JP2009175003A - Contact probe for high frequency - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make constitution simple and operation easy and handling, and attain measurements of high quality. <P>SOLUTION: A center conductor pin 15 is disposed, protruding from a probe body 10 and twelve ground pins 17 are concentrically disposed, to surround the center conductor pin 15, in which the twelve ground pins 17 are provided at an outer conductor 12 via spring members 18, independently and freely movably in the axial direction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a high-frequency contact probe used for directly measuring a signal of a high-frequency circuit used in a high frequency band such as a microwave band communication device and a millimeter wave band communication device.

  In general, in a high-frequency circuit board, it is considered important in terms of circuit configuration whether circuit characteristics such as impedance matching at an interface between high-frequency circuits are sufficiently taken.

  Thus, in such a high-frequency circuit board, a measurement test is performed such that a desired circuit characteristic is ensured by measuring a signal of the high-frequency circuit. In this case, as a method of measuring the characteristics of a high-frequency circuit that does not have an interface such as a connector, a method of measuring a coaxial high-frequency contact probe in direct contact with the circuit is employed.

As this high frequency contact probe configuration, both the first contact pin connected to the center conductor and the second contact pin connected to the outer conductor are provided so as to be movable in the axial direction via springs. Has been proposed (see, for example, Patent Document 1). The configuration of the high-frequency contact probe disclosed in Patent Document 1 is such that both the first and second contact pins are inspected by contacting the high-frequency circuit against the spring force of the spring. It is configured so as to ensure contact by utilizing.
JP-A-6-3371

  However, in the above-described high-frequency contact probe configuration, both the first and second contact pins are provided so as to be movable in the axial direction (longitudinal direction). It is possible to ensure the contact when the contact is made, but if the contact is made to be inclined, a part of the first contact pin or the second contact pin may contact a desired part. There is a risk that it may not be possible or may cause impedance mismatch, and the handling operation is troublesome.

  The present invention has been made in view of the above circumstances, and provides a high-frequency contact probe that is simple in configuration, can realize an easy handling operation, and can realize a high-quality measurement. With the goal.

  The present invention includes a central conductor pin that is in contact with the high-frequency circuit, and a plurality of ground pins that are arranged via an insulator around the central conductor pin and are in contact with a ground that is movably provided in the axial direction. The high-frequency contact probe is configured to include a biasing means that biases the plurality of ground pins independently in the extending direction.

  According to the above configuration, when the center conductor pin thus positioned is brought into contact with the measurement site of the high-frequency circuit, the plurality of ground pins around the center pin are each provided with a biasing means around the measurement site. It abuts against the force and is pressed. At this time, the plurality of ground pins are in contact with each other vertically or inclined by the action of the center conductor pin and the biasing means, and the protrusion amount (retraction amount) is independent depending on the contact angle. All of them are uniformly contacted with the ground portion in the state of being varied.

  Thereby, high-quality impedance matching of the center conductor pin and the plurality of ground pins can be obtained, and it is possible to realize a stable and highly accurate measurement after realizing a simple and easy handling operation.

  As described above, according to the present invention, it is possible to provide a high-frequency contact probe that has a simple configuration, can realize an easy handling operation, and can realize a high-quality measurement.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows a high-frequency contact probe according to an embodiment of the present invention. A central conductor 11 is provided in a probe main body 10 in a ring-shaped outer conductor 12 via an insulator 13 such as a fluororesin. It is coaxially installed (see FIGS. 2 and 3). The probe main body 10 is provided with a connector interface 14 through which a high-frequency cable of a measuring instrument (not shown) is wired and connected.

  The center conductor 11 of the probe body 10 is provided with a center conductor pin 15 projecting by a dimension L on the tip side (see FIG. 2). The other outer conductor 12 is provided with a plurality of, for example, twelve concave pin housing portions 16 (see FIG. 4) on the tip side, with a predetermined spacing, for example, equally distributed in the circumferential direction.

  The number of the pin accommodating portions 16 is set so as to be sufficiently small (= λ / 4 or less) with respect to the wavelength (λ) of the measurement frequency, for example, and the ground pin 17 is provided with an urging means such as a compression spring. The spring members 18 are accommodated so as to be freely movable so as to expand and contract in the axial direction (in the directions of arrows A and B). Thus, the twelve ground pins 17 are each electrically connected to the outer conductor 12 in the pin accommodating portion 16 via the spring member 18.

  The twelve ground pins 17 are each dimension L1 in comparison with the central conductor pin 15 in the pin accommodating portion 16 of the outer conductor 12, for example, in the state of being extended most in the direction of arrow A via the spring member 18. The position of the central conductor pin 15 is drawn from the protruding position L in the state of being drawn in the direction of arrow B most against the spring force of the spring member 18 (see FIG. 2). Is set to In other words, the twelve ground pins 17 are provided so as to be independently movable in the directions of arrows A and B between the two positions.

  In the above configuration, the probe main body 10 is measured by bringing the center conductor pin 15 whose position is fixed into contact with the part to be measured of the high-frequency circuit 19 as shown in FIG. At the time of this measurement, when the central conductor pin 15 of the probe main body 10 is brought into perpendicular contact with the part to be measured of the high-frequency circuit board 19, the plurality of ground pins 17 are protruded by the spring force of each spring member 18 ( The amount of pull-in) is uniformly projected and kept in pressure contact with the ground portion. As a result, highly accurate impedance matching can be obtained, and a highly accurate high-frequency signal can be measured with minimal reflection loss and radiation loss.

  Further, when the center conductor pin 17 of the probe body 10 is tilted and brought into contact with the portion to be measured without being brought into contact with the measurement target at the time of the measurement, the surrounding ground is provided. The protrusion amount (retraction amount) of the pin 17 is variably adjusted in accordance with the inclination direction by the action of the center conductor pin 15 whose position is fixed and the spring force of each spring member 18. Here, the twelve ground pins 17 are maintained in a state of being pressed against the ground portion by the spring force of the spring member 18 at the protruding positions.

  As a result, when the measurement posture of the probe body 10 is not vertically contacted but is inclined and contacted, all of the center conductor pin 15 and the ground pin 17 are not affected by the measurement posture. High-precision impedance matching of the contact portion can be obtained, and high-precision high-frequency signals can be measured with minimal reflection loss and radiation loss. As a result, a stable and highly accurate measurement of a high-frequency signal is realized, and a simple and easy handling operation of the probe body 10 at the time of measurement is realized.

  As described above, the high-frequency contact probe has the central conductor pin 15 protruding from the probe body 10 and is arranged around the central conductor pin 15 with the 12 ground pins 17 coaxially arranged. The twelve ground pins 17 are provided on the outer conductor 12 via the spring member 18 so as to be independently movable in the axial direction.

  According to this, when the positioned center conductor pin 17 is brought into contact with the measurement site of the high-frequency circuit 19, the 12 ground pins 17 around the center conductor pin 17 are respectively connected to the ground site around the measurement site. Is brought into contact with and pressed against the urging force of the spring member 18. At this time, the twelve ground pins 17 have a contact state that is vertical or inclined by the action of the center conductor pin 15 and each spring member 18 that are positioned. In addition to each, the protrusion amount (retraction amount) is varied independently, and all are uniformly in contact with the ground portion.

  As a result, high-quality impedance matching between the center conductor pin 15 and the ground pin 17 can be obtained, and it is possible to realize a stable and highly accurate measurement after realizing a simple and easy handling operation at the time of measurement. Become.

  In the above embodiment, the case where twelve ground pins 17 are provided at equal intervals around the center conductor pin 15 has been described. However, the number of the ground pins 17 is not limited to this number, and can be configured. The ground pins 17 can be arranged without being evenly spaced around the center conductor pin 15, and the same effect can be expected in any configuration.

  Further, in the above-described embodiment, the case where the ground pin 17 is configured by arranging the spring member 18 as an urging means for independently expanding and contracting has been described. It is also possible to use a biasing means.

  Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention at the stage of implementation. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements.

  For example, even if some constituent requirements are deleted from all the constituent requirements shown in the embodiment, the problem described in the column of the problem to be solved by the invention can be solved, and the effect described in the effect of the invention can be obtained. In such a case, a configuration in which this configuration requirement is deleted can be extracted as an invention.

It is the perspective view which showed the external appearance structure of the high frequency contact probe which concerns on one embodiment of this invention. It is the top view which showed the state which looked at FIG. 1 from the side. It is the top view which showed the state which looked at FIG. 1 from the front end side. FIG. 4 is a partial cross-sectional view illustrating a part of XX in FIG. It is the top view shown in order to demonstrate the measurement operation | movement of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Probe main body, 11 ... Center conductor, 12 ... Outer conductor, 13 ... Insulator, 14 ... Connector interface, 15 ... Center conductor, 16 ... Pin accommodating part, 17 ... Ground pin, 18 ... Spring member, 19 ... High frequency circuit substrate.

Claims (5)

A central conductor pin in contact with the high frequency circuit;
A plurality of ground pins arranged around an insulator around the center conductor pin and in contact with a ground provided to be movable in the axial direction;
A biasing means for independently biasing the plurality of ground pins in the extending direction;
A high-frequency contact probe comprising:   The high-frequency contact probe according to claim 1, wherein the plurality of ground pins are set to λ / 4 or less of a use frequency.   3. The high-frequency contact probe according to claim 1, wherein the plurality of ground pins have axially extending positions protruding from the center conductor pin.   The high frequency contact probe according to claim 3, wherein the plurality of ground pins are drawn in the axial drawing position from the central conductor pin.   5. The high-frequency contact probe according to claim 1, wherein the plurality of ground pins are provided at equal intervals around the center conductor. 6.

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