JP2009175638A - Optical communication module and optical communication device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical communication module that can be made more compact than a conventional optical communication module and can reduce radiation of an electromagnetic noise from a flexible portion when the flexible portion is provided. <P>SOLUTION: The optical communication module comprises a light-emitting element 11 or light-receiving element 12, an optical transmission member 13, a driving circuit 14 or an amplifying circuit 15, a first connection unit 16 connecting the driving circuit 14 and amplifying circuit 15 to a logic processing element 1 and a peripheral component 2, a second connection unit 17 connecting the driving circuit 14 and amplifying circuit 15 to the logic processing element 1, first wiring 21 electrically connecting the driving circuit 14 and amplifying circuit 15 to the first connection unit 16, second wiring 22 electrically connecting the driving circuit 14 and amplifying circuit 15 to the second connection unit 17, and a substrate 18 on which they are mounted. The second wiring 22 and second connection unit 17 transmit a second signal having a maximum frequency f2 higher than a maximum frequency f1 of a first signal transmitted and received by the first wiring 21 and the first connection unit 16. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical communication module and an optical communication device.

  In recent years, with rapid progress of digital information processing technology, higher speed and large capacity digital communication technology is required.

  However, in the case of electrically transmitting a signal, there is a limit to the data transmission speed and the transmission distance because the signal quality deteriorates due to the signal transmission distance becoming longer and the influence of electromagnetic noise is large.

  Therefore, an electrical signal is converted into an optical signal and transmitted. As a result, the data transmission speed and transmission distance are greatly improved.

  In an optical communication device that converts an electrical signal into an optical signal and transmits / receives the same, a logic processing element that transmits / receives a high-speed signal, which is a high-frequency electrical signal, is supplied on the main board, and current is supplied to the logic processing element. Peripheral parts constituting a power circuit, a ground circuit for grounding the logic processing element, and the like are mounted on the main board.

  The optical communication device includes a logic processing element and peripheral components, a light emitting element that converts a high-speed signal output from the logic processing element into an optical signal, and a light receiving element that converts an optical signal input from the outside into a high-speed signal. A driving circuit for driving the light emitting element, an amplifying circuit for amplifying an electric signal converted from an optical signal by the light receiving element, and light for optically connecting the light emitting element and the light receiving element to an external optical waveguide A transmission member is provided.

  However, when mounting the light emitting element, the light receiving element, the drive circuit, the amplifier circuit, and the optical transmission member on the main board, there are problems such as workability when assembling the main board, and later maintenance. In general, these elements, circuits, and the like are separately mounted on a small board to form an optical communication module, and this optical communication module is generally electrically connected to a main board with a connector.

  Such an optical communication module includes an optical assembly including an optical semiconductor element and an engineering member that are independent for each channel, an optical fiber that inputs and outputs light to each channel of the optical assembly, and the optical assembly. A multi-channel optical communication module having a sealing member for sealing the optical fiber holding member having a through-hole through which the optical fiber passes is provided as a sealing member independently of other paper passing members (Patent Document 1).

  In the main board, the electrical wiring distance on the main board is shortened by arranging the connector for connecting the optical communication module in the immediate vicinity of the logic processing element and downsizing the optical communication module. Is preferred.

As an optoelectric wiring board used in the optical communication module, a board having a rigid part in which a conductor layer and an insulating layer are laminated, an optical element is mounted, and a flex part in which an optical transmission line is formed is proposed. (Patent Document 2).
JP 2004-101997 A JP 2006-140233 A

  However, in the conventional optical communication module, high-speed signals are exchanged between the logic processing element and the drive circuit or the amplifier circuit, and the low-speed is lower than the high-speed signal between the peripheral components and the drive circuit or the amplifier circuit. Since a configuration in which signal exchange and power supply from a power supply circuit to a drive circuit and an amplifier circuit are all performed through a single connector, a connector for connecting an optical communication module and a main board is large. Therefore, there is a problem that the optical communication module is also enlarged.

  An object of the present invention is to provide an optical communication module with fewer restrictions on arrangement when mounted on a main substrate than a conventional optical communication module.

  The invention according to claim 1 is an optical communication module connected to a main board on which an electrical component including a logic processing element for processing a transmission signal is mounted, and a light emitting element and an optical device for converting an electrical signal into an optical signal An optical element selected from a light receiving element that converts a signal into an electric signal, an optical connector having an optical connector at one end, optically connected to the optical element at the other end, and transmitting the optical signal A member, a drive circuit that drives a light emitting element of the optical element, and an amplifier circuit that amplifies an electric signal from the light receiving element of the optical element, and is electrically connected to the optical element An electrical circuit; a first connection for connecting the electrical circuit to an electrical component on the main board; and a second connection for connecting the electrical circuit to a logic processing element on the main board; , A first wiring that electrically connects the electrical circuit and the first connection portion; a second wiring that electrically connects the electrical circuit and the second connection portion; the optical element; the electrical circuit; The first connection portion, the second connection portion, and the optical transmission member, the first wiring, and a substrate on which the second wiring is provided, and in the second wiring and the second connection portion, The second signal having the highest frequency f2 higher than the highest frequency f1 of the first signal exchanged in the first wiring and the first connection portion is transmitted.

  According to a second aspect of the present invention, in the optical communication module according to the first aspect, the substrate includes a first substrate provided with the first connection portion, the optical element, the electric circuit, and the optical transmission member. And the second substrate provided with the second connection portion, the first substrate and the second substrate are connected by a flexible substrate, and the first wiring is connected to the electric circuit. The circuit and the first connection portion are formed to be connected via the flexible substrate, and the second wiring is formed to connect the electric circuit and the second connection portion without the flexible substrate. It is characterized by being.

  According to a third aspect of the present invention, in the optical communication module according to the second aspect, the optical transmission member is mounted on the second substrate so as to extend toward the flexible substrate.

  According to a fourth aspect of the present invention, in the optical communication module according to any one of the first to third aspects, the optical transmission member is a bendable member.

  According to a fifth aspect of the present invention, in the optical communication module according to any one of the first to fourth aspects, a plurality of the optical elements are provided.

  According to a sixth aspect of the present invention, in the optical communication module according to any one of the first to fifth aspects, the optical transmission member includes an optical branch path that branches an optical signal.

  A seventh aspect of the present invention relates to the optical communication module according to any one of the first to sixth aspects, wherein the optical element transmits and receives an optical signal by a wavelength division multiplexing method.

  According to an eighth aspect of the present invention, in the optical communication module according to the second to seventh aspects, at least a part of the optical element, the electric circuit, the optical transmission member, the flexible substrate, the first substrate, and the second substrate is covered. In addition, a covering case that can be bent according to the bending of the flexible substrate is provided.

  The invention according to claim 9 is an optical communication module according to claims 1 to 8 connected to an external optical waveguide via an optical connector provided at one end of the optical transmission member, and logic for processing a transmission signal. An electrical component including a processing element; a first connector electrically connected to the electrical component; and a first connector engaging with a first connection portion of the optical communication module; and an electrical connection to the logic processing element And a second connector that engages with a first connection portion of the optical communication module, and the main component on which the electrical component, the first connector, and the second connector are mounted. By engaging with the first connection portion of the optical communication module, the electrical circuit of the optical communication module is electrically connected to the electrical component via the first wiring, and the first signal is transmitted. 2 connectors Is engaged with the second connection portion of the optical communication module, so that the electric circuit of the optical communication module is electrically connected to the logic processing element via the second wiring, and is more than the first signal. The present invention relates to an optical communication device characterized in that a second signal having a high frequency is transmitted.

  According to the first aspect of the present invention, compared to an optical communication module in which a high-speed signal and a low-speed signal are transmitted and received by a single connector, there are fewer restrictions on the arrangement when mounted on the main board, and the high-speed signal An optical communication module is provided in which a connection section for transmitting and receiving is easily arranged in the vicinity of a logic processing element.

  According to the second aspect of the present invention, there is provided an optical communication module that emits less electromagnetic noise from the flexible substrate during operation as compared to an optical communication module configured to transmit high-speed signals in wiring on the flexible substrate.

  According to the third aspect of the present invention, a more compact optical communication module is provided as compared with the optical communication module in which the optical transmission member is mounted so as to extend in a direction away from the flexible substrate. .

  According to the fourth aspect of the present invention, there is provided an optical communication module in which the flexibility of the flexible substrate is less impaired than an optical communication module having a rigid optical transmission member.

  According to the invention of claim 5, in the case of configuring an optical communication device having a plurality of optical circuits, unlike the case of using an optical communication module having one light emitting element and one light receiving element, Since a plurality of optical circuits can be grouped together, the configuration of the optical communication apparatus can be simplified.

  According to the sixth aspect of the invention, unlike the optical communication module in which the optical transmission member is not provided with the optical branching path, an optical communication module having a function of combining or dispersing optical signals is provided.

  According to the seventh aspect of the invention, an optical communication module capable of multiplex communication can be obtained unlike an optical communication module that does not use a wavelength division multiplexing system for transmitting and receiving optical signals.

  According to the eighth aspect, unlike the optical communication module having no covering case, the optical element, the electric circuit, the optical transmission member, the flexible substrate, the first substrate, and the second substrate are protected from the impact from the outside. A communication module is provided.

  According to the ninth aspect of the present invention, compared to an optical communication device using an optical communication module that transmits and receives a high-speed signal, a low-speed signal, and a DC signal through the same connector, a connector that transmits and receives a high-speed signal is located in the vicinity of the logic circuit. An optical communication device that can be disposed in a space is provided.

1. Embodiment 1
Hereinafter, an optical communication device and an optical communication module according to the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the optical communication device 10 according to the first embodiment includes a logic processing element 1 that processes a high-speed signal (second signal) and a low-speed signal (first signal) having a frequency lower than that. Peripheral component 2 for supplying or controlling power to logic processing element 1, optical communication module 100 for connecting logic processing element 1 to external optical fiber 3, logic processing element 1 and peripheral component 2 A first connector 4 that electrically connects the optical communication module 100 to transfer a low-speed signal between the logic processing element 1 and the peripheral component 2 and the optical communication module 100 and to supply power to the optical communication module 100; A second connector 5 for electrically connecting the logic processing element 1 and the optical communication module 100 to transfer high-speed signals between the logic circuit element 1 and the optical communication module 100; Goods 2, and a main substrate 6 first connector 4 and the second connector 5 is mounted.

  The logic processing element 1 includes elements such as FPGA and SERDES, and signals processed by the logic processing element 1 include CML (Current Mode Logic), LVDS (LOW Voltage Differential Signal), and TMDS (Transition Minimized Differential Signal). And high-speed signals such as CMOS, TTL, I2C, SPI, and RS-232C, which are lower frequency signals than the high-speed signals.

  Further, as the peripheral component 2, the power supply IC that supplies current to the logic processing element 1, the regulator IC that controls the logic processing element 1, and the output voltage of the power supply IC are stabilized, or the output voltage is increased to a predetermined voltage. There are DC / DC converters for example.

  The first connector 4 is connected to a terminal for low-speed signal input in the logic processing element 1, and the second connector 5 is connected to a terminal for high-speed signal input in the logic processing element 1.

  As the first connector 4, a normal pin type connector is used, and as the second connector 5, a slot type connector in which a slot 5A into which one end of the optical communication module is inserted is formed is used.

  1 to 3, the optical communication module 100 includes a light emitting element 11 that converts an electrical signal into an optical signal, a light receiving element 12 that converts an optical signal into an electrical signal, the light emitting element 11, and the light receiving element 12. A transparent sheet-like light transmission member 13 connected to the light source, a drive circuit 14 for driving the light emitting element 11 under a predetermined drive condition, an amplifier circuit 15 for amplifying an electric signal from the light receiving element, and a main board 6 By connecting to the first connector 4, the first connection portion 16 that electrically connects the drive circuit 14 and the amplifier circuit 15 to the logic processing element 1 and the peripheral component 2, and the second connector 5 on the main board 6 A second connection portion 17 that is inserted into the slot 5A and electrically connects the drive circuit 14 and the amplifier circuit 15 to the logic processing element 1; , And a substrate 18 where the first connecting portion 16, second connecting portion 17 and the optical transmission member 13, is mounted.

  The first connection portion 16 is provided at the end of the substrate 18 on the side where the optical transmission member 13 extends, and the second connection portion 17 is the opposite side of the substrate 18 from the side where the first connection portion 16 is provided. It is formed in the edge part. The first connection portion 16 is a pin-type connector that engages with the first connector 4 of the optical communication device 10, and the second connection portion 17 is connected to a contact disposed inside the slot 5 </ b> A in the second connector 5. It has a metal piece to be used.

  The drive circuit 14 and the amplifier circuit 15 are connected to the first connection unit 16 by a first wiring 21 for transmitting a low-speed signal and a direct-current signal, and to the second connection unit 17 for a second signal for transmitting a high-speed signal. They are connected by wiring 22. Both the first wiring 21 and the second wiring 22 are formed on the surface or inside of the substrate 18.

  The optical transmission member 13 transmits and receives optical signals to and from the light emitting element 11 and the light receiving element 12 at one end, and an optical connector 19 for optically connecting the optical fiber 3 is provided at the other end. At one end of the optical transmission member 13, the optical signal transmitted from the light emitting element 11 is led out toward the optical fiber 3, and the optical signal introduced from the optical fiber 3 is reflected toward the light receiving element 12. A surface 13A is formed.

  The operation of the optical communication device 10 will be described below.

  In the optical communication device 10, as described above, the first connection portion 16 of the optical communication module 100 is connected to the first connector 4, and the second connection portion 17 is inserted into the slot 5 </ b> A of the second connector 5. As a result, the logic processing element 1 includes the first connector 4, the first connection portion 16, and the first electrical path formed by the first wiring 21, the second connector 5, the second connection portion 17, and the first The drive circuit 14 and the amplifier circuit 15 are electrically connected by a second electrical path formed by the two wirings 22. The peripheral component 2 is also electrically connected to the drive circuit 14 and the amplifier circuit 15 through the first electrical path.

  The high-speed signal output from the high-speed signal terminal of the logic processing element 1 is input to the drive circuit 14 through the second electrical path, and the light-emitting element 11 is output by the drive circuit 14 based on the input high-speed signal. Is converted into an optical signal. The high-speed signal converted into the optical signal is transmitted through the optical transmission member 13 and led out toward the optical fiber 3. On the other hand, the low-speed signal output from the low-speed signal terminal of the logic processing element 1 and the peripheral component 2 is input to the drive circuit 14 through the first electrical path, and among the low-speed signals, the AC signal is As in the case of the high-speed signal, it is converted into an optical signal, transmitted through the optical transmission member 13, and guided toward the optical fiber 3.

  On the other hand, the optical signal introduced from the optical fiber 3 is transmitted through the optical transmission member 13 and introduced into the light receiving element 12. The introduced optical signal is converted into an electrical signal in the light receiving element 12, and the low-speed signal among the electrical signals passes through the first electrical path to the low-speed signal terminal of the logic processing element 1. Is introduced into the high-speed signal terminal of the logic processing element 1 through the second electrical path.

  In addition, power is supplied to the drive circuit 14 and the amplifier circuit 15 from the power supply IC of the peripheral components 2 via the first electrical path.

In the optical communication apparatus 10 according to the first embodiment, since the connectors are divided into the first connector for low speed signals and the second connector for high speed signals, the first connector and the second connector can be reduced in size. It is. Therefore, even when the logic processing element 1 having a large outer diameter such as having a heat radiating fin is used, the first is compared with the optical communication apparatus in which the high-speed signal, the low-speed signal, and the power supply are performed through one connector. There are few restrictions on the position of the connector and the second connector. Also, the optical communication module 100 can be formed more compactly than the optical communication module in the optical communication apparatus of the above-described form.
2. Embodiment 2
Another example of the optical communication module used in the optical communication apparatus 10 according to the first embodiment will be described below. 4 and the following drawings, the same reference numerals as those in FIGS. 1 to 3 indicate the same components as those shown in the drawings unless otherwise specified.

  As shown in FIGS. 4 and 5, the optical communication module 102 according to the second embodiment includes a flexible substrate in which the substrate 18 connects the first substrate 18A, the second substrate 18B, and the first substrate 18A and the second substrate 18B. It is divided into 18C.

  The first connecting portion 16 is provided on the first substrate 18A, and the light emitting element 11, the light receiving element 12, the driving circuit 14, the amplifier circuit 15, and the second connecting portion 17 are provided on the second substrate 18B. The flexible substrate 18C is provided with a first wiring 21 through which a low-speed signal and direct current are transmitted.

  Further, the optical transmission member 13 has flexibility, and when the flexible substrate 18C is bent as shown in FIG. 5, the optical transmission member 13 is also bent.

  The optical communication module 102 has the same configuration as the optical communication module according to the first embodiment except for the above points.

  In the optical communication module 102, unlike the optical communication module in which the substrate 18 is rigid, even if the first connector 4 and the second connector 5 mounted on the main substrate 6 are mounted in a state shifted from their normal positions. When the flexible board 18C is deformed, the fitting positions of the first connector 4 and the first connection part 16 and the second connector 5 and the second connection part 17 are adjusted.

  Also, as a process for fabricating an optical communication module by mounting various electronic elements or optical elements on an optoelectric wiring board, solder reflow is common. Therefore, in the optical communication module 102 according to the second embodiment, the first All of the substrate 18A, the second substrate 18B, and the flexible substrate 18C are required to have heat resistance enough to withstand solder reflow.

  Here, although the light-transmitting material having heat resistance generally has a large light transmission loss, no light transmission path is provided on any of the first substrate 18A, the second substrate 18B, and the flexible substrate 18C. Moreover, the optical transmission member 13 can be retrofitted after mounting various electronic elements. Accordingly, since the optical transmission member 13 is not limited in heat resistance due to solder reflow, it is possible to eliminate the need to dare to use a heat-resistant translucent material having a large light transmission loss as the material of the optical transmission member 13. A translucent material with low transmission loss can be used.

Furthermore, when a high-frequency signal having a high frequency is passed through the electrical wiring provided on the flexible substrate 18C, compared with a case where a high-speed signal having a high frequency is passed through the electrical wiring provided on the first substrate 18A and the second substrate 18B. It tends to radiate electromagnetic noise around. However, since only a low-speed signal and direct current are transmitted to the electrical wiring provided on the flexible substrate 18C, the emission of electromagnetic noise does not become a problem.
3. Embodiment 3
Still another example of the optical communication module used in the optical communication apparatus 10 according to the first embodiment will be described below.

  In the optical communication module 104 according to the third embodiment, as shown in FIG. 6, one of the light emitting element 11 and the light receiving element 12 is disposed on the second substrate 18B. When the light emitting element 11 is provided, the drive circuit 14 is provided. When the light receiving element 12 is provided, the amplifier circuit 15 is provided.

The optical communication module 104 of the third embodiment has the same configuration as the optical communication module according to the second embodiment except for the above points.
4). Embodiment 4
Still another example of the optical communication module used in the optical communication apparatus 10 according to the first embodiment will be described with reference to FIG.

  In the optical communication module 106 according to the fourth embodiment, as shown in FIG. 7, four light emitting elements 11 and four light receiving elements 12 are provided, but the number of light emitting elements 11 and light receiving elements 12 is four. It is not limited to. The drive circuit 14 drives the four light emitting elements 11, and the amplifier circuit 15 amplifies the electric signals from the four light receiving elements 12. A drive circuit 14 and an amplifier circuit 15 may be provided for each light emitting element 11 and light receiving element 12.

The optical communication module 106 according to the fourth embodiment has the same configuration as that of the optical communication module according to the second embodiment except for the above points.
5. Embodiment 5
Still another example of the optical communication module used in the optical communication apparatus 10 according to the first embodiment will be described below.

  As shown in FIG. 8, the optical communication module 108 according to the fifth embodiment has a core-cladding structure in which the optical transmission member 13 includes a core that forms optical paths 23 and 24 and a cladding that surrounds the core. Yes. The optical path 23 is optically connected to the light emitting element 11, and the optical path 24 is connected to the light receiving element 12. Branch portions 23A and 24A are formed in the vicinity of the optical connector 19 in the optical paths 23 and 24, and the optical paths 23 and 24 are branched into two and connected to the optical fiber 3, respectively.

  The optical communication module 108 of the fifth embodiment has the same configuration as that of the optical communication module of the second embodiment except for the above points.

FIG. 1 is a perspective view illustrating the configuration of the optical communication apparatus according to the first embodiment. FIG. 2 is a plan view illustrating a configuration of an optical communication unit used in the optical communication apparatus according to the first embodiment. FIG. 3 is a side view illustrating the configuration of the optical communication unit used in the optical communication apparatus according to the first embodiment. FIG. 4 is a plan view illustrating a configuration of an optical communication unit used in the optical communication apparatus according to the second embodiment. FIG. 5 is a side view illustrating a configuration of an optical communication unit used in the optical communication apparatus according to the second embodiment. FIG. 6 is a plan view illustrating a configuration of an optical communication unit used in the optical communication apparatus according to the third embodiment. FIG. 7 is a plan view illustrating a configuration of an optical communication unit used in the optical communication apparatus according to the fourth embodiment. FIG. 8 is a plan view illustrating a configuration of an optical communication unit used in the optical communication apparatus according to the fifth embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Logic processing element 2 Peripheral part 3 Optical fiber 4 1st connector
DESCRIPTION OF SYMBOLS 5 2nd connector 5A Slot 6 Main board 10 Optical communication apparatus 11 Light emitting element 12 Light receiving element 13 Optical transmission member 14 Drive circuit 15 Amplifier circuit 16 1st connection part 17 2nd connection part 18C Flexible board 18 Board | substrate 18A 1st board | substrate 18B 1st 2 substrates 19 optical connector 21 first wiring 22 second wiring 23 optical path 23A branching section 24 optical path 24A branching section 100 optical communication module 102 optical communication module 104 optical communication module 106 optical communication module 108 optical communication module

Claims (9)

An optical communication module connected to a main board on which electrical components including logic processing elements for processing transmission signals are mounted,
An optical element selected from a light emitting element that converts an electrical signal into an optical signal and a light receiving element that converts an optical signal into an electrical signal;
An optical transmission member that has an optical connector at one end, is optically connected to the optical element at the other end, and transmits the optical signal;
An electric circuit that is selected from a drive circuit that drives a light emitting element of the optical elements and an amplifier circuit that amplifies an electric signal from a light receiving element of the optical elements, and is electrically connected to the optical element Circuit,
A first connection for connecting the electrical circuit to electrical components on the main board;
A second connection for connecting the electrical circuit to a logic processing element on the main board;
A first wiring that electrically connects the electrical circuit and the first connection portion;
A second wiring for electrically connecting the electric circuit and the second connection portion;
A substrate provided with the optical element, the electrical circuit, the first connection portion, the second connection portion, and the optical transmission member, the first wiring, and the second wiring;
With
In the second wiring and the second connection portion, a second signal having a highest frequency f2 higher than the highest frequency f1 of the first signal exchanged in the first wiring and the first connection portion is transmitted. An optical communication module. The substrate is divided into a first substrate provided with the first connection portion, and a second substrate provided with the optical element, the electric circuit, the optical transmission member, and the second connection portion. And the first substrate and the second substrate are connected by a flexible substrate having flexibility,
The first wiring is formed so as to connect the electric circuit and the first connection portion via the flexible substrate,
2. The optical communication module according to claim 1, wherein the second wiring is formed so as to connect the electric circuit and the second connection portion without passing through the flexible substrate.   The optical communication module according to claim 2, wherein the optical transmission member is mounted on the second substrate so as to extend toward the flexible substrate.   The optical communication module according to claim 1, wherein the optical transmission member is a bendable member.   The optical communication module according to claim 1, comprising a plurality of the optical elements.   The optical communication module according to claim 1, wherein the optical transmission member includes an optical branch path that branches an optical signal.   The optical communication module according to claim 1, wherein the optical element transmits and receives an optical signal by a wavelength division multiplexing method.   8. A cover case that covers at least a part of the optical element, the electric circuit, the optical transmission member, the flexible substrate, the first substrate, and the second substrate and that can be bent according to the bending of the flexible substrate. An optical communication module according to 1. The optical communication module according to claim 1, which is connected to an external optical waveguide via an optical connector provided at one end of the optical transmission member,
Electrical components including logic processing elements for processing transmission signals;
A first connector electrically connected to the electrical component and engaged with a first connection portion of the optical communication module;
A second connector electrically connected to the logic processing element and engaged with a first connection portion of the optical communication module;
A main board on which the electrical component, the first connector, and the second connector are mounted;
With
When the first connector engages with the first connection portion of the optical communication module, the electrical circuit of the optical communication module is electrically connected to the electrical component via the first wiring, and the first signal is transmitted. When the second connector is engaged with the second connection portion of the optical communication module, the electrical circuit of the optical communication module is electrically connected to the logic processing element via the second wiring. An optical communication apparatus, wherein a second signal having a frequency higher than that of the first signal is transmitted.

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