JP2009182292A - Laminated sheet and method of manufacturing ceramic multilayer substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a green sheet that improves processing accuracy of a pattern consisting of droplets by preventing thermal expansion during drawing under a heating condition, and to provide a method of manufacturing a ceramic multilayer substrate that improves processing accuracy of the pattern using the green sheet. <P>SOLUTION: A laminated sheet 20 includes a carrier sheet 21 consisting of polymeric materials, and a green sheet 22 which is layered on the carrier sheet 21 and contains ceramic particles and organic binder. The laminated sheet 20 is a sheet for drawing a liquid pattern on a drawing surface 22a which receives droplets consisting of conductive ink at a drawing temperature by the drawing surface 22a, and it includes a via hole 21h which is located on the side of the carrier sheet 21 with the green sheet 22 being interposed therebetween and contracts by expansion of the carrier sheet 21 at the drawing temperature. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a laminated sheet and a method for producing a ceramic multilayer substrate.

Low temperature co-fired ceramics (LTCC) technology enables the simultaneous firing of ceramic powder and metal fine particles, and thus can implement an element-embedded substrate incorporating various passive elements between ceramic layers. System on Package (SOP)
In the mounting technology, the manufacturing method related to the element-embedded substrate (hereinafter simply referred to as the LTCC multilayer substrate) has been intensively developed in order to reduce the parasitic effects generated in the composite of electronic components and surface mounted components. ing.

In the manufacturing method of the LTCC multilayer substrate, a drawing process of drawing patterns such as passive elements and wirings on a plurality of green sheets containing ceramic powder and an organic binder, and a lamination process of laminating a plurality of green sheets having the patterns And a firing step of firing the laminate at once.

In the drawing process, in order to increase the density of various patterns, a so-called ink jet method has been proposed in which conductive ink is discharged as fine droplets (for example, Patent Document 1).
The ink jet method uses droplets of several picoliters to several tens of picoliters and changes the ejection position of the droplets, thereby enabling a fine pattern and a narrow pitch.

The green sheet is generally formed with a thickness of several tens of micrometers to several hundreds of micrometers. In the inkjet method, in order to improve the handling of such a thin green sheet, a laminate sheet comprising a carrier sheet made of a polymer material such as polyethylene terephthalate and a green sheet laminated on the carrier sheet is used. A drawing process is performed on the sheet.
JP 2005-57139 A

In the ink jet method, when droplets that have landed on a laminated sheet spread out on the green sheet, it becomes difficult to draw a fine pattern and the pattern processing accuracy is significantly impaired. Therefore, in the inkjet method, a method of suppressing the wetting and spreading of the droplets by performing the droplet discharge process while heating the laminated sheet to a predetermined temperature and applying a heat amount to the landed droplets is being studied.

However, if the discharge process is performed while the laminated sheet is heated, an error occurs in the landing position of the droplet with the thermal expansion of the green sheet. When a pattern having a design dimension of several tens of micrometers is drawn, such an error in the landing position is a factor that greatly impairs the functionality of the ceramic multilayer substrate.

The present invention has been made in order to solve the above problems, and its purpose is to provide a green sheet that improves the processing accuracy of a pattern made of droplets by suppressing thermal expansion during drawing under heating. Another object of the present invention is to provide a method for manufacturing a ceramic multilayer substrate using the green sheet to improve pattern processing accuracy.

In examining the drawing process under heating using a laminated sheet, the present inventors have a sufficiently large amount of thermal expansion of the carrier sheet than the amount of thermal expansion of the green sheet. It has been found that the deformation is induced by the thermal expansion of the carrier sheet.

The laminated sheet of the present invention comprises a carrier sheet made of a polymer material and a green sheet laminated on the carrier sheet and containing ceramic particles and an organic binder, and is heated to limit the wetting and spreading of the conductive ink. A laminated sheet capable of drawing a pattern on the surface of the green sheet by receiving droplets made of conductive ink on the surface of the green sheet, the heating sheet on the side of the carrier sheet across the green sheet A recess that contracts due to the expansion of the carrier sheet.

According to the laminated sheet of the present invention, the thermal expansion of the carrier sheet can be suppressed by the amount of the recess, and the thermal expansion of the carrier sheet is dispersed inward in the plane direction by the amount of the contraction of the recess. be able to. Therefore, outward expansion of the carrier sheet is suppressed, and consequently deformation of the green sheet is suppressed. As a result, the laminated sheet of the present invention can improve the positional accuracy of the droplets that land on the green sheet, and thus can improve the processing accuracy of the pattern formed on the surface of the green sheet.

The concave portion of the laminated sheet may be a through hole formed in the carrier sheet.
According to this laminated sheet, since the through hole contracts, expansion of the carrier sheet outward is suppressed over the entire thickness direction of the carrier sheet. Therefore, this laminated sheet can improve the processing accuracy of the pattern formed on the surface of the green sheet more reliably.

The concave portion of the laminated sheet may be a through groove formed in the carrier sheet.
According to this laminated sheet, since the through groove contracts, expansion of the carrier sheet outward is suppressed over the entire thickness direction of the carrier sheet. Therefore, this laminated sheet can improve the processing accuracy of the pattern formed on the surface of the green sheet more reliably.

The laminated sheet may include a plurality of the carrier sheets that are separated from each other in the surface direction of the green sheet, and the concave portion may be a gap between the adjacent carrier sheets.
According to this laminated sheet, the outward expansion of each carrier sheet is suppressed by contraction of the gap between the other adjacent carrier sheets. Therefore, the outward expansion of the carrier sheet is further suppressed by the amount of the carrier sheet. Therefore, this laminated sheet can further improve the processing accuracy of the pattern formed on the surface of the green sheet.

The method for manufacturing a ceramic multilayer substrate of the present invention uses a laminated sheet comprising a carrier sheet and a green sheet laminated on the carrier sheet, and heats the laminated sheet to limit the spreading of the conductive ink. A step of ejecting droplets made of the conductive ink on the surface of the green sheet and drawing a liquid pattern made of the conductive ink on the surface of the green sheet, and drying the liquid pattern to form a dry pattern A method of manufacturing a ceramic multilayer substrate comprising: a step of forming a multilayer body by laminating a plurality of the green sheets having the dry pattern; and firing the multilayer body. The laminated sheet is heated to the side of the carrier sheet with the green sheet interposed therebetween. A recess to contract by the expansion of the rear seat.

According to the method for manufacturing a ceramic multilayer substrate of the present invention, the thermal expansion of the carrier sheet can be suppressed by the amount of the carrier sheet having the concave portion, and the thermal expansion of the carrier sheet can be suppressed by the amount of the concave portion shrinking. It can be dispersed inward in the surface direction. Therefore, outward expansion of the carrier sheet is suppressed, and deformation of the green sheet is suppressed. As a result, the method for producing a ceramic multilayer substrate of the present invention can improve the positional accuracy of the droplets that land on the green sheet, so that the processing accuracy of the liquid pattern formed on the surface of the green sheet can be improved. The processing accuracy of the various patterns provided in can be improved.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view of a circuit module having a ceramic multilayer substrate manufactured using the method for manufacturing a ceramic multilayer substrate of the present invention.

In FIG. 1, a circuit module 10 includes a low temperature co-fired ceramics (LTCC) multilayer substrate 11 as a ceramic multilayer substrate, and a semiconductor chip 12 connected to the LTCC multilayer substrate 11.

The LTCC multilayer substrate 11 has a plurality of LTCC substrates 13 stacked. Each LTCC substrate 13 is a sintered body of a green sheet and has a thickness of several tens of micrometers to several hundreds of micrometers. Between the layers of each LTCC substrate 13, various internal elements 14 such as a resistance element, a capacitive element, and a coil element, and an internal wiring 15 electrically connected to each internal element 14 are incorporated. Are formed with via wirings 16 each having a stacked via structure or a thermal via structure. The internal element 14 and the internal wiring 15 are
Each is a sintered body of conductive fine particles, and is formed by an ink jet method using conductive ink.

Next, the manufacturing method of the LTCC multilayer board | substrate 11 is demonstrated according to FIGS. Figure 2 shows LTC
FIG. 3 is a flowchart showing a manufacturing method of the C multilayer substrate 11, and FIG. 3 is a process diagram showing a drawing process using a laminated sheet. Fig.4 (a) is the top view which looked at the lamination sheet from the back surface side, FIG.4 (b) is AA sectional drawing of Fig.4 (a).

In FIG. 2, the manufacturing method of the LTCC multilayer substrate 11 includes a drawing process (step S11) for drawing a liquid pattern on a green sheet which is a precursor of the LTCC substrate 13, and a drying process (step S12) for drying the liquid pattern. It is executed in order. Moreover, in the manufacturing method of the LTCC multilayer board | substrate 11, the lamination process (step S13) which laminates | stacks a some green sheet and forms a laminated body, and the baking process (step S14) which bakes a laminated body are performed in order.

In FIG. 3, in the drawing process, a laminated sheet 20 as an object and a droplet discharge device 30 are used. The laminated sheet 20 includes a carrier sheet 21 and a green sheet 22 laminated on the carrier sheet 21.

The carrier sheet 21 is a sheet for supporting the green sheet 22 in the drawing process and the drying process. For example, a polymer material excellent in peelability to the green sheet 22 and mechanical resistance in the drawing process can be used. As the carrier sheet 21, for example, a polyethylene terephthalate film, a polyethylene naphthalate film, a polyethylene film, or a polypropylene film can be used.

In FIG. 4, the carrier sheet 21 has circular holes (hereinafter simply referred to as “through holes 21 h”) as a plurality of recesses penetrating in the thickness direction. Each of the plurality of through holes 21h is dispersed throughout the surface direction of the carrier sheet 21. In the laminated sheet 20, the carrier sheet 21 and the green sheet 22 are stacked to form the green sheet 2.
A plurality of recesses are formed on the side of the carrier sheet 21 with 2 interposed therebetween.

When the carrier sheet 21 is heated, each of the plurality of through holes 21 h contracts inward in the radial direction as the carrier sheet 21 is thermally expanded. The carrier sheet 21 is
The thermal expansion amount is reduced by the amount of the plurality of through holes 21h as compared with the case where the through holes 21h are not provided. When the laminated sheet 20 is heated, the carrier sheet 21 suppresses the outward expansion of the carrier sheet 21 in the surface direction by the amount having the through holes 21h and the amount by which the through holes 21h contract. Therefore, the deformation of the green sheet 22 is suppressed.

The green sheet 22 is a sheet made of a glass ceramic composition containing ceramic powder and an organic binder. The film thickness of the green sheet 22 is, for example, several tens of micrometers when a capacitor element is formed as the internal element 14, and is 100 for other layers.
Micrometer to 200 micrometers are formed. The green sheet 22 is formed by applying a slurry containing ceramic particles and an organic binder onto the carrier sheet 21 using a sheet forming method such as a doctor blade method or a reverse roll coater method, and drying the coated film to a state where it can be handled. Can be obtained.

The ceramic powder is, for example, a powder having an average particle diameter of 0.1 to 5.0 micrometers, and for example, a glass composite ceramic in which a borosilicate glass is mixed with a ceramic powder such as alumina or forsterite is used. it can. As the ceramic _{powder, ZnO-MgO-Al 2 O} 3 -SiO crystallized glass-ceramic with ₂ based crystallized _{glass, BaO-Al 2 O 3 -SiO} 2 ceramic powder and _Al 2 _O 3 -CaO
Non-glass-based ceramics using —SiO ₂ —MgO—B ₂ O ₃ -based ceramic powder or the like may be used.

The organic binder is an organic polymer that functions as a binder for the ceramic powder and can be easily removed by decomposition in the firing step. Examples of organic binders include butyral,
An acrylic or cellulose organic binder resin can be used. Examples of acrylic organic binder resins include alkyl (meth) acrylate, alkoxyalkyl (
Homopolymers of (meth) acrylate compounds such as (meth) acrylate, polyalkylene glycol (meth) acrylate, and cycloalkyl (meth) acrylate can be used. As the acrylic organic binder resin, 2 of the (meth) acrylate compound is used.
A copolymer obtained from more than one species, or a copolymer obtained from another copolymerizable monomer such as a (meth) acrylate compound and an unsaturated carboxylic acid can be used. The organic binder may contain a plasticizer such as adipic acid ester plasticizer, dioctyl phthalate (DOP), dibutyl phthalate (DBP) phthalic acid ester plasticizer, glycol ester plasticizer.

A circular hole or a conical hole (hereinafter simply referred to as a via hole 22h) having a hole diameter of several tens of micrometers to several hundreds of micrometers is formed through the green sheet 22 by laser processing or punching. The via hole 22h is filled with a conductive material such as silver, gold, copper, or palladium in the previous step by a squeegee method using a conductive paste or an inkjet method using a conductive ink.

In FIG. 4, each via hole 22 h has a laminated sheet 20 through a through hole 21 h.
Is formed through. According to this, when the laminated sheet 20 is heated, the via hole 2
The gas from the conductive material filled in 2h is exhausted to the outside of the laminated sheet 20 through the through hole 21h. Therefore, when the laminated sheet 20 is heated, the generation of bubbles between the carrier sheet 21 and the green sheet 22 is suppressed, and the deformation of the green sheet 22 is further suppressed.

In FIG. 3, the droplet discharge device 30 includes a stage 31 on which the laminated sheet 20 is placed, an ink tank 32 that stores the conductive ink Ik, and a conductive ink I in the ink tank 32.
a droplet discharge head 33 for discharging k onto the drawing surface 22a.

The stage 31 is a stage for holding the laminated sheet 20, and positions the laminated sheet 20 placed on the stage 31 with respect to the droplet discharge head 33. Stage 31 is
A heater H for heating the laminated sheet 20 is provided therein, and when the heater H is driven, the laminated sheet 20 placed on the stage 31 is heated to a predetermined temperature (hereinafter simply referred to as a drawing temperature). . The drawing temperature is a temperature for preventing the droplet D after landing from getting wet and spreading beyond a predetermined size when the droplet D made of the conductive ink Ik lands on the green sheet 22. The temperature is appropriately selected according to the contact angle of the conductive ink Ik with respect to the green sheet 22. The drawing temperature is, for example, 60 ° C., and is a temperature lower than the thermal deformation temperature of the carrier sheet 21 in order to suppress excessive thermal deformation of the carrier sheet 21.

The conductive ink Ik is a dispersion system of the conductive fine particles S in which the conductive fine particles S are dispersed in the dispersion medium F. The viscosity of the conductive ink Ik is adjusted to 20 cP or less in order to enable the discharge of minute droplets D. Yes. The conductive fine particle S is a fine particle having a particle size of several nanometers to several tens of nanometers. For example, gold, silver, copper, platinum, palladium, rhodium, osmium, ruthenium, iridium, iron, tin, cobalt, nickel, A metal such as chromium, titanium, tantalum, tungsten, indium, or an alloy thereof can be used. The dispersion medium F is a conductive fine particle S.
Can be used. For example, water or an aqueous solution containing water as a main component, or an organic system containing an organic solvent such as tetradecane as a main component can be used.

The droplet discharge head 33 includes a cavity 34 communicating with the ink tank 32 and a cavity 3.
4 and a pressure generating element 36 connected to the cavity 34.
The cavity 34 receives the conductive ink Ik from the ink tank 32 and supplies the conductive ink Ik to the nozzle 35. The nozzle 35 is a nozzle having an opening of several tens of micrometers, and stores the conductive ink Ik from the ink tank 32. The pressure generating element 36 is a piezoelectric element or a capacitive element that changes the volume of the cavity 34, or a resistance heating element that changes the temperature of the cavity 34, and generates a predetermined pressure inside the cavity 34. When the pressure generating element 36 is driven, the nozzle 35 vibrates the gas-liquid interface (meniscus) of the conductive ink Ik, and discharges the conductive ink Ik as a droplet D of several picoliters to several tens of picoliters. .

In the drawing process, the laminated sheet 20 heated to the drawing temperature and the droplet discharge head 33 move relatively along one direction of the laminated sheet 20. The plurality of droplets D from the nozzle 35 are
Each landed in order on the upper surface of the green sheet 22 (hereinafter simply referred to as the drawing surface 22a),
A continuous liquid pattern P is formed by merging with other adjacent droplets D. At this time, since the temperature of the laminated sheet 20 is the drawing temperature, the liquid pattern P is thickened by evaporation of a part of the dispersion medium F, and its wetting and spreading is limited. And since the through-hole 21h contracts with heating of the laminated sheet 20, the outward expansion of the carrier sheet 21 is suppressed,
As a result, the deformation of the green sheet 22 is suppressed. As a result, the laminated sheet 20 can improve the positional accuracy of the droplets D that land on the green sheet 22, and thus can improve the processing accuracy of the liquid pattern P formed on the drawing surface 22a.

In the drying process, the laminated sheet 20 after the drawing process is carried into a drying apparatus such as a drying furnace,
In a state having the liquid pattern P, it is heated to a predetermined temperature (hereinafter simply referred to as a drying temperature).
In the drying process, drying of the liquid pattern P is promoted, and most of the dispersion medium F of the liquid pattern P evaporates, so that a pattern composed of aggregates of conductive fine particles S (hereinafter simply referred to as a dry pattern) is drawn. Formed on the surface 22a.

If the drying temperature is excessively high, the carrier sheet 21 and the green sheet 22 are thermally deformed, and the positional accuracy with the other laminated sheets 20 in the lamination process is impaired. Therefore, the drying temperature is, for example, 40 ° C. to 80 ° C., and is appropriately selected according to the composition of the laminated sheet 20 and the composition of the conductive ink Ik so as to ensure the positional accuracy during the lamination process.

In the lamination step, first, the carrier sheet 21 is peeled off from each of the plurality of laminated sheets 20. Each of the plurality of green sheets 22 is sequentially stacked in a state having a dry pattern to form a stacked body including the plurality of green sheets 22. A laminate composed of a plurality of green sheets 22 is pressure-bonded by using an isostatic pressing method or the like.

In the firing step, the laminate obtained in the lamination step is carried into a predetermined firing furnace and fired. The firing temperature is, for example, 800 ° C. to 1000 ° C., and is appropriately changed according to the composition of the green sheet 22. When Cu is used as the dry pattern, it is preferable to fire in a reducing atmosphere to prevent oxidation. When silver, gold, platinum, palladium or the like is used, it may be fired in the air. In the firing step, the laminate may be fired while being pressed at a pressure smaller than the hydrostatic pressure in the lamination step. According to this, the flatness of the LTCC multilayer substrate 11 is improved,
Warpage and peeling of each green sheet 22 can be prevented.

Next, effects of the embodiment configured as described above will be described below.
(1) The laminated sheet 20 in the first embodiment has a through-hole 2 that contracts due to the expansion of the carrier sheet 21 at the drawing temperature on the carrier sheet 21 that supports the green sheet 22.
1h. Accordingly, the laminated sheet 20 can suppress the outward expansion of the carrier sheet 21 at the drawing temperature by the amount having the through-holes 21h and the amount by which the through-holes 21h are contracted. It can be suppressed. As a result, the laminated sheet 20
Can improve the positional accuracy of the droplets D that land on the green sheet 22, so that the drawing surface 22
The processing accuracy of the liquid pattern P formed on a can be improved.

(2) Since each of the plurality of through holes 21 h contracts radially inward over the entire thickness direction of the carrier sheet 21, the outward expansion of the carrier sheet 21 is caused in the thickness direction of the carrier sheet 21. It is suppressed more uniformly throughout. Therefore, laminated sheet 2
0 can more reliably improve the processing accuracy of the liquid pattern P formed on the drawing surface 22a.

(3) Moreover, degassing from the green sheet 22 and the via hole 22h during drawing is exhausted to the outside of the laminated sheet 20 through the through hole 21h. Therefore, the generation of bubbles between the carrier sheet 21 and the green sheet 22 is suppressed, and the green sheet 22 is suppressed.
Is more reliably avoided.

(4) In the manufacturing method of the LTCC multilayer substrate 11 in the above embodiment, the laminated sheet 20 is heated to the drawing temperature to limit the wetting and spreading of the liquid pattern P, and the through holes 21h are formed by the expansion of the carrier sheet 21 at the drawing temperature. Shrink. Therefore, in the drawing process, the outward expansion of the carrier sheet 21 is suppressed to the extent that the through hole 21h contracts, and the deformation of the green sheet 22 is suppressed. As a result, it is possible to improve the processing accuracy of the liquid pattern P formed on the drawing surface 22a. As a result, the internal element 14 formed on the LTCC multilayer substrate 11 can be improved.
In addition, the processing accuracy of the internal wiring 15 can be improved.
(Second embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIG. In the second embodiment, the carrier sheet 21 of the first embodiment is modified. Therefore, in the following, the changes will be described in detail. Fig.5 (a) is the top view which looked at the lamination sheet 20 of 2nd embodiment from the back surface side, FIG.5 (b) is AA sectional drawing of Fig.5 (a).

In FIG. 5, the carrier sheet 21 has a through groove 2 as a concave portion penetrating in the thickness direction.
1s. The through groove 21 s is formed in a ninety-nine fold shape over the entire surface direction of the carrier sheet 21. In the laminated sheet 20, the carrier sheet 2 having a through groove 21s.
1 and the green sheet 22 are stacked, whereby a plurality of recesses are formed on the carrier sheet 21 side with the green sheet 22 interposed therebetween.

When the carrier sheet 21 is heated, the through groove 21 s contracts toward the inside of the groove as the carrier sheet 21 is thermally expanded. Further, the carrier sheet 21 is equivalent to the through groove 21s.
The thermal expansion amount is reduced as compared with the case where the through groove 21s is not provided. And when the lamination sheet 20 is heated to drawing temperature, it is only the part which has the penetration groove | channel 21s, and the penetration groove | channel 21
As much as s contracts, expansion of the carrier sheet 21 to the outside in the surface direction is suppressed, whereby deformation of the green sheet 22 can be suppressed.

(5) In the laminated sheet 20 in the second embodiment, since the through groove 21 s contracts over the entire thickness direction of the carrier sheet 21, the outward expansion of the carrier sheet 21 is the entire thickness direction of the carrier sheet 21. And more uniformly. Therefore, the laminated sheet 20 can more reliably improve the processing accuracy of the liquid pattern P formed on the drawing surface 22a.

(6) Moreover, since the lamination sheet 20 has a recessed part covering substantially the full width of the extending direction of the through groove 21s (left and right direction in FIG. 5), the deformation in the right and left direction of the green sheet 22 can be more reliably suppressed.
(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to FIG. In the third embodiment, the carrier sheet 21 of the first embodiment is changed. Therefore, in the following, the changes will be described in detail. Fig.6 (a) is the top view which looked at the lamination sheet 20 of 3rd embodiment from the back surface side, FIG.6 (b) is AA sectional drawing of Fig.6 (a).

In FIG. 6, the laminated sheet 20 has a plurality of carrier sheets 21. The plurality of carrier sheets 21 are each formed in a triangular plate shape extending in the left-right direction in FIG. 6 and attached to the carrier sheet 21 so as to be separated from each other. In the laminated sheet 20, the plurality of carrier sheets 21 are separated from each other, whereby a plurality of through grooves 21 s as concave portions are formed on the side of the carrier sheet 21 with the green sheet 22 interposed therebetween.

Each of the plurality of through grooves 21 s has a carrier sheet 21 when the laminated sheet 20 is heated.
As the heat expands, it shrinks to the inside of the groove. Each of the plurality of carrier sheets 21 is
The amount of thermal expansion is reduced by the amount that the size is reduced. And laminated sheet 2
When 0 is heated to the drawing temperature, the deformation of the green sheet 22 can be suppressed by the amount of the carrier sheet 21 and by the amount by which each of the plurality of through grooves 21s contracts.

(7) In the laminated sheet 20 in the third embodiment, the outward expansion of each carrier sheet 21 is suppressed by contraction of the gap between the other adjacent carrier sheets 21.
Therefore, the outward expansion of the carrier sheet 21 is further suppressed by the amount of the carrier sheet 21. Therefore, the laminated sheet 20 can further improve the processing accuracy of the liquid pattern P formed on the drawing surface 22a.

In addition, you may change the said embodiment as follows.
In the above embodiment, the side of the carrier sheet 21 in each via hole 22h is opened outward through the through hole 21h. However, the present invention is not limited to this, and the side of the carrier sheet 21 in each via hole 22 h may be closed by the carrier sheet 21. According to this, regardless of the presence or absence of the through hole 21h, the via hole 22h can be smoothly filled with the conductive material. That is, the laminated sheet 20 may have a configuration in which a concave portion that contracts due to the expansion of the carrier sheet 21 at the drawing temperature is provided on the side of the carrier sheet 21 with the green sheet 22 interposed therebetween.

In the above embodiment, the via hole 22h may be formed after the liquid pattern P is formed.
-Although the through-hole 21h in said 1st embodiment is a circular hole, as shown in FIG.

The carrier sheet 21 in the second embodiment has ninety-nine fold-shaped through grooves 21s. However, the present invention is not limited to this, and the carrier sheet 21 has a linear or spiral through groove 21s. Also good.

The carrier sheet 21 in the second embodiment may be configured to further include the through hole 21h shown in the first embodiment in addition to the through groove 21s.
Each carrier sheet 21 in the third embodiment has a triangular plate shape, but is not limited thereto, and may have a strip shape as shown in FIG. Moreover, the structure by which the adjacent carrier sheet 21 is connected through the connection sheet | seat 26 which has a shape different from the carrier sheet 21 may be sufficient.

The carrier sheet 21 in the third embodiment is a through hole 21h shown in the first embodiment.
Or the structure which has 21s of through-grooves shown in 2nd embodiment may be sufficient.

Sectional drawing which shows a circuit module. The flowchart which shows the manufacturing method of a ceramic multilayer substrate. Process drawing which shows the manufacturing method of a ceramic multilayer substrate. (A), (b) is the top view and sectional drawing which show a lamination sheet, respectively. (A), (b) is the top view and sectional drawing which show the lamination sheet of 2nd embodiment, respectively. (A), (b) is the top view and sectional drawing which respectively show the lamination sheet of 3rd embodiment. The top view which shows the lamination sheet of the example of a change. The figure which shows the lamination sheet of the example of a change.

Explanation of symbols

D ... droplet, Ik ... conductive ink, P ... liquid pattern, 11 ... LTCC multilayer substrate as a ceramic multilayer substrate, 20 ... laminated sheet, 21 ... carrier sheet, 21h ... through hole as recess, 21s ... as recess Through groove, 22 ... Green sheet.

Claims (5)

A carrier sheet made of a polymer material, and a green sheet laminated on the carrier sheet and containing ceramic particles and an organic binder, and heated to limit the wetting and spreading of the conductive ink. A laminated sheet capable of drawing a pattern on the surface of the green sheet by receiving droplets made of conductive ink,
A laminated sheet comprising a recess that shrinks due to expansion of the carrier sheet in the heating on the side of the carrier sheet with the green sheet interposed therebetween. The laminated sheet according to claim 1,
The laminated sheet, wherein the recess is a through hole formed in the carrier sheet. The laminated sheet according to claim 1 or 2,
The laminated sheet, wherein the recess is a through groove formed in the carrier sheet. It is a lamination sheet given in any 1 paragraph of Claims 1-3,
A plurality of the carrier sheets spaced apart from each other in the surface direction of the green sheet,
The laminated sheet, wherein the concave portion is a gap between the adjacent carrier sheets. A laminated sheet comprising a carrier sheet and a green sheet laminated on the carrier sheet is used, and the laminated sheet is heated on the surface of the green sheet from the conductive ink to limit the wetting and spreading of the conductive ink. Discharging a liquid droplet, and drawing a liquid pattern made of the conductive ink on the surface of the green sheet;
Drying the liquid pattern to form a dry pattern;
Forming a multilayer body by laminating a plurality of the green sheets having the dry pattern, and forming the ceramic multilayer substrate by firing the multilayer body, comprising:
The laminated sheet is
A method for producing a ceramic multilayer substrate, comprising: a recess that shrinks due to expansion of the carrier sheet in the heating, on the side of the carrier sheet with the green sheet interposed therebetween.

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