JP2009182086A - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP2009182086A
JP2009182086A JP2008018806A JP2008018806A JP2009182086A JP 2009182086 A JP2009182086 A JP 2009182086A JP 2008018806 A JP2008018806 A JP 2008018806A JP 2008018806 A JP2008018806 A JP 2008018806A JP 2009182086 A JP2009182086 A JP 2009182086A
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light emitting
light
emitting member
emitting device
layer
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JP2008018806A
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Japanese (ja)
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Kazuhiro Kawabata
和弘 川畑
Tamio Kusano
民男 草野
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Kyocera Corp
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Kyocera Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

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Abstract

<P>PROBLEM TO BE SOLVED: To improve extraction efficiency of light emitted from a fluorescence material. <P>SOLUTION: A light emitting device has a light emitting element 13, a light emitting member 15 and a light transparent layer 16. The light emitting member 15 covers an upper end and side surface of the light emitting element 13 and contains a matrix material and the fluorescence material. The light transparent layer 16 is provided on an outside surface of the light emitting member 15 and has a refractive index larger than that of the matrix material of the light emitting member 16. The light emitting member 15 has a dome shape. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば発光ダイオードなどの発光素子を有する発光装置に関するものである。   The present invention relates to a light emitting device having a light emitting element such as a light emitting diode.

近年、照明分野などにおいて、発光ダイオードなどの発光素子を有する発光装置の開発が進められている。この発光装置は、発光素子によって発生された光の波長を変換する発光部材を有している。発光部材は、蛍光材料を含んでいる。今後、発光装置において、発光特性のさらなる向上が求められている。
特開２００５−２７２８４２号公報 In recent years, development of light emitting devices having light emitting elements such as light emitting diodes has been promoted in the field of illumination and the like. The light emitting device includes a light emitting member that converts the wavelength of light generated by the light emitting element. The light emitting member includes a fluorescent material. In the future, there is a demand for further improvement in light emission characteristics of light emitting devices.
JP 2005-272842 A

発光装置における発光特性を向上させるためには、蛍光材料から放射された光の取出し効率を向上させる必要がある。本発明は、発光部材の蛍光材料から放射された光の取出し効率を向上させることを目的とするものである。   In order to improve the light emission characteristics of the light emitting device, it is necessary to improve the extraction efficiency of the light emitted from the fluorescent material. An object of the present invention is to improve the extraction efficiency of light emitted from a fluorescent material of a light emitting member.

本発明の一つの態様によれば、発光装置は、発光素子、発光部材および透光性層を有している。発光部材は、発光素子の上端および側面を覆っており、マトリクス材料および蛍光材料を含んでいる。透光性層は、発光部材の外側表面に設けられており、マトリクス材料より大きい屈折率を有している。   According to one embodiment of the present invention, a light emitting device includes a light emitting element, a light emitting member, and a light transmissive layer. The light emitting member covers the upper end and the side surface of the light emitting element, and includes a matrix material and a fluorescent material. The translucent layer is provided on the outer surface of the light emitting member and has a refractive index greater than that of the matrix material.

本発明の一つの態様によれば、発光装置は、発光部材の外側表面に設けられており、マトリクス材料より大きい屈折率を有する透光性層を有している。このような構成により、蛍光材料から放射された光の取出し効率が向上されている。従って、発光装置の発光特性が向上されている。   According to one aspect of the present invention, the light-emitting device has a light-transmitting layer that is provided on the outer surface of the light-emitting member and has a higher refractive index than the matrix material. With such a configuration, the extraction efficiency of light emitted from the fluorescent material is improved. Therefore, the light emission characteristics of the light emitting device are improved.

以下、本発明の実施形態が図面を参照して説明されている。図１に示されているように、本実施形態の照明装置１００は、複数の発光装置１、基板２およびカバー３を有している。複数の発光装置１は、基板２上に実装されている。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, the illumination device 100 of the present embodiment includes a plurality of light emitting devices 1, a substrate 2, and a cover 3. The plurality of light emitting devices 1 are mounted on the substrate 2.

図２および図３に示されているように、発光装置１は、基体１１、サブマウント１２および発光素子１３を有している。発光装置１は、封入層１４、発光部材１５および透光性層１６をさらに有している。空気間隙１９が、封入層１４および発光部材１５の間に設けられている。   As shown in FIGS. 2 and 3, the light emitting device 1 includes a base 11, a submount 12, and a light emitting element 13. The light emitting device 1 further includes an encapsulating layer 14, a light emitting member 15, and a light transmissive layer 16. An air gap 19 is provided between the encapsulating layer 14 and the light emitting member 15.

基体１１は、金属材料からなる。金属材料の例は、銅（Ｃｕ）である。絶縁層１７が、基体１１上に設けられている。絶縁層１７は、基体１１に固定されている。絶縁層１７は、基体１１に接合されている。導体パターン１８が、絶縁層１７上に形成されている。   The base 11 is made of a metal material. An example of the metal material is copper (Cu). An insulating layer 17 is provided on the substrate 11. The insulating layer 17 is fixed to the base body 11. The insulating layer 17 is bonded to the base body 11. A conductor pattern 18 is formed on the insulating layer 17.

サブマウント１２は、基体１１上に設けられており、絶縁材料からなる。絶縁材料の例は、セラミックスである。   The submount 12 is provided on the base 11 and is made of an insulating material. An example of the insulating material is ceramics.

発光素子１３は、サブマウント１２上に実装されており、ボンディングワイヤ２０によって導体パターン１８に電気的に接続されている。発光素子１３は、半導体材料からなる発光ダイオード（ＬＥＤ）である。発光素子１３は、活性層を含む複数の半導体層で形成されている。発光素子１３は、駆動電力に応じて第１次光を放射する光源である。第１次光は、ＵＶ波長領域および青色波長領域に含まれるか、または、ＵＶ波長領域および青色波長領域に部分的に重なる。   The light emitting element 13 is mounted on the submount 12 and is electrically connected to the conductor pattern 18 by a bonding wire 20. The light emitting element 13 is a light emitting diode (LED) made of a semiconductor material. The light emitting element 13 is formed of a plurality of semiconductor layers including an active layer. The light emitting element 13 is a light source that emits primary light according to driving power. The primary light is included in the UV wavelength region and the blue wavelength region, or partially overlaps the UV wavelength region and the blue wavelength region.

封入層１４は、発光素子１３の上端および側面に接している。封入層１４は、透光性を有している。封入層１４の“透光性”とは、発光素子１３から放射された光の波長の少なくとも一部が透過することをいう。封入層１４は、シリコーン樹脂からなる。   The encapsulating layer 14 is in contact with the upper end and the side surface of the light emitting element 13. The encapsulating layer 14 has translucency. “Translucency” of the encapsulating layer 14 means that at least a part of the wavelength of light emitted from the light emitting element 13 is transmitted. The encapsulating layer 14 is made of a silicone resin.

発光部材１５は、発光素子１３の上端および側面を覆っている。発光部材１５は、ドーム形状を有している。図３に示されているように、発光部材１５は、マトリクス材料１５−１および蛍光材料１５−２を含んでいる。マトリクス材料１５−１は、透光性を有している。マトリクス材料１５−１に関する“透光性”とは、発光素子１３から放射された光の少なくとも一部が透過することをいう。マトリクス材料は、シリコーン樹脂からなる。蛍光材料１５−２から放射された光は、マトリクス材料１５−１を透過する。蛍光材料１５−２は、マトリクス材料１５−１に埋め込まれている。蛍光材料１５―２は、マトリクス材料１５−１に分散されている。蛍光材料１５−２は、発光素子１３から放射された第１次光によって励起される。   The light emitting member 15 covers the upper end and the side surface of the light emitting element 13. The light emitting member 15 has a dome shape. As shown in FIG. 3, the light emitting member 15 includes a matrix material 15-1 and a fluorescent material 15-2. The matrix material 15-1 has translucency. “Translucent” with respect to the matrix material 15-1 means that at least a part of the light emitted from the light emitting element 13 is transmitted. The matrix material is made of a silicone resin. The light emitted from the fluorescent material 15-2 passes through the matrix material 15-1. The fluorescent material 15-2 is embedded in the matrix material 15-1. The fluorescent material 15-2 is dispersed in the matrix material 15-1. The fluorescent material 15-2 is excited by the primary light emitted from the light emitting element 13.

透光性層１６は、発光部材１５の外側表面に設けられている。透光性層１６は、発光部材１５の外側表面にコーティングされている。層１６に関する“透光性”とは、蛍光材料１５−２から放射された光の波長の少なくとも一部が透過することをいう。透光性層１６は、シリコーン樹脂、エポキシ樹脂またはアクリル樹脂からなる。   The translucent layer 16 is provided on the outer surface of the light emitting member 15. The light transmissive layer 16 is coated on the outer surface of the light emitting member 15. “Translucent” with respect to the layer 16 means that at least a part of the wavelength of the light emitted from the fluorescent material 15-2 is transmitted. The translucent layer 16 is made of silicone resin, epoxy resin, or acrylic resin.

図４に示されているように、蛍光材料１５−２から放射された光の一部Ｌ１５−２は、発光部材１５のマトリクス材料１５−１および透光性層１６の界面２１に入射される。透光性層１６がマトリクス材料１５−１より大きい屈折率を有していることにより、界面２１における出射角β２１は入射角α２１より小さくなる。透光性層１６に入射された光Ｌ１５−２は、透光性層１６の外側表面２２から出射される。光Ｌ１５−２が界面２１において屈折されていることにより、透光性層１６の表面２２における入射角は、臨界角より小さくなっている可能性が高くなっている。従って、表面２２において、光Ｌ１５−２が全反射される可能性が低くなっている。このようにして、発光装置１は、蛍光材料から放射された光Ｌ１５−２の取出し効率が向上されている。発光装置１は、発光特性が向上されている。   As shown in FIG. 4, part of the light L <b> 15-2 emitted from the fluorescent material 15-2 is incident on the interface 21 between the matrix material 15-1 of the light emitting member 15 and the translucent layer 16. . Since the translucent layer 16 has a higher refractive index than the matrix material 15-1, the exit angle β21 at the interface 21 is smaller than the incident angle α21. The light L15-2 incident on the light transmissive layer 16 is emitted from the outer surface 22 of the light transmissive layer 16. Since the light L15-2 is refracted at the interface 21, the incident angle on the surface 22 of the translucent layer 16 is likely to be smaller than the critical angle. Therefore, the possibility that the light L15-2 is totally reflected on the surface 22 is low. In this way, in the light emitting device 1, the extraction efficiency of the light L15-2 emitted from the fluorescent material is improved. The light emitting device 1 has improved light emission characteristics.

本発明の実施形態の照明装置１００を示している。1 shows an illumination device 100 according to an embodiment of the present invention. 図１におけるII−II’の縦断面を示している。2 shows a longitudinal section taken along line II-II ′ in FIG. 1. 発光部材１５および透光性層１６を示している。The light emitting member 15 and the translucent layer 16 are shown. 図３における符号IVで示された部分の拡大模式図を示している。The enlarged schematic diagram of the part shown by the code | symbol IV in FIG. 3 is shown.

符号の説明Explanation of symbols

１ 発光装置
１１ 基体
１２ サブマウント
１３ 発光素子
１４ 封入層
１５ 発光部材
１６ 透光性層 DESCRIPTION OF SYMBOLS 1 Light-emitting device 11 Base | substrate 12 Submount 13 Light-emitting element 14 Encapsulation layer 15 Light-emitting member 16 Translucent layer

Claims (4)

発光素子と、
マトリクス材料および蛍光材料を含んでおり、前記発光素子の上端および側面を覆っている発光部材と、
前記マトリクス材料より大きい屈折率を有しており、前記発光部材の外側表面に設けられた透光性層と、
を備えた発光装置。 A light emitting element;
A light emitting member including a matrix material and a fluorescent material, and covering an upper end and a side surface of the light emitting element;
A translucent layer provided on the outer surface of the light emitting member, having a refractive index greater than that of the matrix material;
A light emitting device comprising: 前記発光部材がドーム形状を有していることを特徴とする請求項１記載の発光装置。   The light emitting device according to claim 1, wherein the light emitting member has a dome shape. 前記透光性層が、前記発光部材の前記外側表面にコーティングされていることを特徴とする請求項２記載の発光装置。   The light-emitting device according to claim 2, wherein the translucent layer is coated on the outer surface of the light-emitting member. 前記透光性層が、シリコーン樹脂、エポキシ樹脂またはアクリル樹脂からなることを特徴とする請求項３記載の発光装置。   The light-emitting device according to claim 3, wherein the translucent layer is made of a silicone resin, an epoxy resin, or an acrylic resin.
JP2008018806A 2008-01-30 2008-01-30 Light emitting device Pending JP2009182086A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102588752A (en) * 2011-01-07 2012-07-18 晶元光电股份有限公司 Light emitting device
CN102588816A (en) * 2011-01-07 2012-07-18 晶元光电股份有限公司 Luminous device, light-mixing device and manufacturing method of luminous device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004265985A (en) * 2003-02-28 2004-09-24 Citizen Electronics Co Ltd Light emitting diode
JP2007036030A (en) * 2005-07-28 2007-02-08 Nichia Chem Ind Ltd Light emitting device and its manufacturing method
JP2007214592A (en) * 2007-04-26 2007-08-23 Kyocera Corp Light emitting apparatus
JP2008016647A (en) * 2006-07-06 2008-01-24 Sanyo Electric Co Ltd Light-emitting device and manufacturing method therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004265985A (en) * 2003-02-28 2004-09-24 Citizen Electronics Co Ltd Light emitting diode
JP2007036030A (en) * 2005-07-28 2007-02-08 Nichia Chem Ind Ltd Light emitting device and its manufacturing method
JP2008016647A (en) * 2006-07-06 2008-01-24 Sanyo Electric Co Ltd Light-emitting device and manufacturing method therefor
JP2007214592A (en) * 2007-04-26 2007-08-23 Kyocera Corp Light emitting apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102588752A (en) * 2011-01-07 2012-07-18 晶元光电股份有限公司 Light emitting device
CN102588816A (en) * 2011-01-07 2012-07-18 晶元光电股份有限公司 Luminous device, light-mixing device and manufacturing method of luminous device

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