JP2009170310A - Holding member, electronic component, and electronic device - Google Patents

Holding member, electronic component, and electronic device Download PDF

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JP2009170310A
JP2009170310A JP2008008360A JP2008008360A JP2009170310A JP 2009170310 A JP2009170310 A JP 2009170310A JP 2008008360 A JP2008008360 A JP 2008008360A JP 2008008360 A JP2008008360 A JP 2008008360A JP 2009170310 A JP2009170310 A JP 2009170310A
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hole
substrate
holding member
leg
portions
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JP4591514B2 (en
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Mitsuaki Kondo
充晃 近藤
Takayoshi Honda
隆芳 本多
Koji Onishi
光二 大西
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Denso Corp
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Denso Corp
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Priority to JP2008008360A priority Critical patent/JP4591514B2/en
Priority to EP09000164.5A priority patent/EP2091106B1/en
Priority to US12/320,062 priority patent/US7896693B2/en
Publication of JP2009170310A publication Critical patent/JP2009170310A/en
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Publication of JP4591514B2 publication Critical patent/JP4591514B2/en
Priority to US12/926,892 priority patent/US8105109B2/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a holding member for holding an electronic component on a substrate with higher strength while reducing damage to the wall face of a through-hole, and to provide the electronic component and an electronic device. <P>SOLUTION: The holding member has a leg part to be inserted into the through-hole of the substrate to hold the electronic component on the surface of the substrate. It comprises a base part to be fixed to the electronic component which is integrally formed with the same metal plate, and at least one leg part extending from the base part. The leg part consists of a locking portion provided at the front end thereof and having at least part located on the opening periphery of the through-hole in the reverse of the substrate in the fixing state of the electronic component, a connection portion having one end connected to the locking portion and part arranged in the through-hole in the fixing state, and a spring portion having one end connected to the end of the connection portion on the opposite side to the locking portion, and arranged on the surface of the substrate in the fixing state, the spring portion being displaced during inserting the locking portion and the connection portion into the through-hole so that the connection portion is inclined in the fixing state and the locking portion is inserted into the through-hole. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、コネクタなどの電子部品を基板上に保持する保持部材、該保持部材を備えた電子部品、及び基板と電子部品を備えた電子装置に関するものである。   The present invention relates to a holding member that holds an electronic component such as a connector on a substrate, an electronic component that includes the holding member, and an electronic device that includes the substrate and the electronic component.

従来、基板に形成された貫通孔に対して電子部品に設けた保持部材の一部を弾性変形させつつ挿入し、保持部材の変形による反力(復元力)によって基板上に電子部品を保持させる保持構造が知られている。例えば特許文献1では、金属板を打ち抜き、印圧及び曲げ加工することで保持部材が形成されており、板状の基部から同方向に延びて互いに対向する一対の第1脚部のうち、嵌入部が、過渡部における平行部との連結端を支点として板厚方向(基板の厚さ方向に略垂直な方向であって貫通孔の内側方向)に弾性変形しつつ貫通孔内に挿入される。そして、変形に対する反力(復元力)によって、嵌入部が貫通孔の壁面(内面)に接触(干渉)し、これにより、嵌入部を貫通孔から引き抜こうとする方向への基板からの電子部品の抜けが抑制され、基板上に電子部品が保持されるようになっている。このような保持構造とすると、ネジ締結などに比べて、基板に対する電子部品の占有面積(電子部品の体格)を小さくすることができる。また、組み付け工数を削減することができる。
特開2007−128772号公報
Conventionally, a part of a holding member provided in an electronic component is inserted into a through-hole formed in the substrate while being elastically deformed, and the electronic component is held on the substrate by a reaction force (restoring force) due to the deformation of the holding member. A holding structure is known. For example, in Patent Document 1, a holding member is formed by punching a metal plate, printing pressure, and bending, and the fitting is inserted from a pair of first legs that extend in the same direction from the plate-like base and face each other. The portion is inserted into the through-hole while elastically deforming in the plate thickness direction (a direction substantially perpendicular to the thickness direction of the substrate and inward of the through-hole) with the connection end with the parallel portion in the transition portion as a fulcrum. . Then, due to the reaction force (restoring force) against the deformation, the fitting portion contacts (interferences) with the wall surface (inner surface) of the through hole, and thereby the electronic component from the board in the direction to pull out the fitting portion from the through hole. The disconnection is suppressed and the electronic component is held on the substrate. With such a holding structure, the area occupied by the electronic component relative to the board (physical size of the electronic component) can be reduced as compared with screw fastening or the like. Also, the assembly man-hour can be reduced.
JP 2007-128772 A

しかしながら、特許文献1に示される保持部材は、それ自身の弾性変形に対する反力によって嵌入部が貫通孔の壁面に接触し(係止し)、基板上に電子部品が保持される構造であるため、嵌入部を貫通孔から引き抜こうとする外力に対する耐力(引っ張りに対する耐力)が低いという問題がある。すなわち、基板に対する電子部品の保持強度が低く、基板から電子部品が外れ易いという問題がある。   However, the holding member shown in Patent Document 1 has a structure in which the insertion portion contacts (locks) with the wall surface of the through hole by a reaction force against its own elastic deformation, and the electronic component is held on the substrate. There is a problem that the proof strength against the external force (the proof strength against pulling) that attempts to pull out the insertion portion from the through hole is low. That is, there is a problem that the holding strength of the electronic component with respect to the substrate is low and the electronic component is easily detached from the substrate.

また、貫通孔の壁面には一般的にメッキ層が形成されているが、引っ張りに対する耐力を向上しようとすると、嵌入部の弾性変形に対する反力(ばね性)が強くなるため、メッキ層が剥がれ易くなる。すなわち、貫通孔の壁面が損傷を受け易くなる。   In addition, a plated layer is generally formed on the wall surface of the through hole. However, if an attempt is made to improve the resistance to tension, the reaction force (spring property) against the elastic deformation of the fitting portion becomes stronger, so the plated layer is peeled off. It becomes easy. That is, the wall surface of the through hole is easily damaged.

本発明は上記問題点に鑑み、基板に対する電子部品の保持強度を向上でき、且つ、貫通孔壁面の損傷を低減できる保持部材、電子部品、及び電子装置を提供することを目的とする。   In view of the above problems, an object of the present invention is to provide a holding member, an electronic component, and an electronic device that can improve the holding strength of the electronic component with respect to the substrate and can reduce damage to the wall surface of the through hole.

上記目的を達成する為に、請求項1に記載の発明は、電子部品に固定される基部と、基部から延設された少なくとも1本の脚部とを備え、脚部が基板の貫通孔に挿入されて、基板の表面上に電子部品を保持する保持部材であって、脚部は、同一の金属板を加工することで基部と一体的に形成されており、脚部の先端側に設けられ、電子部品が基板に固定された固定状態で、基板の裏面における貫通孔の開口周辺上に少なくとも一部が位置する係止部と、一方の端部が係止部と連結され、固定状態で貫通孔内に一部が配置される連結部と、連結部における係止部とは反対側の端部に一端が連結され、固定状態で基板の表面上に配置されるとともに、貫通孔への係止部及び連結部の挿入時において、連結部が固定状態に対して傾いて係止部が貫通孔内に挿入されるように変位するばね部と、を有していることを特徴とする。   In order to achieve the above object, the invention described in claim 1 includes a base portion fixed to the electronic component and at least one leg portion extending from the base portion, and the leg portion is a through hole of the substrate. A holding member that is inserted and holds an electronic component on the surface of the board, and the leg portion is formed integrally with the base portion by processing the same metal plate, and is provided on the distal end side of the leg portion. In a fixed state in which the electronic component is fixed to the substrate, a locking portion at least a part of which is located on the periphery of the opening of the through-hole on the back surface of the substrate and one end portion are connected to the locking portion and are fixed One end is connected to the connecting portion partially disposed in the through hole, and the end of the connecting portion opposite to the locking portion, and is disposed on the surface of the substrate in a fixed state, and to the through hole. When inserting the locking part and the connecting part, the connecting part is inclined with respect to the fixed state and the locking part penetrates. Characterized in that it has a spring portion which is displaced so as to be inserted within.

このように本発明によれば、保持部材が、貫通孔を通り抜け、固定状態で基板の裏面における開口周辺上に位置する係止部を有しており、ばね部の変位によって係止部は貫通孔を通り抜け、基板の裏面上に位置される。そして、係止部は、脚部を貫通孔から引き抜こうとする外力が作用した際に基板の裏面に係止する。したがって、引っ張りに対する耐力が従来よりも向上されており、これにより、基板に対する電子部品の保持強度を向上することができる。すなわち、少なくともはんだ付け前の状態で、従来よりも電子部品を基板から外れにくくすることができる。   As described above, according to the present invention, the holding member has the locking portion that passes through the through hole and is positioned on the periphery of the opening on the back surface of the substrate in the fixed state, and the locking portion is penetrated by the displacement of the spring portion. It passes through the hole and is located on the back side of the substrate. And the latching | locking part latches to the back surface of a board | substrate, when the external force which tries to pull out a leg part from a through-hole acts. Therefore, the strength against pulling is improved as compared with the conventional case, and the holding strength of the electronic component against the substrate can be improved. In other words, at least before soldering, it is possible to make it easier for the electronic component to come off the substrate than before.

また、ばね部は、連結部における係止部の連結端とは反対側の端部に連結されている。すなわち、係止部とばね部とが脚部における異なる位置に構成されており、ばね部が貫通孔内に挿入されないようになっている。すなわち、ばね部は、それ自体が変形による反力で配線基板に係止するのではない。したがって、従来のように、ばね部の反力で貫通孔の壁面にばね部自体が係止する構成に比べて、貫通孔壁面(壁面上に形成されたメッキ層)の損傷を低減することができる。また、ばね部の設計自由度を向上することができる。   Moreover, the spring part is connected with the edge part on the opposite side to the connection end of the latching | locking part in a connection part. That is, the locking portion and the spring portion are configured at different positions in the leg portion, and the spring portion is not inserted into the through hole. That is, the spring part itself does not lock onto the wiring board by a reaction force due to deformation. Therefore, the damage to the through-hole wall surface (plated layer formed on the wall surface) can be reduced compared to the conventional configuration in which the spring portion itself is locked to the wall surface of the through-hole by the reaction force of the spring portion. it can. In addition, the degree of freedom in designing the spring portion can be improved.

請求項1に記載の発明においては、請求項2に記載のように、短手方向における幅が金属板の板厚よりも広くされたばね部を採用すると良い。   In the invention described in claim 1, as described in claim 2, it is preferable to employ a spring portion whose width in the short direction is wider than the plate thickness of the metal plate.

これによれば、ばね部の強度を高めて、係止部(及び連結部)を貫通孔内に挿入させる際や脚部を貫通孔から引き抜こうとする外力が作用した際に、ばね部の変形や破損を抑制することができる。   According to this, when the strength of the spring portion is increased and the locking portion (and the connecting portion) is inserted into the through hole or when an external force is applied to pull out the leg portion from the through hole, the spring portion is deformed. And damage can be suppressed.

請求項1又は請求項2に記載の発明においては、請求項3に記載のように、係止部が金属板を打ち抜き加工することのみで形成された構成とすることが好ましい。曲げ加工によっても形成することができるが、打ち抜き加工のみによって係止部を形成すると、曲げ加工よりも変形や破損に対して耐力を向上することができる。これにより、基板に対する電子部品の保持強度をさらに向上することができる。   In the first or second aspect of the invention, as described in the third aspect of the invention, it is preferable that the engaging portion is formed only by punching a metal plate. Although it can be formed by bending, if the locking portion is formed only by punching, the yield strength can be improved against deformation and breakage compared to bending. Thereby, the holding | maintenance strength of the electronic component with respect to a board | substrate can further be improved.

請求項1〜3いずれかに記載の発明においては、請求項4に記載のように、ばね部として、曲げ加工によって基部と該基部に対向する折り返し部とが屈曲部によって連結された略U字状のばね部を採用しても良い。また、請求項5に記載のように、平板状のばね部(板バネ)を採用しても良い。   In any one of Claims 1-3, as described in Claim 4, as a spring part, the base part and the folding | turning part which opposes this base part by the bending process were connected by the bending part. A shaped spring portion may be employed. Moreover, you may employ | adopt a flat spring part (plate spring) as described in Claim 5.

略U字状とすると、バネ長を長くしてばね部の変位量(ストローク)を大きくすることができ、係止部の長さを長くすることができる。すなわち、係止部による係止状態を解除しにくくし、貫通孔からの脚部の抜け(基板からの電子部品の抜け)を抑制することができる。また、平板状とすると、略U字状のような曲げ加工を不要とすることができる。また、平板状であっても、略コの字状や蛇行形状とすると、バネ長を長くし、ばね部の変位量(ストローク)を大きくすることができる。   If it is made substantially U-shaped, the spring length can be increased to increase the amount of displacement (stroke) of the spring portion, and the length of the locking portion can be increased. That is, it is difficult to release the locked state by the locking portion, and it is possible to suppress the dropout of the leg portion from the through hole (the removal of the electronic component from the board). Moreover, when it is flat, it is not necessary to perform bending work like a substantially U shape. Moreover, even if it is flat form, if it is substantially U-shape or meandering shape, the spring length can be lengthened and the displacement amount (stroke) of the spring part can be increased.

請求項1〜5いずれかに記載の発明においては、請求項6に記載のように、脚部として、基部から同じ方向に延設され、互いに対向する一対の脚部を有し、一対の脚部における係止部の連結部から延びた方向が互いに異なる方向とされた構成とすると良い。   In the invention according to any one of claims 1 to 5, as described in claim 6, the leg portion has a pair of leg portions extending in the same direction from the base portion and facing each other, and the pair of legs. The direction extended from the connection part of the latching | locking part in a part is good to set it as the different direction.

これによれば、1本の脚部のみを有する構成に比べて、基板に対する電子部品の保持強度を向上することができる。また、係止部が互いに異なる方向に延びているので、係止部が互いに同一方向に延びた構成に比べて、基板に対するがたつきが低減されている。また、係止状態が解除されにくくなっている。   According to this, the holding strength of the electronic component with respect to the substrate can be improved as compared with the configuration having only one leg portion. In addition, since the locking portions extend in different directions, rattling with respect to the substrate is reduced compared to a configuration in which the locking portions extend in the same direction. Moreover, the locked state is difficult to be released.

請求項6に記載の発明においては、請求項7に記載のように、基部から脚部と同じ方向であって先端が互いに対向する一対の連結部の間まで少なくとも延設され、挿入前の状態で連結部とは離れて設けられた傾斜制限部を有する構成としても良い。   In the invention described in claim 6, as described in claim 7, the state before the insertion is extended at least from the base portion to the pair of connecting portions in the same direction as the leg portions and the tips facing each other. And it is good also as a structure which has the inclination restriction | limiting part provided apart from the connection part.

これによれば、一対の脚部の間に設けられた傾斜制限部によって、連結部の傾きを制限することができる。したがって、例えば、脚部を貫通孔に挿入する際に、貫通孔と脚部との位置関係が所定の関係からずれていたとしても、連結部が傾斜制限部に当て止まるので、必要以上に連結部が傾くことがなく、脚部の変形や破損を抑制することができる。また、フローはんだ付けを実施する場合には、傾斜制限部が存在することで、毛細管現象により基板の表面側へはんだを吸い上げ易くすることもできる。この場合、傾斜制限部もはんだと接するので、引っ張りに対する耐力をさらに向上することもできる。   According to this, the inclination of a connection part can be restrict | limited by the inclination restriction | limiting part provided between a pair of leg parts. Therefore, for example, when the leg portion is inserted into the through hole, even if the positional relationship between the through hole and the leg portion deviates from a predetermined relationship, the connecting portion stops against the inclination limiting portion, so that the connecting portion is connected more than necessary. The portion does not tilt, and the deformation and breakage of the leg can be suppressed. In addition, when performing flow soldering, the presence of the inclination limiting portion can make it easier to suck up the solder to the surface side of the substrate by capillary action. In this case, since the inclination limiting portion is also in contact with the solder, the strength against tension can be further improved.

請求項1〜7いずれかに記載の発明においては、請求項8に記載のように、基板の厚さ方向に略垂直な方向において、係止部のうち、固定状態で貫通孔から最も離れた位置となる角部が、90°よりも大きい角を複数繋いでなる多角形状、又は、丸みを帯びた形状とされた構成とすると良い。   In the invention according to any one of the first to seventh aspects, as described in the eighth aspect, in the direction substantially perpendicular to the thickness direction of the substrate, the locking portion is farthest from the through hole in a fixed state. It is preferable that the corner portion serving as the position has a polygonal shape formed by connecting a plurality of corners larger than 90 ° or a rounded shape.

角部が角張った形状(90°以下の角度)の場合、貫通孔への脚部の挿入時において、係止部が貫通孔を突き抜ける際に、係止部の少なくとも一部が突き抜けつつばね部の反力(復元力)で貫通孔よりも外側へ移動するため、角部が壁面端部(貫通孔開口部)のメッキ層を削り取る(跳ね飛ばす)恐れがある。これに対し、角部を上記形状とすると、角部によるメッキ層削りを抑制することができる。   In the case where the corner portion has an angular shape (angle of 90 ° or less), at the time of insertion of the leg portion into the through hole, when the locking portion penetrates the through hole, at least a part of the locking portion penetrates and the spring portion Because of this reaction force (restoring force), the corner moves to the outside of the through hole, so that the corner portion may scrape off (bounce off) the plating layer at the wall end (through hole opening). On the other hand, when the corner portion has the above-described shape, plating layer scraping by the corner portion can be suppressed.

請求項1〜8いずれかに記載の発明においては、請求項9に記載のように、係止部における基板裏面との対向部分が、基板の厚さ方向に略垂直な方向において連結部から離れるほど、基板の厚さ方向において基板表面から遠いテーパ状とされた構成としても良い。   In the invention according to any one of claims 1 to 8, as described in claim 9, a portion of the locking portion facing the substrate back surface is separated from the connecting portion in a direction substantially perpendicular to the thickness direction of the substrate. It is also possible to adopt a configuration in which the taper is far from the substrate surface in the thickness direction of the substrate.

これによれば、基板の厚さ方向において、例えば公差の範囲内で製造ばらつき(保持部材、基板、電子部品)や組み付けばらつき(保持部材と電子部品の本体部、電子部品(保持部材含む)と基板)が生じても、係止部を基板の裏面に係止させやすくすることができる。すなわち、基板と電子部品とのがたつきを抑制することができる。また、同一構成の保持部材を、異なる厚さの基板(複数種類の基板)に対して適用することができる。   According to this, in the thickness direction of the substrate, for example, manufacturing variation (holding member, substrate, electronic component) or assembly variation (holding member and main body of electronic component, electronic component (including holding member) within a tolerance range Even if the substrate) occurs, the locking portion can be easily locked to the back surface of the substrate. That is, rattling between the substrate and the electronic component can be suppressed. In addition, the holding member having the same configuration can be applied to substrates (multiple types of substrates) having different thicknesses.

次に、請求項10に記載の発明は、本体部と、該本体部を貫通孔の形成された基板の表面上に保持する保持部材とを備えた電子部品であって、保持部材は、本体部に固定された基部と、基部から延設され、貫通孔に挿入される少なくとも1本の脚部とを備え、脚部は、同一の金属板を加工することで基部と一体的に形成されており、脚部の先端側に設けられ、基板に固定された固定状態で、基板の裏面における貫通孔の開口周辺上に少なくとも一部が位置する係止部と、一方の端部が係止部と連結され、固定状態で貫通孔内に一部が配置される連結部と、連結部における係止部とは反対側の端部に一端が連結され、固定状態で基板の表面上に配置されるとともに、貫通孔への係止部及び連結部の挿入時において、連結部が固定状態に対して傾いて係止部が貫通孔内に挿入されるように変位するばね部と、を有していることを特徴とする。   Next, an invention according to claim 10 is an electronic component comprising a main body portion and a holding member that holds the main body portion on the surface of the substrate in which the through-hole is formed. A base that is fixed to the base and at least one leg that extends from the base and is inserted into the through-hole. The leg is formed integrally with the base by processing the same metal plate. The locking portion is provided on the distal end side of the leg portion and is fixed to the substrate, and at least a part is positioned on the periphery of the through hole opening on the back surface of the substrate, and one end portion is locked. One end is connected to the end of the connecting portion opposite to the locking portion in the fixed state, and arranged on the surface of the substrate in the fixed state. At the time of inserting the locking portion and the connecting portion into the through hole, the connecting portion is inclined with respect to the fixed state. Engaging portion is characterized by having a spring portion which is displaced so as to be inserted into the through hole Te.

このように本発明の電子部品は、上記した保持部材を備えるものである。その作用効果は、請求項1の作用効果と同じであるので、その記載を省略する。   As described above, the electronic component of the present invention includes the above-described holding member. Since the function and effect are the same as those of claim 1, the description thereof is omitted.

請求項10に記載の発明においては、請求項11に記載のように、1つの本体部に対して保持部材を複数備え、係止部として、連結部から延びた方向が、異なる保持部材において互いに反対方向とされた少なくとも一対の係止部を有する構成としても良い。これによれば、例えば1つの保持部材が1本の脚部のみを有する構成であっても、請求項6に記載の保持部材と同様の効果を奏することができる。   In a tenth aspect of the present invention, as described in the eleventh aspect, a plurality of holding members are provided for one main body portion, and the holding portions have different directions extending from the connecting portion as the locking portions. It is good also as a structure which has at least a pair of latching | locking part made into the opposite direction. According to this, even if one holding member has only one leg, for example, the same effect as the holding member according to claim 6 can be obtained.

次に、請求項12に記載の発明は、貫通孔の形成された基板と、本体部と、該本体部を基板の表面上に保持する保持部材を有する電子部品と、を備えた電子装置であって、保持部材は、本体部に固定された基部と、基部から延設され、貫通孔に挿入された少なくとも1本の脚部とを備え、脚部は、同一の金属板を加工することで基部と一体的に形成されており、脚部の先端側に設けられ、電子部品が基板に固定された固定状態で、基板の裏面における貫通孔の開口周辺上に少なくとも一部が位置する係止部と、一方の端部が係止部と連結され、固定状態で貫通孔内に一部が配置された連結部と、連結部における係止部とは反対側の端部に一端が連結され、固定状態で基板の表面上に配置されるとともに、貫通孔への係止部及び連結部の挿入時において、連結部が固定状態に対して傾いて係止部が貫通孔内に挿入されるように変位するばね部と、を有していることを特徴とする。   Next, an invention according to claim 12 is an electronic device comprising: a substrate having a through hole formed therein; a main body portion; and an electronic component having a holding member for holding the main body portion on the surface of the substrate. The holding member includes a base portion fixed to the main body portion and at least one leg portion extending from the base portion and inserted into the through hole, and the leg portions process the same metal plate. The base is formed integrally with the base, and is provided on the distal end side of the leg, and in a fixed state where the electronic component is fixed to the substrate, at least a part thereof is located on the periphery of the opening of the through hole on the back surface of the substrate. One end is connected to the stopper, one end connected to the locking part, a connecting part partially disposed in the through hole in a fixed state, and the end of the connecting part opposite to the locking part And placed on the surface of the substrate in a fixed state, and when inserting the locking part and the connecting part into the through hole Oite, connecting portion engaging portion to tilt, characterized in that it has a spring portion which is displaced so as to be inserted into the through hole with respect to the stationary state.

このように本発明の電子装置は、上記した保持部材を備えるものである。その作用効果は、請求項1の作用効果と同じであるので、その記載を省略する。   Thus, the electronic device of the present invention includes the above-described holding member. Since the function and effect are the same as those of claim 1, the description thereof is omitted.

請求項12に記載の発明においては、請求項13に記載のように、脚部として、同一の基部から同じ方向に延設され、互いに対向する一対の脚部を有し、各脚部における係止部の連結部から延びた方向が互いに反対方向とされた構成とすると良い。本発明の作用効果は、請求項6の作用効果と同じであるので、その記載を省略する。   In the twelfth aspect of the present invention, as in the thirteenth aspect, the leg portion has a pair of leg portions extending in the same direction from the same base portion and facing each other. The direction extended from the connection part of the stop part is good to set it as the structure made into the opposite direction mutually. Since the operational effect of the present invention is the same as that of the sixth aspect, the description thereof is omitted.

請求項13に記載の発明においては、請求項14に記載のように、貫通孔が一方向に長い長孔であり、各脚部における係止部が貫通孔の長手方向に沿って連結部から延び、且つ、延設方向が互いに反対方向とされ、基板の裏面における貫通孔の長手側の開口周辺上に位置する構成とすると良い。   In a thirteenth aspect of the present invention, as described in the fourteenth aspect, the through hole is a long hole extending in one direction, and the locking portion in each leg portion extends from the connecting portion along the longitudinal direction of the through hole. It is preferable that the extending direction is opposite to each other and is located on the periphery of the opening on the long side of the through hole on the back surface of the substrate.

このように貫通孔を長孔とすると、断面積が同じ円形の貫通孔と比べて、挿入時における連結部の傾きを大きくすることができる。すなわち、ばね部の反力を小さくすることができるので、貫通孔に係止部及び連結部を挿入する際に、貫通孔壁面(壁面上に形成されたメッキ層)の損傷を低減することができる。なお、貫通孔の長手方向が、電子部品の本体部の短手方向と略平行な場合には、基板における配線パターンの配置自由度を向上することもできる。   When the through hole is thus a long hole, the inclination of the connecting portion at the time of insertion can be increased as compared with a circular through hole having the same cross-sectional area. That is, since the reaction force of the spring portion can be reduced, damage to the through-hole wall surface (plated layer formed on the wall surface) can be reduced when the locking portion and the coupling portion are inserted into the through-hole. it can. In addition, when the longitudinal direction of the through hole is substantially parallel to the short direction of the main body portion of the electronic component, the degree of freedom in arranging the wiring pattern on the substrate can be improved.

請求項13又は請求項14に記載の発明においては、請求項15に記載のように、各脚部において、連結部における貫通孔の壁面と対向する外側部位間の幅が、貫通孔における外側部位と対向する部位間の幅以上とされた構成としても良い。これによれば、固定状態で、連結部の少なくとも一部が貫通孔の壁面に接するので、基板と電子部品とのがたつきを抑制することができる。   In the invention according to claim 13 or claim 14, as in claim 15, in each leg portion, the width between the outer portions facing the wall surface of the through hole in the connecting portion is equal to the outer portion in the through hole. It is good also as a structure made more than the width | variety between the site | parts which oppose. According to this, in a fixed state, at least a part of the connecting portion is in contact with the wall surface of the through hole, so that rattling between the substrate and the electronic component can be suppressed.

請求項13又は請求項14に記載の発明においては、請求項16に記載のように、各脚部において、連結部における貫通孔と対向する外側部位間の幅を、固定状態で、基板の裏面における貫通孔の開口部での幅のほうが、基板の表面における貫通孔の開口部での幅よりも狭くなるようにしても良い。これによれば、基板における貫通孔壁面と対向する連結部の外側部位との間に隙間が生じるので、基板の裏面側からフローはんだ付けを実施する場合に、隙間における毛細管現象により基板の表面側へはんだを吸い上げ易くすることができる。   In the invention according to claim 13 or claim 14, as described in claim 16, in each leg portion, the width between the outer portions facing the through hole in the connecting portion is fixed, and the back surface of the substrate. The width at the opening of the through hole may be narrower than the width at the opening of the through hole on the surface of the substrate. According to this, a gap is formed between the wall surface of the through hole in the substrate and the outer portion of the connecting portion facing the substrate. Therefore, when flow soldering is performed from the back surface side of the substrate, the surface side of the substrate is caused by capillary action in the gap. The solder can be easily sucked up.

以下、本発明の実施の形態を図に基づいて説明する。
(第1実施形態)
図1は、第1実施形態に係る電子制御装置の概略構成を説明するための分解図である。図2は、コネクタを配線基板に実装した状態の実装部周辺の平面図である。図3は、保持部材の概略構成を示す斜視図である。図4は、図3に示す保持部材のうち、脚部の展開図である。図5は、貫通孔への脚部の挿入時を示す部分断面図である。図6は、コネクタが基板表面上に保持された状態を示す図であり、(a)は部分断面図、(b)は基板裏面側から見た平面図である。図7は、フローはんだ付け後の状態を示す部分断面図である。なお、図2,図5〜7においては、便宜上、貫通孔壁面のメッキ層を省略して図示している。また、以下においては、図1に示すように、配線基板の厚さ方向を上下方向と示し、図2に示すように、ハウジングにおける端子の配列方向を左右方向、上下方向及び左右方向と直交する方向を前後方向と示す。また、図5〜7の断面図は、貫配線基板における貫通孔基準での断面図である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is an exploded view for explaining a schematic configuration of the electronic control device according to the first embodiment. FIG. 2 is a plan view of the periphery of the mounting portion in a state where the connector is mounted on the wiring board. FIG. 3 is a perspective view showing a schematic configuration of the holding member. FIG. 4 is a development view of a leg portion of the holding member shown in FIG. 3. FIG. 5 is a partial cross-sectional view showing when the leg portion is inserted into the through hole. 6A and 6B are diagrams showing a state where the connector is held on the substrate surface, where FIG. 6A is a partial cross-sectional view, and FIG. 6B is a plan view viewed from the back side of the substrate. FIG. 7 is a partial cross-sectional view showing the state after flow soldering. In FIGS. 2 and 5 to 7, the plating layer on the wall surface of the through hole is omitted for convenience. Further, in the following, as shown in FIG. 1, the thickness direction of the wiring board is shown as the vertical direction, and as shown in FIG. 2, the terminal arrangement direction in the housing is orthogonal to the horizontal direction, the vertical direction, and the horizontal direction. The direction is indicated as the front-rear direction. Moreover, the cross-sectional views of FIGS.

以下に示す実施形態においては、主として保持部材に特徴があるが、該保持部材を有するコネクタ及び電子装置とともに保持部材について説明する。なお、本実施形態に示す電子装置は、非防水構造の電子制御装置であり、例えば車両のエンジンECU(Electric Control Unit)として用いられる。   In the embodiment described below, the holding member is mainly characterized, but the holding member will be described together with the connector and the electronic device having the holding member. The electronic device shown in the present embodiment is a non-waterproof electronic control device, and is used, for example, as an engine ECU (Electric Control Unit) of a vehicle.

図1に示す電子制御装置1は、要部として、配線基板31に電子部品32を実装してなる回路基板30と、端子51、ハウジング52、及び保持部材60を有するコネクタ50とを備えている。また上記要素以外にも、本実施形態においては、回路基板30及びコネクタ50を収容する筐体10を備えている。   The electronic control device 1 shown in FIG. 1 includes a circuit board 30 in which an electronic component 32 is mounted on a wiring board 31 and a connector 50 having a terminal 51, a housing 52, and a holding member 60. . In addition to the above elements, the present embodiment includes a housing 10 that houses the circuit board 30 and the connector 50.

筐体10は、アルミニウム、鉄等の金属材料や樹脂材料からなり、その内部に回路基板30とコネクタ50の一部とを収容するものである。筐体10の構成部材の個数は特に限定されるものではなく、1つの部材から構成されても良いし、複数の部材から構成されても良い。本実施形態においては、図1に示すように、一方が開放された箱状のケース11と、ケース11の開放面を閉塞する略矩形板状の底の浅いカバー12との2つの部材によって構成されている。そして、ケース11とカバー12とを組み付けることで、回路基板30とコネクタ50を収容する内部空間を備えた筐体10となっている。また、筐体10(ケース11)には、コネクタ50に対応したコネクタ用切り欠き部(図示略)が設けられており、回路基板30を収容するようにケース11とカバー12を組み付けた(例えば螺子締結した)状態で、回路基板30及びコネクタ50の一部(端子51における回路基板30との接続側を含む)が筐体10内に収容され、コネクタ50の残りの部分(端子51における外部コネクタとの接続側を含む)が筐体10外に露出されるようになっている。   The housing 10 is made of a metal material such as aluminum or iron, or a resin material, and accommodates the circuit board 30 and a part of the connector 50 therein. The number of constituent members of the housing 10 is not particularly limited, and may be configured from one member or a plurality of members. In the present embodiment, as shown in FIG. 1, it is constituted by two members, a box-shaped case 11 with one side opened and a shallow cover 12 with a substantially rectangular plate shape that closes the open surface of the case 11. Has been. The case 11 and the cover 12 are assembled to form the housing 10 having an internal space for accommodating the circuit board 30 and the connector 50. The housing 10 (case 11) is provided with a connector notch (not shown) corresponding to the connector 50, and the case 11 and the cover 12 are assembled so as to accommodate the circuit board 30 (for example, In a state where the screw is fastened), a part of the circuit board 30 and the connector 50 (including the connection side of the terminal 51 to the circuit board 30) is accommodated in the housing 10, and the remaining part of the connector 50 (external to the terminal 51) (Including the connection side with the connector) is exposed outside the housing 10.

回路基板30は、図1に示すように、電極としてのランドを含む配線、配線間を接続するビアホール等が形成されてなる基板としての配線基板31に、マイコン、パワートランジスタ、抵抗、コンデンサ等の電子部品32を実装してなるものである。本実施形態においては、電子部品32の1つとして、回路基板30と外部とを電気的に接続するコネクタ50が、配線基板31に実装されている。このコネクタ50が、特許請求の範囲に記載の電子部品に相当する。また、配線基板31には、図2に示すように、端子51の実装部が挿入される貫通孔33と、図2、図5〜7などに示すように、保持部材60の脚部62が挿入される貫通孔34が形成されている。詳しくは、図2に示すように、左右方向においてハウジング52の両端よりも外側に、貫通孔34がそれぞれ1つずつ形成されており、貫通孔34の間に複数の貫通孔33が形成されている。これら貫通孔33,34の壁面及び配線基板31の開口周辺には、図示されないメッキ層が形成されており、貫通孔33の壁面に形成されたメッキ層は、配線基板31に形成された配線のランドとしての機能を果たすようになっている。なお、各貫通孔33,34の断面形状は特に限定されるものではない。本実施形態においては、貫通孔33が略円形断面、貫通孔34が左右方向に対して前後方向の長さが長い略楕円断面の長孔(図6(b)参照)となっている。   As shown in FIG. 1, the circuit board 30 includes a wiring board 31 as a board on which wiring including lands as electrodes and via holes for connecting the wirings are formed, to a microcomputer, a power transistor, a resistor, a capacitor, and the like. The electronic component 32 is mounted. In the present embodiment, a connector 50 that electrically connects the circuit board 30 and the outside is mounted on the wiring board 31 as one of the electronic components 32. The connector 50 corresponds to the electronic component described in the claims. Further, the wiring board 31 includes a through hole 33 into which the mounting portion of the terminal 51 is inserted as shown in FIG. 2 and a leg portion 62 of the holding member 60 as shown in FIGS. A through hole 34 to be inserted is formed. Specifically, as shown in FIG. 2, one through hole 34 is formed outside each end of the housing 52 in the left-right direction, and a plurality of through holes 33 are formed between the through holes 34. Yes. A plating layer (not shown) is formed around the wall surfaces of the through holes 33 and 34 and the opening of the wiring substrate 31, and the plating layer formed on the wall surface of the through hole 33 is used for the wiring formed on the wiring substrate 31. It is designed to function as a land. In addition, the cross-sectional shape of each through-hole 33 and 34 is not specifically limited. In the present embodiment, the through-hole 33 has a substantially circular cross-section, and the through-hole 34 has a long hole with a substantially elliptical cross section that is long in the front-rear direction with respect to the left-right direction (see FIG. 6B).

コネクタ50は、導電材料からなる複数の端子51を、電気絶縁性の材料(本実施形態においては樹脂)からなるハウジング52に対し、配線基板31の表面31aに沿って配列してなるものである。端子51は、ハウジング52の前面52aから延出された一方の端部(実装部)が、対応する貫通孔33に挿入された状態で、はんだ(図示略)を介して電気的に接続されている。また、ハウジング52の後面から延出された他方の端部が、筐体10外に露出されて外部コネクタと電気的に接続されるようになっている。本実施形態においては、図2に示すように、端子51として、信号伝送用のシグナル端子51aと、シグナル端子51aよりも太い電力伝送用のパワー端子51bを有している。そして、これらの端子51は、配線基板31の表面31aに沿う平面形状が一方向(左右方向)に長い略矩形状のハウジング52に対して、互いに干渉しないようにそれぞれの一部が保持され、左右方向(ハウジング52の長手方向)に沿って配列されている。   The connector 50 is formed by arranging a plurality of terminals 51 made of a conductive material along a surface 31a of the wiring board 31 with respect to a housing 52 made of an electrically insulating material (resin in this embodiment). . The terminal 51 is electrically connected via solder (not shown) in a state where one end portion (mounting portion) extending from the front surface 52a of the housing 52 is inserted into the corresponding through hole 33. Yes. The other end portion extended from the rear surface of the housing 52 is exposed outside the housing 10 and is electrically connected to an external connector. In the present embodiment, as shown in FIG. 2, the terminal 51 includes a signal terminal 51a for signal transmission and a power terminal 51b for power transmission that is thicker than the signal terminal 51a. And these terminals 51 are each held | maintained so that it may not mutually interfere with respect to the substantially rectangular housing 52 in which the planar shape along the surface 31a of the wiring board 31 is long in one direction (left-right direction), They are arranged in the left-right direction (the longitudinal direction of the housing 52).

また、左右方向におけるハウジング52の両側面52bにおいて、ハウジング52の4隅と対応する前後各2か所には、側面52bから左右方向外側に台座部53が延設されている。この台座部53には、図2に示すように縦スリット状の溝部54が各台座部53の上面及び前後方向で対向する他の台座部53との対向面にかけて切り込み形成されている。そして、ハウジング52における左右両端側の溝部54に対して保持部材60が上方から挿入されている。   Further, on both side surfaces 52b of the housing 52 in the left-right direction, pedestal portions 53 are extended from the side surface 52b to the outside in the left-right direction at two front and rear positions corresponding to the four corners of the housing 52. As shown in FIG. 2, the pedestal portion 53 has a longitudinal slit-shaped groove portion 54 formed by cutting the upper surface of each pedestal portion 53 and a surface facing the other pedestal portion 53 facing each other in the front-rear direction. And the holding member 60 is inserted from the upper part with respect to the groove part 54 of the left-right both ends side in the housing 52. As shown in FIG.

保持部材60は、配線基板31の貫通孔34に挿入されて、少なくともはんだ付け前の状態で、コネクタ50を配線基板31から外れにくくするものである。すなわち、配線基板31の表面31a上にコネクタ50を保持するものである。この保持部材60は、図3に示すように、一体的に形成された基部61と脚部62を有している。   The holding member 60 is inserted into the through hole 34 of the wiring board 31 to make it difficult for the connector 50 to be detached from the wiring board 31 at least before being soldered. That is, the connector 50 is held on the surface 31 a of the wiring board 31. As shown in FIG. 3, the holding member 60 has a base portion 61 and a leg portion 62 that are integrally formed.

基部61は、保持部材60をハウジング52に固定するための部位である。本実施形態においては、基部61が、ハウジング52の側面52bに設けられた溝部54に挿入されて固定される略矩形状の平板となっている。この基部61の略中央部下端からは、板状の脚部62が下方に(配線基板31側に向けて)延設されている。   The base 61 is a part for fixing the holding member 60 to the housing 52. In the present embodiment, the base portion 61 is a substantially rectangular flat plate that is inserted into and fixed to the groove portion 54 provided on the side surface 52 b of the housing 52. A plate-like leg portion 62 extends downward (toward the wiring board 31) from the lower end of the substantially central portion of the base portion 61.

脚部62は、コネクタ50を配線基板31の表面31a上に保持する(少なくともはんだ付け前の状態で、コネクタ50を配線基板31から外れにくくする)機能を果たす部位であり、その一部が配線基板31の貫通孔34に挿入される。本実施形態においては、脚部62として、一対の脚部62a,62bが、基部61の略中央部下端から同一方向(下方)に延設されている。   The leg portion 62 is a part that functions to hold the connector 50 on the surface 31a of the wiring board 31 (to make it difficult to remove the connector 50 from the wiring board 31 at least before soldering), and a part of the leg part 62 is a wiring It is inserted into the through hole 34 of the substrate 31. In the present embodiment, as the leg portion 62, a pair of leg portions 62 a and 62 b are extended from the lower end of the substantially central portion of the base portion 61 in the same direction (downward).

この脚部62a,62bのうち、一方の脚部62aは、脚部62aの先端側(下方先端側)に設けられ、コネクタ50が配線基板31に固定された固定状態(保持状態)で、配線基板31の裏面31bにおける貫通孔34の開口周辺上に少なくとも一部が位置する係止部63aを有している。この係止部63aは、固定状態で貫通孔34内に一部が配置される連結部64aの一端と連結されている。また、連結部64aの他端には、固定状態で配線基板31の表面31a上に配置されるとともに、貫通孔34への係止部63a及び連結部64aの挿入時において、連結部64aが固定状態に対して傾いて係止部63aが貫通孔34内に挿入されるように変位するばね部65aが連結されている。そして、ばね部65aにおける連結部64aとの連結端と反対側の端部が、繋ぎ部66aを介して基部61と連結されている。なお、図3中に示す符号67は、保持部材60を構成する際に用いた平板状の金属板の端面(以下単に端面67と示す)を示している。   Of the legs 62a and 62b, one leg 62a is provided on the distal end side (lower distal end side) of the leg portion 62a, and the connector 50 is fixed to the wiring board 31 in a fixed state (holding state). A locking portion 63 a is provided that is at least partially positioned on the periphery of the opening of the through hole 34 on the back surface 31 b of the substrate 31. The locking portion 63a is connected to one end of a connecting portion 64a that is partially disposed in the through hole 34 in a fixed state. In addition, the other end of the connecting portion 64a is disposed on the surface 31a of the wiring board 31 in a fixed state, and the connecting portion 64a is fixed when the engaging portion 63a and the connecting portion 64a are inserted into the through hole 34. A spring portion 65a that is inclined with respect to the state and is displaced so that the locking portion 63a is inserted into the through hole 34 is connected. And the edge part on the opposite side to the connection end with the connection part 64a in the spring part 65a is connected with the base 61 via the connection part 66a. 3 indicates an end face (hereinafter simply referred to as an end face 67) of a flat metal plate used when the holding member 60 is configured.

詳しくは、図3に示すように、略矩形状の平板である基部61と同一平面で、直線状の繋ぎ部66aが基部61から下方に延設されている。なお、変位してもばね部65aが基部61に接しないのであれば、繋ぎ部66aのない構成とすることもできる。そして、繋ぎ部66aから略90°(図2に示すように、ハウジング52に対し、左(右)方向の外側)に折り曲げられた状態で曲げ加工されて、略U字状のばね部65aが延設されている。このばね部65aは、繋ぎ部66aを介して基部61に支持されており、繋ぎ部66aと連結された基部と該基部に対向する折り返し部とが屈曲部によって連結されてなる。そして、変位していない状態で、基部と折り返し部とが互いに略平行であって、配線基板31の表面31aとも略平行となっている。また、本実施形態においては、図3に示すように、ばね部65aの幅W(ばね部65の延設方向及び板厚方向に略垂直な方向の幅)が、その板厚T(平板状の金属板の板厚)よりも広くなっている。この略U字状のばね部65aにおける折り返し部から、略90°(図2に示すように、ハウジング52に対し、左(右)方向の外側)に折り曲げられ、ばね部65aの変位がない状態で配線基板31の表面31aに略垂直な連結部64aが延設されている。本実施形態においては、連結部64aにおける端面67が貫通孔34の壁面と対向するようになっており、連結部64aは、貫通孔34への係止部63a及び連結部64aの挿入時において殆んど変形しないようにリジッドとなっている。また、上下方向に延びた長さは、少なくとも係止部63a,63bが配線基板31の裏面31b上に位置するまで、ばね部65a,65bが配線基板31の表面31bと接触しない長さとなっている。そして、直線状の連結部64aの下端と同一平面で、係止部63aが連結部64aから前(後)方向に延設されている。この係止部63aは、配線基板31の裏面31bとの対向面が裏面31bと略平行とされ、上下方向の幅が、連結部64aとの連結端側から前後方向において連結部64aとは離れた角部の先端に近いほど狭い所謂楔形状となっている。また、係止部63aにおける端面67の少なくとも一部が、固定状態で配線基板31の裏面31b上に位置する(対向する)ようになっている。   Specifically, as shown in FIG. 3, a linear connecting portion 66 a is extended downward from the base 61 on the same plane as the base 61 that is a substantially rectangular flat plate. In addition, if the spring part 65a does not contact the base part 61 even if it displaces, it can also be set as the structure without the connection part 66a. Then, the spring portion 65a is bent substantially 90 degrees from the connecting portion 66a (bent in the left (right) direction with respect to the housing 52 as shown in FIG. 2). It is extended. The spring portion 65a is supported by the base portion 61 via a connecting portion 66a, and a base portion connected to the connecting portion 66a and a folded portion facing the base portion are connected by a bent portion. In a state in which the base plate is not displaced, the base portion and the folded portion are substantially parallel to each other and are also substantially parallel to the surface 31 a of the wiring board 31. In this embodiment, as shown in FIG. 3, the width W of the spring portion 65a (the width in the direction substantially perpendicular to the extending direction of the spring portion 65 and the plate thickness direction) is the plate thickness T (flat plate shape). It is wider than the thickness of the metal plate. The bent portion of the substantially U-shaped spring portion 65a is bent approximately 90 ° (outside in the left (right) direction with respect to the housing 52 as shown in FIG. 2), and the spring portion 65a is not displaced. A connecting portion 64a extending substantially perpendicular to the surface 31a of the wiring board 31 is extended. In the present embodiment, the end surface 67 of the connecting portion 64a is opposed to the wall surface of the through hole 34, and the connecting portion 64a is almost completely inserted when the locking portion 63a and the connecting portion 64a are inserted into the through hole 34. It is rigid so as not to deform. The length extending in the vertical direction is such that the spring portions 65 a and 65 b do not contact the front surface 31 b of the wiring board 31 until at least the locking portions 63 a and 63 b are positioned on the back surface 31 b of the wiring board 31. Yes. And the latching | locking part 63a is extended in the front (rear) direction from the connection part 64a by the same plane as the lower end of the linear connection part 64a. The engaging portion 63a has a surface facing the back surface 31b of the wiring board 31 substantially parallel to the back surface 31b, and the vertical width is separated from the connecting portion 64a in the front-rear direction from the connecting end side with the connecting portion 64a. The closer to the tip of the corner, the narrower the so-called wedge shape. In addition, at least a part of the end surface 67 of the locking portion 63a is positioned (opposed) on the back surface 31b of the wiring board 31 in a fixed state.

これに対し、他方の脚部62bは、基部61の略中央部下端から同一方向に延び、脚部62aと対称の形状を有している。すなわち、脚部62bも脚部62a同様、係止部63b、連結部64b、ばね部65b、及び繋ぎ部66bを有している。   On the other hand, the other leg portion 62b extends in the same direction from the lower end of the substantially central portion of the base portion 61 and has a symmetrical shape with the leg portion 62a. That is, the leg part 62b also has the latching | locking part 63b, the connection part 64b, the spring part 65b, and the connection part 66b similarly to the leg part 62a.

また、本実施形態では、一対の脚部62a,62bにおける係止部63a,63bは、対応する連結部64a,64bから延びた方向が、互いに反対方向となっている。本実施形態では、図6(b)に示すように、前後方向に長い略楕円断面の貫通孔34に対し、貫通孔34の長手方向(前後方向)の一端側の配線基板31の裏面31b上に係止部63aが位置し、他端側の配線基板31の裏面31b上に係止部63bが位置するようになっている。また、一対の脚部62a,62bにおいて、図5にしめすように、連結部64a,64bの幅Hが、係止部63a,63bが係止する前後方向の貫通孔34の幅(内径)Dの半分の長さよりも短い長さであって、脚部62a,62bを貫通孔34内に挿入する際に、互いに接触しない程度の長さとなっている。また、図6(a)に示すように、ばね部65a,65bが変位されない状態における連結部64a,64bの外側部位間の幅Sが、貫通孔34の幅Dよりも短い長さとなっている。すなわち、係止部63a,63bの一部が配線基板31の裏面31b上の位置する状態で、連結部64a,64bが貫通孔34の壁面と接触せず、連結部64a,64bの外側部位と対向する壁面との間に隙間を有するようになっている。   In the present embodiment, the locking portions 63a and 63b of the pair of leg portions 62a and 62b have opposite directions extending from the corresponding connecting portions 64a and 64b. In the present embodiment, as shown in FIG. 6B, on the back surface 31 b of the wiring substrate 31 on one end side in the longitudinal direction (front-rear direction) of the through-hole 34 with respect to the through-hole 34 having a substantially elliptical cross section elongated in the front-rear direction. The locking portion 63a is located on the back surface 31b of the wiring board 31 on the other end side. Further, in the pair of leg portions 62a and 62b, as shown in FIG. 5, the width H of the connecting portions 64a and 64b is the width (inner diameter) D of the through hole 34 in the front-rear direction where the locking portions 63a and 63b are locked. The length is shorter than the half of the length, and the length is such that the legs 62a and 62b do not come into contact with each other when the legs 62a and 62b are inserted into the through hole 34. Further, as shown in FIG. 6A, the width S between the outer portions of the coupling portions 64 a and 64 b in a state where the spring portions 65 a and 65 b are not displaced is shorter than the width D of the through hole 34. . That is, in a state in which a part of the locking portions 63a and 63b is located on the back surface 31b of the wiring board 31, the connecting portions 64a and 64b do not contact the wall surface of the through hole 34, and the outer portions of the connecting portions 64a and 64b. There is a gap between the opposing wall surfaces.

このような保持部材60は、平板状の金属板を打ち抜き、部分的に曲げ加工することで形成することができる。詳しくは、図4に示す形状に、平板状の金属板を打ち抜く。この段階で、繋ぎ部66a,66b、ばね部65a,65b、連結部64a,64b、及び係止部63a,63bは、基部61と同一の平面上に構成されている。この平板状の保持部材60に対し、繋ぎ部66a,66bとばね部65a,65bとの境界68(破線)を略90°折り曲げ、ばね部65a,65bを略U字状に曲げ加工する。また、ばね部65a,65bと連結部64a,64bの境界69(破線)を略90°折り曲げる。このようにして、1つの金属板から図3に示す保持部材60が形成されている。したがって、係止部63a,63bは、曲げ加工せずに打ち抜き加工のみによって形成されている。   Such a holding member 60 can be formed by punching a flat metal plate and partially bending it. Specifically, a flat metal plate is punched into the shape shown in FIG. At this stage, the connecting portions 66a and 66b, the spring portions 65a and 65b, the connecting portions 64a and 64b, and the locking portions 63a and 63b are configured on the same plane as the base portion 61. With respect to the flat holding member 60, the boundary 68 (broken line) between the connecting portions 66a and 66b and the spring portions 65a and 65b is bent by approximately 90 °, and the spring portions 65a and 65b are bent into a substantially U shape. Further, the boundary 69 (broken line) between the spring portions 65a and 65b and the connecting portions 64a and 64b is bent by approximately 90 °. In this way, the holding member 60 shown in FIG. 3 is formed from one metal plate. Accordingly, the locking portions 63a and 63b are formed only by punching without bending.

次に、保持部材60による、配線基板31上へのコネクタ50の保持方法について説明する。先ず、上記した保持部材60の基部61を、コネクタ50の溝部54に挿入して固定する。そして、図5に示すように、配線基板31の表面31a側から裏面31b側の方向(図中の白抜き矢印方向)に、係止部63a,63b側から貫通孔34に保持部材60を挿入する。ここで、係止部63a,63bは、角部の先端間の距離が貫通孔34の幅Dよりも長い長さとなっている。しかしながら、係止部63a,63bは楔形状となっており、ばね部65a,65bがその板厚方向に弾性変形可能となっている。したがって、図5に示す白抜き矢印方向に保持部材60(コネクタ50)を押し込み、係止部63a,63bが配線基板31に接触すると、楔状の係止部63a,63bが、その傾斜に沿って貫通孔34の内側へ移動するように、ばね部65a,65bが基部61によって支えられた部位を支点として変位(弾性変形)する。詳しくは、図5に示すように、略U字状のばね部65a,65bにおいて、少なくとも折り返し部における連結部64a,64bとの連結端側が上方に変位する。このばね部65a,65bの変位により、楔状の係止部63a,63bが貫通孔34内に挿入される。また、連結部64a,64b自体は弾性変形を殆んどせず、固定状態(又は挿入前の状態)に対して傾いた状態となる。すなわち、ばね部65a,65bは、連結部64a,64bが傾いて係止部63a,63bが貫通孔34内に挿入されるように変位する。なお、図5に示す一点鎖線は、比較として、変位されない状態のばね部65aを示している。   Next, a method for holding the connector 50 on the wiring board 31 by the holding member 60 will be described. First, the base 61 of the holding member 60 described above is inserted into the groove 54 of the connector 50 and fixed. Then, as shown in FIG. 5, the holding member 60 is inserted into the through-hole 34 from the locking portions 63 a and 63 b in the direction from the front surface 31 a side to the back surface 31 b side of the wiring substrate 31 (in the direction of the white arrow in the figure). To do. Here, the engaging portions 63 a and 63 b have a length that is longer than the width D of the through-hole 34. However, the locking portions 63a and 63b are wedge-shaped, and the spring portions 65a and 65b can be elastically deformed in the plate thickness direction. Therefore, when the holding member 60 (connector 50) is pushed in the direction of the white arrow shown in FIG. 5 and the locking portions 63a and 63b come into contact with the wiring board 31, the wedge-shaped locking portions 63a and 63b follow the inclination. The spring portions 65a and 65b are displaced (elastically deformed) with the portion supported by the base portion 61 as a fulcrum so as to move to the inside of the through hole 34. Specifically, as shown in FIG. 5, in the substantially U-shaped spring portions 65a and 65b, at least the connection end side of the folded portion with the connection portions 64a and 64b is displaced upward. Due to the displacement of the spring portions 65 a and 65 b, wedge-shaped locking portions 63 a and 63 b are inserted into the through holes 34. Further, the connecting portions 64a and 64b themselves hardly undergo elastic deformation, and are inclined with respect to the fixed state (or the state before insertion). That is, the spring portions 65 a and 65 b are displaced so that the connecting portions 64 a and 64 b are inclined and the locking portions 63 a and 63 b are inserted into the through holes 34. In addition, the dashed-dotted line shown in FIG. 5 has shown the spring part 65a of the state which is not displaced as a comparison.

そして、ばね部65a,65bの弾性変形による反力(復元力)によって貫通孔34の壁面に係止部63a,63bの角部を接触させつつ保持部材60(コネクタ50)をさらに押し込むと、係止部63a,63bが貫通孔34を通り抜ける。そして、ばね部65a,65bの反力により、図6(a),(b)に示すように、係止部63a,63bの少なくとも一部が、配線基板31の裏面であって貫通孔34の開口周辺上に位置することとなる。このようにして、本実施形態においては、コネクタ50が配線基板31に保持されている。   When the holding member 60 (connector 50) is further pushed in while the corner portions of the locking portions 63a and 63b are brought into contact with the wall surface of the through hole 34 by the reaction force (restoring force) due to elastic deformation of the spring portions 65a and 65b, The stop parts 63a and 63b pass through the through hole 34. Then, due to the reaction force of the spring portions 65 a and 65 b, as shown in FIGS. 6A and 6B, at least a part of the locking portions 63 a and 63 b is the back surface of the wiring board 31 and the through holes 34. It will be located on the periphery of the opening. Thus, in this embodiment, the connector 50 is held on the wiring board 31.

また、本実施形態においては、端子51として、対応する貫通孔33に挿入された状態で、フローはんだ付けにより貫通孔33の壁面及び開口周辺に形成されたランドと接続される挿入実装構造の端子を使用しており、端子51とともに保持部材60もフローはんだ付けされる。このフローはんだ付けでは、保持部材60が貫通孔34に挿入され、係止部63a,63bが配線基板31の裏面31b上の位置する状態で、配線基板31の裏面31b全体若しくは局部が溶融はんだに浸される。そして、貫通孔34の壁面及び開口周辺に形成されたメッキ層及び保持部材60の脚部62a,62bが溶融はんだで濡れ、溶融はんだが、係止部63a,63b及び連結部64a,64bの表面や貫通孔34の壁面を伝って、貫通孔34内に吸い上げられる。そして、図7に示すように、溶融されたはんだ35は、配線基板31の表面31a上まで吸い上げられる。これにより、配線基板31の表面31a上には、連結部64a,64bと配線基板31の表面31aを覆うはんだ35のフィレットが形成される。また、配線基板31の裏面31b上には、係止部63a,63bと配線基板31の裏面31bを覆うはんだ35のフィレットが形成される。このようにして、本実施形態では、保持部材60も貫通孔34の壁面及び開口周辺に形成されたメッキ層と、はんだ35を介して接続されている。   Further, in the present embodiment, as a terminal 51, a terminal of an insertion mounting structure that is connected to a land formed around the wall surface of the through hole 33 and the opening by flow soldering while being inserted into the corresponding through hole 33. The holding member 60 is also flow soldered together with the terminals 51. In this flow soldering, with the holding member 60 inserted into the through-hole 34 and the locking portions 63a and 63b positioned on the back surface 31b of the wiring substrate 31, the entire back surface 31b or local portion of the wiring substrate 31 is made of molten solder. Soaked. Then, the plated layer formed on the wall surface of the through hole 34 and the periphery of the opening and the legs 62a and 62b of the holding member 60 are wetted by the molten solder, and the molten solder is exposed to the surfaces of the locking portions 63a and 63b and the connecting portions 64a and 64b. Or is sucked into the through hole 34 along the wall surface of the through hole 34. As shown in FIG. 7, the melted solder 35 is sucked up onto the surface 31 a of the wiring board 31. As a result, a fillet of solder 35 is formed on the surface 31 a of the wiring board 31 so as to cover the connecting portions 64 a and 64 b and the surface 31 a of the wiring board 31. Further, on the back surface 31 b of the wiring substrate 31, a fillet of solder 35 that covers the locking portions 63 a and 63 b and the back surface 31 b of the wiring substrate 31 is formed. Thus, in this embodiment, the holding member 60 is also connected to the plating layer formed on the wall surface of the through hole 34 and the periphery of the opening via the solder 35.

このように、本実施形態に示した保持部材60、該保持部材60を有するコネクタ50、及び該コネクタ50を有する電子制御装置1では、以下に示す特徴がある。先ず、保持部材60が、同一の金属板を開口してなる基部61と脚部62(62a,62b)を有し、脚部62が、貫通孔34を通り抜け、固定状態で配線基板31の裏面31bにおける開口周辺上に位置する係止部63(63a,63b)を有している。また、連結部64(64a,64b)を介して係止部63と連結されたばね部65(65a,65b)の変位により、係止部63は貫通孔34を通り抜け、配線基板31の裏面31b上に位置される。この係止部63は、脚部62を貫通孔34から引き抜こうとする外力(配線基板31からコネクタ50を外そうとする外力)が作用した際に配線基板31の裏面31bに係止する。したがって、従来よりも、引っ張りに対する耐力が向上されており、これにより、配線基板31に対するコネクタ50の保持強度を向上することができる。すなわち、少なくとも端子51のはんだ付け前の状態で、従来よりもコネクタ50を配線基板31から外れにくくすることができる。   As described above, the holding member 60, the connector 50 having the holding member 60, and the electronic control device 1 having the connector 50 described in the present embodiment have the following characteristics. First, the holding member 60 has a base portion 61 and a leg portion 62 (62a, 62b) formed by opening the same metal plate, and the leg portion 62 passes through the through hole 34 and is fixed to the back surface of the wiring board 31. It has the latching | locking part 63 (63a, 63b) located on the opening periphery in 31b. Further, due to the displacement of the spring portion 65 (65a, 65b) connected to the locking portion 63 via the connecting portion 64 (64a, 64b), the locking portion 63 passes through the through hole 34, and on the back surface 31b of the wiring board 31. Located in. The engaging portion 63 is engaged with the back surface 31 b of the wiring board 31 when an external force (external force for removing the connector 50 from the wiring board 31) is applied to pull out the leg 62 from the through hole 34. Therefore, the strength against pulling is improved as compared with the conventional case, whereby the holding strength of the connector 50 with respect to the wiring board 31 can be improved. That is, at least before the terminals 51 are soldered, it is possible to make the connector 50 less likely to come off the wiring board 31 than before.

また、脚部62において、配線基板31に係止する係止部63とばね部65とが互いに異なる位置に構成されており、ばね部65が貫通孔34内に挿入されないようになっている。すなわち、ばね部65は、それ自体がその変形による反力で配線基板31に係止するのではなく、係止部63(及び連結部64)を貫通孔34内に挿入させ、係止部63が貫通孔34を通り抜けた際には係止部63を配線基板31の裏面上に位置させることのできるばね性を有していれば良い。換言すれば、係止部63(及び連結部64)を貫通孔34内に挿入させる際に、係止部63の角部が貫通孔34の壁面に強く当たるようなばね性は必要とせず、これにより、貫通孔34に対する係止部63(及び連結部64)の挿入力を低減することができる。したがって、従来のように、貫通孔の壁面にばね部自体が係止する構成に比べて、貫通孔34の壁面(壁面上に形成されたメッキ層)の損傷を低減することができる。また、ばね部65の設計自由度を向上することもできる。   Further, in the leg portion 62, the locking portion 63 that locks the wiring board 31 and the spring portion 65 are configured at different positions, so that the spring portion 65 is not inserted into the through hole 34. That is, the spring portion 65 itself does not lock onto the wiring board 31 by the reaction force due to its deformation, but causes the locking portion 63 (and the connecting portion 64) to be inserted into the through hole 34, thereby locking the locking portion 63. However, it is only necessary to have a spring property that allows the locking portion 63 to be positioned on the back surface of the wiring board 31 when passing through the through hole 34. In other words, when inserting the locking portion 63 (and the connecting portion 64) into the through hole 34, there is no need for a spring property such that the corner portion of the locking portion 63 strongly hits the wall surface of the through hole 34, Thereby, the insertion force of the latching | locking part 63 (and connection part 64) with respect to the through-hole 34 can be reduced. Therefore, damage to the wall surface of the through hole 34 (plated layer formed on the wall surface) can be reduced as compared with the conventional configuration in which the spring portion itself is locked to the wall surface of the through hole. Moreover, the design freedom of the spring part 65 can also be improved.

また、本実施形態では、ばね部65における幅Wが金属板の板厚Tよりも広くなっている。したがって、ばね部65の強度を高めて、係止部63(及び連結部64)を貫通孔34内に挿入させる際や脚部62を貫通孔34から引き抜こうとする外力が作用した際に、ばね部65の変形や破損を抑制することができる。   In the present embodiment, the width W of the spring portion 65 is wider than the plate thickness T of the metal plate. Therefore, when the strength of the spring portion 65 is increased and the locking portion 63 (and the connecting portion 64) is inserted into the through hole 34 or when an external force is applied to pull out the leg portion 62 from the through hole 34, the spring The deformation and breakage of the portion 65 can be suppressed.

また、本実施形態では、係止部63が金属板を打ち抜き加工することのみで形成されている。このように、打ち抜き加工のみによって係止部63を形成すると、曲げ加工よりも変形や破損に対して耐力を向上することができる。これにより、配線基板31に対するコネクタ50の保持強度をさらに向上することができる。   Moreover, in this embodiment, the latching | locking part 63 is formed only by stamping a metal plate. Thus, if the latching | locking part 63 is formed only by a punching process, yield strength can be improved with respect to a deformation | transformation and a damage rather than a bending process. Thereby, the holding strength of the connector 50 with respect to the wiring board 31 can be further improved.

また、本実施形態においては、ばね部65を略U字状としている。このように略U字状のような折り返し形状のばね部65を採用すると、延設方向(長手方向)のバネ長を長くしてばね部65の変位量(ストローク)を大きくすることができる。したがって、係止部63の長さを長くして、係止部63を配線基板31の裏面31bから外れにくくすることができる。すなわち、貫通孔34からの脚部62の抜け(配線基板31からのコネクタ50の外れ)を抑制することができる。   Moreover, in this embodiment, the spring part 65 is made into the substantially U shape. When the folded spring portion 65 such as a substantially U shape is employed in this way, the spring length in the extending direction (longitudinal direction) can be increased to increase the displacement (stroke) of the spring portion 65. Therefore, it is possible to increase the length of the locking portion 63 and make it difficult for the locking portion 63 to come off the back surface 31 b of the wiring board 31. That is, it is possible to prevent the leg portion 62 from coming off from the through hole 34 (detachment of the connector 50 from the wiring board 31).

また、本実施形態においては、保持部材60が、基部61から同一方向に延設された互いに対向する一対の脚部62a,62bを有し、各脚部62a,62bにおける係止部63a,63bは、対応する連結部64a,64bからの延設方向が、互いに反対方向となっている。このように、1つの基部61から複数の脚部62が延設された構成とすると、基部61から1本の脚部62のみが延設された構成に比べて、配線基板31に対するコネクタ50の保持強度を向上することができる。また、対をなす係止部63a,63bが互いに異なる方向に延びているので、対をなす係止部63a,63bが互いに同一方向に延びた構成に比べて、配線基板31に対するがたつきを低減することができる。これにより、係止部63a,63bを配線基板31の裏面31bから外れにくくすることができる。特に本実施形態においては、対をなす係止部63a,63bが互いに反対方向に延びているので、がたつきを効果的に低減することができる。   In the present embodiment, the holding member 60 has a pair of opposite leg portions 62a and 62b extending in the same direction from the base portion 61, and the locking portions 63a and 63b in the leg portions 62a and 62b. The extending directions from the corresponding connecting portions 64a and 64b are opposite to each other. As described above, when the plurality of leg portions 62 are extended from one base portion 61, the connector 50 with respect to the wiring board 31 is compared with the configuration in which only one leg portion 62 is extended from the base portion 61. Holding strength can be improved. In addition, since the paired locking portions 63a and 63b extend in different directions, the backlash of the wiring board 31 is less than that of the configuration in which the paired locking portions 63a and 63b extend in the same direction. Can be reduced. Thereby, it is possible to make it difficult for the locking portions 63 a and 63 b to be detached from the back surface 31 b of the wiring substrate 31. In particular, in the present embodiment, the locking portions 63a and 63b forming a pair extend in opposite directions, so that the rattling can be effectively reduced.

また、本実施形態においては、保持部材60の脚部62a,62bが挿入される貫通孔34が一方向に長い長孔となっており、各脚部62a,62bにおける係止部63a,63bが、貫通孔34の長手方向に沿って連結部64a,64bから延び、且つ、連結部64a,64bからの延設方向が互いに反対方向となっている。そして、係止部63a,63bが、配線基板31の裏面31bにおける貫通孔34の長手側の開口周辺上に位置するようになっている。このように、貫通孔34を長孔とすると、断面積が同じ円形の貫通孔と比べて、挿入時における連結部64a,64bの傾きを大きくとることができる。すなわち、ばね部65a,65bの反力を小さくし、貫通孔34に対する係止部63a,63b(及び連結部64a,64b)の挿入力を低減することができる。したがって、貫通孔34に係止部63a,63b及び連結部64a,64bを挿入する際に、貫通孔34の壁面の損傷を低減することができる。また、本実施形態では、貫通孔34の長手方向を、コネクタ50のハウジング52の短手方向(前後方向)と略平行としている。したがって、配線基板31における配線の配置自由度を向上することもできる。   Further, in the present embodiment, the through hole 34 into which the leg portions 62a and 62b of the holding member 60 are inserted is a long hole in one direction, and the locking portions 63a and 63b in the leg portions 62a and 62b are formed. , Extending from the connecting portions 64a and 64b along the longitudinal direction of the through hole 34, and extending directions from the connecting portions 64a and 64b are opposite to each other. The locking portions 63 a and 63 b are positioned on the periphery of the opening on the longitudinal side of the through hole 34 in the back surface 31 b of the wiring substrate 31. Thus, when the through hole 34 is a long hole, the inclination of the connecting portions 64a and 64b at the time of insertion can be made larger than that of a circular through hole having the same cross-sectional area. That is, the reaction force of the spring portions 65a and 65b can be reduced, and the insertion force of the locking portions 63a and 63b (and the connecting portions 64a and 64b) into the through hole 34 can be reduced. Therefore, when the engaging portions 63a and 63b and the connecting portions 64a and 64b are inserted into the through hole 34, damage to the wall surface of the through hole 34 can be reduced. In the present embodiment, the longitudinal direction of the through hole 34 is substantially parallel to the short direction (front-rear direction) of the housing 52 of the connector 50. Accordingly, it is possible to improve the degree of freedom of wiring arrangement on the wiring board 31.

また、本実施形態においては、固定状態で、連結部64が貫通孔34の壁面と接しないようになっている。すなわち、連結部64の外側部位と貫通孔34との間に隙間が存在するため、フロー半田付けを実施する場合には、毛細管現象により、この隙間を伝って溶融はんだが吸い上げられ易くなる。すなわち、はんだを介した保持部材60と配線基板31(メッキ層)との接続信頼性を向上することができる。   In the present embodiment, the connecting portion 64 is not in contact with the wall surface of the through hole 34 in a fixed state. That is, since there is a gap between the outer portion of the connecting portion 64 and the through-hole 34, when performing flow soldering, molten solder is easily sucked up through this gap due to capillary action. That is, the connection reliability between the holding member 60 and the wiring board 31 (plating layer) via solder can be improved.

(第2実施形態)
次に、本発明の第2実施形態を、図8及び図9に基づいて説明する。図8は、第2実施形態に係る保持部材の概略構成を示す斜視図である。図9は、図8に示す保持部材のうち、脚部の展開図である。
(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a perspective view illustrating a schematic configuration of a holding member according to the second embodiment. FIG. 9 is a developed view of the leg portion of the holding member shown in FIG.

第2実施形態に係る保持部材、該保持部材を有するコネクタ、及び該コネクタを有する電子制御装置は、上記した実施形態に示したものと共通するところが多いので、以下、共通部分については詳しい説明は省略し、異なる部分を重点的に説明する。なお、上記した各実施形態に示した要素と同一の要素には、同一の符号を付与するものとする。   Since the holding member according to the second embodiment, the connector having the holding member, and the electronic control device having the connector are often in common with those shown in the above-described embodiment, the detailed description of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

第1実施形態においては、ばね部65(65a,65b)が、略U字状である例を示した。しかしながら、ばね部65の形状は、上記例に限定されるものではない。その変位により、貫通孔34への係止部63及び連結部64を挿入でき、且つ、係止部63を、配線基板31の裏面31b上に位置させることができれば良い。本実施形態においては、図8に示すように、ばね部65(65a,65b)として平板状の板バネを採用している。なお、図8に示す例でも、同一の基部61から一対の脚部62a,62bが延設されている。   In 1st Embodiment, the spring part 65 (65a, 65b) showed the example which is substantially U shape. However, the shape of the spring portion 65 is not limited to the above example. It is only necessary that the displacement portion 63 and the connecting portion 64 can be inserted into the through-hole 34 and the engagement portion 63 can be positioned on the back surface 31 b of the wiring substrate 31 by the displacement. In this embodiment, as shown in FIG. 8, a flat plate spring is employed as the spring portion 65 (65a, 65b). In the example shown in FIG. 8, a pair of leg portions 62 a and 62 b are extended from the same base portion 61.

詳しくは、一方の脚部62aで説明すると、略矩形状の平板である基部61と同一平面で、クランク状の繋ぎ部66aが基部61から下方に延設されている。そして、繋ぎ部66aから略90°に折り曲げられて、平板状のばね部65aが延設されている。このばね部65aは、変位していない状態で、配線基板31の表面31aと略平行となっている。そして、ばね部65aの端部から略90°に折り曲げられて、第1実施形態同様の連結部64aが延設されている。また、直線状の連結部64aの下端と同一平面で、係止部63aが連結部64aから前(後)方向に延設されている。すなわち、ばね部65aと繋ぎ部66a以外の構成は、第1実施形態と同じとなっている。   Specifically, when described with one leg portion 62a, a crank-like connecting portion 66a extends downward from the base portion 61 on the same plane as the base portion 61 which is a substantially rectangular flat plate. The flat spring portion 65a is extended from the connecting portion 66a by being bent at approximately 90 °. The spring portion 65a is substantially parallel to the surface 31a of the wiring board 31 when not displaced. And the connection part 64a similar to 1st Embodiment is extendedly bent by about 90 degrees from the edge part of the spring part 65a. Further, the locking portion 63a extends in the front (rear) direction from the connecting portion 64a on the same plane as the lower end of the linear connecting portion 64a. That is, the configuration other than the spring portion 65a and the connecting portion 66a is the same as that of the first embodiment.

このような保持部材60も、平板状の金属板を打ち抜き、部分的に曲げ加工することで形成することができる。詳しくは、図9に示す形状に、平板状の金属板を打ち抜く。この段階で、繋ぎ部66a,66b、ばね部65a,65b、連結部64a,64b、及び係止部63a,63bは、基部61と同一の平面上に構成されている。この平板状の保持部材60に対し、繋ぎ部66a,66bとばね部65a,65bとの境界70(破線)を略90°折り曲げる。また、ばね部65a,65bと連結部64a,64bの境界71(破線)を、上記折り曲げ方向とは反対に略90°折り曲げる。このようにして、1つの金属板から図8に示す保持部材60が形成される。この場合も、係止部63a,63bは、曲げ加工せずに打ち抜き加工のみによって形成される。   Such a holding member 60 can also be formed by punching a flat metal plate and bending it partially. Specifically, a flat metal plate is punched into the shape shown in FIG. At this stage, the connecting portions 66a and 66b, the spring portions 65a and 65b, the connecting portions 64a and 64b, and the locking portions 63a and 63b are configured on the same plane as the base portion 61. With respect to the flat holding member 60, the boundary 70 (broken line) between the connecting portions 66a and 66b and the spring portions 65a and 65b is bent by approximately 90 °. Further, the boundary 71 (broken line) between the spring portions 65a and 65b and the connecting portions 64a and 64b is bent approximately 90 ° opposite to the bending direction. In this way, the holding member 60 shown in FIG. 8 is formed from one metal plate. Also in this case, the locking portions 63a and 63b are formed only by punching without bending.

このように、平板状のばね部65(65a,65b)を採用した場合、保持部材60(コネクタ50)を配線基板31側へ押し込み、係止部63a,63bが配線基板31に接触すると、楔状の係止部63a,63bが、その傾斜に沿って貫通孔34の内側へ移動するように、ばね部65a,65bが基部61(繋ぎ部66a,66b)によって支えられた部位を支点として変位(弾性変形)する。詳しくは、平板状のばね部65a,65bにおいて、少なくとも連結部64a,64bとの連結端側が上方に変位する。このばね部65a,65bの変位により、楔状の係止部63a,63bが貫通孔34内に挿入される。また、連結部64a,64b自体は弾性変形を殆んどせず、固定状態(又は挿入前の状態)に対して傾いた状態となる。すなわち、ばね部65a,65bは、連結部64a,64bが傾いて係止部63a,63bが貫通孔34内に挿入されるように変位する。そして、ばね部65a,65bの弾性変形による反力(復元力)によって貫通孔34の壁面に係止部63a,63bの角部を接触させつつ保持部材60(コネクタ50)をさらに押し込むと、係止部63a,63bが貫通孔34を通り抜ける。そして、ばね部65a,65bの反力により、係止部63a,63bの少なくとも一部が、配線基板31の裏面であって貫通孔34の開口周辺上に位置することとなる。このように、保持部材60のばね部65として、平板状の板バネを採用することもできる。平板状のばね部65を採用すると、略U字状のような曲げ加工を不要とすることができる。   In this way, when the flat spring portion 65 (65a, 65b) is employed, when the holding member 60 (connector 50) is pushed into the wiring board 31 side and the locking portions 63a, 63b come into contact with the wiring board 31, a wedge shape is obtained. The locking portions 63a and 63b of the springs 65a and 65b are displaced with the portion supported by the base 61 (the connecting portions 66a and 66b) as a fulcrum so that the locking portions 63a and 63b move to the inside of the through hole 34 along the inclination thereof ( Elastic deformation). Specifically, in the flat spring portions 65a and 65b, at least the connecting end side with the connecting portions 64a and 64b is displaced upward. Due to the displacement of the spring portions 65 a and 65 b, wedge-shaped locking portions 63 a and 63 b are inserted into the through holes 34. Further, the connecting portions 64a and 64b themselves hardly undergo elastic deformation, and are inclined with respect to the fixed state (or the state before insertion). That is, the spring portions 65 a and 65 b are displaced so that the connecting portions 64 a and 64 b are inclined and the locking portions 63 a and 63 b are inserted into the through holes 34. When the holding member 60 (connector 50) is further pushed in while the corner portions of the locking portions 63a and 63b are brought into contact with the wall surface of the through hole 34 by the reaction force (restoring force) due to elastic deformation of the spring portions 65a and 65b, The stop parts 63a and 63b pass through the through hole 34. Then, due to the reaction force of the spring portions 65 a and 65 b, at least a part of the locking portions 63 a and 63 b is located on the back surface of the wiring substrate 31 and on the periphery of the opening of the through hole 34. In this manner, a flat plate spring can be employed as the spring portion 65 of the holding member 60. When the flat spring portion 65 is employed, a bending process such as a substantially U shape can be eliminated.

なお、図8に示すばね部65a,65bは、その延設方向(長手方向)に直線状となっている。しかしながら、平板状の板バネとしては、例えば図10に示す略コの字状のばね部65(65a,65b)のように、折り返し形状のものを採用することもできる。この場合、平板状であっても、その延設方向のバネ長を長くし、ばね部65の変位量(ストローク)を大きくすることができる。なお、略コの字状以外にも蛇行形状などを採用することができる。なお、図10に示す保持部材60も、平板状の金属板を図11に示すように打ち抜き、繋ぎ部66a,66bとばね部65a,65bとの境界72(破線)を略90°折り曲げ、ばね部65a,65bと連結部64a,64bの境界73(破線)を、上記折り曲げ方向とは反対に略90°折り曲げることで、得ることができる。図10は、変形例を示す斜視図である。図11は、図10に示す保持部材のうち、脚部の展開図である。   In addition, the spring parts 65a and 65b shown in FIG. 8 are linear in the extending direction (longitudinal direction). However, as the flat plate spring, a folded shape such as a substantially U-shaped spring portion 65 (65a, 65b) shown in FIG. 10 may be employed. In this case, even if it is flat, the spring length in the extending direction can be increased, and the displacement amount (stroke) of the spring portion 65 can be increased. In addition to the substantially U-shape, a meandering shape can be adopted. The holding member 60 shown in FIG. 10 is also formed by punching a flat metal plate as shown in FIG. 11, bending the boundary 72 (broken line) between the connecting portions 66a and 66b and the spring portions 65a and 65b by approximately 90 °, The boundary 73 (broken line) between the portions 65a and 65b and the connecting portions 64a and 64b can be obtained by bending approximately 90 ° opposite to the bending direction. FIG. 10 is a perspective view showing a modification. FIG. 11 is a development view of a leg portion of the holding member shown in FIG. 10.

(第3実施形態)
次に、本発明の第3実施形態を、図12及び図13に基づいて説明する。図12は、係止部によるメッキ層損傷を説明するための模式的な部分断面図である。図13は、(a),(b)ともに、第3実施形態に係る保持部材のうち、係止部の概略構成を示す平面図である。
(Third embodiment)
Next, 3rd Embodiment of this invention is described based on FIG.12 and FIG.13. FIG. 12 is a schematic partial cross-sectional view for explaining plating layer damage due to the locking portion. FIG. 13: is a top view which shows schematic structure of a latching | locking part among the holding members which concern on 3rd Embodiment, (a), (b).

第3実施形態に係る保持部材、該保持部材を有するコネクタ、及び該コネクタを有する電子制御装置は、上記した実施形態に示したものと共通するところが多いので、以下、共通部分については詳しい説明は省略し、異なる部分を重点的に説明する。なお、上記した各実施形態に示した要素と同一の要素には、同一の符号を付与するものとする。   Since the holding member according to the third embodiment, the connector having the holding member, and the electronic control unit having the connector are often in common with those shown in the above-described embodiment, detailed descriptions of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

上記した実施形態においては、係止部63の角部の形状については特に言及しなかった。例えば、図12に示すように、係止部63(63a,63b)の角部74が角張った形状(90°以下の角度)の場合、貫通孔34への脚部62(62a,62b)の挿入時において、係止部63が貫通孔34を突き抜ける際に、係止部63の少なくとも一部が突き抜けつつばね部65(65a,65b)の反力(復元力)で貫通孔34よりも外側へ移動する。したがって、角部74が貫通孔34の壁面及び開口周辺に形成されたメッキ層36のうち、壁面端部(開口部)のメッキ層36aを削り取る(跳ね飛ばす)恐れがある。なお、図12においては、係止部63が貫通孔34を突き抜ける直前の状態を実線で示し、配線基板31の裏面31b上に位置された状態を一点鎖線で示している。   In the above-described embodiment, the shape of the corner portion of the locking portion 63 is not particularly mentioned. For example, as shown in FIG. 12, when the corner portion 74 of the locking portion 63 (63a, 63b) has an angular shape (angle of 90 ° or less), the leg portion 62 (62a, 62b) to the through hole 34 At the time of insertion, when the latching portion 63 penetrates the through hole 34, at least a part of the latching portion 63 penetrates and the reaction force (restoring force) of the spring portion 65 (65 a, 65 b) is outside the through hole 34. Move to. Therefore, there is a risk that the corner portion 74 may scrape (bounce off) the plating layer 36a at the end portion of the wall surface (opening portion) in the plating layer 36 formed around the wall surface of the through hole 34 and the opening. In FIG. 12, the state immediately before the locking portion 63 penetrates the through hole 34 is indicated by a solid line, and the state positioned on the back surface 31 b of the wiring substrate 31 is indicated by a dashed line.

これに対し、図13(a)に示す例では、上下方向に垂直な方向(本実施形態では第1実施形態同様に前後方向)において、係止部63のうち、固定状態で貫通孔34から最も離れた位置となる角部74が、90°よりも大きい角を複数(図13(a)では3つ)繋いでなる多角形状となっている。また、図13(b)に示す例では、角部74が、丸みを帯びた形状となっている。係止部63における角部74の形状を上記形状とすると、メッキ層36aにかかる圧力が小さくなり、角部74によるメッキ層削りを抑制することができる。   On the other hand, in the example shown in FIG. 13A, in the direction perpendicular to the vertical direction (in the present embodiment, the front-rear direction as in the first embodiment), the locking portion 63 is fixed from the through hole 34 in the fixed state. The corner portion 74 at the farthest position has a polygonal shape formed by connecting a plurality of angles (three in FIG. 13A) larger than 90 °. In the example shown in FIG. 13B, the corner 74 has a rounded shape. When the shape of the corner portion 74 in the locking portion 63 is the above shape, the pressure applied to the plating layer 36a is reduced, and the plating layer shaving due to the corner portion 74 can be suppressed.

(第4実施形態)
次に、本発明の第4実施形態を、図14及び図15に基づいて説明する。図14は、第4実施形態に係る電子制御装置において、保持部材の脚部と配線基板の貫通孔との関係を示す部分断面図である。図15は、保持部材によってコネクタが配線基板上に保持された状態を示す部分断面図である。
(Fourth embodiment)
Next, 4th Embodiment of this invention is described based on FIG.14 and FIG.15. FIG. 14 is a partial cross-sectional view showing the relationship between the leg portion of the holding member and the through hole of the wiring board in the electronic control device according to the fourth embodiment. FIG. 15 is a partial cross-sectional view showing a state where the connector is held on the wiring board by the holding member.

第4実施形態に係る保持部材、該保持部材を有するコネクタ、及び該コネクタを有する電子制御装置は、上記した実施形態に示したものと共通するところが多いので、以下、共通部分については詳しい説明は省略し、異なる部分を重点的に説明する。なお、上記した各実施形態に示した要素と同一の要素には、同一の符号を付与するものとする。   Since the holding member according to the fourth embodiment, the connector having the holding member, and the electronic control device having the connector are often in common with those shown in the above-described embodiment, detailed descriptions of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

上記した実施形態では、ばね部65が変位されない状態で、基部61から同一方向に延設された一対の脚部62a,62bにおいて、連結部64a,64bの外側部位間の距離Sが、貫通孔34の幅(内径)Dよりも短い例を示した。これに対し、本実施形態においては、図14に示すように、互いに対向する一対の脚部62a,62bにおいて、連結部64a,64bの外側部位間の距離Sが、貫通孔34の幅D以上の長さとなっている。このような構成とすると、図15に示すように、固定状態で、連結部64a,64bの少なくとも一部が貫通孔34の壁面にそれぞれ接することとなる。したがって、固定状態で、保持部材60が配線基板31に確実に接することとなるので、配線基板31とコネクタ50とのがたつきを抑制することができる。なお、この場合、ばね部65a,65bは、固定状態でも、少なからず変位した状態となる。   In the above-described embodiment, the distance S between the outer portions of the connecting portions 64a and 64b in the pair of leg portions 62a and 62b extending in the same direction from the base portion 61 without the spring portion 65 being displaced is the through hole. An example shorter than the width (inner diameter) D of 34 is shown. On the other hand, in the present embodiment, as shown in FIG. 14, in a pair of leg portions 62a and 62b facing each other, the distance S between the outer portions of the connecting portions 64a and 64b is equal to or greater than the width D of the through hole 34. It has become the length. With such a configuration, as shown in FIG. 15, at least a part of the connecting portions 64 a and 64 b comes into contact with the wall surface of the through hole 34 in a fixed state. Therefore, since the holding member 60 is surely in contact with the wiring board 31 in a fixed state, rattling between the wiring board 31 and the connector 50 can be suppressed. In this case, the spring portions 65a and 65b are not displaced in a fixed state.

また、連結部64a,64bとして、例えば図14に示すように上下方向に沿う直線状のものを採用すると、固定状態で、図15に示すように、連結部64a,64bにおける外側部位間の幅Sを、配線基板31の裏面31bにおける貫通孔34の開口部での幅S1のほうが、表面31aにおける貫通孔34の開口部での幅S2よりも狭くなる。すなわち、連結部64a,64bの外側部位と貫通孔34の対向する壁面との間に、配線基板31の裏面31bにおける貫通孔34の開口部から表面31a側の所定範囲まで隙間75が生じることとなる。したがって、配線基板31の裏面31b側からフローはんだ付けを実施する場合に、毛細管現象によって隙間75を溶融はんだが伝わり、配線基板31の表面31a側へはんだを吸い上げ易くすることができる。   Further, when the connecting portions 64a and 64b are linear, for example, as shown in FIG. 14, the width between the outer portions of the connecting portions 64a and 64b in a fixed state as shown in FIG. The width S1 at the opening of the through hole 34 on the back surface 31b of the wiring board 31 is smaller than the width S2 at the opening of the through hole 34 on the front surface 31a. That is, a gap 75 is generated between the outer portion of the coupling portions 64a and 64b and the wall surface facing the through hole 34 from the opening of the through hole 34 on the back surface 31b of the wiring board 31 to a predetermined range on the front surface 31a side. Become. Therefore, when flow soldering is performed from the back surface 31 b side of the wiring board 31, the molten solder is transmitted through the gap 75 by a capillary phenomenon, and the solder can be easily sucked up to the front surface 31 a side of the wiring board 31.

なお、例えば図16に示すように、連結部64a,64bの幅Hが、係止部63a,63bとの連結端からばね部65a,65bの連結端に向けて広くされた形状の連結部64a,64bを有する保持部材60を採用しても、隙間75の効果を期待することができる。この場合、固定状態で、ばね部65a,65bが変位しないようにすることもできる。図16は、変形例を示す部分断面図である。   For example, as shown in FIG. 16, the connecting portion 64a has a shape in which the width H of the connecting portions 64a and 64b is increased from the connecting end with the locking portions 63a and 63b toward the connecting end of the spring portions 65a and 65b. , 64b, the effect of the gap 75 can be expected. In this case, it is possible to prevent the spring portions 65a and 65b from being displaced in a fixed state. FIG. 16 is a partial cross-sectional view showing a modification.

(第5実施形態)
次に、本発明の第5実施形態を、図17に基づいて説明する。図17は、第5実施形態に係る電子制御装置のうち、特徴部分である保持部材の周辺を拡大した部分断面図であり、(a)は、配線基板の厚さがP1、(b)は配線基板の厚さがP2(>P1)の場合を示している。
(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 17 is an enlarged partial cross-sectional view of the periphery of the holding member, which is a characteristic part, in the electronic control device according to the fifth embodiment. FIG. 17A shows the thickness of the wiring board P1, and FIG. The case where the thickness of the wiring board is P2 (> P1) is shown.

第5実施形態に係る保持部材、該保持部材を有するコネクタ、及び該コネクタを有する電子制御装置は、上記した実施形態に示したものと共通するところが多いので、以下、共通部分については詳しい説明は省略し、異なる部分を重点的に説明する。なお、上記した各実施形態に示した要素と同一の要素には、同一の符号を付与するものとする。   Since the holding member, the connector having the holding member, and the electronic control device having the connector according to the fifth embodiment are often in common with those shown in the above-described embodiment, detailed descriptions of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

上記した実施形態では、係止部63(63a,63b)が楔形状であり、配線基板31の裏面31bとの対向面が裏面31bと略平行とされた例を示した。このような形状の係止部63を有する保持部材60では、配線基板31の表面31aに接するハウジング52の位置決め部(図示略)と係止部63の裏面31bとの対向面との対向距離により、コネクタ50を保持できる配線基板31の厚さが決定される。これに対し、本実施形態においては、例えば図17(a)に示すように、楔形状の係止部63における配線基板31の裏面31bとの対向部分76が、上下方向に略垂直な方向(本実施形態では前後方向)において対応する連結部64から離れるほど、固定状態で、上下方向において配線基板31の表面31aから遠いテーパ状となっている。   In the above-described embodiment, the example in which the locking portion 63 (63a, 63b) is wedge-shaped and the surface facing the back surface 31b of the wiring board 31 is substantially parallel to the back surface 31b is shown. In the holding member 60 having the locking portion 63 having such a shape, due to the facing distance between the positioning portion (not shown) of the housing 52 in contact with the front surface 31a of the wiring substrate 31 and the facing surface of the back surface 31b of the locking portion 63. The thickness of the wiring board 31 that can hold the connector 50 is determined. In contrast, in the present embodiment, for example, as shown in FIG. 17A, a portion 76 facing the back surface 31b of the wiring board 31 in the wedge-shaped locking portion 63 is substantially perpendicular to the vertical direction ( In the present embodiment, the taper is farther from the surface 31a of the wiring board 31 in the up-down direction in the fixed state as the distance from the corresponding connecting portion 64 in the front-back direction) increases.

このような構成とすると、上下方向において、公差の範囲内で例えば保持部材60、配線基板31、ハウジング52などに製造ばらつきや組み付けばらつきが生じても、係止部63を配線基板31の裏面31bに係止させることができる。すなわち、配線基板31とコネクタ50とのがたつきを抑制することができる。また、同一構成の保持部材60を、異なる厚さの配線基板31(厚さの異なる複数種類の配線基板31)に対する共通部材とすることができる。例えば図17(b)に示す例では、図17(a)に示す厚さP1の配線基板31に適用した保持部材60を、P1よりも厚い厚さP2の配線基板31に適用している。なお、ばね部65(65a,65b)は、図17(a)に示す状態では変位しておらず、図17(b)に示す状態では少なからず変位した状態となっている。   With such a configuration, even if there are manufacturing variations or assembly variations in the holding member 60, the wiring board 31, the housing 52, etc. within a tolerance range in the vertical direction, the locking portion 63 is connected to the back surface 31b of the wiring board 31. Can be locked. That is, rattling between the wiring board 31 and the connector 50 can be suppressed. Further, the holding member 60 having the same configuration can be a common member for the wiring boards 31 having different thicknesses (a plurality of types of wiring boards 31 having different thicknesses). For example, in the example shown in FIG. 17B, the holding member 60 applied to the wiring board 31 having the thickness P1 shown in FIG. 17A is applied to the wiring board 31 having a thickness P2 thicker than P1. In addition, the spring part 65 (65a, 65b) is not displaced in the state shown in FIG. 17A, and is in a displaced state in the state shown in FIG. 17B.

(第6実施形態)
次に、本発明の第6実施形態を、図18に基づいて説明する。図18は、第6実施形態に係る電子制御装置において、特徴部分である保持部材の周辺を拡大した部分断面図であり、貫通孔への脚部の挿入時を示している。
(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described with reference to FIG. FIG. 18 is an enlarged partial cross-sectional view of the periphery of the holding member, which is a characteristic part, in the electronic control device according to the sixth embodiment, and shows a time when the leg portion is inserted into the through hole.

第6実施形態に係る保持部材、該保持部材を有するコネクタ、及び該コネクタを有する電子制御装置は、上記した実施形態に示したものと共通するところが多いので、以下、共通部分については詳しい説明は省略し、異なる部分を重点的に説明する。なお、上記した各実施形態に示した要素と同一の要素には、同一の符号を付与するものとする。   Since the holding member according to the sixth embodiment, the connector having the holding member, and the electronic control device having the connector are often in common with those shown in the above-described embodiment, a detailed description of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

本実施形態においては、図18に示すように、基部61から同じ方向に延設された一対の脚部62a,62bを有する保持部材60が、基部61からの延設方向が脚部62a,62bと同じ方向であって先端が互いに対向する一対の連結部64a,64bの間まで少なくとも延設された傾斜制限部77をしている。この傾斜制限部77は、貫通孔34へ脚部62a,62bを挿入する前の状態で、連結部64a,64bとは離れて設けられておいる。詳しくは、図18に示すように、傾斜制限部77はは、基部61から延設され、基部61と同一平面の位置する繋ぎ部77aと、繋ぎ部77aの下端と連結され、逆L字状に折曲されて、一部が連結部64a,64bの対向領域に配置された中間部77bとを有している。この中間部77bは、対向領域に配置された一部における端面67(図示略)が、連結部64a,64bにおける内側の端面67(図示略)とそれぞれ対向するように形成されている。   In the present embodiment, as shown in FIG. 18, the holding member 60 having a pair of leg portions 62a and 62b extending in the same direction from the base portion 61 has a leg portion 62a and 62b extending in the extending direction from the base portion 61. And a tilt limiting portion 77 extending at least between the pair of connecting portions 64a and 64b whose ends are opposed to each other. The inclination limiting portion 77 is provided apart from the connecting portions 64a and 64b in a state before the leg portions 62a and 62b are inserted into the through hole 34. Specifically, as shown in FIG. 18, the inclination limiting portion 77 extends from the base portion 61, is connected to a connecting portion 77 a located on the same plane as the base portion 61, and a lower end of the connecting portion 77 a, and has an inverted L shape. And an intermediate portion 77b that is partly disposed in a region facing the connecting portions 64a and 64b. The intermediate portion 77b is formed such that a part of the end face 67 (not shown) disposed in the facing region faces the inner end face 67 (not shown) of the connecting portions 64a and 64b.

このような構成とすると、一対の脚部62a,62b(連結部64a,64b)の間に設けられた傾斜制限部77(中間部77b)によって、連結部64a,64bの傾きを制限することができる。したがって、例えば一対の脚部62a,62bを貫通孔34に挿入する際に、貫通孔34と脚部62a,62bとの位置関係が所定の関係からずれていたとしても、連結部64a,64bが傾斜制限部77に当て止まるので、必要以上に連結部64a,64bが大きく傾くことがない。すなわち、脚部62a,62bの変形や破損を抑制することができる。また、連結部64a,64bの間に傾斜制限部77(中間部77b)が存在するので、フローはんだ付けを実施する場合には、毛細管現象によって連結部64aと中間部77bとの間の隙間と連結部64bと中間部77bとの間の隙間を溶融はんだが伝わり、配線基板31の表面31a側へはんだを吸い上げ易くすることができる。この場合、傾斜制限部77もはんだと接することとなり、傾斜制限部77を有さない構成に比べて保持部材60とはんだとの接触面積が増加するので、引っ張りに対する耐力をさらに向上することもできる。   With such a configuration, the inclination of the connecting portions 64a and 64b can be limited by the inclination limiting portion 77 (intermediate portion 77b) provided between the pair of leg portions 62a and 62b (connecting portions 64a and 64b). it can. Therefore, for example, when the pair of leg portions 62a and 62b is inserted into the through hole 34, even if the positional relationship between the through hole 34 and the leg portions 62a and 62b deviates from a predetermined relationship, the connecting portions 64a and 64b Since it stops at the inclination restricting portion 77, the connecting portions 64a and 64b are not inclined more than necessary. That is, the deformation and breakage of the leg portions 62a and 62b can be suppressed. In addition, since there is an inclination limiting portion 77 (intermediate portion 77b) between the connecting portions 64a and 64b, when performing flow soldering, a gap between the connecting portion 64a and the intermediate portion 77b is caused by capillary action. The molten solder is transmitted through the gap between the connecting portion 64b and the intermediate portion 77b, and the solder can be easily sucked up to the surface 31a side of the wiring board 31. In this case, the inclination restricting portion 77 is also in contact with the solder, and the contact area between the holding member 60 and the solder is increased as compared with the configuration without the inclination restricting portion 77, so that the resistance to tension can be further improved. .

以上、本発明の好ましい実施形態について説明したが、本発明は上述した実施形態になんら制限されることなく、本発明の主旨を逸脱しない範囲において、種々変形して実施することが可能である。   The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

本実施形態においては、1つの基部61から一対の脚部62a,62bが同一方向に延設された保持部材60を採用する例を示した。しかしながら、基部61から延設された脚部62の本数は上記例に限定されるものではない。例えば左右方向においてハウジング52の両端部に固定される保持部材60が、それぞれ1本の脚部62のみを有する構成としても良い。この場合、例えば図19に示すように、係止部63の延設方向が、異なる保持部材60で互いに反対方向(図19では、左方向外側と右方向外側)とされた構成とすると、係止部63の延設方向におけるがたつきを低減することができる。これにより、係止部63を配線基板31の裏面31bから外れにくくすることができる。図19は、その他変形例を示す平面図である。   In this embodiment, the example which employ | adopts the holding member 60 by which a pair of leg part 62a, 62b was extended in the same direction from the one base 61 was shown. However, the number of leg portions 62 extending from the base portion 61 is not limited to the above example. For example, the holding members 60 fixed to both end portions of the housing 52 in the left-right direction may each have only one leg portion 62. In this case, for example, as shown in FIG. 19, if the extending direction of the locking portion 63 is opposite to each other by the different holding members 60 (in FIG. 19, the leftward outer side and the rightward outer side), The backlash in the extending direction of the stop part 63 can be reduced. Thereby, the latching | locking part 63 can be made hard to remove | deviate from the back surface 31b of the wiring board 31. FIG. FIG. 19 is a plan view showing another modification.

本実施形態においては、係止部63が、金属板を打ち抜き加工することのみで形成された例を示した。しかしながら、保持部材60を例えば図20に示すような展開形状とし、繋ぎ部66aとばね部65aとの境界78(破線)、ばね部65aと連結部64aの境界79(破線)、及び連結部64aと係止部63aとの境界80(破線)で略90°折り曲げることによっても、保持部材60を得ることができる。なお、図20では、一方の脚部62a側のみを示したが、他方の脚部62bも同様である。図20は、その他変形例を示す展開図である。   In this embodiment, the example in which the latching | locking part 63 was formed only by stamping a metal plate was shown. However, the holding member 60 has an unfolded shape as shown in FIG. 20, for example, a boundary 78 (broken line) between the connecting portion 66a and the spring portion 65a, a boundary 79 (broken line) between the spring portion 65a and the connecting portion 64a, and a connecting portion 64a. The holding member 60 can also be obtained by bending approximately 90 ° at the boundary 80 (broken line) between the engaging portion 63a and the engaging portion 63a. In FIG. 20, only one leg 62a side is shown, but the other leg 62b is the same. FIG. 20 is a development view showing another modification.

本実施形態においては、電子装置として非防水構造の電子制御装置1の例を示した。しかしながら、防水構造の電子制御装置にも適用することができる。また、電子制御装置に限定されるものでもない。   In this embodiment, the example of the electronic control apparatus 1 of the non-waterproof structure was shown as an electronic apparatus. However, the present invention can also be applied to a waterproof electronic control device. Moreover, it is not limited to an electronic control device.

本実施形態においては、電子部品としてコネクタ50の例を示したが、保持部材60によって配線基板31の表面31a上に保持される電子部品はコネクタ50に限定されるものではない。   In the present embodiment, the example of the connector 50 is shown as an electronic component, but the electronic component held on the surface 31 a of the wiring board 31 by the holding member 60 is not limited to the connector 50.

本実施形態においては、端子51が挿入実装構造を有しており、フローはんだ付けによって、端子51及び保持部材60が、対応する貫通孔33,34の壁面及び開口周辺に設けられたランドとはんだを介して電気的に接続される例を示した。しかしながら、端子51が実装構造は、挿入実装構造に限定されるものではなく、表面実装構造の端子を採用することもできる。   In this embodiment, the terminal 51 has an insertion mounting structure, and the terminal 51 and the holding member 60 are soldered to the land provided on the wall surface of the corresponding through holes 33 and 34 and the periphery of the opening by flow soldering. An example of electrical connection via a cable is shown. However, the mounting structure of the terminal 51 is not limited to the insertion mounting structure, and a terminal having a surface mounting structure can also be adopted.

本実施形態においては、左右方向において、ハウジング52の両側面52bよりも外側に保持部材60が配置される例を示した。しかしながら、ハウジング52に対する保持部材60の配置は上記例に限定されるものではない。例えば、左右方向において、ハウジング52の両側面52b間の領域に保持部材60が配置されても良い。   In the present embodiment, an example in which the holding member 60 is disposed outside the both side surfaces 52b of the housing 52 in the left-right direction is shown. However, the arrangement of the holding member 60 with respect to the housing 52 is not limited to the above example. For example, the holding member 60 may be disposed in a region between both side surfaces 52b of the housing 52 in the left-right direction.

本実施形態においては、ハウジング52における左右両端側の溝部54に対して保持部材60が上方から挿入される例を示した。しかしながら、ハウジング52に対する保持部材60の固定構造は上記例に限定されるものではない。例えば、前後方向から挿入固定される構造としても良い。   In the present embodiment, an example in which the holding member 60 is inserted into the groove portions 54 on the left and right end sides of the housing 52 from above is shown. However, the fixing structure of the holding member 60 with respect to the housing 52 is not limited to the above example. For example, a structure that is inserted and fixed from the front-rear direction may be used.

第1実施形態に係る電子制御装置の概略構成を説明するための分解図である。It is an exploded view for demonstrating schematic structure of the electronic controller which concerns on 1st Embodiment. コネクタを配線基板に実装した状態の実装部周辺の平面図である。It is a top view of the periphery of the mounting part in the state which mounted the connector on the wiring board. 保持部材の概略構成を示す斜視図である。It is a perspective view which shows schematic structure of a holding member. 図3に示す保持部材のうち、脚部の展開図である。It is an expanded view of a leg part among the holding members shown in FIG. 貫通孔への脚部の挿入時を示す部分断面図である。It is a fragmentary sectional view which shows the time of insertion of the leg part to a through-hole. コネクタが基板表面上に保持された状態を示す図であり、(a)は部分断面図、(b)は基板裏面側から見た平面図である。It is a figure which shows the state hold | maintained on the board | substrate surface, (a) is a fragmentary sectional view, (b) is the top view seen from the board | substrate back surface side. フローはんだ付け後の状態を示す部分断面図である。It is a fragmentary sectional view which shows the state after flow soldering. 第2実施形態に係る保持部材の概略構成を示す斜視図である。It is a perspective view which shows schematic structure of the holding member which concerns on 2nd Embodiment. 図8に示す保持部材のうち、脚部の展開図である。It is an expanded view of a leg part among the holding members shown in FIG. 変形例を示す斜視図である。It is a perspective view which shows a modification. 図10に示す保持部材のうち、脚部の展開図である。It is an expanded view of a leg part among the holding members shown in FIG. 係止部によるメッキ層損傷を説明するための模式的な部分断面図である。It is a typical fragmentary sectional view for explaining plating layer damage by a locking part. (a),(b)ともに、第3実施形態に係る保持部材のうち、係止部の概略構成を示す平面図である。(A), (b) is a top view which shows schematic structure of a latching | locking part among the holding members which concern on 3rd Embodiment. 第4実施形態に係る電子制御装置において、保持部材の脚部と配線基板の貫通孔との関係を示す部分断面図である。In the electronic control unit concerning a 4th embodiment, it is a fragmentary sectional view showing the relation between the leg of a holding member, and the penetration hole of a wiring board. 保持部材によってコネクタが配線基板上に保持された状態を示す部分断面図である。It is a fragmentary sectional view which shows the state by which the connector was hold | maintained on the wiring board by the holding member. 変形例を示す断面図である。It is sectional drawing which shows a modification. 第5実施形態に係る電子制御装置のうち、特徴部分である保持部材の周辺を拡大した部分断面図であり、(a)は、配線基板の厚さがP1、(b)は配線基板の厚さがP2(>P1)の場合を示している。It is the fragmentary sectional view which expanded the periphery of the holding member which is a characteristic part among the electronic control units concerning a 5th embodiment, (a) is thickness P1 of a wiring board, and (b) is the thickness of a wiring board. This shows the case where the length is P2 (> P1). 第6実施形態に係る電子制御装置において、特徴部分である保持部材の周辺を拡大した部分断面図であり、貫通孔への脚部の挿入時を示している。In the electronic control device concerning a 6th embodiment, it is the fragmentary sectional view which expanded the circumference of the holding member which is the characterizing portion, and has shown at the time of insertion of the leg to a penetration hole. その他変形例を示す平面図である。It is a top view which shows another modification. その他変形例を示す展開図である。It is an expanded view which shows another modification.

符号の説明Explanation of symbols

1・・・電子制御装置(電子装置)
31・・・配線基板
31a・・・表面
31b・・・裏面
34・・・(保持部材用の)貫通孔
50・・・コネクタ(電子部品)
52・・・ハウジング(本体部)
60・・・保持部材
61・・・基部
62,62a,62b・・・脚部
63,63a,63b・・・係止部
64,64a,64b・・・連結部
65,65a,65b・・・ばね部
1 ... Electronic control device (electronic device)
31 ... Wiring board 31a ... front surface 31b ... back surface 34 ... (for holding member) through hole 50 ... connector (electronic component)
52 ... Housing (main body)
60 ... holding member 61 ... base 62, 62a, 62b ... leg 63, 63a, 63b ... locking part 64, 64a, 64b ... connecting part 65, 65a, 65b ... Spring part

Claims (16)

電子部品に固定される基部と、前記基部から延設された少なくとも1本の脚部とを備え、前記脚部が基板の貫通孔に挿入されて、前記基板の表面上に前記電子部品を保持する保持部材であって、
前記脚部は、同一の金属板を加工することで前記基部と一体的に形成されており、
前記脚部の先端側に設けられ、前記電子部品が前記基板に固定された固定状態で、前記基板の裏面における貫通孔の開口周辺上に少なくとも一部が位置する係止部と、
一方の端部が前記係止部と連結され、前記固定状態で前記貫通孔内に一部が配置される連結部と、
前記連結部における前記係止部とは反対側の端部に一端が連結され、前記固定状態で前記基板の表面上に配置されるとともに、前記貫通孔への前記係止部及び前記連結部の挿入時において、前記連結部が前記固定状態に対して傾いて前記係止部が前記貫通孔内に挿入されるように変位するばね部と、を有していることを特徴とする保持部材。
A base portion fixed to the electronic component; and at least one leg portion extending from the base portion, wherein the leg portion is inserted into a through hole of the substrate to hold the electronic component on the surface of the substrate. A holding member that
The leg is formed integrally with the base by processing the same metal plate,
A locking portion that is provided on the distal end side of the leg portion, and in which the electronic component is fixed to the substrate, and at least a part of the locking portion is located on the periphery of the opening of the through hole on the back surface of the substrate
One end portion is connected to the locking portion, and a connecting portion in which a part is disposed in the through hole in the fixed state;
One end of the connecting portion is connected to the end of the connecting portion opposite to the engaging portion, and is disposed on the surface of the substrate in the fixed state, and the engaging portion to the through hole and the connecting portion And a spring part that is displaced so that the coupling part is inclined with respect to the fixed state and the locking part is inserted into the through hole during insertion.
前記ばね部は、その短手方向における幅が前記金属板の板厚よりも広いことを特徴とする請求項1に記載の保持部材。   The holding member according to claim 1, wherein a width of the spring portion in a short direction is wider than a plate thickness of the metal plate. 前記係止部は、前記金属板を打ち抜き加工することのみで形成されていることを特徴とする請求項1又は請求項2に記載の保持部材。   The holding member according to claim 1 or 2, wherein the locking portion is formed only by punching the metal plate. 前記ばね部は、基部と該基部に対向する折り返し部とが屈曲部によって連結された略U字状に曲げ加工されていることを特徴とする請求項1〜3いずれか1項に記載の保持部材。   The holding | maintenance of any one of Claims 1-3 characterized by the above-mentioned. The said spring part is bent by the substantially U shape by which the base and the folding | turning part which opposes this base were connected by the bending part. Element. 前記ばね部は、平板状とされていることを特徴とする請求項1〜3いずれか1項に記載の保持部材。   The holding member according to claim 1, wherein the spring portion has a flat plate shape. 前記脚部として、前記基部から同じ方向に延設され、互いに対向する一対の脚部を有し、
一対の前記脚部における係止部は、前記連結部から延びた方向が互いに異なる方向とされていることを特徴とする請求項1〜5いずれか1項に記載の保持部材。
As the legs, a pair of legs extending in the same direction from the base and facing each other,
The holding member according to any one of claims 1 to 5, wherein the engaging portions of the pair of leg portions have different directions extending from the connecting portion.
前記基部から前記脚部と同じ方向であって先端が互いに対向する一対の前記連結部の間まで少なくとも延設され、挿入前の状態で前記連結部とは離れて設けられた傾斜制限部を有することを特徴とする請求項6に記載の保持部材。   An inclination limiting portion that extends at least from the base portion to a pair of the coupling portions that are in the same direction as the leg portions and whose distal ends face each other, and is provided apart from the coupling portion in a state before insertion. The holding member according to claim 6. 前記係止部は、前記基板の厚さ方向に略垂直な方向において、前記固定状態で前記貫通孔から最も離れた位置となる角部が、90°よりも大きい角を複数繋いでなる多角形状、又は、丸みを帯びた形状とされていることを特徴とする請求項1〜7いずれか1項に記載の保持部材。   The locking portion is a polygonal shape in which a corner portion which is the farthest from the through hole in the fixed state in a direction substantially perpendicular to the thickness direction of the substrate connects a plurality of corners larger than 90 °. The holding member according to claim 1, wherein the holding member has a rounded shape. 前記係止部は、前記基板の裏面との対向部分が、前記基板の厚さ方向に略垂直な方向において前記連結部から離れた位置ほど、前記基板の厚さ方向において前記基部の表面から遠いテーパ状とされていることを特徴とする請求項1〜8いずれか1項に記載の保持部材。   The locking portion is farther from the surface of the base in the thickness direction of the substrate as the position where the portion facing the back surface of the substrate is away from the coupling portion in a direction substantially perpendicular to the thickness direction of the substrate. The holding member according to claim 1, wherein the holding member is tapered. 本体部と、該本体部を貫通孔の形成された基板の表面上に保持する保持部材とを備えた電子部品であって、
前記保持部材は、前記本体部に固定された基部と、前記基部から延設され、前記貫通孔に挿入される少なくとも1本の脚部とを備え、
前記脚部は、同一の金属板を加工することで前記基部と一体的に形成されており、
前記脚部の先端側に設けられ、前記基板に固定された固定状態で、前記基板の裏面における貫通孔の開口周辺上に少なくとも一部が位置する係止部と、
一方の端部が前記係止部と連結され、前記固定状態で前記貫通孔内に一部が配置される連結部と、
前記連結部における前記係止部とは反対側の端部に一端が連結され、前記固定状態で前記基板の表面上に配置されるとともに、前記貫通孔への前記係止部及び前記連結部の挿入時において、前記連結部が前記固定状態に対して傾いて前記係止部が前記貫通孔内に挿入されるように変位するばね部と、を有していることを特徴とする電子部品。
An electronic component comprising a main body part and a holding member that holds the main body part on the surface of the substrate in which the through hole is formed,
The holding member includes a base fixed to the main body, and at least one leg extending from the base and inserted into the through hole.
The leg is formed integrally with the base by processing the same metal plate,
A locking portion that is provided on the distal end side of the leg portion and is fixed to the substrate, and at least a part thereof is positioned on the periphery of the opening of the through hole on the back surface of the substrate;
One end portion is connected to the locking portion, and a connecting portion in which a part is disposed in the through hole in the fixed state;
One end of the connecting portion is connected to the end of the connecting portion opposite to the engaging portion, and is disposed on the surface of the substrate in the fixed state, and the engaging portion to the through hole and the connecting portion An electronic component comprising: a spring portion that is displaced so that the connecting portion is inclined with respect to the fixed state and inserted into the through hole when inserted.
1つの前記本体部に対して前記保持部材を複数備え、
前記係止部として、前記連結部から延びた方向が、異なる前記保持部材において互いに反対方向とされた少なくとも一対の係止部を有することを特徴とする請求項10に記載の電子部品。
A plurality of the holding members are provided for one main body,
11. The electronic component according to claim 10, wherein the engaging part includes at least a pair of engaging parts whose directions extending from the connecting part are opposite to each other in the different holding members.
貫通孔の形成された基板と、
本体部と、該本体部を前記基板の表面上に保持する保持部材を有する電子部品と、を備えた電子装置であって、
前記保持部材は、前記本体部に固定された基部と、前記基部から延設され、前記貫通孔に挿入された少なくとも1本の脚部とを備え、
前記脚部は、同一の金属板を加工することで前記基部と一体的に形成されており、
前記脚部の先端側に設けられ、前記電子部品が前記基板に固定された固定状態で、前記基板の裏面における貫通孔の開口周辺上に少なくとも一部が位置する係止部と、
一方の端部が前記係止部と連結され、前記固定状態で前記貫通孔内に一部が配置された連結部と、
前記連結部における前記係止部とは反対側の端部に一端が連結され、前記固定状態で前記基板の表面上に配置されるとともに、前記貫通孔への前記係止部及び前記連結部の挿入時において、前記連結部が前記固定状態に対して傾いて前記係止部が前記貫通孔内に挿入されるように変位するばね部と、を有していることを特徴とする電子装置。
A substrate having a through hole formed thereon;
An electronic device comprising a main body part and an electronic component having a holding member that holds the main body part on the surface of the substrate,
The holding member includes a base fixed to the main body, and at least one leg extending from the base and inserted into the through hole.
The leg is formed integrally with the base by processing the same metal plate,
A locking portion that is provided on the distal end side of the leg portion, and in which the electronic component is fixed to the substrate, and at least a part of the locking portion is located on the periphery of the opening of the through hole on the back surface of the substrate
One end portion is coupled to the locking portion, and a coupling portion in which a part is disposed in the through hole in the fixed state;
One end of the connecting portion is connected to the end of the connecting portion opposite to the engaging portion, and is disposed on the surface of the substrate in the fixed state, and the engaging portion to the through hole and the connecting portion An electronic device comprising: a spring portion that is displaced so that the connecting portion is inclined with respect to the fixed state and inserted into the through hole when inserted.
前記脚部として、同一の前記基部から同じ方向に延設され、互いに対向する一対の脚部を有し、
一対の前記脚部における係止部は、前記連結部から延びた方向が互いに反対方向とされていることを特徴とする請求項12に記載の電子装置。
As the legs, a pair of legs extending in the same direction from the same base and facing each other,
The electronic device according to claim 12, wherein the engaging portions of the pair of leg portions have opposite directions extending from the connecting portion.
前記貫通孔は、一方向に長い長孔であり、
一対の前記脚部における係止部は、前記貫通孔の長手方向に沿って前記連結部から延び、且つ、延設方向が互いに反対方向とされ、前記基板の裏面における貫通孔の長手側の開口周辺上に位置していることを特徴とする請求項13に記載の電子装置。
The through hole is a long hole long in one direction,
The engaging portions of the pair of leg portions extend from the connecting portion along the longitudinal direction of the through hole, and the extending directions are opposite to each other, and the opening on the longitudinal side of the through hole on the back surface of the substrate The electronic device according to claim 13, wherein the electronic device is located on a periphery.
一対の前記脚部において、前記連結部における前記貫通孔の壁面と対向する外側部位間の幅が、前記貫通孔における前記外側部位と対向する部位間の幅以上とされていることを特徴とする請求項13又は請求項14に記載の電子装置。   In the pair of leg portions, a width between outer portions facing the wall surface of the through hole in the connecting portion is equal to or greater than a width between portions facing the outer portion in the through hole. The electronic device according to claim 13 or 14. 一対の前記脚部において、前記連結部における前記貫通孔と対向する外側部位間の幅は、前記固定状態で、前記基板の裏面における貫通孔の開口部での幅のほうが、前記基板の表面における貫通孔の開口部での幅よりも狭いことを特徴とする請求項13又は請求項14に記載の電子装置。   In the pair of legs, the width between the outer portions facing the through hole in the connecting portion is in the fixed state, and the width at the opening of the through hole in the back surface of the substrate is larger on the surface of the substrate. The electronic device according to claim 13, wherein the electronic device is narrower than a width at an opening of the through hole.
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Cited By (4)

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JP2011134493A (en) * 2009-12-22 2011-07-07 Denso Corp Electronic device
JP2011176230A (en) * 2010-02-25 2011-09-08 Alpine Electronics Inc Bracket fixing structure
EP2451015A1 (en) 2010-11-05 2012-05-09 Tyco Electronics Japan G.K. Holding member and electronic component
JP2017079099A (en) * 2015-10-19 2017-04-27 住友電装株式会社 Connector for substrate

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JPS63143865U (en) * 1987-03-11 1988-09-21
JPH01159370U (en) * 1988-04-25 1989-11-06
JPH0333972U (en) * 1989-08-11 1991-04-03
JPH0455775U (en) * 1990-09-18 1992-05-13
JPH04124767U (en) * 1991-04-30 1992-11-13 株式会社村田製作所 Printed circuit board terminal
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JPS63143865U (en) * 1987-03-11 1988-09-21
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JPH0455775U (en) * 1990-09-18 1992-05-13
JPH04124767U (en) * 1991-04-30 1992-11-13 株式会社村田製作所 Printed circuit board terminal
JP2007200557A (en) * 2006-01-23 2007-08-09 Tokai Rika Co Ltd Fixing member and mounting structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134493A (en) * 2009-12-22 2011-07-07 Denso Corp Electronic device
JP2011176230A (en) * 2010-02-25 2011-09-08 Alpine Electronics Inc Bracket fixing structure
EP2451015A1 (en) 2010-11-05 2012-05-09 Tyco Electronics Japan G.K. Holding member and electronic component
JP2017079099A (en) * 2015-10-19 2017-04-27 住友電装株式会社 Connector for substrate

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