nm or 355 nm.

  A light beam restricting means 3 is provided in front of the laser light L1 emitted from the laser light source 2 in the emission direction. The light beam restricting means 3 emits the light beam cross-sectional shape of the laser light L1 irradiated to the workpiece 11 while the shape restricting portion 12 restricts the light beam to a shape corresponding to the processed shape, and can be slid within a plane, for example. A plurality of members are combined. As shown in FIG. 2, a specific example of the configuration includes a pair of first members 13 that slide in the X direction in the plane and rotate in the directions of arrows A and B in the plane, and are arranged above the pair. And a pair of second members 14 that slide in the Y direction and rotate in the directions of arrows C and D, and are surrounded by the pair of first members 13 and the second member 14. The opened opening is used as the shape restricting portion 12.

  An objective lens 4 is provided on the optical axis connecting the luminous flux regulating means 3 and the stage 1 so as to face the workpiece 11 placed on the stage 1. This objective lens 4 condenses the laser beam L1 whose beam cross-sectional shape is regulated by the beam regulating means 3 on the workpiece 11, and a lens holder 15 that is movable parallel to the surface of the stage 1. It consists of a plurality of types of objective lenses 4a to 4d having different magnifications that are detachably held.

  An imaging lens 5 is provided on the optical path between the light flux regulating means 3 and the objective lens 4. The image forming lens 5 is combined with the objective lens 4 to form an image of the shape restricting portion 12 of the light beam restricting means 3 on the workpiece 11.

  A pinhole member 6 is provided on the optical path where the optical path from the imaging lens 5 toward the light beam restricting means 3 is branched by the beam splitter 19. As shown in FIG. 3, the pinhole member 6 is formed by forming a plurality of pinholes in a matrix at predetermined intervals. For example, the pinhole member 6 is an opaque film 18 such as chromium (Cr) formed on a transparent substrate 17. Is a pinhole mask in which a plurality of pinholes 16 are formed by etching. It should be noted that the arrangement pitch of the pinholes 16 is preferably set to be approximately an integral multiple of the arrangement pitch of the light receiving elements of the imaging means 8 described later. Furthermore, the arrangement pitch of the pinholes should be sufficiently wide so that the reflected light from the workpiece 11 of the light that has passed through the adjacent pinholes 16 does not interfere on the light receiving surface of the imaging means 8. Each pinhole 16 may be aligned so as to have a one-to-one correspondence with each light receiving element of the imaging unit 8.

  Behind the pinhole member 6 is provided a white light source 7 as a measurement light source. The white light source 7 irradiates the pinhole member 6 with white light (measurement light) L2, and is a xenon lamp, an ultrahigh pressure mercury lamp, a white laser light source, a white LED, or the like.

  An imaging unit 8 is provided on the optical path where the optical path from the imaging lens 5 toward the pinhole member 6 is branched by the beam splitter 20. The image pickup means 8 is provided with a plurality of light receiving elements in a matrix and picks up a two-dimensional image on the workpiece 11. When measuring a minute height, the pinhole of the pinhole member 6 is used. For example, a CCD camera or a CMOS camera functions as detection means for detecting the brightness of the reflected light L3 from the workpiece 11 of the white light L2 that has passed through 16.

  An illumination light source 9 is provided on the optical path where the optical path from the objective lens 4 toward the imaging lens 5 is branched by the beam splitter 21. The illumination light source 9 irradiates the workpiece 11 with illumination light L4 to enable the imaging unit 8 to image the surface of the workpiece 11 and is a halogen lamp or the like.

  Displacement means for vertically moving the main body of the optical system including the laser light source 2, the light beam restricting means 3, the objective lens 4, the imaging lens 5, the pinhole member 6, the white light source 7, the imaging means 8, and the illumination light source 9. 10 is provided. The displacing means 10 moves the optical system main body part within a predetermined movement range from below to above or from above to below at a predetermined speed, so that the distance between the objective lens 4 and the workpiece 11 is increased. For example, a combination of a motor and a gear is used.

  In the above optical system, the position of the shape restricting portion 12 of the light flux restricting means 3, the position where the pinhole 16 of the pinhole member 6 is formed, and the position of the light receiving surface of the imaging means 8 are respectively at the imaging position of the objective lens 4. On the other hand, it has a conjugate relationship. In FIG. 1, reference numeral 22 is a motor for moving the lens holder 15 in the X direction, reference numeral 23 is a ball screw connected to the motor 23 and rotated to move the lens holder 15 in the X direction, and reference numeral 24 is the lens holder 15. A reference numeral 25 denotes a total reflection mirror, and reference numeral 26 denotes a field lens that uniformly illuminates the imaging area of the imaging means 8.

Next, the operation and laser processing of the laser processing apparatus configured as described above will be described with reference to FIGS. In the following description, the case where the workpiece 11 is a color filter substrate will be described.
First, in step S1, the color filter substrate is placed on the stage 1 of the laser processing apparatus. Then, the start switch of the apparatus is turned on, and the illumination light source 9 is turned on. As a result, the illumination light L4 irradiates the color filter substrate surface via the objective lens 4. At the same time, the imaging means 8 is turned on to image the surface of the color filter substrate. At this time, the laser light source 2 and the white light source 7 remain off. In addition, as the objective lens 4, any one of the low-magnification objective lenses 4a to 4c is selected.

  In step S2, the displacing means 10 is turned ON to move the optical system main body up and down, and the autofocus adjustment is performed so that the color filter substrate pattern image picked up by the image pickup means 8 becomes clear. At this time, the image captured by the imaging unit 8 is displayed on a monitor screen (not shown).

  In step S3, a known pattern matching method is applied to the pattern image of the color filter substrate picked up by the image pickup means 8 to detect a pattern defect, for example, a foreign substance attached on the pattern. Here, when the pattern defect is not detected ("NO" determination), the process proceeds to step S4, the stage 1 is moved by a predetermined amount in a predetermined direction, and the next observation area is selected.

  On the other hand, if a pattern defect is detected in step S3 ("YES" determination), the process proceeds to step S5, the stage 1 is moved in the X and Y directions, and the defect (foreign material 27) (see FIG. 5) is the objective. It is positioned at the center of the field of view F of the lens 4.

  In step S6, the motor 22 is driven to move the lens holder 15 in the X direction, and is replaced with a high-magnification objective lens 4d. When the optical axis of the objective lens 4d and the optical axis of the optical system main body are shifted, the motor 24 is further driven to move the lens holder 15 in the Y direction, and the optical axes are aligned.

  When the objective lens 4 is replaced with a high-magnification objective lens 4d, the displacement means 10 is turned ON again to move the optical system main body up and down, and the color filter substrate pattern image picked up by the image pickup means 8 is clear. The autofocus adjustment is performed so that (see FIG. 5A).

  In step S7, the illumination light source 9 is turned off and the white light source 7 is turned on. As a result, the white light L2 emitted from the white light source 7 passes through the plurality of pinholes 16 of the pinhole member 6 and is irradiated onto the color filter substrate via the objective lens 4. Then, a plurality of measurement points 28 corresponding to the pinhole 16 are specified on the color filter substrate (see FIG. 5B). Further, the reflected light L 3 from each measurement point 28 returns to the white light source 7 side through the objective lens 4, is reflected by the beam splitter 20, and enters the imaging unit 8.

  In step S8, height measurement is started. That is, the luminance of the reflected light L3 is detected by the light receiving element of the imaging means 8, and the luminance information is stored in a corresponding area of a storage unit (not shown) for each light receiving element that has received the reflected light. At the same time, the height information of the displacement means 10 at this time is detected by a position sensor provided in the displacement means 10 and stored in the storage unit in association with the luminance information.

  Subsequently, the displacing means 10 is turned ON to move the optical system main body upward, for example, at a predetermined speed. At this time, the reflected light L3 from the color filter substrate of the white light L2 that has passed through the plurality of pinholes 16 is received by the plurality of light receiving elements of the imaging means 8, and the luminance of the reflected light L3 is detected at predetermined time intervals. The At the same time, the height information of the displacement means 10 is acquired in synchronization with the detection of the luminance based on the output of the position sensor of the displacement means 10. The luminance information and the height information are associated with each other and stored in the storage unit for each light receiving element.

  Specifically, every time the luminance information is input at a predetermined time interval, the newly input luminance information is compared with the previous luminance information stored in the storage unit. When the new luminance information exceeds the previous luminance information, the luminance information stored in the storage unit is updated. At the same time, the height information is updated. On the other hand, when the brightness information is not updated a plurality of times set in advance, the stored brightness information is detected as the maximum brightness, and the height information when the brightness information is last updated is measured. Save as point height.

  In the present invention, the reflected light L3 from any one measurement point 28 on the color filter substrate is received by a plurality of light receiving elements of the imaging means 8. However, since each light receiving element individually outputs luminance information, the light receiving element that has detected the strongest luminance during height measurement among the plurality of light receiving elements may be handled as the light receiving element corresponding to the measurement point 28.

  In step S9, when the height measurement of all the measurement points 28 is completed ("YES" determination), the process proceeds to step S10 and the white light source 7 is turned off. At the same time, the displacement means 10 is driven to adjust the height of the optical system body to a predetermined height. This height depends on the power of the laser beam to be irradiated, and is, for example, the pattern surface of the color filter substrate, the apex of the foreign material 27, or the intermediate height position thereof, and is determined by experiments.

  Then, it moves to the removal stage of the foreign material 27 by laser irradiation. In this case, first, in step S <b> 11, the illumination light source 9 is turned on, and an image of a defect pattern including the foreign material 27 is captured by the imaging unit 8.

  In step S12, the first member 13 and the second member 14 of the light beam restricting means 3 are moved so that the size of the shape restricting portion 12 matches the size of the foreign matter 27. This operation is changed in conjunction with the movement of the first member 13 and the second member 14, for example, and a window 29 corresponding to the shape restricting portion 12 is displayed on the monitor screen, and the foreign matter 27 is displayed in the window 29. The positions of the first member 13 and the second member 14 are manually adjusted so as to be accommodated (see FIG. 5C). Alternatively, the contour of the foreign material 27 is detected from the contrast difference between the images captured by the imaging means 8 and the maximum width in the X and Y directions of the foreign material 27 (the width considering the magnification of the objective lens 4) is calculated based on the detected contour. The positions of the first member 13 and the second member 14 are automatically adjusted so that the widths in the X and Y directions of the shape restricting portion 12 of the light flux restricting means 3 coincide with the calculated widths in the X and Y directions. You may do it. Note that the window 29 can be generated by providing a position sensor on the first member 13 and the second member 14 and using an output of the position sensor.

  In step S <b> 13, the laser light source 2 is turned on, and the laser light L <b> 1 is irradiated for a predetermined time with a preset power or a power automatically set according to the height of the foreign material 27. Thereby, the foreign material 27 is instantaneously gasified and removed by the heat of the laser beam L1 (see FIG. 5D).

  In step S14, the substrate surface is observed by a monitor, and the removal state of the foreign matter 27 is confirmed. In step S15, the motor 22 is driven and the lens holder 15 is moved to replace the objective lens 4 with one of the low-magnification objective lenses 4a to 4c. Then, the process proceeds to step S4, where the stage 1 is moved to X, Moving in the Y direction, the observation area of the color filter substrate is moved to the next area. In this way, steps S1 to S14 are executed in the next observation region.

  In step S14, after confirming the removal state of the foreign matter 27, the height may be measured again in the same manner as described above. In this case, for example, when the foreign matter 27 cannot be completely removed and a height exceeding the allowable range is detected, the laser light irradiation may be performed again.

  In the above description, the defect correction of the color filter substrate, particularly the removal of the foreign matter 27 has been described. However, the present invention is not limited to this, and the present invention is also applicable to the case where a recess having a predetermined depth is formed on the workpiece 11. Can be applied. In this case, the processing accuracy can be improved by performing laser processing while measuring the processing amount (processing depth) for the workpiece 11.

  In the above-described embodiment, the case where the distance between the objective lens 4 and the workpiece 11 is displaced by moving the optical system main body in the vertical direction when performing height measurement has been described. The invention is not limited to this, and the stage 1 may be moved in the vertical direction, or the imaging lens 5 may be displaced in the optical axis direction.

  Furthermore, in the above embodiment, the case where the pinhole member 6, the white light source 7, and the imaging unit 8 are provided on the optical path branched from the optical path from the imaging lens 5 to the light beam regulating unit 3 has been described. However, the present invention is not limited to this, and each of the above components may be provided on an optical path branched from the optical path from the objective lens 4 toward the imaging lens 5. Also in this case, the position of the shape restricting portion 12 of the light flux restricting means 3, the position where the pinhole 16 of the pinhole member 6 is formed, and the position of the light receiving surface of the imaging means 8 are respectively conjugate with the imaging position of the objective lens 4. It is comprised so that it may become a relationship.

  In the above embodiment, the case where the measurement light source is the white light source 7 has been described. However, the present invention is not limited to this. For example, the measurement light source may be a laser light source or LED that emits red, green, and blue monochromatic light. Alternatively, the white light source 7 and the laser light source or the like may be switched using a switch.

  Furthermore, in the said embodiment, although the case where the light beam restriction | limiting means 3 was comprised combining the several member which can slide in a plane was demonstrated, this invention is not limited to this, The light flux restriction | limiting means 3 is It may be a micromirror device in which a plurality of individually tiltable micromirrors are arranged in a matrix. Thereby, the light beam cross-sectional shape of a laser beam can be arbitrarily set according to a processing shape.

  In the above embodiment, the case where the pinhole member 6 is formed by forming a plurality of pinholes 16 in a matrix at a predetermined interval on a transparent substrate has been described. However, the present invention is not limited to this, The hole member 6 may be a Nippon disc having a plurality of pinholes formed in a spiral shape. In this case, the height in the observation region can be measured more precisely by rotating the Nippon disc at a predetermined speed.

It is a front view which shows embodiment of the laser processing apparatus by this invention. It is a top view which shows one structural example of the light beam control means used in the said laser processing apparatus. It is a top view which shows one structural example of the pinhole member used in the said laser processing apparatus. It is a flowchart explaining the laser processing by the said laser processing apparatus. It is explanatory drawing shown about the laser processing by the said laser processing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 2 ... Laser light source 3 ... Light beam control means 4 ... Objective lens 5 ... Imaging lens 6 ... Pinhole plate 7 ... White light source (light source for measurement)
DESCRIPTION OF SYMBOLS 8 ... Imaging means 10 ... Displacement means 11 ... Workpiece 12 ... Shape control part L1 ... Laser light L2 ... White light (measurement light)
L3 ... Reflected light

Claims (6)

A light beam restricting means for restricting and emitting a light beam cross-sectional shape of the laser light emitted from the laser light source by a shape restricting portion, and a workpiece to be processed by the laser light. A laser processing apparatus comprising an objective lens for focusing on an object,
A pinhole member provided on an optical path branched from an optical path from the objective lens toward the luminous flux regulating means, and forming a plurality of pinholes;
A light source for measurement that irradiates the pinhole member with measurement light;
An imaging unit that is provided on a branched optical path from the objective lens to the pinhole member, and that receives a reflected light from the workpiece of the measurement light that has passed through the pinhole and includes a plurality of light receiving elements. When,
A displacement means for displacing a distance between the objective lens and the workpiece;
A laser processing apparatus characterized in that a minute height can be measured. A light beam restricting means for restricting and emitting a light beam cross-sectional shape of the laser light emitted from the laser light source by a shape restricting portion, and a workpiece to be processed by the laser light. An objective lens for focusing on an object, and an image of the shape restricting portion is formed on the workpiece in combination with the objective lens provided on an optical path between the light flux regulating means and the objective lens. A laser processing apparatus comprising an imaging lens,
A pinhole member provided on an optical path branched from an optical path from the imaging lens toward the light flux regulating means, and forming a plurality of pinholes;
A light source for measurement that irradiates the pinhole member with measurement light;
Imaging that is provided on a branched optical path from the imaging lens toward the pinhole member and that receives a reflected light from the workpiece of the measurement light that has passed through the pinhole with a plurality of light receiving elements. Means,
Displacement means for displacing the imaging lens in the optical axis direction;
A laser processing apparatus characterized in that a minute height can be measured.   The said light beam control means is comprised combining the several member which can be slid within the plane, The opening part enclosed by this several member was made into the said shape control part, The Claim 1 or 2 characterized by the above-mentioned. Laser processing equipment.   3. The laser processing according to claim 1, wherein the light beam restricting means is configured by arranging a plurality of individually rotatable micromirrors in a matrix, and the plurality of micromirrors are used as the shape restricting portion. apparatus.   The laser processing apparatus according to any one of claims 1 to 4, wherein the pinhole member is formed by forming a plurality of pinholes in a matrix at predetermined intervals on a transparent substrate.   The laser processing apparatus according to any one of claims 1 to 4, wherein the pinhole member is a Nippon disk in which a plurality of pinholes are formed in a spiral shape.

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