JP2009177055A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability of an electronic component mounted in various electric apparatuses, electronic instruments, cars, or the like. <P>SOLUTION: The electronic component houses an electronic component element and a resin in a housing portion, and includes lead terminals connected to the element and a terminal plate to which the lead terminals are fixed. The electronic component has a structure such that there is no bending portion of the lead terminals in the resin by arranging the element and the resin above the terminal plate and by arranging bending portions of the lead terminals under the terminal plate. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component that integrates a storage portion that stores an electronic component element and a connector portion that is connected to the electronic component element.

  Many electronic components are used by being mounted on an electronic circuit board or an electric circuit board such as an electronic device or an electric device. However, an electronic component used in an automobile is mounted on the circuit board as described above and is used in an automobile. In addition to being mounted, there are mounting types in which electronic component elements such as capacitors and coils are singularly or several together are stored in a case together with resin and mounted in the engine room. Is required to be reliable under severe conditions of high temperature and high humidity.

  And the electronic component attached in an engine room with the latter form has a structure as shown in FIG. 8 or FIG. More specifically, in the electronic component in FIG. 8, the capacitor element 92 is housed in the case 94 together with a metal mounting leg 93 for mounting the capacitor 91 in the engine room so as to fill the capacitor element 92 and the mounting leg 93. Are filled with resin 95. Of the external electrodes 96 and 97 provided at both ends of the capacitor element 92, one external electrode 96 is electrically connected to the mounting leg 93 by a conductive wire 98, and the other external electrode 97 is connected to the terminal 100 via the conductive wire 99. The terminal 100 is brought out of the case 94 and connected to an external wiring or the like.

  Further, in the electronic component in FIG. 9, the capacitor element 102 is housed in a case 104 together with a metal mounting leg 103 for mounting the capacitor 101 in the engine room, and is filled with a resin 105. The mounting leg 103 is directly connected to one of the external electrodes 106 and 107 at both ends of the capacitor element 102, and the terminal 110 is directly connected to the other external electrode 107. The terminal 110 passes through the bottom 109 of the case 104 and protrudes to the outside so as to be connected to a wire harness or the like.

  In the conventional capacitor as described above, the conductors 98 and 99 for connecting the external electrodes 96 and 97 of the capacitor element 92 to the mounting legs 93 and the terminals 100 of the former capacitor 91 shown in FIG. Therefore, the latter capacitor 101 is advantageous in that it can reduce man-hours at the time of manufacture and improve reliability by reducing the number of connecting portions.

As the conventional techniques as described above, for example, those described in Patent Documents 1 and 2 are known.
Japanese Utility Model Publication No.2-138412 JP 2000-331868 A

  However, when the present inventors produced a film capacitor having a structure in which the terminal is directly connected to the external electrode of the capacitor element as in the latter case, one problem has been clarified. The problem will be described below with reference to the drawings.

  FIG. 7 shows a film capacitor 71 produced by the present inventors. A capacitor element 72 is housed in a resin case 89 serving as a housing portion 82, and a resin 88 is filled so as to fill the capacitor element 72. Through holes 86 and 87 for projecting the lead terminals 76 and 77 from the inside of the storage part 82 to the outside are provided at the bottom of the storage part 82, and the bottom surface of the bottom of the storage part 82 around the through holes 86 and 87 is provided on the bottom surface. A protrusion 85 is provided so as to surround the through holes 86 and 87.

  The two lead terminals 76 and 77 are connected to the external electrodes 74 and 75 of the capacitor element 72, and project from the through holes 86 and 87 to the outside of the case 89.

  Here, in order to form a connector for connecting to a wire harness or the like by the portion of the lead terminals 76 and 77 protruding to the outside of the case 89 and the protrusion 85, external electrodes of the lead terminal 76 and the lead terminal 77 are formed. In order to make the wide interval between the portions connected to 74 and 75 narrow at the portion protruding to the outside of the case 89, the bent terminals 78, 79, 80, and 81 are formed in the lead terminals 76 and 77 within the case 89. It has a provided structure.

  In order to evaluate the reliability of the film capacitor 71 as described above, when subjected to a temperature cycle test, the bent portions 78, 79, 80, 81 of the lead terminals 76, 77 are caused by the expansion and contraction of the lead terminals 76, 77 and the resin 88. Stress concentrates in the periphery, cracks are generated in the resin 88 around the bent portions 78, 79, 80, 81, and moisture easily penetrates into the cracks, and the metal thin film that forms the capacitance of the film capacitor 71 by the penetrated moisture The electrode corroded, and the capacity of the film capacitor 71 was reduced.

  In the present invention, when the lead terminals 76 and 77 for connecting directly to the external wiring or the like are not connected to the external electrodes 74 and 75 of the capacitor element 72 as described above, the lead terminals 76 and 77 are bent. An object is to solve the problem that the resin 88 around the portions 78, 79, 80, 81 is cracked and the capacity of the film capacitor 71 as an electronic component is reduced.

  In order to solve the above-described problems, an electronic component according to the present invention includes a storage portion in which an electronic component element is stored and filled with a resin, one or more lead terminals connected to the element, and the lead terminal is fixed. The terminal plate is disposed so as to close an opening provided on the bottom surface of the storage portion, the element and the resin are disposed on the upper side of the terminal plate, and the lead terminal The terminal board penetrates from the upper surface side to the lower surface side and is bent at the lower side of the terminal board.

  According to the electronic component of the present invention, since the lead terminal is bent at the resin-free portion under the terminal board, there is no portion where stress concentrates on the resin around the lead terminal, and cracks are less likely to occur in the resin. As a result, it is possible to obtain an effect of suppressing deterioration of the performance of the electronic component due to infiltration of moisture, corrosive gas, or the like into the electronic component element.

  Hereinafter, electronic components according to embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
FIG. 1 is a view showing a cross section of a film capacitor 1 which is an electronic component of the present invention.

  In FIG. 1, the capacitor element 2 is stored in a resin storage portion 12, and a resin 18 is filled to fill the element 2. Here, the terminal plate 14 is provided at the bottom of the storage portion 12 so as to block the opening 13 provided at the bottom of the storage portion 12 and the protrusion 15 protrudes to the outside of the storage portion 12. Lead terminals 6 and 7 are connected to the external electrodes 4 and 5 at both ends of the element 2, and the lead terminals 6 and 7 pass through through holes 16 and 17 provided in the terminal plate 14. The lower surface is bent inward at bent portions 8 and 10 along the lower surface, and further bent downward at bent portions 9 and 11. And the part protruded outside the terminal plate 14 lower surface of the lead terminals 6 and 7 and the protrusion 15 constitute a connector, and has a structure connected to a wire harness or the like.

  More specifically, as shown in FIG. 2A, the element 2 includes a metallized film 65a in which aluminum electrodes 67a and 67b are formed by vacuum deposition on a polyethylene terephthalate film having a thickness of 3 μm as a dielectric film. , 65b are overlapped and wound into a cylindrical shape, and then this cylindrical wound body is pressed from the side to form an elliptical cylindrical wound body 3 as shown in FIG. As shown in FIG. 2B, external electrodes 4 and 5 are formed by spraying a plurality of metal components including zinc, tin and copper on a pair of end faces of the elliptical cylindrical wound body 3.

  As shown in FIG. 2 (a), the metallized films 65a and 65b have aluminum electrodes 67a and 67b formed continuously in the longitudinal direction on the surface, but the metallized films in FIG. 2 (a). A margin 66a that is an unformed portion of the electrode 67a is formed on the upper side of the 65a, and a margin 66b that is an unformed portion of the electrode 67b is continuously formed in the longitudinal direction on the lower side of the metallized film 65b. is there.

  When two such metallized films 65a and 65b are wound in a stacked state, the two metallized films are slightly (in this embodiment 0) in the width direction (A direction in FIG. 2A). .3 to 0.8 mm).

  Further, as shown in FIG. 1, the lead terminals 6 and 7 connected to the external electrodes 4 and 5 of the element 2 are obtained by tin-plating a strip made of brass having a thickness of 0.75 mm and a width of 3 mm. It was.

  The storage portion 12 and the terminal plate 14 are made of polybutylene terephthalate resin, and the opening portion 13 is provided on the bottom surface of the storage portion 12. The terminal plate 14 has through holes 16 and 17, and the through-holes are formed on the bottom surface. A protrusion 15 is provided so as to surround the holes 16 and 17. The protrusion 15 has an outer peripheral dimension that is slightly smaller than an inner peripheral dimension of the opening 13 of the storage part 12, and fits into the opening 13 and protrudes outward from the bottom surface of the storage part 12.

  The resin 18 filled in the storage unit 12 is a thermosetting epoxy resin.

  Hereinafter, the assembly procedure of the film capacitor 1 will be described with reference to FIGS. 3 (a) to 3 (d).

  First, as shown in FIGS. 3 (a) and 3 (b), lead terminals 6 bent at substantially right angles at the bent portions 8 and 9, respectively, and lead terminals bent at substantially right angles at the bent portions 10 and 11, respectively. 7 from the side of the protrusion 15 provided on the lower surface of the terminal plate 14 in the through-holes 16 and 17 provided in the terminal plate 14, and the straight portion between the bent portion 8 and the bent portion 9 of the lead terminal 6. The lead portion 7 is inserted until the straight portion between the bent portion 10 and the bent portion 11 hits the lower surface of the terminal plate 14.

  Next, as shown in FIG. 3C, the element 2 on which the external electrodes 4 and 5 are formed is inserted between the lead terminal 6 protruding from the upper surface of the terminal plate 14 and the lead terminal 7. The lead terminals 6 and 7 and the external electrodes 4 and 5 are connected with solder in a state where a space is provided between the upper surface and the element 2.

  Next, as shown in FIGS. 3 (c) and 3 (d), the projection 15 fits the terminal plate 14 to which the element 2 is attached into the opening 13 of the storage portion 12, and the projection 15 of the terminal plate 14 Insert until the lower surface of the non-existing portion reaches the inner bottom surface of the storage portion 12 and fill with the epoxy resin 18 until the element 2 in the storage portion 12 is filled. The film capacitor 1 is cured.

  In the film capacitor 1 of the present embodiment described above, since the bent portions 8, 9, 10, 11 of the lead terminals 6, 7 are not in the resin 18 enclosing the element 2, the resin 18 around the lead terminals 6, 7 The stress concentration portion is eliminated and cracks are hardly generated in the resin 18. As a result, the deterioration of the performance of the film capacitor 1 due to the infiltration of moisture or corrosive gas into the element 2 can be suppressed.

(Embodiment 2)
FIG. 4 is a view showing a cross section of a film capacitor 21 which is an electronic component of the present invention.

  In FIG. 4, the capacitor element 22 is stored in a resin storage portion 32, and a resin 38 is filled so as to fill the element 22. Here, a terminal plate 34 is provided at the bottom of the storage portion 32 so as to block the opening 33 provided at the bottom of the storage portion 32, and the protrusion 35 protrudes to the outside of the storage portion 32.

  Lead terminals 26 and 27 are connected to the external electrodes 24 and 25 at both ends of the element 22, and the lead terminals 26 and 27 pass through the terminal plate 34 through the through portions 36 and 37. The bent portions 28 and 30 are bent inward along the lower surface of the terminal plate 34, and the protruding portion 35 provided on the terminal plate 34 is penetrated by the through portions 39 and 40 substantially perpendicularly to the wall surface of the protruding portion 35. In addition, the bent portions 29 and 31 are bent downward. A portion of the lead terminals 26 and 27 that protrudes to the outside of the lower surface of the terminal plate 34 and the projection 35 constitute a connector and is connected to a wire harness or the like.

  Hereinafter, the assembly procedure of the film capacitor 21 will be described with reference to FIGS. 5 (a) to 5 (c).

  First, as shown in FIG. 5A, the terminal plate 34 and the lead terminals 26 and 27 are substantially perpendicular to the lead terminal 26 and the bent portions 30 and 31, respectively. A portion of the lead terminal 27 bent in the direction above the bent portions 28 and 30 passes through the terminal plate 34, a portion between the bent portion 28 and the bent portion 29, a bent portion 30 and a bent portion 31, The part between the two is integrally molded so as to penetrate the protrusion 35 provided on the terminal plate 34 substantially vertically, and the external electrodes 24 and 25 are formed as shown in FIG. 5B. The element 22 is inserted between the lead terminal 26 protruding from the upper surface of the terminal plate 34 and the lead terminal 27, and a space is provided between the upper surface of the terminal plate 34 and the element 22, and the lead terminals 26 and 27 and the external electrode. 24 and 25 are connected with solder.

  Next, as shown in FIGS. 5 (b) and 5 (c), the projecting portion 35 fits the terminal plate 34 to which the element 22 is attached into the opening 33 of the housing portion 32, and the projecting portion 35 of the terminal plate 34 is The straight portion between the bent portion 28 and the bent portion 29 of the lead terminal 26 and the straight portion between the bent portion 30 and the bent portion 31 of the lead terminal 27 are inside the storage portion 32. The resin is inserted until reaching the bottom surface, filled with an epoxy resin 38 until the element 22 in the storage portion 32 is filled, and the resin 38 is cured at a high temperature of about 120 ° C. to 130 ° C. to form the film capacitor 21.

  The details of the element 22, the details of the storage portion 32, the lead terminals 26 and 27, and the resin 38 are the same as those in the first embodiment, and thus description thereof is omitted.

  In the film capacitor 21 of the present embodiment described above, since the bent portions of the lead terminals 26 and 27 are not in the resin 38 wrapping the element 22, there is no stress concentrated portion on the resin 38 around the lead terminals 26 and 27. It is difficult for cracks to occur in the resin 38, and as a result, deterioration of the performance of the film capacitor 21 due to infiltration of moisture, corrosive gas, etc. into the element 22 can be suppressed.

  In addition, since the lead terminals 26 and 27 penetrate the protrusions 35 of the terminal plate 34, it is possible to prevent the vertical and horizontal deviation between the lead terminals 26 and 27 and the terminal plate 34 during the manufacturing process. The accuracy of the position of the lead terminals 26 and 27 can be improved.

(Embodiment 3)
FIG. 6 is a view showing a cross section of a film capacitor 41 which is an electronic component of the present invention.

  In FIG. 6, the capacitor element 42 is housed in a resin housing 52, and a resin 58 is filled so as to fill the element 42. Here, an opening 53 is provided on the bottom surface of the storage portion 52, and a rectangular cylindrical protrusion 61 is provided so as to surround the opening 53. The terminal plate 54 closes the opening 53 provided at the bottom of the storage portion 52 at the bottom of the storage portion 52, and the protrusion 55 fits into the cylindrical protrusion 61 from the opening 53 of the storage portion 52. Has been placed.

  Lead terminals 46 and 47 are connected to the external electrodes 44 and 45 at both ends of the element 42, and the lead terminals 46 and 47 penetrate the terminal plate 54 through the through portions 56 and 57. The bent portions 48 and 50 are bent inward along the lower surface of the terminal plate 54, and the protruding portions 55 of the terminal plate 54 are penetrated by the through portions 59 and 60 substantially perpendicularly to the wall surface of the protruding portion 55. Further, the bent portions 49 and 51 are bent downward to penetrate through holes 63 and 64 provided in the shelf portion 62. And the part which protruded outside from the shelf 62 lower surface of the lead terminals 46 and 47 and the cylindrical projection part 61 comprise a connector, and it has a structure connected with a wire harness etc.

  The details of the element 42, the details of the storage portion 52, the lead terminals 46 and 47, and the resin 58 are the same as those in the first embodiment, and thus description thereof is omitted.

  In the film capacitor 41 of the present embodiment described above, since the bent portions of the lead terminals 46 and 47 are not in the resin 58 that encloses the element 42, there is no portion where stress concentrates on the resin 58 around the lead terminals 46 and 47. It is difficult for cracks to occur in the resin 58, and as a result, deterioration of the performance of the film capacitor 41 due to infiltration of moisture, corrosive gas or the like into the element 42 can be suppressed.

  In addition, since the lead terminals 46 and 47 pass through the through holes 63 and 64 provided in the shelf portion 62, the dimensional accuracy of the positions of the lead terminals 46 and 47 with respect to the cylindrical projection 61 serving as a connector, and the lead terminal 46 and The dimensional accuracy with respect to the lead terminal 47 is improved, and the reliability of connection with external wiring and the like is improved.

  The materials, dimensions, and the like described in the first to third embodiments are examples for explaining the present invention and are not limited to these.

  Moreover, although the example of the film capacitor was demonstrated as an electronic component, it is not restricted to this, This invention is applicable also to an electronic component provided with the element which has functions other than a capacitor | condenser.

  As described above, since the present invention can improve the reliability of electronic components, it can be used for automobile applications and the like that require high reliability under severe use conditions of high temperature and high humidity.

Sectional drawing which shows the structure of the film capacitor by one embodiment of this invention (a), (b) The perspective view which shows the manufacturing method of the film capacitor by one embodiment of this invention (a)-(d) The perspective view which shows the manufacturing method of the film capacitor by one embodiment of this invention Sectional drawing which shows the structure of the film capacitor by one embodiment of this invention (a)-(c) The perspective view which shows the manufacturing method of the film capacitor by one embodiment of this invention Sectional drawing which shows the structure of the film capacitor by one embodiment of this invention Sectional drawing which shows the structure of a film capacitor as an example of the conventional electronic component Sectional drawing which shows the structure of a film capacitor as an example of the conventional electronic component Perspective perspective view showing the configuration of a film capacitor as an example of a conventional electronic component

Explanation of symbols

1, 21, 41 Film capacitor 2, 22, 42 Element 3 Winding body 4, 5, 24, 25, 44, 45 External electrode 6, 7, 26, 27, 46, 47 Lead terminal 8, 9, 10, 11 28, 29, 30, 31, 48, 49, 50, 51 Bent part 12, 32, 52 Storage part 13, 33, 53 Opening part 14, 34, 54 Terminal board 15, 35, 55 Protrusion part 16, 17, 63, 64 Through hole 18, 38, 58 Resin 36, 37, 39, 40, 56, 57, 59, 60 Through part 61 Cylindrical protrusion 62 Shelf

Claims (3)

An electronic component element is accommodated and a storage portion filled with a resin, one or more lead terminals connected to the element, and a terminal plate to which the lead terminal is fixed, the terminal plate being the accommodation The element and the resin are arranged on the upper side of the terminal plate, the lead terminal penetrates from the upper surface side to the lower surface side of the terminal plate, An electronic component that is bent below the terminal board. The electronic component according to claim 1, wherein a protrusion is provided on a lower surface of the terminal plate, and the lead terminal passes through the protrusion provided on a lower surface of the terminal plate. A cylindrical protrusion is provided on the lower surface of the storage portion so as to surround the opening, a shelf having a through hole is provided inside the cylindrical protrusion, and the lead terminal has the through hole. The electronic component according to claim 1, wherein the electronic component penetrates.

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